TWI511637B - Electronic device - Google Patents
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- TWI511637B TWI511637B TW102131886A TW102131886A TWI511637B TW I511637 B TWI511637 B TW I511637B TW 102131886 A TW102131886 A TW 102131886A TW 102131886 A TW102131886 A TW 102131886A TW I511637 B TWI511637 B TW I511637B
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Description
本發明關於一種電子裝置,特別是關於一種具有拉持結構以及卡勾的電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device having a holding structure and a hook.
隨著科技的進步,電子裝置的性能也日益進步,以滿足消費者對於性能的需求。除此之外,消費者亦期盼電子裝置能依據個人需要,調整電子裝置的設備以及功能,進而達到客製化的需求。以一伺服主機櫃為例,伺服主機櫃包含一主機箱以及多個伺服器。主機箱具有平行設置的多組軌道。伺服器以層疊與可拆卸的方式設置於軌道內。如此,根據消費者的需要,可以增設或移除伺服器於主機箱,進而調整伺服主機櫃的整體運算以及儲存功能。As technology advances, the performance of electronic devices is also increasing to meet consumer demand for performance. In addition, consumers also expect electronic devices to adjust the equipment and functions of electronic devices according to individual needs, so as to meet the needs of customization. Taking a servo host cabinet as an example, the servo host cabinet includes a main box and a plurality of servers. The main chassis has multiple sets of tracks arranged in parallel. The server is placed in the rail in a stacked and detachable manner. In this way, according to the needs of the consumer, the server can be added or removed to the main box, thereby adjusting the overall operation and storage function of the servo main cabinet.
一般來說,伺服器包含一機殼以及多個主機板模組。機殼包含一上殼以及一下殼,而主機板模組設置於機殼內以及上殼和下殼之間,並且承載於下殼的底壁。多個伺服器依序沿著各組軌道平行地組裝機殼內,或是拆卸於機殼。然而,因為製造工差的因素,上殼會向外突出,如此,可能干涉於設置於上方的另一伺服器。再者,因為下殼承載主機板模組,下殼的底壁會因為主機板模組的重量而下沉或變 形,進而導致伺服器干涉於設置於下方的另一伺服器。Generally, the server includes a casing and a plurality of motherboard modules. The casing comprises an upper casing and a lower casing, and the mainboard module is disposed in the casing and between the upper casing and the lower casing, and is carried on the bottom wall of the lower casing. A plurality of servers are sequentially assembled in parallel along the respective sets of tracks or are detached from the casing. However, due to manufacturing factors, the upper case may protrude outward, and thus may interfere with another server disposed above. Furthermore, since the lower case carries the motherboard module, the bottom wall of the lower case may sink or become changed due to the weight of the motherboard module. The shape, which in turn causes the server to interfere with another server disposed below.
是以,習知技術的伺服器中,因為上下殼的不平整,可能會干涉鄰近的其他伺服器,將會導致伺服器無法組裝或拆卸的問題。Therefore, in the servo of the prior art, the unevenness of the upper and lower casings may interfere with other servers in the vicinity, which may cause the server to be unable to be assembled or disassembled.
鑒於以上的問題,本發明揭露一種電子裝置,藉以解決上述伺服器的底壁在主機板模組壓力下的問題。In view of the above problems, the present invention discloses an electronic device for solving the problem that the bottom wall of the server is under the pressure of the motherboard module.
本發明的一實施例揭露電子裝置,其包含一機殼、一主機板模組以及一拉持結構。機殼包含相組裝在一起的一頂殼與一底殼。頂殼包含一頂壁以及固定於頂壁的一卡勾,底殼包含與頂壁相對的一底壁。卡勾位於頂壁之面對底壁的一側。主機板模組設置於底壁上,主機板模組包含一主機板及設置於主機板上的一中央處理器。拉持結構固持於主機板模組並且掛設於卡勾,以提供主機板模組向上的拉力。An embodiment of the invention discloses an electronic device including a casing, a motherboard module, and a pulling structure. The casing includes a top case and a bottom case that are assembled together. The top case includes a top wall and a hook fixed to the top wall, and the bottom case includes a bottom wall opposite to the top wall. The hook is located on the side of the top wall facing the bottom wall. The motherboard module is disposed on the bottom wall, and the motherboard module includes a motherboard and a central processor disposed on the motherboard. The pulling structure is held on the motherboard module and is hung on the hook to provide an upward pulling force of the motherboard module.
根據本發明揭露的電子裝置,藉由固持於主機板模組的拉持結構掛設於頂殼的卡勾,卡勾提供主機板模組向上的拉力,以減輕主機板模組對底壁的壓力,進而抑制底壁的變形。According to the electronic device disclosed in the present invention, the hook is attached to the top cover by the holding structure of the motherboard module, and the hook provides the upward pulling force of the motherboard module to reduce the bottom plate of the motherboard module. The pressure, in turn, inhibits deformation of the bottom wall.
以上之關於本發明內容之說明及以下之實施方式之說明用以示範與解釋本發明之原理,並且提供本發明之專利申請範圍更進一步之解釋。The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.
1‧‧‧電子裝置1‧‧‧Electronic device
10‧‧‧機殼10‧‧‧Chassis
12‧‧‧頂殼12‧‧‧ top shell
121‧‧‧頂壁121‧‧‧ top wall
1211‧‧‧第一表面1211‧‧‧ first surface
1212‧‧‧第二表面1212‧‧‧ second surface
122‧‧‧卡勾122‧‧‧check
1221‧‧‧連結部1221‧‧‧Link Department
1222‧‧‧延伸部1222‧‧‧Extension
1223‧‧‧勾部1223‧‧‧Hook
1223a‧‧‧導引面1223a‧‧‧ Guide surface
123‧‧‧折邊123‧‧‧Folding
124、125‧‧‧翻邊124, 125‧‧‧Flanging
13‧‧‧底殼13‧‧‧ bottom case
131‧‧‧螺母131‧‧‧ nuts
132‧‧‧底壁132‧‧‧ bottom wall
133‧‧‧第三表面133‧‧‧ third surface
134‧‧‧第四表面134‧‧‧ fourth surface
135、136‧‧‧側壁135, 136‧‧‧ side walls
20‧‧‧主機板模組20‧‧‧ motherboard module
21‧‧‧主機板21‧‧‧ motherboard
22‧‧‧托盤22‧‧‧Tray
221‧‧‧螺母221‧‧‧ nuts
222‧‧‧穿槽222‧‧‧through slot
225‧‧‧第五表面225‧‧‧ fifth surface
226‧‧‧第六表面226‧‧‧ sixth surface
30‧‧‧中央處理器30‧‧‧Central processor
40‧‧‧拉持結構40‧‧‧ Pulling structure
41‧‧‧固定部41‧‧‧ Fixed Department
411‧‧‧穿孔411‧‧‧Perforation
42‧‧‧掛持部42‧‧‧Holding Department
421‧‧‧通風孔421‧‧‧ventilation holes
422‧‧‧內環壁面422‧‧‧ inner ring wall
423‧‧‧底部423‧‧‧ bottom
43‧‧‧固定件43‧‧‧Fixed parts
50‧‧‧插槽50‧‧‧ slots
60‧‧‧擴充模組60‧‧‧Expansion module
70‧‧‧電源模組70‧‧‧Power Module
80‧‧‧風扇80‧‧‧fan
90‧‧‧硬碟模組90‧‧‧hard disk module
第1圖,為根據本發明一實施例的一電子裝置的立體示意圖。1 is a perspective view of an electronic device according to an embodiment of the invention.
第2圖,為根據本發明一實施例的電子裝置於一第一角度的分解示意圖。2 is an exploded perspective view of the electronic device at a first angle according to an embodiment of the invention.
第3A圖,為根據本發明一實施例的電子裝置於第一角度的分解放大示意圖。FIG. 3A is an exploded, enlarged, isometric view of the electronic device at a first angle according to an embodiment of the invention.
第3B圖,為根據本發明一實施例的電子裝置於一第二角度的分解放大示意圖。FIG. 3B is an exploded, isometric view of the electronic device at a second angle according to an embodiment of the invention.
第4圖,為根據本發明一實施例的電子裝置的局部剖切示意圖。4 is a partial cross-sectional view of an electronic device in accordance with an embodiment of the present invention.
第5圖,為根據本發明另一實施例的一電子裝置的局部剖切示意圖。Figure 5 is a partially cutaway perspective view of an electronic device in accordance with another embodiment of the present invention.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.
本發明提供一種電子裝置,用以儲存以及運算資訊和/或資料。在本發明中,電子裝置可以是伺服器,但非用 以限定本發明。此外,本發明的多個電子裝置可以疊設於一機櫃當中,且相鄰的電子裝置間隔一大於零的距離。The present invention provides an electronic device for storing and computing information and/or data. In the present invention, the electronic device may be a server, but not used. To limit the invention. In addition, the plurality of electronic devices of the present invention may be stacked in a cabinet, and adjacent electronic devices are separated by a distance greater than zero.
請同時參照『第1圖』以及『第2圖』。其中『第1圖』為根據本發明一實施例的一電子裝置的立體示意圖,『第2圖』為根據本發明一實施例的電子裝置於一第一角度的分解示意圖。Please refer to "1st picture" and "2nd picture" at the same time. 1 is a perspective view of an electronic device according to an embodiment of the invention, and FIG. 2 is an exploded perspective view of the electronic device according to an embodiment of the invention.
根據本發明的一實施例,揭露一種電子裝置1,其包含一機殼10、一主機板模組(motherboard module)20以及一拉持結構40。拉持結構40固定設置於主機板模組20上,而拉持結構40以及主機板模組20容置於機殼10內。According to an embodiment of the invention, an electronic device 1 includes a casing 10, a motherboard module 20 and a pulling structure 40. The holding structure 40 is fixedly disposed on the motherboard module 20 , and the holding structure 40 and the motherboard module 20 are received in the casing 10 .
機殼10包含一頂殼12以及一底殼13。頂殼12與底殼13互相組裝在一起。頂殼12包含一頂壁121以及一卡勾122。頂壁121具有一第一表面1211以及一第二表面1212,第一表面1211以及第二表面1212彼此相對。在本實施例以及部分的其他實施例中,頂殼12更包含兩個翻邊124、125以及一折邊123。兩個翻邊124、125位於頂壁121相反兩側。折邊123自頂壁121的位於兩個翻邊124、125之間的一邊緣1213向下(朝向底殼13)彎折所形成。折邊123可以抑制頂壁121遭受力量而產生彎曲的程度,進而平整化頂壁121的第一表面1211以及第二表面1212。The casing 10 includes a top case 12 and a bottom case 13. The top case 12 and the bottom case 13 are assembled to each other. The top case 12 includes a top wall 121 and a hook 122. The top wall 121 has a first surface 1211 and a second surface 1212, and the first surface 1211 and the second surface 1212 are opposite each other. In other embodiments of this embodiment and some of the embodiments, the top case 12 further includes two flanges 124, 125 and a flange 123. The two flanges 124, 125 are located on opposite sides of the top wall 121. The hem 123 is formed by bending an edge 1213 of the top wall 121 between the two flanges 124, 125 downward (toward the bottom casing 13). The hem 123 can suppress the extent to which the top wall 121 is subjected to force to bend, thereby flattening the first surface 1211 and the second surface 1212 of the top wall 121.
請參照『第3A圖』、『第3B圖』以及『第4圖』。『第3A圖』為根據本發明一實施例的電子裝置於第一角度的 分解放大示意圖。『第3B圖』為根據本發明一實施例的電子裝置於一第二角度的分解放大示意圖。『第4圖』為根據本發明一實施例的電子裝置的局部剖切示意圖。卡勾122位於頂壁121之面對底壁132的一側,也就是說,卡勾122固定於頂壁121的第二表面1212上。在本實施例以及部分的其他實施例中,卡勾122包含一連結部1221、一延伸部1222以及一勾部1223。連結部1221鉚接於頂殼12,延伸部1222自連結部1222朝向底壁132延伸,而勾部1223自延伸部1222而以平行於主機板21的方向延伸。在本實施例以及部分的其他實施例中,勾部1223自由端形成有傾斜的一導引面1223a。Please refer to "3A", "3B" and "4". 3A is an electronic device according to an embodiment of the present invention at a first angle Decompose the enlarged schematic. 3B is an exploded and enlarged schematic view of the electronic device according to an embodiment of the present invention at a second angle. FIG. 4 is a partially cutaway schematic view of an electronic device according to an embodiment of the invention. The hook 122 is located on a side of the top wall 121 facing the bottom wall 132, that is, the hook 122 is fixed to the second surface 1212 of the top wall 121. In this embodiment and some other embodiments, the hook 122 includes a connecting portion 1221 , an extending portion 1222 , and a hook portion 1223 . The connecting portion 1221 is riveted to the top case 12, and the extending portion 1222 extends from the connecting portion 1222 toward the bottom wall 132, and the hook portion 1223 extends from the extending portion 1222 in a direction parallel to the main board 21. In this embodiment and some other embodiments, the free end of the hook portion 1223 is formed with an inclined guiding surface 1223a.
請參照『第2圖』以及『第4圖』。在本實施例中,底殼13包含一底壁132,底壁132相對於頂壁121。詳細來說,底壁132具有一第三表面133以及一第四表面134,第三表面133以及第四表面134彼此相對,且第三表面133面對卡勾122。在本實施例以及部分的其他實施例中,底殼13包括兩個側壁135、136,分別位於底壁132相反兩側並且自底壁132的第三表面133向上(朝向頂壁121)彎折並延伸所形成。頂殼12的兩個翻邊124、125安裝於兩個側壁136、135上,且兩個翻邊124、125與兩個側壁136、135分別對應相貼靠。如此,彼此對應的翻邊124、125與側壁136、135提升頂殼12以及底殼13彼此的穩固組裝。Please refer to "Figure 2" and "Figure 4". In the present embodiment, the bottom case 13 includes a bottom wall 132 with respect to the top wall 121. In detail, the bottom wall 132 has a third surface 133 and a fourth surface 134, the third surface 133 and the fourth surface 134 are opposite to each other, and the third surface 133 faces the hook 122. In other embodiments of this embodiment and in part, the bottom case 13 includes two side walls 135, 136 that are respectively located on opposite sides of the bottom wall 132 and that are bent upward (toward the top wall 121) from the third surface 133 of the bottom wall 132. And extended to form. The two flanges 124, 125 of the top case 12 are mounted on the two side walls 136, 135, and the two flanges 124, 125 and the two side walls 136, 135 respectively abut each other. As such, the corresponding flanges 124, 125 and the side walls 136, 135 enhance the secure assembly of the top shell 12 and the bottom shell 13 with each other.
請繼續參照『第2圖』以及『第4圖』。主機板 模組20設置於底壁132上。主機板模組20包含一主機板21、一中央處理器(Central Processing Unit,簡稱CPU)30以及一托盤22。中央處理器30設置於主機板21上。中央處理器30用以處理電子裝置1的主要運算。托盤22承載主機板21,且主機板21介於頂壁121以及托盤13之間。詳細來說,主機板21鎖固於托盤22,且主機板21並與托盤22作為一個整體安裝於底壁132上。主機板模組20承載於底壁132,主機板模組20在自身重力下對底壁132產生壓力,以使底壁132變形,上述為本發明欲解決的該問題。托盤13與底壁13相固持在一起,托盤13與底壁13間可設有固持結構以相固持,例如底壁13設有凸柱(未圖示),托盤13設有葫蘆孔(未圖示),凸柱卡固於葫蘆孔。再者,在本實施例以及部分的其他實施例中,托盤22具有一第五表面225以及一第六表面226,第五表面225以及第六表面226彼此相對。主機板21承載於托盤22的第五表面225上,第六表面226面對底壁132。Please continue to refer to "Figure 2" and "Figure 4". motherboard The module 20 is disposed on the bottom wall 132. The motherboard module 20 includes a motherboard 21, a central processing unit (CPU) 30, and a tray 22. The central processing unit 30 is disposed on the motherboard 21. The central processing unit 30 is used to process the main operations of the electronic device 1. The tray 22 carries the motherboard 21, and the motherboard 21 is interposed between the top wall 121 and the tray 13. In detail, the main board 21 is locked to the tray 22, and the main board 21 is attached to the bottom wall 132 as a whole with the tray 22. The motherboard module 20 is carried on the bottom wall 132. The motherboard module 20 exerts pressure on the bottom wall 132 under its own gravity to deform the bottom wall 132. The above is the problem to be solved by the present invention. The tray 13 and the bottom wall 13 are held together, and the tray 13 and the bottom wall 13 may be provided with a holding structure for holding, for example, the bottom wall 13 is provided with a stud (not shown), and the tray 13 is provided with a hoist hole (not shown). Show), the stud is stuck in the gourd hole. Moreover, in this embodiment and some other embodiments, the tray 22 has a fifth surface 225 and a sixth surface 226, the fifth surface 225 and the sixth surface 226 being opposite each other. The motherboard 21 is carried on the fifth surface 225 of the tray 22, and the sixth surface 226 faces the bottom wall 132.
在本實施例以及部分的其他實施例中,電子裝置1更包含多個風扇80以及多個硬碟模組90,皆設置於底殼13的第三表面上133。多個風扇80用以提供主機板模組20散熱,硬碟模組90用以儲存資料。此外,主機板模組20更包含一插槽50、一擴充模組60以及一電源模組70,皆設置於主機板21上。插槽50位於中央處理器30旁,用以電性連接一模組,例如一記憶體模組(未繪示)。擴充模組60設置於主 機板21的一側,且鄰近於折邊123,擴充模組60具有特定之功能。電源模組70係位於擴充模組60旁,用以接收並轉換外界之電能,以提供電能予其他電子裝置1的元件使用。In other embodiments of the present embodiment, the electronic device 1 further includes a plurality of fans 80 and a plurality of hard disk modules 90 disposed on the third surface 133 of the bottom case 13. The plurality of fans 80 are used to provide heat dissipation for the motherboard module 20, and the hard disk module 90 is used for storing data. In addition, the motherboard module 20 further includes a slot 50, an expansion module 60, and a power module 70, all disposed on the motherboard 21. The slot 50 is located next to the central processing unit 30 for electrically connecting a module, such as a memory module (not shown). The expansion module 60 is disposed on the main The expansion module 60 has a specific function on one side of the board 21 and adjacent to the flange 123. The power module 70 is located adjacent to the expansion module 60 for receiving and converting external power to provide power to components of other electronic devices 1.
請參照『第2圖』、『第3A圖』、『第3B圖』以及『第4圖』。拉持結構40固持於主機板模組20並且掛設於卡勾122的勾部1223,以提供主機板模組20向上的拉力。在本實施例以及部分的其他實施例中,拉持結構40設置於中央處理器30、擴充模組60以及電源模組70之間。拉持結構40包含一固定部41、一掛持部42以及一固定件43。固定部41自掛持部42的一底部423彎折延伸形成,且固定部41設置於主機板21上。固定部41更具有一穿孔411。掛持部42掛設於卡勾122。詳細來說,掛持部42具有一內環壁面422。卡勾122的導引面1223a導引拉持結構40掛設於勾部1223,且卡勾122接觸並卡持於內環壁面422上。此外,掛持部42面向風扇80,掛持部42具有多個通風孔421,風扇80工作時形成的氣流至少部份穿過通風孔421。如此,具有通風孔421的拉持結構40有助於電子裝置1內的散熱。再者,固定件43穿設於固定部41的穿孔411以及穿設於主機板21而固定於托盤22上。也就是說,卡勾122拉起拉持結構40,拉持結構40帶動主機板21、托盤22以及底殼13向上移動;同時,因為頂殼12承受拉持結構40、主機板21、托盤22以及底殼13的重力,頂殼12亦會下移。如此,可避免頂殼12以及底殼 13分別向電子裝置1外突出。Please refer to "Fig. 2", "3A", "3B" and "4". The holding structure 40 is retained on the motherboard module 20 and hooked on the hook portion 1223 of the hook 122 to provide an upward pulling force of the motherboard module 20 . In this embodiment and some other embodiments, the holding structure 40 is disposed between the central processing unit 30, the expansion module 60, and the power module 70. The holding structure 40 includes a fixing portion 41 , a hanging portion 42 and a fixing member 43 . The fixing portion 41 is formed by bending and extending from a bottom portion 423 of the hanging portion 42 , and the fixing portion 41 is disposed on the main board 21 . The fixing portion 41 further has a through hole 411. The hanging portion 42 is hooked to the hook 122. In detail, the hanging portion 42 has an inner ring wall surface 422. The guiding surface 1223a of the hook 122 guides the pulling structure 40 to the hook portion 1223, and the hook 122 contacts and is held on the inner ring wall surface 422. In addition, the hanging portion 42 faces the fan 80, and the hanging portion 42 has a plurality of ventilation holes 421, and the airflow formed when the fan 80 operates is at least partially passed through the ventilation holes 421. As such, the pulling structure 40 having the venting holes 421 contributes to heat dissipation within the electronic device 1. Further, the fixing member 43 is bored through the through hole 411 of the fixing portion 41 and is attached to the main board 21 and fixed to the tray 22. That is, the hook 122 pulls up the pulling structure 40, and the pulling structure 40 drives the main board 21, the tray 22 and the bottom case 13 to move upward; meanwhile, because the top case 12 bears the pulling structure 40, the main board 21, and the tray 22 As well as the weight of the bottom case 13, the top case 12 also moves down. In this way, the top case 12 and the bottom case can be avoided 13 protrudes outward from the electronic device 1, respectively.
再者,在本實施例以及部分的其他實施例中,固定件43是一螺絲,托盤22具有一螺母221,螺絲鎖固於螺母221。然而,螺絲以及螺母221的固定方式非用以限定本發明。在其他實施例中,拉持結構40是以卡持的方式固定於主機板21上。在其他實施例中,拉持結構40是以鉚接的方式固定於主機板21上。Furthermore, in this embodiment and some other embodiments, the fixing member 43 is a screw, and the tray 22 has a nut 221 which is screwed to the nut 221. However, the manner in which the screws and nuts 221 are fixed is not intended to limit the invention. In other embodiments, the pulling structure 40 is fixed to the motherboard 21 in a latching manner. In other embodiments, the pull structure 40 is fixed to the motherboard 21 by riveting.
上述主機板21以及托盤22彼此的固定方式非用以限定本發明。請參照『第5圖』,其為根據本發明另一實施例的一電子裝置的局部剖切示意圖。在本實施例中,詳細來說,底殼13具有一螺母131。固定件43依序穿設於固定部41的穿孔411、托盤22的第五表面225以及第六表面226,而固定於底殼13的螺母131內。是以,主機板21、托盤22以及底殼13可視為一整體。當拉持結構40藉由內環壁面422掛設於卡勾122時,拉持結構藉由固定件43共同拉起主機板21、托盤22以及底殼13的底壁132,藉以直接地提升底壁132向上(頂殼121)的拉力,同時亦使頂殼121朝向底壁132下移。也就是說,藉由拉持結構掛持於卡勾,避免頂殼以及底殼向電子裝置1外突出。The manner in which the motherboard 21 and the tray 22 are fixed to each other is not intended to limit the present invention. Please refer to FIG. 5, which is a partial cross-sectional view of an electronic device according to another embodiment of the present invention. In the present embodiment, in detail, the bottom case 13 has a nut 131. The fixing member 43 is sequentially disposed through the through hole 411 of the fixing portion 41, the fifth surface 225 of the tray 22, and the sixth surface 226, and is fixed in the nut 131 of the bottom case 13. Therefore, the motherboard 21, the tray 22, and the bottom case 13 can be regarded as a single unit. When the holding structure 40 is hung on the hook 122 by the inner ring wall surface 422, the pulling structure pulls the main board 21, the tray 22 and the bottom wall 132 of the bottom case 13 together by the fixing member 43 to directly raise the bottom. The pulling force of the wall 132 upward (the top case 121) also causes the top case 121 to move downward toward the bottom wall 132. That is to say, the top case and the bottom case are prevented from protruding to the outside of the electronic device 1 by the holding structure being hung on the hook.
綜合上述,根據本發明揭露的電子裝置,藉由固持於主機板模組的拉持結構掛設於頂殼的卡勾,卡勾提供主機板模組向上的拉力,以減輕主機板模組對底壁的壓力,進 而抑制底壁的變形;同時,因為頂殼的卡勾掛著拉持結構,頂殼承受主機板模組、拉持結構以及底殼的重力,如此亦可避免頂殼向外突出。如此,本發明的電子裝置解決了習知技術的伺服器,因為上下殼的不平整,可能會干涉鄰近的其他伺服器,而導致伺服器無法組裝或拆卸的問題。此外,在部分實施例中,頂殼的折邊亦能抑制頂壁產生彎曲,避免頂殼向外突出。In summary, according to the electronic device disclosed in the present invention, the hook is attached to the top cover by the holding structure of the motherboard module, and the hook provides the upward pulling force of the motherboard module to reduce the pair of the motherboard module. The pressure on the bottom wall The deformation of the bottom wall is suppressed; at the same time, because the hook of the top case hangs the pulling structure, the top case receives the gravity of the main board module, the pulling structure and the bottom case, so that the top case can be prevented from protruding outward. As such, the electronic device of the present invention solves the servo of the prior art, because the unevenness of the upper and lower casings may interfere with other servers in the vicinity, resulting in the problem that the server cannot be assembled or disassembled. In addition, in some embodiments, the folded edge of the top case can also inhibit the top wall from being bent to prevent the top case from protruding outward.
雖然本發明以前述之較佳實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.
122‧‧‧卡勾122‧‧‧check
1221‧‧‧連結部1221‧‧‧Link Department
1222‧‧‧延伸部1222‧‧‧Extension
1223‧‧‧勾部1223‧‧‧Hook
1223a‧‧‧導引面1223a‧‧‧ Guide surface
21‧‧‧主機板21‧‧‧ motherboard
40‧‧‧拉持結構40‧‧‧ Pulling structure
41‧‧‧固定部41‧‧‧ Fixed Department
42‧‧‧掛持部42‧‧‧Holding Department
421‧‧‧通風孔421‧‧‧ventilation holes
422‧‧‧內環壁面422‧‧‧ inner ring wall
423‧‧‧底部423‧‧‧ bottom
43‧‧‧固定件43‧‧‧Fixed parts
Claims (8)
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TW102131886A TWI511637B (en) | 2013-09-04 | 2013-09-04 | Electronic device |
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TW201511637A TW201511637A (en) | 2015-03-16 |
TWI511637B true TWI511637B (en) | 2015-12-01 |
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US7012804B2 (en) * | 2003-02-28 | 2006-03-14 | Kabushiki Kaisha Toshiba | Electronic apparatus having removable circuit board to connect expansion card |
TW200911082A (en) * | 2007-08-28 | 2009-03-01 | Inventec Corp | Case structure for server |
US20090075501A1 (en) * | 2007-09-18 | 2009-03-19 | Denso Corporation | Electronic device including printed circuit board, connector and case |
TW201003359A (en) * | 2008-07-03 | 2010-01-16 | Aopen Inc | Modularized device and method for assembling the modularized device |
CN102033586A (en) * | 2009-09-30 | 2011-04-27 | 鸿富锦精密工业(深圳)有限公司 | Computer case |
TW201120322A (en) * | 2009-12-11 | 2011-06-16 | Hon Hai Prec Ind Co Ltd | Electronic device with latching mechanism |
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US7012804B2 (en) * | 2003-02-28 | 2006-03-14 | Kabushiki Kaisha Toshiba | Electronic apparatus having removable circuit board to connect expansion card |
TW200911082A (en) * | 2007-08-28 | 2009-03-01 | Inventec Corp | Case structure for server |
US20090075501A1 (en) * | 2007-09-18 | 2009-03-19 | Denso Corporation | Electronic device including printed circuit board, connector and case |
TW201003359A (en) * | 2008-07-03 | 2010-01-16 | Aopen Inc | Modularized device and method for assembling the modularized device |
CN102033586A (en) * | 2009-09-30 | 2011-04-27 | 鸿富锦精密工业(深圳)有限公司 | Computer case |
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