TWI490581B - Two-piece casing structure of transceiver optical sub-assembly and fabrication method thereof - Google Patents

Two-piece casing structure of transceiver optical sub-assembly and fabrication method thereof Download PDF

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TWI490581B
TWI490581B TW098134716A TW98134716A TWI490581B TW I490581 B TWI490581 B TW I490581B TW 098134716 A TW098134716 A TW 098134716A TW 98134716 A TW98134716 A TW 98134716A TW I490581 B TWI490581 B TW I490581B
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collar
laser
module
base
optical sub
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TW098134716A
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TW201113571A (en
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Ta Tsung Lin
Tzong Yow Ho
Yun Cheng Yu
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Truelight Corp
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光學次模組之兩件式殼體結構及組裝方法Two-piece housing structure and assembly method of optical sub-module

本發明係為一種光學次模組之兩件式殼體結構及其組裝方法,尤指一種可在三維方向上調整雷射功能元件之光學焦距的一種光學次模組之兩件式殼體結構及其組裝方法。The invention relates to a two-piece housing structure of an optical sub-module and an assembly method thereof, in particular to a two-piece housing structure of an optical sub-module capable of adjusting the optical focal length of a laser functional component in three dimensions. And its assembly method.

按,在光電通訊領域中所稱之光學次模組(OSA,Transceiver Optical Sub-Assembly),可隨功能元件之不同而大致被區分為發射器光學次模組TOSA(Transmitter Optical Sub-Assembly)及接收器光學次模組ROSA(Receiver Optical Sub-Assembly)兩種。其中,TOSA乃是提供自功能元件到光纖之光路徑,例如從半導體雷射元件到光纖、或是從發光二極體元件到光纖,使電訊號(Electrical Signal)得以轉換成光並經過透鏡而聚焦在光纖內再傳輸。至於ROSA則是提供由光纖到光檢測器之光路徑,使來自光纖的光被聚焦於接收器上並轉換成電訊號。此外,也有將TOSA與ROSA兩者合而為一的雙向式(Bi-Directional)或雙工式(Duplex)的光學次模組。無論是TOSA、ROSA或是雙向式的光學次模組,其大體上均是由一殼體與一功能元件相結合所構成。功能元件提供了雷射光源或是光接收器之功能,而殼體則是提供了與外界之光纖(或光纖接頭)相結合並使光纖和功能元件進行光線訊號耦合的結構。由於目前業界於光學次模組的設計製作上,因功能元件封裝精度所衍生的焦距及發射角問題,使得實際生產過程中需要進行殼體與功能元件之間的對焦調整工作。所以,於業界便有開發出具有兩件式殼體之光學次模組的設計,藉由將殼體拆成兩個可相互水平位移來調整相對位置的元件,以便能進行光學次模組的對焦調整工作。According to the optical sub-module (OSA), the optical sub-module (OSA) can be roughly classified into a Transmitter Optical Sub-Assembly and a Transmitter Optical Sub-Assembly. Receiver optical sub-module ROSA (Receiver Optical Sub-Assembly). Among them, TOSA is to provide optical paths from functional components to optical fibers, such as from semiconductor laser components to optical fibers, or from light-emitting diode components to optical fibers, so that electrical signals can be converted into light and passed through the lens. Focus on retransmission within the fiber. As for ROSA, the optical path from the fiber to the photodetector is provided so that the light from the fiber is focused on the receiver and converted into an electrical signal. In addition, there are also bidirectional (Bi-Directional) or duplex (Duplex) optical sub-modules that combine TOSA and ROSA. Whether it is a TOSA, ROSA or a two-way optical sub-module, it is generally composed of a casing and a functional component. The functional element provides the function of a laser light source or a light receiver, and the housing provides a structure that combines with an external fiber (or fiber connector) and couples the fiber and the functional element to light signals. Due to the current design and production of optical sub-modules in the industry, the focus and emission angle problems caused by the packaging precision of functional components make the focus adjustment between the housing and the functional components in the actual production process. Therefore, in the industry, an optical sub-module having a two-piece housing has been developed, and the optical sub-module can be adjusted by disassembling the housing into two elements that can be horizontally displaced from each other to adjust the relative position. Focus adjustment work.

如圖一所示,為一習用具有兩件式殼體之光學次模組的剖面示意圖。該光學次模組10包括有一雷射功能元件11及一殼體12,而殼體12又是由一光纖固定座121與一功能元件固定座122所組合構成。該雷射功能元件11可以是如前述之雷射光源、光接收器或是雙向(雙工)的功能元件,其大體上包括了:一基座111、一封蓋112結合於該基座111之第一表面1111上、至少一功能晶片113設置於基座111之該第一表面1111上且位於封蓋112內、一透鏡114設置於封蓋112上且和功能晶片113相對應、以及若干訊號接腳115自該基座111之第二表面1112延伸出。該功能元件固定座122是一中空套環,其套設並固定於雷射功能元件11之基座111上,提供了與雷射功能元件11相結合之介面。於該光纖固定座121上設有一軸向之光纖插孔1211,可供外界之一光纖(或光纖接頭,圖中未示)所插置而提供了與光纖(或光纖接頭)相結合之介面。As shown in FIG. 1 , it is a schematic cross-sectional view of an optical sub-module having a two-piece housing. The optical sub-module 10 includes a laser function component 11 and a housing 12, and the housing 12 is further composed of a fiber holder 121 and a functional component holder 122. The laser function element 11 can be a laser light source, a light receiver or a bidirectional (duplex) functional element as described above, which generally includes a base 111 and a cover 112 coupled to the base 111. On the first surface 1111, at least one functional wafer 113 is disposed on the first surface 1111 of the pedestal 111 and located in the cover 112. A lens 114 is disposed on the cover 112 and corresponds to the functional wafer 113, and a plurality of The signal pin 115 extends from the second surface 1112 of the base 111. The functional component mount 122 is a hollow collar that is sleeved and secured to the base 111 of the laser functional component 11 to provide an interface in combination with the laser functional component 11. An optical fiber socket 1211 is disposed on the fiber holder 121, and an optical fiber (or a fiber connector, not shown) is inserted into the optical fiber to provide an interface with the optical fiber (or fiber connector). .

在習用技術中,功能元件固定座122一般是以電器抵抗熔接(Electric Resistance Welding;簡稱ERW)的方式焊接於基座111上。並且,功能元件固定座122之中空套環的內徑大致等於封蓋112的外徑,所以一旦套合於封蓋112上時,其位置即被固定住無法調整。該光纖固定座121則是接觸於功能元件固定座122之上表面1221,並且可在垂直於光軸13方向之一平面上(也就是功能元件固定座之上表面1221)進行二維方向的位移調整動作,之後再以雷射焊接(Laser Welding)的方式將兩者固定。顯然地,此種二維方向的位移因缺乏在光軸13方向上的位移調整,故無法滿足對焦調整的需求。因此,在習用技術中,製造廠商必須準備多個不同尺寸(尤其是在光軸13方向上具有不同長度)的光纖固定座121。然後,針對不同雷射功能元件11的不同對焦需求,來選用不同規格尺寸的光纖固定座121來組合搭配功能元件固定座122。此種組裝方法不僅增加了生產管理、物料準備、及組裝製程上的複雜性與難度,更拖累了生產效能且間接提高生產成本,而有待進一步改善。In the conventional technology, the functional component fixing base 122 is generally welded to the base 111 by means of an electrical resistance welding (ERW). Moreover, the inner diameter of the hollow collar of the functional component mount 122 is substantially equal to the outer diameter of the cover 112, so that once it is fitted over the cover 112, its position is fixed and cannot be adjusted. The fiber holder 121 is in contact with the upper surface 1221 of the functional component holder 122 and can be displaced in a two-dimensional direction on a plane perpendicular to the direction of the optical axis 13 (that is, the upper surface 1221 of the functional component holder). Adjust the movement and then fix the two by laser welding. Obviously, such a displacement in the two-dimensional direction cannot be satisfied by the need for focus adjustment due to the lack of displacement adjustment in the direction of the optical axis 13. Therefore, in the conventional art, the manufacturer must prepare a plurality of fiber holders 121 of different sizes (especially having different lengths in the direction of the optical axis 13). Then, for different focusing requirements of different laser functional components 11, fiber optic mounts 121 of different sizes are used to combine and match the functional component mounts 122. This assembly method not only increases the complexity and difficulty of production management, material preparation, and assembly process, but also drags down production efficiency and indirectly increases production costs, and needs further improvement.

本發明的主要目的係在於提供一種光學次模組之兩件式殼體結構及其組裝方法,其可在三維方向上調整雷射功能元件與光纖之間的對焦工作,故能簡化生產管理、物料準備、及組裝製程,進而可提高生產效能與降低生產成本。The main object of the present invention is to provide a two-piece housing structure of an optical sub-module and an assembly method thereof, which can adjust the focusing work between the laser function component and the optical fiber in a three-dimensional direction, thereby simplifying production management, Material preparation and assembly processes, which in turn increase production efficiency and reduce production costs.

為達上述之目的,本發明在於提供一種光學次模組之兩件式殼體結構,可用於結合一雷射功能元件及一光纖,其包括有:一光纖固定座及一功能元件固定座。該光纖固定座具有一軸向之中心穿孔;於中心穿孔之一端設有一光纖插孔、另一端則設有一第一套環。該功能元件固定座具有一第二套環,其一端係與該第一套環以可相互位移之方式套合,且可沿該軸向進行線性位移。該第二套環之另一端係接觸於該雷射功能元件之一基座的表面上且可進行垂直於該軸向之二維方向的位移。藉此,光學次模組於組裝時可進行三維方向上的對焦工作,故能簡化生產管理、物料準備、及組裝製程,且可提高生產效能與降低生產成本。In order to achieve the above object, the present invention provides a two-piece housing structure for an optical sub-module, which can be used to combine a laser function component and an optical fiber, and includes: a fiber holder and a functional component holder. The fiber holder has an axial center through hole; a fiber insertion hole is disposed at one end of the center hole, and a first ring is disposed at the other end. The functional component holder has a second collar, and one end of the functional component holder is sleeved with the first collar in a mutually displaceable manner and linearly displaceable along the axial direction. The other end of the second collar is in contact with the surface of one of the bases of the laser functional element and is displaceable in a two-dimensional direction perpendicular to the axial direction. Thereby, the optical sub-module can perform focusing work in a three-dimensional direction during assembly, thereby simplifying production management, material preparation, and assembly processes, and improving production efficiency and reducing production cost.

較佳者,該雷射功能元件更包括有:一封蓋結合於該基座之第一表面上、至少一功能晶片設置於基座之該第一表面上且位於封蓋內、一透鏡設置於封蓋上且和功能晶片相對應、以及若干訊號接腳自該基座之第二表面延伸出。Preferably, the laser function further comprises: a cover coupled to the first surface of the base, at least one functional wafer disposed on the first surface of the base and located within the cover, a lens setting On the cover and corresponding to the functional wafer, and a plurality of signal pins extending from the second surface of the base.

較佳者,該功能晶片至少包括以下其中之一:半導體雷射晶片、光檢測晶片。Preferably, the functional wafer comprises at least one of the following: a semiconductor laser wafer, a photodetection wafer.

較佳者,該第一套環與第二套環兩者之中具有較小內徑者,其內徑係比該封蓋之外徑大70-200μm。Preferably, the first collar and the second collar have a smaller inner diameter, and the inner diameter is 70-200 μm larger than the outer diameter of the cover.

較佳者,該第一套環係套合於該第二套環之一外緣,且該第一套環之厚度係小於0.3mm。Preferably, the first collar is sleeved on an outer edge of the second collar, and the thickness of the first collar is less than 0.3 mm.

較佳者,於該第二套環較接近第一套環之端的一外緣係設有一斜角,使第二套環鄰近第一套環之端係具有相對較小之外徑。Preferably, an outer edge of the second collar closer to the end of the first collar is provided with an oblique angle such that the end of the second collar adjacent to the first collar has a relatively smaller outer diameter.

較佳者,於該第二套環鄰近基座之端的一內緣係設有一環狀凹圈,使第二套環鄰近基座之該端係具有相對較小之厚度。Preferably, an annular recess is provided on an inner edge of the second collar adjacent to the end of the base such that the end of the second collar adjacent to the base has a relatively small thickness.

較佳者,該第一套環在與該第二套環相套合狀態下所進行之該軸向位移調整的距離為150-400μm。Preferably, the axial displacement of the first collar in the state of being engaged with the second collar is adjusted to a distance of 150-400 μm.

為達上述之目的,本發明並揭露了一種光學次模組之組裝方法,包括了下列步驟:首先,提供一雷射功能元件、一光纖固定座、與一功能元件固定座。該光纖固定座具有一軸向之中心穿孔,於中心穿孔之一端設有一光纖插孔以供容置外界之一光纖,於中心穿孔之另一端則設有中空之一第一套環。該功能元件固定座具有中空之一第二套環。該第二套環於該軸向上之一端係與該第一套環套合。然後將整組光學次模組連接一測試機台以測試其對焦狀況。To achieve the above object, the present invention also discloses an assembly method of an optical sub-module, comprising the following steps: First, a laser function component, a fiber holder, and a functional component holder are provided. The fiber holder has an axial center through hole, and one fiber insertion hole is disposed at one end of the center hole for receiving one of the outer fibers, and the other end of the center hole is provided with a hollow first ring. The functional component mount has a hollow second collar. The second collar is engaged with the first collar at one end of the axial direction. The entire set of optical sub-modules is then connected to a test machine to test its focus.

接著,將該第二套環於該軸向上之另一端接觸於該雷射功能元件之一基座表面上,並使第二套環進行垂直於該軸向之二維的位移調整(亦即調整發射角),直到發射角調整準確後,以雷射焊接的方式焊接第二套環與基座表面之接觸面處。Then, the other end of the second collar on the axial direction is in contact with the surface of one of the laser functional elements, and the second collar is subjected to two-dimensional displacement adjustment perpendicular to the axial direction (ie, Adjust the launch angle) until the adjustment of the launch angle is accurate, and weld the contact surface of the second collar to the surface of the base by laser welding.

之後,將該第一套環進行沿該軸向之線性位移調整(亦即調整焦距),直到準確對焦後,以雷射焊接的方式焊接第一套環與第二套環之接觸面處。如此,便完成本發明之光學次模組的組裝工作。Thereafter, the first collar is linearly displaced along the axial direction (ie, the focal length is adjusted) until the contact surface of the first collar and the second collar is welded by laser welding after accurate focusing. Thus, the assembly work of the optical sub-module of the present invention is completed.

為了能更清楚地描述本發明所提出之光學次模組之兩件式殼體結構及其組裝方法,以下將配合圖式詳細說明之。In order to more clearly describe the two-piece housing structure and assembly method of the optical sub-module proposed by the present invention, the following detailed description will be made in conjunction with the drawings.

請參閱圖二所示,為本發明具有兩件式殼體之光學次模組之一實施例的剖面示意圖。該光學次模組20包括有一兩件式的殼體30及一雷射功能元件40,可和外界之一光纖或光纖接頭50相結合以傳輸光線訊號。於本實施例中,該雷射功能元件40可以是一習知的雷射光源、光接收器、或是同時設有雷射光源與光接收器之雙向(雙工)的功能元件,其包括有:一基座41、一封蓋42結合於該基座41之一第一表面411(上表面)上、至少一功能晶片43設置於基座之該第一表面411上且位於封蓋42內、一透鏡44設置於封蓋42上且和功能晶片43相對應、以及若干訊號接腳45自該基座41之一第二表面412(下表面)延伸出。該功能晶片43決定了雷射功能元件40所能執行的功能,其可以是半導體雷射晶片(雷射光源)、光檢測晶片(光接收器)、或是在基座41上同時設置這兩晶片而可提供雙向(雙工)的功能。於本實施例中,該透鏡44是一球狀透鏡,但也可以是其他形式的透鏡,其是用來提供該功能晶片43與光纖50之間所傳輸之光線訊號在光軸60方向上的聚焦工作。Please refer to FIG. 2, which is a cross-sectional view showing an embodiment of an optical sub-module having a two-piece housing according to the present invention. The optical sub-module 20 includes a two-piece housing 30 and a laser function component 40 that can be combined with an external fiber or fiber optic connector 50 to transmit optical signals. In this embodiment, the laser function component 40 can be a conventional laser light source, a light receiver, or a bidirectional (duplex) functional component that simultaneously has a laser light source and a light receiver, including A base 41 and a cover 42 are coupled to the first surface 411 (upper surface) of the base 41. At least one functional wafer 43 is disposed on the first surface 411 of the base and located at the cover 42. A lens 44 is disposed on the cover 42 and corresponds to the functional wafer 43 and a plurality of signal pins 45 extend from the second surface 412 (lower surface) of the base 41. The functional chip 43 determines the functions that the laser function 40 can perform, which can be a semiconductor laser wafer (laser source), a photodetection wafer (light receiver), or both on the susceptor 41. The chip provides bidirectional (duplex) functionality. In this embodiment, the lens 44 is a spherical lens, but may be other types of lenses for providing the optical signal transmitted between the functional wafer 43 and the optical fiber 50 in the direction of the optical axis 60. Focus on work.

該殼體30包括有一光纖固定座31及一功能元件固定座32。該光纖固定座可供外界之一光纖50(或光纖接頭)所插置,而可提供與光纖50(或光纖接頭)相結合之介面。該功能元件固定座32是用來套設並固定於雷射功能元件40上,其提供了與雷射功能元件40相結合之介面。The housing 30 includes a fiber holder 31 and a functional component holder 32. The fiber holder can be inserted into one of the outer fibers 50 (or fiber connectors) to provide an interface with the fiber 50 (or fiber connector). The functional component mount 32 is for nesting and securing to the laser functional component 40, which provides an interface in combination with the laser functional component 40.

於圖二所示之實施例中,該光纖固定座31之外部設有習知的快拆接頭311結構,以供與光纖50(或光纖接頭)快速地相結合及拆離。光纖固定座31的中央具有一軸向之中心穿孔312以供光線訊號通過。於該中心穿孔312之一端(上端)設有一光纖插孔313以供插置光纖50,光纖固定座31的另一端則設有中空之一第一套環314。於本實施例中,該第一套環314之厚度t1係小於0.3mm為較佳,在此種厚度之下,便能以雷射焊接(Laser Welding)的方式將第一套環314與功能元件固定座32相接觸的表面融接而結合固定成一體。In the embodiment shown in FIG. 2, the outer portion of the fiber holder 31 is provided with a conventional quick release joint 311 structure for quick integration and detachment from the optical fiber 50 (or fiber connector). The center of the fiber holder 31 has an axial central opening 312 for the passage of light signals. One end of the central through hole 312 (upper end) is provided with a fiber insertion hole 313 for inserting the optical fiber 50, and the other end of the optical fiber fixing base 31 is provided with a hollow first first ring 314. In this embodiment, the thickness t1 of the first collar 314 is preferably less than 0.3 mm. Under such thickness, the first collar 314 and the function can be performed by laser welding. The surfaces in contact with the component holder 32 are fused to be integrally fixed.

於本實施例中,該功能元件固定座32於外觀上是呈現一中空之第二套環321的結構。該第二套環321於該軸向60上之一端係與該第一套環314以可相互位移之方式套合,使該第一套環314可在保持與第二套環321相套合的狀態下進行沿該軸向60之線性位移調整。並且,該第二套環321於該軸向60上之另一端係以可相互位移之方式接觸於該雷射功能元件40之基座41的第一表面411上,使第二套環321可接觸在該第一表面411上進行垂直於該軸向60之二維方向的位移調整。於本實施例中,該第一套環314的內徑大體上是等於第二套環321的外徑且係套合於該第二套環321之一外緣3211上。並且,於該第二套環321較接近第一套環314之端的該外緣3211處係設有一斜角3212,使第二套環321鄰近第一套環314之端係具有相對較小之外徑;藉由此種結構,可以使第一套環314更容易套合於第二套環321上。此外,於該第二套環321鄰近基座41之端的一內緣係設有一環狀凹圈3213,使第二套環321鄰近基座41之該端係具有相對較小之厚度t2;藉由此種結構,不僅可以避免封蓋42底部外緣421抵觸到第二套環321底部內緣,且亦可使第二套環321鄰近基座41之該端因為厚度t2較薄(以小於0.3mm為較佳)而可藉由雷射焊接(而非傳統ERW)的方式來結合於基座41表面上。如此,本發明於第一套環314與第二套環321之接處面間、以及於第二套環321底端與基座41上表面之接處面間,其兩個位置都是藉由同一道雷射焊接製程來結合,因此相較於需使用兩種不同焊接技術的習知技術來說,本發明更具有製程簡便快速的優點。In the present embodiment, the functional component fixing base 32 is in the appearance of a hollow second collar 321 . One end of the second collar 321 is axially engaged with the first collar 314 so as to be displaceable relative to each other, so that the first collar 314 can be held in engagement with the second collar 321 The linear displacement adjustment along the axial direction 60 is performed. Moreover, the other end of the second collar 321 in the axial direction 60 is in contact with the first surface 411 of the base 41 of the laser function element 40 so that the second collar 321 can be The contact is adjusted on the first surface 411 in a direction perpendicular to the two-dimensional direction of the axial direction 60. In this embodiment, the inner diameter of the first collar 314 is substantially equal to the outer diameter of the second collar 321 and is sleeved on the outer edge 3211 of the second collar 321 . Moreover, an oblique angle 3212 is disposed at the outer edge 3211 of the second collar 321 closer to the end of the first collar 314, so that the end of the second collar 321 adjacent to the first collar 314 has a relatively small The outer diameter; with this configuration, the first collar 314 can be more easily fitted over the second collar 321 . In addition, an annular recess 3213 is disposed on an inner edge of the second collar 321 adjacent to the end of the base 41, so that the second collar 321 has a relatively small thickness t2 adjacent to the end of the base 41; With such a structure, not only the bottom outer edge 421 of the cover 42 can be prevented from coming into contact with the bottom inner edge of the second collar 321 , but also the second collar 321 can be adjacent to the end of the base 41 because the thickness t2 is thin (less than 0.3 mm is preferred and can be bonded to the surface of the base 41 by means of laser welding instead of conventional ERW. Thus, the present invention is between the junction between the first collar 314 and the second collar 321 and between the bottom end of the second collar 321 and the upper surface of the base 41. The invention is combined by the same laser welding process, so that the invention has the advantages of simple and quick process compared to the prior art which requires two different welding techniques.

由於目前對於功能元件43之封裝精度的技術限制,導致其發射或接收光線訊號的焦距及發射角之公差範圍分別大概落在150-400μm以及70-200μm之範圍區間;因此,本發明之該第一套環314在與該第二套環321相套合狀態下所進行之該軸向60位移調整的距離d1也是落在150-400μm範圍內;同時,該第一套環314與第二套環321兩者之中具有較小內徑者(於本實施例中是第二套環321),其內徑係比該封蓋42之外徑大70-200μm(如圖二中之編號t2)。如此,第一套環314便可在第二套環321上於150-400μm範圍內進行軸向位移的焦距調整工作;而第二套環321亦可在基座41上表面上於150-400μm範圍內進行垂直於該軸向之二維方向的位移以調整發射角。如此一來,本發明之光學次模組20在組裝過程中便可進行三維方向的對焦調整工作,不再需要像習用技術般需更換不同尺寸的固定座,因此確實能能簡化生產管理、物料準備、及組裝製程,進而可提高生產效能與降低生產成本依據如圖二所示之本發明光學次模組20之兩件式殼體30結構,其組裝方法之一較佳實施例係包括有下列步驟:首先,提供一雷射功能元件40、一光纖固定座31、與一功能元件固定座32。該雷射功能元件40包括有:一基座41、一封蓋42結合於該基座41之一第一表面411上、至少一功能晶片43設置於基座41之該第一表面411上且位於封蓋42內、一透鏡44設置於封蓋42上且和功能晶片43相對應、以及若干訊號接腳45自該基座41之第二表面412延伸出。該光學次模組20之兩件式殼體30結構包括有:一光纖固定座31以及一功能元件固定座32。該光纖固定座31具有一軸向之中心穿孔312以供一光線通過。於中心穿孔312之一端設有一光纖插孔313以供容置外界之一光纖50,於中心穿孔312之另一端則設有中空之一第一套環314。該功能元件固定座32具有中空之一第二套環321。該第二套環321於該軸向60上之一端係與該第一套環314以可相互位移之方式套合。然後將整組光學次模組20連接一習知的測試機台(圖中未示),以測試其對焦狀況。Due to the current technical limitations on the packaging accuracy of the functional component 43, the focal length and the emission angle tolerance range of the transmitted or received optical signal are respectively in the range of 150-400 μm and 70-200 μm; therefore, the present invention The distance d1 of the axial 60 displacement adjustment performed by the sleeve 314 in the state of being engaged with the second collar 321 is also in the range of 150-400 μm; meanwhile, the first collar 314 and the second sleeve The ring 321 has a smaller inner diameter (in the present embodiment, the second collar 321), and the inner diameter thereof is 70-200 μm larger than the outer diameter of the cover 42 (the number t2 in FIG. 2). ). In this way, the first collar 314 can perform the axial adjustment of the focal length adjustment on the second collar 321 in the range of 150-400 μm; and the second collar 321 can also be on the upper surface of the base 41 at 150-400 μm. A displacement perpendicular to the two-dimensional direction of the axial direction is performed within the range to adjust the emission angle. In this way, the optical sub-module 20 of the present invention can perform the three-dimensional focus adjustment work during the assembly process, and it is no longer necessary to replace the fixed-size fixing seats like the conventional technology, so that the production management and materials can be simplified. Preparation and assembly process, thereby improving production efficiency and reducing production cost. According to the two-piece housing 30 structure of the optical sub-module 20 of the present invention as shown in FIG. 2, a preferred embodiment of the assembly method includes The following steps: First, a laser function component 40, a fiber holder 31, and a functional component holder 32 are provided. The laser function 40 includes a base 41 and a cover 42 coupled to the first surface 411 of the base 41. At least one functional wafer 43 is disposed on the first surface 411 of the base 41. Located within the cover 42, a lens 44 is disposed on the cover 42 and corresponds to the functional wafer 43, and a plurality of signal pins 45 extend from the second surface 412 of the base 41. The two-piece housing 30 of the optical sub-module 20 includes a fiber holder 31 and a functional component holder 32. The fiber holder 31 has an axial central opening 312 for a light to pass through. One end of the central through hole 312 is provided with a fiber insertion hole 313 for accommodating one of the outer fibers 50, and the other end of the central through hole 312 is provided with a hollow first ring 314. The functional component mount 32 has a hollow second collar 321 . The second collar 321 is engaged with the first collar 314 in a mutually displaceable manner at one end of the axial direction 60. The entire set of optical sub-modules 20 is then coupled to a conventional test machine (not shown) to test its focus condition.

接著,將該第二套環321於該軸向60上之另一端接觸於該雷射功能元件40之基座41的第一表面411上,並使第二套環321在該第一表面411上進行垂直於該軸向60之二維的位移調整(亦即調整發射角),直到該光纖50、透鏡44及功能晶片43係準確座落於該軸向60上後,以雷射焊接的方式焊接第二套環321與第一表面411之接觸面處,以固定第二套環321與雷射功能元件40之相對位置。Then, the other end of the second collar 321 on the axial direction 60 is in contact with the first surface 411 of the base 41 of the laser function element 40, and the second collar 321 is on the first surface 411. Performing a two-dimensional displacement adjustment perpendicular to the axial direction 60 (ie, adjusting the emission angle) until the optical fiber 50, the lens 44, and the functional wafer 43 are accurately seated on the axial direction 60, and are laser welded. The second contact ring 321 is welded to the contact surface of the first surface 411 to fix the relative position of the second collar 321 and the laser functional element 40.

之後,將該第一套環314保持與第二套環321相套合的狀態下進行沿該軸向60之線性位移調整(亦即調整焦距),直到該光纖50、透鏡44及功能晶片43的相對位置係可供該光線準確對焦後,以雷射焊接的方式焊接第一套環314與第二套環321之接觸面處,以固定第一套環314與第二套環321之相對位置。Thereafter, the linear displacement adjustment (ie, adjusting the focal length) along the axial direction 60 is performed while the first collar 314 is held in engagement with the second collar 321 until the optical fiber 50, the lens 44, and the functional wafer 43 are The relative position is such that after the light is accurately focused, the contact surface of the first collar 314 and the second collar 321 is welded by laser welding to fix the first collar 314 and the second collar 321 position.

唯以上所述之實施例不應用於限制本發明之可應用範圍,本發明之保護範圍應以本發明之申請專利範圍內容所界定技術精神及其均等變化所含括之範圍為主者。即大凡依本發明申請專利範圍所做之均等變化及修飾,仍將不失本發明之要義所在,亦不脫離本發明之精神和範圍,故都應視為本發明的進一步實施狀況。The above-mentioned embodiments are not intended to limit the scope of application of the present invention, and the scope of the present invention should be based on the technical spirit defined by the content of the patent application scope of the present invention and the scope thereof. It is to be understood that the scope of the present invention is not limited by the spirit and scope of the present invention, and should be considered as a further embodiment of the present invention.

10...光學次模組10. . . Optical submodule

11...雷射功能元件11. . . Laser function

111...基座111. . . Pedestal

1111...第一表面1111. . . First surface

1112...第二表面1112. . . Second surface

112...封蓋112. . . Cover

113...功能晶片113. . . Functional chip

114...透鏡114. . . lens

115...訊號接腳115. . . Signal pin

12...殼體12. . . case

121...光纖固定座121. . . Fiber optic mount

1211...光纖插孔1211. . . Fiber optic jack

122...功能元件固定座122. . . Functional component mount

1221...上表面1221. . . Upper surface

13...光軸13. . . Optical axis

20...光學次模組20. . . Optical submodule

30...兩件式的殼體30. . . Two-piece housing

31...光纖固定座31. . . Fiber optic mount

311...快拆接頭311. . . Quick release joint

312...中心穿孔312. . . Center perforation

313...光纖插孔313. . . Fiber optic jack

314...第一套環314. . . First set of rings

32...功能元件固定座32. . . Functional component mount

321...第二套環321. . . Second ring

3211...外緣3211. . . Outer edge

3212...斜角3212. . . bevel

3213...環狀凹圈3213. . . Annular groove

40...雷射功能元件40. . . Laser function

41...基座41. . . Pedestal

411...第一表面411. . . First surface

412...第二表面412. . . Second surface

42...封蓋42. . . Cover

421...外緣421. . . Outer edge

43...功能晶片43. . . Functional chip

44...透鏡44. . . lens

45...訊號接腳45. . . Signal pin

50...光纖(或光纖接頭)50. . . Fiber (or fiber connector)

60...光軸60. . . Optical axis

圖一為一習用具有兩件式殼體之光學次模組的剖面示意圖。Figure 1 is a schematic cross-sectional view of an optical sub-module having a two-piece housing.

圖二為本發明具有兩件式殼體之光學次模組之一實施例的剖面示意圖。2 is a cross-sectional view showing an embodiment of an optical sub-module having a two-piece housing according to the present invention.

20...光學次模組20. . . Optical submodule

30...兩件式的殼體30. . . Two-piece housing

31...光纖固定座31. . . Fiber optic mount

311...快拆接頭311. . . Quick release joint

312...中心穿孔312. . . Center perforation

313...光纖插孔313. . . Fiber optic jack

314...第一套環314. . . First set of rings

32...功能元件固定座32. . . Functional component mount

321...第二套環321. . . Second ring

3211...外緣3211. . . Outer edge

3212...斜角3212. . . bevel

3213...環狀凹圈3213. . . Annular groove

40...雷射功能元件40. . . Laser function

41...基座41. . . Pedestal

411...第一表面411. . . First surface

412...第二表面412. . . Second surface

42...封蓋42. . . Cover

421...外緣421. . . Outer edge

42...功能晶片42. . . Functional chip

44...透鏡44. . . lens

45...訊號接腳45. . . Signal pin

50...光纖(或光纖接頭)50. . . Fiber (or fiber connector)

60...光軸60. . . Optical axis

Claims (25)

一種光學次模組之兩件式殼體結構,可用於結合一雷射功能元件及一光纖;該雷射功能元件包括有一基座,該基座具有一第一表面及一第二表面;該兩件式殼體結構包括有:一光纖固定座,其具有一軸向之中心穿孔以供一光線通過;於該中心穿孔之一端設有一光纖插孔、另一端則設有中空之一第一套環;以及一功能元件固定座,其具有中空之一第二套環;該第二套環於該軸向上之一端係與該第一套環以可相互位移之方式套合,使該第一套環可在保持與第二套環相套合的狀態下進行沿該軸向之線性位移調整;並且,該第二套環於該軸向上之另一端係以可相互位移之方式接觸於該雷射功能元件之基座的第一表面上,使第二套環可接觸在該第一表面上進行垂直於該軸向之二維的位移調整;其中,當該第二套環與該第一套環以相互位移之方式套合線性位移調整完成後,予以固定;其中,當該第二套環於該軸向上之另一端係以相互位移之方式接觸於該雷射功能元件之基座的第一表面上之該垂直於該軸向之二維位移調整完成後,予以固定。 An optical sub-module two-piece housing structure for combining a laser functional component and an optical fiber; the laser functional component includes a base having a first surface and a second surface; The two-piece housing structure comprises: a fiber holder having an axial central opening for a light to pass through; a fiber insertion hole at one end of the central hole and a hollow first at the other end a collar; and a functional component holder having a hollow second collar; the second collar is nested at one end of the second collar and the first collar in a mutually displaceable manner, such that the first collar a set of rings can be linearly displaced along the axial direction while being held in engagement with the second set of rings; and the other end of the second set of rings in the axial direction is in contact with each other in a mutually displaceable manner a first surface of the base of the laser functional element, the second collar being contactable on the first surface for two-dimensional displacement adjustment perpendicular to the axial direction; wherein, when the second collar is The first set of rings is linearly displaced by mutual displacement After being completed, fixing is performed; wherein, when the other end of the second collar is displaced from each other in the axial direction, the first surface of the base of the laser function element is perpendicular to the axial direction. After the two-dimensional displacement adjustment is completed, it is fixed. 如申請專利範圍第1項所述之光學次模組之兩件式殼體結構,其中,該雷射功能元件更包括有:一封蓋結合於該基座之第一表面上、至少一功能晶片設置於基座之 該第一表面上且位於封蓋內、一透鏡設置於封蓋上且和功能晶片相對應、以及若干訊號接腳自該基座之第二表面延伸出。 The two-piece housing structure of the optical sub-module of claim 1, wherein the laser function component further comprises: a cover coupled to the first surface of the base, at least one function The wafer is placed on the pedestal The first surface is located in the cover, a lens is disposed on the cover and corresponds to the functional wafer, and a plurality of signal pins extend from the second surface of the base. 如申請專利範圍第2項所述之光學次模組之兩件式殼體結構,其中,該功能晶片至少包括以下其中之一:半導體雷射晶片、光檢測晶片。 The two-piece housing structure of the optical sub-module of claim 2, wherein the functional wafer comprises at least one of the following: a semiconductor laser wafer, a photodetecting wafer. 如申請專利範圍第2項所述之光學次模組之兩件式殼體結構,其中,該第一套環與第二套環兩者之中具有較小內徑者,其內徑係比該封蓋之外徑大70-200μm。 The two-piece housing structure of the optical sub-module of claim 2, wherein the first collar and the second collar have a smaller inner diameter, and the inner diameter ratio is The outer diameter of the cover is 70-200 μm. 如申請專利範圍第1項所述之光學次模組之兩件式殼體結構,其中,該第一套環係套合於該第二套環之一外緣;並且,固定該第二套環與雷射功能元件之基座、以及固定該第一套環與第二套環的方式是雷射焊接(Laser Welding)。 The two-piece housing structure of the optical sub-module of claim 1, wherein the first collar is sleeved on an outer edge of the second collar; and the second sleeve is fixed The base of the ring and the laser function element, and the way of fixing the first and second sets of rings are laser welding. 如申請專利範圍第5項所述之光學次模組之兩件式殼體結構,其中,該第一套環之厚度係小於0.3mm。 The two-piece housing structure of the optical sub-module of claim 5, wherein the first collar has a thickness of less than 0.3 mm. 如申請專利範圍第5項所述之光學次模組之兩件式殼體結構,其中,於該第二套環較接近第一套環之端的一外緣係設有一斜角,使第二套環鄰近第一套環之端係具有相對較小之外徑。 The two-piece housing structure of the optical sub-module of claim 5, wherein an outer edge of the second collar closer to the end of the first collar is provided with an oblique angle, so that the second The end of the collar adjacent the first loop has a relatively small outer diameter. 如申請專利範圍第5項所述之光學次模組之兩件式殼體結構,其中,於該第二套環鄰近基座之端的一內緣係設有一環狀凹圈,使第二套環鄰近基座之該端係具有相對較小之厚度。 The two-piece housing structure of the optical sub-module of claim 5, wherein an inner ring of the second collar adjacent to the end of the base is provided with an annular recess for the second sleeve The end of the ring adjacent the pedestal has a relatively small thickness. 如申請專利範圍第1項所述之光學次模組之兩件式殼 體結構法,其中,該第一套環在與該第二套環相套合狀態下所進行之該軸向位移調整的距離為150-400μm。 The two-piece shell of the optical sub-module as described in claim 1 The body structure method, wherein the axial displacement of the first collar in the state of being engaged with the second collar is adjusted by a distance of 150-400 μm. 一種光學次模組之組裝方法,包括有下列步驟:提供一雷射功能元件、一光纖固定座、與一功能元件固定座,該雷射功能元件包括有:一基座、一封蓋結合於該基座之一第一表面上、至少一功能晶片設置於基座之該第一表面上且位於封蓋內、一透鏡設置於封蓋上且和功能晶片相對應、以及若干訊號接腳自該基座之一第二表面延伸出;該光學次模組結構包括有:一光纖固定座以及一功能元件固定座;該光纖固定座具有一軸向之中心穿孔以供一光線通過,於中心穿孔之一端設有一光纖插孔,於中心穿孔之另一端則設有中空之一第一套環;該功能元件固定座具有中空之一第二套環;該第二套環於該軸向上之一端係與該第一套環以可相互位移之方式套合;將該第二套環於該軸向上之另一端接觸於該雷射功能元件之基座的第一表面上,並使第二套環在該第一表面上進行垂直於該軸向之二維的位移調整,直到透鏡及功能晶片係座落於該軸向上後,固定第二套環與雷射功能元件之相對位置;以及,將該第一套環保持與第二套環相套合的狀態下進行沿該軸向之線性位移調整,直到該透鏡及功能晶片的相對位置係可供該光線對焦後,固定第一套環與第二套環之相對位置。 An optical sub-module assembly method includes the following steps: providing a laser functional component, a fiber optic mount, and a functional component mount, the laser functional component comprising: a base and a cover coupled to On a first surface of the base, at least one functional wafer is disposed on the first surface of the base and located in the cover, a lens is disposed on the cover and corresponds to the functional wafer, and the plurality of signal pins are self-aligned a second surface of the base extends; the optical sub-module structure includes: a fiber holder and a functional component holder; the fiber holder has an axial center hole for a light to pass through, at the center One end of the perforation is provided with a fiber insertion hole, and at the other end of the central perforation, a hollow first sleeve is provided; the functional component fixing seat has a hollow second collar; the second collar is in the axial direction One end is sleeved with the first collar in a mutually displaceable manner; the other end of the second collar is in contact with the first surface of the base of the laser function element, and the second The collar is at the first Performing a two-dimensional displacement adjustment perpendicular to the axial direction on the surface until the lens and the functional wafer system are seated in the axial direction, fixing the relative position of the second collar and the laser functional element; and, the first set The linear displacement adjustment along the axial direction is maintained while the ring is held in engagement with the second collar, until the relative positions of the lens and the functional wafer are used to focus the light, and the first collar and the second collar are fixed. Relative position. 