TWI503753B - - Google Patents

Info

Publication number
TWI503753B
TWI503753B TW103113115A TW103113115A TWI503753B TW I503753 B TWI503753 B TW I503753B TW 103113115 A TW103113115 A TW 103113115A TW 103113115 A TW103113115 A TW 103113115A TW I503753 B TWI503753 B TW I503753B
Authority
TW
Taiwan
Application number
TW103113115A
Other languages
Chinese (zh)
Other versions
TW201539329A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW103113115A priority Critical patent/TW201539329A/en
Application granted granted Critical
Publication of TWI503753B publication Critical patent/TWI503753B/zh
Publication of TW201539329A publication Critical patent/TW201539329A/en

Links

TW103113115A 2014-04-10 2014-04-10 IC card manufacturing method that increases yield rate TW201539329A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103113115A TW201539329A (en) 2014-04-10 2014-04-10 IC card manufacturing method that increases yield rate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103113115A TW201539329A (en) 2014-04-10 2014-04-10 IC card manufacturing method that increases yield rate

Publications (2)

Publication Number Publication Date
TWI503753B true TWI503753B (en) 2015-10-11
TW201539329A TW201539329A (en) 2015-10-16

Family

ID=54851364

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103113115A TW201539329A (en) 2014-04-10 2014-04-10 IC card manufacturing method that increases yield rate

Country Status (1)

Country Link
TW (1) TW201539329A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3734511B1 (en) 2017-12-29 2022-11-23 Wu-Hsu Lin Electronic module preparation layer and manufacturing method therefor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI242164B (en) * 2004-05-26 2005-10-21 Taiwan Ic Packaging Corp Method for constructing a memory card and structure thereof
TWM290357U (en) * 2005-11-15 2006-05-01 Orient Semiconductor Elect Ltd Fixtrue for pressing module cards
TWM312771U (en) * 2006-09-29 2007-05-21 Taiwan Oasis Technology Co Ltd Chip packaging device capable of preventing excessive glue, light emitting diode and light source
TW201306673A (en) * 2011-07-20 2013-02-01 Silitek Electronic Guangzhou Circuit board device and manufacturing method thereof and power supply having the circuit board device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI242164B (en) * 2004-05-26 2005-10-21 Taiwan Ic Packaging Corp Method for constructing a memory card and structure thereof
TWM290357U (en) * 2005-11-15 2006-05-01 Orient Semiconductor Elect Ltd Fixtrue for pressing module cards
TWM312771U (en) * 2006-09-29 2007-05-21 Taiwan Oasis Technology Co Ltd Chip packaging device capable of preventing excessive glue, light emitting diode and light source
TW201306673A (en) * 2011-07-20 2013-02-01 Silitek Electronic Guangzhou Circuit board device and manufacturing method thereof and power supply having the circuit board device

Also Published As

Publication number Publication date
TW201539329A (en) 2015-10-16

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