TWI523881B - Hardened film - Google Patents

Description

Hardened film

The present invention relates to a cured film.

In recent years, in liquid crystal display panels and the like, the size of the substrate has been gradually increasing. Generally, on the surface of the substrate on which the color pixel, the semiconductor element, or the like is formed, the surface of the substrate is flattened by embedding the unevenness of the surface, and is rotated. A curable resin composition is formed by a coating method, a slit, a spin method, or the like.

On the other hand, in view of the improvement in productivity and the response to large-scale screens, a method for saving a liquid amount of a curable resin composition solution and forming a high-quality uniform cured film is discussed.

A method of forming a high-quality uniform cured film, for example, a method of forming a cured film by using the following resin composition, which is 3-methoxy-1-butanol relative to a specific resin And a resin composition in which 3-methoxybutyl acetate is used as a solvent (for example, Patent Document 1).

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-193718

However, when the resin composition using the above solvent is applied to a squeeze type (also referred to as non-rotation) coating method of a representative coating method, etc., it may be caused in the resin composition when the solvent is contested. The sudden boiling of the small bubbles causes the bubbles to appear on the surface of the coating film, which may cause a defect of a depression.

An object of the present invention is to provide a cured film which can suppress the occurrence of defects such as solvent boiling and which has excellent flatness as a whole.

That is, the present invention provides the following [1] to [9].

[1] A cured film obtained from a resin composition containing a resin (A), a surfactant (B), and a solvent (C), and substantially free of a polymerizable monomer The coloring agent and the content of the surfactant (B) are 0.005% by mass to 0.5% by mass based on the solid content.

[2] The cured film according to [1], wherein the surfactant (B) is a surfactant containing at least one atom selected from the group consisting of a ruthenium atom and a fluorine atom.

[3] The cured film according to [1] or [2], wherein the resin (A) is at least an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride (A1), and a ring having a carbon number of 2 to 4. A copolymer composed of an ether-bonded monomer (A2) polymerized.

[4] The cured film according to [3], wherein the monomer (A2) having a cyclic ether bond of 2 to 4 carbon atoms is a monomer having an oxiranyl group.

[5] The cured film according to [3] or [4], wherein the monomer (A2) having a cyclic ether bond of 2 to 4 carbon atoms is a monomer having an aliphatic polycyclic epoxy group.

[6] The cured film according to any one of [3] to [5] wherein the monomer (A2) having a cyclic ether bond of 2 to 4 carbon atoms is selected from the group consisting of formula (I) At least one compound of the group consisting of the compound and the compound represented by the formula (II);

[In the formulae (I) and (II), R ₁ and R ₂ each independently represent a hydrogen atom or a hydroxyl group having 1 to 4 carbon atoms which may be substituted; and X ¹ and X ² each independently represent a single bond, An alkyl group having 1 to 6 carbon atoms or -(CH ₂ ) _s -X'-(CH ₂ ) _t -, X' represents -S-, -O- or -NH-, and s and t each independently represent 0. An integer of ~6, but s+t=6].

[7] The cured film according to any one of [1] to [6] wherein the solvent (C) is a solvent containing diethylene glycol butyl ether acetate.

[8] The cured film according to [7], wherein the solvent (C) is a solvent in an amount of from 1 to 40% by mass based on the total amount of the diethylene glycol butyl ether acetate.

[9] A display device comprising the cured film according to any one of [1] to [8].

The cured film of the present invention is obtained from a resin composition containing a resin (A), a surfactant (B), and a solvent (C), and substantially free of a polymerizable monomer and a coloring agent. The content of the surfactant (B) is 0.005 mass% to 0.5 mass% based on the solid content. Here, the solid content refers to the total of the components in the resin composition after the solvent is removed.

The resin composition used in the present invention contains a resin (A), a surfactant (B), and a solvent (C).

The resin (A) used in the present invention is not particularly limited, and it is preferred that the reactivity can be expressed depending on the action of at least one of light and heat.

The resin (A) is, for example, the following copolymers [K1] to [K4].

[K1] A monomer (A2) in which an unsaturated carboxylic acid and/or an unsaturated carboxylic anhydride (A1) (hereinafter referred to as "(A1)"), and a cyclic ether having a carbon number of 2 to 4 are bonded (A2) (The following is a copolymer which is composed only when it is described as "(A2)").

[K2] A copolymer obtained by polymerizing (A1) and (A2) with a monomer (A3). Here, the monomer (A3) (hereinafter referred to as "(A3)") is a monomer copolymerizable with (A1) and/or (A2) and is not (A1) and/or (A2). Monomer.

[K3] a copolymer obtained by reacting a part of a carboxyl group derived from (A1) with a cyclic ether having a carbon number of 2 to 4 derived from (A2) in a copolymer of (A1) and (A3) .

[K4] a copolymer of (A1) and (A3).

Among these, the resin (A) is preferably a copolymer in which (A1) and (A2) are polymerized to form [K1].

Examples of the unsaturated carboxylic acid and/or unsaturated carboxylic anhydride (A1) include aliphatic unsaturated carboxylic acids and/or unsaturated carboxylic anhydrides. Specific examples include unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid; unsaturated dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, and itaconic acid. Acids; and anhydrides of such unsaturated dicarboxylic acids; succinic acid mono [2-(methyl) propylene methoxyethyl] ester, phthalic acid mono [2-(methyl) propylene oxy ethoxylate B Unsaturated mono[(methyl)propenyloxyalkyl]ester of a polyvalent carboxylic acid having two or more valences such as an ester; 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6 -Dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5-ethylbicyclo[2.2.1]g 2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene, 5,6-di a bicyclo[2.2.1]hept-2-ene containing a carboxyl group or a carboxylic anhydride such as a carboxybicyclo[2.2.1]hept-2-ene anhydride (norbornene dianhydride); α-(hydroxymethyl) acrylate It is equivalent to an unsaturated acrylate containing a hydroxyl group and a carboxyl group in the same molecule.

Among them, acrylic acid, methacrylic acid or maleic anhydride is preferable from the viewpoint of copolymerization reactivity and alkali solubility.

These may be used alone or in combination of two or more. In the present specification, the compound, the component, the agent, and the like which are exemplified may be used singly or in combination of two or more.

In the present specification, the term "(meth)acrylic acid" means at least one selected from the group consisting of acrylic acid and methacrylic acid. The descriptions of "(meth)acryloyl) and "(meth)acrylate" have the same meanings.

The monomer (A2) having a cyclic ether bond of 2 to 4 carbon atoms, for example, as long as it has a group selected from a cyclic ether having a carbon number of 2 to 4 (e.g., an oxiranyl group, a butyl epoxide) At least one of the group consisting of an alkyl group and a tetrahydrofuranyl group may be used, and further, a monomer having an unsaturated bond is preferred.

(A2), for example, a monomer having an oxirane group, a monomer having a butylene oxide group, a monomer having a tetrahydrofuran group, or the like.

The monomer having an oxirane group is, for example, a polymerizable compound having at least one group selected from the group consisting of an aliphatic epoxy group and an alicyclic epoxy group.

The monomer having an oxirane group is preferably a compound having at least one group selected from the group consisting of an aliphatic epoxy group and an alicyclic epoxy group, and having an unsaturated bond.

The aliphatic epoxy group means a group having a structure in which a chain olefin is epoxidized.

Examples of the compound having an aliphatic epoxy group include, for example, glycidyl (meth)acrylate, β-methylglycidyl (meth)acrylate, and β-ethylglycidyl (meth)acrylate. A compound represented by the following formula (III), which is described in JP-A-H07-248625.

(In the formula (III), R ¹¹ to R ¹³ each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and m is an integer of 1 to 5).

Here, the alkyl group is, for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, dibutyl, tert-butyl, 1-methyl-n-propyl, 2-methyl-positive Propyl, tert-butyl, n-pentyl, 1-methyl-n-butyl, 2-methyl-n-butyl, 3-methyl-n-butyl, 1,1-dimethyl-n-propyl 1,2-dimethyl-n-propyl, 2,2-dimethyl-n-propyl, n-hexyl, cyclohexyl and the like.

In any of the chemical structural formulas, the number of carbon atoms is different, but when it is not particularly limited, examples of the substituents and the like can be similarly applied throughout the specification. In addition, either a straight chain or a branch can be used, and any one of them can be used.

The compound represented by the above formula (III), for example, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, α-methyl-o-vinyl Benzyl glycidyl ether, α-methyl-m-vinylbenzyl glycidyl ether, α-methyl-p-vinylbenzyl glycidyl ether, 2,3-diglycidoxymethylstyrene , 2,4-diglycidoxymethylstyrene, 2,5-diglycidoxymethylstyrene, 2,6-diglycidoxymethylstyrene, 2,3,4-tri Glycidoxymethylstyrene, 2,3,5-triglycidoxymethylstyrene, 2,3,6-triglycidoxymethylstyrene, 3,4,5-triglycidyl Oxymethylstyrene, 2,4,6-triglycidoxymethylstyrene.

The alicyclic epoxy group means a group having a structure in which a cyclic olefin is epoxidized.

The compound having an alicyclic epoxy group may, for example, be a monomer having an aliphatic monocyclic epoxy group, a monomer having an aliphatic polycyclic epoxy group, or the like. The monomer having an aliphatic monocyclic epoxy group means a polymerizable compound having a structure having a structure in which a monocyclic cyclic olefin is epoxidized. In addition, the monomer having an aliphatic polycyclic epoxy group means a polymerizable compound having a structure having a structure in which a polycyclic cyclic olefin is epoxidized. The monomer having an epoxy group preferably has an epoxy group on at least one ring selected from the group consisting of an aliphatic monocyclic epoxy group and an aliphatic polycyclic epoxy group. And a compound having an unsaturated bond, and particularly preferably having at least one selected from the group consisting of an aliphatic monocyclic epoxy group and an aliphatic polycyclic epoxy group, and having a (meth) acrylonitrile group A compound of an oxy group.

The monocyclic cyclic olefin may, for example, be cyclopentene, cyclohexene, cycloheptene, cyclooctene or the like. Among them, a compound having 5 to 7 carbon atoms is preferred.

a monomer having an aliphatic monocyclic epoxy group, specifically, for example, a vinylcyclohexene monooxide 1,2-epoxy-4-vinylcyclohexane (for example, Celloxide 2000; Daicel Chemical Industry) Company made), 3,4-epoxycyclohexyl methyl acrylate (for example, Cyclomer A400; manufactured by Daicel Chemical Industry Co., Ltd.), 3,4-epoxycyclohexyl methacrylate (for example, Cyclomer M100; Daicel Chemical Industrial company system).

The polycyclic cyclic olefin, for example, dicyclopentene, tricyclodecene, norbornene, isodecene, bicyclooctene, bicyclononene, bicycloundecene, tricycloundecene, bicyclo Decadiene, tricyclododecene, and the like. Among them, a compound having 8 to 12 carbon atoms is preferred.

a monomer having an aliphatic polycyclic epoxy group, specifically, for example, 3,4-epoxynorbornyl acrylate, 3,4-epoxynorbornyl methacrylate, selected from the formula (I) And at least one compound selected from the group consisting of the compound represented by the formula (II) and the compound represented by the formula (II).

In the formulae (I) and (II), R ¹ and R ² each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms which may be substituted with a hydroxyl group.

X ¹ and X ² each independently represent a single bond, an alkylene group having 1 to 6 carbon atoms or -(CH ₂ ) _s -X'-(CH ₂ ) _t -, and X' represents -S-, -O- or -NH-, s and t each independently represent an integer from 0 to 6, but s + t = 6.

R ¹ and R ² , specifically, for example, a hydrogen atom; an alkyl group of a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a secondary butyl group, a tertiary butyl group or the like; a methylol group; , 1-hydroxyethyl, 2-hydroxyethyl, 1-hydroxypropyl, 2-hydroxypropyl, 3-hydroxypropyl, 1-hydroxymethylethyl, 1-hydroxy-1-methylethyl, A hydroxy-substituted alkyl group such as 1-hydroxybutyl, 2-hydroxybutyl, 3-hydroxybutyl, 4-hydroxybutyl or the like.

Preferred among these are a hydrogen atom, a methyl group, a methylol group, a 1-hydroxyethyl group, and a 2-hydroxyethyl group. It is especially preferred to be a hydrogen atom or a methyl group.

X ¹ and X ² , specifically, for example, a single bond; an alkylene group such as a methylene group, an ethyl group, a propyl group, or the like; a sulfur alkyl group, an oxygen alkyl group, an imide alkyl group, or the like. The alkyl group of a hetero atom. Specifically, for example, aerobic methylene, oxygen extended ethyl, oxygen extended propyl, thiomethylene, sulfur extended ethyl, sulfur extended propyl, imidomethylene, imine extended ethyl, imine Prolonged propyl and so on.

Among them, a single bond, a methylene group, an ethyl group, an oxymethylene group, and an oxygen ethyl group are preferred. Especially preferred is a single bond, oxygen extended ethyl.

At least one compound selected from the group consisting of the compound represented by the formula (I) and the compound represented by the formula (II) is preferably selected from the group consisting of the compound represented by the formula (I') and the formula (II). At least one compound of the group consisting of the compounds represented by ').

In the formula (I') and the formula (II'), R ^{1 '} and R ^{2 '} are synonymous with the above R ¹ and R ^{2 ,} respectively.

The compound represented by the formula (I) is, for example, a compound represented by the formula (I-1) to the formula (I-15). Preferred are formula (I-1), formula (I-3), formula (I-5), formula (I-7), formula (I-9), formula (I-11) to formula (I-15). ), particularly preferred are formula (I-1), formula (I-7), formula (I-9), and formula (I-15).

The compound represented by the formula (II) is, for example, a compound represented by the formula (II-1) to the formula (II-15). Preferably, it is a formula (II-1), a formula (II-3), a formula (II-5), a formula (II-7), a formula (II-9), a formula (II-11) to a formula (II-15). ), particularly preferred are formula (II-1), formula (II-7), formula (II-9), and formula (II-15).

At least one compound selected from the group consisting of the compound represented by the formula (I) and the compound represented by the formula (II) can be used alone. In addition, it can be mixed in any ratio. When mixing, the mixing ratio is preferably in the formula (I): the formula (II) is 5:95 to 95:5, more preferably 10:90 to 90:10, more preferably 20:80. 80:20.

The monomer having a glycidyl group as described above means, for example, a polymerizable compound having a butylene oxide group. The monomer having a butylene oxide group is preferably a compound having a butylene oxide group and having an unsaturated bond, and particularly preferably a compound having a cyclobutylene group and having a (meth)acryloxy group.

a monomer having a butylene oxide group, specifically, for example, 3-methyl-3-methylpropenyloxymethylbutoxybutane, 3-methyl-3-acryloxymethylepoxybutane Alkane, 3-ethyl-3-methylpropenyloxymethylbutoxybutane, 3-ethyl-3-acryloxymethylbutylene oxide, 3-methyl-3-methylpropenyloxy Ethyl butylene oxide, 3-methyl-3-propoxyethyl butylene oxide, 3-ethyl-3-methylpropoxyethyl butylene oxide or 3-ethyl-3- Propyleneoxyethyl butylene oxide and the like.

The monomer having a tetrahydrofuran group is, for example, a polymerizable compound having a tetrahydrofuran group. The monomer having a tetrahydrofuranyl group is preferably a compound having a tetrahydrofuranyl group and having an unsaturated bond, and particularly preferably a compound having a tetrahydrofuranyl group and having a (meth)acryloxy group.

Specific examples of the monomer having a tetrahydrofuranyl group include tetrahydrofuran acrylate (for example, Viscoat V#150, manufactured by Osaka Organic Chemical Industry Co., Ltd.), tetrahydrofuran methacrylate, and the like.

The monomer (A3) which can be copolymerized, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, n-butyl (meth)acrylate, (meth)acrylic acid alkyl esters such as methyl acrylate tributyl acrylate; cyclohexyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, tricyclo(methyl) acrylate [5.2] .1.0 ^2,6 ]decane-8-ester (known in the art as dicyclopentyl (meth)acrylate), dicyclopentyloxyethyl (meth)acrylate, (meth)acrylic acid (meth)acrylic acid cyclic alkyl esters such as isodecyl ester; (meth)acrylic acid aryl esters such as phenyl (meth)acrylate and benzyl (meth)acrylate; phenyl acrylate and benzoyl acrylate An aryl acrylate such as an ester; a dicarboxylic acid diester such as diethyl maleate, diethyl fumarate or diethyl itaconate; 2-hydroxyethyl (meth)acrylate; a hydroxyalkyl ester such as 2-hydroxypropyl methacrylate; bicyclo[2.2.1]hept-2-ene, 5-methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[ 2.2.1] Hept-2-ene, 5-hydroxybicyclo[2.2.1]hept-2-ene, 5-hydroxymethylbicyclo[2.2.1]hept-2-ene, 5-(2 '-Hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5-methoxybicyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2- Alkene, 5,6-dihydroxybicyclo[2.2.1]hept-2-ene, 5,6-bis(hydroxymethyl)bicyclo[2.2.1]hept-2-ene, 5,6-di(2' -hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5,6-dimethoxybicyclo[2.2.1]hept-2-ene, 5,6-diethoxybicyclo[2.2.1 Hept-2-ene, 5-hydroxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxyl Methyl-5-methylbicyclo[2.2.1]hept-2-ene, 5-tris-butoxycarbonylbicyclo[2.2.1]hept-2-ene, 5-cyclohexyloxycarbonylbicyclo[2.2. 1]hept-2-ene, 5-phenoxycarbonylbicyclo[2.2.1]hept-2-ene, 5,6-di(tertiarybutoxycarbonyl)bicyclo[2.2.1]hept-2-ene a bicyclic unsaturated compound of 5,6-di(cyclohexyloxycarbonyl)bicyclo[2.2.1]hept-2-ene; N-methylbutyleneimine, N-ethyl cis-butyl N-alkyl maleimide, such as ene diimine, N-propyl maleimide, N-cyclopentyl maleimide, N-cyclohexyl N-cycloalkyl maleimide, such as enediamine, N-cyclooctylmethyleneimine, etc.; N- An N-crosslinked carbocyclic group-substituted maleimide, such as a cycloalkyl-methyleneimine, an N-norbornyl succinimide, or the like; N-phenyl cis-butene N-aryl maleimide, such as enediamine, N-arylalkyl maleimide, N-benzyltheneimide, etc.; N-amber Imino-3-butylenedimine benzoate, N-succinimide-4-butylimide butyrate, N-succinimide-6-cis Butene diimide hexanoate, N-succinimide-3-butanediimide propionate, N-(9-acridinyl) maleimide, etc. Carbonyl ruthenium derivatives; styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyl toluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, chlorine Ethylene, vinylidene chloride, acrylamide, vinyl acetate, 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, and the like.

Among them, styrene, N-phenylmaleimide, N-cyclohexylmethyleneimine, N-benzyl group are preferred from the viewpoints of copolymerization reactivity and alkali solubility. Maleimide, bicyclo [2.2.1] hept-2-ene, and the like.

For example, the resin (A) can be referred to the "Experimental method for polymer synthesis (experimental method for polymer synthesis)" (Otsuya Ryokan, Chemical Co., Ltd., 1st edition, 1st brush, issued on March 1, 1972) The method described and the cited documents described in the literature were produced.

Specifically, a specific amount of the monomers (A1) and (A2) constituting the copolymer, an arbitrary (A3), a polymerization initiator, and a solvent are placed in a reaction vessel, and oxygen is replaced by nitrogen in oxygen. The polymer is obtained by stirring, heating, and heat preservation in the absence of it. The polymerization conditions such as the input method, the reaction temperature, and the time can be appropriately adjusted in consideration of the production equipment, the calorific value generated by the polymerization, and the like.

The polymerization initiators and solvents used herein can be used generally in the field by users. For example, a polymerization initiator, a solvent (C) or the like described later can be used.

The obtained polymer may be used as it is by directly using the solution after the reaction, or by using a concentrated or diluted solution, or by using a method such as reprecipitation to obtain a solid.

In particular, when the polymerization is carried out, the solvent (C) described later can be used as a solvent, and the solution after the reaction can be used as it is, so that the process can be simplified.

The copolymer [K1], the ratio of each monomer, is preferably a total number of moles with respect to the monomers constituting the copolymer [K1], and is in the following range in terms of molar fraction.

(A1) 5 to 95 mol%, preferably 10 to 90 mol%.

(A2) 5 to 95 mol%, preferably 10 to 90 mol%.

When the molar fraction is in this range, the storage stability, developability, solvent resistance, heat resistance, and mechanical strength tend to be good.

Further, the copolymer [K2], the ratio of each monomer is preferably the total number of moles with respect to the monomers constituting the copolymer [K2], and is in the following range in terms of molar fraction.

(A1) 2 to 40 mol%, preferably 5 to 35 mol%.

(A2) 2 to 95 mol%, preferably 5 to 80 mol%.

(A3) 1 to 65 mol%, preferably 1 to 60 mol%.

When the molar fraction is in this range, the storage stability, developability, solvent resistance, heat resistance, and mechanical strength tend to be good.

The copolymer [K3] can be produced via a two-stage process.

First, (A1) and (A3) were copolymerized by the same method as the above method to obtain a copolymer.

In this case, the ratio of each monomer is preferably the total number of moles with respect to the monomers constituting the resin, and is in the following range in terms of molar fraction.

(A1) 5 to 50 mol%, preferably 10 to 45 mol%.

(A3) 50 to 95% by mole, preferably 55 to 90% by mole.

Next, a part of the carboxylic acid and/or carboxylic anhydride of (A1) and (A1) of the copolymer of (A3) is reacted with an epoxy group, a butylene oxide group or a tetrahydrofuranyl group derived from (A2).

Therefore, the ambient gas in the flask is replaced with oxygen from nitrogen, and (A2), a reaction catalyst, a polymerization inhibitor, and the like are added to the flask, for example, at 60 to 130 ° C for 1 to 10 hours. The reaction conditions such as the input method, the reaction temperature, and the time can be appropriately adjusted in consideration of the production equipment, the calorific value generated by the polymerization, and the like.

The number of moles of (A2) at this time is preferably from 5 to 80 mol%, preferably from 10 to 75 mol%, particularly preferably from 15 to 70 mol%, with respect to the molar number of (A1). .

When the ratio of each monomer is in this range, the balance between storage stability, developability, solvent resistance, heat resistance, mechanical strength, and sensitivity tends to be good.

The reaction catalyst is preferably used, for example, as a reaction catalyst for a carboxyl group and an epoxy group, a butylene oxide group or a tetrahydrofuranyl group. Specifically, there are tris(dimethylaminoethyl)phenol and the like.

The amount of the reaction catalyst used is, for example, 0.001 to 5% by mass based on the total mass of (A1) to (A3).

The polymerization inhibiting agent is, for example, hydroquinone.

The amount of the polymerization inhibitor is, for example, 0.001 to 5% by mass based on the total mass of (A1) to (A3).

The copolymer [K4], the ratio of each monomer is preferably a total number of moles with respect to the monomers constituting the copolymer [K4], and is in the following range in terms of molar fraction.

(A1) 2 to 40 mol%, preferably 5 to 35 mol%.

(A2) 60 to 98% by mole, preferably 65 to 95% by mole.

When the molar fraction is in this range, the storage stability, developability, solvent resistance, heat resistance, and mechanical strength tend to be good.

The polystyrene-equivalent weight average molecular weight of the resin (A) is preferably from 3,000 to 100,000, particularly preferably from 5,000 to 50,000. When the weight average molecular weight of the resin (A) is in this range, the coatability tends to be good.

The degree of dispersion (molecular weight distribution) [weight average molecular weight (Mw) / number average molecular weight (Mn)] of the resin (A) is preferably from 1.1 to 6.0, particularly preferably from 1.2 to 4.0. When the degree of dispersion is in this range, the coatability tends to be excellent.

The content of the resin (A) which can be used in the resin composition of the present invention is preferably from 5 to 99% by mass, particularly preferably from 10 to 70% by mass, based on the mass fraction of the resin composition. When the content of the resin (A) is in this range, solvent resistance, heat resistance, and mechanical strength tend to be good.

The surfactant (B) used in the present invention is not particularly limited, and for example, a surfactant selected from at least one atom selected from the group consisting of a ruthenium atom and a fluorine atom. Specific examples thereof include a polyoxyalkylene-based surfactant, a fluorine-based surfactant, and a polyoxyalkylene-based surfactant having a fluorine atom. Among them, a polyoxyalkylene-based surfactant having a fluorine atom is preferred. By using such a surfactant (B), it is possible to suppress the generation of minute bubbles contained in the composition by blending with other components in the resin composition and their contents. As a result, the sudden boiling of the solvent evaporation can be effectively suppressed.

The polyoxyalkylene-based surfactant is, for example, a surfactant having a siloxane coupling. Specifically, for example, Toray Silicone DC3PA, the same SH7PA, the same DC11PA, the same SH21PA, the same SH28PA, the same SH29PA, the same SH30PA, the polyether modified oyster sauce SH8400 (trade name: Toray Silicone; manufactured by Dow Corning Toray Co., Ltd.), KP321, KP322, KP323, KP324, KP326, KP340, KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF-4446, TSF4452, TSF4460 (manufactured by Momentive Performance Materials).

The fluorine-based surfactant is, for example, a surfactant having a fluorocarbon chain. Specifically, for example, Fluorinert (registered trademark) FC430, FC431 (manufactured by Sumitomo 3M), Megafac (registered trademark) F142D, F171, F172, F173, F177, F183, R30, F489 (DIC) Company system), EF-TOP (registered trademark) EF301, EF303, EF351, EF352 (Mitsubishi Material Electronic Co., Ltd.), Surflon (registered trademark) S381, same as S382, same as SC101, and SC105 (made by Asahi Glass) ), E5844 (manufactured by Daikin Fine Chemical Research Institute), BM-1000, BM-1100 (all product names: manufactured by BM Chemie Co., Ltd.).

The polyoxyalkylene-based surfactant having a fluorine atom is, for example, a surfactant having a siloxane coupling and a fluorocarbon chain. Specifically, for example, Megafac (registered trademark) R08, same as BL20, same as F475, and F443 (manufactured by DIC Corporation). It is preferably Megafac (registered trademark) F475.

The amount of the surfactant (B) relative to the resin composition of the present invention is 0.005 to 0.5% by mass, preferably 0.01 to 0.2% by mass, particularly preferably 0.01 to 0.1% by mass, more preferably 0.01 to 0.07 by mass. %. By including the surfactant (B) in this range, not only the flatness can be improved, but also the bumping can be effectively prevented as described above.

The solvent (C) used in the present invention is, for example, various organic solvents used in the field of the resin composition.

Specific examples are: ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether and ethylene glycol monoether ether like ethylene glycol monoalkyl ether; diethylene glycol dimethyl ether, two Diethylene glycol dialkyl ethers such as diol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether; methyl cellosolve acetate, B Glycol alkyl ether acetate such as cellulose acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monoethyl ether acetate; propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate Ester alkyl glycol alkyl ether acetates such as ester, propylene glycol monopropyl ether acetate, methoxybutyl acetate, methoxypentyl acetate, etc.; propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether Propylene glycol monoalkyl ethers such as propylene glycol monobutyl ether; propylene glycol dialkyl ethers such as propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol ethyl methyl ether, propylene glycol dipropyl ether, propylene glycol propyl methyl ether, propylene glycol ethyl propyl ether a propylene glycol alkane such as propylene glycol methyl ether propionate, propylene glycol diethyl ether propionate, propylene glycol propyl ether propionate or propylene glycol butyl ether propionate Propionate; butanediol monoalkyl ethers such as methoxybutyl alcohol, ethoxybutyl alcohol, propoxy butyl alcohol, butoxybutyl alcohol; methoxybutyl acetate, ethoxybutyl acetate, Butanediol monoalkyl ether acetates such as propoxybutyl acrylate or butoxybutyl acetate; methoxybutyl propionate, ethoxybutyl propionate, propoxybutyl propionate, butoxybutyl propionate Butane diol monoalkyl ether propionate; dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol methyl ether and other dipropylene glycol dialkyl ether; benzene, toluene, xylene, trimethylbenzene, etc. a hydrocarbon; a ketone such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone or cyclohexanone; ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, glycerin, etc. Alcohols; methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, 2-hydroxy-2-methylpropionic acid Ethyl ester, methyl hydroxyacetate, ethyl hydroxyacetate, butyl glycolate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, 3-hydroxyl Propyl propionate, butyl 3-hydroxypropionate, methyl 2-hydroxy-3-methylbutanoate, methyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, Methyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, methyl propyl oxyacetate, ethyl propyl acrylate, propyl propyl acetate, butyl propyl acetate, butoxy Methyl acetate, ethyl butoxyacetate, propyl butoxyacetate, butyl butoxyacetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, 2 - butyl methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, propyl 2-ethoxypropionate, butyl 2-ethoxypropionate, 2-butoxypropionic acid Methyl ester, ethyl 2-butoxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, 3- Propyl propyl propionate, butyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate Ester, methyl 3-propoxypropionate, ethyl 3-propoxypropionate, propyl 3-propoxypropionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, 3-butyl Oxypropionic acid 3-butoxy propyl propionate, butyl propionate 3- butoxy, etc. esters; tetrahydrofuran, pyran cyclic ether group, etc. class; [gamma] -butyrolactone, etc. cyclic ethers.

The solvent (C) is preferably a solvent containing diethylene glycol butyl ether acetate.

Further, in terms of coatability, drying property, and anti-bumping, in addition to diethylene glycol butyl ether acetate, it is preferred to further contain an alkylene glycol alkyl ether acetate; methoxybutanol and Alcohols such as ethoxybutanol; ketones such as cyclohexanone; ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, methyl 3-methoxyacetate, ethyl 3-ethoxyacetate An ester such as 3-butyl methoxyacetate or butyl 3-ethoxyacetate.

The content of the solvent (C) is preferably from 60 to 90% by mass, particularly preferably from 65 to 85% by mass, based on the mass of the resin composition. When the content of the solvent (C) is in this range, it is expected that the coating property can be improved when it is applied by various coating apparatuses to be described later.

In particular, the content of diethylene glycol butyl ether acetate is preferably from 1 to 40% by mass, more preferably from 5 to 25% by mass, based on the mass of the solvent.

The resin composition used in the present invention contains substantially no polymerizable monomer. In the resin composition used in the present invention, the content of the polymerizable monomer relative to the entire composition is, for example, less than 1% by mass, preferably less than 0.5% by mass, based on the mass fraction. The polymerizable monomer is, for example, a monofunctional monomer having an unsaturated bond, a difunctional monomer or a trifunctional or higher polyfunctional monomer.

Monofunctional monomers such as nonylphenylcarbamate (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-ethylhexylcarba(meth)acrylate Alcohol ester, 2-hydroxyethyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, 2-(2-ethoxyethoxy)ethyl (meth)acrylate, Tetrahydrofuranyl (meth)acrylate, caprolactone (meth)acrylate, epoxidized phenolate (meth)acrylate, propionate (meth)acrylate or N-vinylrrolidone.

Difunctional monomers, for example, 1,3-butylene glycol (meth)acrylate, 1,3-butylene glycol (meth)acrylate, 1,6-hexanediol di(meth)acrylate , ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, two ( Tetraethylene glycol methacrylate, polyethylene glycol diacrylate, bis(acryloxyethyl)ether of bisphenol A, epoxidized bisphenol A di(meth)acrylate, di(methyl) A neopentyl glycol acrylate, a neopentyl glycol di(meth)acrylate or a 3-methylpentanediol di(meth)acrylate.

A trifunctional or higher polyfunctional monomer such as trimethylolpropane tris(meth)acrylate, neopentyl tris(meth)acrylate, or tris(2-hydroxyethyl)tris(meth)acrylate Cyanurate, trimethylolpropane tris(meth)acrylate, trimethylolpropane tri(methyl)acrylate, pentaerythritol tetra(meth)acrylate, five (a) Di-n-pentaerythritol acrylate, di-n-pentaerythritol hexa(meth)acrylate, tripentenol tetra(meth)acrylate, tripentenol pentoxide (f), six Tri-n-pentaerythritol (meth)acrylate, triphenol octa(meth)acrylate, tripentenol octa(meth)acrylate, pentaerythritol tri(meth)acrylate a reactant of an acid anhydride, a reaction product of dipentaerythritol penta(meth)acrylate and an acid anhydride, a reaction product of an ampicillin hepta(meth)acrylate and an acid anhydride, and a modified by caprolactone ( Trimethylolpropane methyl methacrylate, neopentyl ester of tris(meth)acrylate modified with caprolactone, tris(2-hydroxyethyl) tris(meth)acrylate modified by caprolactone Isocyanurate Lactone modified tetrakis(meth)acrylic acid pentaerythritol ester, caprolactone modified penta (meth)acrylic acid pentaerythritol ester, caprolactone modified hexa(meth)acrylic acid Dipentaerythritol ester, tetracoerythritol tetra(meth)acrylate modified with caprolactone, and pentaerythritol pentoxide modified by caprolactone Ester-modified hexa(pentaerythritol) hexa(meth) acrylate, heptapropionate modified heptaerythritol (meth) acrylate, octa(meth) acrylate modified by caprolactone a reaction product of tri-n-pentaerythritol ester, modified by caprolactone and neopentyl glycol (meth) acrylate, and anhydride, modified by caprolactone, dipentaerythritol penta(meth)acrylate A reaction product with an acid anhydride or a reaction product of a neopentyl lactone modified hepto-pentaerythritol (meth)acrylate and an acid anhydride.

The resin composition used in the present invention does not substantially contain a coloring agent such as a pigment or a dye. In the resin composition used in the present invention, the content of the colorant relative to the entire composition is generally less than 1% by mass, preferably less than 0.5% by mass, based on the mass fraction.

The resin composition used in the present invention may contain at least one compound selected from the group consisting of a carboxylic anhydride and a compound having at least two carboxyl groups. A compound having two carboxyl groups, for example, a polyvalent carboxylic anhydride, a polyvalent carboxylic acid or the like.

As the carboxylic anhydride, it is also desirable to use a commercially available epoxy resin hardener formed of a colorless acid anhydride. Specifically, for example, Adeka Hardner EH-700 (trade name (the same applies hereinafter), manufactured by Asahi Kasei Kogyo Co., Ltd.), Rikacid-HH, MH-700 (manufactured by Nippon Chemical and Chemical Co., Ltd.), EPIKINI YH-126, and YH- 306. Same as DX-126 (manufactured by Yuka Shell Epoxy Co., Ltd.).

The polyvalent carboxylic acid anhydride is, for example, itaconic anhydride, succinic anhydride, citraconic anhydride, dodecenyl succinic anhydride, 1,2,3-propane tricarboxylic anhydride, maleic anhydride, hexahydrophthalic anhydride, An aliphatic dicarboxylic anhydride such as methyltetrahydrophthalic anhydride, norbornene dicarboxylic acid or norbornene dianhydride; 1,2,3,4-butanetetracarboxylic dianhydride, cyclopentane IV An aliphatic polyvalent carboxylic acid dianhydride such as carboxylic acid dianhydride; an aromatic polyvalent carboxylic acid anhydride such as phthalic anhydride, benzene tetracarboxylic dianhydride, trimellitic anhydride or diphenyl ketone tetracarboxylic anhydride; An acid anhydride-containing acid anhydride such as diol dipyridyl trimomate or glyceryl trimellitate.

Among them, phthalic anhydride and trimellitic anhydride are preferred from the viewpoint of high transparency in the visible light region.

The polyvalent carboxylic acid may, for example, be an aliphatic polyvalent carboxylic acid such as succinic acid, glutaric acid, adipic acid, butane tetracarboxylic acid, maleic acid or itaconic acid; hexahydrophthalic acid, Alicyclic polyvalent carboxylic acid such as 1,2-cyclohexanecarboxylic acid, 1,2,4-cyclohexanetricarboxylic acid, cyclopentanetetracarboxylic acid or the like; phthalic acid, isophthalic acid, An aromatic polyvalent carboxylic acid such as phthalic acid, trimellitic acid, benzotetracarboxylic acid 1,4,5,8-naphthalenetetracarboxylic acid or diphenylketonetetracarboxylic acid.

Among them, phthalic acid and trimellitic acid are preferred from the viewpoint of high transparency in the visible light region.

In the resin composition used in the present invention, the content of at least one compound selected from the group consisting of a carboxylic anhydride and a compound having at least two carboxyl groups is a mass fraction with respect to the total amount of the resin (A). The amount is preferably from 0.1 to 20% by mass, particularly preferably from 1 to 15% by mass. When the compound is in this range, the reliability of the coating film can be improved.

The resin composition used in the present invention may further contain a cationic polymerization initiator.

As the cationic polymerization initiator, those composed of a phosphonium cation and an anion derived from a Lewis acid can also be used.

Specific examples of the phosphonium cation include diphenyl phosphonium salt, bis(p-tolyl) phosphonium salt, bis(p-terinobutylphenyl) phosphonium salt, bis(p-octylphenyl) phosphonium salt, and double (to ten Octyl phenyl) phosphonium salt, bis(p-octyloxyphenyl) phosphonium salt, bis(p-octadeoxyphenyl) phosphonium salt, phenyl (p-octadecyloxyphenyl) phosphonium salt, (p-toluene) (p-isopropylphenyl) phosphonium salt, triphenylsulfonium salt, tris(p-tolyl)phosphonium salt, tris(p-isopropylphenyl)phosphonium salt, tris(2,6-dimethylbenzene) Base salt, tris(p-terphenyl)phosphonium salt, tris(p-cyanophenyl)phosphonium salt, tris(p-chlorophenyl)phosphonium salt, or dimethyl (tris(trichloromethyl) ) methyl) sulfonium salts and the like.

Preferred phosphonium cations are, for example, bis(p-tolyl)phosphonium salt, (p-tolyl)(p-isopropylphenyl)phosphonium salt, bis(p-terphenyl)phosphonium salt, triphenylsulfonium Salt or tris(p-tert-butylphenyl) phosphonium salt and the like.

Specific examples of the aforementioned anion derived from a Lewis acid include hexafluorophosphate, hexafluoroarsenate, hexafluoroantimonate or tetrakis(pentafluorophenyl)borate.

These phosphonium cations can be arbitrarily combined with an anion derived from a Lewis acid.

Specific examples of the cationic polymerization initiator include diphenylphosphonium salt hexafluorophosphate, bis(p-tolyl)phosphonium salt hexafluorophosphate, bis(p-terphenyl)phosphonium salt hexafluorophosphate, Bis(p-octylphenyl)phosphonium salt hexafluorophosphate, bis(p-octadecylphenyl)phosphonium salt hexafluorophosphate, bis(p-octyloxyphenyl)phosphonium salt hexafluorophosphate, double (pair) Octadecyloxyphenyl) phosphonium hexafluorophosphate, phenyl (p-octadecylphenyl) phosphonium salt hexafluorophosphate, (p-tolyl) (p-isopropylphenyl) phosphonium salt hexafluorophosphate Salt, methylnaphthyl sulfonium salt hexafluorophosphate, ethylnaphthyl sulfonium salt hexafluorophosphate, triphenylsulfonium salt hexafluorophosphate, tris(p-tolyl)phosphonium salt hexafluorophosphate, three (pair) Isopropyl phenyl) sulfonium salt hexafluorophosphate, tris(2,6-dimethylphenyl)phosphonium salt hexafluorophosphate, tris(p-tert-butylphenyl) phosphonium salt hexafluorophosphate, three (p-cyanophenyl) phosphonium salt hexafluorophosphate, tris(p-chlorophenyl) phosphonium salt hexafluorophosphate, dimethylnaphthyl phosphonium salt hexafluorophosphate, diethyl naphthyl phosphonium salt hexafluorophosphate , dimethyl (tris(trichloromethyl)methyl) sulfonium salt hexafluorophosphate; diphenyl sulfonium salt hexafluorophosphate Acid salt, bis(p-tolyl)phosphonium salt hexafluoroarsenate, bis(p-terphenyl)phosphonium salt hexafluoroarsenate, bis(p-octylphenyl)phosphonium salt hexafluoroarsenate , bis(p-octadecylphenyl)phosphonium hexafluoroarsenate, bis(p-octyloxyphenyl)phosphonium hexafluoroarsenate, bis(p-octadecylphenyl)phosphonium hexafluoroarsenate Acid salt, phenyl (p-octadecylphenyl) phosphonium salt hexafluoroarsenate, (p-tolyl) (p-isopropylphenyl) phosphonium salt hexafluoroarsenate, methyl naphthyl phosphonium salt Fluor arsenate, ethylnaphthyl sulfonium salt hexafluoroarsenate, triphenylsulfonium salt hexafluoroarsenate, tris(p-tolyl)phosphonium hexafluoroarsenate, tris(p-isopropylphenyl)鋶 salt hexafluoroarsenate, tris(2,6-dimethylphenyl)phosphonium hexafluoroarsenate, tris(p-terphenyl)phosphonium hexafluoroarsenate, three (pair) Cyanophenyl) sulfonium salt hexafluoroarsenate, tris(p-chlorophenyl) phosphonium salt hexafluoroarsenate, dimethylnaphthyl sulfonium salt hexafluoroarsenate, diethylnaphthyl sulfonium salt hexafluoroarsenic Acid salt, dimethyl (tris(trichloromethyl)methyl) phosphonium salt hexafluoroarsenate; diphenyl phosphonium salt hexafluoroantimonate, bis(p-tolyl) phosphonium salt hexafluoroantimonate, Double (for three-level Ding Phenyl) sulfonium salt hexafluoroantimonate, bis(p-octylphenyl) phosphonium salt hexafluoroantimonate, bis(p-octadecylphenyl)phosphonium hexafluoroantimonate, bis(p-octyloxy) Phenyl) sulfonium salt hexafluoroantimonate, bis(p-octadecylphenyl) phosphonium salt hexafluoroantimonate, phenyl (p-octadecylphenyl) phosphonium salt hexafluoroantimonate, Tolyl)(p-isopropylphenyl)phosphonium salt hexafluoroantimonate, methylnaphthylsulfonium salt hexafluoroantimonate, ethylnaphthylsulfonium salt hexafluoroantimonate, triphenylsulfonium salt hexafluorophosphate Citrate, tris(p-tolyl)phosphonium hexafluoroantimonate, tris(p-isopropylphenyl)phosphonium hexafluoroantimonate, tris(2,6-dimethylphenyl)phosphonium salt Fluoride, tris(p-terphenyl)phosphonium hexafluoroantimonate, tris(p-cyanophenyl)phosphonium hexafluoroantimonate, tris(p-chlorophenyl)phosphonium hexafluoroantimonate Acid salt, dimethylnaphthyl sulfonium salt hexafluoroantimonate, diethyl naphthyl sulfonium salt hexafluoroantimonate, dimethyl (tris(trichloromethyl)methyl) sulfonium salt hexafluoroantimonate Diphenylphosphonium tetrakis(pentafluorophenyl)borate, bis(p-tolyl)phosphonium tetrakis(pentafluorophenyl)borate, bis(p-terphenyl)phosphonium tetras(pentafluoro) Phenyl) borate, (p-octylphenyl) phosphonium salt tetrakis(pentafluorophenyl)borate, bis(p-octadecylphenyl)phosphonium tetrakis(pentafluorophenyl)borate, bis(p-octyloxyphenyl)anthracene Tetrakis(pentafluorophenyl)borate, bis(p-octadecylphenyl)phosphonium tetrakis(pentafluorophenyl)borate, phenyl(p-octadecylphenyl)phosphonium salt tetrakis(pentafluoro) Phenyl)borate, (p-tolyl)(p-isopropylphenyl)phosphonium tetrakis(pentafluorophenyl)borate, methylnaphthylphosphonium tetrakis(pentafluorophenyl)borate, ethylnaphthalene Base salt tetrakis(pentafluorophenyl)borate, triphenylsulfonium salt tetrakis(pentafluorophenyl)borate, tris(p-tolyl)phosphonium tetrakis(pentafluorophenyl)borate, three (different Propyl phenyl) sulfonium salt tetrakis(pentafluorophenyl)borate, tris(2,6-dimethylphenyl)phosphonium tetrakis(pentafluorophenyl)borate, tris(p-tert-butylphenyl)鋶 salt tetrakis(pentafluorophenyl)borate, tris(p-cyanophenyl) phosphonium salt tetrakis(pentafluorophenyl)borate, tris(p-chlorophenyl) phosphonium salt tetrakis(pentafluorophenyl)borate , dimethylnaphthyl phosphonium salt tetrakis(pentafluorophenyl)borate, diethylnaphthyl phosphonium salt tetrakis(pentafluorophenyl)borate, dimethyl(tris(trichloromethyl)methyl)anthracene Salt tetrakis(pentafluorophenyl)borate Wait.

Preferred is bis(p-tolyl)phosphonium salt hexafluorophosphate, (p-tolyl) (p-isopropylphenyl) phosphonium salt hexafluorophosphate, bis(p-terphenyl)phosphonium salt hexafluorophosphate Phosphate, triphenylsulfonium salt hexafluorophosphate, tris(p-tert-butylphenyl)phosphonium salt hexafluorophosphate, bis(p-tolyl)phosphonium salt hexafluoroarsenate, (p-tolyl) P-isopropylphenyl) sulfonium salt hexafluoroarsenate, bis(p-terphenyl)phosphonium salt hexafluoroarsenate, triphenylsulfonium salt hexafluoroarsenate, tris (three-stage Phenyl phenyl) sulfonium hexafluoroarsenate, bis(p-tolyl) sulfonium hexafluoroantimonate, (p-tolyl) (p-isopropylphenyl) sulfonium hexafluoroantimonate, double (pair Tert-butyl phenyl) sulfonium salt hexafluoroantimonate, triphenylsulfonium salt hexafluoroantimonate, tris(p-tert-butylphenyl) phosphonium hexafluoroantimonate, bis(p-tolyl) Bismuth salt tetrakis(pentafluorophenyl)borate, (p-tolyl) (p-isopropylphenyl) phosphonium salt tetrakis(pentafluorophenyl)borate, bis(p-terphenyl) phosphonium salt (pentafluorophenyl)borate, triphenylsulfonium salt tetrakis(pentafluorophenyl)borate, tris(p-tert-butylphenyl)phosphonium tetrakis(pentafluorophenyl)borate, and the like.

More preferably bis(p-tolyl)phosphonium hexafluoroantimonate, (p-tolyl)(p-isopropylphenyl)phosphonium hexafluoroantimonate, bis(p-terphenyl)phosphonium salt Hexafluoroantimonate, triphenylsulfonium salt hexafluoroantimonate, tris(p-terphenyl)phosphonium salt hexafluoroantimonate, bis(p-tolyl)phosphonium salt tetrakis(pentafluorophenyl) Borate, (p-tolyl) (p-isopropylphenyl) phosphonium salt tetrakis(pentafluorophenyl)borate, bis(p-terphenyl)phosphonium tetrakis(pentafluorophenyl)borate, Triphenylsulfonium salt tetrakis(pentafluorophenyl)borate, tris(p-tert-butylphenyl) phosphonium salt tetrakis(pentafluorophenyl)borate, and the like.

The content of the cationic polymerization initiator is preferably from 0.1 to 40% by mass, particularly preferably from 1 to 30% by mass, based on the mass fraction of the resin composition.

When the total amount of the cationic polymerization initiator is in this range, there is a tendency to shorten the hardening time.

In the resin composition used in the present invention, a filler, a polymer compound other than the resin (A), an adhesion promoter, an antioxidant, an ultraviolet absorber, a light stabilizer, an anti-agglomerating agent, and a chain transfer may be used as necessary. Additives such as agents.

The filler is, for example, glass, cerium oxide, aluminum oxide or the like.

The polymer compound other than the resin (A) is, for example, a curable resin such as an epoxy resin or a maleimide resin, or a polyvinyl alcohol, a polyacrylic acid, a polyethylene glycol monoalkyl ether, or an acrylic polychloride. A thermoplastic resin such as an alkyl ester, a polyester or a polyurethane.

The adhesion promoter is preferably a decane compound. Specifically, for example, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)decane, N-(2-aminoethyl)-3-aminopropylmethyldi Methoxy decane, N-(2-aminoethyl)-3-aminopropyltrimethoxy decane, 3-aminopropyltrimethoxy decane, 3-glycidoxypropyltrimethoxy decane, 3-epoxypropyl Oxypropyl propyl dimethoxy decane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxy decane, 3-chloropropylmethyldimethoxy decane, 3-chloropropyltrimethoxy decane , 3-methacryloxypropyltrimethoxydecane, 3-mercaptopropyltrimethoxydecane, and the like.

Antioxidants are, for example, 2-tris-butyl-6-(3-tert-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2-[1-(2) acrylic acid. -hydroxy-3,5-di-triamylpentylphenyl)ethyl]-4,6-di-triamylphenyl, 6-[3-(3-tri-butyl-4-hydroxy- 5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldiphenyl[d,f][1,3,2]dioxaphosphane heptane, 3,9 - bis[2-{3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoxy}-1,1-dimethylethyl]-2,4,8, 10-tetraoxaspiro[5.5]undecane, 2,2'-methylenebis(6-tributyl-4-methylphenol), 4,4'-butylbutylene (6-three) Grade butyl-3-methylphenol), 4,4'-thiobis(2-tert-butyl-5-methylphenol), 2,2'-thiobis(6-tertiarybutyl-4- Methylphenol), dilauryl 3,3'-thiodipropionate, dimyristyl 3,3'-thiodipropionate, distearyl 3,3'-thiodipropionate, new Pentaerythritol tetrakis(3-lauryl thiopropionate), 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazo Heterobenzene-2,4,6(1H,3H,5H)-trione, 3,3',3",5,5',5"-hexa-tertiary butyl-A1',a"-(three Toluene-2,4,6-triyl)tri-p-cresol, pentaerythritol tetrakis[3-(3,5-di-tri-tert-butyl-4-hydroxyl) Yl) propionate], 2,6-di - tert.butyl-4-methylphenol and the like.

The ultraviolet absorber is, for example, 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole, octyl-3-[3-tributyl-4-hydroxy-5-(5) -Chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-[4-[(2-hydroxy-3-dodecyloxy)oxy]-2-hydroxyphenyl -4,6-bis(2,4-dimethylphenyl-1,3,5-triazabenzene, 2-[4-[(2-hydroxy-3-(2'-ethyl)hexyl) )oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl-1,3,5-triazabenzene, 2,4-bis(2-hydroxy-4) -butyloxyphenyl)-6-(2,4-bis-butyloxyphenyl)-1,3,5-triazabenzene, 2-(2-hydroxy-4-[1-xin Oxycarbonylcarbonyl]phenyl)4,6-bis(4-phenylphenyl)-1,3,5-triazabenzene, 2-(2H-benzotriazol-2-yl)- 4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl) -4-(1,1,3,3-tetramethylbutyl)phenol, 2-(3-tert-butyl-2-hydroxy-5-methylphenyl)-5-chlorobenzotriazole or Alkoxydiphenyl ketone.

The light stabilizer is, for example, a polymer formed of succinic acid and (4-hydroxy-2,2,6,6-tetramethylpiperidin-1-yl)ethanol, N, N', N'', N' ''-Tetrakis(4,6-bis(butyl-(N-methyl-2,2,6,6-tetramethylpiperidin-4-yl)amino)triazaphenyl-2-yl) -4,7-diazadecane-1,10-diamine, azelaic acid, and bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl Ester, a reaction with 1,1-dimethylethyl hydroperoxide, bis(1,2,2,6,6-pentamethyl-4-piperidinyl)-[[3,5- Bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate, 2,4-bis[N-butyl-N-(1-cyclohexyloxy)- 2,2,6,6-tetramethylpiperidin-4-yl)amino]-6-(2-hydroxyethylamine)-1,3,5-triazabenzene, bis(1,2, 2,6,6-pentamethyl-4-piperidinyl) sebacate or methyl (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate.

The anti-agglomeration agent is, for example, sodium polyacrylate.

The chain transfer agent is, for example, dodecyl mercaptan, 2,4-diphenyl-4-methyl-1-pentane or the like.

The resin composition used in the present invention has a solid content of preferably 10 to 30% by mass, particularly preferably 12 to 28% by mass, more preferably 15 to 25% by mass. By setting this range, the reliability of the coating film can be improved. In various coating methods, even in the extrusion method, defects or the like are less likely to occur, and a flat cured film can be formed.

Further, when the resin composition used in the present invention is filled in a quartz cell having a light path length of 1 cm and a transmittance is measured using a spectrophotometer at a measurement wavelength of 400 to 700 nm, the average transmittance is generally 70. More than %, preferably more than 80%.

In the resin composition used in the present invention, when the cured film is formed, the average transmittance of the cured film is generally 90% or more, preferably 95% or more. The average transmittance is an average value when a cured film having a thickness of 3 μm after heat curing (for example, 100 to 250 ° C for 5 minutes to 3 hours) is measured using a spectrophotometer at a measurement wavelength of 400 to 700 nm. . Thereby, a cured film excellent in transparency in the visible light region can be provided.

The resin composition used in the present invention is applied to a substrate such as a substrate such as glass, metal or plastic, or a substrate on which a color filter, various insulating or conductive films, a driving circuit, or the like is formed, as will be described later. On top, a flat cured film can be formed. The cured film is usually composed by drying and hardening. Further, these cured films may be formed as a part of components of a display device or the like.

Next, a method of producing a cured film will be described.

First, the resin composition used in the present invention is applied to a substrate or a layer formed of a solid portion of a resin composition previously formed.

The coating method is not particularly limited, and for example, a spin coater, an extrusion and spin coater, or a squeeze coater (also referred to as a die coater, a curtain flow coater, and a non-rotating machine) can be used. In the case of a coater, application by an inkjet coater, a roll coater, a dip coater, or the like.

Among them, from the viewpoints of solubility, drying prevention, and prevention of foreign matter generation, it is preferred to apply according to the extrusion coating method, that is, to use an extrusion and spin coater, an extrusion coater, or the like.

Next, it is preferred to carry out drying or prebaking to remove volatile components such as a solvent. Thereby, a smooth uncured film can be obtained. It is especially suitable for drying under reduced pressure. The drying under reduced pressure here is carried out, for example, at a pressure of 50 to 150 Pa in a temperature range of 20 to 25 °C.

The film thickness of the uncured film at this time is not particularly limited, and can be appropriately adjusted by the material to be used, the use, and the like, and is, for example, 0.1 to 30 μm, preferably 1 to 20 μm, and more preferably 1 to 6 μm.

After drying, a cured film such as a flattened film can be obtained by post-baking. The post-baking is preferably, for example, a temperature range of from 150 to 230 ° C, for from 10 to 180 minutes.

In particular, the resin composition used in the present invention can be formed by applying a film on a substrate by using an extrusion coater, and drying the film formed on the substrate to obtain a flattened film or the like. Used for hardened film.

According to the present invention, it is possible to form a cured film which is capable of suppressing generation of defects or the like which are caused by solvent boiling, and which has excellent flatness as a whole.

Further, by using such a cured film, a high-quality display device can be obtained.

The cured film of the present invention can be suitably used, for example, as a transparent film, particularly a transparent film constituting a part of a color filter or an array substrate. Further, these transparent films can be used as a planarizing film, and can be applied to a color filter or an array substrate having a planarizing film or the like as a part of the constituent members, and a flattening film, a color filter, and/or A display device such as an array substrate, for example, a liquid crystal display device, an organic electroluminescence display device, or the like, and a display device having a high-quality flattening film or the like can be manufactured at a high yield.

Example

Hereinafter, the resin composition of the present invention will be described in more detail by way of examples, but the invention is not limited to the examples. In addition, in the following Examples and Comparative Examples, the % or the part of the content or the amount used is based on the mass unless otherwise specified.

Synthesis of Resin Aa

Nitrogen gas was flowed into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer at a flow rate of 0.02 L/min to form a nitrogen atmosphere, and 59 parts by mass of 3-methoxy-1-butanol and 3-methyl acetate were added. 81 parts by mass of oxybutyl ester was heated to 70 ° C while stirring.

Next, 40 parts by mass of methacrylic acid, and 3,4-epoxytricyclo[5.2.1.0 ^2,6 ]decyl acrylate (the compound represented by the formula (I-1) and the formula (II-1) The compound represented by the mixture of the molar ratio of 50:50 was added in an amount of 360 parts by mass, dissolved in 80 parts by mass of 3-methoxy-1-butanol and 110 parts by mass of 3-methoxybutyl acetate to prepare a solution. Using a drop-in pump, the solution was dropped into a flask kept at 70 ° C for 4 hours.

On the other hand, using other dropping pump, 2,2 as a polymerization initiator is dissolved in 101 parts by mass of 3-methoxy-1-butanol and 139 parts by mass of 3-methoxybutyl acetate. A solution of 36 parts by mass of '-azobis(2,4-dimethylvaleronitrile) was dropped into the flask over 5 hours. After completion of the dropwise addition of the polymerization initiator solution, the mixture was kept at 70 ° C for 4 hours, and then cooled to room temperature to obtain a solution of a copolymer (resin Aa) having a solid content of 42.5 mass% and an acid value of 56 mg-KOH/g. The obtained resin Aa had a weight average molecular weight (Mw) of 7.6 × 10 ³ and a degree of dispersion of 2.01.

Synthesis of Resin Ab

Nitrogen gas was flowed into a 1 L flask equipped with a reflux condenser, a dropping funnel, and a stirrer at a flow rate of 0.02 L/min to form a nitrogen atmosphere, and 56 parts by mass of 3-methoxy-1-butanol and 3-methyl acetate were added. 84 parts by mass of oxybutyl ester was heated to 70 ° C while stirring.

Next, 40 parts by mass of methacrylic acid, and 3,4-epoxytricyclo[5.2.1.0 ^2,6 ]decyl acrylate (the compound represented by the formula (I-1) and the formula (II-1) The compound represented by the mixture of the molar ratio of 50:50 was added in an amount of 360 parts by mass, dissolved in 76 parts by mass of 3-methoxy-1-butanol and 114 parts by mass of 3-methoxybutyl acetate to prepare a solution. Using a drop-in pump, the solution was dropped into a flask kept at 70 ° C for 4 hours.

On the other hand, using other dropping pump, 2,2 as a polymerization initiator is dissolved in 96 parts by mass of 3-methoxy-1-butanol and 144 parts by mass of 3-methoxybutyl acetate. A solution of 14 parts by mass of '-azobis(2,4-dimethylvaleronitrile) was dropped into the flask over 4 hours. After the completion of the dropwise addition of the polymerization initiator solution, the mixture was kept at 70 ° C for 4 hours, and then cooled to room temperature to obtain a copolymer having a solid content of 42.3 mass % and an acid value of 57 mg-KOH/g (in terms of solid content) (resin Ab) solution. The obtained resin Ab had a weight average molecular weight Mw of 1.9 × 10 ⁴ and a degree of dispersion of 2.65.

The weight average molecular weight (Mw) and the number average molecular weight (Mn) of the above resin were measured by the GPC method under the following conditions.

Device: K2479 (made by Shimadzu Corporation)

Column: SHIMADZU Shim-pack GPC-80M

Column temperature: 40 ° C

Solvent: THF (tetrahydrofuran)

Flow rate: 1.0mL/min

Detector: RI

The ratio of the weight average molecular weight and the number average molecular weight in terms of polystyrene obtained above was defined as the degree of dispersion (Mw/Mn).

Example 1

235 parts of the resin solution (A) containing the obtained resin Aa (100 parts in terms of solid content), 0.01% of Megafac F-489 (manufactured by DIC Corporation) of fluorine-based surfactant, and Irganox 3114 (Chiba Japan) 0.8 parts of the company and a solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol in a weight ratio of 10:45:45) The mixture was mixed to obtain a resin composition 1 having a solid content concentration of 19.3% by mass.

Example 2

235 parts of the resin solution (A) containing the obtained resin Aa (100 parts in terms of solid content), 0.05 parts of Megafac F-489 (manufactured by DIC Corporation), and 0.8 parts of Irganox 3114 (manufactured by Chiba Japan Co., Ltd.) and The solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol in a weight ratio of 10:45:45) is mixed to obtain a solid portion. Resin composition 2 having a concentration of 19.3% by mass.

Example 3

236 parts of the resin solution (A) containing the obtained resin Ab (100 parts in terms of solid content), 0.01 parts of Megafac F-489 (manufactured by DIC Corporation), and 0.8 parts of Irganox 3114 (manufactured by Chiba Japan Co., Ltd.) and The solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol in a weight ratio of 20:40:40) is mixed to obtain a solid portion. Resin composition 3 having a concentration of 19.3% by mass.

Example 4

236 parts of the resin solution (A) containing the resin Ab (100 parts in terms of solid content), 0.05 parts of Megafac F-489 (made by DIC Corporation), 0.8 parts of Irganox 3114 (manufactured by Chiba Japan Co., Ltd.), and solvent (two The mixture of glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol in a weight ratio of 10:45:45 was mixed to obtain a solid concentration of 19.3 mass. % of resin composition 4.

Example 5

236 parts of the resin solution (A) containing the obtained resin Ab (100 parts in terms of solid content), 0.05 parts of Megafac F-489 (manufactured by DIC Corporation), and 0.8 parts of Irganox 3114 (manufactured by Chiba Japan Co., Ltd.) and The solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol in a weight ratio of 20:40:40) is mixed to obtain a solid portion. Resin composition 5 having a concentration of 19.3% by mass.

Example 6

236 parts of a resin solution (A) containing the obtained resin Ab (100 parts in terms of solid content), SH8400 (manufactured by Dow Corning Toray Co., Ltd.) (B) of a polyoxyalkylene-based surfactant (0.05), and Irganox 3114 ( 0.8 parts by Chiba Japan Co., Ltd. and a mixture of solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol in a weight ratio of 10:45:45) The mixture was mixed to obtain a resin composition 6 having a solid content concentration of 19.3% by mass.

Example 7

236 parts of the resin solution (A) containing the obtained resin Ab (100 parts in terms of solid content), 0.05 parts of Megafac F-489 (manufactured by DIC Corporation), and SH8400 (manufactured by Dow Corning Toray Co., Ltd.) (B) 0.05 parts by weight of Irganox 3114 (manufactured by Chiba Japan Co., Ltd.) and solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol) The mixture of 45:45 was mixed to obtain a resin composition 7 having a solid content concentration of 19.3% by mass.

Example 8

235 parts of the resin solution (A) containing the obtained resin Aa (100 parts in terms of solid content), 0.01 parts of Megafac F-489 (manufactured by DIC Corporation), and 0.8 parts of Irganox 3114 (manufactured by Chiba Japan Co., Ltd.) and A solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate and 3-methoxy-1-butanol in a weight ratio of 1:49.5:49.5) is mixed to obtain a resin composition. Matter 8.

Example 9

235 parts of the resin solution (A) containing the obtained resin Aa (100 parts in terms of solid content), 0.01 parts of Megafac F-489 (manufactured by DIC Corporation), and 0.8 parts of Irganox 3114 (manufactured by Chiba Japan Co., Ltd.) and A solvent (diethylene glycol butyl ether acetate, a mixture of 3-methoxybutyl acetate and 3-methoxy-1-butanol in a weight ratio of 40:30:30) is mixed to obtain a resin composition. Matter 9.

Comparative example 1

235 parts of the resin solution (A) containing the resin Aa (100 parts in terms of solid content), 0.8 parts of Irganox 3114 (manufactured by Chiba Japan Co., Ltd.), and a solvent (diethylene glycol butyl ether acetate, 3-methoxybutyl acetate) The mixture of the ester and 3-methoxy-1-butanol in a weight ratio of 10:45:45 was mixed to obtain a resin composition 10 having a solid content concentration of 19.3% by mass.

The following evaluations were carried out for each of the resin compositions obtained in Examples 1 to 9 and Comparative Example 1.

<Bump boiling evaluation>

A 5 cm × 5 cm glass substrate (Eagle 2000, manufactured by Corning Co., Ltd.) was sequentially washed with a neutral detergent, water, and ethanol, followed by drying. The resin compositions of Examples 1 to 9 and Comparative Example 1 were applied onto the glass substrate under the conditions of 600 rpm and 10 seconds using a spin coater. Then, the pressure was reduced to 130 Pa by a vacuum dryer (manufactured by VCD Microtek Co., Ltd.) and dried. After cooling, the surface of the coating film was observed with a reflection type optical microscope. The result is shown in the second table.

When the sudden boiling is not generated, it is ○, and when the sudden boiling occurs, it is ×.

For the person who produces the bump, the step evaluation is suspended because a smooth convex film cannot be obtained.

<Step difference evaluation>

Evaluation substrate production

Each component was mixed in the ratio shown in the first table, and the colored resin composition 1 was obtained.

A 5 cm × 5 cm glass substrate (Eagle 2000, manufactured by Corning Co., Ltd.) was sequentially washed with a neutral detergent, water, and ethanol, followed by drying. The colored resin composition 1 was applied onto this glass substrate by a spin coating method. Then, prebaking was carried out in a clean oven at 90 ° C for 3 minutes. After cooling, the distance between the substrate coated with the colored resin composition 1 and the mask made of quartz glass was set to 100 μm, and an exposure machine (TME-150RSK; a light source manufactured by Topcon Corporation; an ultrahigh pressure mercury lamp) was used in the atmosphere. Light irradiation was performed under an exposure amount of 100 mJ/cm ² (365 nm basis). At this time, the irradiation of the colored resin composition was carried out by passing the radiation light from the ultrahigh pressure mercury lamp through an optical filter (UV-35; manufactured by Asahi Techno Glass Co., Ltd.). Further, in the reticle, a reticle having a pattern (a line pattern in which the light transmitting portion and the light shielding portion are each 100 μm, respectively) are formed on the same plane.

After the light irradiation, the coating film was immersed in an aqueous developing solution containing 0.12% of a nonionic surfactant and 0.04% of potassium hydroxide for 30 seconds at 23 ° C to carry out development, and after washing with water, in an oven. After post-baking for 20 minutes at 220 ° C, an evaluation substrate having a color line portion of 100 μm and a pitch portion of 100 μm was produced alternately. The film thickness of the colored resin composition was 1.36 μm.

The resin compositions of Examples 1 to 9 were applied to the evaluation substrate at 600 rpm and 10 seconds using a spin coater. Then, the pressure was reduced to 1.0 torr by a vacuum dryer (manufactured by Microtek Co., Ltd.), dried, and placed on a hot plate set at 95 ° C, and pre-baked on the top for 2 minutes to form a coating film. It was then heated at 230 ° C for 20 minutes to harden it. After cooling, a maximum thickness and a minimum film thickness were measured using a probe type film thickness meter (DEKTAK 6M manufactured by Veeco Co., Ltd.), and a step (=maximum film thickness - minimum film thickness) was calculated. The result is shown in the second table.

If the step is smaller than the film thickness of the underlayer, it is set to be good.

<Average transmittance of film>

Each of the resin compositions was used to produce a cured film by the following method so that the film thickness after curing was 3 μm. The resin composition was diluted with diethylene glycol n-butyl ether acetate so as to be 20% by mass of the solid content. The coating was applied by a spin coating method so that the film thickness after curing was 3 μm, and after prebaking at 100 ° C for 10 minutes, it was heat-cured at 220 ° C for 20 minutes.

For each of the obtained cured films, an average transmittance (%) of 400 to 700 nm was measured using a microscopic spectrophotometer (OSP-SP200; manufactured by OLYMPUS).

The higher the transmittance, the smaller the absorption.

In the second table, the content (%) of the surfactant is the content (%) relative to the solid content of the surfactant, and the content (% by mass) of diethylene glycol butyl ether acetate is the total amount relative to the solvent. The content (% by mass) of ethylene glycol butyl ether acetate.

Further, the average transmittance (%) is an average transmittance (%) in a wavelength range of 400 to 700 nm of a film thickness of 3 μm.

Industrial availability:

In the cured film of the present invention, the entire surface of the large-area surface is flat, and defects due to solvent boiling are hardly generated. Further, since it has a high transmittance, it can be preferably used for a flattening film used in a display device such as a coating layer for coating a protective film, an insulating film, or a colored pattern.

Claims (7)

A cured film obtained from a resin composition containing a resin (A), a surfactant (B), and an organic solvent (C), wherein the resin (A) is at least aliphatically unsaturated a carboxylic acid and/or an aliphatic unsaturated carboxylic anhydride (A1) and at least one selected from the group consisting of an aliphatic epoxy group, an alicyclic epoxy group, an oxirane group, and a tetrahydrofuran group a copolymer obtained by polymerizing a monomer (A2), wherein the surfactant (B) is a surfactant containing at least one atom selected from the group consisting of a ruthenium atom and a fluorine atom, and the surfactant ( The content of B) is 0.005 mass% to 0.5 mass% with respect to the solid content, and the content of the polymerizable monomer and the coloring agent is less than 1% by mass for the entire composition. The cured film of claim 1, wherein the monomer (A2) is a monomer having an oxirane group. The cured film of claim 1, wherein the monomer (A2) is a monomer having an aliphatic polycyclic epoxy group. The cured film according to claim 1, wherein the monomer (A2) is at least one compound selected from the group consisting of a compound represented by the formula (I) and a compound represented by the formula (II). ; [In the formulae (I) and (II), R ₁ and R ₂ each independently represent a hydrogen atom or a hydroxyl group having 1 to 4 carbon atoms which may be substituted; and X ₁ and X ₂ each independently represent a single bond, The alkyl group having 1 to 6 carbon atoms or -(CH ₂ ) _s -X'-(CH ₂ ) _t -, X' represents -S-, -O- or -NH-, and s and t each independently represent 0. An integer of ~6, but s+t=6]. The cured film according to claim 1, wherein the organic solvent (C) is a solvent containing diethylene glycol butyl ether acetate. The cured film of the fifth aspect of the invention, wherein the organic solvent (C) is a solvent having a content of from 1 to 40% by mass based on the total amount of the diethylene glycol butyl ether acetate. A display device comprising the cured film according to any one of claims 1 to 6.