TWI506324B - Arrangement of optical fibers, and a method of forming such arrangement - Google Patents

Description

Fiber configuration and method of forming such a configuration

The present invention relates to the configuration of optical fibers. The invention further relates to a method of forming an optical fiber array. Finally, the invention relates to a modulation device and a lithography etching apparatus comprising the configuration.

A charged particle multiple beam system is known in the art, for example, from the texts of U.S. Patent No. 6,958,804 and/or WO 2009/127659, both of which are incorporated in the name of the applicant, the Adjusted for very high volume operations. This lithography system can utilize a plurality of charged particle beamlets to convey the pattern to the target surface. The system can operate from a continuous source of radiation or a source that operates at a fixed frequency. The pattern data can be transmitted to the modulation device by the pattern data load beam. The modulation device can then contain photosensitive members that are capable of converting the received optical signal into a corresponding electrical signal. The electrical signals are then utilized to modulate the small beams by electrostatic deflection. Finally, the modulated small beam is transmitted to the target surface.

Optical fibers can be used to transmit these modulated beams. For accurate data transfer, these fibers are rigorously calibrated relative to the photosensitive member to provide accurate and reliable data transfer. In the multi-beam charged particle lithography etching system as described above, the number of optical fibers is extremely large, and the number of steps of 10,000 can be easily achieved. Therefore, it is necessary to perform the positioning operation of the optical fiber very accurately. This correct positioning is not intuitive. In addition to these, a lot of The volume occupied by the fiber is preferably reduced as much as possible to limit the size of the device. Accordingly, the subject matter of the present invention is to provide a fiber optic configuration or fiber optic array that has very accurate fiber positioning while occupying a limited space.

The present invention, in one feature thereof, provides a method of forming an optical fiber array, the method comprising: providing a substrate having a first surface and an opposite second surface, the substrate being provided with a plurality of extending from the first surface a substrate to the aperture of the second surface; providing a plurality of optical fibers comprising fiber ends having a diameter smaller than a minimum diameter of the apertures; for each of the fibers, inserting the fibers from the first surface side of the substrate a corresponding aperture within the aperture such that the fiber end is positioned adjacent the second surface and bends the fiber in a predetermined direction such that the fiber abuts the sidewall of the aperture at a predetermined location; and utilizes an adhesive material The bent optical fibers are joined together.

The apertures in the substrate may be arranged in an array at locations corresponding to an array of photosensitive members, such as photodiodes. The substrate can be used to position the ends of the fibers at positions corresponding to an array of photosensitive members such as photodiodes, the second surface of the substrate facing the photosensitive members, and the first surface is away from the Waiting for it. The ends of the fibers can be positioned such that light emitted from the ends of the fibers is directed onto the photosensitive members.

The fibers may have an outer layer or a coating, and the layer may be stripped from portions of the fibers to be inserted into the apertures, or The fiber is inserted into the apertures without stripping. Since the ends of the fibers have a diameter that is less than the smallest diameter of the apertures, stripping the outer layer or plating will reduce the desired diameter of the apertures.

The fibers are inserted sufficiently deep into the apertures from the first surface side of the substrate such that the ends of the fibers are filled to the second surface or are located within the apertures close to the second surface, or slightly Extending out of the outer aperture of the aperture. Alternatively, the fibers can be inserted through the apertures and the protruding portions of the fibers can be cut to position the ends of the fibers in close proximity to the second surface.

Each of the optical fibers is inserted into the corresponding aperture from the first surface side of the substrate, and a length of the optical fiber is left from the aperture at the first surface side, and the length of the extended optical fiber is in a predetermined direction Bend. All fibers can be bent in the same direction. The flexing amount of each of the optical fibers is sufficient to push into at least a portion of the optical fiber positioned within the corresponding aperture and abut against the sidewall of the aperture at a predetermined location. The bending process of each of the optical fibers can be performed by a predetermined amount and at a predetermined position sufficiently close to the corresponding aperture, so that at least a portion of the optical fiber positioned within the corresponding aperture is pushed in The predetermined position is abutted against the side wall of the aperture. Each of the fibers may have a length of fiber extending from the aperture at a first surface side of the substrate, and at least a portion of the length of the extended fiber may be bent in a predetermined direction. The aperture in the substrate may be configured in a two-dimensional array having a plurality of courses, each of the fibers having a length of fiber extending from the aperture at a first surface side of the substrate, and The first radius of curvature is bent through the optical fiber inserted in the first aperture course and according to the second larger The radius of curvature bends through the fiber inserted in the next adjacent aperture course to bend the fiber.

The warp-twisted fibers can be stacked in a predetermined spatial arrangement and stacked in a rectangular configuration. Each of the fibers may have a length of fiber extending from the aperture at the first surface side of the substrate. At least a portion of the length of the extended fiber can be configured to extend in a manner generally parallel to the first surface. At least a portion of the length of the extended fiber may be configured to extend in a predetermined spatial configuration in a manner substantially parallel to each other in the same direction. The predetermined spatial configuration can include equidistant spacing of the lengths of the elongated fibers in the array formation, and spacer members can be placed between the lengths of the extended fibers for positioning the elongated fiber lengths relative to one another.

At least a portion of the length of the extended fibers can be attached to each other using an adhesive material. The portion of the length of the extended fiber that is joined together may include a bent partial or unbent portion or both a bent and an unbent portion. The adhesive material may comprise a glue, epoxy or epoxy sealant. The attachment can include curing the adhesive applied to the fibers. The curing can include exposing the adhesive to UV light and/or can include applying thermal energy to the adhesive.

The ends of the fibers can be fixed within the apertures. All of the fibers can be inserted into the corresponding apertures first, and then the ends of the fibers are fixed in the apertures. Adhesives can be utilized to secure the ends of the fibers in the apertures. Adhesives may be applied to the ends of the fibers prior to insertion of the fibers into the apertures, and securing the ends of the fibers may include curing the adhesive applied to the ends of the fibers. The curing may include exposing the adhesive In the UV light, and/or may include applying thermal energy to the adhesive. Alternatively, the ends of the fibers can be secured by clamping.

The method can further include polishing a second surface of the substrate. This polishing process can include polishing both the ends of the fibers and the second surface.

The apertures may have a cross-sectional shape consisting of a circular portion and an additional portion in the form of a groove, and the fibers may be bent in this direction so that the predetermined position of the fibers abutting the sidewall of the aperture is Located within this extra part. The grooves may form a wedge shape and the fibers are in close proximity to the two opposing portions of the wedge shape. The bending amount of each of the optical fibers may be sufficient to push at least a portion of the optical fiber positioned in the corresponding aperture into the trench. The apertures in the substrate may be arranged in an array at positions corresponding to an array of photosensitive members, such as photodiodes, and the grooves in the respective apertures may be positioned such that the ends of the fibers are positioned relative to the photosensitive The desired location of the component.

The fibers can be bent atop the bent structure. The bent structure may constitute an integral part of the substrate at the first surface side of the substrate, or the bent structure may be a temporary removable structure. The fiber bending can be performed by bending a portion of the fibers on the curved section of the bent structure such that the curvature of the partially bent portion of the fibers follows the curvature of the bent structure. The aperture in the substrate can be configured in a two-dimensional array having a plurality of courses, each of the fibers having a length of fiber extending from the aperture at the first surface side of the substrate, and The curved section of the bent structure is bent over the optical fiber inserted in the first aperture course to bend the optical fiber, so that the bent portion of the optical fiber in the first aperture course The curvature follows the curvature of the bent structure. The bending of the optical fiber inserted in the next adjacent aperture course may be performed by bending on the curved section of the optical fiber inserted in the first aperture course and inserted into the next adjacent aperture The fiber in the course is carried out. The bending of the optical fibers inserted into the respective aperture courses can be performed by bending the optical fibers over the curved segments of the optical fibers inserted into the previous aperture courses.

Attaching the warp-knitted fibers may include: forming a mold adjacent the plurality of bent optical fibers; filling the mold with an adhesive material; and curing the adhesive material. The obtained attachment structure can increase the hardness and structural integration of the bent fibers.

Another feature of the present invention provides a fiber optic configuration comprising: a substrate having a first surface and an opposite second surface, the substrate being provided with a plurality of extending from the first surface through the substrate to the The aperture of the second surface; a plurality of optical fibers, each of the optical fibers comprising an end of the optical fiber having a diameter that is less than a corresponding diameter of the corresponding aperture in the substrate. Each of the optical fibers is inserted into a corresponding aperture from a first surface side of the substrate such that the end of the optical fiber is positioned in close proximity to the second surface, and the optical fiber has a section extending from the aperture from the first surface length. The length of extension of each of the optical fibers is bent in a predetermined direction, so that the optical fiber abuts against the side wall of the corresponding aperture at a predetermined position, and the adhesive is used to attach the extended length of the optical fibers.

The apertures in the substrate can be arranged in an array at locations corresponding to the array of photosensitive members, thereby positioning the ends of the fibers to direct light emitted from the ends of the fibers to the photosensitive members.

The lengths of the fibers can all be bent in the same direction. The aperture in the substrate may be configured in a two-dimensional array having a plurality of courses, and the optical fiber inserted in the first aperture row has a portion of the extended length that is bent by the first radius of curvature And an optical fiber inserted through the next adjacent aperture train has a portion of its extended length that is bent by a second, larger radius of curvature. Or alternatively, the aperture in the substrate may be configured in a two-dimensional array having a plurality of courses, and all of the optical fibers inserted in each of the aperture courses have the same radius of curvature in their extended lengths. The portion of the bend is also the same as the radius of curvature of the fibers of each row.

At least a portion of the extended length of the fibers may be stacked in a predetermined spatial configuration and may be stacked in a rectangular configuration. At least a portion of the length of the extended fiber may be configured to extend in a manner substantially parallel to the first surface. At least a portion of the length of the extended fiber may be configured to extend in a predetermined spatial configuration in a manner substantially parallel to each other in the same direction. The predetermined spatial configuration can include equidistant spacing of the lengths of the elongated fibers in the array formation, and spacer members can be placed between the lengths of the extended fibers for positioning the elongated fiber lengths relative to one another.

At least a portion of the length of the extended fibers can be attached using an adhesive. The ends of the fibers can be fixed within the apertures and an adhesive can be utilized to secure the ends of the fibers. The adhesive used to attach the extensions and/or the ends of the fibers comprises an adhesive, epoxy or epoxy sealant.

At least a portion of the extended length of the optical fibers may be bent according to the present disclosure, stacked according to the spatial configuration of the present disclosure, and according to the present disclosure Attached together to form a unitary structure. Such a unitary structure is substantially rigid and can be encapsulated within an encapsulation structure.

The apertures may have a cross-sectional shape consisting of a circular portion and an additional portion in the form of a groove, and the fibers may be bent in this direction so that the predetermined position of the fibers abutting the sidewall of the aperture is Located within this extra part.

Various specific embodiments of the invention are described hereinafter, and are provided by way of example only and with reference to the drawings. The drawings are not drawn to scale and are for illustrative purposes only.

1 shows a simplified schematic of a specific embodiment of a charged particle multiple beam lithography system 1. The lithography etching system 1 may suitably include a small beam generator, which may generate a plurality of small beams; a small beam modulator, which may pattern the small beams to form a plurality of modulated small beams; And a small beam projector for projecting the modulated small beam onto the surface of the target.

The beamlet generator typically contains a source and at least one beam splitter. The source in Figure 1 is an electron source 3 that is configured to produce a substantially homogenous and extensible electron beam 4. The beam energy of the electron beam 4 is preferably maintained at a relatively low level in the range of about 1 to 10 keV. For this purpose, the accelerating voltage is preferably low, and the electron source 3 can be maintained at a voltage between about -1 and -10 kV with respect to the target at the ground potential, although other settings can be used. .

In Fig. 1, an electron beam 4 from the electron source 3 passes through a collimating lens 5 to calibrate the electron beam 4. The calibration lens 5 can be any calibration optical system. Prior to calibration, the electron beam 4 can pass through a double octopole (not shown). The electron beam 4 then strikes the beam splitter, which in the particular embodiment of Fig. 1 is an aperture array 6. The aperture array 6 preferably includes a flat plate having a plurality of through holes. The aperture array 6 is configured to block a portion of the electron beam 4. Furthermore, the array 6 allows a plurality of small beams 7 to pass to produce a plurality of parallel electron beamlets 7.

The lithography etching system of Figure 1 can produce a large number of small beams 7, preferably about 10,000 to 1,000,000 small beams, while producing more or less small beams. It is noted that other known methods can also be employed to produce a calibrated beamlet. A second array of apertures can be added to the system whereby a sub-beam is generated from the electron beam 4 and an electron beam 7 is generated from the sub-beam. This allows for further downstream manipulation of the sub-beams, which in turn facilitates system operation, especially when the number of small beams within the system is 5,000 or more.

The small beam modulator, labeled as modulation system 8, in Fig. 1, contains a small beam blanker array 9, which includes a plurality of blanker configurations, and a small beam stop array 10. The blankers are capable of deflecting one or more of the electron beamlets 7. In a specific embodiment of the invention, the blankers are more specifically electrostatic displacers, which are provided with a first electrode, a second electrode and an aperture. The electrodes are then placed on opposite sides of the aperture for generating an electric field across the aperture. In general, the second electrode is a ground electrode, that is, an electrode connected to a ground potential.

Focusing the electron beamlets 7 on the plane of the blanker array 9 The lithography system can further include a concentrating lens array (not shown).

In the particular embodiment of FIG. 1, the small beam stop-resistance array 10 includes an array of apertures through which small beams can pass. The small beam stop array 10 includes, in its basic form, a substrate disposed with a plurality of through holes, which are generally circular holes, although other shapes are possible. In some embodiments, the substrate of the small beam stop-resistance array 10 is constructed of a enamel wafer having an array of regularly spaced through-holes and may be plated with a surface metal layer to avoid surface charging. In some further embodiments, the metal is a type that does not form a native oxide skin layer, such as CrMo.

The beamlet blanker array 9 and the beam stop array 10 operate in unison to block or permit the punchthrough of the beamlets 7. In some embodiments, the aperture of the small beam stop-resistance array 10 is the aperture of an electrostatic deflector aligned within the beamlet blanker array 9. If the beamlet blanker array 9 deflects a small beam, the person will not pass through the small beam to stop the corresponding aperture in the array 10. Conversely, the beam will be blocked by the substrate of the small beam stop array 10. If the beamlet blanker array 9 does not deflect a small beam, the beamlet will pass through the small beam to stop the corresponding aperture in the array 10. In some alternative embodiments, the cooperative operation between the beamlet blanker array 9 and the beamlet stop array 10 allows the deflector in the beamlet blanker array 9 to be paired with a small beam. The deflection allows the small beam to pass through the corresponding aperture in the array 10 through the small beam, while the non-deflection causes the substrate of the small beam stop array 10 to be blocked.

The modulation system 8 is configured to be provided by the control unit 20 A pattern is added to the small beams 7 based on the input. The control unit 20 can include a data storage unit 21, a readout unit 22, and a data converter 23. The control unit 20 can be located at a distal end from the rest of the system, such as a location outside the clean room. The control system can be further coupled to the actuator system 16. The actuator system is configured to facilitate relative movement of the electro-optical array and target positioning system 14 represented by the dashed lines of FIG.

The modulated beam 24 holding the patterned material can be transmitted to the beam blanker array 9 using an optical fiber. In particular, the modulated beam 24 from the end of the fiber is projected onto the corresponding photosensitive member on the beam blanker array 9. The photosensitive members can be configured to convert optical signals into different types of signals, such as electrical signals. Once modulated, the beam 24 is loaded with a portion of the patterned material for controlling one or more of the blankers coupled to the corresponding photosensitive member. In some embodiments, the beams can be transmitted at least partially toward the photosensitive members by optical waveguides.

The modulated small beam emitted from the small beam modulator is projected onto the target surface of the target 13 as a spot by means of a small beam projector. The beamlet projector typically includes a scanning deflector for scanning the modulated beam of light on the target surface, and a projection lens system whereby the modulated beamlets are focused onto the target surface. These components can appear in a single end module.

Preferably, the end module is constructed in such a manner as to be insertable or replaceable. Therefore, the end module can include a deflector array 11 and a projection lens arrangement 12. The insertable, replaceable unit can also include a small beam stop-resistance array 10 as discussed above with reference to the small beam modulator. Leaving the end After the module, the small beams 7 impinge upon the target surface disposed at the target plane. For lithography etching applications, the target 13 comprises a wafer that is provided with a charged particle sensitive layer or photoresist layer.

The deflector array 11 can take the form of a scan deflector array that is configured to deflect the individual beamlets 7 through the small beam stop array 10. The deflector array 11 can contain a plurality of electrostatic deflectors for applying a relatively small drive voltage. The deflector array 11 is depicted as being positioned upstream of the projection lens arrangement 12, although the deflector array 11 can also be disposed between the projection lens arrangement 12 and the target surface.

The projection lens arrangement 12 is configured to focus the small beams 7 before or after being deflected by the deflector array 11. Preferably, the result of the focusing results in a geometric spot size of about 10 to 30 nanometers in diameter. In the preferred embodiment of the present invention, the projection lens arrangement 12 is preferably configured to provide a de-amplification result of about 100 to 500 times, particularly as high as possible, i.e., in the range of 300 to 500 times. In the preferred embodiment of the present invention, the projection lens arrangement 12 can be advantageously positioned adjacent to the target surface.

In some embodiments, a beam projector (not shown) can be placed between the target surface and the projection lens arrangement 12. The beam projector can be a foil layer or plate provided with a plurality of appropriately positioned apertures. The beam projector is configured to absorb before the released photoresist particles are able to touch any sensitive components within the lithography etching system 1.

Thus, the projection lens arrangement 12 ensures that the spot size of a single pixel on the target surface is correct, while at the same time the micro deflector array 11 can ensure that the pixel is on the target surface by appropriate scanning operations. of The location is correct. In particular, the operation of the deflector array 11 is such that the pixels can be fitted to a pixel grid that ultimately forms the pattern on the target surface. It will be appreciated that the target positioning system 14 can be utilized to properly provide a generalized proportional positioning of the pixel on the target surface.

In general, the target surface contains a photoresist film layer on top of the substrate. The photonic layer will be chemically modified by applying a small beam of charged particles. Therefore, the irradiated portion of the film layer will be more or less dissolved in the fixer, so that a photoresist pattern on the wafer is obtained. The photoresist pattern on the wafer can be subsequently conveyed to the underlying layer, such as by implantation, etching, and/or deposition steps as is well known in the semiconductor fabrication industry. Obviously, if the radiation is not uniform, the photoresist may not be fixed in a uniform manner, resulting in a pattern error. Therefore, high quality projection is closely related to get a lithography etching system that provides reproducible results. It is necessary to be able to obtain indifference radiation results from these deflection steps.

Figure 2 is a schematic view showing the operation of a particular embodiment of the small beam blanker array 9 of the lithography etching system of Figure 1. In particular, FIG. 2 is a schematic cross-sectional view showing a portion of a small beam modulator including a small beam blanker array 9 and a small beam stop array 10. The beamlet blanker array 9 is provided with a plurality of apertures. For ease of reference, the target 13 is also labeled. However, this figure is not drawn according to the proportion.

The illustrated portion of the small beam modulator is configured to modulate the three small beams 7a, 7b, and 7c. The small beams 7a, 7b, 7c may form part of a single beamlet group resulting from a beam originating from a single source or from a single beam. The small beam modulator of Figure 2 is configured to concentrate small light The bundle group is oriented toward a common convergence point P for each group. This common convergence point P is preferably located on the optical axis O for the group of small beams.

Considering the small beams 7a, 7b, 7c shown in Figure 2, the small beams 7a, 7c have an angle of incidence extending between the beam and the optical axis O. The pointing of the small beam 7b is substantially parallel to the optical axis. The direction in which the small beam stops the array 10 substrate to cause the deflection of the small beam blocked by the deflected small beam can be different for each small beam. The small beam 7a is blocked by a deflection toward the left side, that is, the "-" direction indicated by the broken line 7a- in Fig. 2. On the other hand, the small beams 7b, 7c should be oriented toward the right, i.e., toward the "+" direction, deflected to create a barrier to individual small beams. These blocking directions are indicated by dashed lines 7b+ and 7c+, respectively. Note that this deflection direction may not be arbitrarily chosen. For example, for the small beam 7a, the dashed line 7a+ shows that the deflection of the right side of the small beam 7a is directed through the small beam stop array 10. Therefore, the deflection of the small beam 7a along the straight line 7a+ is not appropriate. On the other hand, the deflection of the small beam 7b toward the left side indicated by the broken line 7b- is an option.

FIG. 3 shows a simplified block diagram of a modular lithography system 50. The lithography etching system is preferably designed in a modular manner for ease of maintenance. The primary subsystems are preferably constructed in accordance with a self-contained and removable module, and are therefore capable of being removed from the lithography etching machine to minimize the effects on other subsystems. This is particularly advantageous for lithographic etching machines that are enclosed in a vacuum chamber where access to the machine is limited. Therefore, the error subsystem can be quickly removed and replaced without unnecessary disconnection or influence on other systems.

In the embodiment shown in FIG. 3, the modular subsystems include an illumination optics module 81 that includes a charged particle beam source 71 and a beam calibration system 72; an aperture array and a concentrating lens module 82. Included is an aperture array 73 and a concentrating lens array 74; a beam switching module 83, which includes a small beam blanker array 75; and a projection optics module 84, which includes a beam stop array 76, a beam deflector Array 77 and projection lens array 78. The modules can be designed to slide in and out relative to an alignment frame. In the particular embodiment illustrated in FIG. 3, the alignment frame includes alignment of the inner sub-frame 85 and alignment of the outer sub-frame 86. The projection optics module 84 can be coupled to at least one of the aligned inner sub-frame 85 and the aligned outer sub-frame 86 by one or more folds.

The aforementioned components in the illumination optical component module 81, the aperture array and the concentrating lens module 82, the beam switching module 83, and the projection optical component module 84 may be configured for lithography corresponding to FIG. The functionality of similar components within the etching system 1 operates.

In the particular embodiment of FIG. 3, frame 88 supports the aligned sub-frames 85, 86 via a vibration drag reduction mount 87. In the present embodiment, wafer 55 is docked on wafer table 89, which in turn is mounted on a further support structure 90. The combination of the wafer table 89 and the further support structure 90 can be referred to hereinafter as a chuck 90. The chuck 90 is placed on a short stroke 91 and a long stroke 92 stage. The lithography etching apparatus is encapsulated in a vacuum chamber 60, which preferably includes one or more MU metal shielding layers 65. The machine is parked on a substrate plate 95 supported by frame members 96.

Each module may require a large amount of electrical and/or optical signals and Electricity is used for profit. The modules within the vacuum chamber can receive these signals from one or more control systems 99, which are typically located external to the vacuum chamber. The vacuum chamber 60 contains openings, known as ports, from which the cables carrying the signals are loaded into the vacuum casing while maintaining a vacuum-sealed state around the cables. Preferably, each module is provided with an electrical, optical, and/or power cable connector set that has its own route through one or more ports of the dedicated module. This eliminates the need to disconnect, remove, and replace cables for a particular module without affecting the cable used for any other module. In some embodiments, a patch panel can be provided within the vacuum chamber 60. The patch panel includes one or more connectors for removably connecting one or more connections of the modules. One or more ports may be utilized to access the vacuum chamber by accepting one or more connections of the removable modules.

Figure 4 is a schematic cross-sectional view showing a portion of a small beam blanker array 9 that can be used in the lithography etching system of Figure 1. The beamlet blanker array 9 includes a plurality of modulators 101. A modulator includes a first electrode 103a, a second electrode 103b, and an aperture 105. The electrodes 103a, 103b are placed on opposite sides of the aperture 105 to create an electric field across the aperture.

Photosensitive member 107 is configured to receive a pattern data load beam (not shown). The photosensitive member 107 is electrically connected to the one or more modulators 101 through the electrical connection 109. The photosensitive member 107 receives the pattern data via the light beams, converts the optical signals into electrical signals, and then transmits the received signals through the electrical connection 109 toward the one or more connected modulators 101. Converted pattern data. Then, the one or more modulators 101 pass small beams of charged particles according to the received pattern data, such as small electron light. Beam 7, for modulation. The photosensitive member 107 can be provided with an anti-reflective coating 108 to reduce background radiation caused by reflected light, which may interfere with the correct reading of data loaded by the beam.

Figure 5 is a schematic top plan view showing the arrangement of the small beam blanker array 9 that can be used in a particular embodiment of the invention. The small beam blanker array 9 shown in FIG. 5 is divided into a beam area 121 and a non-beam area 122. The widths of the beam regions 121 and the non-beam regions 122 are shown to be approximately the same, but are not necessary. The dimensions of the regions may vary depending on the arrangement used.

The beam areas 121 contain one or more modulators for small beam modulation. The non-beam regions 122 then contain one or more photosensitive members. The use of beam region 121 and non-beam region 122 in an optical queue in a maskless lithography etching system has the advantage of increasing the density of the modulator and photosensitive region.

The beam regions 121 and the non-beam regions 122 are displayed in a configuration that constitutes a perfect rectangle, and the regions may actually constitute a skew configuration to optimally project the small beam onto the target surface, ie, familiar with the item. Those skilled in the art will be able to understand.

Figure 6 is a schematic top plan view showing a further detailed arrangement of a portion of the small beam blanker array 9 that can be used in a particular embodiment of the present invention. The blanker array partially contains a beam region 121 surrounded by a region that remains as a shield structure 141. The beamlet blanker array 9 further contains a non-beam region which is virtually all of the space that does not remain as the beam region 121 and the masking structure 141. The shielding structure 141 is configured to substantially shield the generated electric field in the vicinity of the non-beam region in the vicinity of, for example, a photosensitive member such as a photodiode.

The shield structure 141 can be described as containing sidewalls that form an open end box-like structure. It is noted that the masking structure 141 is not necessarily physically connected to the beamlet blanker array 9. If the shielding structure 141 is located within a sufficiently close distance from the beamlet blanker array 9, the electric field can still be adequately shielded.

A material suitable for the shielding structure 141 is a material having a sufficiently high electrical conductivity. In addition, the material should have sufficient strength and workability. An exemplary suitable material that can be utilized as a primary component of the masking structure is titanium (Ti). Other exemplary materials that may be utilized include molybdenum (Mo) and aluminum (Al). In an exemplary embodiment, the masking structure is fabricated using a Ti plate that is plated with Mo. In another exemplary embodiment, the masking structure comprises a stack of Mo flakes and Al spacers.

The small beam blanker array portion of Figure 6 further includes an optical interface region 143 that is retained to establish optical between the optical fiber for loading the optical signal and the photosensitive member positioned within the small beam blanker array 9. interface. Therefore, the photosensitive members such as the photodiodes are disposed in the optical interface region 143. The fibers can cover the entire optical interface region 143 or a portion thereof. The fibers can be suitably configured such that the electron beamlets within the beam region 121 are not physically blocked during use of the lithography system.

Furthermore, the non-beam region of the beamlet blanker array 9 contains a power interface region 145. The power interface region 145 is configured to accommodate an electrical power configuration whereby power is suitably applied to the photosensitive members positioned within the optical interface region 143, and optionally other components. The power configuration 145 It may extend substantially perpendicular to, and away from, the direction of the beamlet blanker array 9. This configuration 145 allows for the expansion of power lines over large surface areas, thereby improving efficiency and reducing losses due to thermal impedance reduction due to increased radiation surface area.

The location of the power interface region 145 on the sides of the optical interface region 143 provides access to a relatively short power supply line to the photosensitive members. Therefore, it is possible to reduce the variability of the voltage drop between the different power lines, that is, the connection with the adjacent photosensitive member with respect to the connection to the photosensitive member.

The non-beam region may further include an additional interface region 147 for housing further circuitry, such as a clock and/or controller. The power configuration within the power interface area 145 can also be configured to provide sufficient power to the additional interface area 147.

Figure 6 shows a very specific multi-zone arrangement, but it will be understood that different arrangements are possible. As such, the size and shape of the different interface regions may vary depending on the particular application.

FIG. 7A is a schematic illustration of an exemplary fiber optic configuration embodiment 161 that is selectively disposed over the small beam blanker array 9 of FIG. The fiber configuration 161 includes a plurality of fibers 163 that are configured to direct a pattern data load beam toward a photosensitive member within the non-beam region 122. The fibers 163 are arranged such that they do not impede the passage of charged particle beamlets that are configured to pass through the aperture of the beam region 161 of the beamlet blanker array 9.

The exemplary fiber configuration 161 of FIG. 7A is included in each non-beam region 122 There are two parts. The first portion 161a includes a plurality of optical fibers 163 that enter the space above the non-beam region 122 from one side, and the second portion 161b includes a plurality of optical fibers 163 that enter the space above the non-beam region 122 at opposite sides. The number of fibers in each of the portions 161a, 161b may be equal to each other. The use of different portions can provide more space for each of the fibers 163 and reduce the risk of damaging the fibers 163.

Alternatively, all of the optical fibers 163 can enter the space within the non-beam region 122 from one side. In this case, the other side can be utilized to accommodate the power circuit, for example, to supply power to the power line in the power interface within the power interface area 145 of FIG. In addition, the entry of the fiber at one side simplifies maintenance. For example, when performing a fiber replacement operation, only a single side of the system needs to be disassembled.

Fig. 7B is a schematic cross-sectional view showing the configuration shown in Fig. 7A taken along line VIIB-VIIB'. The fiber 163 within the configuration 161 terminates within a body 165 that forms the fiber array. The body 165 is generally in the form of a substrate and will hereinafter be referred to as a substrate 165. The ends of the fibers within the substrate 165 are directed toward photosensitive members (not shown) in the non-beam region of the beamlet blanker array 9. That is, as discussed in further detail below, the substrate 165 is disposed in close proximity to and fixed to or fixed to the surface of the beamlet blanker array 9. This location minimizes alignment errors due to poor pointing fibers 163 within the substrate 165.

FIG. 8 is a schematic view showing a further detailed view of the alignment between the optical fiber 163 in the substrate 165 and the corresponding photosensitive member 107 in the non-beam region of the small beam blanker array 9. The substrate 165 is disposed at a distance from the The photosensitive member 107 is in close proximity, and preferably at a distance of less than about 100 microns, especially at a distance of less than about 50 microns. Due to the short distance between the photosensitive members 107 and the ends of the optical fibers, optical communication by the light beam 170 can be obtained by reducing the light loss.

The alignment of the optical fiber 163 in the substrate 165 with the photosensitive member 107 in the small beam blanker array 9 is fixed. This can be done after the alignment procedure, which can include the use of a marker such as an optical marker on the blanker array 9. Alternatively, both the substrate 165 and the array of photosensitive members 107 on the blanker array 9 are fabricated with sufficient precision so that the two structures can be aligned relative to one another in the corresponding fiber 163 and the photosensitive A sufficient alignment result is obtained between the members 107. If the test result before the actual operation of the lithography etching system shows that the combination of the specific optical fiber 163 and the corresponding photosensitive member 107 is not performed according to a predetermined specification, the control unit may be used to exclude the item during the lithography etching process. combination.

9A, 9B are schematic views showing two different ways of connecting the substrate 165 to the blanker array 9. In both of Figs. 9A and 9B, only a single combination of the optical fiber 163 and the photosensitive member 107 is shown.

The substrate 165 is attached to the blanker array 9 by an adhesive 175 in FIG. 9A. The adhesive 175 can be a suitable adhesive such as an epoxy adhesive. The adhesive 175 is in contact with the blanker array 9 such that there is no contact between the adhesive and the photosensitive member 107. This type of attachment allows for the use of a smaller amount of adhesive and is easy to handle.

As also shown in Figure 8, the beam 170 exiting the fibers 163 is divergent. Therefore, the beam spot size on the surface of the blanker array 9 will follow The distance between the substrate 165 and the blanker array 9 is increased to increase. At the same time, the beam density of the beam spot per unit area is reduced. Therefore, an increase in the distance between the substrate 165 and the blanker array 9 may reduce the portion of the light beam 170 that can be captured by the photosensitive member 107. In particular, in the case where the spot formed on the photosensitive member 107 is designed to be entirely placed in the photosensitive surface of the photosensitive member 107, if the distance between the substrate 165 and the blanker array 9 becomes If it is too long, the alignment error may have a more profound impact.

In some cases, especially when it is not desired to shorten the distance between the optical fiber and the photosensitive member, it is preferable to use a suitable transparent adhesive layer 177, sometimes referred to as an underlying layer, to complete the fixing operation, that is, as shown in the figure. 9B is shown in a thumbnail. The transparent adhesive layer 177 contacts most of the blanker array 9 and the substrate 165, and can serve as a filler such as silicone, so as to effectively fill the gap between the blanker array 9 and the substrate 165. Clearance. Preferably, the transparent adhesive layer 177 is a material having a coefficient of thermal expansion as close as possible to the substrate 165 and the material of the blanker array 9.

The adhesive layer 177 used in the embodiment of Fig. 9B may also be in contact with the photosensitive member 107 as compared with the adhesive 175 shown in Fig. 9A. Preferably, the material in the adhesive layer 177 has a sufficiently high refractive index to reduce the open angle of the beam 170 exiting the fiber 163. The use of an adhesive layer 177 having a sufficiently high refractive index provides the advantage of improved alignment tolerance.

For example, in Figure 9A, the beam 170 exiting the fiber 163 has an open angle a such that it is capable of integrally covering the photosensitive member 107. However, if the alignment between the optical fiber 163 and the photosensitive member 107 is not perfect, then There will be a portion of the light that cannot be dropped onto the photosensitive member 107. Thus, in the case of imperfect alignment, the light output received by the photosensitive member 107 is weakened.

In Fig. 9B, since an adhesive layer 177 containing a material having a sufficiently high refractive index appears, the opening angle of the light rays exiting the optical fiber 163 has an opening angle a', and the angle a' is smaller than the angle a. The smaller opening angle reduces the spot size of the small beam dropped onto the photosensitive member while the light output of the spot is the same. Therefore, as shown in the outline of FIG. 9B, even in the case where the optical fiber 163 and the photosensitive member are not aligned at the dx distance, the photosensitive member 107 can capture the entire light beam 170 and be received by the photosensitive member. The light output will only begin to decrease if the non-alignment becomes greater than this distance dx. Thus, the embodiment shown in Figure 9B is less susceptible to performance degradation due to minor alignment errors.

The material suitable for the adhesive layer 177 is substantially transparent to the light emitted by the optical fiber 163, while having an epoxy resin adhesive having a sufficiently high refractive index, such as greater than 1.4 and preferably greater than about 1.5. Viscose.

It will be recognized that other fixed constructions can also be used. For example, the substrate 165 and the blanker array 9 can be connected by using a connector member such as a Dowel foot.

Additionally, at least one of the beamlet blanker array and the fixed fiber can be disposed with one or more interdigitated members. Examples of such positioning members include protrusions and snubbers, but are not limited thereto.

Another possible way to limit the influence of the alignment error is to make the spot size of the beam 170 larger than the photosensitive surface of the photosensitive member 107, that is, as shown in the figure. Delineated in Figure 10. In this case, the intensity of the beam portion projected onto the photosensitive member 107 should be sufficient to facilitate its proper operation. In the particular embodiment of FIG. 10, assuming that the light is substantially homogeneously distributed over the entire beam 170, the non-alignment of the optical fiber 163 relative to the photosensitive member 107 over a distance dx or shorter will not be caused by the photosensitive member 107. The magnitude of the captured light has an effect. The light output received by the photosensitive member 107 begins to decrease only if the misalignment exceeds this distance dx. Thus, the embodiment shown in Figure 10 is less susceptible to performance degradation due to minor alignment errors.

Figure 11 is a schematic cross-sectional view showing a portion of a fiber array. The fiber array includes a substrate 165 having a plurality of apertures 180 configured to receive a plurality of fibers 163. For ease of illustration, only a single aperture 180 and corresponding fiber 163 are shown in FIG.

The substrate 165 has a fiber receiving surface side 185a, which is also referred to as a first surface; and a light transmitting surface side 185b, which is also referred to as a second surface. The apertures 180 extend from the first surface through the substrate to the second surface. The fiber 163 includes a transfer end 186a and an accompanying end 186b. The length of the fiber 163 is typically much longer than the length shown in FIG.

The fibers can be placed in the apertures 180 by inserting the fibers 163 into the apertures 180 such that the ends of the fibers extend through at least a majority of the apertures 180. In other words, the light transmitting end 186a of the optical fiber 163 is in close proximity to the second surface side 185b of the substrate 165. After insertion, the one or more optical fibers 163 are bent such that the optical fibers extend in a direction different from the direction through the centerline of the aperture (FIG. 11 Marked by the dotted line 181).

The setup technique described above and as schematically illustrated in FIG. 11 is available for the flexibility of the fiber 163. This resilience forces the fiber 163 toward the side of the aperture 180 (the side wall at the left side in Figure 11). In other words, the fiber bend can apply a preload between the fiber 163 and the substrate 165, which allows the fiber to move toward the side of the aperture. Therefore, by bending the optical fiber 163 in a predetermined direction, the optical fiber 163 can abut against the side wall of the aperture 180 at a predetermined position, that is, roughly opposite to the direction in which the optical fiber 163 is bent. The force generated by the bending is determined by the hardness of the optical fiber 163 and its bending radius. In order to minimize the displacement and/or deformation of the substrate due to the force exerted by the bent fiber 163 on the sidewall of the aperture 180, it is preferable to use a disk such as a vacuum chuck during the fiber setting process. The clip is configured to secure the substrate 165.

The aperture size is preferably larger than the outer diameter of the fiber 163 to improve fiber placement tolerance. In general, the fiber 163 contains a core surrounded by a cladding layer which is in turn surrounded by an outer plating or "outer". In some embodiments, the fibers 163 are stripped prior to insertion, i.e., the outer plating is removed. In some other embodiments, the fibers 163 are not stripped. If the portion of the optical fiber 163 to be inserted into the apertures 180 is stripped, the aperture size is preferably greater than the diameter of the core of the optical fiber and the cladding. If the fiber 163 is unstripped, the aperture size 180 is preferably greater than the outer diameter of the fiber 163 including the outer plating. More preferably, the aperture diameter is greater than the outer diameter of the unstripped fiber 163 for use within the substrate 165 Unstripped fiber. The use of unstripped fiber 163 can reduce the time taken for fiber pretreatment, on the grounds that stripping of fiber 163 is not required.

The fiber 163 can be fixed after the fiber 163 is inserted and bent, and is also referred to as fixed or fixed. This fixing can be done by using an adhesive such as a suitable adhesive. Preferably, the adhesive has a low viscosity of about 100-500 mPas for capillary strength to contact the adhesive of the optical fiber 163. Further, the coefficient of thermal expansion of the adhesive is preferably as close as possible to the material of the substrate 165. In some embodiments, the adhesive can be cured by UV light. Alternatively, the adhesive may be cured in a different manner, for example by applying thermal energy. In general, curing is a time consuming process. Therefore, it is preferable to perform the fixing process of the optical fiber 165 after inserting and bending all the optical fibers 163.

Alternatively, or in addition, different types of fastening means, such as mechanical jaws, may be utilized. In the case where an adhesive is used, the adhesive can be placed on the end of the light transmitting fiber 186a before the optical fiber 163 is placed in the aperture 180. This procedure allows the adhesive to be properly placed on the fiber end 186a while limiting the amount of adhesive dose used. The adhesive curing process can then be performed after bending the individual fibers 163, or after inserting and bending all of the other fibers.

In order to enhance the position tolerance of the optical fiber 163, the aperture 170 preferably has a shape capable of guiding the optical fiber 163 to the predetermined position due to bending of the optical fiber. 12A, 12B are schematic views showing a top view of the aperture 180 in the substrate 165, wherein the aperture 180 has an asymmetrical shape whereby the optical fiber can be moved toward a predetermined position during the bending process. The cross-sectional shape of the aperture 180 has There are two parts 191, 192. The first portion 191 is a circular portion 191 (marked by a white dashed circle) having a diameter greater than the diameter of the portion of the fiber to be inserted into the aperture 180. The second portion 192 is an additional portion that is directly adjacent to the circular portion 191 and takes the form of a groove. The illustrated shape of the additional portion 192 is merely an example. It will be appreciated that alternative shapes may also be employed.

In the apertures shown in Figures 12A, 12B, if the fiber 163 is inserted into the aperture 180 and then bent to the right, the fiber 163 will be forced to self-position at the aperture 180 in a manner as schematically illustrated in Figure 12B. The extra "groove shape" is partially 192. Due to the shape of the additional portion 192, the position of the fiber against which the fiber 163 abuts can be expected. Thus, the additional portion 192 is shaped and sized such that the fiber 163 can self-position at a predetermined location where the fiber will abut the sidewall of the aperture. The shape and size of the additional portion 192 can be tailored to the type and/or size of the fiber 163 used.

Figure 13 is a schematic view of a gripping device 200 that can be used to construct an optical fiber configuration, i.e., as described above. The gripper device 200 includes a first gripper 210, a second gripper 220, and a third gripper 230. The first gripper 210 is configured to hold the optical fiber 163 closer to the position of the accompanying end 186b than to the light transmitting end 186a. The first gripper 210 can include a groove for this purpose, such as a V-shaped groove 211. The second gripper 220 is configured to hold the optical fiber 163 at a position closer to the light-transmitting end 186a than to the trailing end 186b. The second gripper 220 can also include a groove for this purpose, such as V Shaped groove 221. The third gripper 230 is configured to secure the fiber for gluing. The third gripper can contain an intaglio for this purpose. The gripping device 200 can be configured to apply a preload to the fiber such that the fiber is slightly pre-bent prior to being inserted into the corresponding aperture. Applying a preload simplifies fiber handling operations.

14A-14E depict different stages in a method for constructing a fiber optic configuration in accordance with an embodiment of the present invention. That is, as can be clearly seen from the drawings, it is indeed possible to use different types of gripping devices.

Figure 14A shows a situation in which the gripping device 200 is part of a larger device containing a rotating element 240 and a bent structure 250. The gripping device is mounted on the rotating member 240 such that the person can rotate in a direction in which the gripping device 200 bends the optical fiber 163.

In the particular embodiment shown, the gripping device is configured to insert the optical fiber 163 into a corresponding aperture and then utilize the bent structure 250 to bend the optical fiber 163. Bending is then performed such that a portion of the fiber 163 that extends from the first surface of the fiber array can be on the bent structure 250, or if other fibers 163 have been bent over the structure 250. The fiber 163 is bent and bent. The bent structure 250 is bendable to a predetermined curvature. A side view of the actual bending on the bent structure 250 can be as shown in Fig. 14B.

Preferably, especially if the other optical fibers 163 were previously bent, the adhesive 260 may be applied to attach the folded optical fibers to the previously bent optical fiber 163 before the bending is completed. Preferably, the fibers are arranged in a predetermined spatial configuration, such as the rectangular configuration shown in FIG. Place on top of each other. In a rectangular configuration, the fibers have a predetermined length. Knowing this length improves the accuracy of the control signals transmitted via the fibers.

After positioning the optical fiber 163 atop another optical fiber 163, the gripping device 200 can be utilized to secure the upper optical fiber 163 to cure the previously applied adhesive 260. For this purpose, a third gripper 230 can be utilized, for example by applying a suitable intaglio. This situation can be as shown in Figure 14D.

Figure 14E shows the case where the last fiber is placed on top. The fiber wrap is depicted in the dark line region.

Figure 16 is a schematic illustration of a fiber optic configuration in which the fibers 163 are secured by the use of an adhesive material 360, such as a suitable adhesive, after being disposed within the aperture and subsequently bent. That is, as shown in this embodiment, the fibers 163 can extend through the apertures. Preferably, the height difference of the optical fibers 163 extending through the apertures in the substrate 165 is less than 0.2 microns. This can be achieved by polishing the substrate after the fibers 163 are placed and secured.

The fibers 163 are oriented toward the apertures through a support unit 350 that is permanently or temporarily attached to the substrate 165. The support unit 350 can simplify the bending process of the optical fibers 163. In addition, the presence of the support unit 350 avoids the occurrence of defects such as kinking during the bending process. By connecting the optical fibers 163 to each other, and preferably in the case where the support unit 350 is permanent, for example, by using the adhesive 260 to connect to the support unit 350, the optical fibers 163 can be even further strengthened. And the overall configuration of the substrate 165. Used inside the aperture of the substrate 165 Adhesive 360 can be the same as adhesive 260. Fixing the fibers 163 within the fixed substrate 165 provides a robust array of fibers that provides reliable light output. The fixing of the optical fibers 163 to each other can further improve the robustness of the design.

17 shows an attached fiber configuration 410 positioned to be disposed on a surface of a beamlet blanker array 400, such as the non-beam region 121 shown in FIG. 5, the arrangement of which is further explained with reference to FIG. The close proximity of a plurality of photosensitive members. The structure 420 is related to shielding from electromagnetic radiation. To form an attached structure, a mold can be formed in the vicinity of the plurality of bent optical fibers, and then the mold is filled with an adhesive material, such as an epoxy resin, a viscose or an epoxy sealant. Adhesive. A suitable material may be a potting compound. Finally, the adhesive material is cured by, for example, utilizing one or more of UV radiation, vaporization, and thermal energy. The attached structure obtained is a strong structure occupying a limited space.

The invention has been described with reference to a few specific embodiments as hereinbefore described. Various modifications and alterations of the present invention can be made without departing from the spirit and scope of the invention. Accordingly, the present invention has been described in terms of a particular embodiment, and is not intended to limit the scope of the invention as defined in the appended claims.

1‧‧‧Powered particle multiple small beam lithography etching system

3‧‧‧Electronic source

4‧‧‧Electronic beam

5‧‧‧Alignment lens

6‧‧‧Aperture Array

7‧‧‧Small beam

8‧‧‧Transformation system

9‧‧‧Small beam blanker array

10‧‧‧Small beam stop array

11‧‧‧ deflector array

12‧‧‧Projection lens configuration

13‧‧‧ Targets

14‧‧‧Target Positioning System

16‧‧‧Actuator system

20‧‧‧Control unit

21‧‧‧Data storage unit

22‧‧‧Reading unit

23‧‧‧Data Converter

24‧‧‧ modulated beam

50‧‧‧Modular Photolithography Etching System

55‧‧‧ Wafer

60‧‧‧vacuum room

65‧‧‧MU metal shielding layer

71‧‧‧Powered particle beam source

72‧‧‧ Beam Calibration System

73‧‧‧Aperture array

74‧‧‧ Concentrating lens array

75‧‧‧Small beam blanker array

76‧‧‧ Beam stop array

77‧‧‧beam deflector array

78‧‧‧Projection lens array

81‧‧‧Optical optics module

82‧‧‧ concentrating lens module

83‧‧‧beam switching module

84‧‧‧Projection optics module

85‧‧‧Alignment sub-framework

86‧‧‧Alignment sub-framework

87‧‧‧Vibration drag reduction mounting

88‧‧‧Frame

89‧‧‧ Wafer Table

90‧‧‧Support structure

91‧‧‧Short trip

92‧‧‧Long journey

95‧‧‧Base plate

96‧‧‧Frame components

99‧‧‧Control system

101‧‧‧Transformer

103a‧‧‧first electrode

103b‧‧‧second electrode

105‧‧‧Aperture

107‧‧‧Photosensitive member

108‧‧‧Anti-reflective coating

109‧‧‧Electrical connection

121‧‧‧beam area

122‧‧‧Non-beam area

141‧‧‧Shielding structure

143‧‧‧Optical interface area

145‧‧‧Power interface area

147‧‧‧Interface area

161‧‧‧Fibre optic configuration

161a‧‧‧ first part

161b‧‧‧ second part

163‧‧‧ fiber optic

165‧‧‧ Body/Substrate

170‧‧‧ Beam

175‧‧‧Adhesive

177‧‧‧Adhesive layer

180‧‧‧ aperture

181‧‧‧ aperture centerline

185a‧‧‧Fiber receiving surface side / first surface

185b‧‧‧Light transmitted through the surface side / second surface

186a‧‧‧Transport end

186b‧‧‧ accompanied by the end

191‧‧‧First partial/circular part

192‧‧‧Second partial/extra local

200‧‧‧grip device

210‧‧‧First gripper

211‧‧‧V-shaped groove

220‧‧‧Second gripper

221‧‧‧V-shaped groove

230‧‧‧ Third gripper

240‧‧‧Rotating components

250‧‧‧Bending structure

260‧‧‧Adhesive

350‧‧‧Support unit

360‧‧‧Adhesive materials

400‧‧‧Small beam blanker array

410‧‧‧With fiber optic configuration

420‧‧‧ structure

The various embodiments of the present invention will now be further explained with reference to the specific embodiments illustrated in the drawings, in which: 1 is a schematic view showing a maskless lithography etching system that can be used in a specific embodiment of the present invention; FIG. 2 is a schematic view showing the operation of a specific embodiment of the small beam blanker array in the lithography etching system of FIG. 1; A simplified block diagram of a group lithography etching system; FIG. 4 is a cross-sectional view showing a portion of a small beam blanker array that can be used in the lithography etching system of FIG. 1. FIG. 5 is a schematic view showing a specific embodiment of the present invention. Above view of the arrangement of the small beam blanker array; Figure 6 shows a top view of a further detailed arrangement of the small beam blanker array that can be used in a particular embodiment of the invention; Figure 7A shows a small beam of Figure 5 The fiber configuration at the top of the blanker array; Figure 7B shows a cross-sectional view of the configuration shown in Figure 7A along line VIIB-VIIB'; Figure 8 shows a closer view of the alignment between the fibers and the corresponding photosensitive member. Figure 9A, 9B are schematic views showing two different ways of connecting a fiber array substrate to a blanker array; Figure 10 is a schematic view showing yet another way of aligning a fiber array substrate to a blanker array; 11 is a cross-sectional view showing a portion of a fiber array substrate; and FIGS. 12A and 12B are schematic views showing a top view of an aperture in the fiber array substrate; Figure 13 is a schematic view of a gripper device that can be used to construct a fiber optic configuration; Figures 14A-14E depict different stages in a method for constructing a fiber optic configuration in accordance with an embodiment of the present invention; Figure 15 depicts the use of the method illustrated in Figures 14A-14E A cross-sectional view of the fiber optic spatial configuration; FIG. 16 is a schematic view showing another embodiment of the fiber configuration; and FIG. 17 shows the attached fiber configuration positioned on the surface of the beam obscurator.

163‧‧‧ fiber optic

165‧‧‧ Body/Substrate

180‧‧‧ aperture

181‧‧‧ aperture centerline

185a‧‧‧Fiber receiving surface side / first surface

185b‧‧‧Light transmitted through the surface side / second surface

186a‧‧‧Transport end

186b‧‧‧ accompanied by the end

Claims (13)

A modulation device for a charged particle multiple small beam lithography etching system, the modulation device comprising: - a small beam blanker array for patterning a plurality of small beams according to a pattern, and - an optical fiber Configuring to provide a pattern data load beam, wherein the beamlet blanker array comprises a plurality of modulators and a plurality of photosensitive members, wherein the photosensitive members are configured to receive the pattern data load beams and to Converting the light beam into an electrical signal, wherein the photosensitive member is electrically connected to the one or more modulators to provide the received pattern data to the one or more modulators; and wherein the fiber configuration comprises: a substrate The substrate has a first surface and an opposite second surface, the substrate is provided with a plurality of apertures extending from the first surface through the substrate to the second surface, the substrate being configured and the small beam eliminating The surface of the hidden array is in close proximity; a plurality of optical fibers each having an optical fiber end having a diameter smaller than a minimum diameter of a corresponding aperture in the substrate; wherein each of the optical fibers Inserting the first surface side of the substrate into the corresponding aperture, such that the fiber end is positioned in close proximity to the second surface, and the fiber has a length extending from the first surface from the aperture; Forming the extension length of each fiber into a circular partial connection An optical fiber arrangement, wherein the length of each of the optical fibers is bent in a direction substantially along a long side of the extended region of the photosensitive member in conformity with a shape of the circular portion of the attached optical fiber configuration, Thus the fiber is no longer in a straight line such that the fiber abuts against the sidewall of the corresponding aperture at a predetermined location; and wherein the adhesive material is utilized to attach the length of the fiber. The modulation device of claim 1, wherein the apertures in the substrate are arranged in an array at positions corresponding to the array of photosensitive members, thereby positioning the ends of the fibers, thereby Light emitted from the end of the fiber is directed onto the photosensitive members. The modulation device of claim 1, wherein the lengths of the fibers are all bent in the same direction. The modulation device of claim 1, wherein the aperture in the substrate is configured in a two-dimensional array having a row, and the optical fiber inserted in the first aperture row has an extended length thereof. The portion bent at the first radius of curvature and the fiber inserted through the next adjacent aperture row has a portion of its extended length that is bent by the second larger radius of curvature. The modulation device of claim 1, wherein the apertures in the substrate are arranged in a two-dimensional array having a row, and all of the optical fibers inserted in each of the apertures have their The part of the extended length that is bent by the same radius of curvature, and the radius of curvature of the fibers of each course is also the same. The modulation device of claim 1, wherein at least a portion of the extended length of the optical fibers is stacked in a predetermined spatial configuration in the attached optical fiber configuration and configured with the attached optical fiber. The circle is partially bent in conformity with other fibers. The modulation device of claim 6, wherein at least a portion of the extended length of the optical fibers is parallel to each other in the circular portion of the attached fiber configuration. The modulation device of claim 1, wherein at least a portion of the length of the optical fibers is attached to the circular portion of the attached fiber configuration by an adhesive. The modulation device of claim 1, wherein the ends of the optical fibers are fixed within the apertures. The modulation device of claim 1, wherein the apertures have a cross-sectional shape consisting of a circular portion and an additional portion in the form of a groove, and wherein the fibers are bent in the direction, Therefore, the predetermined position of the fibers adjacent to the side walls of the aperture is located within the additional portion. The modulation device of claim 1, wherein the number of the fibers is at least one thousand. The modulation device of claim 1, wherein the beamlet blanker array is divided into a plurality of extended beam regions and a plurality of extended non-beam regions adjacent to the beam regions such that each beam region is The long side is wider than the long side of the adjacent non-light bar area, wherein each beam area includes a plurality of modulations without photosensitive members And each of the non-beam regions includes a plurality of photosensitive members without a modulator. A charged particle multiple beam lithography system for utilizing a plurality of charged particle beamlets to transmit a pattern onto a surface of a target, the system comprising: - a small beam generator for generating a plurality of charged a small beam of particles; and a modulation device according to item 1 of the patent application.