TWI517746B - Electroluminescent device - Google Patents

Description

Electroluminescent device

The present invention relates to an electroluminescent device comprising a system having a substrate electrode on top of a substrate and at least one subsequent layer stack, the at least one subsequent layer stack comprising a counter electrode and having at least one organic One of the electroluminescent layer stacks, wherein the electroluminescent layer stack is disposed between the substrate electrode and the counter electrode. To improve the current distribution on the substrate electrode, at least one electrical shunt member is applied to the top of the substrate electrode. Furthermore, the present invention is directed to a method for shunting a substrate electrode of an electroluminescent device by an electrical branching member.

An organic light emitting diode (OLED) is described in WO 2007/013 001 A2. The organic light-emitting diode consists of a thin layer of one of about 100 nm of organic material sandwiched between two electrodes. The electrode layers typically have a thickness approximately equal to the thickness of the organic material. When a voltage is applied between the two electrodes (typically between 2 volts and 10 volts), the organic species emit light. Unfortunately, due to their small thickness, the resistance of these electrodes is high, so it is difficult to achieve a homogeneous distribution of voltage on the electrode region. To eliminate this drawback, a conductive post is applied to the counter electrode of the OLED. However, the counter electrode is made of a reflective metal that has a low resistance and therefore only results in a small voltage drop across one of the counter electrode regions. The current distribution of this OLED is primarily determined by the nature of the transparent substrate electrode that has not been modified by such columns. The conductive posts are attached to one of the encapsulating members that encapsulate the layer stack formed by the electrodes and the electroluminescent layer. Unfortunately, the organic layer and the counter electrode are very sensitive. Therefore, connecting the conductive posts to the counter electrodes often results in an electrical short. For example, such shorts can occur due to localized destruction of the soft organic layer such that the counter electrode is in direct contact with the substrate electrode.

One other organic light emitting diode (OLED) is described in WO 2009/001241 A1. The electroluminescent device comprises a substrate having a substrate electrode and a plurality of electrically spaced apart electrical branching members, each electrical branching member being in direct electrical contact with the substrate electrode, wherein an electroluminescent layer stack is provided on the substrate electrode And a top of the shunt line, and a counter electrode is disposed on top of the electroluminescent layer stack. The electrical shunt members are provided in direct electrical contact with the substrate layer such that the voltage distribution across the substrate layer during the operation of the electroluminescent device is relatively homogeneous. The resulting topology of a flat substrate electrode having a partial partial line on the top deviates from a flat topology, thereby dissipating the effectiveness of the subsequent layers of the substrate electrode due to shunting circuitry, ultimately resulting in a short circuit that destroys the OLED device. Furthermore, the application of material deposition techniques or material printing techniques to fabricate electrical shunt components on the surface of the substrate electrodes is substantially laborious and expensive.

Therefore, the present invention has to eliminate the above disadvantages for its purpose. In particular, it is an object of the present invention to provide an electroluminescent device that reveals improved application of one of the electrical shunt members electrically connected to the substrate electrodes, resulting in a more reliable and less expensive electroluminescent device.

The object is achieved by an electroluminescent device comprising: a layer system having a substrate electrode on a top of the substrate and at least one subsequent layer stack, the at least one subsequent layer stack comprising a counter electrode and An electroluminescent layer stack having at least one organic electroluminescent layer, wherein the electroluminescent layer stack is disposed between the substrate electrode and the counter electrode; and at least one electrical branching member applied to the top of the substrate electrode To improve the current distribution on the substrate electrode, the electroluminescent device is characterized in that the electrical branching member is applied to the substrate electrode via at least one electrical connection member, and the electrical connection member and the branching member are disposed in the Subsequent layers are stacked outside.

Advantageous embodiments of the electroluminescent device are defined in the scope of the appended claims.

The present invention discloses at least one electrical shunt member that is applied to the substrate electrode via at least one electrical connection member, and the electrical connection member and the shunt member are disposed outside of the subsequent layer stack.

The primary idea of the present invention is to apply an electrical connection member and an electrical branching member to the outside of the subsequent layer stack (i.e., the organic electroluminescent layer and the counter electrode) to maintain a flat topology of the layers. According to the invention, the electrical connection member and the electrical branching member are implemented as a single conductive element applied to the substrate electrode and disposed outside the subsequent layer stack. Basically, the electrical branching member can form an electrical connection between a power source and a connection point on the top of the substrate electrode. In particular, the electrical branching member is preferably disposed between two electrical connecting members disposed in the emission field and a boundary region of the electroluminescent device, and the boundary region of the substrate electrode The voltage is equal. Thus, the use of a single conductive element to connect the boundary region of the substrate electrode to the electrical connection member within the emission region of the device results in a more homogeneous voltage distribution across one of the substrate electrodes. Therefore, the intensity of the emitted light is also more homogeneous than in the absence of the shunt member.

In the context of the present invention, a conceptual electroluminescent (EL) layer stack represents all layers prepared between a substrate electrode and a counter electrode. In one embodiment of the EL layer stack, it includes at least one luminescent organic electroluminescent layer prepared between the substrate electrode and the counter electrode. In other embodiments, the layer stacks can include a plurality of layers prepared between the substrate and the counter electrode. The plurality of layers may be organic layers, such as one or more hole transport layers, electron blocking layers, electron transport layers, hole blocking layers, emissive layers, or a combination of organic and non-organic layers. The non-organic layers may be additional electrodes in the case of two or more luminescent layers and/or charge injection layers within the layer stack. In a preferred embodiment, the substrate electrode and/or the counter electrode comprise at least one of the following materials: ITO, aluminum, silver, doped ZnO, oxide layer.

In the context of the present invention, the conceptual substrate material represents a substrate material to which different layers of the electroluminescent device are deposited. Typically, the substrate is transparent and made of glass. Furthermore, the substrate may be transparent, preferably comprising at least one of the following materials: silver, gold, glass or ceramic. It may also be made of a transparent polymer sheet or foil having a moisture and oxygen barrier to substantially prevent moisture and/or oxygen from entering the electroluminescent device layer stack. A non-transparent material like a metal foil can also be used as the substrate. The substrate can include other layers, for example, for optical purposes similar to light output coupling enhancement or for other purposes. The substrate is generally flat, but it can also be formed into any desired three-dimensional shape.

In the context of the present invention, a conceptual substrate electrode means one of the electrodes deposited on top of the substrate. Typically, it consists of transparent ITO (indium tin oxide) which optionally has a SiO ₂ or SiO undercoat to inhibit diffusion of mobile atoms or ions from the glass into the electrode. For a glass substrate having one of the ITO electrodes, the ITO is usually an anode, but it can also be used as a cathode in special cases. In some cases, a thin Ag or Au layer (8 to 15 nm thick) is used as the substrate electrode, either alone or in combination with ITO. If a metal foil is used as the substrate, it also functions as a substrate electrode, an anode or a cathode. The notation indicates the sequence of the listed layers on top of. This notation explicitly includes the possibility of representing other layers in the middle of the layer as being on top of each other. For example, an additional optical layer useful to enhance light output coupling can be disposed between the substrate electrode and the substrate.

In the context of the present invention, the conceptual counter electrode means one of the electrodes remote from the substrate. It is typically non-transparent and is made of a layer of Al or Ag of sufficient thickness to render the electrode system reflective (typically 100 nm for Al and 100 to 200 nm for Ag). It is usually a cathode, but it can also be biased as an anode. For top emission or transparent electroluminescent devices, the counter electrode must be transparent. The transparent counter electrode is made of a thin Ag or Al layer (5 to 15 nm) deposited on top of other previously deposited layers or from an ITO layer.

In the context of the present invention, an electroluminescent device having a combination of a transparent substrate, a transparent substrate electrode and a non-transparent counter electrode (usually reflective) to emit light through the substrate is referred to as "bottom emission." In the case of an electroluminescent device comprising one of the other electrodes, in some embodiments, when the internal electrode is driven as a cathode or anode, both the substrate and the counter electrode can be two anodes or two cathodes. Furthermore, in the context of the present invention, an electroluminescent device having a combination of a non-transparent substrate electrode and a transparent counter electrode for transmitting light through the counter electrode is referred to as "top emission".

In the context of the present invention, a conceptually transparent electroluminescent device means an electroluminescent device in which the substrate, substrate electrode, counter electrode and encapsulating member are transparent. Here, the electroluminescent device is both a bottom emission and a top emission. In the context of the present invention, a layer (a substrate or an electrode) is referred to as transparent if the transmission of light in the visible range is more than 50% and the remainder is absorbed or reflected. Moreover, in the context of the present invention, a layer (a substrate or an electrode) is referred to as translucent if the transmission of light in the visible range is between 10% and 50% and the remainder is absorbed or reflected. Further, in the context of the present invention, when light has a wavelength between 450 nm and 650 nm, it is called visible light. In the context of the present invention, when the light system is emitted by the organic electroluminescent layer of the electroluminescent device, it is referred to as artificial light.

Furthermore, in the context of the present invention, if a layer (connector or construction element) of an electroluminescent device has a resistance of less than 100,000 ohms, it is said to be electrically conductive. In the context of the present invention, passive electronic components include resistors, capacitors, and inductivity. Moreover, in the context of the present invention, active electronic components include diodes, transistors, and all types of integrated circuits.

In the context of the present invention, if light incident on the interface of a layer (a substrate, an electrode or a structural element) of an electroluminescent device is returned according to the law of reflection (the macroscopic incident angle is equal to the macroscopic reflection angle), then the electricity This layer (substrate, electrode or structural element) of the electroluminescent device is referred to as reflective. The term specular reflection is also used in this case. Moreover, in the context of the present invention, if light incident on a layer, a substrate, an electrode or a structural element of an electroluminescent device is not returned according to the law of reflection (the macroscopic incident angle is not equal to the macroscopic angle of the returning light), This layer (substrate, electrode or structural element) of the electroluminescent device is then referred to as scattering. There is also an angular distribution of the return light. The term diffuse reflection is also used instead of scattering.

Advantageously, the subsequent layer stack includes an open area to feed the shunt member in such a manner as to surround the electrical connection member by the subsequent layer stack. In order to avoid a short circuit between the substrate electrode and the counter electrode, a distance is required between the electrical connection member on the top of the substrate electrode and the counter electrode and the organic electroluminescent layer. The open areas may be formed as circles in subsequent stacks of layers to surround the electrical connection members. Further, the electrical branching member in the form of a wire, a metal strip or a foil may pass through the organic electroluminescent layer and the counter electrode. The connecting member simultaneously acts as a mechanical stabilizer for the undesired movement of the applied shunt member to prevent a short between the shunt member and the counter electrode. Arranging the electrical connection member and the shunt member outside of the subsequent layer stack means that the configuration is performed on the far side of the substrate electrode associated with the subsequent layer stack (ie, on the back side of the OLED rather than within the layers), However, the shunt is still formed to electrically connect one of the substrate electrodes.

In accordance with yet another advantageous embodiment of the present invention, the electrical connection member includes a conductive paste for electrically contacting the shunt member to the substrate electrode. The conductive paste forming the electrical connection member includes a substrate and a filler, and the conductive paste includes an organic material as a matrix and an inorganic material as a filler. In one embodiment, the conductive paste can include at least one of the following substrates: epoxy, polyurethane, or polyoxyxide. The filler and/or the substrate must be electrically conductive to conduct current from the power source to the counter electrode.

Therefore, the conductive paste and/or the filler include conductive sheets or particles. These filler particles must have low electrical resistance, stability and durability. Therefore, the filler comprises at least one of the following sheets or particles: silver, gold, nickel, platinum, copper, palladium or other metals or similar carbon, glassy carbon, graphite, carbon nanotubes, doped ZnO, SnO, conductive nitride, other non-metal of conductive boride, metal-coated glass or plastic beads, metal-coated glass or plastic hollow beads or metal or graphite particles covered with copper, gold or silver.

In a preferred embodiment, the conductive paste is anhydrous and/or non-aqueous. In the context of the present invention, the concept of no water and/or no water clarifies the fact that degradation due to moisture content during the average lifetime of an electroluminescent device is not observable by the naked eye. One of the organic electroluminescent layers that is diffused into the layer stack can be visually degraded to exhibit a growth black spot or a form in which the emitter region shrinks from the edge. The concept that no water and/or water is not only depends on the conductive glue itself but also on the amount of moisture that can be absorbed by the organic electroluminescent layer without damaging it.

In a further preferred embodiment, the electroluminescent device can include a moisture and/or oxygen barrier. In the context of the present invention, a layer that prevents moisture and/or oxygen from diffusing into the layer stack is referred to as a moisture and/or oxygen barrier. If one of the emitted light is observed to have a significant decrease in lifetime, then a diffusion is indicated as detrimental. A shelf life of approximately 100,000 hours or more is achieved according to standard OLED devices of the current state of the art. A significant reduction represents a life reduction of about one-half or more.

In a preferred embodiment, the electrical connection member is embedded in a non-conductive protective member applied to one of the substrate electrodes, and the protective member preferably includes a non-conductive adhesive. When an electrical connection member is embedded in a non-conductive protective member, an electrical short circuit is prevented from occurring. When the electrical connection member includes a conductive paste and the protective member includes a non-conductive paste, different glue layers are applied to each other.

The substrate electrode can be characterized by a contact area disposed in a boundary region of the electroluminescent device. Therefore, an electrical connection member can be applied to the substrate electrode in the contact area. The contact region can include an additional electrically conductive material to increase the conductivity of the substrate electrode in the contact region. Furthermore, the electrical connection of the substrate electrode to an external power source can be performed via the contact area. When the contact region is configured to surround the illumination field of the electroluminescent device, the voltage at the periphery of the substrate electrode is uniform. When the electrical branching member includes an electrical interconnection between the light-emitting region and the plurality of contact posts in the contact region, that is, when the connecting member is applied to the additionally applied conductive material, the voltage distribution across the entire light-emitting field is evenly distributed. Much more.

In a preferred embodiment, the electrical branching member comprises a metal wire, a metal strip or a metal foil, preferably of copper, gold and/or silver, a deposited conductive material or a printed circuit board. production. The copper forming the electrical shunt member can be selected within the common copper-based alloys known to those skilled in the art for electrical conductors. When the conductive elements are manufactured by die cutting, an inexpensive mass production technique can be used to form the branching members. Specifically, when the branching members are configured in a grid form, the entire grid can be This is done by only a few die strokes or, in particular, only one die stroke.

In a preferred embodiment, the electroluminescent device can include at least one contact member for electrically contacting the counter electrode to a power source, and the contact member is preferably implemented as a conductive paste applied to the counter electrode, and Further, a protective member is preferably disposed on the substrate electrode, wherein the protective member is a non-conductive paste and at least completely covers a region under the contact member.

The conductive paste is soft in its original state, so it can be applied to the counter electrode without applying a local high pressure to the counter electrode. Therefore, there is no risk of a short circuit occurring between the counter electrode and the substrate electrode during application of the glue. This results in the advantage of providing a three-dimensional contact mode with a minimum risk of short circuit.

Typically, the conductive paste consists of an organic glue having a conductive filler in the form of a conductive sheet or particle. During gelation of the glue, the glue may exhibit some shrinkage, and this results in forcing certain filler particles into the underlying layer, thereby creating a short between the substrate electrode and the counter electrode. To prevent this, it is advantageous to use a rubber having a small shrinkage and a relatively high elasticity (e.g., polyfluorene) and/or making the counter electrode thicker.

One other advantage achieved by the use of a conductive paste as a contact member is the use of a substrate having only one continuous electrode, which serves as one of the substrate electrodes of the electroluminescent device. In conventional OLEDs, the electrodes on the substrate are at least structured into two regions of electrical separation: one acts as a substrate electrode and the other is connected to the counter electrode. Thus, both the substrate and the counter electrode are directed to the edge of the substrate in one plane, which can be contacted at the edge by standard members. The disadvantage of this two-dimensional contact mode is that the substrate electrode and the counter electrode must share the periphery of the OLED to contact, so the electrode on the substrate needs to be divided into at least two separate regions (the substrate electrode and the second electrode to be in contact with the counter electrode) To avoid shorting the device. The disclosed 3-dimensional contact eliminates this serious drawback of 2-dimensional contact.

The configuration in which the non-conductive protective member at least completely covers the area under the contact member results in the advantage of avoiding a short circuit between the substrate electrode and the counter electrode during hardening of the glue.

If it is not desired to limit the type of glue, and if the counter electrode cannot be made thicker, the non-conductive protective member is applied to the substrate electrode to prevent a possible short circuit due to the conductive paste. The use of at least one protective member renders the electroluminescent device completely insensitive to the specific properties of the conductive paste. Therefore, all conventional conductive adhesives can be used to contact the counter electrode to a power source. The protective member must cover the entire area in which the contact member is applied to the counter electrode, which may therefore be a short circuit source, but it may also be larger than the contact member region. In order to prevent a direct contact between the counter electrode and the substrate electrode, the protective member has a thickness and/or a hardness which ensures that the contact member is not in electrical contact with the substrate electrode. To achieve this goal, the protective member may comprise a non-conductive glue and/or a photoresist and/or a lacquer and/or a coating and/or a glass layer made of a remelted glass frit. The protective member may also comprise an oxidized metal layer similar to one of anodized aluminum. Other non-conductive materials within the scope of the present invention may be selected by those skilled in the art.

The protective member must have the property of ensuring that it is not electrically conductive on the one hand. In addition, it must be sufficiently thick and/or hard to shield the substrate electrodes from contact members. The exact thickness and hardness depend on the actual pressure applied by the contact member, but typically a thickness of 1 to 100 microns is sufficient. The desired protection has been achieved with a 1.5 micron thick photoresist layer and with a 10 to 200 micron thick non-conductive adhesive layer, but thicker layers can also be used. In addition, it is necessary to ensure that the protective member does not damage the substrate electrode, the organic electroluminescent layer, and does not damage the counter electrode. In a preferred embodiment, the protective member comprises a non-conductive glue. Further, the non-conductive glue of the protective member is preferably anhydrous and/or non-aqueous. Further, the non-conductive glue of the protective member is preferably anhydrous and/or non-aqueous.

Advantageously, the electroluminescent device comprises an encapsulation member configured to encapsulate at least the electroluminescent layer stack, and the electrical contact member is preferably disposed between the encapsulation member and the counter electrode for use The counter electrode is electrically contacted to the encapsulation member. The encapsulating member may also encapsulate the entire layer stack of the electroluminescent device or only enclose a plurality of layers forming part of the entire layer stack. Preferably, the encapsulating member is provided to cover at least one of the organic electroluminescent layer and the counter electrode. By using a hermetic encapsulating member, environmental factors such as moisture or oxygen are prevented from damaging the encapsulated layer. The encapsulation member can form an airtight cover. This cover may be formed of glass or metal. The encapsulating member may also be formed from one or more layers supplied to the electroluminescent device or only a portion thereof. The layers may include tantalum, niobium oxide, tantalum nitride, aluminum oxide or hafnium oxynitride. All of the specified encapsulating members prevent mechanical and/or environmental factors from adversely affecting the layer stack of the electroluminescent device. As an example, the encapsulating member can be made of metal, glass, ceramic, or a combination of such materials. It is attached to the substrate by conductive or non-conductive glue, molten frit or metal solder. Thus, the electroluminescent device can also be provided with mechanical stability while at least a portion of the glue applied between the layers and the encapsulating member is electrically conductive for contacting the counter electrode.

According to another preferred embodiment, the encapsulation member includes an encapsulation member top and an encapsulation member side that electrically insulates the contact member from the substrate electrode, and preferably the counter electrode is passed to the contact member Electrical contact of the encapsulating member is provided to the top of the at least partially electrically conductive encapsulating member. A cover is formed on the top of the encapsulation member, and the side of the encapsulation member surrounds the layer system of the electroluminescent device. The encapsulating member side can be electrically connected to the substrate electrode, and the top of the encapsulating member forms an electrical interconnection by the electrical contact member. Thus, the insulating member forms an electrical insulation between the top of the encapsulating member and the side of the encapsulating member. In order to connect the electroluminescent device to a power source, a current must be applied to the top and sides of the encapsulating member to operate the electroluminescent device.

To ensure accurate operation of the electroluminescent device, the electrodes must be insulated from each other. When at least one electrode is supplied with electrical power via at least a portion of the encapsulating member, for example, by a contact member between the top of the encapsulating member and the counter electrode, the remaining portion of the encapsulating member must be insulated from the other electrode. When the top of the encapsulation member is in electrical contact with the counter electrode, the encapsulation member side must be insulated from the substrate electrode, for example by an insulating rim. When the side of the encapsulating member is electrically conductive, the top of the encapsulating member may be characterized by an insulating material or at least one locally configured feedthrough line such that a conductive element passes through the top of the encapsulating structure, the conductive element contacting Counter electrode. In the case where the encapsulation member side is electrically interconnected to the substrate electrode and the counter electrode is electrically contacted to the top of the encapsulation member, the encapsulation member may include an insulating member between the top and the side of the encapsulation member.

In one embodiment, the encapsulation member side is disposed on the substrate electrode by a bonding member, and the bonding member includes a conductive paste. Therefore, the side of the encapsulation member may include one of electrically conductive materials having high conductivity, and the contact region of the substrate electrode formed by the bonding member along the substrate electrode has a uniform voltage.

By arranging the encapsulating member over the surface of the substrate electrode, different contact possibilities of the shunt member are given. As just one example, a shunt member may be disposed between one of the electrical connection members and the engagement member in the illumination region of the electroluminescent device to bond the encapsulation member side to the substrate electrode. In this case, the joining member realizes the function of one of the electrical connection members in the boundary region of the electroluminescent device.

In accordance with yet another embodiment, at least one electrical branching member is disposed between the electrical connection member and the encapsulation member to extend to at least a portion of the electrically conductive inner surface of the encapsulation member for inductive contact via an inner surface of the encapsulation member The substrate electrode, preferably the shunt member, has a spike form and more preferably the shunt member is attached to the encapsulation member. The shunt member can be in the form of a spike or a needle that preferably extends substantially perpendicular to the inner surface of the top of the encapsulation member toward the electrical connection member for electrical contact with the substrate electrode. When the shunt member has a spike or a needle form, the shunt member can penetrate into an electrical connection member that can be composed of a conductive paste. With this configuration, it is possible to realize an easy contact method of one or preferably a plurality of connecting members in the form of liquid conductive glue on the surface of the substrate electrode. When the branching member is disposed in the encapsulating member, the plurality of branching members may be penetrated to the plurality of dedicated conductive adhesives at the dedicated column when the encapsulating member is applied to the back side of the electroluminescent device Drop in.

When the top of the encapsulating member (hereinafter referred to as a cover) is electrically conductive or characterized by a conductive member (eg, aluminum wire) by means of an applied conductive member (eg, aluminum wire) in the inner surface, the entire cover may be spanned or at least spanned The main portion of the cover (preferably except for the feedthrough line for contacting the counter electrode) performs an electrical shunt. The cover can be electrically connected to the substrate electrode in the circumference, for example by means of a conductive paste applied to the circumference of the substrate electrode. The conductive member can be connected to the substrate electrode in discrete spots, for example, by a conductive glue disposed between the conductive member and the substrate electrode. The droplets can then be placed in the open area of the subsequent layer stack.

Within the scope of the protection according to the invention, the branching member can be arranged in an encapsulation chamber which is formed by the encapsulation member and which is defined by the inner region of the encapsulation member and the layer system of the electroluminescent device. This means that the branching member and the connecting member are completely disposed within the cavity formed by the encapsulating member. In particular, the shunt member and the connecting member are disposed between the shunt member and the subsequent layer stack. The spacing between the counter electrode and the top of the encapsulating member must be disposed in the gap in the form of a wire, a metal foil, a metal strip or a doped conductive material or an electrical branching member in the form of a printed circuit board. One way to size it.

Advantageously, the electrically conductive paste forming the electrical connection member and/or the protective member comprises at least one scattering member for scattering at least light generated by the organic electroluminescent layer. Looking at the material used to protect the member, experiments have shown that the area to which the protective member is applied may appear dark during normal operation of the electroluminescent device by blocking direct current injection from the counter electrode to the substrate electrode. Accordingly, another preferred embodiment is characterized in that the protective member comprises at least one scattering member for scattering light generated by the organic electroluminescent layer, preferably the scattering member is embedded in the protective member. The scattering member scatters and/or reflects portions of the artificial light directed by the substrate. This causes one of the originally non-emissive areas to illuminate. Since the substrate is typically used as a light guide, the scattering member of the protective member enables this light to be scattered and reflected from the electroluminescent device. The scattering member may be formed of a plurality of pigments and/or sheets embedded in the protective member. For example, such pigments and/or flakes may comprise: aluminum, mica effect pigments, titanium dioxide particles or other flakes or particles known to those skilled in the art to scatter and/or reflect artificial light of organic electroluminescent devices.

In another preferred embodiment, the protective member is dyed. This can be done by coloring the protective member itself or by applying a color pigment to the protective member.

The present invention also relates to a method for electrically shunting a substrate electrode of an electroluminescent device, the electroluminescent device comprising a system having a substrate electrode on a top of a substrate and at least one subsequent layer stack, The at least one subsequent layer stack includes a counter electrode and an electroluminescent layer stack having at least one organic electroluminescent layer, wherein the electroluminescent layer stack is disposed between the substrate electrode and the counter electrode, and the method further comprises At least the following steps: depositing the subsequent layer stack on top of the substrate electrode; applying at least one electrical branching member to the substrate electrode via at least one connecting member outside the subsequent layer stack; and arranging the branching member in the subsequent layer Stack the outside. In one embodiment, the method further includes the steps of: applying at least one other electrical connection member of the feature conductive paste to the substrate electrode; and subsequently disposing the shunt member between the at least two electrical connection members. The improved application of the layer disposed on top of the substrate electrode achieves the advantages of the method. The deposition of the layers is not disturbed by the shunt members, which are disposed directly on top of the substrate electrode and which will result in an uneven topology. Thus, the shunt member and the electrical connection member do not cause edge and shadow effects in the surface to which the layers are applied. The layering used to fabricate the electroluminescent device can be completed prior to performing the shunt. Applying the shunt member to the outside of the subsequent layer stack means that the shunt member is disposed on the subsequent layer stack with respect to the back surface of the substrate.

The features and details set forth for the electroluminescent device also apply to the method and vice versa. The foregoing electroluminescent devices and/or methods, as well as the claimed components, and the components to be used in the illustrated embodiments in accordance with the present invention are not subject to any particular exception in terms of size, shape, material selection. In the unrestricted case, the technical concept of the selection criteria known in the related art can be applied. Additional details, features, and advantages of the present invention are disclosed in the following description of the claims and the accompanying drawings, which are merely by way of example, showing a plurality of preferred embodiments of the electroluminescent device in accordance with the present invention. example.

In Fig. 1, an electroluminescent device 10 in accordance with an embodiment of the present invention is shown. The electroluminescent device 10 includes a substrate electrode 20, a counter electrode 30, and an organic electroluminescent layer 50 (representing an electroluminescent layer stack in this and the following examples). The organic electroluminescent layer 50 is disposed between the substrate electrode 20 and the counter electrode to form a stack. This layer is stacked on the substrate 40 to form a carrier material for the electroluminescent device 10. In the illustrated embodiment, substrate electrode 20 is formed from an approximately 100 nm thick layer of ITO, which is a transparent and electrically conductive material. The organic electroluminescent layer 50 is deposited onto the substrate electrode 20. If a voltage is applied between the substrate electrode 20 and the counter electrode 30, some of the organic molecules in the organic molecules in the organic electroluminescent layer 50 are excited, resulting in the emission of artificial light emitted by the electroluminescent layer 50. The counter electrode 30 is formed of an aluminum layer to serve as a mirror and reflects the artificial light through the substrate electrode 20 and the substrate 40. In order to emit light into the surrounding environment, the substrate 40 in this embodiment is made of glass. Therefore, the electroluminescent device 10 is a bottom emitting OLED. The electroluminescent device 10 shown in the following figures, as well as the components thereof and the components used in accordance with the present invention, are not shown in true scale. In particular, the thicknesses of the electrode electrodes 20, 30, the organic electroluminescent layer 50, and the substrate 40 are not drawn in true scale. All figures are only intended to illustrate the invention.

As shown in FIG. 1, the counter electrode 30 is contacted by a connecting member 93 and the substrate electrode 20 is contacted by a connecting member 93' to supply power to the electroluminescent device 10 by applying a voltage between the connecting members 93 and 93'. To homogenize the voltage across the entire emission field of the electroluminescent device 10, an electrical shunt member 122 is disposed on top of the substrate electrode 20. The electrical shunt member 122 is disposed between the at least two electrical connection members 120. At least one of the electrical connection members 120 is disposed on a boundary region of the substrate electrode 20 while at least the next electrical connection member 120 is disposed within the emission field of the electroluminescent device 10 (eg, at the center of the electroluminescent device 10) . This shunting of the substrate electrode 20 causes homogenization of one of the voltages across the substrate electrode 20 even if the substrate electrode 20 has a high specific resistance.

In order to dispose the at least one electrical connection member 120 to the substrate electrode 20, the layer system including at least the organic electroluminescent layer 50 and the counter electrode 30 is characterized by an open region 140. This open region 140 enables the electrical shunt member 122 to bypass the organic electroluminescent layer 50 and the counter electrode 30, also referred to herein as a subsequent layer stack. Further, the electrical connection member 120 is spaced apart from the counter electrode 30 in the lateral direction to prevent a short circuit from occurring. Basically, the electrical connection member 120 can be characterized as a conductive paste and the glue is applied to the substrate electrode 20 in the form of, for example, a liquid glue. When the open regions 140 in the organic electroluminescent layer 50 and the counter electrode 30 are performed, only liquid droplets must be positioned within the open region 140 for electrically contacting the electrical shunt member 122.

FIG. 2 shows another embodiment of an electroluminescent device 10 that includes two electrical shunt members 122. The two branching members 122 extend from one of the boundary regions of the electroluminescent device 10 (the outer region forming the emission field or at least the region beside the emission field) to an inner region of the electroluminescent device 10, and the substrate electrode 20 Each electrical contact in the boundary region of the illuminating field and in the inner region includes an electrical connection member 120. Each of the electrical connection members 120 within the illumination region of the electroluminescent device 10 is positioned within a dedicated open area 140. As shown, the electrical shunt member 122 is directed to the outside of the stack of subsequent layers including at least the counter electrode 30 and the organic electroluminescent layer 50. Accordingly, the electrical shunt member 122 includes a single conductive element that is implemented as an electrical jumper that connects at least two of the posts on the top of the substrate electrode 20.

To secure the electrical shunt member 122, a layer system including the open region 140 can be completed on top of the substrate 40. In a subsequent step of the method for electrically shunting the substrate electrode 20, the electrical branching member 122 is applied to the substrate electrode 20 via a connecting member 120 that may be formed of a droplet of a conductive paste. As a result, the electrical shunt member 122 can be implemented as a simple conductive element outside the layer system and at least the delamination of the organic electroluminescent layer 50 and the counter electrode 30 is not directly applied to the surface of the substrate electrode 20 according to the prior art. The interference of the shunt member 122.

As shown in FIG. 3a, the organic electroluminescent layer 50 and the counter electrode 30 are encapsulated by an encapsulation member 90. The encapsulation member 90 includes a lid-like shape on the back side of the cover system. The encapsulation member 90 must be airtight to prevent environmental atmosphere damage to the organic electroluminescent layer 50 or both of the electrodes 20 and 30 encapsulated within the encapsulation member 90. Additionally, the illustrated electroluminescent device 10 can include an absorbent 170 disposed within the encapsulation member 90. This absorbent 170 serves to absorb moisture or other damaging gases that tend to diffuse into one of the protected regions (i.e., within the encapsulation chamber 99) within the encapsulation member 90. Therefore, the branching member 122 and the connecting member 120 are completely disposed within the cavity 99. The absorbent 170 can include CaO or a zeolite. Other materials known to those skilled in the art to form an absorbent 170 are known.

As shown, a contact region 21 is applied on top of the substrate electrode 20, the contact region being characterized by a highly conductive material. This additionally applied conductive material 22 results in a conductive frame surrounding one of the illumination fields of the electroluminescent device 10. Thus, the contact area 21 causes the voltage to be homogenized across one of the boundary edges of the electroluminescent device 10. As shown, the outer electrical connection member 120 is positioned over the top of the contact area 21 within the encapsulation chamber 99. The electrical branching member 122 is disposed between the electrical connection member 120 of one of the centers of the illumination fields of the electroluminescent device 10 and the electrical connection member 120 on the top of the contact region 21. Therefore, the electrical connection member 120 induces a potential at the center of the electroluminescent device 10 that is the same as the voltage of the contact region 21 in the boundary edge of the electroluminescent device 10. Furthermore, the contact region 21 is adapted to form an improved current path from the outer side of the encapsulation member 90 to the encapsulation chamber 99 for contacting the electrical shunt member 122 by the electrical connection member 120.

Additionally, a contact member 60 is configured for electrically contacting the counter electrode 30 to a power source. Thus, contact member 60 is part of the current path from counter electrode 30 to the power source. In the known prior art, a contact post is used as the contact member 60 applied to the counter electrode 30. These contact posts have the disadvantage that they often cause a short circuit between the counter electrode 30 and the substrate electrode 20. To overcome this disadvantage, the contact member 60 includes a conductive paste applied to the counter electrode 30. The conductive paste can be applied to the counter electrode 30 in a gentle manner such that there is no short circuit between the counter electrode 30 and the organic electroluminescent layer 50 and/or the electroluminescent layer stack which typically results in a gap between the two designated electrodes 20 and 30. damage.

The contact member 60 may be implemented as a conductive paste that is configured to be in direct contact with the counter electrode 30 and the inner surface of the encapsulation member 90. Therefore, it is easy to electrically connect the counter electrode 30 to a power source via the encapsulation member 90. The user only has to apply a conductive member (shown as a connecting member 93) to the encapsulating member 90. Then, the conductive paste between the encapsulation member 90 and the counter electrode 30 conducts current to the counter electrode 30. In the illustrated embodiment, the encapsulation member 90 is disposed on top of a further applied electrically conductive material 22 that is configured for supplying electrical power to the substrate electrode 20. Thus, the encapsulating member 90 is disposed in an electrically isolating manner on top of the additionally applied electrically conductive material 22 using an insulating rim 91.

One preferred embodiment of the disclosed electroluminescent device 10 includes a non-conductive protective member 70 when a conductive paste is used to form the electrical contact member 60 for electrically contacting the counter electrode 30. The non-conductive protective member 70 is configured to at least completely cover the area under the contact member 60. The protective member 70 is disposed on the substrate electrode 20 and can protect a region under the contact member 60. In the illustrated electroluminescent device 10, three different kinds of glue are applied: the electrical connection member 120 comprises a conductive paste, and the protective member 70 is composed of a non-conductive glue to isolate the area under the contact member 60, the contact member 60 A third conductive paste application is formed. Both the shunting of the substrate electrode 20 and the contact member 60 by means of the electrical shunt member 122 are applied within the encapsulation chamber 99 formed by the encapsulation member 90.

Figure 3b shows another embodiment of contacting the counter electrode 30 to a power source. In this embodiment, the encapsulation member includes a conductive airtight feedthrough 92. This feedthrough line 92 is connected to the contact member 60. This can be done, as shown, by a connecting member 93 which connects the feedthrough 92 on the one hand and the contact member 60 on the other hand. The connecting member 93 can be a wire, a foil or another conductive element known to those skilled in the art. It is also possible that the feedthrough 92 is in direct contact with the contact member 60. Thus, during installation of the encapsulation member 90 onto the layer stack, the gas tight feedthrough 92 can be extruded into the undried conductive paste of the contact member 60. After hardening, there is an electrical contact between the hermetic feedthrough 92 and the contact member 60. On the outer side of the encapsulation member 90, the airtight feedthrough 92 can be contacted to a power source. In the illustrated embodiment, it is assumed that the entire encapsulation member 90 is electrically conductive. Therefore, the airtight feedthrough 92 includes an insulating member 97 which is suitable. This insulating member 97 prevents any short circuit between the feedthrough line 92 (connected to the counter electrode 30) and the encapsulation member 90 (connected to the substrate electrode 20). This insulating member 97 may be formed of ceramic, glass or made of a remelted frit. If there is no insulating member 97 for the airtight feedthrough 92, the top portion 95 of the encapsulating member 90 can also be insulated. Therefore, a short circuit between the two electrodes 20, 30 is also prevented.

Figure 4 shows yet another embodiment of an electroluminescent device 10 in accordance with the present invention. A protective member 71 is applied into the open region 140 and the electrical connection member 120 is embedded in the protective member 71 including the non-conductive adhesive. Therefore, a glue intermediate configuration is provided and the electrical branching member 122 is fed through the protective member 71.

According to the illustrated embodiment, the protective member 70 beneath the contact member 60 and the protective member 71 in the open region 140 are characterized by at least one scattering member 180 for scattering light generated by the organic electroluminescent layer 50, preferably scattering The members 180 are embedded in the protective members 70 and 71, respectively. The scattering member 180 scatters and/or reflects portions of the artificial light that are directed by the substrate 40. This causes one of the originally non-emission regions formed by the protective members 70, 71 to illuminate. Since the substrate 40 is often used as a light guide, the scattering members 180 of the protective members 70, 71 enable this light to be scattered and reflected from the electroluminescent device 10. The scattering member 180 may be formed of a plurality of pigments and/or sheets embedded in the protective members 70 and 71. For example, such sheets and/or pigments may include aluminum, mica effect pigments, titanium dioxide particles, or other sheets or particles known to those skilled in the art of scattering and/or artificial light that reflects organic electroluminescent device 10. Thus, the light emission system across the entire illumination field of the electroluminescent device 10 is homogenized and the open region 140 (not self-emission) becomes invisible. Both the non-conductive glue forming the protective members 70 and 71 and the conductive paste forming the electrical connection member 120 may include the scattering member 180.

