TWI470693B - - Google Patents

Info

Publication number
TWI470693B
TWI470693B TW101143732A TW101143732A TWI470693B TW I470693 B TWI470693 B TW I470693B TW 101143732 A TW101143732 A TW 101143732A TW 101143732 A TW101143732 A TW 101143732A TW I470693 B TWI470693 B TW I470693B
Authority
TW
Taiwan
Application number
TW101143732A
Other languages
Chinese (zh)
Other versions
TW201340205A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201340205A publication Critical patent/TW201340205A/en
Application granted granted Critical
Publication of TWI470693B publication Critical patent/TWI470693B/zh

Links

TW101143732A 2012-01-09 2012-11-22 Gas spray head TW201340205A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210005091.9A CN103198993B (en) 2012-01-09 2012-01-09 A kind of gas spray for plasma processing apparatus

Publications (2)

Publication Number Publication Date
TW201340205A TW201340205A (en) 2013-10-01
TWI470693B true TWI470693B (en) 2015-01-21

Family

ID=48721453

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101143732A TW201340205A (en) 2012-01-09 2012-11-22 Gas spray head

Country Status (2)

Country Link
CN (1) CN103198993B (en)
TW (1) TW201340205A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104576279B (en) * 2013-10-22 2017-02-15 中微半导体设备(上海)有限公司 Gas adjusting device and plasma reactor employing same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200903576A (en) * 2007-06-13 2009-01-16 Lam Res Corp Showerhead electrode assemblies for plasma processing apparatuses
US20110133650A1 (en) * 2009-12-09 2011-06-09 Jehara Corporation Apparatus for generating plasma
US20110226420A1 (en) * 2010-03-16 2011-09-22 Tokyo Electron Limited Electrode and plasma processing apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3360098B2 (en) * 1995-04-20 2002-12-24 東京エレクトロン株式会社 Shower head structure of processing equipment
KR100400044B1 (en) * 2001-07-16 2003-09-29 삼성전자주식회사 Shower head of wafer treatment apparatus having gap controller
JP4707588B2 (en) * 2006-03-16 2011-06-22 東京エレクトロン株式会社 Plasma processing apparatus and electrodes used therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200903576A (en) * 2007-06-13 2009-01-16 Lam Res Corp Showerhead electrode assemblies for plasma processing apparatuses
US20110133650A1 (en) * 2009-12-09 2011-06-09 Jehara Corporation Apparatus for generating plasma
US20110226420A1 (en) * 2010-03-16 2011-09-22 Tokyo Electron Limited Electrode and plasma processing apparatus

Also Published As

Publication number Publication date
CN103198993A (en) 2013-07-10
TW201340205A (en) 2013-10-01
CN103198993B (en) 2015-08-12

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