TWI508156B - - Google Patents

Info

Publication number
TWI508156B
TWI508156B TW102112084A TW102112084A TWI508156B TW I508156 B TWI508156 B TW I508156B TW 102112084 A TW102112084 A TW 102112084A TW 102112084 A TW102112084 A TW 102112084A TW I508156 B TWI508156 B TW I508156B
Authority
TW
Taiwan
Application number
TW102112084A
Other languages
Chinese (zh)
Other versions
TW201440132A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW102112084A priority Critical patent/TW201440132A/zh
Publication of TW201440132A publication Critical patent/TW201440132A/zh
Application granted granted Critical
Publication of TWI508156B publication Critical patent/TWI508156B/zh

Links

TW102112084A 2013-04-03 2013-04-03 薄板支撐封裝結構的製作方法 TW201440132A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102112084A TW201440132A (zh) 2013-04-03 2013-04-03 薄板支撐封裝結構的製作方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102112084A TW201440132A (zh) 2013-04-03 2013-04-03 薄板支撐封裝結構的製作方法

Publications (2)

Publication Number Publication Date
TW201440132A TW201440132A (zh) 2014-10-16
TWI508156B true TWI508156B (de) 2015-11-11

Family

ID=52113905

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102112084A TW201440132A (zh) 2013-04-03 2013-04-03 薄板支撐封裝結構的製作方法

Country Status (1)

Country Link
TW (1) TW201440132A (de)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5953594A (en) * 1997-03-20 1999-09-14 International Business Machines Corporation Method of making a circuitized substrate for chip carrier structure
TW200421574A (en) * 2003-04-09 2004-10-16 Phoenix Prec Technology Corp Substrate with enhanced supporting structure and method for fabricating the same
EP1928024A1 (de) * 2006-12-01 2008-06-04 Axalto SA Trägerfolie für Chipmodulen, die zur automatischen Prüfung der Verkabelung geeignet ist und Verfahren zur Herstellung von Modulen
CN100485909C (zh) * 2006-08-18 2009-05-06 巨擘科技股份有限公司 结合ic整合基板与载板的结构及其与电子装置的制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5953594A (en) * 1997-03-20 1999-09-14 International Business Machines Corporation Method of making a circuitized substrate for chip carrier structure
TW200421574A (en) * 2003-04-09 2004-10-16 Phoenix Prec Technology Corp Substrate with enhanced supporting structure and method for fabricating the same
TWI226115B (en) * 2003-04-09 2005-01-01 Phoenix Prec Technology Corp Substrate with enhanced supporting structure and method for fabricating the same
CN100485909C (zh) * 2006-08-18 2009-05-06 巨擘科技股份有限公司 结合ic整合基板与载板的结构及其与电子装置的制造方法
EP1928024A1 (de) * 2006-12-01 2008-06-04 Axalto SA Trägerfolie für Chipmodulen, die zur automatischen Prüfung der Verkabelung geeignet ist und Verfahren zur Herstellung von Modulen

Also Published As

Publication number Publication date
TW201440132A (zh) 2014-10-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees