TWI475135B - - Google Patents
Info
- Publication number
- TWI475135B TWI475135B TW099113517A TW99113517A TWI475135B TW I475135 B TWI475135 B TW I475135B TW 099113517 A TW099113517 A TW 099113517A TW 99113517 A TW99113517 A TW 99113517A TW I475135 B TWI475135 B TW I475135B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99113517A TW201137186A (en) | 2010-04-28 | 2010-04-28 | Pull-plating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW99113517A TW201137186A (en) | 2010-04-28 | 2010-04-28 | Pull-plating apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201137186A TW201137186A (en) | 2011-11-01 |
TWI475135B true TWI475135B (de) | 2015-03-01 |
Family
ID=46759378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW99113517A TW201137186A (en) | 2010-04-28 | 2010-04-28 | Pull-plating apparatus |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201137186A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI642379B (zh) * | 2016-12-13 | 2018-12-01 | 日商Ykk股份有限公司 | 具備具有鍍膜的金屬製鏈牙列的拉鏈牙鏈帶、拉鏈鏈條、拉鏈及物品 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0344385B1 (de) * | 1986-10-06 | 1992-01-22 | Sumitomo Metal Industries, Ltd. | Verfahren und Apparat für die Elektroplattierung von Stahl in einer Salzschmelze |
EP0307161B1 (de) * | 1987-09-08 | 1993-11-18 | Eco-Tec Limited | Verfahren zum Galvanisieren von Metallen |
EP0415876B1 (de) * | 1989-08-07 | 1994-12-28 | Eltech Systems Corporation | Kontinuierliche Elektroplattierung von elektrisch leitendem Schaum |
WO1997020971A1 (en) * | 1995-12-07 | 1997-06-12 | Eltech Systems Corporation | Continuously electroplated foam of improved weight distribution |
TWM252713U (en) * | 2004-03-12 | 2004-12-11 | Wen-Tsai Ju | An improved transmission structure for electroplating machine |
TWM288080U (en) * | 2005-10-28 | 2006-02-21 | Applied Equipment Ltd | Dual-lined continuous electroplating apparatus |
US20090026083A1 (en) * | 2007-07-27 | 2009-01-29 | Shinji Tachibana | Continuous copper electroplating method |
TW201011128A (en) * | 2008-09-05 | 2010-03-16 | Thian Yu Chen Tech Co Ltd | Orbital plating device |
-
2010
- 2010-04-28 TW TW99113517A patent/TW201137186A/zh not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0344385B1 (de) * | 1986-10-06 | 1992-01-22 | Sumitomo Metal Industries, Ltd. | Verfahren und Apparat für die Elektroplattierung von Stahl in einer Salzschmelze |
EP0307161B1 (de) * | 1987-09-08 | 1993-11-18 | Eco-Tec Limited | Verfahren zum Galvanisieren von Metallen |
EP0415876B1 (de) * | 1989-08-07 | 1994-12-28 | Eltech Systems Corporation | Kontinuierliche Elektroplattierung von elektrisch leitendem Schaum |
WO1997020971A1 (en) * | 1995-12-07 | 1997-06-12 | Eltech Systems Corporation | Continuously electroplated foam of improved weight distribution |
TWM252713U (en) * | 2004-03-12 | 2004-12-11 | Wen-Tsai Ju | An improved transmission structure for electroplating machine |
TWM288080U (en) * | 2005-10-28 | 2006-02-21 | Applied Equipment Ltd | Dual-lined continuous electroplating apparatus |
US20090026083A1 (en) * | 2007-07-27 | 2009-01-29 | Shinji Tachibana | Continuous copper electroplating method |
TW201011128A (en) * | 2008-09-05 | 2010-03-16 | Thian Yu Chen Tech Co Ltd | Orbital plating device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI642379B (zh) * | 2016-12-13 | 2018-12-01 | 日商Ykk股份有限公司 | 具備具有鍍膜的金屬製鏈牙列的拉鏈牙鏈帶、拉鏈鏈條、拉鏈及物品 |
Also Published As
Publication number | Publication date |
---|---|
TW201137186A (en) | 2011-11-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |