TWI471577B - Testing socket for bga chip - Google Patents

Description

BGA chip test fixture

The present invention discloses a test fixture suitable for a BGA (Ball Grid Array) wafer, which is composed of a test fixture combined with a test fixture. The test master is a traditional test fixture. The test fixture is a "mobile positioning frame", and two different sizes of BGA chips can be tested in succession.

Figure 1. is a technical block diagram of the prior art.

A test fixture of the prior art can only test a single size BGA wafer. When two BGA wafers with different lengths*width need to be tested, it is necessary to separately make a specific test fixture to be used separately. The test fixture includes a positioning grid, a test unit, and corresponding test software.

1 shows a test software 1, a test unit 1, which cooperates with a positioning grid 1 to form a test fixture 1 for testing a first BGA wafer; the first BGA wafer has a first size. The test software 2, the test unit 2, and the positioning grid 2 cooperate to form the test fixture 2 for testing the second BGA wafer; the second BGA wafer has a second size smaller than the first size. The test software N, the test unit N, and the positioning grid N cooperate to form a test fixture N for testing the Nth BGA wafer; the Nth sheet BGA wafer has an Nth dimension smaller than the size of the N-1th sheet.

In other words, the first BGA wafer and the second BGA wafer have different lengths*width, and when the first BGA wafer needs to be tested, a dedicated test fixture 1 needs to be prepared for use. When it is necessary to test the second BGA wafer, it is necessary to separately prepare a dedicated test fixture 2 for use; at this time, the test fixture 1 cannot be used to test the second BGA wafer. This has led to a much larger budget for wafer test shops in the production of test fixtures; at the same time, the cost of storage, shipping, test replacement, etc. has increased. A universal tool that can be used for testing different sizes of chips and is extremely ready for development.

Figure 2 is a prior art test fixture

2 shows a conventional test fixture having a base 21 with a positioning grid 22 disposed in the center of the base 21, each mesh length of the positioning grid 22 being slightly larger than the diameter of a single metal ball below the BGA wafer. A metal ball gate array under the BGA wafer is provided for one-to-one placement; the metal balls under the BGA wafer can be snapped into the corresponding meshes of the positioning grid 22, and the BGA chip is fixed when the upper cover 23 of the test fixture is pressed down. After positioning, the BGA wafer test can be performed.

FIG. 3A is a prior art test wafer 40*40

3A shows a cross-sectional view of a conventional test fixture having a base 21 having an opening 25 in the center, the opening 25 being sized to correspond to the size of the wafer 40*40; and a positioning grid 22 disposed within the opening 25. The mesh of the positioning grid 22 provides a metal ball 41 for fastening under the wafer 40*40, and the wafer 40*40 has a 40*40 matrix metal ball gate under the wafer (only the metal ball is shown in the figure, According to the actual number). There is a corresponding elastic probe 24 in each mesh. When the upper cover 23 of the test fixture is pressed and fixed, the elastic probe 24 extends upward and is electrically coupled to the corresponding metal ball 41. The lower end of the resilient probe 24 is electrically coupled to the test unit 40, and the test software is electrically coupled to the test unit 40 for use in providing the test wafer 40*40.

FIG. 3B is a prior art test wafer 30*30

3B shows the test fixture having a base 21B having an opening 25B in the center, the size of the opening 25B being designed to correspond to the size of the wafer 30*30; and a positioning grid 22B disposed in the opening 25B. The mesh of the positioning grid 22B is provided for securing the metal ball 41B under the wafer 30*30, and the wafer 30*30 is a metal ball arranged in a matrix of 30*30 under the wafer (only the metal ball is illustrated in the figure, and is not based on The actual number is expressed). There is one elastic probe 24B in each mesh. When the upper cover 23 of the test fixture is pressed down, the elastic probe 24B extends upward and is electrically coupled to the corresponding metal ball 41B. The lower end of the elastic probe 24B is electrically coupled to the test unit 30, and the test software 302 is electrically coupled to the test unit 30 for use in providing the test wafer 30*30. 3A-3B show the test of the wafer 40*40 and the test of the wafer 30*30. Since the test fixtures used have different sizes and different test units, it is necessary to separately use a dedicated test fixture, and it is not possible to share a fixture.

The technique first uses a specially designed "moving positioning frame" as a test sub-tool, which can be placed above the positioning grid of the test master to define a smaller grid area, and can provide a smaller size BGA chip. Test.

Figure 4 is a technical block diagram of the present technology

The figure shows a single test master of the art that can test at least two different sizes of BGA wafers. When a first piece of BGA wafer having a different length*width and a second piece of BGA wafer need to be tested, it is not necessary to separately make a dedicated test fixture. This test tool consists of a test fixture and a test fixture. The test master includes a positioning grid, test units, and multiple sets of test software. The test fixture is a mobile positioning frame.

Figure 4 shows the test fixtures 1~N, which cooperate with a single test unit and a single positioning grid to form the test fixture of the present technology. A single fixture, used in conjunction with the first mobile positioning frame, can be used to test the first BGA wafer; with the use of the second mobile positioning frame, it can be used to test the second BGA wafer; and so on. With the use of the Nth mobile positioning frame, it can be used to test the Nth BGA wafer.

