TWI510077B - Method for adjusting position of image pick-up element, camera module, method and device for fabricating the same - Google Patents
Method for adjusting position of image pick-up element, camera module, method and device for fabricating the same Download PDFInfo
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Description
本發明係關於調整相對於攝影透鏡之攝像元件的位置的方法、具有攝影透鏡與攝像元件之相機模組、以及此相機模組之製造方法及製造裝置。The present invention relates to a method of adjusting a position of an imaging element with respect to a photographic lens, a camera module having a photographic lens and an imaging element, and a manufacturing method and manufacturing apparatus of the camera module.
在行動電話、汽車等之中,為了能簡單地實現照相功能,採用泛用的相機模組。此相機模組係將已安裝攝影透鏡之透鏡單元與已安裝CCD、CMOS等之攝像元件的元件單元組合在一起而構成者(例如,日本特開2010-21985號公報)。此元件單元係由基板、安裝於基板上之攝像元件、驅動電路等構成,且以紫外線硬化樹脂等固定於透鏡單元上。在攝像元件之攝像面不平行於基板的情況下、或透鏡單元未被垂直地安裝於基板上之情況下,因攝像元件之攝像面相對於透鏡單元之成像面呈現傾斜,所以整個畫面無法獲得變得鮮艷之攝像圖像。於是,於相機模組之製造時,以攝像元件之攝像面與透鏡單元之成像面為大致一致的方式,進行相對於透鏡單元之元件單元的位置調整。In mobile phones, automobiles, etc., in order to easily realize the camera function, a general-purpose camera module is employed. This camera module is constructed by combining a lens unit to which a photographic lens is mounted and an element unit to which an image pickup element such as a CCD or a CMOS is mounted (for example, Japanese Patent Laid-Open Publication No. 2010-21985). The element unit is composed of a substrate, an image pickup element mounted on the substrate, a drive circuit, and the like, and is fixed to the lens unit by an ultraviolet curable resin or the like. In the case where the imaging surface of the imaging element is not parallel to the substrate, or the lens unit is not vertically mounted on the substrate, since the imaging surface of the imaging element is inclined with respect to the imaging surface of the lens unit, the entire screen cannot be changed. Have a bright camera image. Therefore, at the time of manufacture of the camera module, the position adjustment of the element unit with respect to the lens unit is performed so that the imaging surface of the imaging element and the imaging surface of the lens unit substantially coincide with each other.
日本特開2010-21985號公報所記載之攝像元件的位置調整方法係具備對焦座標值取得步驟、成像面運算步驟、調整值運算步驟、及調整步驟。對焦座標值取得步驟係在與測量圖表垂直之Z軸上設定透鏡單元及元件單元,使元件單元依序朝預先分散地設定於Z軸上之複數個測量位置移動而進行拍攝。然後,對於設定於攝像元件之攝像面上的中央部及其周邊之5個攝像區域,根據其攝像信號算出表示各攝像區域之對焦程度的對焦評價值。各攝像區域之對焦評價值,係按每個測量位置所算出。於是,在對於各攝像區域已獲得規定之對焦評價值時,將Z軸上之位置作為此區域之對焦座標值。The position adjustment method of the imaging element described in Japanese Laid-Open Patent Publication No. 2010-21985 includes a focus coordinate value acquisition step, an imaging surface calculation step, an adjustment value calculation step, and an adjustment step. The focus coordinate value acquisition step sets the lens unit and the element unit on the Z axis perpendicular to the measurement chart, and causes the element unit to sequentially move toward a plurality of measurement positions set in advance on the Z axis in advance, and to perform imaging. Then, the focus evaluation value indicating the degree of focus of each imaging region is calculated from the imaging signals of the central imaging unit set on the imaging surface of the imaging element and the five imaging regions around it. The in-focus evaluation value of each imaging area is calculated for each measurement position. Then, when a predetermined in-focus evaluation value has been obtained for each imaging region, the position on the Z-axis is taken as the focus coordinate value of the region.
在成像面運算步驟中,使用以各攝像區域之XY座標值與Z軸上的對焦座標值之組合來表示的至少5個評價點,該各攝像區域之XY座標值係使攝像面對應於與Z軸垂直之XY座標平面對應時的各攝像區域之XY座標值,而該Z軸上的對焦座標值係按各攝像區域之每個區域而獲得者。在將此5個評價點繪製於組合XY座標平面與Z軸而成之三維座標系時,算出在此三維座標系中作為一平面而被表示的近似成像面。實際上藉由最小二乘法運算該評價點而將近似於平面者作為近似成像面(參照日本特開2010-21985號公報之[0065]、[0079])。In the imaging plane calculation step, at least five evaluation points indicated by a combination of the XY coordinate value of each imaging region and the focus coordinate value on the Z axis are used, and the XY coordinate values of the imaging regions are such that the imaging surface corresponds to The XY coordinate value of each imaging region when the XY coordinate plane perpendicular to the Z axis corresponds, and the focus coordinate value on the Z axis is obtained for each region of each imaging region. When the five evaluation points are plotted on the three-dimensional coordinate system in which the XY coordinate plane and the Z-axis are combined, an approximate imaging surface which is represented as a plane in the three-dimensional coordinate system is calculated. Actually, the evaluation point is calculated by the least square method, and the approximating plane is used as an approximate imaging plane (refer to [0065] and [0079] of JP-A-2010-21985).
調整值運算步驟係算出作為Z軸與近似成像面之交點的成像面座標值,及對於XY座標平面之近似成像面的繞X軸及Y軸的旋轉角度。調整步驟係根據成像面座標值及旋轉角度,調整攝像元件之Z軸上之位置與繞X軸及Y軸的旋轉角度,而使攝像面與近似成像面一致。The adjustment value calculation step calculates the coordinate value of the imaging plane as the intersection of the Z-axis and the approximate imaging plane, and the rotation angle around the X-axis and the Y-axis of the approximate imaging plane of the XY coordinate plane. The adjustment step adjusts the position of the imaging element on the Z axis and the rotation angle around the X axis and the Y axis according to the coordinate value of the imaging surface and the rotation angle, so that the imaging surface is aligned with the approximate imaging surface.
近年來,相機模組趨向於小型輕薄化,因而亦期待元件單元之基板能夠達成薄型化。然而,當基板之厚度薄時, 例如藉由濺鍍等而於表面形成多層薄膜之基板等中,會有因多層薄膜之膜應力(壓縮應力),而產生基板發生彎曲變形的問題。In recent years, camera modules have become smaller and lighter, and it is expected that the substrate of the element unit can be made thinner. However, when the thickness of the substrate is thin, For example, in a substrate or the like on which a multilayer film is formed by sputtering or the like, there is a problem that the substrate is subjected to bending deformation due to film stress (compression stress) of the multilayer film.
在日本特開2010-21985號公報記載之使用最小二乘法算出近似成像面的方法係於攝像元件之攝像面全面以相同狀態傾斜變形而在全評價點之相對位置同樣地傾斜的狀態時,被算出之近似成像面成為已矯正傾斜之面(垂直的面)。另外,在攝像面全面呈波浪狀變形而全評價點之相對位置包含一定誤差的情況,被算出之近似成像面亦成為包含一定誤差在內的面。因此,於基板以相同狀態變形之情況下,即使在習知技術之方法中亦不會有問題。The method of calculating the approximate imaging surface by the least squares method described in Japanese Laid-Open Patent Publication No. 2010-21985 is a state in which the imaging surface of the imaging element is tilted in the same state and is tilted in the same position at the full evaluation point. The approximated image plane calculated is the surface that has been corrected to be inclined (vertical surface). Further, when the imaging surface is completely deformed in a wave shape and the relative position of the full evaluation point includes a certain error, the approximated imaging surface to be calculated also becomes a surface including a certain error. Therefore, in the case where the substrate is deformed in the same state, there is no problem even in the method of the prior art.
然而,在基板發生局部變形之情況下,則會變得無法獲得已矯正此變形的近似成像面。例如,如第26A圖所示,攝像面200之一部分200a發生了變形。在此情況下,在處於對焦程度高之位置上的對焦評價值201的一部分含有異常值201a。在將最小二乘法使用於目標函數之情況下,異常值201a未被反映在近似成像面202上,所以造成攝像面200之一部分200a的解析度極端地下降。又,第26A圖中,水平方向為Z軸方向,垂直方向為Y軸方向,在假設空間內之對焦評價值係與基板之變形方向相比下以左右逆轉之方向來表示。However, in the case where the substrate is locally deformed, it becomes impossible to obtain an approximate image plane in which the deformation has been corrected. For example, as shown in Fig. 26A, one portion 200a of the imaging surface 200 is deformed. In this case, a part of the in-focus evaluation value 201 at a position where the degree of focusing is high includes an abnormal value 201a. In the case where the least square method is used for the objective function, the abnormal value 201a is not reflected on the approximate imaging plane 202, so that the resolution of one portion 200a of the imaging surface 200 is extremely lowered. Further, in Fig. 26A, the horizontal direction is the Z-axis direction, and the vertical direction is the Y-axis direction, and the in-focus evaluation value in the assumed space is expressed by the direction in which the direction is reversed from the direction in which the substrate is deformed.
本發明之目的在於,藉由基板之局部變形,對解析度 變不均等之攝像元件,能平衡感良好地調整整個攝像面的解析度。The object of the present invention is to solve the resolution by local deformation of the substrate. The imaging element that is unevenly adjusted can adjust the resolution of the entire imaging surface with a good balance.
為了解決上述課題,本發明之攝像元件的位置調整方法、及相機模組之製造方法,包括:攝像步驟、對焦座標值取得步驟、插補步驟、Z軸座標值取得步驟、近似平面運算步驟、估計解析度取得步驟、特定成像平面決定步驟及調整步驟。In order to solve the above problems, the method for adjusting the position of the imaging device of the present invention and the method for manufacturing the camera module include an imaging step, a focus coordinate value acquisition step, an interpolation step, a Z-axis coordinate value acquisition step, an approximate plane calculation step, The resolution acquisition step, the specific imaging plane decision step, and the adjustment step are estimated.
該攝像步驟係沿著與測量圖表垂直之Z軸上,一面使該攝影透鏡或該攝像元件之任一方依序朝各測量座標值(Z軸上之各測量位置)移動,一面於各測量座標值上以攝像元件拍攝測量圖表。該對焦座標值取得步驟係根據從設定於該攝像元件之攝像面上的複數個攝像區域,例如中央部分及2個以上之周邊部分所獲得之攝像信號,算出表示在各個攝像區域之對焦程度的個別對焦評價值。此對焦評價值係按每個測量座標值算出。該插補步驟係插補該各攝像區域中之該Z軸上的每個測量座標值的對焦評價值,算出連續對焦評價值資料。該Z軸座標值取得步驟係求取設定於該攝像面中央之攝像區域的連續對焦評價值資料之峰值的Z軸座標值。該近似平面運算步驟係在將至少3個以上之評價點繪製於組合該XY座標平面及Z軸而成的三維座標系,該至少3個以上的評價點係以使該攝像面與垂直於Z軸之XY座標平面對應時的各攝像區域之XY座標軸、及該Z軸上之測量座標值的組合來表示。根據此等評價點之相對位置,算出在該三維座標系中作為一平面而被表示之近似平面。該估計解析度取得步驟首先以該近似平面與該Z軸之交點成為該Z軸座標值的方式移動該近似平面。從以此移動位置為中心而能繞該X、Y軸移動之複數個成像平面與該各連續對焦評價資料的交點,求取各成像平面中之各攝像區域的估計解析度。該特定成像平面決定步驟係根據表示該估計解析度之偏差的平衡評價值來決定特定成像平面。該調整步驟係算出作為該Z軸與該特定成像平面之交點的成像面座標值,及相對於該XY座標平面之該特定成像平面的繞X軸及Y軸的旋轉角度,使該攝像面與該特定之成像平面一致。該相機模組之製造方法,更包含:在對於該攝影透鏡已調整了攝像元件之位置的狀態下,將該透鏡單元與該元件單元固定在一起之步驟。The imaging step is performed by moving either one of the photographic lens or the imaging element toward each measurement coordinate value (each measurement position on the Z axis) along the Z axis perpendicular to the measurement chart, and at each measurement coordinate The measurement chart is taken with the imaging element. The focus coordinate value obtaining step calculates the degree of focus indicating the respective imaging regions based on the imaging signals obtained from a plurality of imaging regions set on the imaging surface of the imaging device, for example, the central portion and two or more peripheral portions. Individual focus evaluation values. This focus evaluation value is calculated for each measurement coordinate value. The interpolation step interpolates the in-focus evaluation value of each measurement coordinate value on the Z-axis in each of the imaging regions, and calculates the continuous focus evaluation value data. The Z-axis coordinate value obtaining step is to obtain a Z-axis coordinate value of the peak value of the continuous focus evaluation value data of the imaging region set in the center of the imaging surface. The approximate plane calculation step is to draw at least three or more evaluation points on a three-dimensional coordinate system in which the XY coordinate plane and the Z-axis are combined, and the at least three evaluation points are such that the imaging surface is perpendicular to the Z A combination of the XY coordinate axes of the respective imaging regions when the XY coordinate plane of the axis corresponds, and the measured coordinate values on the Z axis. Based on the relative positions of the evaluation points, an approximate plane which is represented as a plane in the three-dimensional coordinate system is calculated. The estimated resolution obtaining step first moves the approximate plane such that the intersection of the approximate plane and the Z-axis becomes the Z-axis coordinate value. The estimated resolution of each imaging region in each imaging plane is obtained from the intersection of a plurality of imaging planes that are movable around the X and Y axes around the movement position and the successive focus evaluation data. The particular imaging plane decision step determines a particular imaging plane based on a balance evaluation value representative of the deviation of the estimated resolution. The adjusting step calculates an imaging surface coordinate value which is an intersection of the Z axis and the specific imaging plane, and a rotation angle about the X axis and the Y axis with respect to the specific imaging plane of the XY coordinate plane, so that the imaging surface is This particular imaging plane is consistent. The method of manufacturing the camera module further includes the step of fixing the lens unit to the component unit in a state where the position of the imaging element has been adjusted for the photographic lens.
以該特定成像面決定步驟包含:對於該各連續對焦評價資料,算出該Z軸方向之每單位長度的解析度變化率的步驟;及將該解析度變化率少之範圍決定為搜索範圍,在此搜索範圍內決定該特定成像平面的步驟較為適宜。以該固定步驟係以紫外線硬化黏著劑將該透鏡單元與該元件單元黏著在一起較為適宜。The specific imaging plane determining step includes: a step of calculating a resolution change rate per unit length in the Z-axis direction for each of the continuous focus evaluation data; and determining a range in which the resolution change rate is small as a search range, The step of determining the particular imaging plane within this search range is preferred. It is preferable to adhere the lens unit to the element unit by the fixing step with an ultraviolet curing adhesive.
本發明之相機模組製造裝置,其包含:測量圖表、透鏡單元保持部、元件單元保持部、測量位置移動部、攝像元件控制部、對焦座標值取得部、插補部、Z軸座標值取得部、近似平面運算部、估計解析度取得部、特定成像平面決定部、調整部、及固定部。The camera module manufacturing apparatus of the present invention includes: a measurement chart, a lens unit holding unit, an element unit holding unit, a measurement position moving unit, an imaging element control unit, a focus coordinate value acquisition unit, an interpolation unit, and a Z-axis coordinate value acquisition. Part, approximate plane calculation unit, estimated resolution acquisition unit, specific imaging plane determination unit, adjustment unit, and fixed unit.
於該測量圖表上形成有測量圖形。透鏡單元保持部係將安裝有攝影透鏡之透鏡單元保持並設定於與該測量圖表垂直之Z軸上。元件單元保持部係將安裝有攝像元件之元件單元保持並設定於該Z軸上,並使該元件單元之Z軸上的位置、及繞與該Z軸垂直之X軸及Y軸的傾斜變化。該測量位置移動部係使該透鏡單元保持部或該元件單元保持部之任一方朝預先分散地設定於該Z軸上之各測量座標值移動。該攝像元件控制部係於該Z軸上之測量座標值的各值上,使該攝像元件拍攝圖表圖像。對焦座標值取得部係將設定於該攝像元件之攝像面上的中央部分及2個以上之周邊部分作為攝像區域,根據從此等區域獲得之攝像信號,按該Z軸上之每個測量座標值算出表示在各攝像區域之對焦程度的個別對焦評價值。該插補部係插補該各攝像區域中之該Z軸上的每個測量座標值的對焦評價值,算出連續對焦評價值資料。該Z軸座標值取得部係求取設定於該攝像面中央之攝像區域中的連續對焦評價值資料的峰值之Z軸座標值。該近似平面運算部係使用至少3個以上的評價點,該至少3個以上的評價點係以使該攝像面與垂直於Z軸之XY座標平面對應時的各攝像區域之XY座標軸、及該Z軸上之測量座標值的組合來表示。在將至少3個以上的評價點繪製於使該XY座標平面及Z軸組合而成的三維座標系時,根據此等評價點之相對位置,算出在該三維座標系中作為一平面而被表示之近似平面。該估計解析度取得部係以該近似平面與該Z軸之交點成為該Z軸座標值的方式使該近似平面移動。根據以此位置為中心而能繞該X、Y軸移動之複數個成像平面與該各連續對焦評價資料的交點,求取各成像平面中之各攝像區域的估計解析度。該特定成像平面決定部係根據表示該估計解析度之偏差的平衡評價值來決定特定成像平面。該調整部係算出作為該Z軸與該特定成像平面之交點的成像面座標值,及相對於該XY座標平面之該特定成像平面的繞X軸及Y軸的旋轉角度,使該攝像面與該特定成像平面一致。該固定部係在相對於該攝影透鏡已調整了攝像元件之位置的狀態下,將該透鏡單元與該元件單元固定在一起。A measurement pattern is formed on the measurement chart. The lens unit holding unit holds and sets the lens unit on which the photographic lens is mounted on the Z axis perpendicular to the measurement chart. The element unit holding unit holds and sets the element unit on which the image pickup element is mounted on the Z axis, and changes the position on the Z axis of the element unit and the X axis and the Y axis perpendicular to the Z axis. . The measurement position moving unit moves one of the lens unit holding unit or the element unit holding unit to each measurement coordinate value set in advance on the Z axis in advance. The imaging element control unit is configured to capture a chart image on each value of the measurement coordinate value on the Z axis. The focus coordinate value acquisition unit sets a central portion and two or more peripheral portions set on the imaging surface of the imaging element as an imaging region, and measures the coordinate value for each of the Z-axis based on the imaging signals obtained from the regions. An individual focus evaluation value indicating the degree of focus in each imaging area is calculated. The interpolation unit interpolates the in-focus evaluation value of each measurement coordinate value on the Z axis in each of the imaging regions, and calculates the continuous focus evaluation value data. The Z-axis coordinate value acquisition unit obtains a Z-axis coordinate value of a peak value of the continuous focus evaluation value data set in the imaging region at the center of the imaging surface. The approximate plane calculation unit uses at least three or more evaluation points, and the at least three or more evaluation points are XY coordinate axes of the imaging regions when the imaging surface corresponds to the XY coordinate plane perpendicular to the Z axis, and A combination of measured coordinate values on the Z axis is represented. When at least three or more evaluation points are drawn on a three-dimensional coordinate system in which the XY coordinate plane and the Z-axis are combined, the relative position of the evaluation points is calculated and expressed as a plane in the three-dimensional coordinate system. Approximate plane. The estimated resolution acquisition unit moves the approximate plane such that the intersection of the approximate plane and the Z-axis becomes the Z-axis coordinate value. The estimated resolution of each imaging region in each imaging plane is obtained from the intersection of a plurality of imaging planes that are movable about the X and Y axes around the position and the successive focus evaluation data. The specific imaging plane determining unit determines a specific imaging plane based on a balance evaluation value indicating a deviation of the estimated resolution. The adjustment unit calculates an imaging surface coordinate value which is an intersection of the Z axis and the specific imaging plane, and a rotation angle about the X axis and the Y axis with respect to the specific imaging plane of the XY coordinate plane, so that the imaging surface is This particular imaging plane is consistent. The fixing portion fixes the lens unit and the element unit in a state where the position of the image pickup element has been adjusted with respect to the photographic lens.
以該特定成像面決定部係算出該各連續對焦評價資料中之該Z軸方向的每單位長度的解析度變化率,並將此解析度變化率少之範圍決定為搜索範圍,在該搜索範圍內決定該特定之成像平面較為適宜。本發明之相機模組係藉由相機模組之製造方法所製造。The specific imaging plane determining unit calculates a resolution change rate per unit length in the Z-axis direction of each of the continuous focus evaluation data, and determines a range in which the resolution change rate is small as a search range, and the search range is It is appropriate to determine this particular imaging plane. The camera module of the present invention is manufactured by a manufacturing method of a camera module.
作為攝像區域,可為中央部分及2個以上之周邊部分,又以中央部分及4個以上之周邊部分更為適宜。作為特定成像平面之決定方法,係能以該平衡評價值滿足預先決定之規格值的方式來決定成像平面,亦能以該平衡評價值成為最小的方式來決定成像平面。The imaging area may be a central portion and two or more peripheral portions, and a central portion and four or more peripheral portions are more preferable. As a method of determining the specific imaging plane, the imaging plane can be determined such that the balance evaluation value satisfies a predetermined specification value, and the imaging plane can be determined such that the balance evaluation value is minimized.
針對各攝像區域,將對焦評價值成為最大之測量座標值的Z軸上之位置作為對焦座標值。藉此,可根據對焦評價值成為最高之Z軸上的位置,調整攝像元件之位置。For each imaging area, the position on the Z-axis where the focus evaluation value becomes the largest measurement coordinate value is used as the focus coordinate value. Thereby, the position of the imaging element can be adjusted based on the position on the Z axis where the focus evaluation value becomes the highest.
另外,在對焦座標值之取得中,亦可針對各攝像區域,在Z軸方向上相鄰之測量位置之間依序比較按複數個測量座標值之每個值所算出的各對焦評價值,在對焦評價值以規定次數連續地降低時,中止攝影透鏡或攝像元件朝測量座標值之移動。在此情況下,可將對焦評價值降低之前的測量位置(Z軸上之座標值)作為對焦座標值。藉此,不需要在所有測量座標值取得對焦評價值,所以可縮短取得對焦座標值所需之時間。In addition, in the acquisition of the focus coordinate value, each focus evaluation value calculated by each value of the plurality of measurement coordinate values may be sequentially compared between the measurement positions adjacent to each other in the Z-axis direction. When the focus evaluation value is continuously decreased by a predetermined number of times, the movement of the photographic lens or the imaging element toward the measurement coordinate value is suspended. In this case, the measurement position (the coordinate value on the Z axis) before the focus evaluation value is lowered can be used as the focus coordinate value. Thereby, it is not necessary to obtain the in-focus evaluation value at all measurement coordinate values, so the time required to obtain the focus coordinate value can be shortened.
又,在其他之對焦座標值之取得中,亦可針對各攝像區域,從複數個評價點生成近似曲線,將與從此近似曲線中求得之最大對焦評價值對應的Z軸上之位置作為對焦座標值,該複數個評價點係以複數個測量座標值及對應於該複數個測量座標值之各對焦評價值的組合來表示。藉此,無需實際測量各攝像區域之對焦評價值的最大值便可求取,所以與實際測量最大值之情況相比,可縮短時間。另外,根據對焦評價值的最大值,可求取對焦座標值,所以可提高調整精度。Further, in the acquisition of the other focus coordinate values, an approximate curve may be generated from the plurality of evaluation points for each imaging region, and the position on the Z-axis corresponding to the maximum focus evaluation value obtained from the approximate curve may be used as the focus. The coordinate value, the plurality of evaluation points are represented by a combination of a plurality of measurement coordinate values and respective in-focus evaluation values corresponding to the plurality of measurement coordinate values. Thereby, it is not necessary to actually measure the maximum value of the in-focus evaluation value of each imaging area, so that the time can be shortened compared with the case where the maximum value is actually measured. In addition, according to the maximum value of the focus evaluation value, the focus coordinate value can be obtained, so the adjustment accuracy can be improved.
又,在其他之對焦座標值之取得中,亦可針對各攝像區域,分別算出預先決定之指定值與按複數個測量座標值之每個值算出的各對焦評價值之差值,將差值最小之測量位置的Z軸上之座標值作為對焦座標值。藉此,能以與方方面面取得良好之平衡地使各攝像區域之對焦評價值達成一致,所以可提高畫面質量。Further, in the acquisition of the other focus coordinate values, the difference between the predetermined designated value and each focus evaluation value calculated for each of the plurality of measurement coordinate values may be calculated for each imaging region, and the difference may be calculated. The coordinate value on the Z axis of the smallest measurement position is used as the focus coordinate value. As a result, the in-focus evaluation values of the respective imaging regions can be agreed in a good balance with all aspects, so that the picture quality can be improved.
作為對焦評價值,以使用對比傳遞函數值較為適宜。另外,在對焦座標值之取得中,亦可針對各攝像區域,按複數個測量位置之每個位置,算出有關於設定於XY座標平面上之第1方向與及與第1方向垂直的第2方向上的對比傳遞函數值,且對於各攝像區域,按第1方向及第2方向之各方向取得個別之第1對焦座標值及第2對焦座標值。在特定成像面之決定中,以從各攝像區域之第1對焦座標值及第2對焦座標值求取至少10點之評價點,根據此等評價點之相對位置算出近似平面較為適宜。藉此,於各攝像區域中,即使於複數個方向的對比傳遞函數值具有偏差情況下,仍可獲得平衡性佳之近似平面。另外,藉由增加評價點,還可提高近似平面之算出精度。As the in-focus evaluation value, it is preferable to use the contrast transfer function value. Further, in the acquisition of the focus coordinate value, the first direction set on the XY coordinate plane and the second direction perpendicular to the first direction may be calculated for each of the plurality of measurement positions for each imaging region. The contrast transfer function value in the direction is obtained, and for each of the imaging regions, the respective first focus coordinate value and second focus coordinate value are obtained in each of the first direction and the second direction. In the determination of the specific imaging plane, it is preferable to obtain an evaluation point of at least 10 points from the first focus coordinate value and the second focus coordinate value of each imaging region, and to calculate an approximate plane based on the relative positions of the evaluation points. Thereby, in each imaging region, even if the values of the contrast transfer function in the plurality of directions have deviations, an approximate plane with good balance can be obtained. In addition, by increasing the evaluation point, the calculation accuracy of the approximate plane can be improved.
作為算出對比傳遞函數值之第1方向及第2方向,以水平方向及垂直方向較為適宜。另外,亦可在攝影透鏡之徑向及與此徑向垂直的垂直方向上,求取對比傳遞函數值。As the first direction and the second direction for calculating the value of the contrast transfer function, it is preferable to use the horizontal direction and the vertical direction. Alternatively, the value of the contrast transfer function can be obtained in the radial direction of the photographic lens and in the vertical direction perpendicular to the radial direction.
設定於攝像面上之至少3個攝像區域,係例如以設定於攝像面之中心、及攝像面之4個象限上中的對角線上的2個較為適宜。在設有5個攝像區域之情況,以設定於攝像面之中心、及攝像面之4個象限上各設定1個較為適宜。另外,在對焦座標值之取得中,以成像於各攝像區域之圖表圖案相同較為適宜。It is preferable to set at least three imaging areas set on the imaging surface, for example, two on the diagonal line set in the center of the imaging surface and the four quadrants of the imaging surface. In the case where five imaging areas are provided, it is preferable to set one of each of the four quadrants set to the center of the imaging surface and the imaging surface. Further, in the acquisition of the focus coordinate value, it is preferable to form the same map pattern for each imaging region.
亦可在調整位置之後,再次取得對焦座標值,針對各攝像區域,確認對焦座標值。另外,亦可反複多次地進行對焦座標值取得步驟、插補步驟、特定成像平面決定步驟及調整步驟,以使攝像面與特定成像平面一致。藉此,可提高調整精度。After adjusting the position, the focus coordinate value can be obtained again, and the focus coordinate value can be confirmed for each imaging area. In addition, the focus coordinate value acquisition step, the interpolation step, the specific imaging plane determination step, and the adjustment step may be performed repeatedly to make the imaging surface coincide with the specific imaging plane. Thereby, the adjustment accuracy can be improved.
元件單元保持部係由保持元件單元之保持機構、使保持機構繞X軸及Y軸傾斜之2軸旋轉台、及使2軸旋轉台沿Z軸方向移動之滑台所構成。元件單元保持部亦可設置電性連接攝像元件及元件控制部之元件連接部。另外,還可於透鏡單元保持部設置AF連接部,該AF連接部電性連接已安裝透鏡單元內之自動焦點機構、及驅動此自動焦點機構之AF驅動器。The element unit holding portion is constituted by a holding mechanism that holds the element unit, a two-axis rotating table that tilts the holding mechanism about the X-axis and the Y-axis, and a slide table that moves the two-axis rotating table in the Z-axis direction. The element unit holding portion may be provided with an element connection portion electrically connected to the image pickup element and the element control portion. In addition, an AF connecting portion that electrically connects the auto focus mechanism in the mounted lens unit and the AF driver that drives the auto focus mechanism may be disposed in the lens unit holding portion.
圖表圖案具有相對於中心位置而沿X軸方向、Y軸方向及2個對角線方向將矩形之圖表面分割而成之8個區域,於分別設於第1至第4象限的2個區域內設置相互垂直之複數條平行的線。藉此,不需要交換測量圖表,亦可應用於使用不同畫角之攝像元件的相機模組之製造。The chart pattern has eight regions in which the surface of the rectangle is divided in the X-axis direction, the Y-axis direction, and the two diagonal directions with respect to the center position, and is disposed in two regions of the first to fourth quadrants, respectively. Set a plurality of parallel lines perpendicular to each other. Thereby, there is no need to exchange measurement charts, and it is also applicable to the manufacture of camera modules using image elements of different angles.
使用於本發明之相機模組的元件單元,係以如下之順序進行位置調整。首先,在與測量圖表垂直之Z軸上設定透鏡單元及元件單元,於Z軸上使攝影透鏡或該攝像元件之任一方依序朝測量座標值(測量位置)移動,以各測量粗座標值拍攝測量圖表。根據從設定於攝像元件之攝像面上的中央部分及4個周邊部分之攝像區域獲得的攝像信號,按Z軸上之每個測量座標值算出表示在各攝像區域的對焦程度之個別對焦評價值。插補各攝像區域中之Z軸上的每個測量座標值的對焦評價值,算出連續對焦評價值資料。The component unit used in the camera module of the present invention is positionally adjusted in the following order. First, the lens unit and the element unit are set on the Z axis perpendicular to the measurement chart, and either the photographic lens or the imaging element is sequentially moved toward the measurement coordinate value (measurement position) on the Z axis to measure the coarse coordinate value. Take a measurement chart. The individual focus evaluation value indicating the degree of focus in each imaging area is calculated for each of the measurement coordinate values on the Z-axis from the imaging signal obtained from the imaging area set on the imaging surface of the imaging element and the four peripheral portions. . The in-focus evaluation value of each measurement coordinate value on the Z axis in each imaging area is interpolated, and the continuous focus evaluation value data is calculated.
其次,求取設定於攝像面中央之攝像區域的連續對焦評價值資料之峰值的Z軸座標值。在將至少5個評價點展開於組合XY座標平面及Z軸而成的三維座標系時,根據此等評價點之相對位置,算出在三維座標系中作為一平面而被表示之近似平面,而該至少5個評價點係以使該攝像面與垂直於Z軸之XY座標平面對應時的各攝像區域之XY座標軸、及Z軸上之測量座標值的組合來表示。以該近似平面與Z軸之交點成為Z軸座標值的方式移動此近似平面,根據以此位置為中心而能繞該X、Y軸移動之複數個成像平面與各連續對焦評價資料的交點,求取各成像平面中之各攝像區域的估計解析度。根據從各攝像平面中表示每個攝像區域之估計解析度之偏差的平衡評價值來決定特定成像平面。算出作為Z軸與特定成像平面之交點的成像面座標值,及對於XY座標平面之特定成像平面的繞X軸及Y軸的旋轉角度。以使攝像面與特定之成像平面一致之方式,調整攝像元件之Z軸上的位置及繞X軸及Y軸的傾斜。Next, the Z-axis coordinate value of the peak value of the continuous focus evaluation value data of the imaging area set in the center of the imaging surface is obtained. When at least five evaluation points are developed on a three-dimensional coordinate system in which the XY coordinate plane and the Z-axis are combined, the approximate plane represented as a plane in the three-dimensional coordinate system is calculated based on the relative positions of the evaluation points, and The at least five evaluation points are represented by a combination of the XY coordinate axes of the respective imaging regions when the imaging surface corresponds to the XY coordinate plane perpendicular to the Z axis, and the measured coordinate values on the Z axis. Moving the approximate plane in such a manner that the intersection of the approximate plane and the Z-axis becomes the Z-axis coordinate value, and the intersection of the plurality of imaging planes that can move around the X and Y axes with the continuous focus evaluation data according to the position. The estimated resolution of each imaging region in each imaging plane is obtained. The specific imaging plane is determined based on the balance evaluation value indicating the deviation of the estimated resolution of each imaging region from each imaging plane. The image plane coordinate value as the intersection of the Z axis and the specific imaging plane, and the rotation angle around the X axis and the Y axis for a specific imaging plane of the XY coordinate plane are calculated. The position of the imaging element on the Z-axis and the tilt around the X-axis and the Y-axis are adjusted so that the imaging surface coincides with the specific imaging plane.
本發明中,對於移動近似平面而獲得之成像平面,按每個攝像區域求取估計解析度,並從此估計解析度算出表示估計解析度之偏差的平衡評價值。根據此平衡評價值從 各成像平面中決定特定成像平面,所以藉由安裝有攝像元件之基板的變形等,即使於攝像面之局部存在有解析度極低的部分的情況下,仍可提高降低部分之解析度,整個成像面可調整成平衡性佳的解析度。In the present invention, the imaging plane obtained by moving the approximate plane is obtained for each imaging region, and an estimated evaluation value indicating the deviation of the estimated resolution is calculated from the estimated resolution. According to this balance evaluation value from Since a specific imaging plane is determined in each imaging plane, even if there is a portion having a very low resolution in a portion of the imaging surface by deformation or the like of the substrate on which the imaging element is mounted, the resolution of the reduced portion can be improved. The imaging surface can be adjusted to a well-balanced resolution.
於第1及第2圖中,相機模組2係設計成例如具有一邊為10mm左右之尺寸的箱形形狀。於相機模組2之前面中央形成有攝影開口5。於攝影開口5之深處配置有攝影透鏡6。於相機模組2前面之角部設有用於相機模組2之製造時的定位之定位用凹部。本實施形態中,於3個角部上設有定位用凹部7~9。在位於1條對角線上之2個定位用凹部7,9之大致中央形成有定位用孔7a,9a。藉此,用以高精度地限制空間上之絕對位置及傾斜。In the first and second figures, the camera module 2 is designed to have, for example, a box shape having a size of about 10 mm on one side. A photographing opening 5 is formed in the center of the front surface of the camera module 2. A photographic lens 6 is disposed deep in the photographic opening 5. A positioning recess for positioning the camera module 2 during manufacture is provided at a corner of the front surface of the camera module 2. In the present embodiment, the positioning recesses 7 to 9 are provided at the three corner portions. Positioning holes 7a, 9a are formed in substantially the center of the two positioning recesses 7, 9 located on one diagonal line. Thereby, the absolute position and inclination in space are restricted with high precision.
於相機模組2之背面形成有矩形開口11。此開口11係用以使內建於相機模組2內之攝像元件12的背面所設之複數個接點13露出。A rectangular opening 11 is formed on the back surface of the camera module 2. The opening 11 is for exposing a plurality of contacts 13 provided on the back surface of the imaging element 12 built in the camera module 2.
如第3圖所示,相機模組2係由已安裝攝影透鏡6之透鏡單元15及已安裝攝像元件12的元件單元16構成。元件單元16係安裝於透鏡單元15之背面側。As shown in FIG. 3, the camera module 2 is composed of a lens unit 15 to which the imaging lens 6 is mounted and an element unit 16 to which the imaging element 12 is mounted. The element unit 16 is attached to the back side of the lens unit 15.
如第4圖所示,透鏡單元15係由設計成方筒形之單元本體19、安裝此單元本體19內之透鏡鏡筒20、及固定於單元本體19之前面側的前罩21所構成。於前罩21上設有攝影開口5、定位用凹部7~9等。單元本體19、透鏡鏡筒20及前罩21係由例如塑膠所形成。As shown in Fig. 4, the lens unit 15 is composed of a unit body 19 designed in a rectangular tube shape, a lens barrel 20 mounted in the unit body 19, and a front cover 21 fixed to the front side of the unit body 19. The front cover 21 is provided with a photographing opening 5, positioning recesses 7 to 9, and the like. The unit body 19, the lens barrel 20, and the front cover 21 are formed of, for example, plastic.
透鏡鏡筒20係設計成圓筒形,於其內部安裝有例如構成3組之攝影透鏡6。透鏡鏡筒20係被保持於單元本體19之前面所安裝的金屬製簧片24上,藉由簧片24之彈性而形成為可朝光軸S方向自由移動。The lens barrel 20 is designed in a cylindrical shape, and for example, three groups of photographic lenses 6 are mounted inside. The lens barrel 20 is held by a metal spring 24 attached to the front surface of the unit body 19, and is formed to be freely movable in the direction of the optical axis S by the elasticity of the spring 24.
於透鏡鏡筒20之外周與單元本體19的內周,以對置之方式安裝有永久磁鐵25及電磁鐵26,用以實現自動聚焦功能。電磁鐵26係利用轉換供給之電流的方向而使極性變化。透鏡鏡筒20係藉由永久磁鐵25因應電磁鐵26之極性變化而被排斥或吸引,朝光軸S方向移動以調整焦點。將電流供給於電磁鐵26之接點26a,係以從單元本體19之下面露出的方式所設置。又,作為為了自動聚焦功能而使透鏡鏡筒20移動的驅動機構,採用脈衝馬達+進給螺桿、壓電振動器+慣性機構等。A permanent magnet 25 and an electromagnet 26 are attached to the outer circumference of the lens barrel 20 and the inner circumference of the unit body 19 so as to achieve an autofocus function. The electromagnet 26 changes the polarity by switching the direction of the supplied current. The lens barrel 20 is repelled or attracted by the permanent magnet 25 in response to a change in polarity of the electromagnet 26, and is moved in the direction of the optical axis S to adjust the focus. The current is supplied to the contact 26a of the electromagnet 26 so as to be exposed from the lower surface of the unit body 19. Further, as a drive mechanism for moving the lens barrel 20 for the autofocus function, a pulse motor + a feed screw, a piezoelectric vibrator + an inertial mechanism, or the like is used.
元件單元16係由形成為矩形框狀之元件框29、及以攝像面12a朝向透鏡單元15側之方式安裝於元件框29內之攝像元件12所構成。元件框29係由例如塑膠所形成。The element unit 16 is composed of an element frame 29 formed in a rectangular frame shape and an imaging element 12 mounted in the element frame 29 such that the imaging surface 12a faces the lens unit 15 side. The component frame 29 is formed of, for example, plastic.
於元件框29之前面側面、單元本體19之側面及背面之間的角部,分別設有4個嵌合片32、及嵌合有此等嵌合片32之凹狀嵌合槽33。於此等嵌合片32與嵌合槽33的嵌合之後,藉由朝嵌合槽33內注入黏著劑,用以黏固透鏡單元15及元件單元16。Four fitting pieces 32 and concave fitting grooves 33 into which the fitting pieces 32 are fitted are provided at the front side surface of the element frame 29 and the corner between the side surface and the back surface of the unit main body 19. After the fitting piece 32 is fitted to the fitting groove 33, the lens unit 15 and the element unit 16 are adhered by injecting an adhesive into the fitting groove 33.
於單元本體19之背面設有一對缺口36。由第7圖中明顯可知,此等缺口36在Y方向上之位置不同。另外,於元件框29之兩側面設有一對凹部37。缺口36及凹部37係於透鏡單元15及元件單元16之組裝時,用於對雙方進行定位及保持。單元本體19及元件框29係藉由射出成形所形成,為了脫模之需要,將側面設計成平坦之錐形。在此,為了確保平面性,設有缺口36及凹部37。因此,於組裝時,在保持無錐形之面的情況下,亦可不設置缺口36及凹部37。A pair of notches 36 are provided on the back surface of the unit body 19. As is apparent from Fig. 7, the positions of the notches 36 in the Y direction are different. Further, a pair of concave portions 37 are provided on both side faces of the element frame 29. The notch 36 and the recess 37 are used to position and hold both of the lens unit 15 and the element unit 16 when assembled. The unit body 19 and the element frame 29 are formed by injection molding, and the side surface is designed to have a flat taper for the purpose of demolding. Here, in order to ensure planarity, a notch 36 and a recess 37 are provided. Therefore, in the case of maintaining the surface having no taper at the time of assembly, the notch 36 and the recessed portion 37 may not be provided.
然後,參照第5圖,針對相機模組製造裝置之構成進行說明。相機模組製造裝置40係用以調整元件單元16相對於該透鏡單元15之位置。於調整位置之後,以黏著劑將元件單元16固定於該透鏡單元15,完成相機模組。相機模組製造裝置40係由例如圖表單元41、聚光單元42、透鏡定位板43、透鏡保持機構44、元件移動機構45、黏著劑供給器46、紫外線燈47、及控制此等構件之控制部48所構成。此等構件被設置於共同之作業台49上。Next, the configuration of the camera module manufacturing apparatus will be described with reference to Fig. 5 . The camera module manufacturing device 40 is for adjusting the position of the component unit 16 with respect to the lens unit 15. After the position is adjusted, the component unit 16 is fixed to the lens unit 15 with an adhesive to complete the camera module. The camera module manufacturing apparatus 40 is controlled by, for example, a chart unit 41, a condensing unit 42, a lens positioning plate 43, a lens holding mechanism 44, a component moving mechanism 45, an adhesive supplier 46, an ultraviolet lamp 47, and control of these components. The department 48 is composed of. These components are disposed on a common work surface 49.
圖表單元41係由圖表箱體41a、收容於此圖表箱體41a內之測量圖表52及光源53所構成。測量圖表52係例如具有透光性之塑膠板,而以設計成乳白色之塑膠板較為適宜。此測量圖表52係被來自光源53之平行照明光從背面所照明。The chart unit 41 is composed of a chart box 41a, a measurement chart 52 housed in the chart box 41a, and a light source 53. The measurement chart 52 is, for example, a translucent plastic plate, and a plastic plate designed to be milky white is suitable. This measurement chart 52 is illuminated from the back side by parallel illumination light from source 53.
如第6圖所示,測量圖表52係設計成四方形,於表面(圖表面)印刷有圖表圖案。圖表圖案係於中心52a及上、左下、右上、右下具有第1~第5圖表圖像56~60。第1~第5圖表圖像56~60全部為相同之圖像,是以規定間隔排列黑線而成之所謂方向舵狀的圖表,該等圖像係分別由水平方向排列之水平圖表圖像56a~60a、及垂直方向排列之垂直圖表圖像56b~60b所構成。As shown in Fig. 6, the measurement chart 52 is designed in a square shape, and a chart pattern is printed on the surface (the surface of the figure). The chart pattern has the first to fifth chart images 56 to 60 at the center 52a and the upper, lower left, upper right, and lower right. The first to fifth chart images 56 to 60 are all the same image, and are rudder-like charts in which black lines are arranged at predetermined intervals, and the images are horizontal chart images 56a arranged in the horizontal direction. ~60a and vertical chart images 56b to 60b arranged in the vertical direction.
聚光單元42係在與測量圖表52之中心52a垂直的Z軸上,以與圖表單元41對面之方式配置。聚光單元42係由固定於作業台49上之支架42a及聚光透鏡42b所構成。聚光透鏡42b係對從圖表單元41放射之光線進行聚光,並通過形成於支架42a上之開口42c射入透鏡單元15。The condensing unit 42 is disposed on the Z axis perpendicular to the center 52a of the measurement chart 52 so as to face the chart unit 41. The condensing unit 42 is composed of a holder 42a and a condensing lens 42b that are fixed to the work table 49. The condensing lens 42b condenses the light emitted from the chart unit 41, and enters the lens unit 15 through the opening 42c formed in the holder 42a.
透鏡定位板43係為了獲得剛性而由例如金屬所製作而成,並設有使藉聚光單元42進行聚光之光線通過的開口43a。The lens positioning plate 43 is made of, for example, metal in order to obtain rigidity, and is provided with an opening 43a through which light collected by the condensing unit 42 passes.
如第7圖所示,在透鏡定位板43之一面、即與透鏡保持機構44相對之面,於開口43a之周圍設有3個抵接銷63~65。於3個抵接銷63~65當中之配置於對角線上的2個抵接銷63,65之前端,設有小徑之插入銷63a,65a。當抵接銷63~65進入透鏡單元15之定位用凹部7~9內時,插入銷63a,65a被插入定位用孔7a,9a中,對透鏡單元15進行定位。As shown in Fig. 7, on one surface of the lens positioning plate 43, that is, the surface facing the lens holding mechanism 44, three abutting pins 63 to 65 are provided around the opening 43a. Among the three abutting pins 63 to 65, the front end of the two abutting pins 63, 65 disposed on the diagonal line are provided with small-diameter insertion pins 63a, 65a. When the abutment pins 63 to 65 enter the positioning recesses 7 to 9 of the lens unit 15, the insertion pins 63a, 65a are inserted into the positioning holes 7a, 9a, and the lens unit 15 is positioned.
透鏡保持機構44係由在Z軸上以前面朝向圖表單元41之方式保持透鏡單元15之保持板68、及使此保持板68朝Z軸方向移動之第1滑台69所構成。如第7圖所示,保持板68具備:水平基部68a,係保持於第1滑台69之台部69a;及一對保持臂68b,係從水平基部68a朝上方及水平方向突出設置而嵌合於透鏡單元15之一對缺口36中。The lens holding mechanism 44 is constituted by a holding plate 68 that holds the lens unit 15 so as to face the chart unit 41 on the Z axis, and a first slide table 69 that moves the holding plate 68 in the Z-axis direction. As shown in Fig. 7, the holding plate 68 includes a horizontal base portion 68a that is held by the table portion 69a of the first slide table 69, and a pair of holding arms 68b that are protruded upward and horizontally from the horizontal base portion 68a. It is incorporated in one of the pair of lens units 15 in the notch 36.
於保持板68上安裝有具備與電磁鐵26之接點26a接觸的複數根探針70a之第1探針單元70。第1探針單元70係用以電性連接電磁鐵26及AF驅動器84(參照第8圖)。A first probe unit 70 having a plurality of probes 70a that are in contact with the contact 26a of the electromagnet 26 is attached to the holding plate 68. The first probe unit 70 is for electrically connecting the electromagnet 26 and the AF driver 84 (see Fig. 8).
第1滑台69係被稱為所謂自動精密台者,藉由未圖示之馬達的旋轉而使滾珠螺桿旋轉,以使嚙合於此滾珠螺桿之台部69a水平地移動。The first slide table 69 is called a so-called automatic precision stage, and the ball screw is rotated by the rotation of a motor (not shown) to horizontally move the table portion 69a that meshes with the ball screw.
元件移動機構45係由卡盤(chuck hand)72、2軸旋轉台74、及第2滑台76所構成。卡盤72係於Z軸上以攝像面12a朝向圖表單元41之方式保持元件單元16。2軸旋轉台74係保持安裝有卡盤72之曲柄狀的支架73,繞與Z軸垂直之2軸來調整傾斜。第2滑台76係保持安裝有2軸旋轉台74之支架75而使此支架朝Z軸方向移動。The component moving mechanism 45 is composed of a chuck hand 72, a two-axis rotating table 74, and a second sliding table 76. The chuck 72 is attached to the Z-axis to hold the component unit 16 such that the imaging surface 12a faces the chart unit 41. The 2-axis rotary table 74 holds a crank-shaped bracket 73 on which the chuck 72 is mounted, and is wound around two axes perpendicular to the Z-axis. To adjust the tilt. The second slide table 76 holds the holder 75 to which the two-axis rotary table 74 is attached, and moves the holder in the Z-axis direction.
如第7圖所示,卡盤72係由彎曲成曲柄狀之一對挾持構件72a、及使此等挾持構件72a在與Z軸垂直之X軸方向上移動的致動器72b所構成。挾持構件72a係將元件單元16夾入元件框29之凹部37內來保持元件單元16。另外,卡盤72係以攝影透鏡6之光軸中心與攝像面12a的中心12b大致一致之方式,對被挾持於挾持構件72a之元件單元16進行定位。As shown in Fig. 7, the chuck 72 is composed of one of the gripping members 72a bent in a crank shape and an actuator 72b that moves the gripping members 72a in the X-axis direction perpendicular to the Z-axis. The holding member 72a holds the component unit 16 into the recess 37 of the component frame 29 to hold the component unit 16. Further, the chuck 72 positions the component unit 16 held by the holding member 72a so that the optical axis center of the imaging lens 6 substantially coincides with the center 12b of the imaging surface 12a.
2軸旋轉台74係被稱為所謂自動2軸測角台,藉由未圖示之2個馬達之旋轉,以攝像面12a的中心12b為中心,使元件單元16在繞X軸之θ方向、及繞垂直於Z軸及X軸之Y軸的Φ方向傾斜。藉此,於使元件單元16朝各方向傾斜時,不會有攝像面12a的中心12b與Z軸之位置關係的偏移。The two-axis rotating table 74 is referred to as a so-called automatic two-axis horn, and the element unit 16 is oriented in the θ direction around the X-axis centering on the center 12b of the imaging surface 12a by rotation of two motors (not shown). And tilting in the Φ direction about the Y axis perpendicular to the Z axis and the X axis. Thereby, when the element unit 16 is tilted in each direction, there is no offset in the positional relationship between the center 12b of the imaging surface 12a and the Z axis.
第2滑台76係用以使測量位置(測量座標值)移動者,其經由2軸旋轉台74而使元件單元16朝Z軸方向移動。又,第2滑台76係在尺寸等上與第1滑台69不同之外,其餘均為相同之構造,故而省略詳之說明。The second stage 76 is configured to move the measurement position (measurement coordinate value), and the element unit 16 is moved in the Z-axis direction via the two-axis rotary table 74. Further, the second slide table 76 has the same structure as the first slide table 69 in terms of size and the like, and the detailed description thereof is omitted.
於2軸旋轉台74上安裝有用以電性連接攝像元件12及攝像元件驅動器85(參照第8圖)之第2探針單元79。此第2探針單元79具有通過元件單元16之開口11而接觸於攝像元件12之各接點13的複數根探針79a。A second probe unit 79 for electrically connecting the imaging element 12 and the imaging element driver 85 (see FIG. 8) is mounted on the two-axis rotating table 74. The second probe unit 79 has a plurality of probes 79a that are in contact with the respective contacts 13 of the imaging element 12 through the opening 11 of the element unit 16.
黏著劑供給器46係於元件單元16之位置調整結束,而將元件單元16之嵌合片32嵌合於透鏡單元15之嵌合部33時,朝嵌合部33內供給紫外線硬化黏著劑。紫外線燈47係朝嵌合部33照射紫外線而使紫外線硬化黏著劑硬化。本實施形態中,藉由黏著劑供給器46及紫外線燈47,來固定透鏡單元15及元件單元16。又,作為黏著劑,亦可利用瞬間黏著劑、熱硬化黏著劑、自然硬化黏著劑等。When the position adjustment of the adhesive unit 46 is completed in the element unit 16, and the fitting piece 32 of the element unit 16 is fitted to the fitting portion 33 of the lens unit 15, the ultraviolet curing adhesive is supplied into the fitting portion 33. The ultraviolet lamp 47 is irradiated with ultraviolet rays toward the fitting portion 33 to cure the ultraviolet curable adhesive. In the present embodiment, the lens unit 15 and the element unit 16 are fixed by the adhesive supplier 46 and the ultraviolet lamp 47. Further, as the adhesive, an instant adhesive, a heat-curing adhesive, a natural hardening adhesive, or the like can be used.
於第8圖中,控制部48係具備例如CPU、ROM、RAM等之微電腦,其根據儲存於ROM中之控制程式來控制各部分。另外,於控制部48上連接有進行各種設定之鍵盤、滑鼠等之輸入裝置81、及顯示有設定內容、作業內容、作業結果等之監視器82。In Fig. 8, the control unit 48 includes a microcomputer such as a CPU, a ROM, and a RAM, and controls each unit based on a control program stored in the ROM. Further, the control unit 48 is connected to an input device 81 such as a keyboard or a mouse for performing various settings, and a monitor 82 for displaying setting contents, work contents, work results, and the like.
AF驅動器84係驅動電磁鐵26之驅動電路,其經由第1探針單元70供給電流於電磁鐵26。攝像元件驅動器85係驅動攝像元件12之驅動電路,其經由第2探針單元79輸入控制信號於攝像元件12。The AF driver 84 drives a drive circuit of the electromagnet 26, and supplies current to the electromagnet 26 via the first probe unit 70. The imaging element driver 85 drives a driving circuit of the imaging element 12, and inputs a control signal to the imaging element 12 via the second probe unit 79.
對焦座標值取得電路87係在設定於第9圖所示之攝像元件12之攝像面12a上的第1~第5攝像區域89a~89e之Z軸方向上,取得處於對焦程度高之位置的對焦座標值。第1~第5攝像區域89a~89e係設定於攝像面12a之中心12b及左上、左下、右上、右下,而可拍攝測量圖表52之第1~第5圖表圖像56~60。又,測量圖表52係藉由攝像透鏡6而上下左右逆轉地進行成像,所以第2~第5攝像區域89b~89e係分別對被配置於對角線上之相反側的第2~第5圖表圖像57~60進行拍攝。The focus coordinate value acquisition circuit 87 obtains a focus at a position where the focus is high in the Z-axis direction of the first to fifth imaging regions 89a to 89e set on the imaging surface 12a of the imaging device 12 shown in Fig. 9 . Coordinate value. The first to fifth imaging regions 89a to 89e are set at the center 12b and the upper left, lower left, upper right, and lower right of the imaging surface 12a, and the first to fifth chart images 56 to 60 of the measurement chart 52 can be captured. Further, since the measurement chart 52 is imaged upside down and left and right by the imaging lens 6, the second to fifth imaging regions 89b to 89e are respectively arranged on the second to fifth graphs arranged on the opposite side of the diagonal line. Shoot like 57~60.
於取得第1~第5攝像區域89a~89e之對焦座標值時,控制部48係控制第2滑台76,使元件單元16依序朝預先分散地設定於Z軸上之複數個測量位置移動。另外,控制部48係控制攝像元件驅動器85,使攝像元件12在各測量位置上拍攝攝影透鏡6成像之第1~第5圖表圖像56~60的圖表像。When the focus coordinate values of the first to fifth imaging regions 89a to 89e are obtained, the control unit 48 controls the second slider 76 to sequentially move the component unit 16 to a plurality of measurement positions that are previously dispersedly set on the Z axis. . Moreover, the control unit 48 controls the image sensor driver 85 to cause the image pickup device 12 to capture the image images of the first to fifth chart images 56 to 60 imaged by the image pickup lens 6 at the respective measurement positions.
對焦座標值取得電路87首先從經由第2探針單元79輸入之攝像信號中抽取與第1~第5攝像區域89a~89e對應的像素之信號。然後,從該像素信號分別算出對於各第1~第5攝像區域89a~89e之對焦評價值。此對焦評價值係按每個測量位置所算出。在針對第1~第5攝像區域89a~89e之各攝像區域,而獲得了規定範圍內之對焦評價值時,將此測量位置作為Z軸上之測量座標值。The focus coordinate value acquisition circuit 87 first extracts signals of pixels corresponding to the first to fifth imaging regions 89a to 89e from the imaging signals input via the second probe unit 79. Then, the in-focus evaluation values for the respective first to fifth imaging regions 89a to 89e are calculated from the pixel signals. This focus evaluation value is calculated for each measurement position. When the in-focus evaluation value within the predetermined range is obtained for each of the first to fifth imaging regions 89a to 89e, the measurement position is taken as the measurement coordinate value on the Z-axis.
於本實施形態中,作為對焦評價值,採用對比傳達函數值(Contrast Transfer Function:以下稱為CTF值)。CTF值係表示相對於空間頻率之像的對比度之值,CTF值高時,可認為是對焦中。CTF值係以輸出值之最大值及最小值的和除以從攝像元件12輸出之攝像信號的輸出值之最大值與最小值的差而求得。例如,在設攝像信號的輸出值之最大值為P,最小值為Q時,CTF值係根據以下之數式(1)所算出。In the present embodiment, a contrast transfer function value (hereinafter referred to as a CTF value) is used as the in-focus evaluation value. The CTF value indicates the value of the contrast with respect to the image of the spatial frequency, and when the CTF value is high, it can be considered to be in focus. The CTF value is obtained by dividing the sum of the maximum value and the minimum value of the output values by the difference between the maximum value and the minimum value of the output values of the image pickup signals output from the image pickup device 12. For example, when the maximum value of the output value of the image pickup signal is P and the minimum value is Q, the CTF value is calculated based on the following equation (1).
CTF值=(P-Q)/(P+Q) ...(1)對焦座標值取得電路87係針對第1~第5攝像區域89a~89e之各攝像區域,按設定於Z軸上之複數個測量位置,對在XY座標平面上設定之複數個方向的各方向,算出CTF值。作為算出CTF值之方向,係任意之第1方向及與此第1方向垂直的第2方向。於本實施形態中,分別算出水平方向(X軸方向)、即攝像面12a之橫向、及與此方向垂直的垂直方向(Y軸方向)之CTF值(H-CTF值及V-CTF值)。另外,對焦座標值取得電路87係針對第1~第5攝像區域89a~89e之各攝像區域,取得H-CTF值及V-CTF值成為最大之測量位置的Z軸上之座標,作為水平對焦座標值及垂直對焦座標值。CTF value=(PQ)/(P+Q) (1) The focus coordinate value acquisition circuit 87 is configured to set a plurality of imaging regions of the first to fifth imaging regions 89a to 89e on the Z axis. The measurement position is calculated for each direction of the plurality of directions set on the XY coordinate plane. The direction in which the CTF value is calculated is an arbitrary first direction and a second direction perpendicular to the first direction. In the present embodiment, the CTF values (H-CTF value and V-CTF value) in the horizontal direction (X-axis direction), that is, the lateral direction of the imaging surface 12a and the vertical direction (Y-axis direction) perpendicular to the direction are calculated. . In addition, the focus coordinate value acquisition circuit 87 acquires the coordinates on the Z-axis of the measurement position where the H-CTF value and the V-CTF value become the maximum for each of the first to fifth imaging regions 89a to 89e as the horizontal focus. Coordinate value and vertical focus coordinate value.
從對焦座標值取得電路87朝插補電路92輸入有第1~第5攝像區域89a~89e之水平對焦座標值及垂直對焦座標值。插補電路92係插補各攝像區域89a~89e中之Z軸上的每個測量座標值的對焦評價值,算出連續對焦評價值資料。藉插補電路92進行之連續對焦評價值資料的算出,例如,係樣條插補各攝像區域89a~89e中之Z軸上的每個測量座標值的對焦評價值,算出連續對焦評價值資料。又,作為插補電路92,不限定於樣條插補,亦能以周知之三次方插補、拉格蘭奇插補、及最近插補等進行插補。The horizontal focus coordinate value and the vertical focus coordinate value of the first to fifth imaging regions 89a to 89e are input from the focus coordinate value obtaining circuit 87 to the interpolation circuit 92. The interpolation circuit 92 interpolates the in-focus evaluation value of each measurement coordinate value on the Z axis of each of the imaging regions 89a to 89e, and calculates the continuous focus evaluation value data. By calculating the continuous focus evaluation value data by the interpolation circuit 92, for example, the focus evaluation value of each measurement coordinate value on the Z axis among the imaging regions 89a to 89e is interpolated, and the continuous focus evaluation value data is calculated. . Further, the interpolation circuit 92 is not limited to the spline interpolation, and can be interpolated by well-known cubic interpolation, Lagrangian interpolation, and most recent interpolation.
於特定成像平面決定電路93輸入有各攝像區域89a~89e之連續對焦評價值資料。特定成像平面決定電路93係求取設定於攝像面12a中央之攝像區域89a的連續對焦評價值資料之峰值的Z軸座標值。採用至少5個評價點,該至少5個以上的評價點係以使攝像面12a與垂直於Z軸之XY座標平面對應時的各攝像區域89a~89e之XY座標軸、及該Z軸上之測量座標值的組合來表示。在將此5個評價點繪製於由X軸、Y軸及Z軸構成之三維座標系時,根據此等評價點之相對位置,算出該三維座標系中作為一平面而被表示之近似平面。The continuous imaging evaluation value data of each of the imaging regions 89a to 89e is input to the specific imaging plane determining circuit 93. The specific imaging plane determining circuit 93 obtains the Z-axis coordinate value of the peak value of the continuous focus evaluation value data set in the imaging region 89a at the center of the imaging surface 12a. At least five evaluation points are used, and the XY coordinate axes of the imaging regions 89a to 89e when the imaging surface 12a corresponds to the XY coordinate plane perpendicular to the Z axis, and the measurement on the Z axis are used. A combination of coordinate values is represented. When the five evaluation points are plotted on the three-dimensional coordinate system composed of the X-axis, the Y-axis, and the Z-axis, the approximate plane represented as a plane in the three-dimensional coordinate system is calculated based on the relative positions of the evaluation points.
藉特定成像平面決定電路93進行之近似成像面的算出,係採用例如以aX+bY+cZ+d=0的數式(a~d為任意之常數)所表示的最小二乘法。特定成像平面決定電路93係藉由將第1~第5攝像區域89a~89e之XY座標平面上的座標值、及藉由對焦座標值取得電路87所求得之Z軸上的水平對焦座標值或垂直對焦座標值代入上述數式中進行運算,算出近似成像面。The calculation of the approximate imaging plane by the specific imaging plane determining circuit 93 is, for example, a least squares method expressed by a formula (a to d is an arbitrary constant) of aX+bY+cZ+d=0. The specific imaging plane determining circuit 93 is a coordinate value on the XY coordinate plane of the first to fifth imaging regions 89a to 89e and a horizontal focus coordinate value obtained on the Z-axis obtained by the focus coordinate value obtaining circuit 87. Or the vertical focus coordinate value is substituted into the above equation to calculate the approximate imaging surface.
特定成像平面決定電路93係將算出之近似平面配置於假設的三維模型上,以近似平面與Z軸之交點成為Z軸座標值、即連續對焦評價資料的峰值的方式朝Z軸座標值移動近似平面。然後,根據以此位置為中心而能繞該X、Y軸移動之複數個成像平面的攝像區域與各連續對焦評價資料的交點,求取各成像平面中之各攝像區域89a~89e的估計解析度。又,恐有各成像平面之攝像區域89a~89e從各連續對焦評價資料偏離的擔憂。在此情況下,因此偏差極小,所以判斷為在誤差範圍內,而將此近似之對焦評價值作為估計解析度。The specific imaging plane determining circuit 93 arranges the calculated approximate plane on the hypothetical three-dimensional model, and moves the approximation toward the Z-axis coordinate value such that the intersection of the approximate plane and the Z-axis becomes the Z-axis coordinate value, that is, the peak value of the continuous focus evaluation data. flat. Then, based on the intersection of the imaging region of the plurality of imaging planes that can be moved around the X and Y axes around the position and the continuous focus evaluation data, the estimation analysis of each of the imaging regions 89a to 89e in each imaging plane is obtained. degree. Further, there is a fear that the imaging areas 89a to 89e of the respective imaging planes deviate from the respective continuous focus evaluation data. In this case, therefore, the deviation is extremely small, so that it is judged to be within the error range, and the approximated in-focus evaluation value is taken as the estimated resolution.
此時,特定成像平面決定電路93對於各連續對焦評價資料,算出Z軸方向之每單位長度的解析度變化率,將解析度變化率少之範圍決定為搜索範圍,以在此搜索範圍內的方式決定特定成像平面。又,作為決定搜索範圍之參數,除了解析度降低少之範圍外,還可考慮黏著後產生之攝像面的預測變化量、及預先決定之解析度允許值來決定各搜索範圍。在此情況下,例如判斷各成像平面上之每個攝像區域89a~89e的估計解析度是否落在各搜索範圍內。於完全落在各搜索範圍的情況下,求取各成像平面中之每個攝像區域89a~89e的估計解析度。於不在各搜索範圍的情況下,例如,進行使解析度允許值變得寬鬆等之參數變更來擴大各搜索範圍,再度判斷各成像平面是否落在各搜索範圍內。在此,黏著後之攝像面12a的預測變化量,係根據預先實際測量之資料所決定。At this time, the specific imaging plane determining circuit 93 calculates the resolution change rate per unit length in the Z-axis direction for each continuous focus evaluation data, and determines the range in which the resolution change rate is small as the search range to be within the search range. The way determines the specific imaging plane. Further, as a parameter for determining the search range, in addition to the range in which the resolution is less reduced, the search range can be determined in consideration of the predicted change amount of the imaging surface generated after the adhesion and the predetermined resolution allowable value. In this case, for example, it is judged whether or not the estimated resolution of each of the imaging regions 89a to 89e on each imaging plane falls within each search range. In the case of completely falling within each search range, the estimated resolution of each of the imaging regions 89a to 89e in each imaging plane is obtained. When it is not in each search range, for example, parameter change such as making the resolution allowable value loose is performed to expand each search range, and it is determined again whether each imaging plane falls within each search range. Here, the predicted change amount of the imaging surface 12a after adhesion is determined based on the data actually measured in advance.
於判斷各成像平面是落在各搜索範圍內之後,特定成像平面決定電路93從各成像平面中決定對於每個攝像區域89a~89e的估計解析度之平均值的偏差成為最小之特定成像平面。對於估計解析度之平均值的偏差(以下稱為[平衡評價值]),係以下述數式(2)所求得。作為特定成像平面之決定方法,係將各成像平面中之每個攝像區域89a~89e的估計解析度代入數式(2)中來算出平衡評價值,決定平衡評價值成為最小之成像平面。又,亦可將滿足預先決定了平衡評價值之規格值的成像平面決定為特定成像平面。After determining that each imaging plane falls within each search range, the specific imaging plane determining circuit 93 determines, from each imaging plane, a specific imaging plane in which the deviation of the average value of the estimated resolutions of each of the imaging regions 89a to 89e becomes the smallest. The deviation of the average value of the estimated resolution (hereinafter referred to as [balance evaluation value]) is obtained by the following formula (2). As a method of determining the specific imaging plane, the estimated resolution of each of the imaging regions 89a to 89e in each imaging plane is substituted into the equation (2) to calculate a balance evaluation value, and the imaging plane in which the balance evaluation value is the smallest is determined. Further, an imaging plane that satisfies the specification value in which the balance evaluation value is determined in advance may be determined as a specific imaging plane.
在此,n表示第9圖所示之攝像區域的編號,Rn 表示攝像區域n中之估計解析度,Rh表示估計解析度平均值,B表示估計解析度之平衡評價值。Here, n denotes the number of the imaging region shown in FIG. 9, R n denotes an estimated resolution in the imaging region n, Rh denotes an estimated resolution average value, and B denotes a balanced evaluation value of the estimated resolution.
從特定成像平面決定電路93朝調整值運算電路95輸入特定成像平面之資訊。調整值運算電路95係算出作為Z軸與特定成像平面之交點的Z軸上之成像面座標值,及對於XY座標平面之特定成像平面的繞X軸及繞Y軸的傾斜、即XY方向旋轉角度,並輸入控制部48。控制部48根據從調整值運算電路95輸入之成像面座標值及XY方向旋轉角度而驅動元件移動機構45,以攝像面12a與特定之成像平面一致的方式調整元件單元16之位置及姿勢。The information of the specific imaging plane is input from the specific imaging plane decision circuit 93 toward the adjustment value operation circuit 95. The adjustment value calculation circuit 95 calculates an imaging surface coordinate value on the Z-axis which is the intersection of the Z-axis and the specific imaging plane, and an X-axis and a Y-axis rotation, that is, an XY-direction rotation, for a specific imaging plane of the XY coordinate plane. The angle is input to the control unit 48. The control unit 48 drives the element moving mechanism 45 based on the imaging surface coordinate value and the XY direction rotation angle input from the adjustment value calculation circuit 95, and adjusts the position and posture of the element unit 16 so that the imaging surface 12a coincides with the specific imaging plane.
其次,針對上述實施形態之作用,參照第10至第12圖之流程進行說明。首先,說明藉透鏡保持機構44對透鏡單元15進行之保持(S1)。控制部48控制第1滑台69而使保持板68移動,藉此,於透鏡定位板43與保持板68之間形成可插入透鏡單元15之空間。透鏡單元15係藉機器人(未圖示)所保持,且在透鏡定位板43與保持板68之間進行移動。Next, the action of the above embodiment will be described with reference to the flowcharts of Figs. 10 to 12. First, the holding of the lens unit 15 by the lens holding mechanism 44 will be described (S1). The control unit 48 controls the first slide table 69 to move the holding plate 68, whereby a space into which the lens unit 15 can be inserted is formed between the lens positioning plate 43 and the holding plate 68. The lens unit 15 is held by a robot (not shown) and moves between the lens positioning plate 43 and the holding plate 68.
控制部48利用光學感測器等來檢測透鏡單元15之移動,而使第1滑台69之台部69a朝接近於透鏡定位板43的方向移動。保持板68使一對保持臂68b嵌合於一對缺口36中而誒比保持透鏡單元15。第1探針單元70接觸於接點26a而對電磁鐵26與AF驅動器84進行電性連接。The control unit 48 detects the movement of the lens unit 15 by an optical sensor or the like, and moves the table portion 69a of the first stage 69 in a direction close to the lens positioning plate 43. The holding plate 68 engages the pair of holding arms 68b in the pair of notches 36 to maintain the lens unit 15. The first probe unit 70 is in electrical contact with the AF driver 84 by contacting the contact 26a.
在藉機器人(未圖示)對透鏡單元15之保持被解除之後,保持板68被進一步朝透鏡定位板43的方向移動。藉由保持板68之移動,定位用凹部7~9抵接於抵接銷63~65,並將插入銷63a,65a插入定位孔7a,9a中。藉此,在Z軸方向、X軸方向及Y軸方向上對透鏡單元15進行定位。又,定位用凹部7~9及抵接銷63~65僅各設置3個,定位孔7a,9a及插入銷63a,65a係於對角線上只設置2個,所以透鏡單元15不會有以錯誤之姿勢進行設定的情況。After the holding of the lens unit 15 by the robot (not shown) is released, the holding plate 68 is further moved in the direction of the lens positioning plate 43. By the movement of the holding plate 68, the positioning recesses 7 to 9 abut against the abutment pins 63 to 65, and the insertion pins 63a, 65a are inserted into the positioning holes 7a, 9a. Thereby, the lens unit 15 is positioned in the Z-axis direction, the X-axis direction, and the Y-axis direction. Further, only three positioning recesses 7 to 9 and the contact pins 63 to 65 are provided, and the positioning holes 7a and 9a and the insertion pins 63a and 65a are provided on only two diagonal lines. Therefore, the lens unit 15 does not have The case where the wrong posture is set.
然後,說明藉元件移動機構45對元件單元16進行之保持(S2)。控制部48控制第2滑台76而使2軸旋轉台74移動,藉此,於保持板68與2軸旋轉台74之間形成可插入元件單元16之空間。元件單元16係藉機器人(未圖示)所保持,且在保持板68與2軸旋轉台74之間進行移動。Next, the holding of the component unit 16 by the component moving mechanism 45 will be described (S2). The control unit 48 controls the second slide table 76 to move the two-axis rotary table 74, thereby forming a space in which the component unit 16 can be inserted between the holding plate 68 and the two-axis rotary table 74. The component unit 16 is held by a robot (not shown) and moves between the holding plate 68 and the two-axis rotating table 74.
控制部48利用光學感測器等來檢測元件單元16之移動,而使第2滑台76之台部76a朝接近於保持板68的方向移動。然後,藉由卡盤72之挾持構件72a,將元件單元16夾入凹部37而用以保持元件單元16。另外,第2探針單元79之各探針79a接觸於攝像元件12之各接點13而將攝像元件12及控制部48電性連接。然後,解除藉機器人(未圖示)進行之元件單元16的保持。The control unit 48 detects the movement of the element unit 16 by an optical sensor or the like, and moves the table portion 76a of the second stage 76 in a direction close to the holding plate 68. Then, the component unit 16 is sandwiched into the recess 37 by the holding member 72a of the chuck 72 to hold the component unit 16. Further, each of the probes 79a of the second probe unit 79 is in contact with each of the contacts 13 of the imaging element 12 to electrically connect the imaging element 12 and the control unit 48. Then, the holding of the component unit 16 by the robot (not shown) is released.
在完成對透鏡單元15及元件單元16之保持後,取得攝像面12a之第1~第5攝像區域89a~89e的水平對焦座標值及垂直對焦座標值(S3)。此步驟(S3)係由第11圖所示之次步驟S3-1~S3-6所構成。首先,控制部48控制第2滑台76而使2軸旋轉台74朝接近於透鏡保持機構44的方向移動,使元件單元16移動至攝像元件12最接近於透鏡單元15的第1測量位置(S3-1)。After the holding of the lens unit 15 and the element unit 16, the horizontal focus coordinate value and the vertical focus coordinate value of the first to fifth imaging regions 89a to 89e of the imaging surface 12a are obtained (S3). This step (S3) is composed of the following steps S3-1 to S3-6 shown in Fig. 11. First, the control unit 48 controls the second slide table 76 to move the two-axis rotary table 74 in the direction close to the lens holding mechanism 44, and moves the element unit 16 to the first measurement position of the image pickup device 12 closest to the lens unit 15 ( S3-1).
控制部48係使圖表單元41之光源53發光。另外,控制部48控制AF驅動器84而使攝影透鏡6移動至規定的焦點位置。在此移動之後,控制攝像元件驅動器85,以攝像元件12拍攝由攝影透鏡6成像之第1~第5圖表圖像56~60(S3-2)。從攝像元件12輸出之攝像信號,經由第2探針單元79被輸入對焦座標值取得電路87。The control unit 48 causes the light source 53 of the chart unit 41 to emit light. Further, the control unit 48 controls the AF driver 84 to move the imaging lens 6 to a predetermined focus position. After this movement, the image pickup device driver 85 is controlled to capture the first to fifth chart images 56 to 60 imaged by the image pickup lens 6 by the image pickup device 12 (S3-2). The imaging signal output from the imaging element 12 is input to the focus coordinate value acquisition circuit 87 via the second probe unit 79.
對焦座標值取得電路87從輸入之攝像信號中抽取與第1~第5攝像區域89a~89e對應的像素之信號,從該像素信號算出有關第1~第5攝像區域89a~89e之H-CTF值及V-CTF值(S3-3)。H-CTF值及V-CTF值,例如儲存於控制部48內之RAM。The focus coordinate value acquisition circuit 87 extracts signals of pixels corresponding to the first to fifth imaging regions 89a to 89e from the input imaging signals, and calculates H-CTFs for the first to fifth imaging regions 89a to 89e from the pixel signals. Value and V-CTF value (S3-3). The H-CTF value and the V-CTF value are, for example, RAMs stored in the control unit 48.
然後,為了於沿著Z軸方向設定之第2測量位置來測量元件單元16,控制部48執行次步驟S3-1~S3-6(S3-4~S3-5)。於此第2測量位置拍攝測量圖表52,算出第1~第5攝像區域89a~89e之H-CTF值及V-CTF值(S3-2~S3-3)。以下,同樣地使元件單元16朝各測量位置移動,算出H-CTF值及V-CTF值(S3-2~S3-5)。Then, in order to measure the element unit 16 at the second measurement position set along the Z-axis direction, the control unit 48 executes the following steps S3-1 to S3-6 (S3-4 to S3-5). The measurement chart 52 is taken at the second measurement position, and the H-CTF value and the V-CTF value (S3-2 to S3-3) of the first to fifth imaging regions 89a to 89e are calculated. Hereinafter, the element unit 16 is moved to each measurement position in the same manner, and the H-CTF value and the V-CTF value (S3-2 to S3-5) are calculated.
第13,14圖之曲線顯示於各測量位置上求得之第1~第5攝像區域89a~89e之H-CTF值、即Ha1~Ha5及V-CTF值、即Va1~Va5之一例。又,測量位置[0]表示相對於攝影透鏡6之成為設計上的成像面的位置。對焦座標值取得電路87針對第1~第5攝像區域89a~89e之各攝像區域,從算出之複數個H-CTF值Ha1~Ha5及V-CTF值Va1~Va5之中選出最大值,並取得獲得最大值之測量位置的Z軸座標作為第1~第5攝像區域89a~89e的水平對焦座標值及垂直對焦座標值(S3-6)。The graphs of Figs. 13 and 14 show examples of H-CTF values of the first to fifth imaging regions 89a to 89e obtained at the respective measurement positions, that is, Ha1 to Ha5 and V-CTF values, i.e., Va1 to Va5. Further, the measurement position [0] indicates a position which becomes a design image plane with respect to the photographic lens 6. The focus coordinate value acquisition circuit 87 selects the maximum value from the calculated plurality of H-CTF values Ha1 to Ha5 and V-CTF values Va1 to Va5 for each imaging region of the first to fifth imaging regions 89a to 89e, and obtains The Z-axis coordinate at which the measurement position of the maximum value is obtained is used as the horizontal focus coordinate value and the vertical focus coordinate value of the first to fifth imaging regions 89a to 89e (S3-6).
於第13,14圖所示之例中,H-CTF值ha1~ha5及V-CTF值va1~va5分別成為最大值,取得與此等之CTF值對應之測量位置Z0~Z5及Z0~Z4之Z軸座標,作為水平對焦座標值及垂直對焦座標值。In the example shown in Figs. 13 and 14, the H-CTF values ha1 to ha5 and the V-CTF values va1 to va5 are respectively the maximum values, and the measurement positions Z0 to Z5 and Z0 to Z4 corresponding to the CTF values are obtained. The Z-axis coordinate is used as the horizontal focus coordinate value and the vertical focus coordinate value.
第15,16圖所示之曲線顯示將10個評價點Hb1~Hb5及Vb1~Vb5展開於XYZ之三維座標系的狀態。此10個評價值Hb1~Hb5及Vb1~Vb5,係以使攝像面12a與XY座標平面對應時的各攝像區域89a~89e之XY座標軸、及分別按每個攝像區域89a~89e而獲得之Z軸上的水平對焦座標值及垂直對焦座標值的組合來表示。從此等曲線可知,由水平方向之評價點Hb1~Hb5及垂直方向之Vb1~Vb5所表示的攝像元件12之實際成像面,因各零件之製造誤差、組裝誤差,而相對於形成於Z軸之[0]上的設計上的成像面發生偏差。The graphs shown in Figs. 15 and 16 show the state in which the ten evaluation points Hb1 to Hb5 and Vb1 to Vb5 are developed in the three-dimensional coordinate system of XYZ. The ten evaluation values Hb1 to Hb5 and Vb1 to Vb5 are obtained by XY coordinate axes of the respective imaging regions 89a to 89e when the imaging surface 12a corresponds to the XY coordinate plane, and Z obtained for each of the imaging regions 89a to 89e. A combination of the horizontal focus coordinate value and the vertical focus coordinate value on the axis. As can be seen from these curves, the actual image forming surface of the image pickup element 12 indicated by the horizontal evaluation points Hb1 to Hb5 and the vertical direction Vb1 to Vb5 is formed on the Z-axis due to manufacturing errors and assembly errors of the respective components. The imaging surface on the design on [0] is deviated.
於對焦座標值取得電路87中取得之水平對焦座標值及垂直對焦座標值,被輸入插補電路92。插補電路92樣條地插補各攝像區域中之Z軸上的每個測量座標值的對焦評價值,算出連續對焦評價值資料(S5)。The horizontal focus coordinate value and the vertical focus coordinate value acquired in the focus coordinate value acquisition circuit 87 are input to the interpolation circuit 92. The interpolation circuit 92 interpolates the in-focus evaluation value of each measurement coordinate value on the Z axis in each imaging region in a spline manner, and calculates the continuous focus evaluation value data (S5).
由插補電路92算出之各攝像區域89a~89e的各連續對焦評價值資料被輸入特定成像平面決定電路93,進行特定成像平面之決定(S6)。此特定成像平面之決定,如第12圖所示,由次步驟S6-1~S6-8構成。特定成像平面決定電路93求取設定於攝像面12a中央之第1像區域89a的連續對焦評價資料之峰值的Z軸座標值(S6-1)。然後,根據各運續對焦評價資料,藉由最小二乘法算出近似於平面之近似平面(S6-2)。The continuous focus evaluation value data of each of the imaging regions 89a to 89e calculated by the interpolation circuit 92 is input to the specific imaging plane determination circuit 93, and the determination of the specific imaging plane is performed (S6). The determination of this particular imaging plane, as shown in Fig. 12, consists of sub-steps S6-1 to S6-8. The specific imaging plane determining circuit 93 obtains the Z-axis coordinate value (S6-1) of the peak value of the continuous focus evaluation data set in the first image region 89a at the center of the imaging surface 12a. Then, based on the respective in-focus evaluation data, an approximate plane approximate to the plane is calculated by the least squares method (S6-2).
特定成像平面決定電路93將算出之近似平面配置於假設之三維模型上,以近似平面與Z軸的交點成為Z軸座標值、即連續對焦評價資料之峰值的方式使近似平面朝Z軸座標值移動(S6-3)。The specific imaging plane determining circuit 93 arranges the calculated approximate plane on the assumed three-dimensional model, and makes the approximate plane toward the Z-axis coordinate value such that the intersection of the approximate plane and the Z-axis becomes the Z-axis coordinate value, that is, the peak value of the continuous focus evaluation data. Move (S6-3).
如第17圖所示,特定成像平面決定電路93將算出之近似平面97構建成假設的三維空間,以近似平面97與Z軸的交點成為Z軸座標值、即連續對焦評價資料之峰值的方式朝Z軸座標值移動近似平面97。然後,以此移動後之位置為中心,從能以X軸及Y軸為中心進行移動之複數個成像平面的攝像區域與各連續對焦評價資料之交點,求取各成像平面中之每個攝像區域89a~89e的估計解析度(S6-5)。As shown in Fig. 17, the specific imaging plane determining circuit 93 constructs the calculated approximate plane 97 into a hypothetical three-dimensional space, and approximates the intersection of the plane 97 and the Z-axis as the Z-axis coordinate value, that is, the peak value of the continuous focus evaluation data. The approximate plane 97 is moved toward the Z-axis coordinate value. Then, centering on the position after the movement, each of the imaging planes is obtained from the intersection of the imaging regions of the plurality of imaging planes that can be moved around the X-axis and the Y-axis and the respective continuous focus evaluation data. The estimated resolution of the regions 89a to 89e (S6-5).
特定成像平面決定電路93v係與前述處理(S6-1~S6-4)之執行同時地,對於該各連續對焦評價資料,算出Z軸方向之每單位長度的解析度變化率(S6-5)。然後,將搜索範圍設定於各成像面之每個攝像區域(S6-6)。例如,如第18圖所示,各搜索範圍係藉由相對於解析度變化率而預先決定之臨界值來決定解析度降低少之範圍P,並考慮成為黏著後產生之攝像面的預測變化量的距離寬裕量Q、及預先決定之解析度允許值R,來決定搜索範圍M。The specific imaging plane determining circuit 93v calculates the resolution change rate per unit length in the Z-axis direction for each of the continuous focus evaluation data (S6-5) simultaneously with the execution of the above-described processes (S6-1 to S6-4). . Then, the search range is set to each of the imaging areas of the respective imaging planes (S6-6). For example, as shown in Fig. 18, each search range determines a range P in which the resolution is less reduced by a predetermined threshold value with respect to the resolution change rate, and considers the predicted change amount of the imaging surface which is generated after adhesion. The distance allowance Q and the predetermined resolution allowable value R determine the search range M.
特定成像平面決定電路93對各成像平面中之每個攝像區域89a~89e的估計解析度是否落在各搜索範圍內進行判斷(S6-7),在完全落在各搜索範圍內的情況下,決定為特定成像平面(S6-8)。於不在各搜索範圍的情況下,例如,預先階段性地決定使設置解析度的降低少之範圍用的臨界值、或解析度允許值或此等之組合值變得寬鬆等之參數變更,來漸漸地擴大各搜索範圍(S6-9),判斷各成像平面是否落在搜索範圍內。The specific imaging plane determining circuit 93 determines whether the estimated resolution of each of the imaging regions 89a to 89e in each imaging plane falls within each search range (S6-7), and if it falls completely within each search range, Determined to be a specific imaging plane (S6-8). When it is not in the range of the search, for example, it is determined in advance that the threshold value for reducing the range in which the resolution is reduced is small, or the parameter allowable value or the combined value of these combinations is loosened. Gradually expand each search range (S6-9) to determine whether each imaging plane falls within the search range.
特定成像平面決定電路93從各成像平面中決定表示每個攝像區域89a~89e的估計解析度之偏差的平衡評價值成為最小之特定成像平面。以特定成像平面決定電路93決定後之特定成像平面的資訊,被輸入調整值運算電路95。調整值運算電路95算出作為特定成像平面與Z軸之交點的Z軸座標值,及對於XY座標平面之特定成像平面的繞X軸及繞Y軸的傾斜、即XY方向旋轉角度,並輸入控制部48(S7)。The specific imaging plane determining circuit 93 determines, from each imaging plane, a specific imaging plane in which the balance evaluation value indicating the deviation of the estimated resolution of each of the imaging regions 89a to 89e is the smallest. The information of the specific imaging plane determined by the specific imaging plane determining circuit 93 is input to the adjustment value computing circuit 95. The adjustment value calculation circuit 95 calculates a Z-axis coordinate value which is an intersection of a specific imaging plane and the Z-axis, and an inclination around the X-axis and the Y-axis, that is, an XY-direction rotation angle with respect to a specific imaging plane of the XY coordinate plane, and is input and controlled. Part 48 (S7).
於第19圖所示之例子中,將例如由數式(2)算出之平衡評價值的分布構建成假設之三維空間,算出各成像平面中之平衡評價值成為最小的最佳點Ha(特定成像平面之決定)。求取此最佳點Ha之繞X軸的角度θ及繞Y軸的角度 Φ(參照第7圖)。In the example shown in Fig. 19, for example, the distribution of the equilibrium evaluation values calculated by the equation (2) is constructed into a hypothetical three-dimensional space, and the optimum point Ha at which the balance evaluation value in each imaging plane becomes the smallest is calculated (specific The decision of the imaging plane). Find the angle θ around the X axis and the angle around the Y axis of the best point Ha Φ (refer to Figure 7).
控制部48根據Z軸座標值與XY方向旋轉角度,控制2軸旋轉台74及第2滑台76,以攝像面12a之中心12b與Z軸座標值一致的方式使元件單元16朝Z軸方向移動。然後,以攝像面12a之傾斜與特定成像平面一致的方式,調整元件單元16之θ方向及Φ方向的角度(S8)。於元件單元16之位置調整後,實施確認第1~第5攝像區域89a~89e之對焦位置的確認步驟(S9)。於此確認步驟中,再度執行上述S3之各步驟。The control unit 48 controls the two-axis rotating table 74 and the second sliding table 76 based on the Z-axis coordinate value and the XY-direction rotation angle, and causes the element unit 16 to face the Z-axis such that the center 12b of the imaging surface 12a coincides with the Z-axis coordinate value. mobile. Then, the angle of the θ direction and the Φ direction of the element unit 16 is adjusted such that the inclination of the imaging surface 12a coincides with the specific imaging plane (S8). After the position of the component unit 16 is adjusted, a step of confirming the in-focus position of the first to fifth imaging regions 89a to 89e is performed (S9). In this confirmation step, each step of the above S3 is performed again.
第20圖所示之曲線表示在確認步驟確認後之第1~第5攝像區域89a~89e的各測量位置的解析度之結果的一例。由此曲線可知,於元件單元16之位置調整後,於習知技術中確認到因基板之局部變形而在攝像面之一部分造成解析度下降的情況。相對於此,根據本發明之調整方法,因為相對於近似平面決定解析度之平衡成為最小的成像平面,所以解析度在整體上落在一定範圍內。因此,若以第21圖所示解析度下降部分的解析度的度數分布進行比較,本發明之調整方法可提高下落部分的解析度。另外,在以第22圖所示之整個攝像面的平衡評價值進行比較時,本發明之調整方法相比於習知技術,亦可整體上提高解析度之平衡。因此,當以平衡評價值的度數分布進行比較時,如第23圖所示,可知本發明之調整方法被集中在[0]附近。藉此,如第26B圖所示,與在習知技術中說明之調整方法(第26A圖)比較,可獲得整個攝像面之解析度的偏差為最小的成像平面202。The graph shown in Fig. 20 shows an example of the result of the resolution of each measurement position of the first to fifth imaging regions 89a to 89e after the confirmation step is confirmed. From this curve, it is understood that after the position of the element unit 16 is adjusted, it has been confirmed in the prior art that the resolution of the substrate is reduced due to local deformation of the substrate. On the other hand, according to the adjustment method of the present invention, since the balance of the resolution is determined to be the smallest imaging plane with respect to the approximate plane, the resolution falls as a whole within a certain range. Therefore, if the degree distribution of the resolution of the resolution reduction portion shown in Fig. 21 is compared, the adjustment method of the present invention can improve the resolution of the falling portion. Further, when the comparison is made with the balance evaluation value of the entire imaging surface shown in Fig. 22, the adjustment method of the present invention can improve the balance of the resolution as a whole as compared with the conventional technique. Therefore, when the comparison is made with the degree distribution of the equilibrium evaluation value, as shown in Fig. 23, it is understood that the adjustment method of the present invention is concentrated in the vicinity of [0]. Thereby, as shown in Fig. 26B, the imaging plane 202 having the smallest deviation of the resolution of the entire imaging surface can be obtained as compared with the adjustment method (Fig. 26A) described in the prior art.
於確認步驟(S9)結束之後(S4),控制部48以攝像面12a之中心12b與特定成像面平面座標值一致的方式使元件單元16朝Z軸方向移動(S10)。另外,控制部48進行控制而從黏著供給部46朝嵌合部33內供給紫外線硬化黏著劑(S11),並點亮紫外線燈47,而使紫外線硬化黏著劑硬化(S12)。然後,藉由機器人(未圖示)從相機模組製造裝置40中取出完成之相機模組2(S12)。After the completion of the confirmation step (S9) (S4), the control unit 48 moves the element unit 16 in the Z-axis direction so that the center 12b of the imaging surface 12a coincides with the specific imaging plane plane coordinate value (S10). Moreover, the control unit 48 performs control to supply the ultraviolet curable adhesive (S11) from the adhesive supply unit 46 into the fitting portion 33, and illuminates the ultraviolet lamp 47 to cure the ultraviolet curable adhesive (S12). Then, the completed camera module 2 is taken out from the camera module manufacturing apparatus 40 by a robot (not shown) (S12).
於確認步驟中,從特定成像平面之估計解析度與實測解析度,求取Product management value(PMV)。在此,作為解析度,使用CTF值(對比傳遞函數)。從該估計CTF值及實測CTF值,從數式(3)求取PMV。此PMV係按每個H-CTF值及V-CTF值所算出。In the confirmation step, the Product management value (PMV) is obtained from the estimated resolution and the measured resolution of the specific imaging plane. Here, as the resolution, a CTF value (contrast transfer function) is used. From the estimated CTF value and the measured CTF value, the PMV is obtained from the equation (3). This PMV is calculated for each H-CTF value and V-CTF value.
PMV=實測CTF值×估計CTF值 ...(3)以設置判斷獲得之PMV是否在預先決定之臨界值以下的手段較為適宜。在判斷為臨界值以下的情況,可知裝置40之狀態得到保持,而若超過臨界值的話,則裝置40之狀態未被保持。利用設置此種判斷手段,可把握裝置40之維修時期,另外,在實際空間中亦能保證在假設空間所保證的各像素區域之解析度、及全面之解析度的偏差的大小。PMV = measured CTF value × estimated CTF value ... (3) It is preferable to set whether the obtained PMV is below a predetermined threshold value. When it is judged that it is less than a critical value, it is understood that the state of the device 40 is maintained, and if the critical value is exceeded, the state of the device 40 is not maintained. By providing such a judging means, it is possible to grasp the maintenance period of the device 40, and also to secure the resolution of each pixel region secured by the hypothesis space and the magnitude of the deviation of the overall resolution in the real space.
從以上說明明顯可知,元件單元16以與攝像面12a全面之解析度的偏差最小或滿足規格的成像平面一致的方式進行位置調整,所以即使在大量生產相機模組的情況下,亦可穩定畫面質量。另外,考慮到解析度降低少之範圍、黏著後之變形量等,按每個攝像區域決定搜索範圍,以落在各搜索範圍內的方式決定特定成像平面,所以攝像面12a全面之解析度為一定值以上。又,以與偏差最小或滿足規格的成像平面一致的方式進行位置調整,所以可提高相機模組2之品質。As is apparent from the above description, the element unit 16 performs position adjustment so that the deviation from the overall resolution of the imaging surface 12a is the smallest or the imaging plane that satisfies the specifications, so that the screen can be stabilized even in the case of mass production of the camera module. quality. In addition, considering the range in which the resolution is less reduced, the amount of deformation after adhesion, and the like, the search range is determined for each imaging region, and the specific imaging plane is determined so as to fall within each search range. Therefore, the resolution of the imaging surface 12a is comprehensive. More than a certain value. Further, since the position adjustment is performed in such a manner as to match the imaging plane having the smallest deviation or satisfying the specification, the quality of the camera module 2 can be improved.
上述各實施形態中,使用CTF值作為對焦評價值,但本發明不限定於CTF值,還可應用於能對解析度、MTF值等進行評價之各種評價方法,還可將評價值利用於對焦位置之測量。In each of the above embodiments, the CTF value is used as the in-focus evaluation value. However, the present invention is not limited to the CTF value, and can be applied to various evaluation methods capable of evaluating the resolution, the MTF value, and the like, and the evaluation value can be used for focusing. Measurement of position.
另外,作為CTF值,使用水平方向及垂直方向之H-CTF值及V-CTF值。如第24圖之測量圖表130所示,亦可使用排列有沿著攝影透鏡之徑向的線131a、及沿著與徑向垂直的線131b之圖表圖像131,算出攝影透鏡之徑向的S-CTF值及垂直方向之T-CFT值。又,亦可於各攝像區域算出所有之H-CTF值及V-CTF值與S-CTF值及T-CFT值,亦可變更按每個攝像區域算出之CTF值。另外,亦能以H-CTF值、V-CTF值、S-CTF值及T-CFT值中之任一個值或任意之組合進行運算來測量對焦位置。Further, as the CTF value, the H-CTF value and the V-CTF value in the horizontal direction and the vertical direction are used. As shown in the measurement chart 130 of Fig. 24, the radial direction of the photographic lens can also be calculated by using the line 131a along the radial direction of the photographic lens and the chart image 131 along the line 131b perpendicular to the radial direction. S-CTF value and T-CFT value in the vertical direction. Further, all of the H-CTF value, the V-CTF value, the S-CTF value, and the T-CFT value may be calculated in each imaging region, and the CTF value calculated for each imaging region may be changed. Alternatively, the focus position can be measured by performing an operation using any one of H-CTF value, V-CTF value, S-CTF value, and T-CFT value or any combination thereof.
另外,如第25圖之測量圖表135所示,亦可於沿X軸方向、Y軸方向及2條對角線方向相對於中心位置來分割圖表面,而分別設置有第1~第4象限136~139的2個區域內,設置相互垂直之複數條平行線。根據此測量圖表135,沿對角線上之圖表圖案無論是在哪一位置均相同,所以可兼作為用於不同畫角之攝像元件的位置調整。又,設置於各區域之線亦可為水平線及垂直線。Further, as shown in the measurement chart 135 of Fig. 25, the surface of the figure may be divided with respect to the center position in the X-axis direction, the Y-axis direction, and the two diagonal directions, and the first to fourth quadrants may be respectively provided. In two areas of 136 to 139, a plurality of parallel lines perpendicular to each other are disposed. According to this measurement chart 135, the chart pattern along the diagonal line is the same regardless of the position, so that it can also serve as the position adjustment for the image pickup elements of different image angles. Moreover, the lines provided in the respective areas may be horizontal lines and vertical lines.
上述各實施形態中,測量圖表52與透鏡單元15之位置被固定,但亦可預先將至少其中一個可於Z軸向上移動,利用雷射位移計等對測量圖表52與透鏡鏡筒20之距離進行測量,以此距離落在規定值內的方式進行位置調整之後,再進行元件單元16之位置調整。藉此,可進行高精度之位置調整。In each of the above embodiments, the position of the measurement chart 52 and the lens unit 15 is fixed, but at least one of them may be moved in the Z-axis direction in advance, and the distance between the measurement chart 52 and the lens barrel 20 by a laser displacement meter or the like is used. The measurement is performed, and the position adjustment is performed such that the distance falls within the predetermined value, and then the position adjustment of the element unit 16 is performed. Thereby, high-precision position adjustment can be performed.
另外,雖只進行一次元件單元16之位置調整,但亦可重複執行多次。又,以相機模組之元件單元16之位置調整為例進行了說明,但亦可利用於一般之數位相機的攝像元件之位置調整。Further, although the position adjustment of the element unit 16 is performed only once, it may be repeated a plurality of times. Further, the position adjustment of the component unit 16 of the camera module has been described as an example, but it is also possible to adjust the position of the imaging element of a general digital camera.
2...相機模組2. . . Camera module
5...攝影開口5. . . Photography opening
6...攝影透鏡6. . . Photographic lens
7~9...定位用凹部7~9. . . Positioning recess
7a,9a...定位用孔7a, 9a. . . Positioning hole
11...矩形開口11. . . Rectangular opening
12...攝像元件12. . . Camera element
12a...攝像面12a. . . Camera
13...接點13. . . contact
15...透鏡單元15. . . Lens unit
16...元件單元16. . . Component unit
19...單元本體19. . . Unit body
20...透鏡鏡筒20. . . Lens barrel
21...前罩twenty one. . . Front cover
24...簧片twenty four. . . Reed
25...永久磁鐵25. . . permanent magnet
26...電磁鐵26. . . Electromagnet
26a...接點26a. . . contact
29...元件框29. . . Component frame
32...嵌合片32. . . Mating piece
33...嵌合槽33. . . Mating slot
36...缺口36. . . gap
37...凹部37. . . Concave
40...相機模組製造裝置40. . . Camera module manufacturing device
41...圖表單元41. . . Chart unit
41a...圖表箱體41a. . . Chart box
42...聚光單元42. . . Concentrating unit
42a...支架42a. . . support
42b...聚光透鏡42b. . . Condenser lens
42c...開口42c. . . Opening
43...透鏡定位板43. . . Lens positioning plate
43a...開口43a. . . Opening
44...透鏡保持機構44. . . Lens retention mechanism
45...元件移動機構45. . . Component moving mechanism
46...黏著劑供給器46. . . Adhesive feeder
47...紫外線燈47. . . ultra violet light
48...控制部48. . . Control department
49...作業台49. . . Workbench
52...測量圖表52. . . Measurement chart
53...光源53. . . light source
52a...中心52a. . . center
56~60...第1~第5圖表圖像56~60. . . 1st to 5th chart images
56a~60a...水平圖表圖像56a~60a. . . Horizontal chart image
56b~60b...垂直圖表圖像56b~60b. . . Vertical chart image
63~65...抵接銷63~65. . . Abutment pin
63a,65a...插入銷63a, 65a. . . Insert pin
68...保持板68. . . Holding plate
68b...保持臂68b. . . Holding arm
69...第1滑台69. . . 1st slide
68a...水平基部68a. . . Horizontal base
69a...台部69a. . . Taiwan Department
70a...探針70a. . . Probe
70...第1探針單元70. . . First probe unit
72...卡盤(chuck hand)72. . . Chuck hand
72a...挾持構件72a. . . Holding member
72b...致動器72b. . . Actuator
74...2軸旋轉台74. . . 2-axis rotary table
76...第2滑台76. . . 2nd slide
81...輸入裝置81. . . Input device
82...監視器82. . . Monitor
84...AF驅動器84. . . AF drive
87...對焦座標值取得電路87. . . Focus coordinate value acquisition circuit
89a~89e...第1~第5攝像區域89a~89e. . . First to fifth imaging areas
92...插補電路92. . . Interpolation circuit
93...特定成像平面決定電路93. . . Specific imaging plane decision circuit
95...調整值運算電路95. . . Adjustment value operation circuit
第1圖為從本發明之相機模組的正面側觀察之立體圖。Fig. 1 is a perspective view of the camera module of the present invention as seen from the front side.
第2圖為從相機模組之背面側觀察之立體圖。Fig. 2 is a perspective view of the camera module as viewed from the back side.
第3圖為透鏡單元與元件單元之分解立體圖。Fig. 3 is an exploded perspective view of the lens unit and the element unit.
第4圖為相機模組之剖視圖。Figure 4 is a cross-sectional view of the camera module.
第5圖為顯示相機模組製造裝置之構成的概略圖。Fig. 5 is a schematic view showing the configuration of a camera module manufacturing apparatus.
第6圖為測量圖表之俯視圖。Figure 6 is a top view of the measurement chart.
第7圖為顯示在相機模組製造裝置上之透鏡單元與元件單元的保持狀態之說明圖。Fig. 7 is an explanatory view showing a state in which a lens unit and an element unit are held on a camera module manufacturing apparatus.
第8圖為顯示相機模組製造裝置之構成的方塊圖。Fig. 8 is a block diagram showing the configuration of a camera module manufacturing apparatus.
第9圖為顯示設定於攝像面上之各攝像區域的說明圖。Fig. 9 is an explanatory view showing each imaging area set on the imaging surface.
第10圖為顯示相機模組之製造順序的流程圖。Figure 10 is a flow chart showing the manufacturing sequence of the camera module.
第11圖為顯示對焦座標值取得步驟的流程圖。Figure 11 is a flow chart showing the steps of obtaining the focus coordinate value.
第12圖為顯示特定成像平面決定步驟的流程圖。Figure 12 is a flow chart showing the steps of determining a particular imaging plane.
第13圖為顯示元件單元調整前之各攝像區域的H-CTF值之曲線圖。Fig. 13 is a graph showing the H-CTF value of each imaging region before the component unit adjustment.
第14圖為顯示元件單元調整前之各攝像區域的V-CTF值之曲線圖。Fig. 14 is a graph showing V-CTF values of respective imaging regions before adjustment of the element unit.
第15圖為從X軸側觀察元件單元調整前之各攝像區域的評價點的三維曲線圖。Fig. 15 is a three-dimensional graph showing evaluation points of respective imaging regions before adjustment of the element unit from the X-axis side.
第16圖為從Y軸側觀察元件單元調整前之各攝像區域的評價點的三維曲線圖。Fig. 16 is a three-dimensional graph showing evaluation points of respective imaging regions before adjustment of the element unit from the Y-axis side.
第17圖為顯示配置於假設之三維空間的近似平面之說明圖。Fig. 17 is an explanatory diagram showing an approximate plane arranged in a hypothetical three-dimensional space.
第18圖為顯示連續對焦評價資料中的搜索範圍之設定例的曲線圖。Fig. 18 is a graph showing a setting example of the search range in the continuous focus evaluation data.
第19圖為將根據各攝像區域之估計解析度而按每個成像平面算出之平衡評價值的分布配置於假設之三維空間的說明。Fig. 19 is a view for explaining the distribution of the balance evaluation values calculated for each imaging plane based on the estimated resolution of each imaging region in the assumed three-dimensional space.
第20圖為顯示對於調整後所確認之攝像區域的解析度之曲線圖。Fig. 20 is a graph showing the resolution of the imaging region confirmed after the adjustment.
第21圖為顯示以調整後之各相機模組所測量的解析度之度數分布之曲線圖。Figure 21 is a graph showing the degree distribution of the resolution measured by the adjusted camera modules.
第22圖為顯示調整後所確認之各成像平面的平衡評價值之曲線圖。Fig. 22 is a graph showing the balance evaluation values of the respective imaging planes confirmed after the adjustment.
第23圖為顯示以調整後所確認之平衡評價值的度數分布之曲線圖。Fig. 23 is a graph showing the degree distribution of the equilibrium evaluation value confirmed after the adjustment.
第24圖為顯示在攝影透鏡之徑向、及與此方向垂直的方向算出CTF值時所使用之測量圖表的俯視圖。Fig. 24 is a plan view showing a measurement chart used when calculating the CTF value in the radial direction of the photographic lens and the direction perpendicular to the direction.
第25圖為用於不同畫角之攝像元件的位置調整之測量圖表的俯視圖。Fig. 25 is a plan view of a measurement chart for position adjustment of image pickup elements of different drawing angles.
第26A圖為顯示在基板局部變形中的情況下以習知技術算出近似成像面之狀態的說明圖,第26B圖為顯示以本發明算出近似成像面之狀態的說明圖。Fig. 26A is an explanatory view showing a state in which an approximate imaging surface is calculated by a conventional technique in the case where the substrate is locally deformed, and Fig. 26B is an explanatory view showing a state in which an approximate imaging surface is calculated by the present invention.
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EP4230480A3 (en) * | 2014-05-07 | 2023-11-01 | Arriver Software AB | Imaging system for a motor vehicle and method of mounting an imaging system |
DE102014212104A1 (en) * | 2014-06-24 | 2015-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | DEVICE AND METHOD FOR THE RELATIVE POSITIONING OF A MULTI-PAPER UROPTIK WITH SEVERAL OPTICAL CHANNELS RELATIVE TO AN IMAGE SENSOR |
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JP6316979B2 (en) * | 2014-10-16 | 2018-04-25 | シャープ株式会社 | Camera module manufacturing method and manufacturing apparatus |
CN107133557B (en) * | 2017-03-08 | 2019-12-31 | 天地融科技股份有限公司 | Palm print recognition auxiliary method, device and system |
CN110770622B (en) * | 2017-06-21 | 2021-09-10 | 富士胶片株式会社 | Image pickup apparatus and mobile image pickup apparatus |
CN107864338B (en) * | 2017-12-04 | 2020-02-21 | 江西合力泰科技有限公司 | Camera module with variable optical axis and control method thereof |
EP3650161A1 (en) * | 2018-11-12 | 2020-05-13 | TRUMPF Schweiz AG | Focusing device and laser machining device with such a focusing device |
JP7271159B2 (en) | 2018-12-14 | 2023-05-11 | キヤノン株式会社 | CONTROL DEVICE, IMAGING DEVICE, LENS DEVICE, PROGRAM, AND CONTROL METHOD OF CONTROL DEVICE |
US11159706B2 (en) | 2019-03-19 | 2021-10-26 | Pfa Corporation | Camera module manufacturing apparatus and camera module manufacturing method |
CN112312120A (en) * | 2019-07-30 | 2021-02-02 | 深圳光启空间技术有限公司 | Automatic adjusting system and method for camera focal plane |
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Publication number | Priority date | Publication date | Assignee | Title |
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TW200835931A (en) * | 2006-12-27 | 2008-09-01 | Sony Corp | Zoom lens and imaging apparatus |
JP2010021985A (en) * | 2008-01-15 | 2010-01-28 | Fujifilm Corp | Method of adjusting position of imaging element, method and apparatus of manufacturing camera module, and camera module |
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