TWI495751B - - Google Patents
Info
- Publication number
- TWI495751B TWI495751B TW102125164A TW102125164A TWI495751B TW I495751 B TWI495751 B TW I495751B TW 102125164 A TW102125164 A TW 102125164A TW 102125164 A TW102125164 A TW 102125164A TW I495751 B TWI495751 B TW I495751B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102125164A TW201502302A (zh) | 2013-07-15 | 2013-07-15 | 可微調整製程參數之濺鍍製程控制系統及其方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102125164A TW201502302A (zh) | 2013-07-15 | 2013-07-15 | 可微調整製程參數之濺鍍製程控制系統及其方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201502302A TW201502302A (zh) | 2015-01-16 |
| TWI495751B true TWI495751B (https=) | 2015-08-11 |
Family
ID=52718294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102125164A TW201502302A (zh) | 2013-07-15 | 2013-07-15 | 可微調整製程參數之濺鍍製程控制系統及其方法 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201502302A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111534804B (zh) * | 2020-06-16 | 2022-03-22 | 常州市乐萌压力容器有限公司 | 基于改进灰关联模型的磁控溅射工艺参数优化方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW332896B (en) * | 1996-05-21 | 1998-06-01 | Aneruba Kk | Sputtering apparatus |
| US6090246A (en) * | 1998-01-20 | 2000-07-18 | Micron Technology, Inc. | Methods and apparatus for detecting reflected neutrals in a sputtering process |
| TW503470B (en) * | 1999-10-29 | 2002-09-21 | Toshiba Corp | Sputtering apparatus and film forming method |
| US6863785B2 (en) * | 2001-02-07 | 2005-03-08 | Asahi Glass Company, Limited | Sputtering apparatus and sputter film deposition method |
| US20090127101A1 (en) * | 2007-11-16 | 2009-05-21 | Ken Nauman | Methods and apparatus for sputtering deposition using direct current |
| TWI352129B (en) * | 2003-08-18 | 2011-11-11 | Mks Instr Inc | Control system for a sputtering system |
| US8163140B2 (en) * | 2002-05-29 | 2012-04-24 | Kobe Steel, Ltd. | Reactive sputtering method and device |
| TW201219588A (en) * | 2010-11-15 | 2012-05-16 | Ind Tech Res Inst | Continuous-type sputtering apparatus and method of fabricating solar selective absorber |
-
2013
- 2013-07-15 TW TW102125164A patent/TW201502302A/zh unknown
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW332896B (en) * | 1996-05-21 | 1998-06-01 | Aneruba Kk | Sputtering apparatus |
| US6090246A (en) * | 1998-01-20 | 2000-07-18 | Micron Technology, Inc. | Methods and apparatus for detecting reflected neutrals in a sputtering process |
| TW503470B (en) * | 1999-10-29 | 2002-09-21 | Toshiba Corp | Sputtering apparatus and film forming method |
| US6863785B2 (en) * | 2001-02-07 | 2005-03-08 | Asahi Glass Company, Limited | Sputtering apparatus and sputter film deposition method |
| US8163140B2 (en) * | 2002-05-29 | 2012-04-24 | Kobe Steel, Ltd. | Reactive sputtering method and device |
| TWI352129B (en) * | 2003-08-18 | 2011-11-11 | Mks Instr Inc | Control system for a sputtering system |
| US20090127101A1 (en) * | 2007-11-16 | 2009-05-21 | Ken Nauman | Methods and apparatus for sputtering deposition using direct current |
| TW200930159A (en) * | 2007-11-16 | 2009-07-01 | Advanced Energy Ind Inc | Methods and apparatus for sputtering deposition using direct current |
| TW201219588A (en) * | 2010-11-15 | 2012-05-16 | Ind Tech Res Inst | Continuous-type sputtering apparatus and method of fabricating solar selective absorber |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201502302A (zh) | 2015-01-16 |