TWI494812B - Touch integrated circuit device - Google Patents

Description

Touch integrated circuit device

The present invention relates to an integrated circuit device, and more particularly to a touch integrated circuit device.

Many electronic products with touch screens, such as tablets, smart phones, and notebook computers, have employed touch sensing substrates as input devices. The touch sensing substrate generally has a plurality of sensing traces, a plurality of driving traces, and a sensing array, and the sensing array has a plurality of sensing electrodes. The sensing traces and the driving traces are respectively connected to the sensing electrodes in the first direction and the second direction in the sensing array, wherein the first direction is perpendicular to the second direction.

Some electronic products currently require a larger size touch sensing substrate. However, the larger the size of the touch sensing substrate, the longer the sensing trace and the driving trace are required, resulting in an excessive impedance of the signal transmission and affecting accuracy. In this regard, at present, the layout of the touch sensing substrate is designed such that the two ends of the sensing electrodes in the first direction are connected to the two pads through the sensing traces, and the sensing electrodes in the second direction are Both ends connect the other two pads through the drive trace.

A flexible printed circuit board (FPC) for electrically connecting the touch sensing substrate has a short circuit line disposed therein to electrically connect both ends of the sensing electrode in the first direction to each other, and the sensing electrode in the second direction Both ends are electrically connected to each other. However, the short circuit described above occupies a large area of the flexible printed circuit board, forcing the size of the flexible printed circuit board to be increased, thereby increasing the cost.

The present invention provides a touch integrated circuit device that is applied to a touch sensing substrate and is used to improve the problem that the short circuit line occupies a large area of the flexible printed circuit board.

One embodiment of the present invention provides a touch integrated circuit device for electrically connecting a touch sensor substrate. The touch sensing substrate has a plurality of first pads and a plurality of second pads, and the touch integrated circuit device includes bare crystals. The die includes a bare body, a plurality of first signal pads, and a plurality of second signal pads. The bare body has a flat surface. These first signal pads and these second signal pads are exposed to the plane. The second signal pads are electrically insulated from the first signal pads, and the first signal pads form a plurality of first terminal sets. The number of the first signal pads is twice the number of the first terminal groups, wherein each of the first terminal groups has two first signal pads, and the two first signal pads in the same first terminal group are electrically connected to each other Sexual conduction. The first signal pads are electrically connected to the first pads individually, and the second signal pads are electrically connected to the second pads individually.

Another embodiment of the present invention provides a touch integrated circuit device including a die and a carrier. The die has a plurality of first signal pads and a plurality of second signal pads. The carrier board includes a substrate, a plurality of first upper bonding pads, a plurality of second upper bonding pads, a plurality of first lower bonding pads, and a plurality of second lower bonding pads. The substrate has a first bonding surface and a second bonding surface opposite to the first bonding surface, and the bare crystal is mounted on the first bonding surface. The first upper bonding pad and the second upper bonding pad are exposed on the first bonding surface. The first upper bond pads are respectively connected to the first signal pads, and the second upper bond pads are respectively connected to the second signal pads. The first upper bond pads are electrically insulated from the second upper bond pads. The first lower bonding pads and the second lower bonding pads are exposed to the second bonding surface. The first lower bonding pads are electrically connected to the first upper bonding pads, respectively, and the second lower bonding pads are electrically connected to the second upper bonding pads, respectively. The number of the first lower bonding pads is twice the number of the first upper bonding pads, and each of the first upper bonding pads is electrically connected to each of the two first lower bonding pads.

Another embodiment of the present invention provides a touch integrated circuit device for connecting the touch sensing substrate. The touch integrated circuit device includes a plurality of first terminal pads and a plurality of second terminal pads, wherein the first terminal pads and the second terminal pads are all signal pads. These first terminal pads are used to electrically connect the first pads, respectively. The number of these first terminal pads The number of the first pads is the same, and the number of the first terminal pads is an even number, wherein each of the two first terminal pads forms a first terminal pair, and the two first terminals of the same first terminal pair The pads are electrically connected to each other. The second terminal pads are used to electrically connect the second pads, respectively, and the number of the second terminal pads is the same as the number of the second pads.

Based on the above, with each of two signal pads electrically connected to each other (for example, the first terminal pad, the first signal pad or the first lower bonding pad), the present invention can design a short circuit in the bare crystal or the carrier to reduce the touch. Controlling the influence of the resistance of the sensing substrate on the operation of the touch circuit, and simultaneously improving the problems caused by the short circuit of the above flexible printed circuit board. Compared with the prior art, the present invention helps to reduce the size of such touch-screen electronic products and reduce the cost.

10‧‧‧Touch sensing substrate

20‧‧‧Transverse conductive film

21‧‧‧Electrical particles

40‧‧‧ boards

41, 51, 52‧‧‧ pads

50‧‧‧Soft circuit board

200, 300, 400a, 400b‧‧‧ touch integrated circuit device

213a, 442‧‧ plane

225a, 225b, 431, 432‧‧‧ connection

210, 310‧‧‧ bare crystal

211, 311, 410‧‧‧ first signal pad

212, 312, 420‧‧‧ second signal pad

213, 440‧‧‧ bare body

220, 320‧‧‧ carrier board

221, B21‧‧‧ first joint pad

222, B22‧‧‧Second lower joint pad

223, B11‧‧‧ first upper bonding pad

224, B12‧‧‧Second upper bonding pad

226, 322‧‧‧ substrate

226a‧‧‧ first joint

226b‧‧‧second joint

324‧‧‧Interconnection structure

330‧‧‧Mold block

B1‧‧‧ Conductive bumps

I1, I2‧‧‧ inner circuit layer

P1, P2, P3‧‧‧ conductive column

P11‧‧‧first mat

S1‧‧‧ solder block

1A is a schematic top plan view of a touch integrated circuit device according to another embodiment of the present invention.

Figure 1B is a schematic cross-sectional view taken along line I-I of Figure 1A.

Figure 1C is a schematic cross-sectional view taken along line II-II of Figure 1A.

2A is a schematic top plan view of a touch integrated circuit device according to another embodiment of the present invention.

Figure 2B is a schematic cross-sectional view taken along line III-III of Figure 2A.

3 is a bottom plan view of a touch integrated circuit device according to another embodiment of the present invention.

4 is a bottom plan view of a touch integrated circuit device according to another embodiment of the present invention.

1A is a schematic top plan view of a touch integrated circuit device according to an embodiment of the present invention. Referring to FIG. 1A , the touch integrated circuit device 200 can be applied to a touch input device, such as a touch screen or a touch pad. The touch panel is an opaque touch input device, which can be used as an input device of a notebook computer. In addition, the touch integrated circuit device 200 can also be applied to a graphics tablet.

The touch integrated circuit device 200 is connected to the touch sensing substrate 10 to enable electrical signals to be transmitted between the touch integrated circuit device 200 and the touch sensing substrate 10 . In addition, touch The touch sensing substrate 10 can be a capacitive touch sensor substrate or a resistive touch sensor substrate.

Figure 1B is a schematic cross-sectional view taken along line I-I of Figure 1A. Referring to FIG. 1A and FIG. 1B , the touch sensing substrate 10 has a plurality of first pads P11 and a plurality of second pads (not shown), wherein the structures of the first pads P11 and the second pads are The same. In addition, the touch sensing substrate 10 further has a plurality of sensing traces, a plurality of driving traces, and a sensing array (the sensing traces, the driving traces, and the sensing array are not shown). The first pad P11 is connected to the sensing array via the sensing trace, and the second pad is connected to the sensing array via the driving trace. The sensing electrodes in the first direction of the sensing array of the embodiment are configured to receive the sensing signals, and the two ends of the sensing electrodes in the first direction are respectively connected to the two first pads P11. The sensing electrodes in the second direction are used to output driving signals, and the two ends of the sensing electrodes in the second direction are respectively connected to the two second pads.

The touch integrated circuit device 200 includes a die 210 and a carrier 220. The die 210 is mounted on the carrier 220 and electrically connected to the carrier 220. Here and in the following, the bare crystal refers to a wafer that has been dicing but has not been packaged. The carrier 220 is a single layer circuit board and is a flexible film. Therefore, the carrier plate 220 has flexibility. In addition, the die 210 may be mounted on the carrier 220 by a method of chip on-film (COF).

The carrier 220 includes a plurality of first lower bonding pads 221, a plurality of second lower bonding pads 222, a plurality of first upper bonding pads 223, and a plurality of second upper bonding pads 224, wherein the first lower bonding pads 221 and the second The lower bonding pads 222 have the same structure, and the first upper bonding pads 223 and the second upper bonding pads 224 have the same structure. The first lower bonding pads 221 are electrically connected to the first upper bonding pads 223, respectively, and the second lower bonding pads 222 are electrically connected to the second upper bonding pads 224, respectively.

In the present embodiment, the number of the second lower bonding pads 222 is equal to the number of the second upper bonding pads 224, and the number of the first lower bonding pads 221 is the first upper bonding pads 223. The number is twice, so the number of the first lower bonding pads 221 is an even number. Each of the first upper bonding pads 223 is electrically connected to each of the two first lower bonding pads 221 , and the first upper bonding pads 223 can be electrically insulated from the second upper bonding pads 224 . Moreover, the first upper bond pads 223 can be electrically insulated from each other, and the second upper bond pads 224 can be electrically insulated from each other.

The carrier 220 further includes a plurality of wires 225a and a plurality of wires 225b. Each of the wires 225a is connected to each of the first upper bonding pads 223 and each of the two first lower bonding pads 221, and the wiring 225a is used to form a short circuit in the carrier 220, and the two first lower bonding pads 221 are electrically connected. A first upper bond pad 223. Each of the wires 225b connects each of the second upper bonding pads 224 and each of the second lower bonding pads 222 such that the second lower bonding pads 222 are electrically connected to the second upper bonding pads 224, respectively. Further, the line width of both the wire 225a and the wire 225b is between 0.01 mm and 0.1 mm.

Since the carrier 220 is a single-layer circuit board, the carrier 220 has only one circuit layer, and the wiring 225a, the wiring 225b, the first lower bonding pad 221, the second lower bonding pad 222, the first upper bonding pad 223, and The second upper bond pad 224 is part of the circuit layer described above.

The carrier 220 can be connected to the touch sensing substrate 10. Specifically, the carrier 220 further includes a substrate 226, and the connection 225a and the connection 225b are located in the substrate 226, wherein the material constituting the substrate 226 may be a flexible polymer material, such as polymethylene (Polymide). , PI), and the substrate 226 can be formed by stacking two layers of polymer materials.

The substrate 226 has a first bonding surface 226a and a second bonding surface 226b opposite to the first bonding surface 226a, wherein the first lower bonding pads 221 are exposed on the second bonding surface 226b, as shown in FIG. 1B. Since the first lower bonding pad 221 and the second lower bonding pad 222 have the same structure, the second lower bonding pad 222 has a cross-sectional structure like the first lower bonding pad 221 shown in FIG. 1B, that is, the second lower bonding pad 222. Also exposed to the second bonding surface 226b.

The first lower bonding pad 221 is a first terminal pad for electrically connecting the first pad P11, and the second lower bonding pad 222 is a second terminal pad for electrically connecting the second pad. Each of the two first terminal pads (the first lower bonding pads 221) forms a first terminal pair, and the two first terminal pads of the same first terminal pair are electrically connected to each other. In addition, the first lower bonding pad 221 and the second lower bonding pad 222 are electrically insulated from each other.

There are various electrical connections between the first lower bonding pad 221 and the first pad P11, and between the second lower bonding pad 222 and the second pad. For example, the first lower bonding pad 221 and the second lower bonding pad may electrically connect the first pad P11 and the second pad respectively by using a solder bump. In this embodiment, the first lower bonding pad 221 and the second lower bonding pad 222 may also be electrically connected to the first pad P11 and the second pad by using an anisotropic conductive film (ACF) 20, respectively. The first lower bonding pads 221 are electrically connected to the first pads P11 by the plurality of conductive particles 21 included in the anisotropic conductive film 20, and the second lower bonding pads 222 are electrically connected to the second pads.

Figure 1C is a schematic cross-sectional view taken along line II-II of Figure 1A. Referring to FIG. 1A and FIG. 1C , the die 210 includes a plurality of first signal pads 211 , a plurality of second signal pads 212 , and a bare body 213 . The bare body 213 has a plane 213a. In this embodiment, the plane 213a is a bottom surface of the bare body 213, and the first signal pad 211 and the second signal pad 212 are exposed on the plane 213a. In addition, the second signal pad 212 and the first signal pad 211 are electrically insulated from each other.

The first upper bonding pads 223 and the second upper bonding pads 224 are exposed on the first bonding surface 226a, and the bare crystals 210 are mounted on the first bonding surface 226a. The first upper bonding pads 223 electrically conduct the first signal pads 211, and the second upper bonding pads 224 electrically conduct the second signal pads 212, respectively.

In this embodiment, the first upper bonding pad 223 and the second upper bonding pad 224 can electrically connect the first signal pad 211 and the second signal pad 212 by using a plurality of conductive bumps B1, as shown in FIG. 1C. The conductive bump B1 may protrude from the first bonding surface 226a, and the material constituting the conductive bump B1 may be a metal material having high conductivity such as gold, silver or copper.

However, in other embodiments, the first upper bonding pad 223 and the second upper bonding pad 224 may not use the conductive bumps B1, but instead use the solder bumps, the anisotropic conductive film 20 (See FIG. 1B) or a metal glue (such as silver paste or solder paste) to electrically connect the first signal pad 211 and the second signal pad 212.

The first signal pads 211 may be a plurality of signal receiving ends, and the second signal pads 212 may be a plurality of signal transmitting terminals. Therefore, the die 210 can emit a driving signal from the second signal pads 212, and the driving signal can be input to the touch sensing substrate 10 via the second upper bonding pad 224, the wiring 225b, and the second lower bonding pad 222. Measuring electrode. In addition, the bare crystal 210 can receive the sensing signals output from the sensing electrodes of the touch sensing substrate 10 from the first signal pads 211.

In the touch sensing substrate 10 of the embodiment, the two ends of the sensing electrode strip are electrically connected to the two first lower bonding pads 221 via the sensing traces, wherein the two first lower bonding pads 221 are connected. The same line 225a. Therefore, by using the wires 225a in the carrier 220, the die 210 can be connected in parallel with the sensing traces to reduce the resistance between the touch integrated circuit device 200 and the sensing trace.

It should be noted that, in this embodiment, the first signal pad 211 is a signal receiving end, and the second signal pad 212 is a signal transmitting end. However, in other embodiments, the first signal pad 211 can be a signal transmitting end and the second signal pad 212 can be a signal receiving end. In the case where the first signal pad 211 is a signal transmitting end and the second signal pad 212 is a signal receiving end, the two first signal pads 211 are electrically connected to the same driving electrode strip via a connecting line 225a. Therefore, with the connection 225a, the bare crystal 210 can emit the same driving signal from the two first signal pads 211 to both ends of one of the driving electrode strips to increase the power of the driving signal and reduce the degree of distortion of the driving signal.

Based on the above, the wire 225a can form a short circuit in the carrier 220, and the line width of both the wire 225a and the wire 225b is between 0.01 mm and 0.1 mm. Such a line width is smaller than the trace width of a conventional flexible printed circuit board, thereby facilitating the reduction of the size of the carrier 220. Compared to conventional flexible printed circuit boards, carrier 220 has a smaller size and lower cost. As such, the touch integrated circuit device 200 not only reduces the influence of the resistance of the touch sensing substrate 10 on the operation of the touch circuit, but also helps to reduce the size of the electronic product and reduce the cost.

2A is a top plan view of a touch integrated circuit device according to another embodiment of the present invention, and FIG. 2B is a cross-sectional view taken along line III-III of FIG. 2A. Referring to FIG. 2A and FIG. 2B , the touch integrated circuit device 300 includes a die 310 and a carrier 320 , and the die 310 is mounted on the carrier 320 and electrically connected to the carrier 320 . The die 310 includes a plurality of first signal pads 311 and a plurality of second signal pads 312, and the first signal pads 311 are electrically insulated from the second signal pads 312.

The carrier 320 includes a plurality of first lower bonding pads B21, a plurality of second lower bonding pads B22, a plurality of first upper bonding pads B11, and a plurality of second upper bonding pads B12, wherein the first lower bonding pads B21 and the first The upper bonding pad B11 is electrically turned on, and the second lower bonding pad B22 is electrically connected to the second upper bonding pad B12. In addition, the first upper bonding pad B11 can be electrically insulated from the second upper bonding pad B12, and the first lower bonding pad B21 can be electrically insulated from the second lower bonding pad B22.

After the bare die 310 is mounted on the carrier 320, the first signal pad 311 is electrically connected to the first upper bonding pad B11, and the second signal pad 312 is electrically connected to the second upper bonding pad B12, wherein the first signal pad 311 The first upper bonding pad B11 and the second upper bonding pad B12 can be electrically connected to the second signal pad 312 by means of the solder bump S1 or the anisotropic conductive film 20 (as shown in FIG. 1B).

The carrier 320 may be mounted on the circuit board 40. The first lower bonding pad B21 and the second lower bonding pad B22 may be electrically connected to the pads 41 of the circuit board 40 by using the solder bumps S1 or the anisotropic conductive film 20 or the like. In addition, the touch integrated circuit device 300 may include a molding compound 330, and the mold block 330 covers and seals the die 310. In addition, the die 310, the die block 330, and the carrier 320 may form a packaged chip.

The circuit board 40 can be a hard circuit substrate and electrically connected to a flexible circuit substrate 50. The circuit board 40 and the flexible circuit substrate 50 can be integrated into a flexible rigid circuit board. The flexible circuit substrate 50 has a plurality of pads 51 and 52. The pad 51 is a first terminal pad for electrically connecting the first pad P11, and the pad 52 is a second terminal pad for electrically connecting the second pad, wherein the pad 51 Both the number and the 52 are even. Each of the two first terminal pads (pads 51) forms a first terminal pair, and the two first terminal pads of the same first terminal pair are electrically connected to each other. Each of the two second terminal pads (pads 52) forms a second terminal pair, and the two second terminal pads of the same second terminal pair are electrically connected to each other. The pad 51 and the pad 52 can be electrically connected to the first pad P11 of the touch sensing substrate 10 (please refer to FIG. 1B ) and the second pad by using the solder bump S1 , the anisotropic conductive film 20 or the metal glue. In addition, the pads 51 and the pads 52 are electrically insulated from each other.

The touch integrated circuit device 300 of the present embodiment is similar to the touch integrated circuit device 200 of the foregoing embodiment. For example, the electrical function of the first signal pad 311 is the same as the electrical function of the first signal pad 211, and the electrical function of the second signal pad 312 is the same as the electrical function of the second signal pad 212. Therefore, the same features that have been described for both of the touch integrated circuit devices 200 and 300 will not be repeated below, and the main differences between the two will be described below.

The main difference between the touch integrated circuit devices 200 and 300 is that the carrier 320 is a multilayer circuit board and is a rigid circuit substrate. The die 310 may be mounted on the carrier 320 by a flip chip (as shown in FIG. 2B) or a wire bonding method. Specifically, the carrier 320 further includes a substrate 322 and an interconnect structure 324, wherein the substrate 322 is formed, for example, by a stack of multiple insulating layers (not labeled), and the main material of the insulating layer is, for example, epoxy. . The interconnect structure 324 is located in the substrate 322 and connects the first upper bonding pad B11, the second upper bonding pad B12, the first lower bonding pad B21 and the second lower bonding pad B22 to electrically connect the first upper bonding pad B11. The first lower bonding pad B21, the second upper bonding pad B12 is electrically connected to the second lower bonding pad B22.

In the present embodiment, the carrier 320 is a circuit board having four circuit layers. In detail, the interconnect structure 324 includes two inner circuit layers I1 and I2 and a plurality of conductive pillars P1, P2 and P3, wherein the inner circuit layers I1 and I2 connect the conductive pillars P1, P2 and P3. The conductive pillars P1 are respectively connected to the first upper bonding pads B11 and the second upper bonding pads B12, and the conductive pillars P3 are respectively connected to the first lower bonding pads. B21 and these second lower bonding pads B22. The conductive pillar P2 is connected between the inner layer circuit layers I1 and I2, wherein the inner layer circuit layer I1 is located between the conductive pillars P1 and the conductive pillars P2, and the inner layer circuit layer I2 is located at the conductive pillars P2 and the conductive Between columns P3.

The inner circuit layer I1 is connected to the conductive pillars P2, and each of the two conductive pillars P2 can be electrically connected to each other, and the two conductive pillars P2 electrically connected to each other pass through the inner layer circuit layer I2 and the conductive pillars P3, respectively. Two first lower bonding pads B21 or two second lower bonding pads B22 are electrically connected. Thus, each of the two first lower bonding pads B21 can be electrically connected to each other by the conductive pillars P1, P2, and P3 and the inner circuit layers I1 and I2, or each of the two second lower bonding pads B22 can be electrically connected to each other.

The inner layer circuit layer I1 is connected to the conductive pillars P1, and each of the conductive pillars P2 is electrically connected to the respective conductive pillars P3 via the inner layer circuit layer I2. Since the conductive pillar P2 is connected between the inner layer circuit layers I1 and I2, the short circuit can be formed in the carrier 320 by using the conductive pillar P2, the inner layer circuit layers I1 and I2, and the conductive pillar P3, so that each of the first upper joints is formed. The pad B11 is electrically connected to each of the two first lower bonding pads B21, and each of the second upper bonding pads B12 is electrically connected to each of the two second lower bonding pads B22.

In the above, after the first signal pad 311 is electrically connected to the first upper bonding pad B11, each of the first signal pads 311 is electrically connected to the two first lower bonding pads B21. After the second signal pad 312 is electrically connected to the second upper bonding pad B12, each of the second signal pads 312 is electrically connected to the two second lower bonding pads B22. When the die 310 emits and receives a touch signal from the first signal pad 311 and the second signal pad 312, the sensing of the touch integrated circuit device 300 and the touch sensing substrate 10 can be reduced by using the interconnect structure 324. The resistance between the traces, and also the power of the drive signal can be increased to reduce the degree of distortion of both the drive signal and the sense signal.

In addition, the carrier 320 can be reduced in size by the interconnect structure 324. Compared to conventional flexible printed circuit boards, carrier 320 can have a smaller size and lower cost. As such, the touch integrated circuit device 300 can not only reduce the influence of the resistance of the touch sensing substrate 10 on the operation of the touch circuit, but also help reduce the size of the electronic product and reduce the cost.

It should be noted that, in this embodiment, the interconnect structure 324 enables each of the two first lower bond pads B21 to be electrically connected to each other and the second second lower bond pads B22 to be electrically connected to each other. However, in other embodiments, the interconnect structure 324 may electrically insulate the first upper bond pads B11 from each other or electrically insulate the second upper bond pads B12 from each other. In addition, the interconnect structure 324 may electrically connect the first upper bonding pad B11 to the first lower bonding pad B21 one-to-one, and the second upper bonding pad B12 and the second lower bonding pad B22 are electrically connected one-to-two; or The second upper bonding pad B12 and the second lower bonding pad B22 are electrically connected one-to-one, and the first upper bonding pad B11 and the first lower bonding pad B21 are electrically connected one to two.

In this embodiment, the carrier 320 is a circuit board having four circuit layers, and the conductive pillars P1, P2, and P3 are all formed in conductive vias. However, in other embodiments, the carrier 320 may be a single-layer circuit board, a double-sided circuit board, or a circuit board having three or more circuit layers, and the interconnect structure 324 may Further comprising at least one conductive pillar formed in a conductive through hole. Alternatively, the conductive pillar P2 may be formed in a buried hole.

3 is a bottom plan view of a touch integrated circuit device according to another embodiment of the present invention. Referring to FIG. 3, the touch integrated circuit device 400a includes bare crystals and can be electrically connected to the touch sensing substrate 10 in the above embodiment (please refer to FIG. 1A and FIG. 1B). The die includes a plurality of first signal pads 410, a plurality of second signal pads 420, and a die body 440. The electrical functions of the first signal pad 410 and the second signal pad 420 are respectively the same as the electrical functions of the first signal pad 211 and the second signal pad 212 in FIG. 3D, that is, the first signal pad 410 and the second The signal pad 420 can emit and receive touch signals.

The bare body 440 has a plane 442. In this embodiment, the plane 442 is the bottom surface of the bare body 440, and the first signal pads 410 and the second signal pads 420 are exposed on the plane 442. The die can be mounted on a carrier (not shown), and the carrier can be connected to the touch sensing substrate 10, wherein the carrier can be a flexible film substrate or a hard circuit substrate. The hard circuit board can be integrated into a soft and hard circuit board with the flexible circuit board, and The flexible circuit substrate can be electrically connected to the touch sensing substrate 10 by using a solder bump, a metal paste or an anisotropic conductive film. In addition, the bare crystal of the touch integrated circuit device 400a may be directly mounted on the touch sensing substrate 10 without using any carrier.

The touch sensing circuit device 400a is electrically connected to the touch sensing substrate 10, wherein the first signal pad 410 and the second signal pad 420 can electrically connect the first pad P11 and the second pad by using the carrier. Alternatively, both the first signal pad 410 and the second signal pad 420 may also electrically connect the first pad P11 and the second pad with a solder bump or a metal paste (please refer to FIG. 1B ).

In addition, the first signal pad 410 and the second signal pad 420 are electrically insulated from each other, and each of the two first signal pads 410 is electrically connected to each other, wherein the two first signal pads 410 electrically connected to each other form a first The terminal group, therefore, the number of these first signal pads 410 is twice the number of these first terminal groups. Specifically, the bare crystal further includes a plurality of wires 431, and the wires 431 may be disposed on the plane 442, wherein the wires 431 may be traces on the plane 442.

In the above, each of the wires 431 connects the two first signal pads 410 to electrically connect the two first signal pads 410 to each other to form a first terminal group. Therefore, in the present embodiment, the first terminal group not only has two first signal pads 410, but also has a connection 431, so that the number of the wires 431 is equal to the number of the first terminal groups. In addition, in the embodiment, the two first signal pads 410 in each of the first terminal groups are electrically insulated from the first signal pads 410 in the other first terminal groups.

The same as the function of the touch integrated circuit device 200 in FIG. 1A, when the first signal pad 410 is a signal receiving pad, the two ends of the first direction sensing electrode of the touch sensing substrate 10 can be electrically connected to the same Two first signal pads 410 of a terminal set. Thus, the resistance between the lines of the touch integrated circuit device 400a can be reduced, thereby helping to reduce the degree of distortion of the sensing signal.

In addition, when the first signal pad 410 is a signal transmitting pad, two ends of one of the driving electrode strips of the touch sensing substrate 10 can be electrically connected to the two first terminals of the same first terminal group via two driving wires respectively. Signal pad 410 for touch integrated circuit device The 400a can emit the same driving signal to both ends of the above-mentioned driving electrode strip via the two first signal pads 410. In this way, the power of the drive signal can be increased, thereby reducing the degree of distortion of the drive signal.

It should be noted that, in this embodiment, the connection 431 is a trace on the plane 442, but in other embodiments, the connection 431 may not be a trace, for example, the connection 431 may be a redistribution layer (RDL). Or the internal circuit inside the die. Therefore, the connection 431 described above is not limited to being a trace.

