TWI491100B - - Google Patents

Info

Publication number
TWI491100B
TWI491100B TW100139750A TW100139750A TWI491100B TW I491100 B TWI491100 B TW I491100B TW 100139750 A TW100139750 A TW 100139750A TW 100139750 A TW100139750 A TW 100139750A TW I491100 B TWI491100 B TW I491100B
Authority
TW
Taiwan
Application number
TW100139750A
Other languages
Chinese (zh)
Other versions
TW201228088A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201228088A publication Critical patent/TW201228088A/en
Application granted granted Critical
Publication of TWI491100B publication Critical patent/TWI491100B/zh

Links

TW100139750A 2010-12-17 2011-11-01 Multi-channel radio-frequency filter for electrostatic sucking disk TW201228088A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010593682.3A CN102545816B (en) 2010-12-17 2010-12-17 Multi-channel radiofrequency filter for electrostatic chuck

Publications (2)

Publication Number Publication Date
TW201228088A TW201228088A (en) 2012-07-01
TWI491100B true TWI491100B (en) 2015-07-01

Family

ID=46351904

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100139750A TW201228088A (en) 2010-12-17 2011-11-01 Multi-channel radio-frequency filter for electrostatic sucking disk

Country Status (2)

Country Link
CN (1) CN102545816B (en)
TW (1) TW201228088A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104332378B (en) * 2013-07-22 2016-09-07 中微半导体设备(上海)有限公司 Plasma processing apparatus and temperature testing device thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI286627B (en) * 2003-03-14 2007-09-11 Sharp Kk Substrate bonding apparatus
US20070284344A1 (en) * 2006-06-13 2007-12-13 Todorov Valentin N High ac current high rf power ac-rf decoupling filter for plasma reactor heated electrostatic chuck
US20090133839A1 (en) * 2007-11-14 2009-05-28 Tokyo Electron Limited Plasma processing apparatus
CN101587813A (en) * 2008-05-21 2009-11-25 东京毅力科创株式会社 A loading station mechanism, a plasma processing apparatus and a pressure exertion method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI286627B (en) * 2003-03-14 2007-09-11 Sharp Kk Substrate bonding apparatus
US20070284344A1 (en) * 2006-06-13 2007-12-13 Todorov Valentin N High ac current high rf power ac-rf decoupling filter for plasma reactor heated electrostatic chuck
US20090133839A1 (en) * 2007-11-14 2009-05-28 Tokyo Electron Limited Plasma processing apparatus
CN101587813A (en) * 2008-05-21 2009-11-25 东京毅力科创株式会社 A loading station mechanism, a plasma processing apparatus and a pressure exertion method

Also Published As

Publication number Publication date
TW201228088A (en) 2012-07-01
CN102545816A (en) 2012-07-04
CN102545816B (en) 2015-02-04

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