TWI478637B - - Google Patents

Info

Publication number
TWI478637B
TWI478637B TW102117349A TW102117349A TWI478637B TW I478637 B TWI478637 B TW I478637B TW 102117349 A TW102117349 A TW 102117349A TW 102117349 A TW102117349 A TW 102117349A TW I478637 B TWI478637 B TW I478637B
Authority
TW
Taiwan
Application number
TW102117349A
Other versions
TW201446087A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW102117349A priority Critical patent/TW201446087A/zh
Publication of TW201446087A publication Critical patent/TW201446087A/zh
Application granted granted Critical
Publication of TWI478637B publication Critical patent/TWI478637B/zh

Links

TW102117349A 2013-05-16 2013-05-16 用於高頻信號的電路板結構 TW201446087A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102117349A TW201446087A (zh) 2013-05-16 2013-05-16 用於高頻信號的電路板結構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102117349A TW201446087A (zh) 2013-05-16 2013-05-16 用於高頻信號的電路板結構

Publications (2)

Publication Number Publication Date
TW201446087A TW201446087A (zh) 2014-12-01
TWI478637B true TWI478637B (zh) 2015-03-21

Family

ID=52707265

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102117349A TW201446087A (zh) 2013-05-16 2013-05-16 用於高頻信號的電路板結構

Country Status (1)

Country Link
TW (1) TW201446087A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI607681B (zh) * 2015-01-23 2017-12-01 欣興電子股份有限公司 線路基板的製作方法
CN112839426B (zh) * 2019-11-25 2024-06-18 蓝胜堃 降低电路板导体信号损失的结构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW544773B (en) * 2001-07-05 2003-08-01 Sumitomo Electric Industries Circuit board, method for manufacturing same, and high-output module
TWI286916B (en) * 2004-10-18 2007-09-11 Via Tech Inc Circuit structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW544773B (en) * 2001-07-05 2003-08-01 Sumitomo Electric Industries Circuit board, method for manufacturing same, and high-output module
TWI286916B (en) * 2004-10-18 2007-09-11 Via Tech Inc Circuit structure

Also Published As

Publication number Publication date
TW201446087A (zh) 2014-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees