TWI506327B - Lens cap for optical module, optical module, and method for manufacturing lens cap for optical module - Google Patents

Lens cap for optical module, optical module, and method for manufacturing lens cap for optical module Download PDF

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Publication number
TWI506327B
TWI506327B TW103119991A TW103119991A TWI506327B TW I506327 B TWI506327 B TW I506327B TW 103119991 A TW103119991 A TW 103119991A TW 103119991 A TW103119991 A TW 103119991A TW I506327 B TWI506327 B TW I506327B
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Prior art keywords
lens
optical module
lens barrel
linear expansion
ppm
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TW103119991A
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Chinese (zh)
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TW201514568A (en
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Akihiro Matsusue
Koichi Nakamura
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Mitsubishi Electric Corp
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/008Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00Re-forming shaped glass
    • C03B23/0013Re-forming shaped glass by pressing
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/02Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/028Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B2215/00Press-moulding glass
    • C03B2215/79Uniting product and product holder during pressing, e.g. lens and lens holder

Description

光模組用鏡頭蓋、光模組以及光模組用鏡頭蓋之製造方法 Lens cap for optical module, optical module, and lens cap for optical module

本發明係關於一種光模組用鏡頭蓋、光模組以及光模組用鏡頭蓋之製造方法。 The present invention relates to a lens cover for an optical module, an optical module, and a method of manufacturing the lens cover for the optical module.

在使用先前衝壓鏡頭之光模組用鏡頭蓋中,鏡筒係使用SUS430或SF-20T等之線膨脹係數為10ppm/K以上之材質(例如參照專利文獻1的段落0014)。亦即,鏡筒使用線膨脹係數大於玻璃的線膨脹係數6~8ppm/K之材料。藉此,在600~800℃進行鏡頭成形後之冷卻過程中,藉衝壓鏡頭與金屬鏡筒間之線膨脹係數差,金屬鏡筒鎖固鏡頭。因此,可提高鏡頭與金屬鏡筒間之氣密性。 In the lens cap for an optical module using a previously punched lens, a material having a linear expansion coefficient of SUS430 or SF-20T or the like of 10 ppm/K or more is used for the lens barrel (for example, refer to paragraph 0014 of Patent Document 1). That is, the lens barrel uses a material having a coefficient of linear expansion greater than a linear expansion coefficient of glass of 6 to 8 ppm/K. Thereby, during the cooling process after the lens forming at 600 to 800 ° C, the linear expansion coefficient between the punching lens and the metal lens barrel is fixed, and the metal lens barrel locks the lens. Therefore, the airtightness between the lens and the metal lens barrel can be improved.

【先行技術文獻】 [First technical literature] 【專利文獻】 [Patent Literature]

【專利文獻1】日本特開2009-37055號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-37055

使用先前之衝壓鏡頭之光模組用鏡頭蓋,係鏡筒 材質的線膨脹係數大於10ppm/K,所以,因為鏡頭蓋的溫度變化(△T=70K),自鏡筒底面至鏡頭之距離係2~5μm左右變動。因此,鏡頭與光半導體元件的發光點間之距離會改變,鏡頭的聚光位置會變動,所以,產生光輸出變動。 Lens cap for a light module using a previously punched lens, a lens barrel Since the linear expansion coefficient of the material is larger than 10 ppm/K, the distance from the bottom surface of the lens barrel to the lens varies from 2 to 5 μm because of the temperature change of the lens cover (ΔT=70K). Therefore, the distance between the lens and the light-emitting point of the optical semiconductor element changes, and the position where the lens is concentrated changes, so that the light output changes.

為抑制此變動,採用在組裝光半導體元件之部分,使用線膨脹係數10ppm/K左右之材料,使得光半導體元件的發光點的位置追蹤鏡頭的位置變動,或者,安裝鏡頭到光半導體元件的組裝面之方法等。但是,在前者之方法中,EML晶片等,在使組裝晶片之部分保持一定溫度之製品上無法使用,在後者之方法中,會有零件數量增加之問題。 In order to suppress this variation, a material having a linear expansion coefficient of about 10 ppm/K is used in the portion where the optical semiconductor element is assembled, so that the position of the light-emitting point of the optical semiconductor element tracks the positional change of the lens, or the mounting of the lens to the assembly of the optical semiconductor element is performed. The method of the face, etc. However, in the former method, the EML wafer or the like cannot be used in a product in which a part of the assembled wafer is kept at a certain temperature, and in the latter method, there is a problem that the number of parts is increased.

為減少熱變形量,有改變鏡筒材質為線膨脹係數較小材質(例如線膨脹係數係8ppm/K以下之科伐合金(Kovar)或Fe-42Ni)之方法。但是,因為線膨脹係數小於鏡頭,所以,金屬鏡筒與鏡頭間的熱填縫之力量會減少,產生氦氣洩漏(1×10-5Pa.m3/s以上),而有損害氣密性之問題。而且,也有使預先成形之衝壓鏡頭嵌入開孔之金屬鏡筒,使用低熔點玻璃以固定之方法,但是,鏡頭與鏡筒間之位置精度較差。 In order to reduce the amount of thermal deformation, there is a method of changing the material of the lens barrel to a material having a small coefficient of linear expansion (for example, Kovar or Fe-42Ni having a coefficient of linear expansion of 8 ppm/K or less). However, because the coefficient of linear expansion is smaller than that of the lens, the force of hot caulking between the metal barrel and the lens is reduced, resulting in helium leakage (1 × 10 -5 Pa.m 3 /s or more), which is harmful to airtightness. Sexual problem. Further, there is also a metal lens barrel in which a pre-formed punching lens is fitted into an opening, and a low-melting glass is used for fixing, but the positional accuracy between the lens and the lens barrel is poor.

本發明係為解決上述課題而研發出者,其目的在於提供一種可防止光輸出變動,確保氣密性之光模組用鏡頭蓋、光模組以及光模組用鏡頭蓋之製造方法。 The present invention has been made to solve the above problems, and an object of the present invention is to provide a lens cover for an optical module, an optical module, and a lens cover for an optical module, which are capable of preventing light output fluctuation and ensuring airtightness.

本發明之光模組用鏡頭蓋係具有:鏡筒,由金屬材料構成;以及衝壓鏡頭,由玻璃構成,被前述鏡筒保持;前述玻璃的線膨脹係數係6~8ppm/K,前述金屬材料的線膨脹係 數,係在150~800℃為10ppm/K以上,100℃以下為8ppm/K以下。 The lens cover for an optical module of the present invention comprises: a lens barrel made of a metal material; and a stamping lens made of glass and held by the lens barrel; the glass has a linear expansion coefficient of 6 to 8 ppm/K, and the metal material Linear expansion system The number is 10 ppm/K or more at 150 to 800 ° C, and 8 ppm/K or less at 100 ° C or less.

在本發明中,鏡筒的金屬材料的線膨脹係數在100℃以下時較小,所以,可減少由鏡筒的熱變形所致之鏡頭位置變動,可防止光輸出變動。又,在150~800℃中,金屬材料的線膨脹係數比玻璃大,所以,可充分發揮鏡筒與鏡頭間之熱填縫的力量,可確保氣密性。 In the present invention, since the linear expansion coefficient of the metal material of the lens barrel is small at 100 ° C or lower, the lens position variation due to thermal deformation of the lens barrel can be reduced, and the light output can be prevented from fluctuating. Further, in the case of 150 to 800 ° C, since the linear expansion coefficient of the metal material is larger than that of the glass, the strength of the hot caulking between the lens barrel and the lens can be sufficiently exerted, and the airtightness can be ensured.

1‧‧‧光模組用鏡頭蓋 1‧‧‧ lens cap for optical module

2‧‧‧鏡筒 2‧‧‧Mirror tube

3‧‧‧衝壓鏡頭 3‧‧‧ punching lens

7‧‧‧光半導體元件 7‧‧‧Optical semiconductor components

第1圖係表示本發明實施形態的光模組用鏡頭蓋之剖面圖。 Fig. 1 is a cross-sectional view showing a lens cover for an optical module according to an embodiment of the present invention.

第2圖係表示衝壓鏡頭用玻璃與鏡筒的金屬材料的線膨脹係數之圖面。 Fig. 2 is a view showing a linear expansion coefficient of a metal material for a press lens and a metal material of the lens barrel.

第3圖係表示本發明實施形態的光模組之正視圖。 Fig. 3 is a front elevational view showing an optical module according to an embodiment of the present invention.

第4圖係沿著第3圖I-II線之剖面圖。 Fig. 4 is a cross-sectional view taken along line I-II of Fig. 3.

第5圖係表示安裝本發明實施形態的光模組到插座之狀態之剖面圖。 Fig. 5 is a cross-sectional view showing a state in which an optical module according to an embodiment of the present invention is mounted to a socket.

第6圖係表示本發明實施形態的光模組的變形例之剖面圖。 Fig. 6 is a cross-sectional view showing a modification of the optical module according to the embodiment of the present invention.

第1圖係表示本發明實施形態的光模組用鏡頭蓋之剖面圖。光模組用鏡頭蓋1具有鏡筒2、及被鏡筒2保持之衝壓鏡頭3。鏡筒2由金屬材料構成,衝壓鏡頭3由玻璃構成。 具體說來,金屬材料係不變鋼()、超級不變鋼( )及不鏽不變鋼()中之一者(不變鋼係Aperam Alloy Imphy公司的註冊商標)。 Fig. 1 is a cross-sectional view showing a lens cover for an optical module according to an embodiment of the present invention. The lens cover 1 for an optical module has a lens barrel 2, and a punching lens 3 held by the lens barrel 2. The lens barrel 2 is made of a metal material, and the punching lens 3 is made of glass. Specifically, the metal material is a constant steel ( ), super invariable steel ( ) and stainless steel ( One of them (registered trademark of Aperam Alloy Imphy, Inc.).

第2圖係表示衝壓鏡頭用玻璃與鏡筒的金屬材料的線膨脹係數之圖面。玻璃的線膨脹係數係由溫度所致之變化較少,其係6~8ppm/K。金屬材料的線膨脹係數在150~800℃係10ppm/K以上(例如在300℃係10~15ppm/K),在100℃以下係8ppm/K以下。 Fig. 2 is a view showing a linear expansion coefficient of a metal material for a press lens and a metal material of the lens barrel. The coefficient of linear expansion of glass is less due to temperature, which is 6-8 ppm/K. The linear expansion coefficient of the metal material is 10 ppm/K or more at 150 to 800 ° C (for example, 10 to 15 ppm/K at 300 ° C), and is 8 ppm/K or less at 100 ° C or lower.

說明上述光模組用鏡頭蓋1之製造方法。首先,形成由金屬材料構成之鏡筒2。接著,對於鏡筒2藉加壓衝壓成形玻璃,藉此,形成被鏡筒2保持之衝壓鏡頭3。 A method of manufacturing the lens cover 1 for the optical module will be described. First, a lens barrel 2 made of a metal material is formed. Next, the lens barrel 2 is formed by press-forming the glass, whereby the punching lens 3 held by the lens barrel 2 is formed.

在此,加壓衝壓時之溫度係600~800℃。在此溫度下,鏡筒2的線膨脹係數較高,所以,在加壓衝壓後之冷卻過程中,進行自鏡筒2往衝壓鏡頭3之熱填縫。在150~250℃中,衝壓鏡頭3與鏡筒2的線膨脹係數的大小逆轉,但是,由到此為止之熱填縫所致之壓力被積存。因此,在光模組的使用溫度範圍(140~100℃)中,殘留充分鎖固力,可確保氣密性。 Here, the temperature at the time of press-pressing is 600 to 800 °C. At this temperature, the linear expansion coefficient of the lens barrel 2 is high, so that the hot caulking from the lens barrel 2 to the punching lens 3 is performed during the cooling process after the press-pressing. At 150 to 250 ° C, the magnitude of the linear expansion coefficient of the punching lens 3 and the lens barrel 2 is reversed, but the pressure due to the hot caulking up to this point is accumulated. Therefore, in the operating temperature range (140 to 100 ° C) of the optical module, sufficient locking force remains to ensure airtightness.

另外,科伐合金(Kovar)的線膨脹係數,係在全溫度範圍中,總是比玻璃小,沒有由熱收縮所致之玻璃鎖固。因此,在使用由科伐合金(Kovar)構成之鏡筒之先前技術中,有損害光模組用鏡頭蓋內之氣密性之問題。 In addition, Kovar's coefficient of linear expansion is always in the full temperature range, smaller than glass, and there is no glass lock caused by heat shrinkage. Therefore, in the prior art using the lens barrel composed of Kovar, there is a problem that the airtightness in the lens cover for the optical module is impaired.

第3圖係表示本發明實施形態的光模組之正視圖。第4圖係沿著第3圖I-II線之剖面圖。中介著珀爾帖模組 5,在桿體4上設有金屬塊6。在此金屬塊6上,設有半導體雷射等之光半導體元件7。珀爾帖模組5係進行光半導體元件7之冷卻。 Fig. 3 is a front elevational view showing an optical module according to an embodiment of the present invention. Fig. 4 is a cross-sectional view taken along line I-II of Fig. 3. Intermediary Peltier module 5. A metal block 6 is provided on the rod 4. On the metal block 6, an optical semiconductor element 7 such as a semiconductor laser is provided. The Peltier module 5 performs cooling of the optical semiconductor element 7.

光模組用鏡頭蓋1係被被覆,使得覆蓋光半導體元件7,其被熔接在桿體4上。光半導體元件7係在光模組用鏡頭蓋1的鏡筒2內,被配置在衝壓鏡頭3的聚光位置。在鏡筒2內填充有氦氣。 The lens cover 1 for the optical module is covered so as to cover the optical semiconductor element 7, which is welded to the rod 4. The optical semiconductor element 7 is placed in the lens barrel 2 of the lens cover 1 for an optical module, and is disposed at a condensing position of the punch lens 3. The lens barrel 2 is filled with helium gas.

第5圖係表示安裝本發明實施形態的光模組到插座之狀態之剖面圖。光模組透過插座用保持器9,被安裝在插座8上,使得中介著衝壓鏡頭3,光半導體元件7與插座8的光纖相向。 Fig. 5 is a cross-sectional view showing a state in which an optical module according to an embodiment of the present invention is mounted to a socket. The optical module is mounted on the socket 8 through the socket holder 9, so that the punch lens 3 is interposed, and the optical semiconductor element 7 faces the optical fiber of the socket 8.

以上,如上所述,在本實施形態中,鏡筒2的金屬材料的線膨脹係數在100℃以下時係8ppm/K以下而較小,所以,由70K的溫度變化所做之鏡頭位置變動也可減少1~3μm。結果,可防止光輸出變動。 As described above, in the present embodiment, the linear expansion coefficient of the metal material of the lens barrel 2 is less than 8 ppm/K at 100 ° C or less, so that the lens position change by the temperature change of 70 K is also Can be reduced by 1~3μm. As a result, the light output can be prevented from changing.

又,在150~800℃時,金屬材料的線膨脹係數比玻璃大,所以,可充分發揮鏡筒2與衝壓鏡頭3間之熱填縫的力量,以確保光模組用鏡頭蓋1內部的氣密性。因此,氦氣之自鏡筒2洩漏之洩漏率小於1×10-9Pa.m3/s。 Moreover, since the linear expansion coefficient of the metal material is larger than that of the glass at 150 to 800 ° C, the force of the hot caulking between the lens barrel 2 and the punch lens 3 can be sufficiently exerted to ensure the inside of the lens cover 1 for the optical module. Air tightness. Therefore, the leak rate of helium from the lens barrel 2 is less than 1 × 10 -9 Pa. m 3 /s.

而且,當玻璃的線膨脹係數過大時,在自玻璃成形溫度往常溫冷卻時,玻璃的收縮量變大,由熱填縫所致之壓力不足,而氣密耐性降低。因此,最好玻璃的線膨脹係數不要過大。 Further, when the coefficient of linear expansion of the glass is too large, the amount of shrinkage of the glass becomes large at the time of cooling from the glass forming temperature to normal temperature, the pressure due to the hot caulking is insufficient, and the airtightness is lowered. Therefore, it is preferable that the coefficient of linear expansion of the glass is not excessive.

第6圖係表示本發明實施形態的光模組的變形例 之剖面圖。在桿體4上直接設有金屬塊6。如此一來,即使沒有珀爾帖模組5,也可以獲得與上述實施形態相同之效果。 Figure 6 is a view showing a modification of the optical module according to the embodiment of the present invention. Sectional view. A metal block 6 is directly provided on the rod 4. As a result, even if the Peltier module 5 is not provided, the same effects as those of the above embodiment can be obtained.

1‧‧‧光模組用鏡頭蓋 1‧‧‧ lens cap for optical module

2‧‧‧鏡筒 2‧‧‧Mirror tube

3‧‧‧衝壓鏡頭 3‧‧‧ punching lens

Claims (6)

一種光模組用鏡頭蓋,具有:鏡筒,由金屬材料構成;以及衝壓鏡頭,由玻璃構成,其被前述鏡筒保持,前述玻璃的線膨脹係數係6~8ppm/K,前述金屬材料的線膨脹係數,係在150~800℃為10ppm/K以上,100℃以下為8ppm/K以下。 A lens cover for an optical module, comprising: a lens barrel, which is made of a metal material; and a stamping lens, which is made of glass, which is held by the lens barrel, and the linear expansion coefficient of the glass is 6-8 ppm/K, and the metal material is The coefficient of linear expansion is 10 ppm/K or more at 150 to 800 ° C and 8 ppm/K or less at 100 ° C or less. 如申請專利範圍第1項所述之光模組用鏡頭蓋,其中,前述金屬材料係不變鋼、超級不變鋼及不鏽不變鋼中之一者。 The lens cover for an optical module according to claim 1, wherein the metal material is one of a constant steel, a super invariable steel, and a stainless non-ferrous steel. 一種光模組,具有:光模組用鏡頭蓋,申請專利範圍第1項或第2項所述者;以及光半導體元件,在前述鏡筒內,被配置於前述衝壓鏡頭之聚光位置。 An optical module comprising: a lens cover for an optical module, which is described in claim 1 or 2; and an optical semiconductor element disposed in the condensing position of the punching lens in the lens barrel. 如申請專利範圍第3項所述之光模組,其中,而且具有被填充在前述鏡筒內之氦氣,前述氦氣之自前述鏡筒洩漏之洩漏率係1×10-9Pa.m3/s以下。 The optical module of claim 3, wherein the helium gas filled in the lens barrel has a leakage rate of 1×10 -9 Pa from the lens barrel. Below m 3 /s. 一種光模組用鏡頭蓋之製造方法,具有:形成由金屬材料構成之鏡筒之工序;以及對於前述鏡筒藉加壓衝壓成形玻璃,藉此,形成被前述鏡筒保持之衝壓鏡頭之工序,前述玻璃的線膨脹係數係6~8ppm/K,前述金屬材料的線膨脹係數,係在150~800℃為10ppm/K 以上,100℃以下為8ppm/K以下。 A manufacturing method of a lens cover for an optical module, comprising: a step of forming a lens barrel made of a metal material; and a step of forming a punching lens held by the lens barrel by press-forming a glass to the lens barrel The linear expansion coefficient of the glass is 6-8 ppm/K, and the linear expansion coefficient of the metal material is 10 ppm/K at 150 to 800 °C. Above 100 ° C or less is 8 ppm / K or less. 如申請專利範圍第5項所述光模組用鏡頭蓋之製造方法,其中,前述加壓衝壓時之溫度係600~800℃。 The method of manufacturing a lens cover for an optical module according to claim 5, wherein the temperature at the time of the press press is 600 to 800 °C.
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Publication number Priority date Publication date Assignee Title
CN106707725B (en) * 2017-01-20 2022-07-22 中国电子科技集团公司第十二研究所 Optical transmission window for atomic clock
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101398523A (en) * 2007-09-28 2009-04-01 阿尔卑斯电气株式会社 Lens barrel assembly
WO2010061604A1 (en) * 2008-11-28 2010-06-03 住友電気工業株式会社 Lens unit and infrared lens unit for mounting on vehicle

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59180515A (en) * 1983-03-31 1984-10-13 Toshiba Corp Light emitting element for optical fiber connection
JPH02156587A (en) 1988-12-08 1990-06-15 Matsushita Electric Ind Co Ltd Semiconductor laser retaining apparatus
DE4118523A1 (en) * 1991-02-19 1992-08-20 Leica Industrieverwaltung AXIALSYMMETRIC JOINT CONNECTION WITH HIGH THERMAL LOAD CAPACITY
JP2002296530A (en) 2001-03-30 2002-10-09 Hitachi Koki Co Ltd Optical fiber optical device
JP3955065B2 (en) * 2005-01-18 2007-08-08 シャープ株式会社 Optical coupler
JP2009037055A (en) 2007-08-02 2009-02-19 Hitachi Maxell Ltd Optical element with lens barrel and metallic die for molding optical element
CN103403598A (en) * 2011-03-03 2013-11-20 阿尔卑斯电气株式会社 Lens with lens barrel and production method for lens with lens barrel
CN102798955B (en) * 2011-05-23 2014-12-17 亚洲光学股份有限公司 Lens of projector
CN203178544U (en) * 2013-04-16 2013-09-04 北极光电(深圳)有限公司 Structure used for improving temperature characteristic of optical passive device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101398523A (en) * 2007-09-28 2009-04-01 阿尔卑斯电气株式会社 Lens barrel assembly
WO2010061604A1 (en) * 2008-11-28 2010-06-03 住友電気工業株式会社 Lens unit and infrared lens unit for mounting on vehicle

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