TWI493569B - Memory device and method for reading data from memeory device - Google Patents
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Description
本發明係關於一種記憶體裝置,特別係關於具有高速讀取功能之記憶體裝置。The present invention relates to a memory device, and more particularly to a memory device having a high speed reading function.
第1圖係顯示傳統之一記憶體裝置100之示意圖。記憶體裝置100包括一記憶單元陣列110和一感測放大器160。複數筆資料,例如:位元組0-7,係儲存於記憶單元陣列110中。記憶單元陣列110包括複數條字元線111、112以及複數條位元線以選擇資料之位址。當一外部裝置欲由記憶單元陣列110中讀取資料時,在一感測週期中僅能選擇一條字元線,否則將會發生錯誤。例如,若字元線111、112在同一時間被選擇,則感測放大器160將無法分辨讀取資料係來自位元組0或是位元組4。因此,傳統記憶體裝置100之讀取速度將會受到限制。1 is a schematic diagram showing a conventional one memory device 100. The memory device 100 includes a memory cell array 110 and a sense amplifier 160. A plurality of pieces of data, for example, bytes 0-7, are stored in the memory cell array 110. The memory cell array 110 includes a plurality of word lines 111, 112 and a plurality of bit lines to select an address of the data. When an external device wants to read data from the memory cell array 110, only one word line can be selected in one sensing cycle, otherwise an error will occur. For example, if word lines 111, 112 are selected at the same time, sense amplifier 160 will not be able to distinguish that the read data is from byte 0 or byte 4. Therefore, the reading speed of the conventional memory device 100 will be limited.
本發明提供一種記憶體裝置,包括:一第一記憶單元陣列,包括複數第一字元線和複數第一位元線,其中複數第一資料係儲存於該第一記憶單元陣列中;一第二記憶單元陣列,與該第一記憶單元陣列分離,並包括複數第二字元線和複數第二位元線,其中複數第二資料係儲存於該第二記憶單元陣列中;一控制邏輯電路,允許於一相同時間或於一重疊時間中 選擇該等第一字元線之一者以及該等第二字元線之一者,並且交錯地選擇該第一記憶單元陣列之一第一位址和該第二記憶單元陣列之一第二位址,以從該第一記憶單元陣列和該第二記憶單元陣列中交錯地讀取該等第一資料之一第一對應部份以及該等第二資料之一第二對應部份;一第一感測放大器,經由該等第一位元線耦接至該第一記憶單元陣列,並放大該等第一資料之該第一對應部份;以及一第二感測放大器,經由該等第二位元線耦接至該第二記憶單元陣列,並放大該等第二資料之該第二對應部份。The present invention provides a memory device, comprising: a first memory cell array comprising a plurality of first word lines and a plurality of first bit lines, wherein the plurality of first data are stored in the first memory cell array; The second memory cell array is separated from the first memory cell array and includes a plurality of second word lines and a plurality of second bit lines, wherein the plurality of second data are stored in the second memory cell array; a control logic circuit , allowed at the same time or in an overlapping time Selecting one of the first word lines and one of the second word lines, and alternately selecting one of the first address of the first memory cell array and one of the second memory cell array And an address of the first corresponding portion of the first data and a second corresponding portion of the second data are alternately read from the first memory cell array and the second memory cell array; a first sense amplifier coupled to the first memory cell array via the first bit lines and amplifying the first corresponding portion of the first data; and a second sense amplifier via the first sense amplifier The second bit line is coupled to the second memory unit array and amplifies the second corresponding portion of the second data.
另外,本發明提供一種由一記憶體裝置中讀取資料之方法,包括下列步驟:提供一第一記憶單元陣列,其中該第一記憶單元陣列包括複數第一字元線和複數第一位元線,而複數第一資料係儲存於該第一記憶單元陣列中;提供一第二記憶單元陣列,其中該第二記憶單元陣列包括複數第二字元線和複數第二位元線,該第二記憶單元陣列與該第一記憶單元陣列分離,而複數第二資料係儲存於該第二記憶單元陣列中;於一相同時間或於一重疊時間中選擇該等第一字元線之一者以及該等第二字元線之一者;交錯地選擇該第一記憶單元陣列之一第一位址和該第二記憶單元陣列之一第二位址,以從該第一記憶單元陣列和該第二記憶單元陣列中交錯地讀取該等第一資料之一第一對應部份以及該等第二資料之一第二對應部份;以及放大該等第一資料之該第一對應部份以及該等第二資料之該第二對應部份。In addition, the present invention provides a method of reading data from a memory device, comprising the steps of: providing a first memory cell array, wherein the first memory cell array comprises a plurality of first word lines and a plurality of first bits a plurality of first data is stored in the first memory cell array; a second memory cell array is provided, wherein the second memory cell array includes a plurality of second word lines and a plurality of second bit lines, the The second memory cell array is separated from the first memory cell array, and the plurality of second data is stored in the second memory cell array; and one of the first word lines is selected at the same time or in an overlapping time And one of the second word lines; alternately selecting one of the first address of the first memory cell array and the second address of the second memory cell array from the first memory cell array and Interleaving a first corresponding portion of the first data and a second corresponding portion of the second data in the second memory cell array; and amplifying the first corresponding portion of the first data Share And the second part corresponding to those of the second data.
100、200‧‧‧記憶體裝置100, 200‧‧‧ memory devices
110、210、220‧‧‧記憶單元陣列110, 210, 220‧‧‧ memory cell array
111、112、211、212、221、222‧‧‧字元線111, 112, 211, 212, 221, 222‧‧ ‧ character lines
160、260、270‧‧‧感測放大器160, 260, 270‧‧ ‧ sense amplifier
215、216、225、226‧‧‧位元線215, 216, 225, 226‧ ‧ bit lines
250‧‧‧控制邏輯電路250‧‧‧Control logic
280‧‧‧資料多工器280‧‧‧Data multiplexer
290‧‧‧位移暫存器290‧‧‧Displacement register
CLK‧‧‧時脈信號CLK‧‧‧ clock signal
S1、S2‧‧‧資料之對應部份Corresponding parts of S1, S2‧‧‧ data
SA1、SA2、410-1、410-2、…、410-7‧‧‧位址SA1, SA2, 410-1, 410-2, ..., 410-7‧‧‧ addresses
SE1、SE2‧‧‧感測致能信號SE1, SE2‧‧‧ sensing enable signal
SIN‧‧‧輸入信號SIN‧‧‧ input signal
SOUT‧‧‧輸出資料SOUT‧‧‧Output data
T1、T2‧‧‧感測時間T1, T2‧‧‧ sensing time
第1圖係顯示傳統之記憶體裝置之示意圖;第2圖係顯示根據本發明一實施例所述之記憶體裝置之示意圖;第3A圖係顯示根據本發明一實施例所述之第一記憶單元陣列和第二記憶單元陣列之示意圖;第3B圖係顯示根據本發明另一實施例所述之第一記憶單元陣列和第二記憶單元陣列之示意圖;第4A圖係顯示根據本發明一實施例所述之記憶體裝置之信號波形圖;第4B圖係顯示根據本發明另一實施例所述之記憶體裝置之信號波形圖;第5圖係顯示根據本發明一實施例所述之由記憶體裝置中讀取資料之方法之流程圖;第6A圖係顯示根據本發明一實施例所述之第一記憶單元陣列和第二記憶單元陣列之示意圖;以及第6B圖係顯示根據本發明另一實施例所述之第一記憶單元陣列和第二記憶單元陣列之示意圖。1 is a schematic view showing a conventional memory device; FIG. 2 is a schematic view showing a memory device according to an embodiment of the present invention; and FIG. 3A is a view showing a first memory according to an embodiment of the present invention; Schematic diagram of a cell array and a second memory cell array; FIG. 3B is a schematic diagram showing a first memory cell array and a second memory cell array according to another embodiment of the present invention; FIG. 4A is a view showing an implementation according to the present invention; FIG. 4B is a signal waveform diagram of a memory device according to another embodiment of the present invention; and FIG. 5 is a diagram showing a signal waveform of a memory device according to another embodiment of the present invention; A flowchart of a method of reading data in a memory device; FIG. 6A is a schematic diagram showing a first memory cell array and a second memory cell array according to an embodiment of the invention; and FIG. 6B is a diagram showing A schematic diagram of a first memory cell array and a second memory cell array according to another embodiment.
第2圖係顯示根據本發明一實施例所述之記憶體裝置200之示意圖。記憶體裝置200可以是一NOR快閃記憶體,但不限於此。如第2圖所示,記憶體裝置200包括:一第一記憶單元陣列210、一第二記憶單元陣列220、一控制邏輯電路250、一第一感測放大器260、一第二感測放大器270、一資料多工器 280,以及一位移暫存器290。2 is a schematic diagram showing a memory device 200 according to an embodiment of the invention. The memory device 200 can be a NOR flash memory, but is not limited thereto. As shown in FIG. 2, the memory device 200 includes a first memory cell array 210, a second memory cell array 220, a control logic circuit 250, a first sense amplifier 260, and a second sense amplifier 270. Data multiplexer 280, and a shift register 290.
第一記憶單元陣列210係與第二記憶單元陣列220分離。複數筆第一資料(例如:位元組)係儲存於第一記憶單元陣列210中,而複數筆第二資料(例如:位元組)係儲存於第二記憶單元陣列220中。該等第一資料和該等第二資料之組合為完整之連續資料。然而,在一些實施例中,儲存於第一記憶單元陣列中210之該等第一資料以及儲存於第二記憶單元陣列220中之該等第二資料皆為不連續資料。第一記憶單元陣列210包括複數條第一字元線211、212和複數條第一位元線215、216。第一感測放大器260係經由該等第一位元線耦接至第一記憶單元陣列210。第二記憶單元陣列220亦包括複數條第二字元線221、222和複數條第二位元線225、226。第二感測放大器270係經由該等第二位元線耦接至第二記憶單元陣列220。在一讀取過程中,前述之字元線和位元線係用於選擇任一記憶單元陣列之位址。為了簡化圖式,並非所有字元線和位元線皆顯示於第2圖中。必須理解的是,本實施例中每一記憶單元陣列皆可包括更多字元線及位元線。The first memory cell array 210 is separated from the second memory cell array 220. The plurality of first data (eg, a byte) is stored in the first memory cell array 210, and the second data (eg, a byte) is stored in the second memory cell array 220. The combination of these first materials and the second materials is complete and continuous. However, in some embodiments, the first data stored in the first memory cell array 210 and the second data stored in the second memory cell array 220 are discontinuous data. The first memory cell array 210 includes a plurality of first word lines 211, 212 and a plurality of first bit lines 215, 216. The first sense amplifier 260 is coupled to the first memory cell array 210 via the first bit lines. The second memory cell array 220 also includes a plurality of second word lines 221, 222 and a plurality of second bit lines 225, 226. The second sense amplifier 270 is coupled to the second memory cell array 220 via the second bit lines. In a read process, the aforementioned word line and bit line are used to select the address of any memory cell array. To simplify the drawing, not all of the word lines and bit lines are shown in Figure 2. It should be understood that each memory cell array in this embodiment may include more word lines and bit lines.
控制邏輯電路250係用於從第一記憶單元陣列210中讀取該等第一資料,以及從第二記憶單元陣列220中讀取該等第二資料。在一些實施例中,控制邏輯電路250接收一輸入信號SIN,其指示任一記憶單元陣列之一起始位址,而控制邏輯電路250再從該起始位址開始執行一讀取程序。在該讀取程序期間,控制邏輯電路250可允許於一相同時間或於一重疊時間中選擇該等第一字元線之一者以及該等第二字元線之一 者。舉例來說,第一記憶單元陣列210之第一字元線211和第二記憶單元陣列220之第二字元線221可於同一時間中被選擇。由於第一記憶單元陣列210係與第二記憶單元陣列220分離,一條第一字元線之選擇係與另一條第二字元線之選擇相互獨立,而感測放大器260、270可以無混淆地分辨讀取之資料。在較佳實施例中,控制邏輯電路250係交錯地選擇第一記憶單元陣列210之一第一位址SA1和第二記憶單元陣列220之一第二位址SA2,以從第一記憶單元陣列210和第二記憶單元陣列220中交錯地讀取該等第一資料之一第一對應部份S1以及該等第二資料之一第二對應部份S2。必須注意的是,每一對應部份皆可包括一或多筆資料。接下來,第一感測放大器260放大已讀取之第一對應部份S1,而第二感測放大器270放大已讀取之第二對應部份S2。資料多工器280係耦接至第一感測放大器260和第二感測放大器270。資料多工器280係選擇性地傳送放大之第一對應部份S1和放大之第二對應部份S2至位移暫存器290。位移暫存器290再根據第一對應部份S1和第二對應部份S2依序地產生複數筆輸出資料SOUT。Control logic circuit 250 is for reading the first data from first memory cell array 210 and reading the second data from second memory cell array 220. In some embodiments, control logic circuit 250 receives an input signal SIN indicating one of the start addresses of any of the memory cell arrays, and control logic circuit 250 then performs a read procedure from the start address. During the read process, control logic circuit 250 may allow one of the first word lines and one of the second word lines to be selected at an identical time or in an overlap time By. For example, the first word line 211 of the first memory cell array 210 and the second word line 221 of the second memory cell array 220 can be selected at the same time. Since the first memory cell array 210 is separated from the second memory cell array 220, the selection of one first word line is independent of the selection of the other second word line, and the sense amplifiers 260, 270 can be confusingly Distinguish the data read. In a preferred embodiment, the control logic circuit 250 alternately selects one of the first address unit SA1 of the first memory cell array 210 and the second address address SA2 of the second memory cell array 220 to be from the first memory cell array. The first corresponding portion S1 of the first data and the second corresponding portion S2 of the second data are alternately read by the 210 and the second memory cell array 220. It must be noted that each corresponding part may include one or more pieces of data. Next, the first sense amplifier 260 amplifies the read first corresponding portion S1, and the second sense amplifier 270 amplifies the read second corresponding portion S2. The data multiplexer 280 is coupled to the first sense amplifier 260 and the second sense amplifier 270. The data multiplexer 280 selectively transmits the amplified first corresponding portion S1 and the amplified second corresponding portion S2 to the shift register 290. The shift register 290 sequentially generates the plurality of output data SOUT according to the first corresponding portion S1 and the second corresponding portion S2.
更詳細地說,控制邏輯電路250更接收一時脈信號CLK。在控制邏輯電路250接收到指示該起始位址之輸入信號SIN之後,控制邏輯電路250即傳送感測致能信號SE1、SE2以啟動該讀取程序。記憶體裝置200之詳細操作流程將於下列實施例中作說明。In more detail, the control logic circuit 250 further receives a clock signal CLK. After the control logic circuit 250 receives the input signal SIN indicating the start address, the control logic circuit 250 transmits the sense enable signals SE1, SE2 to initiate the read process. The detailed operational flow of the memory device 200 will be described in the following embodiments.
第3A圖係顯示根據本發明一實施例所述之第一記憶單元陣列210和第二記憶單元陣列220之示意圖。如第3A圖所 示,儲存於第一記憶單元陣列210中之該等第一資料包括不連續之位元組0、2、4、6,而儲存於第二記憶單元陣列220中之該等第二資料包括不連續之位元組1、3、5、7。每一位元組皆可視為一筆資料。該等第一資料和該等第二資料之組合可形成完整資料,其包括連續之位元組0至7。為了簡化圖式,第3A圖並未顯示所有位元組,但必須理解的是,每一記憶單元陣列皆可儲存更多位元組。FIG. 3A is a schematic diagram showing a first memory cell array 210 and a second memory cell array 220 according to an embodiment of the invention. As shown in Figure 3A The first data stored in the first memory cell array 210 includes discontinuous bits 0, 2, 4, and 6, and the second data stored in the second memory cell array 220 includes Successive bytes 1, 3, 5, 7. Each tuple can be viewed as a piece of information. The combination of the first data and the second data may form complete information including consecutive bytes 0 through 7. To simplify the drawing, Figure 3A does not show all the bytes, but it must be understood that each memory cell array can store more bytes.
第4A圖係顯示根據本發明一實施例所述之記憶體裝置200之信號波形圖。請一併參考第2圖、第3A圖,以及第4A圖。若已接收到輸入信號SIN後,在產生輸出資料SOUT前,必須先耗費幾個虛週期(Dummy Cycles)以初始化一讀取程序。第4A圖中之位址410-0至410-7(未顯示全部位址)係分別對應至第3A圖中之位元組0至7。如第4A圖所示,在該讀取程序期間,控制邏輯電路250係交錯地選擇第一記憶單元陣列210之第一位址SA1(例如:位址410-0、410-2、410-4、410-6之一者)和第二記憶單元陣列220之第二位址SA2(例如:位址410-1、410-3、410-5、410-7之一者),以從第一記憶單元陣列210和第二記憶單元陣列220中交錯地讀取該等第一資料之第一對應部份S1(例如:位元組0、2、4、6之一者)以及該等第二資料之第二對應部份S2(例如:位元組1、3、5、7之一者)。即使儲存之該等第一資料和儲存之該等第二資料皆為不連續,但輸出資料SOUT可為完整且連續之資料。在本實施例中,每當第一位址SA1(例如:位址410-2)被選擇時,讀取之第一對應部份S1(例如:位元組2)之資料數量為1,而每當第二位址SA2(例如:位 址410-3)被選擇時,讀取之第二對應部份S2(例如:位元組3)之資料數量亦為1。舉例來說,在第3A圖中,若選擇第一字元線211,則該等第一資料之一者(例如:位元組2)將被讀取;而若選擇第二字元線221,則該等第二資料之一者(例如:位元組3)將被讀取,其中第一字元線211和第二字元線221可於一相同時間或一重疊時間中被選擇。在本實施例中,第一位址SA1和第二位址SA2皆為每經過二個時脈週期即增加2。一感測時間T1係用於讀取第一對應部份S1(例如:位元組2)或用於讀取第二對應部份S2(例如:位元組3),除了初始化過程期間以外,感測時間T1之最大值為二個時脈週期。相較之下,第1圖所示之傳統記憶體裝置100之一感測時間之最大值為一個時脈週期。因此,第2、3A、4A圖所示之實施例將可提供更快之讀取速度,其約為傳統讀取速度之兩倍。FIG. 4A is a diagram showing signal waveforms of the memory device 200 according to an embodiment of the invention. Please refer to Figure 2, Figure 3A, and Figure 4A together. If the input signal SIN has been received, it is necessary to spend several dummy cycles (Dummy Cycles) to initialize a read program before generating the output data SOUT. The addresses 410-0 to 410-7 in Figure 4A (all addresses are not shown) correspond to the bytes 0 to 7 in Figure 3A, respectively. As shown in FIG. 4A, during the read process, the control logic circuit 250 alternately selects the first address SA1 of the first memory cell array 210 (eg, addresses 410-0, 410-2, 410-4). a second address SA2 of the second memory cell array 220 (eg, one of the addresses 410-1, 410-3, 410-5, 410-7) to The memory cell array 210 and the second memory cell array 220 alternately read the first corresponding portion S1 of the first data (eg, one of the bytes 0, 2, 4, and 6) and the second The second corresponding portion of the data S2 (for example, one of the bytes 1, 3, 5, 7). Even if the first data stored and the stored second data are discontinuous, the output data SOUT may be complete and continuous data. In this embodiment, each time the first address SA1 (for example, the address 410-2) is selected, the number of data of the first corresponding portion S1 (for example, byte 2) read is 1, and Whenever the second address is SA2 (for example: bit When the address 410-3) is selected, the number of data of the second corresponding portion S2 (for example, byte 3) read is also 1. For example, in FIG. 3A, if the first word line 211 is selected, one of the first data (eg, byte 2) will be read; and if the second word line 221 is selected. Then, one of the second materials (eg, byte 3) will be read, wherein the first word line 211 and the second word line 221 can be selected at the same time or an overlapping time. In this embodiment, the first address SA1 and the second address SA2 are both increased by 2 every two clock cycles. A sensing time T1 is used to read the first corresponding portion S1 (for example: byte 2) or to read the second corresponding portion S2 (for example: byte 3), except during the initialization process, The maximum value of the sensing time T1 is two clock cycles. In contrast, the maximum value of one of the sensing times of the conventional memory device 100 shown in FIG. 1 is one clock period. Thus, the embodiment shown in Figures 2, 3A, and 4A will provide a faster read speed that is about twice the conventional read speed.
第3B圖係顯示根據本發明另一實施例所述之第一記憶單元陣列210和第二記憶單元陣列220之示意圖。如第3B圖所示,儲存於第一記憶單元陣列210中之該等第一資料包括不連續之位元組0、1、4、5,而儲存於第二記憶單元陣列220中之該等第二資料包括不連續之位元組2、3、6、7。每一位元組皆可視為一筆資料。該等第一資料和該等第二資料之組合可形成完整資料,其包括連續之位元組0至7。為了簡化圖式,第3B圖並未顯示所有位元組,但必須理解的是,每一記憶單元陣列皆可儲存更多位元組。第3B圖與第3A圖相似,兩者之差異在於,第3B圖中,每一記憶單元陣列儲存之任二個鄰近之位元組(例如:位元組0、1)可以是連續資料。此設計方式將可進一 步地加快記憶體裝置200之讀取速度。FIG. 3B is a schematic diagram showing the first memory cell array 210 and the second memory cell array 220 according to another embodiment of the present invention. As shown in FIG. 3B, the first data stored in the first memory cell array 210 includes discontinuous bits 0, 1, 4, and 5, and are stored in the second memory cell array 220. The second data includes discontinuous bits 2, 3, 6, and 7. Each tuple can be viewed as a piece of information. The combination of the first data and the second data may form complete information including consecutive bytes 0 through 7. In order to simplify the drawing, Figure 3B does not show all the bytes, but it must be understood that each memory cell array can store more bytes. Figure 3B is similar to Figure 3A in that the difference between the two is that, in Figure 3B, any two adjacent bytes stored in each memory cell array (e.g., byte 0, 1) may be continuous data. This design method will be able to enter one The reading speed of the memory device 200 is accelerated step by step.
第4B圖係顯示根據本發明另一實施例所述之記憶體裝置200之信號波形圖。請一併參考第2圖、第3B圖,以及第4B圖。若已接收到輸入信號SIN後,在產生輸出資料SOUT前,必須先耗費幾個虛週期以初始化一讀取程序。第4B圖中之位址410-0至410-7(未顯示全部位址)係分別對應至第3B圖中之位元組0至7。如第4B圖所示,在該讀取程序期間,控制邏輯電路250係交錯地選擇第一記憶單元陣列210之第一位址SA1(例如:位址410-0、410-4之一者)和第二記憶單元陣列220之第二位址SA2(例如:位址410-2、410-6之一者),以從第一記憶單元陣列210和第二記憶單元陣列220中交錯地讀取該等第一資料之第一對應部份S1(例如:位元組0、1,或是位元組4、5)以及該等第二資料之第二對應部份S2(例如:位元組2、3,或是位元組6、7)。即使儲存之該等第一資料和儲存之該等第二資料皆為不連續,但輸出資料SOUT可為完整且連續之資料。在本實施例中,每當第一位址SA1(例如:位址410-4)被選擇時,讀取之第一對應部份S1(例如:位元組4、5)之資料數量為2,而每當第二位址SA2(例如:位址410-6)被選擇時,讀取之第二對應部份S2(例如:位元組6、7)之資料數量亦為2。舉例來說,在第3B圖中,若選擇第一字元線212,則該等第一資料之連續二者(例如:位元組4、5)將一起被讀取;而若選擇第二字元線222,則該等第二資料之連續二者(例如:位元組6、7)將一起被讀取,其中第一字元線212和第二字元線222可於一相同時間或一重疊時間中被選擇。在本實施例中,第一位址SA1和第二位址SA2皆為 每經過四個時脈週期即增加4。一感測時間T2係用於讀取第一對應部份S1(例如:位元組4、5)或用於讀取第二對應部份S2(例如:位元組6、7),除了初始化過程期間以外,感測時間T2之最大值為四個時脈週期。相較之下,第1圖所示之傳統記憶體裝置100之一感測時間之最大值為一個時脈週期。因此,第2、3B、4B圖所示之實施例將可提供更快之讀取速度,其約為傳統讀取速度之四倍。Fig. 4B is a diagram showing signal waveforms of the memory device 200 according to another embodiment of the present invention. Please refer to Figure 2, Figure 3B, and Figure 4B together. If the input signal SIN has been received, it is necessary to spend several virtual cycles to initialize a read program before generating the output data SOUT. The addresses 410-0 to 410-7 (not all addresses are shown) in Fig. 4B correspond to the bytes 0 to 7 in Fig. 3B, respectively. As shown in FIG. 4B, during the read process, the control logic circuit 250 alternately selects the first address SA1 of the first memory cell array 210 (eg, one of the addresses 410-0, 410-4). And a second address SA2 of the second memory cell array 220 (eg, one of the addresses 410-2, 410-6) to be interleaved from the first memory cell array 210 and the second memory cell array 220 a first corresponding portion S1 of the first data (eg, byte 0, 1, or a byte 4, 5) and a second corresponding portion S2 of the second data (eg, a byte) 2, 3, or byte 6, 7). Even if the first data stored and the stored second data are discontinuous, the output data SOUT may be complete and continuous data. In this embodiment, each time the first address SA1 (for example, the address 410-4) is selected, the number of data of the first corresponding portion S1 (for example, the bytes 4, 5) read is 2 And each time the second address SA2 (for example, the address 410-6) is selected, the number of data of the second corresponding portion S2 (for example, the bytes 6, 7) read is also 2. For example, in FIG. 3B, if the first word line 212 is selected, then consecutive two of the first data (eg, bytes 4, 5) will be read together; and if the second is selected Word line 222, then consecutive two of the second data (eg, bytes 6, 7) will be read together, wherein the first word line 212 and the second word line 222 can be at the same time Or selected during an overlapping time. In this embodiment, the first address SA1 and the second address SA2 are both It increases by 4 every four clock cycles. A sensing time T2 is used to read the first corresponding portion S1 (eg, byte 4, 5) or to read the second corresponding portion S2 (eg, byte 6, 7), except for initialization Outside of the process, the maximum value of the sensing time T2 is four clock cycles. In contrast, the maximum value of one of the sensing times of the conventional memory device 100 shown in FIG. 1 is one clock period. Thus, the embodiment shown in Figures 2, 3B, and 4B will provide a faster read speed that is approximately four times the conventional read speed.
第5圖係顯示根據本發明一實施例所述之由一記憶體裝置中讀取資料之方法之流程圖。首先,在步驟S510,提供一第一記憶單元陣列,其中該第一記憶單元陣列包括複數第一字元線和複數第一位元線,而複數第一資料係儲存於該第一記憶單元陣列中。在步驟S520,提供一第二記憶單元陣列,其中該第二記憶單元陣列包括複數第二字元線和複數第二位元線,該第二記憶單元陣列與該第一記憶單元陣列分離,而複數第二資料係儲存於該第二記憶單元陣列中。在步驟S530,於一相同時間或於一重疊時間中選擇該等第一字元線之一者以及該等第二字元線之一者。在步驟S540,交錯地選擇該第一記憶單元陣列之一第一位址和該第二記憶單元陣列之一第二位址,以從該第一記憶單元陣列和該第二記憶單元陣列中交錯地讀取該等第一資料之一第一對應部份以及該等第二資料之一第二對應部份。最後,在步驟S550,放大該等第一資料之該第一對應部份以及該等第二資料之該第二對應部份。值得注意的是,以上方法步驟皆無須依次序執行。第2、3A、3B、4A、4B圖相關之實施例,其所有細部特徵均可套用至第5圖所示之方 法中。Figure 5 is a flow chart showing a method of reading data from a memory device in accordance with an embodiment of the present invention. First, in step S510, a first memory cell array is provided, wherein the first memory cell array includes a plurality of first word lines and a plurality of first bit lines, and the plurality of first data is stored in the first memory cell array in. In step S520, a second memory cell array is provided, wherein the second memory cell array includes a plurality of second word lines and a plurality of second bit lines, and the second memory cell array is separated from the first memory cell array, and The plurality of second data are stored in the second memory cell array. In step S530, one of the first word lines and one of the second word lines are selected at the same time or in an overlap time. In step S540, one of the first address of the first memory cell array and one of the second address of the second memory cell array are alternately selected to be interleaved from the first memory cell array and the second memory cell array. And reading a first corresponding portion of the first data and a second corresponding portion of the second data. Finally, in step S550, the first corresponding portion of the first data and the second corresponding portion of the second data are enlarged. It is worth noting that none of the above method steps need to be performed sequentially. For the embodiments related to Figures 2, 3A, 3B, 4A, and 4B, all of the detailed features can be applied to the square shown in Figure 5. In the law.
雖然以上所述,在各記憶單元陣列中,每一字元線僅對應至兩個位元組,但本發明並不限於此。第6A圖係顯示根據本發明一實施例所述之第一記憶單元陣列210和第二記憶單元陣列220之示意圖。如第6A圖所示,在各記憶單元陣列中,每一字元線可對應至四個位元組,而第6A圖之設計方式可與第4A圖之實施例產生相似之信號波形。第6B圖係顯示根據本發明另一實施例所述之第一記憶單元陣列210和第二記憶單元陣列220之示意圖。如第6B圖所示,在各記憶單元陣列中,每一字元線可對應至四個位元組,而第6B圖之設計方式可與第4B圖之實施例產生相似之信號波形。值得注意的是,本發明更可套用至各種各式之記憶單元陣列,例如,其每一字元線對應至2、4、8、16、32、64、128,256,甚至更多個位元組之記憶單元陣列。Although described above, in each memory cell array, each word line corresponds to only two bytes, but the present invention is not limited thereto. FIG. 6A is a schematic diagram showing a first memory cell array 210 and a second memory cell array 220 according to an embodiment of the invention. As shown in Fig. 6A, in each memory cell array, each word line can correspond to four bytes, and the design of Fig. 6A can produce a similar signal waveform as the embodiment of Fig. 4A. FIG. 6B is a schematic diagram showing the first memory cell array 210 and the second memory cell array 220 according to another embodiment of the present invention. As shown in FIG. 6B, in each memory cell array, each word line can correspond to four bytes, and the design of FIG. 6B can produce a similar signal waveform as the embodiment of FIG. 4B. It should be noted that the present invention can be applied to various memory cell arrays, for example, each word line corresponds to 2, 4, 8, 16, 32, 64, 128, 256, or even more bits. A memory cell array of tuples.
在本說明書以及申請專利範圍中的序數,例如「第一」、「第二」、「第三」等等,彼此之間並沒有順序上的先後關係,其僅用於標示區分兩個具有相同名字之不同元件。The ordinal numbers in this specification and the scope of the patent application, such as "first", "second", "third", etc., have no sequential relationship with each other, and are only used to indicate that two are identical. Different components of the name.
本發明雖以較佳實施例揭露如上,然其並非用以限定本發明的範圍,任何熟習此項技藝者,在不脫離本發明之精神和範圍內,當可做些許的更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。The present invention has been described above with reference to the preferred embodiments thereof, and is not intended to limit the scope of the present invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
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