TWI528203B - Method, apparatus, and recording medium for lightening printed circuit assembly file - Google Patents

Method, apparatus, and recording medium for lightening printed circuit assembly file Download PDF

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TWI528203B
TWI528203B TW103141759A TW103141759A TWI528203B TW I528203 B TWI528203 B TW I528203B TW 103141759 A TW103141759 A TW 103141759A TW 103141759 A TW103141759 A TW 103141759A TW I528203 B TWI528203 B TW I528203B
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file
circuit board
board assembly
idf
new
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TW201621722A (en
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倪崇勝
魏智斌
楊俊英
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英業達股份有限公司
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輕量化電路板組裝檔案之方法、裝置及記錄媒體 Method, device and recording medium for lightweighting circuit board assembly files

本發明關於一種用於電子輔助設計(Computer Aided Design,CAD)系統之方法、裝置及記錄媒體,特別是用於一種輕量化電路板組裝(Printed Circuit Assembly,PCA)檔案之方法及裝置。 The present invention relates to a method, apparatus and recording medium for a Computer Aided Design (CAD) system, and more particularly to a method and apparatus for a Lightweight Circuit Board (PCA) file.

在電子產品研發設計的技術領域上,電子電路和機構外型的設計占重要一環。近年來,由於積體電路製程技術和電子產品設計複雜度的日益提升,因此必須藉由電腦輔助設計(Computer-aided design,CAD)系統從事與電子電路和機構外型相關的設計。舉例來說,藉由電子電腦輔助(ECAD)系統進行與電子電路相關的設計,以及藉由機械電腦輔助(MCAD)系統與機構外型相關的設計。 In the technical field of electronic product development and design, the design of electronic circuits and mechanical appearances is an important part. In recent years, due to the increasing complexity of integrated circuit process technology and electronic product design, it is necessary to carry out designs related to electronic circuits and mechanism appearances through a computer-aided design (CAD) system. For example, electronic computer-aided (ECAD) systems are used for electronic circuit-related designs, as well as mechanical computer-aided (MCAD) systems for design related to the form factor.

一般而言,ECAD系統包含Protel、PowerPCB、ORCAD等,是用於定義電路示意圖中有關元件封裝及電路接點等相關設計,以及MCAD系統包含AutoCAD、Pro/ENGINEER、SolidEdge等,是用於定義電路板的形狀中有關機孔位置和機件配置等相關設計。因此,在設計流程上,MCAD設計團隊會先制定關於電子產品的尺寸限制條件,例如電路板上所有電子零件的設置高度限制,接著,ECAD設計團隊再根據這些尺寸限制條件進行電子零件的布局。 In general, the ECAD system includes Protel, PowerPCB, ORCAD, etc., which are used to define the related components of the circuit schematic and circuit contacts, and the MCAD system includes AutoCAD, Pro/ENGINEER, SolidEdge, etc., which are used to define the circuit. Related design of the shape of the plate and the configuration of the machine. Therefore, in the design process, the MCAD design team will first set the size constraints on the electronic products, such as the height limit of all electronic parts on the board, and then the ECAD design team will then arrange the electronic parts according to these size constraints.

而當ECAD系統設計完成後,MCAD團隊會將當ECAD團隊完成之檔案做結合,以做電路板組裝(Printed Circuit Assembly,PCA)最後的尺寸確認。參照台灣專利公開號第201202988A1號,ECAD系統一般採用IDF(Intermediate Data Format,中間資料格式)格式。然而,ECAD系統中的電子零件數量十分龐大,兩者結合後所產生之新的PCA檔案會有部分相同重複的零件匯入。為了進行設計檢查,需要將重複零件移除,而需花費很多時間。此外,ECAD系統之IDF檔案產生的3D零件由原來數十個零件的組件,變為數千個零件的組件,對於進行後續設計與運算效率都會增加硬體負擔。 When the ECAD system is designed, the MCAD team will combine the files completed by the ECAD team for the final size confirmation of the Printed Circuit Assembly (PCA). Referring to Taiwan Patent Publication No. 201202988A1, the ECAD system generally adopts an IDF (Intermediate Data Format) format. However, the number of electronic components in the ECAD system is very large, and the new PCA files generated by the combination of the two will have some identical duplicate parts. In order to carry out the design check, it is necessary to remove the duplicate parts, which takes a lot of time. In addition, the 3D parts generated by the IDF file of the ECAD system are changed from the components of the original dozens of parts to the components of thousands of parts, which will increase the hardware burden for subsequent design and operation efficiency.

