TWI468671B - - Google Patents

Info

Publication number
TWI468671B
TWI468671B TW101140807A TW101140807A TWI468671B TW I468671 B TWI468671 B TW I468671B TW 101140807 A TW101140807 A TW 101140807A TW 101140807 A TW101140807 A TW 101140807A TW I468671 B TWI468671 B TW I468671B
Authority
TW
Taiwan
Application number
TW101140807A
Other languages
Chinese (zh)
Other versions
TW201418701A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101140807A priority Critical patent/TW201418701A/en
Priority to KR1020120154262A priority patent/KR101380687B1/en
Publication of TW201418701A publication Critical patent/TW201418701A/en
Application granted granted Critical
Publication of TWI468671B publication Critical patent/TWI468671B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8803—Visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW101140807A 2012-11-02 2012-11-02 Final defect inspection method TW201418701A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101140807A TW201418701A (en) 2012-11-02 2012-11-02 Final defect inspection method
KR1020120154262A KR101380687B1 (en) 2012-11-02 2012-12-27 Defect detecting method of terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101140807A TW201418701A (en) 2012-11-02 2012-11-02 Final defect inspection method

Publications (2)

Publication Number Publication Date
TW201418701A TW201418701A (en) 2014-05-16
TWI468671B true TWI468671B (en) 2015-01-11

Family

ID=50656356

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101140807A TW201418701A (en) 2012-11-02 2012-11-02 Final defect inspection method

Country Status (2)

Country Link
KR (1) KR101380687B1 (en)
TW (1) TW201418701A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009281836A (en) * 2008-05-21 2009-12-03 Olympus Corp Apparatus and method for substrate observation, control apparatus, and program
JP2011047999A (en) * 2009-08-25 2011-03-10 Micronics Japan Co Ltd Method and device for detecting defective pixel address
TW201211558A (en) * 2010-06-09 2012-03-16 Dtg Int Gmbh Apparatus and method for the testing of circuit boards
TW201231957A (en) * 2010-08-30 2012-08-01 Kla Tencor Corp Reticle defect inspection with model-based thin line approaches
US8300030B2 (en) * 2009-02-16 2012-10-30 Waltop International Corporation Tablet and coordinate computation circuit thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008268158A (en) * 2007-04-25 2008-11-06 Aitesu:Kk Method and apparatus for inspecting flat display panel
JP2010032456A (en) * 2008-07-31 2010-02-12 Alpha- Design Kk Glass substrate inspecting device
KR101156222B1 (en) * 2010-10-05 2012-06-18 삼성전기주식회사 Method for inspecting substrate defect
KR101177645B1 (en) * 2011-02-01 2012-08-27 삼성전기주식회사 Apparatus and Method for Detecting Coordinate of Unit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009281836A (en) * 2008-05-21 2009-12-03 Olympus Corp Apparatus and method for substrate observation, control apparatus, and program
US8300030B2 (en) * 2009-02-16 2012-10-30 Waltop International Corporation Tablet and coordinate computation circuit thereof
JP2011047999A (en) * 2009-08-25 2011-03-10 Micronics Japan Co Ltd Method and device for detecting defective pixel address
TW201211558A (en) * 2010-06-09 2012-03-16 Dtg Int Gmbh Apparatus and method for the testing of circuit boards
TW201231957A (en) * 2010-08-30 2012-08-01 Kla Tencor Corp Reticle defect inspection with model-based thin line approaches

Also Published As

Publication number Publication date
TW201418701A (en) 2014-05-16
KR101380687B1 (en) 2014-04-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees