TWI475724B - Light emitting unit, manufacturing method thereof and touch panel having the same - Google Patents

Light emitting unit, manufacturing method thereof and touch panel having the same Download PDF

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TWI475724B
TWI475724B TW100128530A TW100128530A TWI475724B TW I475724 B TWI475724 B TW I475724B TW 100128530 A TW100128530 A TW 100128530A TW 100128530 A TW100128530 A TW 100128530A TW I475724 B TWI475724 B TW I475724B
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light
package structure
emitting
top surface
double
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TW201308686A (en
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You-Fa Wang
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Lite On Singapore Pte Ltd
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發光單元、其製造方法及觸控面板Light emitting unit, manufacturing method thereof and touch panel

本發明係有關於一種發光單元、其製造方法及觸控面板,尤指一種具有不對稱發光態樣之發光單元、其製造方法及觸控面板。The present invention relates to a light emitting unit, a manufacturing method thereof, and a touch panel, and more particularly to a light emitting unit having an asymmetric light emitting state, a manufacturing method thereof, and a touch panel.

隨著電子產品的發展,許多類型之輸入裝置目前可用於在電子系統內實行操作,例如按鈕或按鍵、滑鼠、軌跡球、觸控螢幕等等。而近來觸控螢幕的應用越來越普遍,觸控螢幕可包括觸控面板,其可為具有觸敏表面之透明面板,以便作業表面覆蓋於顯示螢幕之可檢視區域。觸控螢幕允許使用者藉由手指或觸控筆觸控顯示螢幕作出選擇並移動游標,並根據觸控事件達成運算動作。而紅外光之近接式感測器(IR proximity sensor)則大量應用於手持式通訊裝置上而構成一種紅外線式觸控面板(IR touch panel),以用於偵測使用者的臉部與顯示螢幕之間的距離,進而達到操作上的控制效果。With the development of electronic products, many types of input devices are currently available for operation within electronic systems, such as buttons or buttons, mice, trackballs, touch screens, and the like. Recently, touch screen applications have become more and more popular. The touch screen may include a touch panel, which may be a transparent panel with a touch-sensitive surface so that the work surface covers the viewable area of the display screen. The touch screen allows the user to select and move the cursor by touching the display screen with a finger or a stylus, and to achieve an operation according to the touch event. Infrared light proximity sensors are widely used in handheld communication devices to form an infrared touch panel for detecting the user's face and display screen. The distance between them to achieve operational control.

紅外線式觸控面板的主要原理是在螢幕前方的四周圍佈滿可發射/接收紅外線光束的發光二極體(LED),排列四周的發光二極體會同時產生紅外線訊號,形成一個整齊交錯的紅外線網,透過操作者之手指接近到螢幕時會遮蔽住紅外線,以進行定位的目的。目前在一般表面黏著(SMT)形式之發光二極體通常在兩個發光方向上通常具有相對稱的發光態樣,例如發光二極體在X軸與Y軸上的可視角度通常相當接近,然而,具有對稱發光態樣之發光二極體並不適用於觸控面板的應用,因觸控面板僅需偵測單一方向的物體,例如操作者的手指僅會由顯示器的前方接近顯示器;但具有對稱發光態樣之發光二極體卻在兩個方向上形成相同的光線,故有可能造成訊號串擾(crosstalk)問題,更造成無法提高觸控面板之感測距離的問題。當觸控面板之感測距離過小時,操作者的手指必須相當接近顯示器才會進行定位,故有靈敏度下降的問題,更可能造成操作者的手指刮傷顯示器造成顯示器壽命降低的問題。The main principle of the infrared touch panel is that the four sides of the front of the screen are covered with light-emitting diodes (LEDs) that can emit/receive infrared beams, and the light-emitting diodes arranged around them simultaneously generate infrared signals to form a neatly interlaced infrared light. The net, when the operator's finger approaches the screen, blocks the infrared rays for positioning purposes. At present, the light-emitting diodes in the general surface adhesion (SMT) form usually have symmetrical illumination states in two directions of illumination. For example, the viewing angles of the LEDs on the X-axis and the Y-axis are usually quite close, however, The illuminating diode having a symmetrical illuminating state is not suitable for the application of the touch panel, because the touch panel only needs to detect an object in a single direction, for example, the operator's finger only approaches the display from the front of the display; The illuminating diode of the symmetrical light-emitting state forms the same light in two directions, which may cause a crosstalk problem, and the problem that the sensing distance of the touch panel cannot be improved. When the sensing distance of the touch panel is too small, the operator's finger must be relatively close to the display to perform positioning, so there is a problem that the sensitivity is lowered, and the operator's finger is scratched to cause the display to have a reduced life.

另外,當具有對稱發光態樣之發光二極體在某一方向上具有大角度的可視角度時,另一方向上同樣具有大角度的可視角度,此亦造成整體的發光亮度低於在應用上所需之亮度。In addition, when the illuminating diode having the symmetrical illuminating state has a large angle of view in a certain direction, the other direction also has a large angle of viewing angle, which also causes the overall illuminating brightness to be lower than that required for the application. Brightness.

本發明之目的之一,在於提供一種發光單元之製造方法,該製造方法利用模造、切割步驟成型具有特定外觀的封裝結構,使封裝結構可控制發光元件之光線在不同發光方向上具有不對稱的態樣,以滿足在觸控面板、觸控螢幕等之特定的需求。One of the objects of the present invention is to provide a method for manufacturing a light-emitting unit, which utilizes a molding and cutting step to form a package structure having a specific appearance, so that the package structure can control the light of the light-emitting element to have an asymmetry in different light-emitting directions. In order to meet the specific needs of touch panels, touch screens, and the like.

本發明實施例係提供一種發光單元之製造方法,包括以下步驟:提供一基板,該基板上包含有複數個電路區域,並將一發光元件分別設置於每一個該電路區域上;成型一封裝結構對應於每一個該電路區域,該封裝結構係包覆該發光元件;以及沿著兩個軸向的切割道進行切割以形成多個單一的發光單元,其中該封裝結構在該兩個軸向上分別經過兩次切割,使該封裝結構具有一個頂面及兩組相對應的側面,該頂面係為一雙次曲面,以形成雙錐形(biconic)透鏡封裝結構;其中,每一個該發光單元在兩個發光方向上具有不對稱的發光態樣。The embodiment of the invention provides a method for manufacturing a light emitting unit, comprising the steps of: providing a substrate, the substrate comprising a plurality of circuit regions, and respectively arranging a light emitting component on each of the circuit regions; forming a package structure Corresponding to each of the circuit regions, the package structure covers the light-emitting elements; and cutting along two axial scribe lines to form a plurality of single light-emitting units, wherein the package structure is respectively separated in the two axial directions After two cuttings, the package structure has a top surface and two corresponding sets of sides, the top surface being a double-curved surface to form a biconic lens package structure; wherein each of the light-emitting units There are asymmetric illumination patterns in both directions of illumination.

本發明實施例係提供一種發光單元,包括:一基板,其上具有電路區域;一發光元件,其係設於該基板上而電性連接於該電路區域;以及一雙錐形透鏡封裝結構,該封裝結構具有一個頂面及兩組相對應的側面,該頂面係為一雙次曲面;其中,該發光單元在兩個發光方向上具有不對稱的發光態樣。An embodiment of the present invention provides a light emitting unit, comprising: a substrate having a circuit region thereon; a light emitting device disposed on the substrate and electrically connected to the circuit region; and a double tapered lens package structure, The package structure has a top surface and two corresponding sets of sides, the top surface being a double-curved surface; wherein the light-emitting unit has an asymmetric light-emitting state in two light-emitting directions.

本發明實施例更一種觸控面板,其至少包括多個發光單元及多個與發光單元對應之接收器,每一該發光單元包括:一基板,其上具有電路區域;一發光元件,其係設於該基板上而電性連接於該電路區域;以及一雙錐形透鏡封裝結構,該封裝結構具有一個頂面及兩組相對應的側面,該頂面係為一雙次曲面;其中,該發光單元在兩個發光方向上具有不對稱的發光態樣。A touch panel includes at least a plurality of light emitting units and a plurality of receivers corresponding to the light emitting units, each of the light emitting units including: a substrate having a circuit region thereon; and a light emitting component a double-conical lens package structure having a top surface and two corresponding sets of side surfaces, wherein the top surface is a double-sided surface; The illumination unit has an asymmetrical illumination pattern in both illumination directions.

本發明具有以下有益的效果:本發明之製造方法的製程簡單,可利用切割方法成型具有特定外觀的封裝結構;而本發明所成型的封裝結構具有不對稱之光學特性,使光線在兩個發光方向上形成不同的發光態樣,而此種不對稱之發光可應用於觸控面板之領域,並有效提高觸控面板之感應(感測)距離,更可使發光強度(intensity)滿足一般使用之需求。The invention has the following beneficial effects: the manufacturing method of the invention has a simple process, and the package structure having a specific appearance can be formed by the cutting method; and the package structure formed by the invention has asymmetric optical characteristics, so that the light is illuminated in two Different illuminating patterns are formed in the direction, and the asymmetric illuminating light can be applied to the field of the touch panel, and the sensing (sensing) distance of the touch panel is effectively improved, and the illuminating intensity (intensity) can be satisfied for general use. Demand.

為使能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

請參閱圖1、圖1A,並配合圖2、圖3,本發明係提供一種發光單元之製造方法,該製造方法係利用切割的方式間接製作出不易以模造等方式成型之雙錐形(biconic)的封裝結構13,換言之,本發明係先以光學模擬軟體規劃出適當的雙錐形透鏡封裝結構13,但由於此結構並無法或較難直接成型,因此本發明就針對這樣的結構提出以下的製造成型方法;而雙錐形透鏡封裝結構13可應用於本發明之發光單元1、觸控面板等應用,使本發明之側向式(side-view)發光單元1在不同發光方向上具有不同的發光態樣。本發明之製造方法至少包括以下步驟:Referring to FIG. 1 and FIG. 1A , and in conjunction with FIG. 2 and FIG. 3 , the present invention provides a method for manufacturing a light emitting unit, which indirectly uses a cutting method to produce a biconical shape that is not easily molded by molding or the like. The package structure 13, in other words, the present invention first plans an appropriate biconical lens package structure 13 with an optical simulation software, but since this structure is not or difficult to directly form, the present invention proposes the following for such a structure. The manufacturing method of the biconical lens package 13 can be applied to the application of the illumination unit 1, the touch panel and the like of the present invention, so that the side-view illumination unit 1 of the present invention has different illumination directions. Different illuminating aspects. The manufacturing method of the present invention includes at least the following steps:

步驟(一):提供一基板11,基板11上包含有複數個電路區域(圖未示),並將發光元件12分別設置於每一個電路區域上。如圖1、圖2所示,在本具體實施例中,該基板11上包含有3乘2個的陣列,而在完成後述之製程後可製作出六個單一的發光單元1(如圖3所示),此僅為說明之用,並非用於限制本發明。而在本實施例中,發光元件12分別安裝於每一個電路區域上,例如固晶、打線等方法。在本具體實施例中,該發光元件12係為發光二極體(LED),上述的發光元件12可利用晶片黏著方法(die attaching)分別固設於每一個電路區域上,並利用打線將發光元件12電性連接於其所對應之該電路區域之電路。Step (1): A substrate 11 is provided. The substrate 11 includes a plurality of circuit regions (not shown), and the light-emitting elements 12 are respectively disposed on each of the circuit regions. As shown in FIG. 1 and FIG. 2, in the specific embodiment, the substrate 11 includes 3 by 2 arrays, and after the process described later, six single light-emitting units 1 can be fabricated (see FIG. 3). This is shown for illustrative purposes only and is not intended to limit the invention. In the present embodiment, the light-emitting elements 12 are respectively mounted on each of the circuit regions, such as a method of solid crystal bonding, wire bonding, and the like. In the embodiment, the light-emitting element 12 is a light-emitting diode (LED), and the light-emitting element 12 can be fixed on each circuit area by die attaching, and the light is emitted by using a wire bonding method. The component 12 is electrically connected to the circuitry of the circuit region to which it corresponds.

步驟(二):成型一封裝結構13′對應於每一個該電路區域,該封裝結構13′係包覆該發光元件12。請復參考圖1,在本具體實施例中,係利用一模具(圖未示)進行模造步驟,以將封裝材料固化成型,進而覆蓋、包覆上述之電路區域及發光元件12。而在本模造步驟中所使用的封裝材料,其可為熱塑性塑料,如主成分可以為聚對苯二醯對苯二胺(PPA)、聚醯胺(PA)等;或者使用熱固性塑料,例如至少包含矽膠或樹脂材料之透明膠。再者,在本實施例中,封裝結構13′可對應於發光元件12而形成凸狀(dome-like)的透鏡狀之封裝結構13′(如圖1A所示),以利發光元件12之光線射出。在本具體實施例中,發光元件12係為一種發出紅外光之發光二極體,而封裝結構13′則為可讓紅外光穿透之封裝材料所製成。凸狀之封裝結構13′的頂面具有一第一頂面區域131及一第二頂面區域132,第一頂面區域131係為一種雙次曲面,第二頂面區域132則不限定其態樣(因第二頂面區域132在後續步驟中會被移除,故其態樣並非本發明所著重的部分),而所述的雙次曲面可廣泛地指任何n維的超曲面,其定義為多元二次方程的解的軌跡,例如橢球面、類球面、球面、橢圓拋物面、雙曲拋物面等等。Step (2): Forming a package structure 13' corresponding to each of the circuit regions, the package structure 13' coating the light-emitting element 12. Referring to FIG. 1 , in the specific embodiment, a molding step is performed by using a mold (not shown) to cure the encapsulating material to cover and cover the circuit region and the light-emitting element 12 . The encapsulating material used in the molding step may be a thermoplastic, such as a main component, which may be polyparaphenylene terephthalamide (PPA), polyamine (PA), or the like; or a thermosetting plastic, such as A clear adhesive containing at least a silicone or resin material. Furthermore, in the present embodiment, the package structure 13' can form a dome-like lenticular package structure 13' (as shown in FIG. 1A) corresponding to the light-emitting element 12, so as to facilitate the light-emitting element 12 Light is shining. In the present embodiment, the light-emitting element 12 is a light-emitting diode that emits infrared light, and the package structure 13' is made of an encapsulating material that allows infrared light to penetrate. The top mask of the convex package structure 13' has a first top surface area 131 and a second top surface area 132. The first top surface area 131 is a bimorphal surface, and the second top surface area 132 is not limited thereto. The aspect (because the second top surface region 132 is removed in a subsequent step, the aspect is not a part of the invention), and the double-surface can be broadly referred to as any n-dimensional hypersurface. It is defined as the trajectory of the solution of a multivariate quadratic equation, such as an ellipsoid, a spherical surface, a spherical surface, an elliptical paraboloid, a hyperbolic paraboloid, and the like.

步驟(三):沿著兩個軸向的切割道進行切割以形成多個單一的發光單元1,更將該封裝結構13′在該兩個軸向上分別經過兩次切割,使切割後之封裝結構13′具有一個頂面131及兩組相對應的側面132A、132B,以形成雙錐形(biconic)透鏡封裝結構13,值得說明的是,經過切割步驟後所成型之頂面131即為所述凸狀之封裝結構13′之第一頂面區域131,故兩者使用相同的標號,且由於切割後成型之頂面131即為封裝結構13′之第一頂面區域131,故頂面131即為雙次曲面的態樣。如圖2所示,待步驟(二)中的封裝材料固化成型該封裝結構13′後,將該模具自該基板11上移除,以進行切割步驟,在此步驟中係利用刀具等切割工具沿著所定義出之切割道進行切割。Step (3): cutting along two axial cutting channels to form a plurality of single light emitting units 1, and further cutting the package structure 13' twice in the two axial directions to make the package after cutting The structure 13' has a top surface 131 and two sets of corresponding side surfaces 132A, 132B to form a biconical lens package structure 13. It is worth noting that the top surface 131 formed after the cutting step is The first top surface area 131 of the convex package structure 13' is used, so the same reference numerals are used for both, and since the top surface 131 after the dicing is the first top surface area 131 of the package structure 13', the top surface 131 is the aspect of the bisurface. As shown in FIG. 2, after the encapsulating material in the step (2) is cured and molded into the encapsulating structure 13', the mold is removed from the substrate 11 to perform a cutting step, in which a cutting tool such as a cutter is used. Cut along the defined scribe line.

值得說明的是,本切割步驟除了將前述的發光陣列切割為多個單一的發光單元1,更可依照發光的需求將封裝結構13′所需的外型、尺寸。舉例來說,設計者可先利用模擬軟體計算該封裝結構在該兩個軸向的切割寬度,以圖2進行說明,該發光陣列之每一封裝結構13′在縱向(以圖示之方向為準)上經過兩次切割,例如藉由SX1、SX2或SX3、SX4兩切割道切割出封裝結構13′在縱向上所需的外型、尺寸;而在橫向(以圖示之方向為準)上經過兩次切割,例如藉由SY1、SY2或SY3、SY4或SY5、SY6等兩切割道切割出封裝結構13′在橫向上所需的外型、尺寸。另外,經過兩個軸向上之兩次切割後,封裝結構13′之第二頂面區域132可被切割移除,以形成雙錐形透鏡封裝結構13,且雙錐形透鏡封裝結構13具有一個與基板11相連接之底面133,該底面133係為矩形等四邊形。It should be noted that, in addition to cutting the foregoing light-emitting array into a plurality of single light-emitting units 1, the cutting step can further select the shape and size of the package structure 13' according to the requirements of the light-emitting. For example, the designer can first calculate the cutting width of the package structure in the two axial directions by using the simulation software, which is illustrated in FIG. 2, and each package structure 13' of the light-emitting array is in the longitudinal direction (in the direction shown) After two cuts, for example, by SX1, SX2 or SX3, SX4 two cutting lines, the required shape and size of the package structure 13' in the longitudinal direction are cut; and in the lateral direction (subject to the direction shown) After two cuts, for example, by SY1, SY2 or SY3, SY4 or SY5, SY6 and the like, the desired shape and size of the package structure 13' in the lateral direction are cut out. In addition, after two cuts in two axial directions, the second top surface region 132 of the package structure 13' can be removed by cutting to form the biconical lens package structure 13, and the biconical lens package structure 13 has one A bottom surface 133 connected to the substrate 11 is a rectangular shape such as a rectangle.

請參考圖3,其為以上述步驟後所完成的單一的發光單元1,其中側面132A(132B)與透鏡狀之頂面131的連接處會形成圓錐曲線等的態樣,故本發明將封裝結構13稱為雙錐形,而頂面131為雙次曲面。另外,藉由雙次曲面之頂面131可將發光元件12所發出之光線以不對稱的方式射出,以達到在第一發光方向上具有較小的可視角度,而在第二發光方向上具有較大的可視角度。本發明經過光學模擬軟體的計算後,當發光單元1在兩個發光方向上的可視角度之比例大於1.5時,即可滿足紅外線式觸控面板的偵測距離及亮度之需求。另外,所述之第一發光方向與第二發光方向可為相互垂直(如X、Y軸),但兩者亦可不相互垂直,端視應用面的需求而定。Please refer to FIG. 3 , which is a single light-emitting unit 1 completed after the above steps, wherein the connection between the side surface 132A ( 132B ) and the lenticular top surface 131 forms a conic curve or the like, so the present invention will package Structure 13 is referred to as a double cone and top surface 131 is a biquad surface. In addition, the light emitted by the light-emitting element 12 can be emitted in an asymmetric manner by the top surface 131 of the double-order curved surface to achieve a smaller viewing angle in the first light-emitting direction and a second light-emitting direction in the second light-emitting direction. Large viewing angle. After the calculation of the optical simulation software of the present invention, when the ratio of the viewing angle of the illumination unit 1 in the two illumination directions is greater than 1.5, the detection distance and brightness of the infrared touch panel can be satisfied. In addition, the first light emitting direction and the second light emitting direction may be perpendicular to each other (such as X and Y axes), but the two may not be perpendicular to each other, depending on the requirements of the application surface.

請參考圖4、圖5,其顯示本發明的一個較佳的具體實施例,圖4係顯示圖3之發光單元在X軸(第二發光方向)的可視角度測試圖,其中在X軸的可視角度小於40度;而圖5係顯示圖3之發光單元1在Y軸(第二發光方向)的可視角度測試圖,其中在Y軸的可視角度大於80度;故Y軸的可視角度與X軸的可視角度之比例大於2。Please refer to FIG. 4 and FIG. 5, which illustrate a preferred embodiment of the present invention. FIG. 4 is a view showing a viewing angle of the light-emitting unit of FIG. 3 in the X-axis (second light-emitting direction), wherein the X-axis is The viewing angle is less than 40 degrees; and FIG. 5 is a view showing the viewing angle of the light-emitting unit 1 of FIG. 3 in the Y-axis (second light-emitting direction), wherein the viewing angle on the Y-axis is greater than 80 degrees; therefore, the viewing angle of the Y-axis is The ratio of the viewing angle of the X axis is greater than 2.

請參考圖6,其顯示一種觸控面板TP,其至少包括多個本發明之發光單元1及多個與發光單元1對應之接收器2,發光單元1與接收器2係對應地排列於觸控面板TP的四周,當觸發訊號S(如操作者的手指)接近時,會產生遮斷紅外線的效果,即可進行定位。具體而言,發光單元1是各自獨立且單一的,只要對遮斷的位置做解析即可做到定位的目的,最後再經由控制電路的運算將訊號傳送到電腦主機等處理端,再經由顯示器顯示輸出剛才觸碰的訊號位置,或者再經由其他軟體執行其他的訊號操控運用。Referring to FIG. 6 , a touch panel TP includes at least a plurality of the light emitting unit 1 of the present invention and a plurality of receivers 2 corresponding to the light emitting unit 1 . The light emitting unit 1 and the receiver 2 are arranged in contact with each other. Around the control panel TP, when the trigger signal S (such as the operator's finger) approaches, the effect of blocking the infrared rays is generated, and the positioning can be performed. Specifically, the light-emitting units 1 are independent and single, and the purpose of positioning can be achieved by analyzing the position of the cut-off. Finally, the signal is transmitted to the processing terminal of the computer host through the operation of the control circuit, and then through the display. Display the position of the signal that was just touched, or perform other signal manipulation operations via other software.

綜上所述,本發明至少具有下列諸項優點:In summary, the present invention has at least the following advantages:

1、本發明利用加工的方式,如切割將凸狀的透鏡狀之封裝結構切割成雙錐形的封裝結構,使發光單元在兩個發光方向上產生不對稱的發光態樣,此一不對稱的發光態樣在應用於觸控面板時可使觸控面板具有較大的感測距離及以較低的訊號串擾(crosstalk)問題。1. The present invention utilizes a processing method such as cutting to cut a convex lenticular package structure into a biconical package structure, so that the illuminating unit produces an asymmetrical illuminating state in two illuminating directions, and this asymmetry The illuminating aspect can make the touch panel have a larger sensing distance and a lower crosstalk problem when applied to the touch panel.

2、由於本發明之發光單元在一個特定的發光方向具有很大的可視角度(例如大於80度),而在另一相對的發光方向上造成小的可視角度(例如小於40度),故對整體發光強度而言仍可滿足一般的應用需求。2. Since the illumination unit of the present invention has a large viewing angle (e.g., greater than 80 degrees) in a particular illumination direction and a small viewing angle (e.g., less than 40 degrees) in another relative illumination direction, The overall luminous intensity can still meet the general application needs.

以上所述僅為本發明之較佳可行實施例,非因此侷限本發明之專利範圍,故舉凡運用本發明說明書及圖示內容所為之等效技術變化,均包含於本發明之範圍內。The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the equivalents of the present invention are intended to be included within the scope of the present invention.

1...發光單元1. . . Light unit

11...基板11. . . Substrate

12...發光元件12. . . Light-emitting element

13、13′...封裝結構13, 13'. . . Package structure

131...頂面(第一頂面區域)131. . . Top surface (first top surface area)

132...第二頂面區域132. . . Second top area

132A...側面132A. . . side

132B...側面132B. . . side

133...底面133. . . Bottom

2...接收器2. . . receiver

TP...觸控面板TP. . . Touch panel

SX1、SX2、SX3、SX4...切割道SX1, SX2, SX3, SX4. . . cutting line

SY1、SY2、SY3、SY4、SY5、SY6...切割道SY1, SY2, SY3, SY4, SY5, SY6. . . cutting line

圖1係顯示本發明之發光陣列的側視圖。Figure 1 is a side view showing a light-emitting array of the present invention.

圖1A係顯示本發明之凸狀的透鏡狀之封裝結構的示意圖。Fig. 1A is a schematic view showing a convex lenticular package structure of the present invention.

圖2係顯示本發明之發光陣列上之切割道之示意圖。Figure 2 is a schematic illustration of a dicing street on a luminescent array of the present invention.

圖3係顯示本發明之單一發光單元的示意圖。Figure 3 is a schematic view showing a single light emitting unit of the present invention.

圖4係顯示本發明之發光單元在X軸上的光型圖。Fig. 4 is a view showing the light pattern of the light-emitting unit of the present invention on the X-axis.

圖5係顯示本發明之發光單元在Y軸上的光型圖。Fig. 5 is a view showing a light pattern of the light-emitting unit of the present invention on the Y-axis.

圖6係顯示本發明之觸控面板之示意圖。6 is a schematic view showing a touch panel of the present invention.

1...發光單元1. . . Light unit

11...基板11. . . Substrate

12...發光元件12. . . Light-emitting element

13...封裝結構13. . . Package structure

131...頂面131. . . Top surface

132A...側面132A. . . side

132B...側面132B. . . side

133...底面133. . . Bottom

Claims (9)

一種發光單元之製造方法,包括以下步驟:提供一基板,該基板上包含有複數個電路區域,並將一發光元件分別設置於每一個該電路區域上;成型一封裝結構對應於每一個該電路區域,該封裝結構係包覆該發光元件;以及沿著兩個軸向的切割道進行切割以形成多個單一的發光單元,其中該封裝結構在該兩個軸向上分別經過兩次切割,使該封裝結構具有一個頂面及兩組相對應的側面,該頂面係為一雙次曲面,以形成雙錐形(biconic)透鏡封裝結構;其中,每一個該發光單元在兩個發光方向上具有不對稱的發光態樣。 A manufacturing method of a light emitting unit, comprising the steps of: providing a substrate, the substrate comprising a plurality of circuit regions, and respectively arranging a light emitting component on each of the circuit regions; forming a package structure corresponding to each of the circuits a region, the package structure encasing the light emitting element; and cutting along two axial scribe lines to form a plurality of single light emitting units, wherein the package structure is cut twice in the two axial directions respectively The package structure has a top surface and two corresponding sets of sides, the top surface being a double-curved surface to form a biconic lens package structure; wherein each of the light-emitting units is in two light-emitting directions It has an asymmetric illuminating aspect. 如申請專利範圍第1項所述之發光單元之製造方法,其中在成型一封裝結構的步驟中,係利用一模具成型一凸狀(dome-like)之封裝結構包覆該發光元件,該凸狀之封裝結構的頂面具有一第一頂面區域及一第二頂面區域,該第一頂面區域係為所述之雙次曲面;在沿著兩個軸向的切割道進行切割的步驟中,該第二頂面區域係被切割移除,而留下的該第一頂面區域即為所述之雙錐形透鏡封裝結構的該頂面。 The method for manufacturing a light-emitting unit according to claim 1, wherein in the step of molding a package structure, the light-emitting element is covered by a die-like dome-like package structure, the protrusion The top mask of the package structure has a first top surface area and a second top surface area, the first top surface area being the double-sided surface; cutting along two axial cutting lanes In the step, the second top surface area is removed by cutting, and the first top surface area left is the top surface of the biconical lens package structure. 如申請專利範圍第2項所述之發光單元之製造方法,其中在沿著兩個軸向的切割道進行切割的步驟之前更包括利用模擬軟體計算該凸狀之封裝結構在該兩個軸向的切割寬度。 The method of manufacturing a light-emitting unit according to claim 2, wherein before the step of cutting along the two axial scribe lines, the method further comprises: calculating the convex package structure in the two axial directions by using a simulation software Cutting width. 如申請專利範圍第1項所述之發光單元之製造方法,其中每一個該發光單元在兩個發光方向上的可視角度之比例大於1.5。 The method for manufacturing a light-emitting unit according to claim 1, wherein a ratio of a viewing angle of each of the light-emitting units in two light-emitting directions is greater than 1.5. 如申請專利範圍第1項所述之發光單元之製造方法,其中每一個該發光單元在一第一發光方向上的可視角度係小於40度,而該發光單元在一第二發光方向上的可視角度係大於80度。 The method for manufacturing a light-emitting unit according to claim 1, wherein a viewing angle of each of the light-emitting units in a first light-emitting direction is less than 40 degrees, and the light-emitting unit is visible in a second light-emitting direction. The angle is greater than 80 degrees. 一種發光單元,包括:一基板,其上具有電路區域;一發光元件,其係設於該基板上而電性連接於該電路區域;以及一雙錐形透鏡封裝結構,該雙錐形透鏡封裝結構具有一個頂面及兩組相對應的側面,該頂面係為一雙次曲面,且該雙錐形透鏡封裝結構係為一凸狀(dome-like)之封裝結構所切割成型者;其中,該發光單元在兩個發光方向上具有不對稱的發光態樣。 A light-emitting unit includes: a substrate having a circuit region thereon; a light-emitting element coupled to the substrate and electrically connected to the circuit region; and a double-cone lens package structure, the double-cone lens package The structure has a top surface and two corresponding sets of sides, the top surface is a double-sided curved surface, and the double-cone lens package structure is a die-like package structure for cutting the shape; The light-emitting unit has an asymmetrical illumination pattern in two illumination directions. 如申請專利範圍第6項所述之發光單元,其中該封裝結構具有一個與該基板相連接之底面,該底面係為矩形。 The illuminating unit of claim 6, wherein the package structure has a bottom surface connected to the substrate, the bottom surface being rectangular. 如申請專利範圍第6項所述之發光單元,其中該發光單元在一第一發光方向上的可視角度係小於40度,而該發光單元在一第二發光方向上的可視角度係大於80度。 The illuminating unit of claim 6, wherein the viewing angle of the illuminating unit in a first illuminating direction is less than 40 degrees, and the viewing angle of the illuminating unit in a second illuminating direction is greater than 80 degrees. . 一種觸控面板,其至少包括多個發光單元及多個與發 光單元對應之接收器,每一該發光單元包括:一基板,其上具有電路區域;一發光元件,其係設於該基板上而電性連接於該電路區域;以及一雙錐形透鏡封裝結構,該雙錐形透鏡封裝結構具有一個頂面及兩組相對應的側面,該頂面係為一雙次曲面,且該雙錐形透鏡封裝結構係為一凸狀(dome-like)之封裝結構所切割成型者;其中,該發光單元在兩個發光方向上具有不對稱的發光態樣。 A touch panel comprising at least a plurality of light emitting units and a plurality of light emitting units a light unit corresponding to the receiver, each of the light emitting units includes: a substrate having a circuit region thereon; a light emitting device disposed on the substrate and electrically connected to the circuit region; and a double cone lens package The biconical lens package structure has a top surface and two corresponding sets of sides, the top surface is a double-sided surface, and the biconical lens package structure is a dome-like The package structure cuts the shaper; wherein the light-emitting unit has an asymmetrical illumination pattern in two illumination directions.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005175280A (en) * 2003-12-12 2005-06-30 Citizen Electronics Co Ltd Method for manufacturing package for electronic component
US20060267037A1 (en) * 2005-05-31 2006-11-30 Samsung Electro-Mechanics Co., Ltd. Light emitting diode package
JP2007207833A (en) * 2006-01-31 2007-08-16 Sanyo Electric Co Ltd Light-emitting diode light source
TW200842280A (en) * 2006-04-18 2008-11-01 Lamina Ceramics Inc Optical devices for controlled color mixing
US20100155586A1 (en) * 2008-12-23 2010-06-24 Avago Technologies Ecbu (Singapore) Pte. Ltd. Optical Encoder Systems, Devices and Methods
TW201113774A (en) * 2009-10-07 2011-04-16 Radiant Opto Electronics Corp Backlight module and optical touch panel

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005175280A (en) * 2003-12-12 2005-06-30 Citizen Electronics Co Ltd Method for manufacturing package for electronic component
US20060267037A1 (en) * 2005-05-31 2006-11-30 Samsung Electro-Mechanics Co., Ltd. Light emitting diode package
JP2007207833A (en) * 2006-01-31 2007-08-16 Sanyo Electric Co Ltd Light-emitting diode light source
TW200842280A (en) * 2006-04-18 2008-11-01 Lamina Ceramics Inc Optical devices for controlled color mixing
US20100155586A1 (en) * 2008-12-23 2010-06-24 Avago Technologies Ecbu (Singapore) Pte. Ltd. Optical Encoder Systems, Devices and Methods
TW201113774A (en) * 2009-10-07 2011-04-16 Radiant Opto Electronics Corp Backlight module and optical touch panel

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