Figure 5a shows a further embodiment of an electroluminescent device 10. As shown, the shunt member 122' is applied to the substrate electrode 20 by means of an electrical connection member 120 that can be formed on the top of the substrate electrode 20 by a glue drop in the open region 140 and at the circumference of the substrate electrode 20. The branching member 122' is disposed between the electrical connection member 120 and at least one of the inner side surfaces of the encapsulation member 90. The shunt members 122" can be implemented as inner surfaces of the encapsulation member 90. Conductive strips in the middle. The shunt member 122' can be in the form of a spike, preferably extending perpendicular to the inner surface of the encapsulation member 90 toward the electrical connection member 120, and the shunt member 122' is electrically coupled to the shunt member 122". When the member 90 is encapsulated to the electroluminescent device 10, the electrical branching member 122' in the form of a spike penetrates into the electrical connection member 120 of the feature-elastic conductive droplet and completes the shunt.

In particular, the shunt member 122" in the inner surface of the encapsulation member 90 can form a printed circuit board that is shunted to the substrate electrode 20 by means of a shunt member 122' shown in the form of a spike or needle.

In Figure 5b, the application of the shunt member 122" is defined as at least one of the shunt members 122" of the inner surface of the encapsulation member 90. In this embodiment, the electrical connection member 120' is made of a conductive paste, preferably in the form of a glue drop. A glue droplet extends between the substrate electrode 20 and the inside of the encapsulation member 90, wherein a shunt member 122" is shown. When at least one electrical connection member 120' is applied to the emission field of the electroluminescent device 10 and at least another When the electrical connection member 120 is applied in the circumference of the substrate electrode 20, the shunt is reliably performed when each of the electrical connection members 120' electrically contacts the shunt member 122" in the inner surface of the encapsulation member 90.

In particular, in this embodiment, the shunt member 122" in the inner surface of the encapsulation member 90 can also form a printed circuit board that is electrically coupled to the substrate electrode 20 by the electrical connection member 120' shown.

According to an embodiment of the electroluminescent device 10 shown in Figure 6, the electrical shunt member 122 contacts the outer region of the substrate electrode 20 in an alternative manner. The encapsulation member 90 includes an encapsulation member top 95 and an encapsulation member side 96 that form one of the top sides of the electroluminescent device 10. To form an electrical isolation between the encapsulation member top 95 and the encapsulation member side 96, the top and sides 95, 96 enclose an insulating member 98. Thus, the current to operate the electroluminescent device 10 to the top 95 and side 96 of the encapsulation member 90 can be applied by means of the connecting members 93 and 93' shown. As a result, the connecting member 93' is electrically connected to the substrate electrode 20 by means of the bonding member 94 shown, which includes, for example, a conductive agent made of a conductive paste. The encapsulation member top 95 is electrically connected to the counter electrode 30 by means of the contact member 60 as shown. For the shunt substrate electrode 20, a shunt member 122 is disposed between the electrical connection member 120 of the center of the emission field of the electroluminescent device 10 and the bonding member 94. The electrical shunt member 122 terminates inside the engagement member 94 and the end of the electrical shunt member 122 can be glued into the engagement member 94. In this way, the branching member 122 is simply electrically connected in one of the outer regions of the electroluminescent device 10.

FIG. 7 shows an electroluminescent device 10 having a plurality of protective members 70 preferably disposed in the edges of the counter electrode 30. These protective members 70 may include a non-conductive paste to prevent a short circuit between the counter electrode 30 and the substrate electrode 20. In particular, the boundary line of the open area 140 may be protected by the protective member 70, and an additional protective member 71 may be applied to embed the electrical connection member 120 within the open area 140.

Figure 8 shows a back side view of one of the electroluminescent devices 10. The shunt of the substrate electrode 20 includes one of the first electrical connection members 120 of the center of the illumination field of the electroluminescent device 10. The electrical connection member 120 is connected to four different electrical connection members 120 in the edge of the electroluminescent device 10. Thus, four different electrical shunt members 122 are disposed between the external electrical connection member 120 and the electrical connection member 120 at the center of the electroluminescent device 10 (specifically, within the open region 140).

FIG. 9 shows another embodiment of an electroluminescent device 10 that includes four electrical connection members 120 within the illumination field of substrate electrode 20. Each of the electrical connection members 120 within the illumination field of the substrate electrode 20 includes an electrical shunt member 122 for connecting the electrical connection member 120 to the electrical connection member 120 in an outer region of the electroluminescent device 10.

Figure 10 shows an embodiment of an electroluminescent device 10 comprising a counter electrode having one of four different counter electrode segments 31. The counter electrode segments 31 are shown in a square configuration, and the organic electroluminescent layer 50 is not covered by the counter electrode segments 31 spanning the entire electroluminescent device 10. At the center of the electroluminescent device 10, the counter electrode segment 31 forms a region of the organic electroluminescent layer 50 that does not have the coverage of the counter electrode segment 31. An open region 140 is disposed in this region of the organic electroluminescent layer 50, and the electrical connection member 120 is positioned within the open region 140. This electrical connection member 120 is contacted to one of the outer regions of the electroluminescent device 10 by the electrical branching member 122 and to the internal electrical connection member 120. The counter electrode segments 31 can be individually connected to a power source by the contact members 60 applied to each of the counter electrode segments 31.

As an example, the illustrated embodiment includes an organic electroluminescent layer 50 within a layer stack. In an alternative embodiment within the scope of the present invention, in addition to the organic electroluminescent layer 50, the electroluminescent layer stack may also include, for example, a hole transparent layer, a hole blocking layer, an electron transport layer, an electron blocking layer, and a charge injection layer. , other conductive layers and other layers.

10. . . Electroluminescent device

20. . . Substrate electrode

twenty one. . . Contact area

twenty two. . . Additional applied conductive material

30. . . Counter electrode

31. . . Counter electrode segment

40. . . Substrate

50. . . Organic electroluminescent layer

60. . . Contact member

70. . . Protective member

71. . . Protective member

72. . . Continuous gap

90. . . Encapsulation member

91. . . Insulated edge

92. . . Airtight feedthrough

93. . . Connecting member

93'. . . Connecting member

94. . . Joint member

95. . . Capsule top

96. . . Encapsulation member side

97. . . Insulating member

98. . . Insulating member

99. . . Capsule

120. . . Connecting member

120'. . . Connecting member

122. . . Shunt component

122'. . . Shunt component

122"...divide member

140. . . Open area

170. . . Absorbent

180. . . Scattering member

Further embodiments of the present invention will be described with respect to the following figures, which show:

1 is an embodiment of an electroluminescent device having a shunt member shown between two electrical connection members in accordance with the present invention;

Figure 2 includes an electroluminescent device comprising one of two branching members;

Figure 3a includes an encapsulating member and an electroluminescent device electrically contacting one of the contact members of the top of the encapsulating member;

Figure 3b is an electroluminescent device with a contact member applied to a hermetic feedthrough that is isolated from the top of the encapsulation member;

Figure 4 is an electroluminescent device having one of different glue applicators, the glue applicator comprising a scattering member;

Figure 5a has an electroluminescent device embodied as one of the shunt members of a shunt form of the shunt member;

Figure 5b has an electroluminescent device applied to one of the shunt members in the inner surface of the encapsulation member;

Figure 6 is an electroluminescent device having a contact by means of an encapsulation member and a substrate electrode;

Figure 7 includes an electroluminescent device comprising one of a plurality of protective members;

Figure 8 is a top plan view of an electroluminescent device comprising a branching member between an electrical connection member and a boundary region within the illumination field of the device;

Figure 9 is a top plan view of an electroluminescent device having a plurality of electrical connection members within the illumination field;

Figure 10 is a top plan view of an electroluminescent device comprising a plurality of counter electrode segments.

10. . . Electroluminescent device

20. . . Substrate electrode

30. . . Counter electrode

40. . . Substrate

50. . . Organic electroluminescent layer

93. . . Connecting member

93'. . . Connecting member

120. . . Connecting member

122. . . Shunt component

140. . . Open area

Claims (13)

An electroluminescent device (10) comprising: a layer system having a substrate electrode (20) on top of a substrate (40) and at least one stack of subsequent layers, the at least one The subsequent layer stack includes a counter electrode (30) and an electroluminescent layer stack having at least one organic electroluminescent layer (50), wherein the electroluminescent layer stack is disposed on the substrate electrode (20) and the Between the counter electrodes (30); and at least one electrical shunt means (122, 122', 122") applied to the top of the substrate electrode (20) to improve the substrate electrode (20) Current distribution, wherein the electrical branching member (122, 122', 122") is applied to the substrate electrode (20) via at least one electrical connection member (120), and the electrical connection member (120) and the electrical shunt The member (122, 122', 122") is disposed outside the subsequent layer stack, wherein the electrical connection member (120) is embedded in a protective member (71) applied to the substrate electrode (20), wherein the protection The member (71) includes a non-conductive glue and at least one scattering member (180), the at least one scattering member ( 180) for scattering light generated by the organic electroluminescent layer (50). The electroluminescent device (10) of claim 1, wherein the subsequent layer stack has an open region (140) for feeding through the one of the electrical connection members (120, 120') by the subsequent layer stack Electrical branching members (122, 122'). The electroluminescent device (10) of claim 1 or 2, wherein the electrical connection member (120, 120') comprises means for electrically contacting the electrical branching member (122, 122') to the substrate electrode (20) One of the conductive adhesives. The electroluminescent device (10) of claim 3, wherein the conductive paste forming at least the electrical connection member (120, 120') comprises a substrate and a filler, and the conductive paste comprises an organic material as the substrate and As an inorganic material of the filler. The electroluminescent device (10) of claim 1, wherein the electrical branching member (122, 122") comprises at least one of the following: a wire, a metal foil, a deposited conductive material, or a printing Circuit board. The electroluminescent device (10) of claim 1, wherein the substrate electrode (20) has a contact region (21), and the other electrical connection member (120) is applied to the substrate in the contact region (21) Electrode (20). The electroluminescent device (10) of claim 6, wherein the contact region (21) comprises an additional applied conductive material (22), the additionally applied conductive material (22) being implemented to increase the contact region (21) The conductivity of the substrate electrode (20). An electroluminescent device (10) according to claim 1, further comprising at least one contact member (60) for electrically contacting the counter electrode (30) to a power source, and an additional protective member (70) disposed on the substrate On the electrode (20), the additional protective member (70) is a non-conductive glue and at least completely covers the area under the contact member (60). An electroluminescent device (10) according to claim 8, wherein an encapsulating member (90) is configured to encapsulate at least the electroluminescent layer stack. The electroluminescent device (10) of claim 9, wherein the encapsulating member (90) comprises electrically insulating the contact member (60) from the substrate electrode, an encapsulating member top (95) and an encapsulating member side (96). An electroluminescent device (10) according to claim 9 or 10, wherein at least one electrical branching member (122') is disposed between the electrical connecting member (120) and the encapsulating member (90) to extend to the bladder An at least partially electrically conductive inner surface of the encapsulating member (90) for electrically contacting the substrate electrode (20) via the inner surface of the encapsulating member. A method for electrically shunting a substrate electrode (20) of an electroluminescent device (10), the electroluminescent device (10) comprising a system having a substrate (40) top a top substrate electrode (20) and at least one subsequent layer stack, the at least one subsequent layer stack comprising a counter electrode (30) and an electroluminescent layer stack having at least one organic electroluminescent layer (50), wherein An electroluminescent layer stack is disposed between the substrate electrode (20) and the counter electrode (30), the method comprising at least the step of depositing the subsequent layer stack on top of the substrate electrode (20), via the subsequent layer stacking At least one of the outer connecting members (120, 120') applies at least one electrical branching member (122, 122', 122") to the substrate electrode (20), and the electrical branching member (122, 122', 122) ") disposed outside the stack of subsequent layers, and embedding the electrical connection member (120) in a protective member (71) applied to the substrate electrode (20), wherein the protective member (71) comprises a non-conductive paste and At least one scattering member (180) for scattering from the organic A photoluminescent layer (50) produced. The method of claim 12, which includes the following additional steps: Applying at least one other electrical connection member (120, 120') characteristically of a conductive paste to the substrate electrode (20), the electrical branching member (122, 122', 122") being disposed on the at least two electrical connection members Between (120, 120').