TWI471505B - Semiconductor light source device - Google Patents

Description

Semiconductor light source device

The present invention relates to a light source device, and more particularly to a semiconductor light source device.

With the advancement of optical technology, various optical products have been developed. The development of optical products mainly has several directions, including the technology of the light source system, the technology of the light guiding system, and the technology of the image capturing system.

Some of these optical products combine the above various types of technologies, such as optical systems such as endoscopes or microscopes, which require the development of integrated light source systems, light guiding systems, and image capturing systems, which are quite complex.

Due to the high complexity of this type of optical product, many technical bottlenecks hinder the development of the industry. Researchers are committed to investing in technical research in this area to promote industrial development.

According to an embodiment of the present invention, a semiconductor light source device is proposed. The semiconductor light source device includes a light guiding element, at least one semiconductor light source component, and at least one light shape conversion coupler. The light conversion coupler is disposed between the semiconductor light source assembly and the light guide member to guide the light of the semiconductor light source assembly to the light guide member. The light conversion coupler has a slope and a curved surface, and the slope is a multi-step slope having a plurality of slopes.

In order to better understand the above and other aspects of the present invention, the following specific embodiments, together with the drawings, are described in detail below:

First embodiment

Please refer to FIGS. 1 to 2 for a schematic view of the semiconductor light source device 1000 of the first embodiment. The semiconductor light source device 1000 is, for example, an endoscope or a microscope. The semiconductor light source device 1000 includes a light guide 110, at least one semiconductor light source assembly 120, at least one light shape conversion coupler 130, and a control unit 140. The light guiding element 110 is used to transmit light, such as an optical fiber. The semiconductor light source component 120 is a light source made of a semiconductor material, for example, composed of a light emitting diode (LED), or a laser diode (LD), or a plurality of light emitting diodes. It consists of, or consists of, a plurality of laser diodes or a combination of at least one light-emitting diode and at least one laser diode. The light shape conversion coupler 130 is used to guide the projection direction of the light, for example, composed of a transparent material or a reflective material. The control unit 140 is configured to control the semiconductor light source component 120, such as a control chip, a firmware circuit, or a storage medium storing a plurality of sets of code.

In the case of light guiding element 110, light guiding element 110 can be a single solid fiber, a bundle of fibers, or a combination thereof. The material of the light guiding element 110 may be glass, quartz or plastic. Light guiding element 110 can be soft or rigid.

In the case of the semiconductor light source assembly 120, the semiconductor light source assembly 120 is disposed on the substrate 150, which can provide the power and heat dissipation functions required by the semiconductor light source assembly 120.

Referring to the embodiments of FIGS. 3A-3E, various angle diagrams of the light transforming coupler 130 of the first embodiment are shown. In the case of the light conversion coupler 130, the light conversion coupler 130 is disposed between the semiconductor light source assembly 120 and the light guide member 110 to refract or reflect the light of the semiconductor light source assembly 120 to the light guide member 110. The light shape conversion coupler 130 has a slope 131 and a curved surface 132. The slope 131 and the curved surface 132 are used to reflect the light of the semiconductor light source assembly 120. The curved surface 132 can be a spherical surface, an elliptical spherical surface, or a paraboloid. Taking the 3A to 3E drawings as an example, the light-shaped conversion coupler 130 has four inclined faces 131, one curved surface 132, and the curved surface 132 is an elliptical spherical surface. The light-shaped conversion coupler 130 is not limited to the design of the 3A to 3E drawings, and the projection direction of the light guided by the semiconductor light source unit 120 (shown in FIG. 2) can be refracted or reflected, without departing from the present case. The technical scope. In other embodiments, the light profile conversion coupler 130 may have only a bevel or curved surface design, and is not limited to the design of the embodiment of FIGS. 3A-3E.

The light shape conversion coupler 130 has a first end surface 133 and a second end surface 134. In the embodiment illustrated in FIG. 2, the first end surface 133 is a light input end surface, and the second end surface 134 is a light output end surface. The first end surface 133 is substantially identical in shape to the semiconductor light source assembly 120 (shown in FIG. 2), such as a square shape. The shape of the second end surface 134 and the cross section of the light guiding element 110 (shown in FIG. 2) are substantially the same, for example, circular.

Referring to the embodiment of FIG. 2, the first end surface 133 of the light conversion coupler 130 can maintain a gap with the semiconductor light source assembly 120 or be in close contact with the semiconductor light source assembly 120. In the present embodiment, the gap between the first end surface 133 of the light transforming coupler 130 and the semiconductor light source assembly 120 is less than or equal to 0.5 mm. The second end face 134 of the light profile conversion coupler 130 can then maintain a gap with the light guide element 110 or abut against the light guide element 110.

Referring to the embodiment of FIG. 4, an optical path diagram of the light transforming coupler 130 of the first embodiment is shown. The light emitted by the semiconductor light source unit 120 is reflected by the inclined surface 131 or the curved surface 132 (shown in FIGS. 3A to 3E) of the light conversion coupler 130, and then guided to the light guiding element 110. For example, the semiconductor light source assembly 120 of the present embodiment is square, and the light guiding member 110 has a circular cross section. The angle at which the light guiding element 110 can receive is within a certain range. The maximum acceptance angle θ _{f of the} light guiding element 110 is related to its numerical aperture (NA). The maximum emission angle of the light emitted by the semiconductor light source assembly 120 is θ _s . The light of the semiconductor light source assembly 120 having a large angle cannot satisfy the receiving range of the light guiding element 110. By using the inclined surface 131 or the curved surface 132 (shown in FIGS. 3A-3E) having a certain slope on the light-shaped conversion coupler 130, the light can be changed through the above-mentioned inclined surface 131 or curved surface 132, and the angle of travel is changed to enter. The input end face of the light guiding member 110 is such that the incident angle thereof satisfies the receiving angle of the light guiding member 110.

If the maximum emission angle θ _{s of the} semiconductor light source component 120 is less than the maximum acceptance angle θ _{f of the} light guiding element 110, the slope of the slope 131 can be designed according to the formula (1):

D *tan θ _c = L _f - L _s .......................................(1)

Where θ _c is the angle between the inclined surface 131 and the central axis L1, D is the length of the inclined surface 131 projected to the central axis L1, L _f is the radius of the light guiding element 110, and L _s is half of the side length of the semiconductor light source component 120.

If the maximum emission angle θ _{s of the} semiconductor light source component 120 is greater than the maximum acceptance angle θ _{f of the} light guiding element 110, the slope of the slope 131 can be designed according to the formula (2):

|θ _s -2×θ _c |≦θ _f , D*tan θ _c ≦L _f -L _s ...............(2)

Referring to the embodiment of FIG. 5, an optical path diagram of the light transforming coupler 130a of another embodiment is shown. In an embodiment, the slope 131a of the light transforming coupler 130a may be a multi-step bevel having a plurality of slopes, and the curved surface (not shown) may also be a multi-step curved surface having a plurality of slopes. For example, the slope 131a of the light transforming coupler 130a can be designed according to the formula (3):

D ₁ *tan θ _{c ,1} + D ₂ *tan θ _{c ,2} L _f - L _s , θ _{c , 2} θ _{c , 1} .........(3)

Wherein D ₁ is the length of the first-order inclined surface 131a1 projected to the central axis L1a, D ₂ is the length of the second-order inclined surface 131a2 projected to the central axis L1a, and θ _{c , 1} is the angle between the first-order inclined surface 131a1 and the central axis L1a, θ _{c , 2} is the angle between the second stepped slope 131a2 and the central axis L1a.

The above description is made by taking only the single-step bevel 131 and the second-order bevel 131a as an example. However, a similar design can be extended to a multi-step or multi-order surface.

Referring to the embodiments of FIGS. 6A-6C, FIGS. 6A-6B are schematic views showing two semiconductor light source devices 1000b and 1000c, and FIG. 6C is a schematic view showing the semiconductor light source device 1000 of the present embodiment. As shown in FIG. 6A, the semiconductor light source assembly 120b can be directly coupled to the light guiding element 110b. As shown in FIG. 6B, the light of the semiconductor light source unit 120c can be guided to the light guiding element 110c through the mirror 161c and the collecting lens 162c. Referring to Table 1, the light guiding efficiency of the light guiding element 110 of the present embodiment is the best.

In addition, referring to the embodiments of FIGS. 7A-7B, embodiments of the shapes of the semiconductor light source assemblies 120e, 120f are illustrated. In the embodiment of FIG. 7A, the semiconductor light source assembly 120e may be square; in the embodiment of FIG. 7B, the semiconductor light source assembly 120f may be circular.

Referring to the embodiments of FIGS. 8A-8B, an embodiment of the number of semiconductor light source assemblies 120g, 120h is illustrated. In the embodiment of FIG. 8A, the number of semiconductor light source assemblies 120g may be one; in the embodiment of FIG. 8B, the number of semiconductor light source assemblies 120h may be plural and arranged in an array.

Referring to the embodiments of Figures 9A-9D, an embodiment of the colors of the semiconductor light source assemblies 120i, 120j, 120k, 120m, 120n, 120p is illustrated. In the embodiment of FIG. 9A, the semiconductor light source component 120i may be composed of a light emitting diode and a phosphor powder, for example, a combination of a blue light emitting diode and a YAG phosphor, or an ultraviolet light emitting diode. Combination of RGB phosphor powder, or combination of UV light emitting diode and BY phosphor powder. In the embodiment of FIG. 9B, the semiconductor light source assembly 120j may be composed of two light emitting diodes 120j1, 120j2. The colors of the light-emitting diodes 120j1, 120j2 may be binary complementary colors such as blue light and yellow light. In the embodiment of FIG. 9C, the semiconductor light source assembly 120k may be composed of three light emitting diodes 120k1, 120k2, and 120k3. The colors of the light-emitting diodes 120k1, 120k2, and 120k3 may be ternary complementary colors such as blue light, green light, and red light. In the embodiment of FIG. 9D, the semiconductor light source component 120m may be composed of four light emitting diodes 120m1, 120m2, 120m3, and 120m4, and the colors of the light emitting diodes 120m1, 120m2, 120m3, and 120m4 may be ternary complementary colors. With a wide range of colors, such as blue, green, red and blue-green.

Referring to the embodiments of FIGS. 10A-10B, an embodiment of the color temperature of the semiconductor light source assemblies 120n, 120p is illustrated. The semiconductor light source component 120n can be composed of two light emitting diodes 120n1 and 120n2. The light emitting diode 120n1 is a low color temperature white light, and the light emitting diode 120n2 is a blue light. The combination of the two can improve the color temperature of the output. The semiconductor light source assembly 120p may be composed of two light emitting diodes 120p1, 120p2. The light-emitting diode 120p1 is a high color temperature white light, and the light emitting diode 120p2 is a red light, and the combination of the two can reduce the color temperature of the output. By the combination of the above, the ratio of blue light to low color temperature white light is adjusted, or the ratio of red light to high color temperature white light is adjusted, and the output color or color temperature can be changed. In another embodiment, the semiconductor light source components 120n, 120p may be respectively combined with a blue light emitting diode or a red light emitting diode by white light emitting diodes having the same color temperature, so that the semiconductor light source component 120n has a higher Color temperature, semiconductor light source assembly 120p has a lower color temperature

As described above, the semiconductor light source device 1000 can adopt any of the designs of FIGS. 9B to 10B. The control unit 140 can individually control the ratio of the illumination of the semiconductor light source components 120j, 120k, 120m, 120n, 120p to change the color and color temperature presented.

Second embodiment

Please refer to FIG. 11 , which is a schematic diagram of a semiconductor light source device 2000 according to a second embodiment. The semiconductor light source device 2000 of the present embodiment is different from the semiconductor light source device 1000 of the first embodiment in that it is transmitted through the beam splitter group 270. The light of a plurality of semiconductor light source assemblies 220 (e.g., semiconductor light source assemblies 220a, 220b, 220c) is used, and the rest are not repeated.

