TWI503655B - - Google Patents
Info
- Publication number
- TWI503655B TWI503655B TW101115573A TW101115573A TWI503655B TW I503655 B TWI503655 B TW I503655B TW 101115573 A TW101115573 A TW 101115573A TW 101115573 A TW101115573 A TW 101115573A TW I503655 B TWI503655 B TW I503655B
- Authority
- TW
- Taiwan
Links
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101115573A TW201346500A (en) | 2012-05-02 | 2012-05-02 | Heat dissipation device |
JP2012006976U JP3181289U (en) | 2012-05-02 | 2012-11-16 | Heat dissipation device |
US13/873,484 US20130292092A1 (en) | 2012-05-02 | 2013-04-30 | Heat Dissipating Device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101115573A TW201346500A (en) | 2012-05-02 | 2012-05-02 | Heat dissipation device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201346500A TW201346500A (en) | 2013-11-16 |
TWI503655B true TWI503655B (en) | 2015-10-11 |
Family
ID=49511660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101115573A TW201346500A (en) | 2012-05-02 | 2012-05-02 | Heat dissipation device |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130292092A1 (en) |
JP (1) | JP3181289U (en) |
TW (1) | TW201346500A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI539894B (en) * | 2014-11-28 | 2016-06-21 | 財團法人工業技術研究院 | Power module |
EP3286513B1 (en) * | 2015-04-21 | 2019-09-04 | Aavid Thermalloy, LLC | Thermosiphon with multiport tube and flow arrangement |
US10107557B2 (en) * | 2016-05-27 | 2018-10-23 | Asia Vital Components Co., Ltd. | Integrated heat dissipation device |
CN109193070A (en) * | 2018-09-05 | 2019-01-11 | 江苏奥吉瑞斯新能源有限公司 | A kind of refrigerant coolant liquid mixed type power battery heat sink |
US11910563B2 (en) * | 2021-06-21 | 2024-02-20 | Quanta Computer Inc. | Liquid cooling module with movable radiators |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7665511B2 (en) * | 2006-05-25 | 2010-02-23 | Delphi Technologies, Inc. | Orientation insensitive thermosiphon capable of operation in upside down position |
CN101871740A (en) * | 2009-06-15 | 2010-10-27 | 华为技术有限公司 | Heat exchanger, heat dissipation method for heat exchanger and communication equipment |
JP2011196632A (en) * | 2010-03-19 | 2011-10-06 | Toyota Industries Corp | Ebullient cooling device |
CN202143339U (en) * | 2011-07-27 | 2012-02-08 | 兆亮科技股份有限公司 | Radiating device and radiating plate thereof |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4429734A (en) * | 1981-05-04 | 1984-02-07 | Kool-Fire Limited | Heat exchanger coil |
US4926931A (en) * | 1988-11-14 | 1990-05-22 | Larinoff Michael W | Freeze protected, air-cooled vacuum steam condensers |
US6119767A (en) * | 1996-01-29 | 2000-09-19 | Denso Corporation | Cooling apparatus using boiling and condensing refrigerant |
US6360814B1 (en) * | 1999-08-31 | 2002-03-26 | Denso Corporation | Cooling device boiling and condensing refrigerant |
JP4178719B2 (en) * | 2000-05-19 | 2008-11-12 | 株式会社デンソー | Boiling cooler |
US20020121097A1 (en) * | 2001-03-02 | 2002-09-05 | Gil Chiu | Temperature balance device |
WO2006019219A2 (en) * | 2004-08-18 | 2006-02-23 | Thermalforce | Cooling apparatus of looped heat pipe structure |
US20070246193A1 (en) * | 2006-04-20 | 2007-10-25 | Bhatti Mohinder S | Orientation insensitive thermosiphon of v-configuration |
US7403392B2 (en) * | 2006-05-16 | 2008-07-22 | Hardcore Computer, Inc. | Liquid submersion cooling system |
-
2012
- 2012-05-02 TW TW101115573A patent/TW201346500A/en not_active IP Right Cessation
- 2012-11-16 JP JP2012006976U patent/JP3181289U/en not_active Expired - Fee Related
-
2013
- 2013-04-30 US US13/873,484 patent/US20130292092A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7665511B2 (en) * | 2006-05-25 | 2010-02-23 | Delphi Technologies, Inc. | Orientation insensitive thermosiphon capable of operation in upside down position |
CN101871740A (en) * | 2009-06-15 | 2010-10-27 | 华为技术有限公司 | Heat exchanger, heat dissipation method for heat exchanger and communication equipment |
JP2011196632A (en) * | 2010-03-19 | 2011-10-06 | Toyota Industries Corp | Ebullient cooling device |
CN202143339U (en) * | 2011-07-27 | 2012-02-08 | 兆亮科技股份有限公司 | Radiating device and radiating plate thereof |
Also Published As
Publication number | Publication date |
---|---|
TW201346500A (en) | 2013-11-16 |
JP3181289U (en) | 2013-01-31 |
US20130292092A1 (en) | 2013-11-07 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |