TWI473442B - Chip card holding module and electronic device using the same - Google Patents

Description

Chip card holding module and electronic device using the same

The present invention relates to a chip card holding module, and more particularly to a SIM card (Subscriber Identification Module Card) holding module and an electronic device using the same.

With the rapid development of the communication industry, the use of various portable electronic devices such as mobile phones and personal digital assistants (PDAs) has become more and more popular, which has brought convenience to people's lives. As the functions of the portable electronic device products become more and more diversified, more and more wafer cards for storing memories are applied to the portable electronic device, such as an SD card (Secure Digital Memory Card), CF card (Compact Flash Card), SIM card (Subscriber Identification Module Card), etc. Among them, the SIM card is a plastic card equipped with an IC chip, which has the functions of recording a personal user number and an address book.

FIG. 1 shows a conventional mobile phone 100 including a housing 10, a housing 14 for housing a battery, a circuit board 16, and a wafer card holding module disposed on the circuit board 16. 12 and a SIM card 20. The chip card holder module 12 includes a base 122, a plurality of electrical contacts 124 disposed on the base 122, a frame 126, a holder 128, and a SIM card inlet 130. The frame 126 is sized to fit the SIM card for accommodating the SIM card. The holder 128 is disposed on the frame 126 adjacent to the base 122.

During installation, the SIM card 20 is pushed into the chip card holding module 12 from the SIM card inlet 130 along the frame 126 until the SIM card 20 is completely received in the holding structure 12, so that the SIM card 20 is The electrical contacts 124 are aligned and electrically connected. In order to accommodate and mount the above-mentioned wafer card, the accommodating space of the wafer card and the holding device must be installed in the portable electronic device to fix the wafer card in the portable electronic device.

However, since the electronic components required to be disposed on the circuit board 16 are increasingly increased with the functions provided by the mobile phone 100, the structure of the frame 126 and the holder 128 of the conventional holding module 12 occupies the circuit board 16 Many spaces make it difficult to configure the electronic components on the board 16.

In view of this, it is necessary to provide a more space-saving chip card holding module to fully utilize the limited space in the electronic device using the holding module.

A chip card holding module includes a connector and a holding member, the connector comprising a base and a plurality of conductive terminals disposed at opposite ends of the base. The base has a card slot on the opposite sides of the base, the retaining member includes a resisting plate and a connecting plate extending from the two ends of the abutting plate, the connecting plate is inserted into the slot of the base for the connection A space for accommodating a wafer card is formed between the holder and the holder.

A portable electronic device includes a casing, a circuit board disposed in the casing, and a chip card holding module, the chip card holding module including a connector and a holding member, the connector The utility model comprises a base and a plurality of conductive terminals disposed on opposite ends of the base. The base has a card slot on opposite sides of the base, and the holding member includes a resisting plate and a connecting plate extending from the two ends of the resisting plate, the connecting plate is inserted The card slot of the base forms a space for accommodating a wafer card between the connector and the holder.

Compared with the prior art, the chip card holding module can stably hold the wafer card in the mobile phone through a holding member, and has a simple structure, and the chip card holding module is disposed on the circuit board, It occupies only approximately the same pedestal space as the electrical contacts, so that the space occupied by the wafer card can be greatly reduced, and the space saved can be used to house other required electronic components.

(known)

12‧‧‧Terminal slot

21‧‧‧ housing

22‧‧‧ Circuit board

24‧‧‧ wafer card retention module

26‧‧‧Connector

261a‧‧‧ upper surface

261b‧‧‧ lower surface

261c‧‧‧ first end

261d‧‧‧second end

263‧‧‧ card slot

28‧‧‧ holding parts

281‧‧‧Resistance board

282‧‧‧Connecting plate

282a‧‧‧Bend

282b‧‧‧Installation Department

30‧‧‧Electrical terminals

32‧‧‧ Fixed Department

34‧‧‧Contact end

36‧‧‧welding end

50, 52‧‧‧ Electronic parts

200‧‧‧Mobile Phone

1 is a perspective view of a conventional wafer card holding module and a mobile phone using the same; FIG. 2 is a perspective view of a portable electronic device using the chip card holding module of the present invention; FIG. 4 is a perspective view showing the three-dimensional assembly of the chip card holding module of the present invention; and FIG. 5 is a perspective view showing the chip card holding module of the present invention disposed on a circuit board.

The chip card holding module of the preferred embodiment of the present invention is described as an example of a portable electronic device, which includes an SD card (Secure Digital Memory Card), a CF card (Compact Flash Card), and a SIM card. Wait. The specific structure of the wafer card holder module of the present invention will be described in detail below with reference to the accompanying drawings.

Referring to FIG. 2, a chip card holding module according to a preferred embodiment of the present invention is applied to the mobile phone 200 as an example. The mobile phone 200 includes a casing 21, a circuit board 22 disposed in the casing 21, and a chip card holding module 24. The board A plurality of electronic components 50, 52 are disposed on 22. The wafer card retention module 24 can be secured to the circuit board 22 using surface mount technology (SMT).

The chip card holding module 24 includes a connector 26 and a holding member 28.

Referring to FIG. 3 at the same time, the connector 26 includes a base 261 and a plurality of conductive terminals 30. The base 261 has a substantially rectangular shape and includes an upper surface 261a, a lower surface 261b opposite to the upper surface 261a, a first end portion 261c and a second end portion 261d opposite to the first end portion 261c. . The pedestal 261 defines a plurality of terminal slots 12 for accommodating the conductive terminals 30, and the base 261 defines a card slot 263 at opposite sides of the 261.

The conductive terminal 30 is electrically connected to a wafer placed on the upper surface 261a. Each of the conductive terminals 30 is formed by stamping and bending a metal sheet. The middle portion is a fixing portion 32, and the fixing portion 32 is upwardly bent upward. The contact end 34 is bent out and the other end is bent downwardly to the welded end 36. The fixing portion 32 is fastened in the terminal slot 12 of the base 261. The contact end 34 is protruded from the upper surface of the base 261, and is in contact with the corresponding component of the SIM card. The soldering end 36 is exposed by the lower surface of the base 261, and is soldered to On the circuit board 22 (refer to FIG. 5).

The holding member 28 includes a resisting plate 281 and a connecting plate 282 extending from both ends of the resisting plate 281. The connecting plate 282 includes a bent portion 282a and a mounting portion 282b. The bent portion 282a is formed by the opposite ends of the resisting plate 281 being vertically bent and extending toward the resisting plate 281, and the mounting portion is formed. The portion 282b is formed by vertically bending away from the end of the bent portion 282a in a direction away from the resisting plate 281, wherein the height of the mounting portion 282b is substantially the same as the depth of the slot 263 of the connector 26.

4 shows the assembled wafer card holding module 24. Here, in order to more clearly show the structure of the connector 26 and the holder 28, the wafer card is not shown in the drawing. installation The connector 26 is first fixed on the circuit board 22, and the mounting portion 282b of the holder 28 is inserted into the slot 263 of the connector 26 for the connector 26 and the holder 28. A space is formed to accommodate the wafer card.

When the chip card holding module 24 is disposed on the circuit board 22, since the conventional frame for arranging the chip card is no longer needed, the chip card holding module 24 only partially occupies the circuit. The space on the board 22. As shown in FIG. 5, the regions 40, 42 adjacent to the wafer card holding module 24 on the circuit board 22 can still be used to house the electronic components 52 (the upper portions of the regions 40, 42 are the holding members 28) to increase The number of electronic components can be placed on the circuit board 22.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. It should be covered by the following patent application.

26‧‧‧Connector

261a‧‧‧ upper surface

261b‧‧‧ lower surface

261c‧‧‧ first end

261d‧‧‧second end

263‧‧‧ card slot

28‧‧‧ holding parts

281‧‧‧Resistance board

282‧‧‧Connecting plate

282a‧‧‧Bend

282b‧‧‧Installation Department

30‧‧‧Electrical terminals

32‧‧‧ Fixed Department

34‧‧‧Contact end

36‧‧‧welding end

Claims (8)

A chip card holder module comprising: a connector comprising a base and a plurality of conductive terminals disposed at opposite ends of the base; the base defines a card slot on opposite sides thereof; a holding member comprising a resisting plate and a connecting plate extending from opposite ends of the resisting plate; the connecting plate comprises a bent portion and a mounting portion, the bent portion being perpendicular to the opposite ends of the resisting plate After being bent, the opposite side is formed to extend in the resisting plate, and the mounting portion is formed by bending from the end of the bent portion to the direction away from the resisting plate, wherein the connecting plate is inserted into the slot of the base to A space for accommodating a wafer card is formed between the connector and the holder. The wafer card holding module of claim 1, wherein the base comprises an upper surface, the conductive terminal comprises a fixing portion and a contact end bent by the fixing portion toward the upper surface, the contact end is used for Electrically coupled to a wafer placed on the upper surface. The wafer card holding module of claim 2, wherein the base comprises a lower surface opposite to the upper surface, the conductive terminal further comprising a soldering end bent by the fixing portion toward the lower surface, The soldering end is electrically connected to a circuit board. The wafer card holding module of claim 1, wherein the two opposite ends of the base are provided with a plurality of terminal slots for receiving the conductive terminals. The wafer card holding module of claim 1, wherein the height of the mounting portion is substantially the same as the depth of the card slot. A portable electronic device includes a casing, a circuit board disposed in the casing, and a chip card holding module. The chip card holding module includes: a connector including a base and a plurality of conductive terminals disposed at opposite ends of the base, the bases respectively defining a card slot on opposite sides thereof; and a holding member including a resisting plate and a connection extending from the two ends of the resisting plate a connecting plate comprising a bent portion and a mounting portion, the bent portion is formed by the resisting plate The two opposite ends are vertically bent and formed to extend toward the inner side of the resisting plate, and the mounting portion is formed by bending from the end of the bent portion in a direction away from the resisting plate, wherein the connecting plate is inserted therein. The card slot of the base forms a space for accommodating a wafer card between the connector and the holder. The portable electronic device of claim 6, wherein the base comprises an upper surface, and the conductive terminal comprises a fixing portion and a contact end bent by the fixing portion toward the upper surface, wherein the contact end is used for Electrically coupled to a wafer placed on the upper surface. The portable electronic device of claim 6, wherein the height of the mounting portion is substantially the same as the depth of the card slot.