TWI484553B - - Google Patents
Info
- Publication number
- TWI484553B TWI484553B TW101151232A TW101151232A TWI484553B TW I484553 B TWI484553 B TW I484553B TW 101151232 A TW101151232 A TW 101151232A TW 101151232 A TW101151232 A TW 101151232A TW I484553 B TWI484553 B TW I484553B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210134283.XA CN102646619B (en) | 2012-04-28 | 2012-04-28 | Cavity pressure control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201344784A TW201344784A (en) | 2013-11-01 |
| TWI484553B true TWI484553B (en) | 2015-05-11 |
Family
ID=46659370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101151232A TW201344784A (en) | 2012-04-28 | 2012-12-28 | Cavity pressure control method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102646619B (en) |
| TW (1) | TW201344784A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104991581B (en) * | 2015-06-08 | 2019-08-23 | 北京北方华创微电子装备有限公司 | A kind of compress control method and device of processing chamber |
| CN109712907B (en) * | 2017-10-26 | 2021-05-07 | 北京北方华创微电子装备有限公司 | Chamber pressure stability control system and method and semiconductor processing equipment |
| US11020774B2 (en) * | 2018-02-19 | 2021-06-01 | Tel Manufacturing And Engineering Of America, Inc. | Microelectronic treatment system having treatment spray with controllable beam size |
| CN111831022B (en) * | 2019-04-18 | 2022-03-18 | 北京七星华创流量计有限公司 | Chamber pressure control method and device and semiconductor equipment |
| CN111322984B (en) * | 2020-04-15 | 2023-10-03 | 深圳市创客火科技有限公司 | Altitude calculating method and device, unmanned aerial vehicle and storage medium |
| CN112695297B (en) * | 2020-11-24 | 2022-12-09 | 北京北方华创微电子装备有限公司 | Method for controlling chamber pressure in semiconductor process |
| CN113515095B (en) * | 2021-04-16 | 2024-10-25 | 北京北方华创微电子装备有限公司 | Method for controlling pressure of multiple process chambers and semiconductor process equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101236893A (en) * | 2007-01-31 | 2008-08-06 | 东京毅力科创株式会社 | Substrate processing method and substrate processing device |
| TW201214534A (en) * | 2010-09-29 | 2012-04-01 | Dainippon Screen Mfg | Apparatus for and method of processing substrate |
| TW201214524A (en) * | 2010-03-31 | 2012-04-01 | Tokyo Electron Ltd | Atomic layer deposition of silicon and silicon-containing films |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7854821B2 (en) * | 2005-06-02 | 2010-12-21 | Tokyo Electron Limited | Substrate processing apparatus |
| US7900705B2 (en) * | 2007-03-13 | 2011-03-08 | Schlumberger Technology Corporation | Flow control assembly having a fixed flow control device and an adjustable flow control device |
| CN101378000A (en) * | 2007-08-31 | 2009-03-04 | 中芯国际集成电路制造(上海)有限公司 | Method for improving wafer cavity environment |
-
2012
- 2012-04-28 CN CN201210134283.XA patent/CN102646619B/en active Active
- 2012-12-28 TW TW101151232A patent/TW201344784A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101236893A (en) * | 2007-01-31 | 2008-08-06 | 东京毅力科创株式会社 | Substrate processing method and substrate processing device |
| TW201214524A (en) * | 2010-03-31 | 2012-04-01 | Tokyo Electron Ltd | Atomic layer deposition of silicon and silicon-containing films |
| TW201214534A (en) * | 2010-09-29 | 2012-04-01 | Dainippon Screen Mfg | Apparatus for and method of processing substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201344784A (en) | 2013-11-01 |
| CN102646619B (en) | 2014-12-03 |
| CN102646619A (en) | 2012-08-22 |