As in the embodiment shown in Fig. 11, the number of semiconductor light source assemblies 220a, 220b, 220c is plural, and the number of the light conversion couplers 230 is plural. The beam splitter group 270 is disposed between the light shape conversion coupler 230 and the light guide element 210, and the beam splitter group 270 is used to mix the light of the semiconductor light source assemblies 220a, 220b, and 220c.

Taking the embodiment of Fig. 11 as an example, the beam splitter group 270 includes dichroic mirrors 271, 272. The beamsplitters 271, 272 may be arranged in a crisscross pattern or in a misaligned arrangement. The beam splitters 271 and 272 are transparent substrates, and the material thereof may be plastic, glass or optical crystals, and the optical film is coated thereon, and the light of different wavelength ranges may be transmitted or reflected to allow light to pass or turn the light traveling direction. .

The light of the semiconductor light source unit 220b located on the left side can pass through the two beam splitters 271 and 272. The light of the semiconductor light source unit 220a located on the upper side is reflected by the beam splitter 271, and the light of the semiconductor light source unit 220c located at the lower side is split by the beam splitter. The reflection of 272 causes the light of the three semiconductor light source assemblies 220a, 220b, 220c to be mixed by the beam splitter group 270.

The control unit 240 is electrically connected to the semiconductor light source assemblies 220a, 220b, and 220c, respectively, to control the brightness of the semiconductor light source assemblies 220a, 220b, and 220c, respectively. When the semiconductor light source components 220a, 220b, and 220c are in different colors, different brightness ratios may be mixed for different mixed colors. When the semiconductor light source components 220a, 220b, and 220c adopt different color temperatures, different brightness ratios may be mixed to different mixed color temperatures.

Third embodiment

Referring to FIG. 12, a schematic diagram of a semiconductor light source device 3000 of a third embodiment is shown. The semiconductor light source device 3000 of the present embodiment is different from the semiconductor light source device 1000 of the first embodiment in the design of the light-shaped conversion coupler 330, and the rest of the same points will not be repeatedly described.

As in the embodiment illustrated in Fig. 12, the number of semiconductor light source assemblies 320 is plural, such as semiconductor light source assemblies 320a, 320b. The light conversion coupler 330 has a plurality of first end faces 333 and a second end face 334. In the embodiment illustrated in FIG. 12, the first end surface 333 is a light input end surface, and the second end surface 334 is a light output end surface. Each of the first end faces 333 corresponds to one of the semiconductor light source assemblies 320a, 320b. The shapes of the first end faces 333 are substantially the same as the shapes of the semiconductor light source assemblies 320a, 320b, such as square or circular. The shape of the second end face 334 is substantially the same as the cross section of the light guiding member 310, such as a square or a circle.

The control unit 340 is electrically connected to the semiconductor light source assemblies 320a, 320b, respectively, to control the brightness of the semiconductor light source assemblies 320a, 320b, respectively. When the semiconductor light source components 320a, 320b are of different colors, different brightness ratios may be mixed for different mixed colors. When the semiconductor light source components 320a, 320b adopt different color temperatures, different brightness ratios can be mixed with different mixed color temperatures.

Fourth embodiment

Referring to FIG. 13, a schematic diagram of a semiconductor light source device 4000 of a fourth embodiment is shown. The semiconductor light source device 4000 of the present embodiment is different from the semiconductor light source device 1000 of the first embodiment in that the mobile platform 480 is further used, and the rest of the same portions will not be repeatedly described.

As in the embodiment shown in Fig. 13, the number of semiconductor light source assemblies 420 of the present embodiment is plural, such as semiconductor light source assemblies 420a, 420b. The number of light shape conversion couplers 430 is plural. Each of the light shape conversion couplers 430 is used to guide the light of each of the semiconductor light source assemblies 420a, 420b. Light guiding element 410 receives at least a portion of the light from each of semiconductor light source assemblies 420a, 420b. The mobile platform 480 is configured to move the semiconductor light source components 420a, 420b and the light shape conversion couplers 430 to adjust the ratio of the light guide elements 410 to receive the semiconductor light source components 420a, 420b.

The mobile platform 480 can be moved or rotated to vary the relative position of the light guiding element 410 to the semiconductor light source assemblies 420a, 420b. As such, the relative proportions of the semiconductor light source components 420a, 420b into the light guiding element 410 change.

The control unit 440 is electrically connected to the mobile platform 480 to control the movement or rotation of the mobile platform 480. When the semiconductor light source components 420a, 420b are of different colors, the relative proportions of the semiconductor light source components 420a, 420b entering the light guiding component 410 may change to change the mixed color. When the semiconductor light source components 420a, 420b are at different color temperatures, the relative proportions of the semiconductor light source components 420a, 420b entering the light guiding component 410 may change to change the mixed color temperature.

Moreover, in one embodiment, the light shape conversion coupler 430 may be omitted and the light from the semiconductor light source assemblies 420a, 420b may be directly incident on the light guide element 410. The relative proportions of the semiconductor light source components 420a, 420b into the light guiding element 410 can also be varied by movement or rotation of the mobile platform 480.

Fifth embodiment

Referring to FIGS. 14A-14B, FIG. 14A is a perspective view of the semiconductor light source device 5000 of the fifth embodiment, and FIG. 14B is a side view of the semiconductor light source device 5000 of the fifth embodiment. The semiconductor light source device 5000 of the present embodiment is different from the semiconductor light source device 1000 of the first embodiment in the arrangement of the fixture 590, and the rest of the same is not repeated.

As shown in the embodiment of FIG. 14B, the holder 590 is used to fix the light guiding member 510 and the light conversion coupling coupler 530 such that the light guiding member 510 is in close contact with the light conversion coupling coupler 530. The holder 590 includes a clamping member 591 and a carrier plate 592. The semiconductor light source assembly 520 is disposed on the carrier plate 592. The clamping member 591 includes a fixing plate 5911 and a plurality of elastic pieces 5912. The light guiding member 510 is inserted into the fixing plate 5911, and the elastic piece 5912 is engaged with the hook 5921 of the carrying plate 592 such that the light guiding member 510 is clamped above the carrying plate 592. Since the elastic piece 5912 has a degree of deformation, the light guiding element 910 is in close contact with the light conversion coupling coupler 530, improving the coupling efficiency.

Moreover, in an embodiment, the light shape conversion coupler 530 may not be provided, and the light of the semiconductor light source assembly 520 may be directly incident on the light guide element 510. The light guiding member 510 can also be fixed through the fixing member 590 so that the light guiding member 510 is in close contact with the semiconductor light source assembly 520 to improve the coupling efficiency.

Sixth embodiment

Referring to FIGS. 15A-15B, FIG. 15A is a side view of the semiconductor light source device 6000 of the sixth embodiment, and FIG. 15B is a plan view of the semiconductor light source device 6000 of the sixth embodiment. The semiconductor light source device 6000 of the present embodiment is different from the semiconductor light source device 4000 of the fourth embodiment in the relationship between the semiconductor light source assembly 620 and the light guiding member 610, and the rest of the same points will not be repeatedly described.

The number of semiconductor light source assemblies 620 in this embodiment is four, for example, semiconductor light source assemblies 620a, 620b, 620c, 620d, and the number of light conversion couplers is four. The mobile platform 680 is configured to move the semiconductor light source components 620a, 620b, 620c, 620d and the light shape conversion couplers 630 to adjust one of the light guide elements 610 corresponding to the light shape conversion coupler 630 such that the light guide elements 610 Only the light emitted by one of the light conversion couplers 630 is received.

Taking the embodiment of FIGS. 15A-15B as an example, the upper semiconductor light source assembly 620a corresponds to one light-shaped conversion coupler 630, and the lower semiconductor light source assembly 620c corresponds to the other light-shaped conversion coupler 630. The light of the upper semiconductor light source unit 620a is white light, and the light of the lower semiconductor light source unit 620c is narrow wave light, for example, light of 415 nm and 530 nm. The control unit 640 is electrically connected to the mobile platform 680 to control the movement of the mobile platform 680. The mobile platform 680 can move the semiconductor light source components 620a, 620b, 620c, 620d and the light shape conversion coupler 630 to switch the received light received by the light guiding element 610 between white light or narrow wave light. In general, white light can be used for general surgical illumination, while narrow-wave light can be used as an auxiliary diagnosis for cancer or other pathologies.

In addition, in an embodiment, the mobile platform 680 can also move the light guiding component 610 to move the light guiding component 610 relative to the semiconductor light source components 620a, 620b, 620c, 620d and the light conversion coupler 630 to switch white light or Narrow wave light.

In summary, although the present invention has been disclosed above by way of example, it is not intended to limit the present invention. Those who have ordinary knowledge in the technical field of the present invention can make various changes and refinements without departing from the spirit and scope of the present case. Therefore, the scope of protection of this case is subject to the definition of the scope of the patent application attached.

1000, 1000b, 1000c, 2000, 3000, 4000, 5000, 6000. . . Semiconductor light source device

110, 110b, 110c, 210, 310, 410, 510, 610. . . Light guide element

120, 120b, 120c, 120e, 120f, 120g, 120h, 120i, 120j, 120k, 120m, 120n, 120p, 220, 220a, 220b, 220c, 220d, 320, 320a, 320b, 420, 420a, 420b, 520, 620, 620a, 620b, 620c, 620d. . . Semiconductor light source assembly

120j1, 120j2, 120k1, 120k2, 120k3, 120m1, 120m2, 120m3, 120m4, 120n1, 120n2, 120p1, 120p2. . . Light-emitting diode

130, 130a, 230, 330, 430, 530, 630. . . Light conversion coupler

131, 131a. . . Bevel

131a1. . . First step bevel

131a2. . . Second step

132. . . Surface

133, 333. . . First end face

134, 334. . . Second end face

140, 240, 340, 440, 640. . . control unit

150. . . Substrate

161c. . . Reflector

162c. . . Condenser lens

270. . . Beam splitter

271, 272. . . Beam splitter

480, 680. . . mobile platform

590. . . Holder

591. . . Clamping piece

5911. . . Fixed plate

5912. . . shrapnel

5921. . . The hook

D. . . The length of the bevel projection to the center axis

D ₁ . . . The length of the first-order bevel projection to the central axis

D ₂ . . . Projection of the second-order bevel to the length of the central axis

L1, L1a. . . The central axis

L _f . . . Radius of the light guide element

L _s . . . Half of the length of the semiconductor light source assembly

θ _c . . . The angle between the slope and the central axis

θ _{c ,1} . . . The angle between the first stepped slope 131a1 and the central axis L1a

θ _{c , 2} . . . The angle between the second stepped slope 131a2 and the central axis L1a

θ _f . . . Maximum receiving angle of the light guiding element 110

θ _s . . . Maximum emission angle of the semiconductor light source assembly

1 to 2 are schematic views showing the semiconductor light source device of the first embodiment.

3A to 3E are diagrams showing various angles of the light shape conversion coupler of the first embodiment.

FIG. 4 is a schematic view showing the optical path of the light conversion coupler of the first embodiment.

FIG. 5 is a schematic diagram showing an optical path of a light shape conversion coupler according to another embodiment.

6A-6B are schematic views showing two semiconductor light source devices.

FIG. 6C is a schematic view showing the semiconductor light source device of the embodiment.

7A-7B illustrate an embodiment of the shape of the semiconductor light source assembly.

8A-8B illustrate an embodiment of the number of semiconductor light source components.

9A-9D illustrate an embodiment of the color of the semiconductor light source assembly.

10A-10B illustrate an embodiment of the color temperature of the semiconductor light source assembly.

11 is a schematic view showing the semiconductor light source device of the second embodiment.

Fig. 12 is a schematic view showing the semiconductor light source device of the third embodiment.

Figure 13 is a schematic view showing the semiconductor light source device of the fourth embodiment.

Fig. 14A is a perspective view showing the semiconductor light source device of the fifth embodiment.

Fig. 14B is a side view showing the semiconductor light source device of the fifth embodiment.

Fig. 15A is a side view showing the semiconductor light source device of the sixth embodiment.

Fig. 15B is a plan view showing the semiconductor light source device of the sixth embodiment.

110. . . Light guide element

120. . . Semiconductor light source assembly

130a. . . Light conversion coupler

131a. . . Bevel

131a1. . . First step bevel

131a2. . . Second step

D ₁ . . . The length of the first-order bevel projection to the central axis

D ₂ . . . Projection of the second-order bevel to the length of the central axis

L1a. . . The central axis

L _f . . . Radius of the light guide element

L _s . . . Half of the length of the semiconductor light source assembly

θ _{c ,1} . . . The angle between the first stepped slope and the central axis

θ _{c , 2} . . . The angle between the second stepped slope and the central axis

Claims (13)

A semiconductor light source device comprising: a light guiding component; at least one semiconductor light source component; and at least one light shape converting coupler disposed between the semiconductor light source component and the light guiding component to guide the light of the semiconductor light source component to the The light guide element; wherein the light shape conversion coupler has a slope and a curved surface, the slope is a multi-step slope having a plurality of slopes; at least two slopes of the multi-step slope meet the following conditions: Wherein D ₁ is a length of a first-order oblique plane projected to a central axis, D ₂ is a length of a second-order oblique plane projected to the central axis, and θ _{c, 1} is an angle between the first-order inclined surface and the central axis , θ _{c, 2 is} the angle between the second stepped slope and the central axis, L _{f is} the radius of the light guiding element, and L _s is half of the side length of the semiconductor light source component. The semiconductor light source device of claim 1, wherein the slope and the curved surface are used to reflect light of the semiconductor light source assembly. The semiconductor light source device of claim 2, wherein the curved surface is a spherical surface, an elliptical spherical surface or a paraboloid. The semiconductor light source device of claim 1, wherein the light conversion coupler has a first end surface and a second end surface, the first end surface being substantially the same shape as the semiconductor light source assembly, the second end surface The shape of the cross section of the light guiding element is substantially the same. The semiconductor light source device of claim 4, The first end surface is in close contact with the semiconductor light source assembly. The semiconductor light source device of claim 4, wherein a gap between the first end face and the semiconductor light source component is less than or equal to 0.5 mm. The semiconductor light source device of claim 1, wherein the number of the at least one semiconductor light source component is one, and the semiconductor light source component is composed of a light emitting diode or a plurality of light emitting diodes. The semiconductor light source device of claim 1, wherein the number of the semiconductor light source components is plural, and each of the semiconductor light source components is composed of a light emitting diode or a plurality of light emitting diodes. The semiconductor light source device of claim 1, wherein the number of the at least one semiconductor light source component is plural, and the number of the at least one light conversion coupler is plural, and the semiconductor light source device further comprises: A beam splitter group is disposed between the light shape conversion coupler and the light guide element, and the beam splitter group is configured to mix the light of the semiconductor light source components. The semiconductor light source device of claim 1, wherein the number of the at least one semiconductor light source component is plural, and the color light source components have different colors or color temperatures, and the light shape conversion coupler has a plurality of first The end surface and a second end surface, each of the first end surfaces corresponding to one of the semiconductor light source assemblies. The semiconductor light source device of claim 1, wherein the number of the at least one semiconductor light source component is plural, and the number of the at least one light conversion coupler is plural, and each of the light shape conversions a coupler for guiding light of each of the semiconductor light source components, the light guide component receiving at least a portion of the light of each of the semiconductor light source components, the semiconductor light source device further comprising: a moving platform for moving the semiconductor light source components and the a light shape conversion coupler for adjusting a ratio of the light guide elements to receive the semiconductor light source components. The semiconductor light source device of claim 1, further comprising: a holder for fixing the light guiding element and the light conversion coupling so that the light guiding element is in close contact with the light conversion coupling. The semiconductor light source device of claim 1, wherein the number of the at least one semiconductor light source component is plural, and the number of the at least one light conversion coupler is plural, and each of the light conversion couplers is used. Or guiding the light of one of the semiconductor light source components, the light guiding component only receiving light of one of the semiconductor light source components, the semiconductor light source device further comprising: a moving platform for moving the semiconductor light source components And the light shape conversion couplers to adjust the light guide element to correspond to one of the light shape conversion couplers.