如申請專利範圍第10項所述之組裝方法,其中,固定該第二套環與雷射功能元件、以及固定該第一套環與第二套環的方式是雷射焊接(Laser Welding)。 The assembly method of claim 10, wherein the fixing of the second collar and the laser function element and the fixing of the first collar and the second collar are laser welding. 如申請專利範圍第10項所述之組裝方法,其中,該功能晶片至少包括以下其中之一:半導體雷射晶片、光檢測晶片。 The assembly method of claim 10, wherein the functional wafer comprises at least one of the following: a semiconductor laser wafer, a photodetection wafer. 如申請專利範圍第10項所述之組裝方法,其中,該第一套環與第二套環兩者之中具有較小內徑者,其內徑係比該封蓋之外徑大70-200μm。 The assembly method of claim 10, wherein the first collar and the second collar have a smaller inner diameter, and the inner diameter is larger than the outer diameter of the cover 70- 200 μm. 如申請專利範圍第10項所述之組裝方法,其中,該第一套環係套合於該第二套環之一外緣。 The assembly method of claim 10, wherein the first loop is sleeved on an outer edge of one of the second loops. 如申請專利範圍第14項所述之組裝方法,其中,該第一套環之厚度係小於0.3mm。 The assembly method of claim 14, wherein the first collar has a thickness of less than 0.3 mm. 如申請專利範圍第14項所述之組裝方法,其中,於該第二套環較接近第一套環之端的一外緣係設有一斜角,使第二套環鄰近第一套環之端係具有相對較小之外徑。 The assembly method of claim 14, wherein an outer edge of the second collar closer to the end of the first collar is provided with an oblique angle so that the second collar is adjacent to the end of the first collar It has a relatively small outer diameter. 如申請專利範圍第14項所述之組裝方法,其中,於該第二套環鄰近基座之端的一內緣係設有一環狀凹圈,使第二套環鄰近基座之該端係具有相對較小之厚度。 The assembly method of claim 14, wherein an annular recess is provided on an inner edge of the second collar adjacent to the end of the base, such that the second collar is adjacent to the end of the base. Relatively small thickness. 如申請專利範圍第10項所述之組裝方法,其中,該第一套環在與該第二套環相套合狀態下所進行之該軸向位移調整的距離為150-400μm。 The assembly method of claim 10, wherein the axial displacement of the first collar in the state of being engaged with the second collar is adjusted to a distance of 150-400 μm. 一種光學次模組之殼體結構,可用於結合一雷射功能 元件與一光纖,該雷射功能元件包括有一封蓋;該光學次模組之殼體結構包括有:一光纖固定座,其具有一軸向之中心穿孔以供一光線通過;於該中心穿孔之一端設有一光纖插孔、另一端則設有中空之一第一套環;以及一功能元件固定座,其具有中空之一第二套環;該第二套環於該軸向上之一端係與該第一套環以可相互位移之方式套合,使該第一套環可在保持與第二套環相套合的狀態下進行沿該軸向之線性位移調整;其中,該第一套環與第二套環兩者之中具有較小內徑者,其內徑係比該雷射功能元件之封蓋的外徑大一預定尺寸;其中,當該第二套環與該第一套環以相互位移之方式套合線性位移調整完成後,予以固定;其中,該雷射功能元件更包括有:該封蓋結合於該基座之一第一表面上、至少一功能晶片設置於基座之該第一表面上且位於封蓋內、一透鏡設置於封蓋上且和功能晶片相對應、以及若干訊號接腳自該基座之一第二表面延伸出;其中,該第二套環於該軸向上之另一端係以可相互位移之方式接觸於該雷射功能元件之基座的第一表面上,使第二套環可接觸在該第一表面上進行垂直於該軸向之二維的位移調整;其中,當該第二套環於該軸向上之另一端係以相互 位移之方式接觸於該雷射功能元件之基座的第一表面上之該垂直於該軸向之二維位移調整完成後,予以固定。 A housing structure of an optical sub-module, which can be used to combine a laser function The component and an optical fiber, the laser functional component includes a cover; the housing structure of the optical sub-module includes: a fiber holder having an axial central through hole for a light to pass through; One end is provided with a fiber insertion hole, and the other end is provided with a hollow first sleeve; and a functional component fixing seat has a hollow second collar; the second collar is at one end of the axial direction And the first sleeve is sleeved in a mutually displaceable manner, so that the first sleeve can be linearly displaced along the axial direction while being held in a state of being engaged with the second collar; wherein the first sleeve The inner diameter of the collar and the second collar are smaller than the outer diameter of the cover of the laser function element by a predetermined size; wherein, the second collar and the second The set of rings is fixed in a manner of mutual displacement, and is fixed after the linear displacement adjustment is completed. The laser function component further includes: the cover is coupled to the first surface of the base, and the at least one functional wafer is disposed. On the first surface of the base and in the cover, The lens is disposed on the cover and corresponding to the functional wafer, and the plurality of signal pins extend from the second surface of the base; wherein the other end of the second collar is displaceable from each other in the axial direction Contacting the first surface of the base of the laser functional element such that the second collar is contactable on the first surface for two-dimensional displacement adjustment perpendicular to the axial direction; wherein, when the second set The other end of the ring in the axial direction is mutually The displacement is fixed in contact with the two-dimensional displacement perpendicular to the axial direction on the first surface of the base of the laser functional element. 如申請專利範圍第19項所述之光學次模組之殼體結構,其中,該功能晶片至少包括以下其中之一:半導體雷射晶片、光檢測晶片。 The housing structure of the optical sub-module of claim 19, wherein the functional wafer comprises at least one of the following: a semiconductor laser wafer, a photodetecting wafer. 如申請專利範圍第19項所述之光學次模組之殼體結構,其中,該第一套環與第二套環兩者之中具有較小內徑者,其內徑係比該封蓋之外徑大70-200μm。 The housing structure of the optical sub-module of claim 19, wherein the first collar and the second collar have a smaller inner diameter, and the inner diameter is larger than the cover The outer diameter is 70-200 μm. 如申請專利範圍第19項所述之光學次模組之殼體結構,其中,該第一套環係套合於該第二套環之一外緣;並且,固定該第二套環與雷射功能元件之基座、以及固定該第一套環與第二套環的方式是雷射焊接(Laser Welding)。 The housing structure of the optical sub-module of claim 19, wherein the first collar is sleeved on an outer edge of the second collar; and the second collar and the lightning are fixed The pedestal of the functional element and the manner in which the first and second collars are secured are laser welded. 如申請專利範圍第22項所述之光學次模組之殼體結構,其中,該第一套環之厚度係小於0.3mm。 The housing structure of the optical sub-module of claim 22, wherein the thickness of the first collar is less than 0.3 mm. 如申請專利範圍第22項所述之光學次模組之殼體結構,其中,於該第二套環較接近第一套環之端的一外緣係設有一斜角,使第二套環鄰近第一套環之端係具有相對較小之外徑。 The housing structure of the optical sub-module of claim 22, wherein an outer edge of the second collar closer to the end of the first collar is provided with an oblique angle so that the second collar is adjacent to the second collar. The end of the first set of rings has a relatively small outer diameter. 如申請專利範圍第19項所述之光學次模組之殼體結構,其中,該第一套環在與該第二套環相套合狀態下所進行之該軸向位移調整的距離為150-400μm。The housing structure of the optical sub-module according to claim 19, wherein the distance of the axial displacement adjustment of the first collar in the state of being engaged with the second collar is 150. -400 μm.
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