TWI474333B - Single-ended multi-port storage device - Google Patents
Single-ended multi-port storage device Download PDFInfo
- Publication number
- TWI474333B TWI474333B TW96139890A TW96139890A TWI474333B TW I474333 B TWI474333 B TW I474333B TW 96139890 A TW96139890 A TW 96139890A TW 96139890 A TW96139890 A TW 96139890A TW I474333 B TWI474333 B TW I474333B
- Authority
- TW
- Taiwan
- Prior art keywords
- coupled
- inverter
- transistor
- gate
- storage device
- Prior art date
Links
- 230000000903 blocking effect Effects 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 2
- 230000014759 maintenance of location Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 12
- 230000005669 field effect Effects 0.000 description 6
- KZNMRPQBBZBTSW-UHFFFAOYSA-N [Au]=O Chemical compound [Au]=O KZNMRPQBBZBTSW-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- RDYMFSUJUZBWLH-UHFFFAOYSA-N endosulfan Chemical compound C12COS(=O)OCC2C2(Cl)C(Cl)=C(Cl)C1(Cl)C2(Cl)Cl RDYMFSUJUZBWLH-UHFFFAOYSA-N 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Static Random-Access Memory (AREA)
Description
本發明係有關於一種儲存裝置,其係尤指一種單端多埠之儲存裝置。The present invention relates to a storage device, and more particularly to a storage device for single-ended multi-turns.
按,隨著多核心系統單晶片的發展,越來越多的記憶體將被整合於系統晶片中以幫助各核心的運算,因此記憶體在未來的晶片上必定佔有大部分的面積,並成為影響系統晶片效能一個很重要的因子,且將消耗大量的能量;所以,如何有效的降低記憶體的面積及其功率消耗必定成為一個很重要的課題。According to the development of multi-core system single-chip, more and more memory will be integrated into the system chip to help the core operations, so the memory must occupy most of the area on the future wafer, and become A very important factor affecting system chip performance, and will consume a lot of energy; therefore, how to effectively reduce the memory area and its power consumption must become an important issue.
請參閱第一圖,係為習知技術之儲存裝置的電路圖。如圖所示,習知技術之儲存裝置包括一第一反相器10’、一第二反相器20’與一存取埠30’。第一反相器10’之輸入端耦接第二反相器20’之輸出端;第一反相器10’之輸出端耦接第二反相器20’之輸入端,存取埠30’耦接於第二反相器20’與一位元線(Bitline,BL),並與一字元線(Wordline,WL)相耦接,此存取埠30’為一N型金氧半場效電晶體(NMOS),因此當位元線為高電位時,存取埠30’打開,將會有一門檻電壓跨在存取埠30’上,使得位元線電壓對儲存裝置的有效電壓減小;因此,請一併參閱第二圖,係為另一習知技術之儲存裝置的電路圖,如圖所示,存取埠30’被一P型金氧半場效電晶體(PMOS)所取代,因此當位元線為高電位時,存取埠30’打開後,位元線的電壓將在無耗損的情況下傳入儲存裝置中。Please refer to the first figure, which is a circuit diagram of a storage device of the prior art. As shown, the prior art storage device includes a first inverter 10', a second inverter 20' and an access port 30'. The input end of the first inverter 10' is coupled to the output end of the second inverter 20'; the output end of the first inverter 10' is coupled to the input end of the second inverter 20', and the access port 30 is accessed. 'coupled to the second inverter 20' and a bit line (Bitline, BL), and coupled with a word line (Wordline, WL), the access port 30' is an N-type gold oxygen half field Effect transistor (NMOS), so when the bit line is high, the access port 30' is turned on, and there will be a threshold voltage across the access port 30', so that the effective voltage of the bit line voltage to the storage device is reduced. Therefore, please refer to the second figure, which is a circuit diagram of another conventional storage device. As shown, the access port 30' is replaced by a P-type metal oxide half field effect transistor (PMOS). Therefore, when the bit line is high, after the access port 30' is turned on, the voltage of the bit line will be transferred to the storage device without loss.
一般位元線在單端儲存裝置進行讀取及寫入邏輯值”1”時,位元線都將先保持在高準位(High),並字元線將會導通,如此,單端儲存裝置無法得知位元線與字元線如何動作是在進行讀取還是寫入邏輯值”1”。因此,設計出儲存裝置可依據不同準位的位元線,而進行寫入資料或讀取資料,當儲存裝置進行讀取時,位元線必須轉變為較電壓準位稍微低之電壓準位,以透過存取埠30,讀取第一反相器10’與第二反相器20’所儲存的資料;當儲存裝置進行寫入時,位元線必須轉變為高電壓準位,以透過存取埠30’寫入第一反相器10’與第二反相器20’所形成的儲存單元。惟若,此架構具有較低的靜態雜訊邊界(static noise margin,SNM),並必須注意儲存裝置之電晶體的大小,且難延伸多個存取埠。When the general bit line reads and writes the logic value "1" in the single-ended memory device, the bit line will remain at the high level first, and the word line will be turned on. Thus, single-ended storage The device cannot know whether the bit line and the word line are moving to read or write a logical value of "1". Therefore, the storage device is designed to write data or read data according to bit lines of different levels. When the storage device reads, the bit line must be converted to a voltage level slightly lower than the voltage level. Reading the data stored in the first inverter 10' and the second inverter 20' through the access port 30; when the storage device performs writing, the bit line must be converted to a high voltage level to The storage unit formed by the first inverter 10' and the second inverter 20' is written through the access port 30'. However, if the architecture has a low static noise margin (SNM), it must pay attention to the size of the transistor of the storage device, and it is difficult to extend multiple access ports.
此外,儲存裝置又有另一種設計,以保持良好的靜態雜訊邊界,並使用不同準位的字元線以進行寫入與讀取儲存裝置,其使用低準位的字元線以讀取儲存裝置的資料:使用高準位的字元線以寫入資料於儲存裝置。惟若,此種方式必須額外使用直流對直流轉換器(DC-DC convert)或充電幫浦,如此增加電路的複雜度,並增加功率的消耗。In addition, the storage device has another design to maintain good static noise boundaries and use different levels of word lines for writing and reading storage devices that use low-level word lines to read Storage device data: Use high-level word lines to write data to the storage device. However, this method must additionally use a DC-DC converter or a charging pump, which increases the complexity of the circuit and increases the power consumption.
因此,如何針對上述問題而提出一種新穎單端多埠之儲存裝置,將可運用單端記憶體元件的高密度優勢,多埠供讀寫以加快記憶體效率,以及其對於記憶體單元寫入速度與功率消耗之改進,更進一步的改進多核心系統單晶片上記憶體的效能。Therefore, how to solve the above problems and propose a novel single-ended multi-storage storage device, which can utilize the high-density advantage of single-ended memory components, for reading and writing to speed up memory efficiency, and writing to memory cells. Improvements in speed and power consumption further improve the performance of memory on a single-chip multi-core system.
本發明之目的之一,在於提供一種單端多埠之儲存裝置,其藉由一記憶單元內之均衡器與一虛接地,以降低資料寫入儲存裝置時,所需的功率消耗。One of the objectives of the present invention is to provide a single-ended multi-turn storage device with an equalizer and a virtual ground in a memory unit to reduce the power consumption required when data is written into the storage device.
本發明之目的之一,在於提供一種單端多埠之儲存裝置,其藉由一記憶單元內之均衡器與一虛接地,以加快資料寫入儲存裝置的速度。One of the objects of the present invention is to provide a single-ended multi-turn storage device that accelerates the writing of data to a storage device by using an equalizer and a virtual ground in a memory unit.
本發明之目的之一,在於提供一種單端多埠之儲存裝置,其簡化儲存裝置的複雜度,進而節省成本。One of the objects of the present invention is to provide a single-ended multi-turn storage device that simplifies the complexity of the storage device and thereby saves costs.
本發明之單端多埠之儲存裝置內之記憶單元包含一第一反相器、一第二反相器、一均衡器與複數存取埠。第一反相器具有一第一輸入端與一第一輸出端,並耦接一電源與一虛接地,第二反相器具有一第二輸入端與一第二輸出端,第二輸入端耦接第一輸出端,第二輸出端耦接第一輸入端,並且第二反相器耦接電源與虛接地,均衡器耦接第一反相器與第二反相器,以控制第一反相器與第二相器之電位,複數存取埠耦接第一反相器與第二反相器,並耦接一位元線與一字元線。The memory unit in the single-ended multi-device storage device of the present invention comprises a first inverter, a second inverter, an equalizer and a complex access port. The first inverter has a first input end and a first output end, and is coupled to a power supply and a virtual ground. The second inverter has a second input end and a second output end coupled to the second input end. a first output end, the second output end is coupled to the first input end, and the second inverter is coupled to the power source and the virtual ground, and the equalizer is coupled to the first inverter and the second inverter to control the first reverse The potential of the phase comparator and the second phase comparator, the plurality of access ports are coupled to the first inverter and the second inverter, and coupled to the one bit line and the one word line.
再者,本發明之單端多埠之儲存裝置更包括一阻隔單元,其耦接虛接地與接地之間,以避免當資料寫入儲存裝置時,因儲存裝置內之不穩態而導致大電流流經儲存裝置。Furthermore, the single-ended multi-turn storage device of the present invention further includes a blocking unit coupled between the virtual ground and the ground to prevent large data from being written into the storage device due to an unstable state in the storage device. Current flows through the storage device.
又,本發明之單端多埠之儲存裝置可供多埠同時讀出資料,但若有資料要寫入儲存裝置時,則僅供一埠寫入資料,而其他埠皆必須為關閉狀態(不供讀寫)。Moreover, the single-ended multi-port storage device of the present invention can read data at the same time, but if the data is to be written into the storage device, only one data is written, and the other devices must be in the off state ( Not for reading and writing).
第三圖,係為本發明之一較佳實施例之方塊圖。如圖所示,本發明之單端多埠之儲存裝置可為任意之具有儲存功能之裝置,例如:一靜態隨機存取記憶體(State Random Access Memory,SRAM)、一檔案暫存器(Register File),一緩衝器(Buffer)、一內容可定址記憶體(Context Addressable Memory,CAM);並儲存裝置包含複數記憶單元(memory cell),該些記憶單元包含一第一反相器10、一第二反相器20、一均衡器30(Equalizer)與複數存取埠40,42,44。第一反相器10具有一第一輸入端與一第一輸出端,並耦接一電源Vdd與一虛接地V_Gnd,第二反相器20,具有一第二輸入端與一第二輸出端,第二輸入端耦接第一輸出端,第二輸出端耦接第一輸入端,第二反相器20耦接電源Vdd與虛接地V_Gnd,如此,第一反相器10與第二反相器20形成一反相器對,以儲存資料供存取埠40,42,44讀取或寫入資料。其中,請一併參閱第四圖,係為本發明之一較佳實施例之儲存裝置之電路圖。如圖所示,第一反相器10與第二反相器20為一互補式金氧半場效電晶體(Complemental Metal Oxide Semiconductor Field Effective Transistor,CMOSFET)。第一反相器10包括一第一電晶體12與一第二電晶體14。即第一電晶體12之一端耦接於電源Vdd,第二電晶體14之一端耦接於虛接地V_Gnd,另一端與第一電晶體12串接,並第一電晶體12之閘極與第二電晶體20之閘極相耦接;第二反相器20包括一第三電晶體22與一第四電晶體24。第三電晶體22其一端耦接於電源Vdd,第四電晶體24之一端耦接於虛接地V_Gnd,第四電晶體24之另一端與第三電晶體22串接,並第三電晶體22之閘極與第四電晶體24之閘極相耦接,其中,第一電晶體12與第二電晶體14之串接端耦接於第三電晶體22與第四電晶體24之閘極,第三電晶體22與第四電晶體24之串接端耦接於第一電晶體12與第二電晶體14之閘極,以形成反相器對。此外,上述之第一電晶體12與第二電晶體14形成之第一反相器10與第三電晶體22與第四電晶體24形成之第二反相器20僅為本發明之一較佳的實施方式,但不侷限於上述電路所構成之第一反相器10與第二反相器20,亦可為其他任意形式之反相電路所構成。The third figure is a block diagram of a preferred embodiment of the present invention. As shown in the figure, the single-ended multi-port storage device of the present invention can be any device having a storage function, such as: a state random access memory (SRAM), a file register (Register). File, a buffer, a Context Addressable Memory (CAM); and the storage device includes a plurality of memory cells, the memory cells including a first inverter 10, The second inverter 20, an equalizer 30 (Equalizer) and a plurality of access ports 40, 42, 44. The first inverter 10 has a first input end and a first output end, and is coupled to a power source Vdd and a virtual ground V_Gnd, and the second inverter 20 has a second input end and a second output end. The second input end is coupled to the first output end, the second output end is coupled to the first input end, and the second inverter 20 is coupled to the power supply Vdd and the virtual ground V_Gnd, such that the first inverter 10 and the second reverse Phaser 20 forms an inverter pair to store data for access to 40, 42, 44 to read or write data. The fourth embodiment is a circuit diagram of a storage device according to a preferred embodiment of the present invention. As shown, the first inverter 10 and the second inverter 20 are a Complemental Metal Oxide Semiconductor Field Effective Transistor (CMOSFET). The first inverter 10 includes a first transistor 12 and a second transistor 14. That is, one end of the first transistor 12 is coupled to the power source Vdd, one end of the second transistor 14 is coupled to the virtual ground V_Gnd, the other end is connected in series with the first transistor 12, and the gate of the first transistor 12 is The gate of the second transistor 20 is coupled; the second inverter 20 includes a third transistor 22 and a fourth transistor 24. The third transistor 22 has one end coupled to the power source Vdd, one end of the fourth transistor 24 is coupled to the virtual ground V_Gnd, and the other end of the fourth transistor 24 is connected in series with the third transistor 22, and the third transistor 22 is connected. The gate is coupled to the gate of the fourth transistor 24, wherein the series connection of the first transistor 12 and the second transistor 14 is coupled to the gates of the third transistor 22 and the fourth transistor 24. The series connection ends of the third transistor 22 and the fourth transistor 24 are coupled to the gates of the first transistor 12 and the second transistor 14 to form an inverter pair. In addition, the first inverter 10 formed by the first transistor 12 and the second transistor 14 and the second inverter 20 formed by the third transistor 22 and the fourth transistor 24 are only one of the present inventions. A preferred embodiment, but not limited to the first inverter 10 and the second inverter 20 formed by the above circuit, may be formed by any other form of inverter circuit.
均衡器30耦接第一反相器10與第二反相器20之間,以控制第一反相器10與第二反相器20間的電位,即均衡器30接收一控制訊號時,使第一反相器10與第二反相器20間的電位相同,以進入一準穩定狀態(meta-stable state),其中均衡器30為一開關電路,如一場效電晶體(Field Effect Transistor,FET),如第三圖所示,均衡器30並作為一開關之用,當接收到控制訊號(EQ)時,使均衡器30導通而使反相器對的N1點與N2點的電壓準位相同。The equalizer 30 is coupled between the first inverter 10 and the second inverter 20 to control the potential between the first inverter 10 and the second inverter 20, that is, when the equalizer 30 receives a control signal, The potential between the first inverter 10 and the second inverter 20 is the same to enter a meta-stable state, wherein the equalizer 30 is a switching circuit, such as a field effect transistor (Field Effect Transistor) , FET), as shown in the third figure, the equalizer 30 is used as a switch. When receiving the control signal (EQ), the equalizer 30 is turned on to make the voltage of the N1 point and the N2 point of the inverter pair. The same level.
該些存取埠40,42,44耦接第一反相器10與第二反相器,並分別耦接位元線BL_1、位元線BL_2與位元線BL_n和字元線WL_1、字元線WL_2與字元線WL_n,以作為為一讀寫共用埠、一讀出埠或一寫入埠,如此可存取記憶單元之反相器對中的資料,但若有資料要寫入儲存裝置時,則僅供一埠寫入資料,而其他埠皆必須為關閉狀態(不供讀寫)。如此,當進行寫入資料進入記憶單元之操作時,在初始階段,均衡器30將使記憶單元進入準穩定狀態;當記憶體已進入準穩定狀態,截止均衡器30,並導通存取埠40,記憶單元將會感測位元線BL_1上的訊號以進行寫入資料;與此同時,虛接地V_Gnd之電壓也會增加而導致第一反相器10與第二反相器20的門檻電壓上升,使本發明只需使用一半的電源Vdd於位元線BL_1即可進行資料的寫入,故降低資料寫入儲存裝置之記憶單元時,所需的功率消耗。此外,上述之該些存取埠40,42,44為一開關電路,並為場效電晶體。The access ports 40, 42 and 44 are coupled to the first inverter 10 and the second inverter, and are respectively coupled to the bit line BL_1, the bit line BL_2 and the bit line BL_n, and the word line WL_1, and the word. The source line WL_2 and the word line WL_n are used as a read/write shared 埠, a read 埠 or a write 埠, so that the data in the inverter pair of the memory unit can be accessed, but if there is data to be written When the device is stored, it is only for one file to be written, and the other ports must be off (not for reading and writing). Thus, when the operation of writing data into the memory unit is performed, in the initial stage, the equalizer 30 will bring the memory unit into a quasi-stable state; when the memory has entered the quasi-stable state, the equalizer 30 is turned off, and the access is turned on. The memory unit will sense the signal on the bit line BL_1 for writing data; at the same time, the voltage of the virtual ground V_Gnd will also increase, causing the threshold voltage of the first inverter 10 and the second inverter 20 to rise. Therefore, the present invention can perform data writing only by using half of the power supply Vdd on the bit line BL_1, thereby reducing the power consumption required when the data is written into the memory unit of the storage device. In addition, the access ports 40, 42, 44 described above are a switching circuit and are field effect transistors.
請參閱第五圖,係為本發明之一較佳實施例之儲存裝置之列記憶單元之電路圖,如圖所示,由於在進行資料寫入時,若虛地端V_Gnd的電壓為零電位,並在均衡器30導通時,將會導致大電流流經第一反相器10與第二反相器20,進而增加功率的消耗。所以,本發明之單端多埠之儲存裝置在每一列的記憶單元中的虛接地V_Gnd與接地間設置一阻隔單元50,以避免大電流產生而減少功率的消耗。其中阻隔單元50包括一電晶體51,52、一第一邏輯閘53、一第二邏輯閘54。電晶體51與電晶體52相互並接,並耦接於虛接地V_Gnd與接地間,第一邏輯閘53之輸出端耦接電晶體52之閘極,第二邏輯閘55之輸出端耦接電晶體51之閘極,並且第一邏輯閘53與第二邏輯閘54分別接收一阻隔訊號(PG)與反相之阻隔訊號,阻隔單元50在儲存裝置進行寫入時截止,以阻隔虛接地與接地端之連結,使虛接地浮接而避免大電流產生。此外,上述阻隔單元50之架構僅為本實施例之一較佳實施例,但不侷限於上述電路所構成阻隔單元50,亦可為其他架構,如一P型金氧半場效電晶體功率閘(PMOS power gate)、一N型金氧半場效電晶體功率閘(NMOS power gate)或一資料保留功率閘(data retention power gate)。Referring to FIG. 5, it is a circuit diagram of a memory unit of a storage device according to a preferred embodiment of the present invention. As shown in the figure, when the data is written, if the voltage of the virtual ground terminal V_Gnd is zero potential, And when the equalizer 30 is turned on, a large current will flow through the first inverter 10 and the second inverter 20, thereby increasing power consumption. Therefore, the single-ended multi-turn storage device of the present invention provides a blocking unit 50 between the virtual ground V_Gnd and the ground in the memory cells of each column to avoid large current generation and reduce power consumption. The blocking unit 50 includes a transistor 51, 52, a first logic gate 53, and a second logic gate 54. The transistor 51 and the transistor 52 are connected to each other and coupled between the virtual ground V_Gnd and the ground. The output of the first logic gate 53 is coupled to the gate of the transistor 52, and the output of the second logic gate 55 is coupled to the output. The gate of the crystal 51, and the first logic gate 53 and the second logic gate 54 respectively receive a blocking signal (PG) and an inverted blocking signal, and the blocking unit 50 is turned off when the storage device performs writing to block the virtual ground and The connection of the grounding ends allows the virtual ground to float to avoid large currents. In addition, the structure of the foregoing blocking unit 50 is only a preferred embodiment of the present embodiment, but is not limited to the blocking unit 50 formed by the above circuit, and may be other structures, such as a P-type gold-oxygen half field effect transistor power gate ( PMOS power gate), an N-type MOS power gate or a data retention power gate.
請參閱第六圖,係為本發明之一較佳實施例之儲存裝置之寫入資料的時序圖。如圖所示,當儲存裝置欲進行資料寫入時,控制訊號(EQ)與阻隔訊號(PG)將會轉變為高準位,均衡器30在控制訊號(EQ)轉變為高準位時導通,並破壞記憶單元原本所儲存的資料,虛接地V_Gnd將從接地的零電位轉變為浮動的電位,此時第一反相器10與第二反相器20間的N1點與N2點之準位相同,此時,當均衡器30截止時,儲存裝置之記憶單元進入準穩定狀態,並該些存取埠40,42,44之其中之一將導通,並感測位元線上的訊號,之後,字元線將設定為高準位並導通阻隔單元50,以完成寫入的動作。Please refer to a sixth diagram, which is a timing diagram of data written in a storage device according to a preferred embodiment of the present invention. As shown in the figure, when the storage device is to write data, the control signal (EQ) and the blocking signal (PG) will be converted to a high level, and the equalizer 30 is turned on when the control signal (EQ) transitions to the high level. And destroying the data stored in the memory unit, the virtual ground V_Gnd will change from the zero potential of the ground to the floating potential. At this time, the N1 and N2 points between the first inverter 10 and the second inverter 20 are accurate. The bits are the same. At this time, when the equalizer 30 is turned off, the memory unit of the storage device enters a quasi-stable state, and one of the access ports 40, 42, 44 will be turned on, and the signal on the bit line is sensed, after which The word line will be set to a high level and the blocking unit 50 will be turned on to complete the writing operation.
綜上所述,本發明之單端多埠之儲存裝置,其藉由一均衡器與一虛接地以控制第一反相器與第二反相器所形成的反相器對進入一準穩定狀態後,並由多埠之存取埠以存取資料。如此,降低資料寫入儲存裝置時所需的功率消耗,並加快資料寫入儲存裝置的速度,再者,由於本發明為單端的儲存裝置,故可降低儲存裝置的面積與縮小儲存裝置中位元線的繞線面積。In summary, the single-ended multi-turn storage device of the present invention enters a quasi-stable state by an equalizer and a virtual ground to control the inverter pair formed by the first inverter and the second inverter. After the status, the access is accessed by multiple accesses. In this way, the power consumption required for writing data to the storage device is reduced, and the speed of writing data to the storage device is accelerated. Further, since the present invention is a single-ended storage device, the area of the storage device can be reduced and the storage device can be reduced. The winding area of the Yuan line.
本發明係實為一具有新穎性、進步性及可供產業利用者,應符合我國專利法所規定之專利申請要件無疑,爰依法提出發明專利申請。The invention is a novel, progressive and available for industrial use, and should meet the requirements of the patent application stipulated in the Patent Law of China, and the invention patent application is filed according to law.
惟以上所述者,僅為本發明之一較佳實施例而已,並非用來限定本發明實施之範圍,舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the shapes, structures, features, and spirits described in the claims are equivalently changed. Modifications are intended to be included in the scope of the patent application of the present invention.
10’...第一反相器10’. . . First inverter
20’...第二反相器20’. . . Second inverter
30’...存取埠30’. . . Access code
10...一反相器10. . . Inverter
20...第二反相器20. . . Second inverter
30‧‧‧均衡器30‧‧‧Equalizer
40‧‧‧存取埠40‧‧‧ access point
42‧‧‧存取埠42‧‧‧Access rights
44‧‧‧存取埠44‧‧‧ access point
50‧‧‧阻隔單元50‧‧‧Block unit
51‧‧‧電晶體51‧‧‧Optoelectronics
52‧‧‧電晶體52‧‧‧Optoelectronics
53‧‧‧第一邏輯閘53‧‧‧First Logic Gate
54‧‧‧第二邏輯閘54‧‧‧Second logic gate
Vdd‧‧‧電源Vdd‧‧‧ power supply
V_Gnd‧‧‧虛接地V_Gnd‧‧‧virtual ground
第一圖為習知技術之儲存裝置之電路圖;第二圖為另一習知技術之儲存裝置之電路圖;第三圖為本發明之一較佳實施例之儲存裝置之方塊圖;第四圖為本發明之一較佳實施例之儲存裝置之電路圖;第五圖為本發明之一較佳實施例之儲存裝置之列記憶單元之電路圖;以及第六圖為本發明之一較佳實施例之儲存裝置之寫入資料的時序圖。1 is a circuit diagram of a storage device of a prior art; FIG. 2 is a circuit diagram of another conventional storage device; and FIG. 3 is a block diagram of a storage device according to a preferred embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a circuit diagram of a memory device of a memory device according to a preferred embodiment of the present invention; and FIG. 6 is a preferred embodiment of the present invention A timing diagram of the data written by the storage device.
10...第一反相器10. . . First inverter
20...第二反相器20. . . Second inverter
30...均衡器30. . . Equalizer
40...存取埠40. . . Access code
42...存取埠42. . . Access code
44...存取埠44. . . Access code
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96139890A TWI474333B (en) | 2007-10-24 | 2007-10-24 | Single-ended multi-port storage device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96139890A TWI474333B (en) | 2007-10-24 | 2007-10-24 | Single-ended multi-port storage device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200919483A TW200919483A (en) | 2009-05-01 |
| TWI474333B true TWI474333B (en) | 2015-02-21 |
Family
ID=44727133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96139890A TWI474333B (en) | 2007-10-24 | 2007-10-24 | Single-ended multi-port storage device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI474333B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5991192A (en) * | 1997-12-08 | 1999-11-23 | National Science Council Of Republic Of China | Current-mode write-circuit of a static ram |
| TWI259939B (en) * | 2004-12-02 | 2006-08-11 | Univ Nat Chiao Tung | A power gating structure with concurrent data retention and intermediate modes |
-
2007
- 2007-10-24 TW TW96139890A patent/TWI474333B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5991192A (en) * | 1997-12-08 | 1999-11-23 | National Science Council Of Republic Of China | Current-mode write-circuit of a static ram |
| TWI259939B (en) * | 2004-12-02 | 2006-08-11 | Univ Nat Chiao Tung | A power gating structure with concurrent data retention and intermediate modes |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200919483A (en) | 2009-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101564340B1 (en) | Low-power 5t sram with improved stability and reduced bitcell size | |
| KR101363656B1 (en) | Semiconductor integrated circuit and processor | |
| TWI431624B (en) | Data-aware dynamic supply random access memory | |
| CN103077741B (en) | The storage unit circuit of a kind of SRAM of low voltage operating | |
| CN112863571B (en) | Near-threshold ultra-low leakage latch-type memory cell and its read-write control circuit | |
| JP2009505315A (en) | SRAM cell having independent read / write circuit | |
| US9378789B2 (en) | Voltage level shifted self-clocked write assistance | |
| CN102272843A (en) | Low-Leakage High-Performance SRAM Cell Using Dual-Technology Transistors | |
| CN102446545B (en) | Design method of static random access memory suitable for low-power chip | |
| US10373663B2 (en) | Non-volatile memory circuit | |
| CN112185445B (en) | Hybrid nonvolatile random access memory for suppressing electric leakage by using tunnel field effect transistor | |
| WO2010046800A1 (en) | Dual-rail sram with independent read and write ports | |
| TWI405206B (en) | The low voltage content can be addressed by the memory of the read and compare circuit | |
| CN115331713A (en) | Asymmetric writing double-voltage magnetic random access memory structure | |
| WO2021212393A1 (en) | Low-leakage memory array | |
| CN101840728B (en) | Dual-end static random access memory (SRMA) unit | |
| CN114758700A (en) | A 12T TFET SRAM cell circuit with read-write separation | |
| Ataei et al. | A high performance multi-port SRAM for low voltage shared memory systems in 32 nm CMOS | |
| TWI474333B (en) | Single-ended multi-port storage device | |
| CN117174139A (en) | Signal generation circuit and memory | |
| CN113628649A (en) | Static random access memory unit structure and static random access memory | |
| CN109637568B (en) | Symmetric reference cell type STT-MRAM read operation method and read circuit | |
| CN102290102A (en) | Ternary heat insulating storage | |
| TWI457935B (en) | Suitable for low operating voltage of the memory circuit | |
| CN113012738B (en) | A storage unit, memory array and all-digital static random access memory |