4 is a bottom plan view of a touch integrated circuit device according to another embodiment of the present invention. Referring to FIG. 4, the touch integrated circuit device 400b of the present embodiment is similar to the touch integrated circuit device 400a of the previous embodiment. For example, the touch integrated circuit device 400b includes a bare die, and the die includes a plurality of first signal pads 410, a plurality of second signal pads 420, a wiring 431, and a bare body 440, and the die can be mounted. On a carrier board (such as a flexible film substrate or a hard circuit substrate). Therefore, the following will focus on the differences between the touch integrated circuit devices 400a and 400b. As for the same features that have been described and illustrated for both of the touch integrated circuit devices 400a and 400b, the description thereof will not be repeated.

Different from the touch integrated circuit device 400a of the foregoing embodiment, in this embodiment, not only every two first signal pads 410 are electrically connected to each other, but each two second signal pads 420 are electrically connected to each other, wherein The two second signal pads 420 electrically connected to each other form a second terminal group, and thus the number of these second signal pads 420 is twice the number of the second terminal groups. In detail, the bare crystal of the embodiment further includes a plurality of wires 432, and the wires 432 may be internal circuits disposed in the traces, redistribution layers or bare crystals disposed on the plane 442.

In the above, each of the wires 432 connects the two second signal pads 420 to electrically connect the two second signal pads 420 to each other to form a second terminal group. Therefore, in the present embodiment, the second terminal group has not only two second signal pads 420 but also a connection line 432. In addition, in the embodiment, the two second signal pads 420 of the respective second terminal groups are electrically insulated from the second signal pads 420 of the other second terminal groups.

Therefore, in the touch integrated circuit device 400b, since each of the two first signal pads 410 is electrically connected to each other, each of the two second signal pads 420 is electrically connected to each other, so that the touch integrated circuit device 400b can The sensing traces of the touch sensing substrate 10 are connected in parallel and can emit the same driving signal to both ends of one of the driving electrode strips. In this way, not only the loss of the sensing signal can be reduced, but also the power of the driving signal can be increased to help reduce the degree of distortion of both the sensing signal and the driving signal. In addition, the wires 431 and 432 can form a short circuit in the bare crystal, so that the touch integrated circuit devices 400a and 400b can more effectively reduce the size of the electronic product and reduce the cost compared with the conventional flexible printed circuit board.

In summary, the present invention utilizes a signal pad (eg, a first signal pad or a first lower bonding pad) that is electrically conductive to each other to design a short circuit in the die or carrier to reduce the touch sensing substrate. The effect of the resistor on the operation of the touch circuit, while also having the effect of reducing the volume, helps the size of the electronic product with the touch screen to be reduced, and can also effectively reduce the cost.

In order to further understand the techniques, methods, and effects of the present invention, reference should be made to the detailed description and drawings of the invention. It is believed that the following description should be made to enable those of ordinary skill in the art to understand the features and technical means of the invention. However, it must be noted that the following and the accompanying drawings are merely provided by way of illustration and illustration, and are not intended to limit the scope of the invention.

10‧‧‧Touch sensing substrate

200‧‧‧Touch integrated circuit device

210‧‧‧Bare crystal

220‧‧‧ Carrier Board

221‧‧‧First lower bonding pad

222‧‧‧Second lower joint pad

223‧‧‧First upper bonding pad

224‧‧‧Second upper bonding pad

225a, 225b‧‧‧ connection

Claims (23)

A touch integrated circuit device for electrically connecting a touch sensing substrate, wherein the touch sensing substrate has a plurality of first pads and a plurality of second pads, and the touch integrated circuit device comprises: a die includes: a die body having a plane; a plurality of first signal pads exposed on the plane; and a plurality of second signal pads exposed on the plane and electrically interconnected with the first signal pads Insulation, the first signal pads form a plurality of first terminal groups, and the number of the first signal pads is twice the number of the first terminal groups, wherein each of the first terminal groups has two a signal pad, wherein the two first signal pads in the same first terminal group are electrically connected to each other, the first signal pads are electrically connected to the first pads, and the second signal pads are individually charged Connecting the second pads. The touch integrated circuit device of claim 1, wherein the two first signal pads in each of the first terminal groups are electrically insulated from each other of the first signal pads. The touch integrated circuit device of claim 1, wherein the bare crystal further comprises: a plurality of wires, each of the wires connecting the two first signal pads in the same first terminal group, The wires are arranged on the plane. The touch integrated circuit device of claim 1, wherein the second signal pads form a plurality of second terminal groups, and the number of the second signal pads is the number of the second terminal groups Two times, wherein each of the second terminal groups has two second signal pads, and the two second signal pads in the same second terminal group are electrically connected to each other. The touch integrated circuit device of claim 4, wherein the two second signal pads in each of the second terminal groups and the other second signal pads are mutually Electrical insulation. The touch integrated circuit device of claim 4, wherein the bare crystal further comprises: a plurality of wires, each of the wires connecting the two second signal pads in the same second terminal group, The wires are arranged on the plane. The touch integrated circuit device of claim 1, wherein the first signal pads are a plurality of signal receiving ends, and the second signal pads are a plurality of signal transmitting ends. The touch integrated circuit device of claim 1, wherein the first signal pads are a plurality of signal transmitting ends, and the second signal pads are a plurality of signal receiving ends. The touch integrated circuit device of claim 1, further comprising a carrier plate on which the die is mounted. The touch integrated circuit device according to claim 9, wherein the carrier is a flexible film substrate or a hard circuit substrate. A touch integrated circuit device includes: a die having a plurality of first signal pads and a plurality of second signal pads; a carrier board comprising: a substrate having a first bonding surface and a first opposing surface a second bonding surface of the bonding surface, wherein the die is mounted on the first bonding surface; a plurality of first upper bonding pads are exposed on the first bonding surface, and respectively connecting the first signal pads; a second upper bonding pad, exposed on the first bonding surface, and respectively connected to the second signal pads, wherein the first upper bonding pads and the second upper bonding pads are electrically insulated from each other; a bonding pad, exposed on the second bonding surface, and electrically connecting the first upper bonding pads, wherein the number of the first lower bonding pads is twice the number of the first upper bonding pads, and each of the First upper bond pad with every two The first lower bonding pads are electrically conductive; and the plurality of second lower bonding pads are exposed to the second bonding surface, and electrically connected to the second upper bonding pads respectively. The touch integrated circuit device of claim 11, wherein the carrier is a multi-layer circuit board, and further includes an interconnect structure disposed in the substrate, the interconnect structure connecting the first The upper bonding pads, the second upper bonding pads, the first lower bonding pads and the second lower bonding pads, and electrically connecting the first upper bonding pads to the first lower bonding pads, and The second upper bonding pads electrically connect the second lower bonding pads. The touch integrated circuit device of claim 12, wherein the interconnect structure comprises a plurality of inner layer circuit layers and a plurality of conductive pillars, the conductive pillars respectively connecting the first upper bonding pads, The second upper bonding pads, the first lower bonding pads and the second lower bonding pads, and the inner circuit layers are connected to the conductive pillars, and the first upper bonding pads are electrically connected to the first The bonding pads are next, and the second upper bonding pads are electrically connected to the second lower bonding pads. The touch integrated circuit device of claim 11, wherein the first upper bonding pads are electrically insulated from each other. The touch integrated circuit device of claim 11, wherein the carrier is a flexible film substrate, and further includes a plurality of wires located in the substrate, wherein each of the first upper bonding pads is connected via the wire Two first lower bond pads. The touch integrated circuit device of claim 11, wherein the second upper bonding pads are electrically insulated from each other. The touch integrated circuit device of claim 11, wherein the number of the second lower bonding pads is twice the number of the second upper bonding pads, and each of the second upper bonding pads is Each of the two second lower bonding pads is electrically conductive. The touch integrated circuit device of claim 17, wherein the carrier is a flexible film substrate, and further comprising a plurality of wires located in the substrate, wherein each of the second upper bonding pads is connected via the wire Two second lower bond pads. The touch integrated circuit device of claim 11, wherein the first signal pads are a plurality of signal receiving ends, and the second signal pads are a plurality of signal transmitting ends. The touch integrated circuit device of claim 11, wherein the first signal pads are a plurality of signal transmitting ends, and the second signal pads are a plurality of signal receiving ends. A touch integrated circuit device is configured to connect a touch sensing substrate, wherein the touch sensing substrate has a plurality of first pads and a plurality of second pads, and the touch integrated circuit device comprises: a first terminal pad for electrically connecting the first pads, the number of the first terminal pads is the same as the number of the first pads, and the number of the first terminal pads is an even number, wherein Each of the two first terminal pads forms a first terminal pair, and the two first terminal pads of the same first terminal pair are electrically connected to each other; and a plurality of second terminal pads for electrically connecting the two a second pad, the number of the second terminal pads being the same as the number of the second pads; wherein the first terminal pads are a plurality of signal receiving pads, and the second terminal pads are multiple signal transmissions The pad; or the first terminal pads are a plurality of signal transmitting pads, and the second terminal pads are a plurality of signal receiving pads. The touch integrated circuit device of claim 21, wherein the number of the second terminal pads is an even number, and each of the two second terminal pads forms a second terminal pair and the same second terminal The two second terminal pads of the pair are electrically connected to each other. The touch integrated circuit device of claim 21, wherein the first terminal pads and the second terminal pads are electrically insulated from each other.