TWI504333B - Assembly structure for chip card of electronic device - Google Patents

Description

Chip card loading and unloading structure of electronic device

The present invention relates to a wafer card loading and unloading structure for an electronic device.

In recent years, surface connection cards having integrated circuits have been widely used in electronic devices to enhance or expand the functions of electronic devices, such as SIM cards installed in mobile phones, which store personal information of users and information materials such as plural telephone numbers. . Therefore, a loading and unloading structure for installing a wafer card is also required on the mobile phone.

The loading and unloading structure of the chip card is generally disposed on the back casing of the electronic device, and is located at the bottom of the battery receiving frame, and a chip card receiving slot is formed in the casing, and two sides of the receiving groove are formed on the receiving groove. Connect one of the card holders. When the wafer card is loaded, the wafer card is obliquely inserted into the receiving slot from one end of the receiving slot, and the card holder clamps the wafer card. When the chip card is removed, the wafer card is pushed from one end of the receiving slot to receive the wafer card. It can be taken out in the tank.

However, the wafer card loading and unloading structure occupies a large space for the electronic device, and when the wafer card is taken out, the battery cover needs to be opened first, and the battery card can be taken out after the battery is taken out, which brings great inconvenience to the user operation.

In view of the above, it is necessary to provide a wafer card loading and unloading structure of an electronic device which is simple in structure, small in space, and convenient for user to take.

A wafer card loading and unloading structure for an electronic device includes a casing, an elastic member, a tensile member and a circuit board. The casing includes a bottom wall and an end wall, and the bottom wall is formed with a wafer card. The receiving frame has an opening connected to the receiving frame, and the elastic member is fixed to one end of the housing opposite to the opening, and the tensile member is connected to the elastic member at one end. The other end protrudes from the opening, the circuit board is mounted on the housing and covers the receiving frame, the wafer card is inserted from the opening for installation, and the elastic member is resisted by pulling the stretching member The wafer card ejects the wafer card from the opening.

Compared with the prior art, the wafer card loading and unloading structure is formed by opening an opening in the casing of the electronic device, and the opening is in communication with the receiving frame of the mounting chip card, the wafer card can be loaded from the opening, and the wafer card loading and unloading structure is Simple, the volume of the electronic device can be saved, and the installation is convenient. When the wafer card is taken out, by pulling the stretching member, the stretching member pulls the elastic member to deform, and the elastic member pushes the wafer card to make the wafer card The sliding frame is slid out, and after the stretching member is released, the elastic member returns to the original state, and the stretching member returns to the original position, thus facilitating the removal of the wafer card.

10‧‧‧shell

20‧‧‧Flexible parts

12‧‧‧ bottom wall

22‧‧‧Fixed section

120‧‧‧ Containment frame

222‧‧‧Fixed holes

122‧‧‧stop wall

24‧‧‧Resistance

124‧‧‧Fixed wall

242‧‧‧Resistance

126‧‧‧First rib

244‧‧‧Connecting hook

128‧‧‧second rib

30‧‧‧Stretching parts

14‧‧‧ side wall

32‧‧‧connection hole

142‧‧‧Fixed column

40‧‧‧ boards

16‧‧‧End wall

50‧‧‧wafer card

162‧‧‧ openings

100‧‧‧ wafer card loading and unloading structure

1 is an exploded perspective view of a wafer card loading and unloading structure of an electronic device according to a preferred embodiment of the present invention; FIG. 2 is a schematic view showing the assembly of a tensile member mounted on a housing in the wafer card loading and unloading structure shown in FIG. 1. FIG. A partial cross-sectional view of the wafer card loading and unloading structure shown after mounting the wafer card.

Referring to FIG. 1 , a wafer card loading and unloading structure 100 of an electronic device according to a preferred embodiment of the present invention is provided. The utility model comprises a casing 10, an elastic member 20, a tensile member 30 and a circuit board 40.

The housing 10 has a rectangular frame structure and includes a bottom wall 12 mounted on the outer side wall 14 and the end wall 16 of the outer wall 12 . A bottom wall 122 and a plurality of fixed walls 124 are protruded from the bottom wall 12 . The stop wall 122 is parallel to the end wall 16, and the distance from the end wall 16 is slightly larger than the length of a wafer card, and a certain distance is formed between the two side walls 14. The fixed wall 124 is parallel to the side wall 14 and is symmetrically disposed in two groups and adjacent to the side wall 14, respectively. The bottom wall 12, the stop wall 122, the fixed wall 124 and the end wall 16 define a receiving frame 120 for receiving a wafer card. A plurality of first ribs 126 and second ribs 128 parallel to the side walls 14 are formed on the bottom of the receiving frame 120, that is, the bottom wall 12. The first rib 126 is slightly lower than the second rib 128 and lower than the second rib 128. The first rib 126 forms a slope toward one end of the end wall 16 to facilitate the wafer. The card slides into the containment frame 120. The second rib 128 is adjacent to the end wall 16 and forms a slope away from one end of the end wall 16 to facilitate sliding of the wafer card out of the receiving frame 120.

A fixing post 142 is formed on the inner side of the side wall 14 , and the fixing post 142 is located at one end of the stopping wall 122 of the receiving frame 120 for fixing with the elastic member 20 .

An opening 162 is defined in the end wall 16 . The width of the opening 162 is equivalent to the width of the wafer card. The opening 162 is inserted into the receiving frame 12 , and the wafer card is inserted into the receiving frame 12 through the opening 162 .

The elastic member 20 is a vertically bent sheet-like structure, and includes a fastening portion 22 and a bending portion connected to the fastening portion 22 to resist the segment 24, and the abutting portion 24 is opposite to the fastening portion 22 Elastically bent around its joint. The fixing portion 22 defines a fixing hole 222 for connecting with the fixing post 142 on the side wall 14 to make the elastic member 20 Secured to the side wall 14. One side of the abutting portion 24 further defines a resisting protrusion 242 and a connecting hook portion 244. The resisting protrusion 242 is formed by bending a side edge of the resisting portion 24, and is formed away from the fixing portion. One end of 22, and the protruding direction is parallel to the side wall 14 for resisting the wafer card. The connecting hook portion 244 is also formed by bending a side edge of the resisting portion 24, and is formed in the middle of the resisting portion 24 for attaching to the tensile member 30.

The tensile member 30 has a long strip shape and a thin thickness. The tensile member 30 can be a strip or a soft cord having a certain hardness. The tensile member 30 is not easily dropped into the receiving frame 120. The strip of the hardness of the tool is preferably selected. One end of the tensile member 30 defines a connecting hole 32. The connecting hole 32 can be inserted into the connecting hook portion 244 of the elastic member 20 to fix the tensile member 30 and the elastic member 20.

The circuit board 40 is used to fit the housing 10, and the circuit board 40 is mounted on the housing 10 to cover the receiving frame 120 of the housing 10, and at the same time, the elastic electrical connection terminal of the circuit board 40 ( Not shown in the drawing frame 120, after the wafer is inserted into the receiving groove 120, the elastic terminal presses against the wafer card and is in electrical communication with the wafer card.

Referring to FIG. 2, when the wafer card loading and unloading structure 100 is assembled, the elastic member 20 is disposed in the housing 10, and the fixing hole 222 of the fixing portion 22 of the elastic member 20 and the fixing column on the side wall 14 are assembled. 142 sets, and fixed by hot melt or threaded fit. The abutting portion 24 of the elastic member 20 is located between the stop wall 122 and the side wall 14 , and the resisting protrusion 242 is adjacent to and substantially flush with the stop wall 122 . The tensile member 30 is then snapped through the connecting hole 32 with the connecting hook portion 244 of the elastic member 20, and the tensile member 30 is attached to the bottom wall 12 adjacent to the fixed wall 124, and the other end thereof is The opening 162 extends. Finally, the circuit board 40 is mounted on the housing 10, and the circuit board 40 can be fixed to the housing 10 by screws. After assembly, the circuit board 40 covers the receiving frame 120, and at the same time, the circuit board 40 The elastic electrical connection terminal faces the receiving frame 120.

Referring to FIG. 3, when the wafer card loading and unloading structure 100 is used, a wafer card 50 is pushed in from the opening 162 of the housing 10, and the wafer card 50 is slidably slid into the receiving frame 120 along with the slope of the first rib 126. At this time, one end of the wafer card 50 away from the opening 162 abuts the stop wall 122 and the resisting protrusion 242, and one end of the adjacent opening 162 of the wafer card 50 is located on the slope of the second rib 128. At the same time, the electrical connection terminals of the circuit board 40 elastically resist the electrical conduction of the wafer card 50, and the tensile member 30 is located on one side of the wafer card 50. When the wafer card 50 is withdrawn, the tensile member 30 is pulled, and the abutting portion 24 of the elastic member 20 is elastically bent relative to the fastening portion 22, and the resisting protrusion 242 pushes against the wafer card 50. The card 50 will slide along the slope of the two ribs 128. As the tensile member 30 is further pulled, the wafer card 50 will slide out of the opening 162, so that the wafer card 50 can be easily removed. Upon release of the tensile member 30, the abutting section 24 will return to its original position while also pulling the tensile member 30 back to its original position.

