TWI503753B - - Google Patents
Info
- Publication number
- TWI503753B TWI503753B TW103113115A TW103113115A TWI503753B TW I503753 B TWI503753 B TW I503753B TW 103113115 A TW103113115 A TW 103113115A TW 103113115 A TW103113115 A TW 103113115A TW I503753 B TWI503753 B TW I503753B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103113115A TW201539329A (en) | 2014-04-10 | 2014-04-10 | IC card manufacturing method that increases yield rate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103113115A TW201539329A (en) | 2014-04-10 | 2014-04-10 | IC card manufacturing method that increases yield rate |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI503753B true TWI503753B (en) | 2015-10-11 |
TW201539329A TW201539329A (en) | 2015-10-16 |
Family
ID=54851364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103113115A TW201539329A (en) | 2014-04-10 | 2014-04-10 | IC card manufacturing method that increases yield rate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201539329A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3734511B1 (en) | 2017-12-29 | 2022-11-23 | Wu-Hsu Lin | Electronic module preparation layer and manufacturing method therefor |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI242164B (en) * | 2004-05-26 | 2005-10-21 | Taiwan Ic Packaging Corp | Method for constructing a memory card and structure thereof |
TWM290357U (en) * | 2005-11-15 | 2006-05-01 | Orient Semiconductor Elect Ltd | Fixtrue for pressing module cards |
TWM312771U (en) * | 2006-09-29 | 2007-05-21 | Taiwan Oasis Technology Co Ltd | Chip packaging device capable of preventing excessive glue, light emitting diode and light source |
TW201306673A (en) * | 2011-07-20 | 2013-02-01 | Silitek Electronic Guangzhou | Circuit board device and manufacturing method thereof and power supply having the circuit board device |
-
2014
- 2014-04-10 TW TW103113115A patent/TW201539329A/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI242164B (en) * | 2004-05-26 | 2005-10-21 | Taiwan Ic Packaging Corp | Method for constructing a memory card and structure thereof |
TWM290357U (en) * | 2005-11-15 | 2006-05-01 | Orient Semiconductor Elect Ltd | Fixtrue for pressing module cards |
TWM312771U (en) * | 2006-09-29 | 2007-05-21 | Taiwan Oasis Technology Co Ltd | Chip packaging device capable of preventing excessive glue, light emitting diode and light source |
TW201306673A (en) * | 2011-07-20 | 2013-02-01 | Silitek Electronic Guangzhou | Circuit board device and manufacturing method thereof and power supply having the circuit board device |
Also Published As
Publication number | Publication date |
---|---|
TW201539329A (en) | 2015-10-16 |