有鑑於此,本發明的目的在於提供一種輕量化電路板組裝檔案之方法,其可將IDF檔案中重複的零件進行過濾,再將其轉換成單一零件的檔案,使得與PCA檔案結合後可降低零件的重複檢查以及降低運算的負擔。 In view of the above, an object of the present invention is to provide a method for assembling a file by lightweight circuit board, which can filter repeated parts in an IDF file and convert it into a file of a single part, so that the combination with the PCA file can be reduced. Repeated inspection of parts and reduced computational burden.

本發明的另一目的在於提供一種輕量化電路板組裝檔案之裝置,其可將IDF檔案中重複的零件進行過濾,再將其轉換成單一零件的檔案,使得與PCA檔案結合後可降低零件的重複檢查以及降低運算的負擔。 Another object of the present invention is to provide a device for assembling a file of a lightweight circuit board, which can filter the duplicated parts in the IDF file and convert them into a file of a single part, so that the parts can be reduced by combining with the PCA file. Repeat the check and reduce the burden of the operation.

本發明的再另一目的在於提供一種電腦可讀媒體,其致使電腦執行上述輕量化電路板組裝檔案之方法,使得與PCA檔案結合後可降低零件的重複檢查以及降低運算的負擔。 Still another object of the present invention is to provide a computer readable medium that causes a computer to execute the above method of assembling a file on a lightweight circuit board such that, in combination with the PCA file, the repeated inspection of parts and the burden of computation can be reduced.

為達成上述目的,本發明提供之輕量化電路板組裝檔案之方法用於將IDF檔案匯入第一電路板組裝檔案,IDF檔案包括資料庫檔案及板檔案,方法包括下列由電腦執行的步驟:比對第一電路板組裝檔案與IDF 檔案中之複數零件之檔名與組裝位置;過濾IDF檔案中之複數重複零件,以得到新資料庫檔案;由新資料庫檔案及板檔案產生新電路板組裝檔案;將新電路板組裝檔案轉換為單一零件之第二電路板組裝檔案;以及結合第二電路板組裝檔案及第一電路板組裝檔案。 To achieve the above object, the method for assembling a lightweight circuit board assembly file of the present invention is used for importing an IDF file into a first circuit board assembly file, and the IDF file includes a database file and a board file, and the method includes the following steps performed by a computer: Compare the first board assembly file with IDF File name and assembly position of multiple parts in the file; filter multiple duplicate parts in IDF file to get new database file; generate new circuit board assembly file from new database file and board file; convert new board assembly file Assembling a file for a second circuit board of a single component; and combining the second circuit board assembly file with the first circuit board assembly file.

在較佳實施例中,重複零件之檔名與組裝位置與IDF檔案中之部分零件之檔名與組裝位置相同。另外,過濾步驟包括:從IDF檔案中之零件中刪除重複零件。 In the preferred embodiment, the file name and assembly position of the duplicate part are the same as the file name and assembly position of some of the parts in the IDF file. In addition, the filtering step includes removing duplicate parts from the parts in the IDF file.

在一較佳實施例中,轉換步驟包括:將新電路板組裝檔案轉成一STL(Stereolithography,立體印刷術)格式。具體而言,第二電路板組裝檔案為新電路板組裝檔案之表面輪廓之資料。 In a preferred embodiment, the converting step includes converting the new board assembly file into an STL (Stereolithography) format. Specifically, the second board assembly file is the surface profile of the new board assembly file.

在較佳實施例中,該結合步驟包括:對準第二電路板組裝檔案及第一電路板組裝檔案中的電路板之原點座標。 In a preferred embodiment, the bonding step includes aligning the origin coordinates of the second circuit board assembly file and the circuit board in the first circuit board assembly file.

為達成上述另一目的,本發明提供之輕量化電路板組裝檔案之裝置用於將IDF檔案匯入第一電路板組裝檔案,IDF檔案包括資料庫檔案及板檔案,裝置包括比對單元、過濾單元、PCA產生單元、轉換單元、及結合單元。比對單元用於比對第一電路板組裝檔案與IDF檔案中之複數零件之檔名與組裝位置。過濾單元用於過濾IDF檔案中之複數重複零件,以得到新資料庫檔案。PCA產生單元用於由新資料庫檔案及板檔案產生新電路板組裝檔案。轉換單元將新電路板組裝檔案轉換為單一零件之第二電路板組裝檔案。結合單元用於結合第二電路板組裝檔案及第一電路板組裝檔案。 In order to achieve the above other object, the device for assembling a lightweight circuit board assembly file is used for importing an IDF file into a first circuit board assembly file, and the IDF file includes a database file and a board file, and the device includes a comparison unit and filtering. A unit, a PCA generating unit, a converting unit, and a combining unit. The comparison unit is used to compare the file name and assembly position of the plurality of parts in the first circuit board assembly file and the IDF file. The filter unit is used to filter the complex duplicate parts in the IDF file to obtain a new database file. The PCA generation unit is used to generate new circuit board assembly files from new database files and board files. The conversion unit converts the new board assembly file into a second board assembly file of a single part. The bonding unit is configured to combine the second circuit board assembly file and the first circuit board assembly file.

在較佳實施例中,重複零件之檔名與組裝位置與IDF檔案中之部分零件之檔名與組裝位置相同。 In the preferred embodiment, the file name and assembly position of the duplicate part are the same as the file name and assembly position of some of the parts in the IDF file.

在一較佳實施例中,第二電路板組裝檔案為新電路板組裝檔案之表面輪廓之資料。 In a preferred embodiment, the second board assembly file is the surface profile of the new board assembly file.

為達成上述再另一目的,本發明提供之電腦可讀媒體儲存使電腦執行輕量化電路板組裝檔案之方法之電腦程式,用於將IDF檔案匯入第一電路板組裝檔案,IDF檔案包括資料庫檔案及板檔案,方法包括下列步驟:比對第一電路板組裝檔案與IDF檔案中之複數零件之檔名與組裝位置;過濾IDF檔案中之複數重複零件,以得到新資料庫檔案;由新資料庫檔案及板檔案產生新電路板組裝檔案;將新電路板組裝檔案轉換為單一零件之第二電路板組裝檔案;以及結合第二電路板組裝檔案及第一電路板組裝檔案。 In order to achieve the above other object, the computer readable medium provided by the present invention stores a computer program for causing a computer to execute a method for assembling a lightweight circuit board for importing an IDF file into a first circuit board assembly file, and the IDF file includes data. The library file and the board file method include the following steps: comparing the file name and assembly position of the plurality of parts in the first circuit board assembly file and the IDF file; filtering the plurality of duplicate parts in the IDF file to obtain a new database file; The new database file and board file generates a new board assembly file; the new board assembly file is converted into a second board assembly file of a single part; and the second board assembly file and the first board assembly file are combined.

相較於習知技術,本發明之輕量化電路板組裝檔案之方法、裝置及記錄媒體係可將IDF檔案中與第一電路板組裝檔案之重複的零件進行過濾,再將其轉換成單一零件之第二電路板組裝檔案,使得第二電路板組裝檔案與第一電路板組裝檔案結合後可免去重複檢查零件的步驟,以及降低運算的負擔,據此克服習知技術的問題。 Compared with the prior art, the method, device and recording medium of the lightweight circuit board assembly file of the present invention can filter the duplicated parts of the IDF file and the first circuit board assembly file, and then convert the same into a single part. The second circuit board assembly file, such that the second circuit board assembly file is combined with the first circuit board assembly file, eliminates the need to repeatedly inspect the parts, and reduces the computational burden, thereby overcoming the problems of the prior art.

為讓本發明之上述和其他目的、特徵、和優點能更明顯易懂,配合所附圖式,作詳細說明如下: The above and other objects, features, and advantages of the present invention will become more apparent and understood.

10‧‧‧第一PCA檔案 10‧‧‧First PCA file

20‧‧‧新PCA檔案 20‧‧‧New PCA file

30‧‧‧第二PCA檔案 30‧‧‧ Second PCA file

100‧‧‧輕量化電路板組裝檔案之裝置 100‧‧‧Lightweight circuit board assembly file device

101‧‧‧電路板 101‧‧‧ boards

102‧‧‧零件 102‧‧‧ parts

110‧‧‧比對單元 110‧‧‧ comparison unit

120‧‧‧過濾單元 120‧‧‧Filter unit

130‧‧‧PCA產生單元 130‧‧‧PCA generating unit

140‧‧‧轉換單元 140‧‧‧Conversion unit

150‧‧‧結合單元 150‧‧‧ combination unit

S110~S150‧‧‧步驟 S110~S150‧‧‧Steps

第1圖繪示本發明之較佳實施例之輕量化電路板組裝檔案之方法之流程圖。 1 is a flow chart showing a method of assembling a file of a lightweight circuit board according to a preferred embodiment of the present invention.

第2圖繪示較佳實施例之第一PCA檔案之立體示意圖。 2 is a perspective view of the first PCA file of the preferred embodiment.

第3圖繪示較佳實施例之新PCA檔案之立體示意圖。 Figure 3 is a perspective view of the new PCA file of the preferred embodiment.

第4圖繪示較佳實施例之第二PCA檔案之立體示意圖。 4 is a perspective view of the second PCA file of the preferred embodiment.

第5圖繪示較佳實施例之第二PCA檔案及第一PCA檔案結合之立體示意圖。 FIG. 5 is a perspective view showing the combination of the second PCA file and the first PCA file of the preferred embodiment.

第6圖繪示本發明較佳實施例之輕量化電路板組裝檔案之裝置之方塊示意圖。 FIG. 6 is a block diagram showing an apparatus for assembling a lightweight circuit board according to a preferred embodiment of the present invention.

本發明之數個較佳實施例藉由所附圖式與下面之說明作詳細描述,在不同的圖式中,相同的元件符號表示相同或相似的元件。 The present invention has been described in detail with reference to the preferred embodiments in the

以下將透過附圖說明較佳實施例之輕量化電路板組裝檔案之方法。本發明之輕量化電路板組裝檔案之方法較佳係適用於一種CAD系統,特別是一種設計電路板上之零件與機殼之間干涉之CAD系統。 Hereinafter, a method of assembling a file of a lightweight circuit board of a preferred embodiment will be described with reference to the accompanying drawings. The method for assembling a lightweight circuit board assembly file of the present invention is preferably applied to a CAD system, and more particularly to a CAD system for designing interference between a component on a circuit board and a casing.

請參照第1圖及第2圖,第1圖繪示本發明之較佳實施例之輕量化電路板組裝檔案之方法之流程圖,第2圖繪示較佳實施例之第一PCA檔案之立體示意圖。本實施例之輕量化電路板組裝檔案之方法用於將IDF檔案匯入第一電路板組裝(PCA)檔案10,以減少零件重複及降低運算負擔。 Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a flow chart showing a method for assembling a lightweight circuit board according to a preferred embodiment of the present invention, and FIG. 2 is a first PCA file of the preferred embodiment. Stereoscopic view. The lightweight circuit board assembly file method of the present embodiment is used to import IDF files into the first circuit board assembly (PCA) file 10 to reduce part duplication and reduce computational burden.

本實施例之第一PCA檔案10表示為電路板101及其上的多個零件102。零件102較佳為具有較大體積之零件,如散熱片、連接器等,其較容易與機殼干涉。更進一步而言,如第1圖所示,第一PCA檔案10中的零件102表示為具體3D結構的圖檔。 The first PCA file 10 of the present embodiment is shown as a circuit board 101 and a plurality of parts 102 thereon. The part 102 is preferably a part having a large volume, such as a heat sink, a connector, etc., which is relatively easy to interfere with the casing. Further, as shown in FIG. 1, the part 102 in the first PCA file 10 is represented as a picture of a specific 3D structure.

另一方面,IDF檔案包括資料庫檔案及板檔案,其中資料庫檔案包含多個零件之資料,板檔案為電路板之圖檔。具體而言,每個IDF檔案都有兩部份:板檔案與資料庫檔案;例如.emp和.emm格式。然而,本發 明並不限於此,其他可能的組合包括.brd/.lib、.brd/.pro、.bdf/.ldf與.idb/.idl等。在此實施例中,資料庫檔案中的零件較佳為電子零件,如晶片、電容等元件,但也有與上述零件102重複的零件。然而,資料庫檔案中的零件表示為僅具有固定長寬高的方塊或圓柱,俗稱2.5D的零件。 On the other hand, the IDF file includes a database file and a file file, wherein the database file contains data of a plurality of parts, and the file file is a picture file of the circuit board. Specifically, each IDF file has two parts: a board file and a database file; for example, .emp and .emm formats. However, this issue It is not limited to this, and other possible combinations include .brd/.lib, .brd/.pro, .bdf/.ldf, and .idb/.idl. In this embodiment, the components in the database file are preferably electronic components such as wafers, capacitors, etc., but also have the same components as the above-described components 102. However, the parts in the database file are represented as squares or cylinders with a fixed length, width and height, commonly known as 2.5D parts.

本實施例之輕量化電路板組裝檔案之方法包括下列由電腦執行的步驟S110至步驟S150。此方法開始於步驟S110。 The method of assembling a file of the lightweight circuit board of this embodiment includes the following steps S110 to S150 performed by a computer. The method begins in step S110.

在步驟S110中,比對第一PCA檔案10與IDF檔案中之複數零件之檔名與組裝位置,然後執行步驟S120。詳細而言,第一PCA檔案10與IDF檔案都包含一零件清單,該零件清單記載了零件的檔名與組裝位置。在此實施例中,IDF檔案的零件清單係位於資料庫檔案中。 In step S110, the file names and assembly positions of the plurality of parts in the first PCA file 10 and the IDF file are compared, and then step S120 is performed. In detail, both the first PCA file 10 and the IDF file contain a parts list that records the file name and assembly position of the part. In this embodiment, the parts list of the IDF file is located in the repository file.

在步驟S120中,過濾IDF檔案中之複數重複零件,以得到新資料庫檔案,然後執行步驟S130。具體來說,重複零件之檔名與組裝位置與IDF檔案中之部分零件之檔名與組裝位置相同。在此實施例中,重複零件即為第一PCA檔案10中的零件102。詳細而言,步驟S120中之過濾步驟還包括從IDF檔案中之零件中刪除重複零件,即刪除第1圖之零件102。 In step S120, the plurality of duplicate parts in the IDF file are filtered to obtain a new database file, and then step S130 is performed. Specifically, the file name and assembly position of the duplicate part are the same as the file name and assembly position of some parts in the IDF file. In this embodiment, the duplicate part is the part 102 in the first PCA file 10. In detail, the filtering step in step S120 further includes deleting the duplicate part from the part in the IDF file, that is, deleting the part 102 of FIG.

在步驟S130中,由新資料庫檔案及板檔案產生新PCA檔案,然後執行步驟S140。請一併參照第3圖,第3圖繪示較佳實施例之新PCA檔案之立體示意圖。新資料庫檔案(即新emm檔)與板檔案(即emp檔)經由電腦執行而產生的新PCA檔案20如第3圖所示,其不包含第一PCA檔案10中的零件102。 In step S130, a new PCA file is generated from the new database file and the board file, and then step S140 is performed. Please refer to FIG. 3 together. FIG. 3 is a schematic perspective view of the new PCA file of the preferred embodiment. The new PCA file 20 generated by the new database file (ie, the new emm file) and the board file (ie, the emp file) is executed as shown in FIG. 3, which does not include the part 102 in the first PCA file 10.

在步驟S140中,將新PCA檔案20轉換為單一零件之第二PCA檔案,然後執行步驟S150。請一併參照第4圖,第4圖繪示較佳實施例 之第二PCA檔案之立體示意圖。具體而言,步驟S140中之轉換步驟還包括將新PCA檔案20轉成一STL(Stereolithography,立體印刷術)格式。其中立體印刷術是從電腦影像製作實體物件的3D列印過程。此過程同時也稱為原型製作,會使用STL檔案中的面塊網格顯示產生零件。轉換成STL檔案後,第3圖中之多個電子零件與電路板則轉換為輕量化的單一檔案,即視為單一零件。接著,再將此STL檔案轉換成第二PCA檔案30。請對照第2圖及第4圖,第二PCA檔案30為新PCA檔案20之表面輪廓之資料。 In step S140, the new PCA file 20 is converted into a second PCA file of a single part, and then step S150 is performed. Please refer to FIG. 4 together, and FIG. 4 illustrates a preferred embodiment. A schematic view of the second PCA file. Specifically, the converting step in step S140 further includes converting the new PCA file 20 into an STL (Stereolithography) format. Among them, stereo printing is a 3D printing process for making physical objects from computer images. This process, also known as prototyping, uses the facet grid display in the STL file to produce the part. After conversion to an STL file, the multiple electronic parts and boards in Figure 3 are converted to a lightweight single file, which is treated as a single part. Next, the STL file is converted into a second PCA file 30. Please refer to FIG. 2 and FIG. 4, and the second PCA file 30 is the surface profile of the new PCA file 20.

在步驟S150中,結合第二PCA檔案30及第一PCA檔案10。請一併參照第5圖,第5圖繪示一較佳實施例之第二PCA檔案及第一PCA檔案結合之立體示意圖。步驟S150中之結合步驟具體包括:對準第二PCA檔案30及第一PCA檔案10中的電路板101之原點座標(圖未示)。兩者的原點座標重疊後,即可完成本實施例之輕量化電路板組裝檔案之方法。經過上述步驟後,在MCAD系統上的檔案庫僅會較原第一PCA檔案10增加一個零件資料,即第二PCA檔案30,進而可降低運算的負擔。 In step S150, the second PCA file 30 and the first PCA file 10 are combined. Referring to FIG. 5 together, FIG. 5 is a perspective view showing a combination of a second PCA file and a first PCA file according to a preferred embodiment. The step of combining in step S150 specifically includes: aligning the origin coordinates (not shown) of the second PCA file 30 and the circuit board 101 in the first PCA file 10. After the origin coordinates of the two are overlapped, the method for assembling the file of the lightweight circuit board of the embodiment can be completed. After the above steps, the archive on the MCAD system will only add one part data, that is, the second PCA file 30, to the original first PCA file 10, thereby reducing the burden of computing.

以下將說明實現上述輕量化電路板組裝檔案之方法之具體架構。請參照第6圖,第6圖繪示本發明較佳實施例之輕量化電路板組裝檔案之裝置之方塊示意圖。本實施例之輕量化電路板組裝檔案之裝置100較佳係設置於CAD系統中,用於將IDF檔案12匯入第一PCA檔案10,以減少零件重複及降低運算負擔。本實施例之輕量化電路板組裝檔案之裝置100是用於體現上述輕量化電路板組裝檔案之方法,以下所提到元件請參照上述說明,在此不再贅述。 The specific architecture of the method for implementing the above described lightweight circuit board assembly file will be described below. Please refer to FIG. 6. FIG. 6 is a block diagram showing the apparatus for assembling a lightweight circuit board according to a preferred embodiment of the present invention. The device 100 for assembling the lightweight circuit board assembly file of the embodiment is preferably disposed in the CAD system for importing the IDF file 12 into the first PCA file 10 to reduce part duplication and reduce the computational burden. The apparatus 100 for assembling a lightweight circuit board assembly file of the present embodiment is a method for embodying the above-mentioned lightweight circuit board assembly file. For the components mentioned below, please refer to the above description, and details are not described herein again.

如第6圖所示,本實施例之輕量化電路板組裝檔案之裝置 100包括比對單元110、過濾單元120、PCA產生單元130、轉換單元140、及結合單元150。請一併參照第1圖至第6圖,比對單元110用於比對第一PCA檔案10與IDF檔案12中之複數零件之檔名與組裝位置。接著,過濾單元120用於過濾IDF檔案12中之複數重複零件,以得到新資料庫檔案。PCA產生單元130用於由新資料庫檔案及板檔案產生新PCA檔案20。轉換單元140將新PCA檔案20轉換為單一零件之第二PCA檔案30。結合單元150用於結合第二PCA檔案30及第一PCA檔案10。 As shown in FIG. 6, the device for assembling a file of the lightweight circuit board of the embodiment 100 includes a matching unit 110, a filtering unit 120, a PCA generating unit 130, a converting unit 140, and a combining unit 150. Referring to FIG. 1 to FIG. 6 together, the matching unit 110 is used to compare the file names and assembly positions of the plurality of parts in the first PCA file 10 and the IDF file 12. Next, the filtering unit 120 is configured to filter the plurality of duplicate parts in the IDF file 12 to obtain a new database file. The PCA generating unit 130 is configured to generate a new PCA file 20 from the new database file and the board file. The conversion unit 140 converts the new PCA file 20 into a second PCA file 30 of a single part. The combining unit 150 is used to combine the second PCA file 30 and the first PCA file 10.

同樣地,該些重複零件之檔名與組裝位置與IDF檔案12中之部分零件之檔名與組裝位置相同。另外,第二PCA檔案30為新PCA檔案20之表面輪廓之資料。 Similarly, the file names and assembly positions of the duplicate parts are the same as the file names and assembly positions of some of the parts in the IDF file 12. In addition, the second PCA file 30 is the surface profile of the new PCA file 20.

以下將說明實現上述輕量化電路板組裝檔案之方法之電腦可讀媒體。請一併參照第1圖至第5圖,本發明提供之電腦可讀媒體儲存使電腦執行輕量化電路板組裝檔案之方法之電腦程式,方法用於將IDF檔案匯入第一PCA檔案10。IDF檔案包括資料庫檔案及板檔案。方法下列步驟:比對第一PCA檔案10與IDF檔案中之複數零件之檔名與組裝位置;過濾IDF檔案中之複數重複零件,以得到新資料庫檔案;由新資料庫檔案及板檔案產生新PCA檔案20;將新PCA檔案20轉換為單一零件之第二PCA檔案30;以及結合第二PCA檔案30及第一PCA檔案10。上述之細節請參考前面的說明,在此不再贅述。 A computer readable medium that implements the above method of assembling a lightweight circuit board file will be described below. Referring to FIG. 1 to FIG. 5 together, the computer readable medium provided by the present invention stores a computer program for causing a computer to execute a method for assembling a lightweight circuit board, and the method is used for importing an IDF file into the first PCA file 10. IDF files include database files and board files. The method comprises the following steps: comparing the file name and assembly position of the plurality of parts in the first PCA file 10 and the IDF file; filtering the plurality of duplicate parts in the IDF file to obtain a new database file; generating the new database file and the file file The new PCA file 20; the second PCA file 30 that converts the new PCA file 20 into a single part; and the second PCA file 30 and the first PCA file 10 are combined. Please refer to the previous description for details of the above, and will not go into details here.

上述之步驟或裝置可以用硬體、軟體、韌體或其任何組合來實施本發明中所描述之該等技術。若以軟體來實施,則可在一處理器中執行該軟體,該處理器可指一或多個處理器,諸如一微處理器、特殊應用 積體電路(ASIC)、場可程式化閘陣列(FPGA)、或數位信號處理器(DSP),或其他等效積體或離散邏輯電路。包含用以執行該等技術之指令的軟體可最初儲存於一電腦可讀媒體中且由一處理器執行。 The above described steps or devices may be carried out using hardware, software, firmware, or any combination thereof to carry out the techniques described in this disclosure. If implemented in software, the software may be executed in a processor, which may be referred to as one or more processors, such as a microprocessor, special application Integrated circuit (ASIC), field programmable gate array (FPGA), or digital signal processor (DSP), or other equivalent integrated or discrete logic. Software containing instructions for performing such techniques may be initially stored in a computer readable medium and executed by a processor.

綜上所述,本發明之輕量化電路板組裝檔案之方法、裝置及記錄媒體係可將IDF檔案中與第一PCA檔案10之重複的零件進行過濾,再將其轉換成單一零件之第二PCA檔案30,使得第二PCA檔案30與第一PCA檔案10結合後可免去重複檢查零件的步驟,以及降低運算的負擔,據此克服習知技術的問題。 In summary, the method, device and recording medium of the lightweight circuit board assembly file of the present invention can filter the duplicated parts of the IDF file with the first PCA file 10 and convert it into the second part of the single part. The PCA file 30 allows the second PCA file 30 to be combined with the first PCA file 10 to eliminate the need to repeatedly inspect the part and to reduce the computational burden, thereby overcoming the problems of the prior art.

雖然本發明以已一較佳實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之變更和潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention. Various changes and modifications may be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

S110~S150‧‧‧步驟 S110~S150‧‧‧Steps

Claims (10)

一種輕量化電路板組裝檔案之方法,用於將一IDF(Intermediate Data Format,中間資料格式)檔案匯入一第一電路板組裝檔案,該IDF檔案包括一資料庫檔案及一板檔案,該方法包括下列由電腦執行的步驟:比對該第一電路板組裝檔案與該IDF檔案中之複數零件之檔名與組裝位置;過濾該IDF檔案中之複數重複零件,以得到一新資料庫檔案;由該新資料庫檔案及該板檔案產生一新電路板組裝檔案;將該新電路板組裝檔案轉換為單一零件之一第二電路板組裝檔案;以及結合該第二電路板組裝檔案及該第一電路板組裝檔案。 A lightweight circuit board assembly file method for importing an IDF (Intermediate Data Format) file into a first circuit board assembly file, the IDF file including a database file and a board file, the method The following steps are performed by the computer: comparing the file name and assembly position of the first circuit board assembly file and the plurality of parts in the IDF file; filtering the plurality of duplicate parts in the IDF file to obtain a new database file; Generating a new circuit board assembly file from the new database file and the file file; converting the new circuit board assembly file into a second circuit board assembly file; and combining the second circuit board assembly file and the first A board assembly file. 如申請專利範圍第1項所述之方法,其中該些重複零件之檔名與組裝位置與該IDF檔案中之部分該些零件之檔名與組裝位置相同。 The method of claim 1, wherein the file names and assembly positions of the duplicate parts are the same as the file names and assembly positions of the parts of the IDF file. 如申請專利範圍第2項所述之方法,其中該過濾步驟包括:從該IDF檔案中之該些零件中刪除該些重複零件。 The method of claim 2, wherein the filtering step comprises: deleting the duplicate parts from the parts in the IDF file. 如申請專利範圍第1項所述之方法,其中該轉換步驟包括:將新電路板組裝檔案轉成一STL(Stereolithography,立體印刷術)格式。 The method of claim 1, wherein the converting step comprises: converting the new board assembly file into an STL (Stereolithography) format. 如申請專利範圍第4項所述之方法,其中該第二電路板組裝檔案為該新電路板組裝檔案之表面輪廓之資料。 The method of claim 4, wherein the second circuit board assembly file is information on a surface profile of the new circuit board assembly file. 如申請專利範圍第1項所述之方法,其中該結合步驟包括:對準該第二電路板組裝檔案及該第一電路板組裝檔案中的一電路板之一原點座標。 The method of claim 1, wherein the combining step comprises: aligning the second circuit board assembly file with an origin coordinate of a circuit board in the first circuit board assembly file. 一種輕量化電路板組裝檔案之裝置,用於將一IDF(Intermediate Data Format,中間資料格式)檔案匯入一第一電路板組裝檔案,該IDF檔案包括一資料庫檔案及一板檔案,該裝置包括:一比對單元,用於比對該第一電路板組裝檔案與該IDF檔案中之複數零件之檔名與組裝位置;一過濾單元,用於過濾該IDF檔案中之複數重複零件,以得到一新資料庫檔案;一PCA產生單元,用於由該新資料庫檔案及該板檔案產生一新電路板組裝檔案;一轉換單元,將該新電路板組裝檔案轉換為單一零件之一第二電路板組裝檔案;以及一結合單元,用於結合該第二電路板組裝檔案及該第一電路板組裝檔案。 A device for assembling a file of a lightweight circuit board for importing an IDF (Intermediate Data Format) file into a first circuit board assembly file, the IDF file including a database file and a board file, the device The method includes: a comparison unit, configured to compare a file name and an assembly position of the first circuit board assembly file and the plurality of parts in the IDF file; and a filtering unit configured to filter the plurality of duplicate parts in the IDF file to Obtaining a new database file; a PCA generating unit for generating a new circuit board assembly file from the new database file and the board file; a conversion unit converting the new circuit board assembly file into one of the single parts a second circuit board assembly file; and a combination unit for combining the second circuit board assembly file and the first circuit board assembly file. 如申請專利範圍第7項所述之裝置,其中該些重複零件之檔名與組裝位置與該IDF檔案中之部分該些零件之檔名與組裝位置相同。 The device of claim 7, wherein the file names and assembly positions of the duplicate parts are the same as the file names and assembly positions of the parts in the IDF file. 如申請專利範圍第7項所述之裝置,其中該第二電路板組裝檔案為該新電路板組裝檔案之表面輪廓之資料。 The device of claim 7, wherein the second circuit board assembly file is information on a surface profile of the new circuit board assembly file. 一種電腦可讀媒體,儲存使電腦執行輕量化電路板組裝檔案之方法之電腦程式,用於將一IDF(Intermediate Data Format,中間資料格式)檔案匯入一第一電路板組裝檔案,該IDF檔案包括一資料庫檔案及一板檔案,該方法包括下列步驟:比對該第一電路板組裝檔案與該IDF檔案中之複數零件之檔名與組裝位置;過濾該IDF檔案中之複數重複零件,以得到一新資料庫檔案;由該新資料庫檔案及該板檔案產生一新電路板組裝檔案;將該新電路板組裝檔案轉換為單一零件之一第二電路板組裝檔案;以及結合該第二電路板組裝檔案及該第一電路板組裝檔案。 A computer readable medium storing a computer program for causing a computer to execute a method for assembling a lightweight circuit board for importing an IDF (Intermediate Data Format) file into a first circuit board assembly file, the IDF file Include a database file and a board file, the method comprising the steps of: assembling a file and a file assembly name of the first circuit board and a plurality of parts in the IDF file; filtering a plurality of duplicate parts in the IDF file, Obtaining a new database file; generating a new circuit board assembly file from the new database file and the file file; converting the new circuit board assembly file into one of the single component assembly files; and combining the Two circuit board assembly files and the first circuit board assembly file.
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