The wafer card loading and unloading structure 100 has an opening 162 formed in the casing 10, and the opening 162 is communicated with the receiving frame 120. The wafer card 50 can be loaded from the opening 162, and the structure is simple, and the volume of the electronic device can be saved. For easy installation, when the wafer card 50 is taken out, by pulling the stretching member 30, the stretching member 30 pulls the elastic member 20 to deform, and the resisting portion 24 of the elastic member 20 pushes against the wafer card 50, so that the wafer card 50 is removed from the wafer card 50. The container frame 120 slides out, so that the wafer card can be taken out.

It can be understood that the fixed wall 124, the first rib 126 and the second rib 128 on the bottom wall 12 can be omitted. The sidewall 14 and the end wall 16 surround the receiving frame 120 by the stopping wall 122. .

10‧‧‧shell

20‧‧‧Flexible parts

12‧‧‧ bottom wall

22‧‧‧Fixed section

120‧‧‧ Containment frame

222‧‧‧Fixed holes

122‧‧‧stop wall

24‧‧‧Resistance

124‧‧‧Fixed wall

242‧‧‧Resistance

126‧‧‧First rib

244‧‧‧Connecting hook

128‧‧‧second rib

30‧‧‧Stretching parts

14‧‧‧ side wall

32‧‧‧connection hole

142‧‧‧Fixed column

40‧‧‧ boards

16‧‧‧End wall

100‧‧‧ wafer card loading and unloading structure

162‧‧‧ openings

Claims (9)

The wafer card loading and unloading structure of the electronic device is improved in that the wafer card loading and unloading structure comprises a casing, an elastic member and a tensile member, and the casing comprises a bottom wall, a side wall and an end wall, the bottom A receiving frame for accommodating a wafer card is formed on the wall, the side wall is formed with a fixing post, and the end wall is provided with an opening communicating with the receiving frame, and the elastic member is fixed to the housing One end of the opening, the elastic member includes a fixing portion, and the fixing portion is formed with a fixing hole, and the elastic member is sleeved to the fixing post and fixed to the side wall by the fixing hole, the stretching One end of the piece is connected to the elastic member, the other end is protruded from the opening, the wafer card is inserted from the opening for mounting, and the elastic member is pressed against the wafer card to pull the wafer card by pulling the stretching member The opening exits. The wafer card loading and unloading structure of the electronic device of claim 1, wherein the bottom wall is provided with a stop wall and a plurality of fixed walls, the stop wall being parallel to the end wall and opposite to the opening, The bottom wall, the stop wall, the fixed wall and the end wall enclose the receiving frame. The wafer card loading and unloading structure of the electronic device according to the first aspect of the invention, wherein the bottom of the receiving frame is formed with a plurality of first ridges and second ridges, and the first ridges and the second ridges respectively A ramp is formed for guiding the sliding of the wafer card when it is installed or withdrawn. The wafer card loading and unloading structure of the electronic device of claim 1, wherein the elastic member further comprises a resisting portion vertically bent and connected to the fixing portion, the resisting portion being formed at the stopping wall and the side wall. Between the gaps, the fixed portion can be elastically bent to resist the wafer card. The wafer card loading and unloading structure of the electronic device of claim 4, wherein the abutting portion is formed with a resisting protrusion facing the open end and being flush with the stopping wall. Qi, used to resist the wafer card. The wafer card loading and unloading structure of the electronic device of claim 4, wherein the resisting A connecting hook portion is formed on the segment, and one end of the tensile member is formed with a connecting hole, and the tensile member is sleeved on the connecting hook portion to be fixed to the elastic member. The wafer card loading and unloading structure of the electronic device of claim 4, wherein the tensile member is a strip having a hardness. The wafer card loading and unloading structure of the electronic device of claim 1, wherein the wafer card loading and unloading structure further comprises a circuit board mounted on the casing and covering the receiving frame. The wafer card loading and unloading structure of the electronic device of claim 8, wherein the circuit board is formed with an elastic electrical connection terminal, the electrical connection terminal facing the receiving frame.