TWI503655B - - Google Patents

Info

Publication number
TWI503655B
TWI503655B TW101115573A TW101115573A TWI503655B TW I503655 B TWI503655 B TW I503655B TW 101115573 A TW101115573 A TW 101115573A TW 101115573 A TW101115573 A TW 101115573A TW I503655 B TWI503655 B TW I503655B
Authority
TW
Taiwan
Application number
TW101115573A
Other languages
Chinese (zh)
Other versions
TW201346500A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101115573A priority Critical patent/TW201346500A/en
Priority to JP2012006976U priority patent/JP3181289U/en
Priority to US13/873,484 priority patent/US20130292092A1/en
Publication of TW201346500A publication Critical patent/TW201346500A/en
Application granted granted Critical
Publication of TWI503655B publication Critical patent/TWI503655B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW101115573A 2012-05-02 2012-05-02 Heat dissipation device TW201346500A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW101115573A TW201346500A (en) 2012-05-02 2012-05-02 Heat dissipation device
JP2012006976U JP3181289U (en) 2012-05-02 2012-11-16 Heat dissipation device
US13/873,484 US20130292092A1 (en) 2012-05-02 2013-04-30 Heat Dissipating Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101115573A TW201346500A (en) 2012-05-02 2012-05-02 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW201346500A TW201346500A (en) 2013-11-16
TWI503655B true TWI503655B (en) 2015-10-11

Family

ID=49511660

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101115573A TW201346500A (en) 2012-05-02 2012-05-02 Heat dissipation device

Country Status (3)

Country Link
US (1) US20130292092A1 (en)
JP (1) JP3181289U (en)
TW (1) TW201346500A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI539894B (en) * 2014-11-28 2016-06-21 財團法人工業技術研究院 Power module
EP3286513B1 (en) * 2015-04-21 2019-09-04 Aavid Thermalloy, LLC Thermosiphon with multiport tube and flow arrangement
US10107557B2 (en) * 2016-05-27 2018-10-23 Asia Vital Components Co., Ltd. Integrated heat dissipation device
CN109193070A (en) * 2018-09-05 2019-01-11 江苏奥吉瑞斯新能源有限公司 A kind of refrigerant coolant liquid mixed type power battery heat sink
US11910563B2 (en) * 2021-06-21 2024-02-20 Quanta Computer Inc. Liquid cooling module with movable radiators

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7665511B2 (en) * 2006-05-25 2010-02-23 Delphi Technologies, Inc. Orientation insensitive thermosiphon capable of operation in upside down position
CN101871740A (en) * 2009-06-15 2010-10-27 华为技术有限公司 Heat exchanger, heat dissipation method for heat exchanger and communication equipment
JP2011196632A (en) * 2010-03-19 2011-10-06 Toyota Industries Corp Ebullient cooling device
CN202143339U (en) * 2011-07-27 2012-02-08 兆亮科技股份有限公司 Radiating device and radiating plate thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4429734A (en) * 1981-05-04 1984-02-07 Kool-Fire Limited Heat exchanger coil
US4926931A (en) * 1988-11-14 1990-05-22 Larinoff Michael W Freeze protected, air-cooled vacuum steam condensers
US6119767A (en) * 1996-01-29 2000-09-19 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6360814B1 (en) * 1999-08-31 2002-03-26 Denso Corporation Cooling device boiling and condensing refrigerant
JP4178719B2 (en) * 2000-05-19 2008-11-12 株式会社デンソー Boiling cooler
US20020121097A1 (en) * 2001-03-02 2002-09-05 Gil Chiu Temperature balance device
WO2006019219A2 (en) * 2004-08-18 2006-02-23 Thermalforce Cooling apparatus of looped heat pipe structure
US20070246193A1 (en) * 2006-04-20 2007-10-25 Bhatti Mohinder S Orientation insensitive thermosiphon of v-configuration
US7403392B2 (en) * 2006-05-16 2008-07-22 Hardcore Computer, Inc. Liquid submersion cooling system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7665511B2 (en) * 2006-05-25 2010-02-23 Delphi Technologies, Inc. Orientation insensitive thermosiphon capable of operation in upside down position
CN101871740A (en) * 2009-06-15 2010-10-27 华为技术有限公司 Heat exchanger, heat dissipation method for heat exchanger and communication equipment
JP2011196632A (en) * 2010-03-19 2011-10-06 Toyota Industries Corp Ebullient cooling device
CN202143339U (en) * 2011-07-27 2012-02-08 兆亮科技股份有限公司 Radiating device and radiating plate thereof

Also Published As

Publication number Publication date
TW201346500A (en) 2013-11-16
JP3181289U (en) 2013-01-31
US20130292092A1 (en) 2013-11-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees