TWI472978B - Touch panel - Google Patents
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- TWI472978B TWI472978B TW101136012A TW101136012A TWI472978B TW I472978 B TWI472978 B TW I472978B TW 101136012 A TW101136012 A TW 101136012A TW 101136012 A TW101136012 A TW 101136012A TW I472978 B TWI472978 B TW I472978B
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- 239000000758 substrate Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 230000008054 signal transmission Effects 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 241000699670 Mus sp. Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Description
本發明是有關於一種觸控面板,且特別是有關於一種電容式觸控面板。 The present invention relates to a touch panel, and more particularly to a capacitive touch panel.
近年來,隨著資訊技術、無線行動通訊和資訊家電的快速發展與應用,為了達到更便利、體積更輕巧化以及更人性化的目的,許多資訊產品已由傳統之鍵盤或滑鼠等輸入裝置,轉變為使用觸控面板(Touch Panel)作為輸入裝置。 In recent years, with the rapid development and application of information technology, wireless mobile communication and information appliances, many information products have been input devices such as traditional keyboards or mice for the purpose of being more convenient, lighter and more humanized. , changed to use a touch panel (Touch Panel) as an input device.
觸控面板依照感測形式的不同可大致上區分為電阻式觸控面板、電容式觸控面板、光學式觸控面板、聲波式觸控面板以及電磁式觸控面板。由於電容式觸控面板相較於其他類型的觸控面板具有反應時間快、可靠度佳以及解析度高(high definition)等優點,因此被廣泛的應用於各類手持電子裝置上。 The touch panel can be roughly classified into a resistive touch panel, a capacitive touch panel, an optical touch panel, an acoustic wave touch panel, and an electromagnetic touch panel according to different sensing forms. Since capacitive touch panels have advantages such as fast response time, good reliability, and high definition compared with other types of touch panels, they are widely used in various types of handheld electronic devices.
本發明提供一種觸控面板,其可提升訊號傳輸品質及感測的靈敏度。 The invention provides a touch panel, which can improve signal transmission quality and sensitivity of sensing.
本發明提出一種觸控面板,其包括一基板、多條導線、多個導墊、多條連接線、多個接地線以及多個虛擬墊。基板具有一第一表面。導線並排於第一表面上,並且分別 沿一第一方向延伸。導墊配置於第一表面上,其中任兩相鄰的導線之間具有N個導墊。連接線配置於第一表面上,並且分別連接導墊,其中位於第i條導線與第i+1條導線之間的第1~N個導墊分別連接第1~N條連接線。第1~N條連接線相互並排並且位於第1~N個導墊與第i+1條導線之間,且基板上的所有第j條連接線相互電性連接。j及i為正整數。接地線並排於第一表面上,並且分別沿第一方向延伸,其中第i條接地線位於第i+1條導線與其相應的第1~N條連接線之間。虛擬墊(dummy pads)配置於第一表面上,並且位於第i條導線與其相應的第1~N個導墊之間。 The invention provides a touch panel, which comprises a substrate, a plurality of wires, a plurality of guiding pads, a plurality of connecting lines, a plurality of grounding lines and a plurality of virtual pads. The substrate has a first surface. The wires are arranged side by side on the first surface and are respectively Extending in a first direction. The guiding pad is disposed on the first surface, wherein there are N guiding pads between any two adjacent wires. The connecting wires are disposed on the first surface, and are respectively connected to the guiding pads, wherein the first to N guiding pads between the ith wire and the (i+1)th wire are respectively connected to the first to N connecting wires. The first to Nth connecting lines are arranged side by side and are located between the first to Nth conductive pads and the i+1th conductive wires, and all the jth connecting wires on the substrate are electrically connected to each other. j and i are positive integers. The grounding wires are arranged side by side on the first surface and extend in the first direction, wherein the ith grounding wire is located between the (i+1)th wire and the corresponding first to Nth connecting wires. The dummy pads are disposed on the first surface and are located between the ith wire and its corresponding first to N conductive pads.
在本發明之一實施例中,上述之第1~N條連接線延伸至基板的同一側。 In an embodiment of the invention, the first to Nth connecting lines extend to the same side of the substrate.
在本發明之一實施例中,上述之觸控面板更包括一軟性電路板。軟性電路板設置於基板之同一側。第1~N條連接線分別電性連接至軟性電路板。 In an embodiment of the invention, the touch panel further includes a flexible circuit board. The flexible circuit board is disposed on the same side of the substrate. The first to Nth connecting wires are electrically connected to the flexible circuit board.
在本發明之一實施例中,上述之部分第1~N條連接線延伸至基板的第一側。另一部分之第1~N條連接線延伸至基板相對於第一側之一第二側。 In an embodiment of the invention, part of the first to N connection lines extend to the first side of the substrate. The other portion of the first to N connecting lines extends to the second side of the substrate relative to the first side.
在本發明之一實施例中,上述之觸控面板更包括一第一軟性電路板及一第二軟性電路板,第一及第二軟性電路板彼此電性相連,且分別設置於基板之第一側及相對於第一側之一第二側,部份第1~N條連接線分別電性連接至第一軟性電路板,剩下之第1~N條連接線分別電性連接至第 二軟性電路板。 In one embodiment of the present invention, the touch panel further includes a first flexible circuit board and a second flexible circuit board. The first and second flexible circuit boards are electrically connected to each other, and are respectively disposed on the substrate. One of the first to N connection lines is electrically connected to the first flexible circuit board, and the remaining 1 to N connection lines are electrically connected to the first side and the second side of the first side. Two flexible boards.
在本發明之一實施例中,上述之連接線的材料包括導電透明材料。 In an embodiment of the invention, the material of the connecting wire comprises a conductive transparent material.
在本發明之一實施例中,上述之導線的寬度相同。 In an embodiment of the invention, the wires have the same width.
在本發明之一實施例中,上述之導墊之尺寸相同。 In an embodiment of the invention, the pads are of the same size.
在本發明之一實施例中,上述之導墊之尺寸不相同。 In an embodiment of the invention, the size of the above-mentioned guide pads is different.
基於上述,本發明為了調整導線及相應之導墊之間的距離,將多個未參與電路佈局之虛擬墊設置於觸控面板上之導線及與其相應的導墊之間,以降低導線及對應之導墊間所產生的寄生電容對觸控品質的影響。並且,將虛擬墊設置於導線及對應之導墊之間,更可減少兩者之間因間距較大而導致觸控面板配置於背光模組上時有透光不均勻的情形產生。此外,本發明更將接地線設置於觸控面板上的導線與其相應的連接線之間,以降低兩相鄰且並排之導線間彼此干擾而導致訊號傳輸不良的問題。 Based on the above, in order to adjust the distance between the wires and the corresponding pads, a plurality of dummy pads not participating in the circuit layout are disposed between the wires on the touch panel and the corresponding pads to reduce the wires and corresponding The effect of the parasitic capacitance generated between the pads on the touch quality. Moreover, the virtual pad is disposed between the wire and the corresponding conductive pad, which can reduce the uneven transmittance between the two when the touch panel is disposed on the backlight module. In addition, the present invention further provides a grounding wire between the wires on the touch panel and its corresponding connecting wires to reduce the problem that the two adjacent and side-by-side wires interfere with each other and cause poor signal transmission.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.
圖1是依照本發明之一實施例之一種觸控面板的上視示意圖。請參考圖1,本實施例之觸控面板100包括一基板110、多條導線Ry1~Ryi、多個導墊Tx1~TxN、多條連接線CL1~CLN、多個接地線GL1~GLN以及多個虛擬墊160。導線Ry1~Ryi並排於基板110之一第一表面112上,並且 分別沿一第一方向D1延伸。導墊Tx1~TxN亦配置於第一表面112上。詳細而言,多個導墊Tx1沿一第二方向D2排列且分別由多條連接線CL1串接而形成一第一感測串列。同理,導墊Tx2、...TxN皆採用相同的佈局,以分別形成沿第二方向延伸之第二~第N感測串列,其中,第一方向D1垂直於第二方向D2。在此,觸控面板100之導線Ry1~Ryi與導墊Tx1~TxN的數量可相等,亦可為不等,本發明並不針對導線Ry1~Ryi與導墊Tx1~TxN的數量做限制。 1 is a top plan view of a touch panel in accordance with an embodiment of the present invention. Referring to FIG. 1 , the touch panel 100 of the present embodiment includes a substrate 110 , a plurality of wires Ry 1 to Ry i , a plurality of pads Tx 1 to Tx N , a plurality of connecting lines CL 1 to CL N , and a plurality of groundings. Lines GL 1 ~ GL N and a plurality of virtual pads 160. The wires Ry 1 to Ry i are juxtaposed on one of the first surfaces 112 of the substrate 110 and extend in a first direction D1, respectively. The pads Tx 1 ~Tx N are also disposed on the first surface 112. In detail, the plurality of pads Tx 1 are arranged along a second direction D2 and are respectively connected in series by a plurality of connecting lines CL1 to form a first sensing series. Similarly, the pads Tx 2 , . . . Tx N all adopt the same layout to respectively form second to Nth sensing series extending in the second direction, wherein the first direction D1 is perpendicular to the second direction D2 . Here, the number of the wires Ry 1 to Ry i of the touch panel 100 and the pads Tx 1 to Tx N may be equal or different, and the present invention is not directed to the wires Ry 1 to Ry i and the pads Tx 1 ~ The number of Tx N is limited.
如此,導線Ry1~Ryi與導墊Tx1~TxN交叉配置而達成面的感測。當使用者以手指接觸觸控面板100時,觸控面板100的導線Ry1~Ryi與導墊Tx1~TxN會在手指所接觸的位置上產生一電容的改變。觸控面板100便可由此電容上的改變而計算接觸點的座標並傳送至與其連接之電子裝置。一般而言,導線Ry1~Ryi及導墊Tx1~TxN若交錯地配置於不同平面上,將使觸控面板100產生視覺上的差異性,所以本實施例將導線Ry1~Ryi及導墊Tx1~TxN設置於同一平面上可以減少觸控面板100的厚度並增加穿透率。因此,當觸控面板100與一顯示面板整合為具有觸控功能的顯示器時,觸控面板100可以具有較好的光學性質。 In this manner, the wires Ry1 to Ryi are arranged to intersect the pads Tx1 to TxN to achieve surface sensing. When the user touches the touch panel 100 with a finger, the wires Ry1 R Ryi of the touch panel 100 and the pads Tx1 T TxN generate a change in capacitance at a position where the finger contacts. The touch panel 100 can calculate the coordinates of the contact point and transmit it to the electronic device connected thereto by the change in capacitance. In general, if the wires Ry 1 to Ry i and the pads Tx 1 to Tx N are alternately arranged on different planes, the touch panel 100 will be visually different. Therefore, the wires Ry 1 to Ry in this embodiment. The arrangement of the i and the pads Tx 1 to Tx N on the same plane can reduce the thickness of the touch panel 100 and increase the transmittance. Therefore, when the touch panel 100 and a display panel are integrated into a display having a touch function, the touch panel 100 can have better optical properties.
以下將針對圖1中相鄰之導線Ry1及導線Ry2及其間之元件對觸控面板100的結構配置做進一步舉例說明,然其結構配置模式並不僅適用於導線Ry1及導線Ry2之間,而適於延伸套用至整個觸控面板100。 The structural configuration of the touch panel 100 will be further exemplified for the adjacent wires Ry 1 and Ry 2 and the components therebetween in FIG. 1 , but the structural configuration mode is not only applicable to the wires Ry 1 and Ry 2 . And suitable for extending to the entire touch panel 100.
如圖1所示,兩相鄰的導線Ry1與導線Ry2之間具有N個導墊Tx1~TxN。連接線CL1~CLN配置於第一表面112上,並且分別連接導墊Tx1~TxN。換句話說,位於導線Ry1與導線Ry2之間的導墊Tx1~TxN分別連接至連接線CL1~CLN。連接線CL1~CLN相互並排並且位於導墊Tx1~TxN與導線Ry2之間,且基板110上的所有連接線CL1相互電性連接,以連接第二方向上之所有導墊Tx1而形成第一感測串列。同理,連接線CL2、...CLN皆可採用相同的佈局,以分別形成第二~第N感測串列。連接線CL1~CLN主要是用以將導線Ry1~Ryi與導墊Tx1~TxN中所產生的感測訊號傳輸至一控制電路以及將控制電路所輸出的控制訊號傳輸至導線Ry1~Ryi與導墊Tx1~TxN。 As shown in FIG. 1, there are N pads Tx 1 ~Tx N between two adjacent wires Ry 1 and Ry 2 . The connection lines CL 1 to CL N are disposed on the first surface 112 and are connected to the pads Tx 1 to Tx N , respectively . In other words, the pads Tx 1 to Tx N between the wires Ry 1 and the wires Ry 2 are connected to the connection lines CL 1 to CL N , respectively . The connecting lines CL 1 to CL N are arranged side by side and are located between the pads Tx 1 to Tx N and the wires Ry 2 , and all the connecting lines CL 1 on the substrate 110 are electrically connected to each other to connect all the pads in the second direction. Tx 1 forms a first sensing series. Similarly, the connecting lines CL 2 , . . . , CL N can all adopt the same layout to form the second to Nth sensing series, respectively. The connecting lines CL 1 ~CL N are mainly used for transmitting the sensing signals generated by the wires Ry 1 -Ry i and the pads Tx 1 -Tx N to a control circuit and transmitting the control signals output by the control circuit to the wires Ry 1 ~Ry i and the pad Tx 1 ~Tx N .
承上述,連接線CL1~CLN可延伸至觸控面板100之橋接區114,並透過橋接區114上之橋接元件將連接線CL1~CLN分別沿第二方向D2做電性連接,以分別形成上述之第一~第N感測串列。在本實施例中,觸控面板100包括一第一橋接區114及一第二橋接區116,分別位於基板110之相對兩側。觸控面板100更包括一第一軟性電路板170a及一第二軟性電路板170b,分別設置於第一橋接區114及第二橋接區116上,且第一性電路板170a及第二性電路板170b彼此電性連接。部分之連接線CL1~CLN電性連接至第一軟性電路板170a,而另一部份之連接線CL1~CLN則電性連接至第二軟性電路板170b。如此配置,由於所有連接線CL1~CLN分別連接至基板110相對兩側之 橋接區114、116,因此可大幅節省觸控面板100上的配線空間,進而縮小觸控面板100的體積。當然,本發明並不侷限於此。在本發明之其他實施例中,連接線CL1~CLN亦可全數連接至基板110之同一側上。其配置方式例如為設置一軟性電路板於觸控面板之一橋接區上,其中橋接區位於基板110之一側,再將連接線CL1~CLN電性連接至上述之軟性電路板上。 In the above, the connecting lines CL 1 ~CL N can be extended to the bridging area 114 of the touch panel 100, and the connecting lines CL 1 -CL N are electrically connected in the second direction D2 through the bridging elements on the bridging area 114, respectively. To form the first to Nth sensing series described above, respectively. In this embodiment, the touch panel 100 includes a first bridging region 114 and a second bridging region 116 respectively located on opposite sides of the substrate 110. The touch panel 100 further includes a first flexible circuit board 170a and a second flexible circuit board 170b disposed on the first bridging area 114 and the second bridging area 116, respectively, and the first circuit board 170a and the second circuit The plates 170b are electrically connected to each other. The part of the connecting lines CL 1 to CL N are electrically connected to the first flexible circuit board 170a, and the other part of the connecting lines CL 1 to CL N are electrically connected to the second flexible circuit board 170b. In this way, since all the connecting lines CL 1 to CL N are respectively connected to the bridge regions 114 and 116 on opposite sides of the substrate 110 , the wiring space on the touch panel 100 can be greatly saved, thereby reducing the volume of the touch panel 100 . Of course, the invention is not limited thereto. In other embodiments of the present invention, the connecting lines CL 1 to CL N may also be all connected to the same side of the substrate 110. For example, a flexible circuit board is disposed on one of the bridge areas of the touch panel, wherein the bridge area is located on one side of the substrate 110, and the connection lines CL 1 to CL N are electrically connected to the flexible circuit board.
在本實施例中,連接線CL1~CLN的材料為導電透明材料,例如為銦錫氧化物(Indium Tin Oxide,ITO)、銦鋅氧化物(Indium Zinc Oxide,IZO)、氧化鋁鋅(Al doped zinc oxide,AZO)或氧化銦(Indium Oxide)或上述之任意組合等。實際而言,在本實施例中,導線Ry1~Ryi的寬度相同,且導墊Tx1~TxN之尺寸亦相同。然而,本發明並不以此為限,在本發明之其他實施例中,導墊Tx1~TxN之尺寸亦可能不同,例如依據接觸面積(例如手指頭的大小)或感應的解析度的需求來進行調整。 In this embodiment, the material of the connecting lines CL 1 to CL N is a conductive transparent material, such as Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), and Alumina Zinc ( Al doped zinc oxide, AZO) or indium oxide (Indium Oxide) or any combination of the above. Actually, in the present embodiment, the widths of the wires Ry1 to Ryi are the same, and the sizes of the pads Tx1 to TxN are also the same. However, the present invention is not limited thereto. In other embodiments of the present invention, the dimensions of the pads Tx1 T TxN may also be different, for example, according to the contact area (such as the size of a finger) or the resolution of the sensing. Make adjustments.
承上述,在本實施例中,接地線GL1~GLi-1並排設置於第一表面112上,並且分別沿第一方向D1延伸。本實施例特將接地線GL1~GLi-1分別設置於導線與其相鄰的連接線之間,以降低導線與其相鄰的連接線間彼此產生電性干擾而導致訊號傳輸不良的問題。例如圖1所示,將接地線接地線GL1位於導線Ry2與其相應的連接線CL1~CLN之間,防止Ry2與其相應的連接線CL1~CLN間的訊號彼此干擾。 As described above, in the present embodiment, the ground lines GL 1 to GL i-1 are arranged side by side on the first surface 112 and extend in the first direction D1, respectively. In this embodiment, the grounding wires GL 1 to GL i-1 are respectively disposed between the wires and their adjacent connecting wires to reduce electrical interference between the wires and their adjacent connecting wires, resulting in poor signal transmission. For example as shown in FIG. 1, the ground line ground line GL 1 positioned between CL N ~ 1 Ry 2 wire connection line CL corresponding thereto, Ry 2 corresponding thereto to prevent the connection lines CL 1 - CL N between the signal interfere with each other.
此外,當導線Ry1~Ryi及相應之導墊Tx1~TxN間相距過近時,兩者間所產生之寄生電容會影響觸控面板的正常運作。因此,導線Ry1~Ryi及相應之導墊Tx1~TxN之間的距離必須調整至適當的間距。然而,若將導線Ry1~Ryi及相應之導墊Tx1~TxN之間的距離拉大,則可能導致製程困難以及觸控面板100有透光不均勻的情形產生。有鑑於此,本實施例將虛擬墊160設置於導線及與其相應的第1~N個導墊之間,以調整導線Ry1~Ryi及相應之導墊Tx1~TxN之間的距離,使觸控面板100保持正常運作,更可維持觸控面板100之透光均勻度。在此,虛擬墊160僅用以間隔導線Ry1~Ryi與對應之導墊Tx1~TxN,而未參與電路佈局。 In addition, when the wires Ry 1 to Ry i and the corresponding pads Tx 1 to Tx N are too close together, the parasitic capacitance generated between the two may affect the normal operation of the touch panel. Therefore, the distance between the wires Ry 1 to Ry i and the corresponding pads Tx 1 to Tx N must be adjusted to an appropriate pitch. However, if the distance between the wires Ry 1 to Ry i and the corresponding pads Tx 1 to Tx N is large, the process may be difficult and the touch panel 100 may have uneven light transmission. In view of this, in the embodiment, the dummy pad 160 is disposed between the wire and the corresponding first to Nth conductive pads to adjust the distance between the wires Ry 1 to Ry i and the corresponding pads Tx 1 to Tx N . The touch panel 100 is kept in normal operation, and the uniformity of light transmission of the touch panel 100 can be maintained. Here, the dummy pad 160 is only used to separate the wires Ry 1 -Ry i and the corresponding pads Tx 1 -Tx N without participating in the circuit layout.
綜上所述,本發明為了調整導線及相應之導墊之間的距離,將多個未參與電路佈局之虛擬墊設置於觸控面板上之導線及與其相應的導墊之間,以降低導線及對應之導墊間所產生的寄生電容對觸控品質的影響。並且,將虛擬墊設置於導線及對應之導墊之間,更可減少兩者之間因間距較大而導致觸控面板配置於背光模組上時透光不均勻的情形產生。此外,本發明更將接地線設置於觸控面板上之導線與其相應的連接線之間,以降低兩相鄰且並排之導線間彼此干擾而導致訊號傳輸不良的問題。 In summary, in order to adjust the distance between the wires and the corresponding pads, a plurality of dummy pads not participating in the circuit layout are disposed between the wires on the touch panel and the corresponding pads to reduce the wires. And the influence of the parasitic capacitance generated between the corresponding pads on the touch quality. Moreover, the virtual pad is disposed between the wire and the corresponding conductive pad, which can reduce the uneven transmittance between the two when the touch panel is disposed on the backlight module. In addition, the present invention further provides a grounding wire between the wires on the touch panel and its corresponding connecting lines to reduce the problem that the two adjacent and side-by-side wires interfere with each other and cause poor signal transmission.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. this The scope of the invention is defined by the scope of the appended claims.
100‧‧‧觸控面板 100‧‧‧ touch panel
110‧‧‧基板 110‧‧‧Substrate
112‧‧‧第一表面 112‧‧‧ first surface
114、116‧‧‧橋接區 114, 116‧‧‧ Bridge area
Ry1~Ryi‧‧‧導線 Ry 1 ~Ry i ‧‧‧ wire
Tx1~TxN‧‧‧導墊 Tx 1 ~Tx N ‧‧‧ Guide pad
CL1~CLN‧‧‧連接線 CL 1 ~CL N ‧‧‧Connecting line
GL1~GLi-1‧‧‧接地線 GL 1 ~GL i-1 ‧‧‧ Grounding wire
160‧‧‧虛擬墊 160‧‧‧Virtual mat
170a‧‧‧第一軟性電路板 170a‧‧‧First flexible circuit board
170b‧‧‧第二軟性電路板 170b‧‧‧Second flexible circuit board
D1‧‧‧第一方向 D1‧‧‧ first direction
D2‧‧‧第二方向 D2‧‧‧ second direction
圖1是依照本發明之一實施例之一種觸控面板的上視示意圖。 1 is a top plan view of a touch panel in accordance with an embodiment of the present invention.
100‧‧‧觸控面板 100‧‧‧ touch panel
110‧‧‧基板 110‧‧‧Substrate
112‧‧‧第一表面 112‧‧‧ first surface
114、116‧‧‧橋接區 114, 116‧‧‧ Bridge area
Ry1~Ryi‧‧‧導線 Ry 1 ~Ry i ‧‧‧ wire
Tx1~TxN‧‧‧導墊 Tx 1 ~Tx N ‧‧‧ Guide pad
CL1~CLN‧‧‧連接線 CL 1 ~CL N ‧‧‧Connecting line
GL1~GLi-1‧‧‧接地線 GL 1 ~GL i-1 ‧‧‧ Grounding wire
160‧‧‧虛擬墊 160‧‧‧Virtual mat
170a‧‧‧第一軟性電路板 170a‧‧‧First flexible circuit board
170b‧‧‧第二軟性電路板 170b‧‧‧Second flexible circuit board
D1‧‧‧第一方向 D1‧‧‧ first direction
D2‧‧‧第二方向 D2‧‧‧ second direction
Claims (9)
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CN102929464B (en) * | 2012-11-08 | 2016-02-03 | 敦泰科技有限公司 | A kind of touch panel device and touch-screen body thereof |
KR101655410B1 (en) | 2014-08-26 | 2016-09-07 | 엘지디스플레이 주식회사 | In-cell Touch type liquid crystal display device |
CN106502443B (en) * | 2015-09-08 | 2019-03-08 | 和鑫光电股份有限公司 | Touch control component and touch control display module |
CN107831940B (en) * | 2017-11-16 | 2020-10-23 | 业成科技(成都)有限公司 | Touch device with electrostatic protection capability |
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CN101881899B (en) * | 2009-05-08 | 2011-11-02 | 义强科技股份有限公司 | Liquid crystal display |
TW201145103A (en) * | 2010-06-04 | 2011-12-16 | Wei-Chuan Chen | Manufacturing method of touch panel |
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US8487898B2 (en) * | 2008-04-25 | 2013-07-16 | Apple Inc. | Ground guard for capacitive sensing |
JP4720857B2 (en) * | 2008-06-18 | 2011-07-13 | ソニー株式会社 | Capacitance type input device and display device with input function |
WO2010084642A1 (en) * | 2009-01-26 | 2010-07-29 | シャープ株式会社 | Touch panel incorporated into display device |
US9495042B2 (en) * | 2009-04-14 | 2016-11-15 | Atmel Corporation | Two-dimensional position sensor |
CN101694605B (en) * | 2009-10-27 | 2012-10-03 | 友达光电股份有限公司 | Touch panel |
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