5A-5C are embodiments of the present technology

FIG. 5A shows a test master 200 having a base 21. The base 21 is provided with a first positioning grid 22 at the center. The length and width of the first positioning grid 22 are designed to match the length and width of the first BGA wafer. The first BGA wafer placement test.

Figure 5B shows the test tool of the present technology

The test fixture of the present technology is a mobile positioning frame 50; the test fixture (mobile positioning frame) 50 can be placed above the base 21 of the test fixture 200. The lower layer of the test sub-tool (moving positioning frame) 50 has a positioning opening 52; the positioning opening 52 is smaller than the area size of the first positioning grid 22; when the test sub-tool (moving positioning frame) 50 is placed in the first positioning Above the grid 22, the locating opening 52 locates a second area of the smaller area of the second BGA wafer placement test for a smaller size.

The structure of the test sub-tool (moving positioning frame) 50 includes: a lower frame plate 51 having a positioning opening 52 in the center; an upper layer opening 53 having an upper opening in the center, which is larger than the positioning opening 52; The plate 54 connects the lower frame plate 51 and the upper frame plate 53.

Figure 5C is a cross-sectional view of the test sub-tool (mobile positioning frame)

The test sub-frame (moving positioning frame) lower frame plate 51 has a positioning opening 52 in the center; the upper frame plate 53 has an upper opening 52B in the center, the upper opening 52B is larger than the positioning opening 52; and the connecting slanting plate 54 is connected to the The lower frame plate 51 and the upper frame plate 53.

Figure 6 is a combination of the mother and child jig of the present technology

6 is a view of the test sub-assembly (moving positioning frame) 50 of FIG. 5B disposed above the base 21 of the test fixture 200 of FIG. 5A, and the test sub-tool (moving positioning frame) 50 defines a smaller second. Grid area 22B. The first mesh region 22 of FIG. 5A is designed according to the length and width of the first BGA wafer, and can be placed for use in the first BGA wafer test; the second mesh region 22B of FIG. 6 is based on the length and width of the second BGA wafer. Designed to be placed in a second BGA wafer test. The length and width of the second BGA are at least one side smaller than the length or width of the first BGA wafer. Thus, a single test master can be tested with a test sub-tool (moving positioning frame) 50 to test a smaller second BGA wafer. And so on, the smaller size of the third BGA wafer only needs to prepare the corresponding test piece (moving positioning frame) 50, so that the same test tool can be used together without separately preparing a special test fixture. .

Figure 7-8 is a schematic diagram of the test of the present technology

Figure 7 shows the test of the first BGA wafer.

(a) preparing a first BGA wafer 40*40;

(b) preparing a second BGA wafer 30*30, the area being smaller than the first BGA chip;

(c) preparing a test master 200 having a first mesh area;

(d) placing said first BGA wafer in said first grid region;

(e) selecting the corresponding test software 402 to test;

Next, Figure 8 shows the test of the second BGA wafer:

(f) taking out the first BGA wafer 40*40;

(g) placing a test sub-tool (mobile positioning frame) 50 above the test fixture 200;

(h) placing said second BGA wafer 30*30 in said smaller second grid region;

(i) Select the corresponding test software 302 and test it.

9A-9B are the test frame positioning of the test tool of the present technology.

9A shows the positioning of the test fixture in the prior art. The first mesh area 222 of the test fixture 200 has a frame edge 28 around the first mesh area 222. The first mesh area 222 is slightly larger than the size of the BGA wafer 100C to be tested. Region 222 is only suitable for placement of BGA wafer 100C. Figure 9B shows that the BGA wafer 100C is placed just in the first grid region 222, awaiting testing.

10A-10B are frame edge positioning of the test sub-tool of the prior art

FIG. 10A shows the frame edge positioning of the test fixture of the present technology. After the test fixture (moving positioning frame) 50 is placed over the first positioning grid 22 of the test fixture 200, the test fixture (moving positioning frame) 50 The positioning opening 52 defines a smaller second mesh area 222B. The second grid region 222B is slightly larger than the size of the BGA wafer 200C, and the second grid region 222B is only suitable for placement of the BGA wafer 200C to be tested. Figure 10B shows that the BGA wafer 200C is placed just in the second grid region 222B, awaiting testing.

11A-11B are the positioning of the auxiliary positioning pile of the test master of the present technology.

11A shows the use of the auxiliary positioning post 60 of the test fixture 200 of the present technology. The first mesh area 222 is larger than the size of the BGA wafer 300C to be tested, and the L-shaped auxiliary positioning post 60 is inserted in the first mesh area 222, L. The shape assisted positioning post 60 cooperates with the lower right corner of the frame 28 to define a smaller third mesh area 32B; the third mesh area 32B fits the size of the BGA wafer 300C, and the L shape assists the positioning pile 60 above and the left space 66, It is convenient for placing and removing the BGA wafer 300C. Figure 11B shows that the BGA wafer 300C is placed just in the third grid region 32B, awaiting testing.

12A-12B are the positioning of the auxiliary positioning pile of the test tool of the prior art.

Figure 12A shows the positioning of the auxiliary positioning post 60 of the test sub-assembly 50 of the prior art. After the test sub-assembly (moving positioning frame) 50 is placed on the first positioning grid 22 of the test fixture 200, the test sub-tool (mobile) The positioning opening 52 of the positioning frame 50 defines a smaller second mesh area 222B. The second mesh area 222B is larger than the size of the BGA wafer 400C to be tested. The L-shaped auxiliary positioning pile 60 is inserted in the first mesh area 222B, and the L-shaped auxiliary positioning pile 60 is matched with the lower right corner of the frame 51B to define a smaller number. The three mesh regions 322B; the third mesh regions 322B fit the size of the BGA wafer 400C, and the L shape assists the upper and left spaces 66 of the post 60 to facilitate the placement and removal of the BGA wafer 400C. Figure 12B shows that the BGA wafer 400C is placed just in the fourth grid region 322B, awaiting testing.

The above description of the preferred embodiments and the drawings are intended to be illustrative of the preferred embodiments of the invention The present invention is intended to be within the scope of the applicant's scope of the invention.

200. . . Test master

21, 21B. . . Pedestal

22,22B. . . Positioning grid

twenty three. . . Upper cover

24,24B. . . Elastic probe

25,25B. . . space

41, 41B. . . Metal ball

30,40. . . Test unit

302,402. . . Test software

50. . . Test tool (mobile positioning frame)

51. . . Lower frame board

52. . . Opening

53. . . Upper frame board

54. . . Connecting sloping plate

100C, 200C, 300C, 400C. . . BGA chip

222,222B,32B,322B,. . . Grid area

Figure 1. is a technical block diagram of the prior art.

Figure 2 is a prior art test fixture

FIG. 3A is a prior art test wafer 40*40

FIG. 3B is a prior art test wafer 30*30

Figure 4 is a technical block diagram of the present technology

5A-5C are embodiments of the present technology

Figure 6 is a combination of the mother and child jig of the present technology

Figure 7-8 is a schematic diagram of the test of the present technology

9A-9B are the test frame positioning of the test tool of the present technology.

10A-10B are frame edge positioning of the test sub-tool of the prior art

11A-11B are the positioning of the auxiliary positioning pile of the test master of the present technology.

12A-12B are the positioning of the auxiliary positioning pile of the test tool of the prior art.

50. . . Test tool (mobile positioning frame)

51. . . Lower frame board

52. . . Opening

53. . . Upper frame board

54. . . Connecting sloping plate

Claims (7)

A test fixture for a BGA wafer, comprising: a test fixture having a first grid region for providing a first BGA wafer to be tested for placement; a test unit disposed under the test fixture; having an elastic probe, In the test, electrically coupled to the BGA wafer; and the test sub-assembly having a positioning opening; the positioning opening is smaller than the first mesh area; when the test sub-tool is placed in the a first mesh region defining a second BGA wafer placement test for testing a smaller size to be tested; wherein the first mesh region and the second mesh region are Separate different usage areas on the same grid. The test fixture of the BGA chip of claim 1, further comprising: a first test software selectively electrically coupled to the test unit; used in the first BGA wafer test; and The second test software is selectively electrically coupled to the test unit; used in the second BGA wafer test. The test fixture of the BGA wafer according to claim 1, wherein the test sub-assembly comprises: a lower frame plate having a positioning opening; and an upper frame plate having an upper opening, which is larger than the positioning opening And a swash plate connecting the lower frame plate and the upper frame plate. The test fixture of the BGA chip according to claim 1, further comprising: an auxiliary positioning pile, which can be inserted in the grid area and cooperate with the corner of the frame to define a third grid area. The auxiliary positioning pile according to item 4 of the patent application scope has an L shape. A method for testing a BGA wafer, comprising: (a) preparing a first BGA wafer; (b) preparing a second BGA wafer having a smaller size than the first BGA wafer; and (c) preparing a test fixture having a first grid a region; (d) placing the first BGA wafer in the first grid region; (e) selecting a corresponding test software test; (f) removing the first BGA wafer; (g) placing a test sub-assembly over the test master to define a second mesh region; Place the second BGA wafer in the second grid region; and (i) select the corresponding test software and test it. A method for testing a BGA wafer, comprising: (a) preparing a first BGA wafer; (b) preparing a second BGA wafer having a smaller size than the first BGA wafer; and (c) preparing a test fixture having a first grid a region; (d) placing the first BGA wafer in the first grid region; (e) selecting a corresponding test software test; (f) removing the first BGA wafer; (g) The test sub-assembly is placed above the test master to define a second grid area; (h) the auxiliary positioning pile is inserted in the second grid area, and the frame corner of the test sub-tool is defined a three-grid region; (i) placing the second BGA wafer in the third grid region; and (j) selecting a corresponding test software for testing.