TWI469374B - Photovoltaic package structure - Google Patents

Description

Photovoltaic packaging structure

The present invention relates to a solar cell, and more particularly to a photovoltaic package structure.

Solar energy itself has no pollution problems and is easy to obtain, and it will never be exhausted, so solar energy has become one of the important alternative energy sources. A solar cell that is more commonly used in solar energy is a photoelectric conversion element that converts light energy into electrical energy after being irradiated by sunlight.

There are many types of solar cells, such as silicon-based solar cells, compound semiconductor solar cells or organic solar cells, or Dye Sensitized Solar Cells (DSSC). The structure of the dye-sensitized solar cell comprises two conductive substrates having a conductive layer, wherein one conductive substrate is provided with titanium dioxide to adsorb the dye, and the other conductive substrate is provided with a catalytic layer such as platinum.

In conclusion, how to propose a new structural design for dye-sensitized solar cells to improve the product's lightness and thinness and enhance the structural strength, thereby improving product competitiveness and reliability, is one of the current important topics.

In view of the above problems, an object of the present invention is to provide a photovoltaic package structure, which can improve the thinness of the product and enhance the structural strength, thereby Increase product competitiveness and reliability.

To achieve the above objective, a photovoltaic package structure according to the present invention comprises a first conductive substrate, a dye layer, a collector electrode, an insulating paste, and a plurality of second conductive substrates. The first conductive substrate has a transparent substrate and a light-transmissive conductive layer, and the transparent conductive layer is disposed on the transparent substrate. The dye layer is disposed on the light-transmitting conductive layer. The collector electrode is disposed on the light-transmissive conductive layer and at least partially located around the dye layer. An insulating paste is disposed around the dye layer and on the collector electrode. The second conductive substrate is disposed on the dye layer and the insulating paste, and the insulating glue extends to a gap between the second conductive substrates.

In an embodiment, the first conductive substrate has at least one groove, and the insulating glue is filled in the groove.

In an embodiment, the second conductive substrate is a metal piece or a substrate having a conductive layer.

In one embodiment, the material of the substrate having the conductive layer comprises glass, plastic, metal or ceramic.

In one embodiment, the insulating glue extends over portions of each of the second conductive substrates away from a surface of the dye layer.

In one embodiment, the insulating paste protrudes from the surface to a height substantially between 0 and 0.5 mm.

In one embodiment, the collector electrode includes a plurality of frame portions, and each of the second conductive substrates corresponds to at least one frame portion or the frame portions that are connected to each other.

In one embodiment, the collector electrode further includes a plurality of conductive connecting portions, and each of the conductive connecting portions is coupled to the at least one frame portion.

In an embodiment, the at least one second conductive substrate and the adjacent second guide The conductive connection portion of the frame portion corresponding to the electrical substrate is electrically connected.

In one embodiment, the at least one second conductive substrate has a convex portion that extends to one of the adjacent second conductive substrates.

In an embodiment, the electrically conductive connections are located at one edge or opposite edges of the first electrically conductive substrate.

In one embodiment, the light-transmissive conductive layer comprises a plurality of light-transmissive conductive portions that are not connected, and the light-transmitting conductive portions respectively correspond to the second conductive substrate.

In one embodiment, the dye layer has a plurality of dye portions that are not joined, and the dye portions are each surrounded by the frame portions.

In one embodiment, one of the second conductive substrates has an area that is not equal to an area of the first conductive substrate.

In one embodiment, the photovoltaic package further includes an encapsulant disposed between the first conductive substrate or the second conductive substrate or the substrates.

As described above, in the photovoltaic package structure of the present invention, the insulating glue extends to the gap between the second conductive substrates, so that the second conductive substrate can be stretched by the insulating rubber. The distance between the conductive substrates is reduced, thereby achieving a thinning of the product. In addition, the gap between the insulating material and the second conductive substrate can also strengthen the bonding strength between the second conductive substrate and the first conductive substrate, thereby improving the reliability of the product.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a photovoltaic package structure according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein like elements will be described with the same reference numerals.

1 is a schematic perspective view of a photovoltaic package structure 1 according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view of the photovoltaic package structure 1, FIG. 3 is a top view of the photovoltaic package structure 1, and FIG. 4 is a photovoltaic package. A cross-sectional view of the structure 1 taken along line AA of FIG. Please refer to FIG. 1 to FIG. 4 to illustrate the photovoltaic package structure 1. The photovoltaic package structure 1 includes a first conductive substrate 11, a dye layer 12, a collector electrode 13, an insulating paste 14, and a plurality of second conductive substrates 15. The photovoltaic package structure 1 of the present embodiment is exemplified by a dye-sensitized solar cell.

The first conductive substrate 11 has a transparent substrate 111 and a light-transmissive conductive layer 112. The transparent conductive layer 112 is disposed on the transparent substrate 111. Light can enter the photovoltaic package 1 via the first conductive substrate 11. The material of the transparent substrate 111 may include, for example, glass or plastic, and the plastic is, for example, polyethylene terephthalate (PET) or other light transmissive polymer. The material of the light-transmitting conductive layer 112 may be, for example, a light-transmissive conductive oxide (TCO) such as indium tin oxide, tin oxide, zinc oxide, or fluorine-doped tin dioxide (Sn:F), and this first The conductive substrate 11 is also referred to as an FTO substrate. In the present embodiment, the light-transmitting conductive layer 112 includes a plurality of transparent conductive portions 113 that are not connected. The transparent conductive portions 113 respectively correspond to the second conductive substrate. Here, the transparent conductive portion 113 corresponds to a second conductive substrate 15. The photovoltaic package 1 has a total of six second conductive substrates 15. The light-transmissive conductive layer 112 can be broken, for example, by a subsequent processing such as laser cutting, mechanical cutting, chemical etching, or FTO printing. By breaking the light-transmitting conductive layer 112, the photovoltaic package structure 1 can be divided into a plurality of small batteries to be connected in series or in parallel, thereby increasing applicability. Here, the light-transmitting conductive portion 113 is exemplified by being arranged in parallel at intervals and having a rectangular shape.

The dye layer 12 is disposed on the light-transmitting conductive layer 112. In forming the dye layer 12, a dye adsorption layer (e.g., titanium dioxide, not shown) may be applied to the light-transmissive conductive layer 112 and then filled with a dye to allow the titanium dioxide to adsorb the dye to form the dye layer 12. When light is absorbed, the dye layer 12 generates electrons, and electrons are transferred to the light-transmitting conductive layer 112 of the first conductive substrate 11. Here, the dye in the dye layer 12 may contain, for example, a metal complex dye such as ruthenium (Ru) or an organic dye such as a methyl group or a phthalocyanine. In the present embodiment, the dye layer 12 has a plurality of dye portions 121 that are not connected, and the shape of the dye portion 121 is not limited thereto, and may be, for example, a regular polygon or a rectangle, such as a regular hexagon. Here, the dye portion 121 is shaped to match the shape of the light-transmitting conductive portion 113, and is also arranged in parallel at intervals.

The collector electrode 13 is disposed on the light-transmitting conductive layer 112 and at least partially located around the dye layer 12. In the present embodiment, the collector electrode 13 includes a plurality of frame portions 131. The frame portion 131 is located around the dye portion 121. Each of the second conductive substrates 15 corresponds to at least one frame portion 131 or the frame portions 131 connected to each other. Here, each of the second conductive substrates 15 is exemplified by a corresponding frame portion 131. In addition, the collector electrode 13 further includes a plurality of conductive connecting portions 132, and each of the conductive connecting portions 132 is coupled to at least one of the frame portions 131. Here, the conductive connecting portions 132 are connected to the respective frame portions 131 as an example. In this embodiment, the conductive connection portion 132 is disposed on one side of the frame portion 131 and serves as an electrode of the battery to transmit power. Here, the conductive connecting portion 132 is a polygon, for example, a rectangle, and is taken as a negative electrode as an example.

The material of the collector electrode 13 is exemplified by silver glue, and may be a conductive glue or a metal film of other materials, such as aluminum glue or copper glue. Forming the collector electrode 13 The manner of printing, sputtering, coating or dispensing can be assisted by the arrangement of the collector electrodes 13 to assist in the transfer of electrons from the dye layer 12. Here, the electrons generated by the dye layer 12 are first transmitted to the light-transmitting conductive layer 112 on the first conductive substrate 11, and then transmitted to the collector electrode 13 by the light-transmitting conductive layer 112.

The insulating paste 14 is disposed around the dye layer 12 and on the collector electrode 13, even covering the collector electrode 13. The insulating paste 14 is disposed between the collector electrode 13 and the second conductive substrate 15 to electrically insulate the two.

The second conductive substrate 15 is disposed on the dye layer 12 and the insulating paste 14. The second conductive substrate 15 is not disposed to overlap the conductive connecting portion 132. The second conductive substrate 15 is electrically connected to the dye layer 12, and can be used, for example, as a positive electrode of the battery, and forms an electrical circuit together with the collector electrode 13. The second conductive substrate 15 is, for example, a metal piece or a substrate having a conductive layer. The material of the substrate with the conductive layer may include glass, plastic, metal or ceramic, for example: polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimine ( PI), zinc, tungsten, titanium, or stainless steel. In addition, the second conductive substrate 15 may also be a light-transmitting conductive substrate.

The insulating adhesive 14 can be a hot melt adhesive, a heat shrink adhesive, or a hot plastic, and the original insulating rubber 14 can be extended to a gap between the second conductive substrates 15 after being pressed (for example). As shown in FIG. 4, after the two second conductive substrates are joined by thermocompression bonding, the distance between the second conductive substrate 15 and the first conductive substrate 11 can be reduced, thereby accelerating electron conduction inside the battery, and further reducing the thickness of the product. In addition, the gap between the insulating adhesive 14 and the second conductive substrate 15 can also strengthen the connection strength between the second conductive substrate 15 and the first conductive substrate 11, thereby improving the reliability of the product. Insulating rubber 14 can also be extended The second conductive substrate 15 of the covering portion is away from a surface of the dye layer 12, for example, the insulating glue 14 protrudes from the surface to a height substantially between 0 and 0.5 mm. Even at least one second conductive substrate 15 may have at least one through hole (not shown), and the insulating glue 14 may extend to the through hole. In the above arrangement, the distance between the second conductive substrate 15 and the first conductive substrate 11 can be further reduced, and the connection strength can be improved.

The photovoltaic package structure 1 further includes an electrolyte 16 disposed in a space between the second conductive substrate 15, the insulating paste 14, and the dye layer 12. Since the highest point of the insulating paste 14 is higher than the dye layer 12, a space can be formed to accommodate the electrolyte 16. The second conductive substrate 15 can be electrically connected to the dye layer 12 by the electrolyte 16 to form another electrode of the battery.

The photovoltaic package structure 1 further includes an encapsulant 17 disposed on the second conductive substrate 15. The encapsulant 17 prevents air and moisture from entering the photovoltaic package structure 1 and can avoid damage to the photovoltaic package structure 1. The encapsulant 17 can also maintain the hermeticity of the photovoltaic package structure 1. In this embodiment, it can be electrically connected to the second conductive substrate 15 by a plurality of circuit connections, and can be used as a battery connected in series.

Next, please refer to FIG. 5 , which is a schematic top view of the second conductive substrate 15 and the first conductive substrate 11 in the present embodiment. For the sake of clarity, other components are not shown first. Referring to FIG. 5, the width D1 of one of the second conductive substrates 15 may be greater than or less than the width D2 of one of the outer edges of the first conductive substrate 11. Here, the width D1 is smaller than the width D2. Here, the width D1 is the width of the range in which all of the second conductive substrates 15 are formed. In this embodiment, the width D1 and the width D2 conform to the following equation: 0<(D2-D1) /D2<5%. This makes the package more convenient.

6 is an exploded perspective view of a photovoltaic package structure 2 according to a second embodiment of the present invention, FIG. 7 is a top plan view of the photovoltaic package structure of FIG. 6, and FIG. 8 is a cross section of the photovoltaic package structure of FIG. schematic diagram. Please refer to FIG. 6 to FIG. 8 to illustrate the photovoltaic package structure 2. The photovoltaic package structure 2 includes a first conductive substrate 21, a dye layer 22, a collector electrode 23, an insulating paste 24a, a plurality of second conductive substrates 25a, 25b, 25c, an electrolyte 26, and an encapsulant 27.

The insulating paste 24a extends to a gap between the second conductive substrates 25a, 25b, 25c (as shown in FIG. 8). By controlling the overflow of the insulating paste 24a, the distance between the second conductive substrate 25a, 25b, 25c and the first conductive substrate 21 can be reduced, thereby achieving thinning, and the insulating paste 24a extends to the second conductive substrates 25a, 25b. The gap between the 25c and the second conductive substrate 25a, 25b, 25c and the first conductive substrate 21 can also strengthen the connection strength, thereby improving the reliability of the product. In the above arrangement, the distance between the second conductive substrates 25a, 25b, and 25c and the first conductive substrate 21 can be further reduced, and the connection strength can be improved.

The main difference between the second embodiment and the first embodiment will be described below.

The insulating adhesive 24a extends over the surface of each of the second conductive substrates 25a, 25b, 25c away from the surface of the dye layer 22, for example, the height h of the insulating adhesive 24a protruding from the surface is substantially between 0 and 0.5 mm, and FIG. 4 The insulating glue 14 shown protrudes from the surface by a height h of zero. In addition, in order to further improve the effect of the insulating adhesive 24a, the first conductive substrate 21 may have at least one groove R, and the position of the groove R may correspond to the adjacent second conductive substrate 25a, The intervals of 25b, 25c are set so that the insulating glue 24a is filled in the recess R.

In the present embodiment, the collector electrode 23 has a plurality of frame portions 231, and the adjacent frame portions 231 are connected to each other. Here, the two frame portions 231 are connected to each other as an example. The two frame portions 231 share a conductive connecting portion 232a, 232b, and 232c, thereby causing the adjacent two dye portions 221 to be electrically connected in parallel with each other. In addition, the at least one second conductive substrate is electrically connected to the conductive connection portion of the frame portion corresponding to the adjacent second conductive substrate; wherein the second conductive substrate 25b corresponds to the adjacent second conductive substrate 25a. The conductive connecting portion 232a of the frame portion 231 is electrically connected, and the second conductive substrate 25c is electrically connected to the conductive connecting portion 232b of the frame portion 231 corresponding to the adjacent second conductive substrate 25b. For example, the height of the conductive connection portion and the second conductive substrate or the predetermined conductive connection portion may be connected by a wire, so that the conductive connection portion directly contacts the second conductive substrate to achieve electrical connection. Thereby, the effect that the second conductive substrates 25a, 25b, 25c and the collector electrode 23 are brought into series in series can be achieved.

In addition, in this embodiment, the at least one second conductive substrate has a convex portion, and the convex portion extends to one of the adjacent second conductive substrates. Here, the second conductive substrate 25b has a convex portion P1, and the convex portion P1 extends to a notch O1 of the adjacent second conductive substrate 25a; the second conductive substrate 25c has a convex portion P2, and the convex portion P2 protrudes to the phase One of the adjacent second conductive substrates 25b is notched O2. By the design of the convex-concave fit, the area occupied by the second conductive substrates 25a-25c can be prevented from being enlarged while achieving the internal series effect. Further, in the present embodiment, electrical conductivity can be derived by connecting the plurality of bonding wires to the second conductive substrates 25a and 25c, respectively.

Next, please refer to FIG. 9 , which is the second conductive substrate 25 a of the embodiment. A schematic plan view of 25c and the first conductive substrate 21, for the sake of clarity, other components are not shown first. Referring to FIG. 9, one of the second conductive substrates 25a-25c has a width D3 that is smaller than a width D4 of the outer edge of the first conductive substrate 21. Here, the width D3 is the width of the range in which all of the second conductive substrates 25a to 25c are formed. In the present embodiment, the width D3 and the width D4 conform to the following equation: 0 < (D4-D3) / D4 < 5%. This makes the package more convenient.

In addition, FIG. 10 is a cross-sectional view of another photovoltaic package structure 2a according to a second embodiment of the present invention, wherein one of the second conductive substrates 25 has an area that is not equal to an area of the first conductive substrate 21. For example, the shape of the second conductive substrate 25 and the first conductive substrate 21 are different, resulting in different areas, or different lengths or widths of the two, resulting in different areas. For example, the second conductive substrate 25 and the first conductive substrate 21 may be rectangular or hexagonal such that the widths of the two are not equal and the areas are not equal. The width of one of the second conductive substrates 25 is greater than the width of one of the first conductive substrates 21, and an encapsulant 27a is disposed between the second conductive substrate 25 and the first conductive substrate 21 in the form of a sealant. It may be extended on a lower surface of one of the first conductive substrates 21. In addition, another encapsulant 27b can cover the insulating paste 24a to provide protection and isolation.

In summary, in the photovoltaic package structure of the present invention, the insulating glue extends to the gap between the second conductive substrates, so that the second conductive substrate and the first conductive layer can be pulled by the tensile force of the insulating adhesive. The distance between the conductive substrates is reduced, thereby achieving a thinner product. In addition, the gap between the insulating material and the second conductive substrate can also strengthen the bonding strength between the second conductive substrate and the first conductive substrate, thereby improving the reliability of the product.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

1, 1a, 1b, 2, 2a ‧ ‧ photovoltaic packaging structure

11, 21‧‧‧ first conductive substrate

111, 211‧‧‧Transparent substrate

112, 212‧‧‧Transparent conductive layer

113‧‧‧Transparent Conductive Parts

12, 22‧‧‧ dye layer

121, 221‧ ‧ Dye Department

13, 23‧‧‧ Collecting electrodes

131, 231‧‧‧ Frame Department

132, 232, 232a, 232b, 232c‧‧‧ conductive connection

14, 24, 24a‧‧‧Insulation

15, 25, 25a, 25b, 25c‧‧‧ second conductive substrate

16, 26‧‧‧ Electrolytes

17,27,27a,27b‧‧‧Package

D1~D4‧‧‧Width

H‧‧‧height

O1, O2‧‧ ‧ gap

P1, P2‧‧‧ convex

R‧‧‧ groove

1 is a schematic perspective view of a photovoltaic package structure according to a first embodiment of the present invention; FIG. 2 is an exploded perspective view of the photovoltaic package structure 1 shown in FIG. 1; FIG. 4 is a cross-sectional view of the photovoltaic package structure 1 of FIG. 1 taken along line AA of FIG. 3; FIG. 5 is a top plan view of the second conductive substrate and the first conductive substrate according to the first embodiment of the present invention; 6 is an exploded perspective view of a photovoltaic package structure according to a second embodiment of the present invention; FIG. 7 is a top plan view of the photovoltaic package structure shown in FIG. 6; FIG. 8 is a schematic view of the photovoltaic package structure shown in FIG. FIG. 9 is a schematic plan view of a second conductive substrate and a first conductive substrate according to a second embodiment of the present invention; and FIG. 10 is a cross-sectional view showing another photovoltaic package according to a second embodiment of the present invention.

1‧‧‧Photovoltaic packaging structure

11‧‧‧First conductive substrate

111‧‧‧Transparent substrate

112‧‧‧Light conductive layer

121‧‧‧Dye Department

13‧‧‧ Collecting electrode

14‧‧‧Insulating adhesive

15‧‧‧Second conductive substrate

16‧‧‧ Electrolytes

17‧‧‧Package

Claims (15)

A photovoltaic package structure comprising: a first conductive substrate having a light-transmissive substrate and a light-transmissive conductive layer, wherein the light-transmissive conductive layer is disposed on the light-transmissive substrate; and a dye layer disposed on the light-transmitting conductive layer a collector electrode disposed on the light-transmissive conductive layer and at least partially located around the dye layer; an insulating paste disposed around the dye layer and the collector electrode; and a plurality of second conductive substrates disposed on On the dye layer and the insulating paste, the insulating glue extends to a gap between the second conductive substrates, wherein the insulating adhesive extends over the surface of the second conductive substrate away from the dye layer. The photovoltaic package structure of claim 1, wherein the first conductive substrate has at least one groove, and the insulating glue is filled in the groove. The photovoltaic package structure of claim 1, wherein the second conductive substrate is a metal piece or a substrate having a conductive layer. The photovoltaic package structure according to claim 3, wherein the material of the substrate with the conductive layer comprises glass, plastic, metal or ceramic. The photovoltaic package structure of claim 1, wherein the at least one second conductive substrate has at least one through hole, and the insulating glue extends to the through hole. The photovoltaic package structure of claim 1, wherein the insulating paste protrudes from the surface of the second conductive substrate to a height substantially between 0 and 0.5 mm. The photovoltaic package structure of claim 1, wherein the collector electrode comprises a plurality of frame portions, each of the second conductive substrates corresponding to at least one frame portion or the frame portions connected to each other. The photovoltaic package structure of claim 7, wherein the collector electrode further comprises a plurality of conductive connecting portions, each of the conductive connecting portions being coupled to at least one frame portion. The photovoltaic package structure of claim 8, wherein the at least one second conductive substrate is electrically connected to the conductive connection portion of the collector electrode corresponding to the adjacent second conductive substrate. The photovoltaic package structure of claim 1, wherein the at least one second conductive substrate has a convex portion extending to a gap of one of the adjacent second conductive substrates. The photovoltaic package structure of claim 8, wherein the conductive connection portions are located at one edge or opposite edges of the first conductive substrate. The photovoltaic package structure of claim 1, wherein the light-transmissive conductive layer comprises a plurality of light-transmissive conductive portions that are not connected, and the light-transmitting conductive portions respectively correspond to the second conductive substrate. The photovoltaic package structure of claim 7, wherein the dye layer has a plurality of dye portions that are not connected, and the dye portions are respectively surrounded by the frame portions. The photovoltaic package structure of claim 1, wherein one of the second conductive substrates has an area that is not equal to an area of the first conductive substrate. The photovoltaic package structure of claim 1, further comprising: a package adhesive disposed between the first conductive substrate or the second conductive substrate or the substrates.