TWI468552B - A system for plating a conductive substrate, and a substrate holder for holding a conductive substrate during plating thereof - Google Patents

Description

a system for plating a conductive substrate and a substrate support for supporting the conductive substrate during plating

This invention relates to a substrate support for an electrolytic plating process. More particularly, the present invention relates to a substrate support comprising a physically adaptable contact member configured to provide electrical contact to a recess in a back of a conductive substrate of a substrate support. A method for arranging a substrate in a substrate support is also provided.

Electroplating is used in a wide range of applications for microelectronic devices such as interconnects, components, waveguides, inductors, contact pads, and the like.

A primary electrode such as that prepared by the present invention is suitable for the production of microstructures and nanostructures in single or multiple layers, for the manufacture of printed wiring boards (PWB), printed circuit boards (PCBs), microelectromechanical systems (MEMS), integrated circuits ( IC) Interconnects, interconnects on ICs, sensors, flat panel displays, magnetic and optical storage devices, solar cells and other electronic applications. It can also be used for different types of structures in conductive polymers, different types of structures in semiconductors, different types of structures in metals, and other structures that may be produced using the primary electrode. Even 3D structures in the crucible (such as by the formation of porous crucibles) are possible.

Chemical vapor deposition and physical vapor deposition are processes that can also be used for metallization, but electroplating is often preferred because it is generally less expensive than other metallization processes and can be carried out at ambient temperatures and ambient pressures.

Electroplating of the workpiece is carried out in a reactor containing an electrolyte. The anode carrying the metal to be plated is connected to a positive voltage. In some cases, the anode is inert and the metal to be electroplated is from ions in the electrolyte. The electrical conductivity of a workpiece, such as a semiconductor substrate, is typically too low to allow the structure to be plated to be connected to the back contact via the substrate. Therefore, the structure to be plated must first be provided with a conductive layer (such as a seed layer). The leads connect the pattern to the finger contacts on the front side. The finger joint is in turn connected to a negative voltage. The electroplating step is an electrolysis process in which metal is transferred from the anode or from the ions in the electrolyte to the conductive pattern (the cathode) by the electrolyte between the anode and the conductive layer on the workpiece (which forms the cathode) and the applied electric field. ).

As mentioned above, the workpiece is typically made of a non-conductive material. When the pattern to be plated is on the front side, a voltage must be applied to the conductive layer on the front side. Additional leads and contact areas must also be on the front side because direct contact of the pattern with the electrodes can interfere with the plating process in those areas.

This configuration has many drawbacks:

- having a contact area on the front side takes up a lot of space which could otherwise be used for the pattern to be electroplated.

- The contact area is limited to the perimeter of the work piece to take up as little space as possible.

- The electroplating process proceeds in close proximity to the electrode at an acceleration rate, resulting in non-uniformity in metallization. If any part of the work piece is accessible, the plating uniformity will be improved.

- The finger electrode applied to the contact zone is immersed in the destructive (such as corrosive) environment of the electrolyte during the process, resulting in a degraded electrode.

- Constructing durable electrodes requires complex design and expensive materials.

An alternative device and process is described in U.S. Patent 6,322,678, in which a substrate support is constructed using electrodes applied to the contact areas on the back of the workpiece, the contact regions being connected to leads extending around the edge of the workpiece or to conductive channels. Thereby extending through the substrate. However, US6322678 is still accompanied by the problem that the leads and contact areas occupy the space on the front side because such leads and contact areas are unlikely to be coordinated with the desired plating. Moreover, the electrode is fixed in a small position close to the periphery of the substrate support member, and only the peripheral contact with the conductive surface of the workpiece to be electroplated is ensured, so that the contact area and the lead of the workpiece need to be laid out to ensure that it is correctly placed on the electrode. In the corresponding position of the back of the workpiece. Further, the substrate support according to US Pat. No. 6,322,678 is not advantageous for electroplating the ECPR main electrode, especially for the main electrode having an insulating material on the side not intended for electroplating because it does not ensure that the electrode contacts the conductive member of the main electrode. It is also necessary to carefully align the substrate with the electrodes of the substrate support. Still further, the electrodes are configured such that they can slide through the substrate support, thereby failing to ensure isolation of the back of the workpiece from the electrolyte.

Accordingly, the present invention seeks to reduce, alleviate or eliminate one or more of the above-disclosed deficiencies and to provide an improved substrate support of the type mentioned.

In the first aspect, a system is provided to achieve this. The system includes (i) a conductive substrate including a first conductive side and a second conductive side, wherein the first side of the conductive substrate is to be plated; and (ii) a substrate support member, the substrate support member An attachment member for attaching the conductive substrate to the substrate support such that a first surface of the substrate support faces the second side of the conductive substrate; and an elastic contact member attached to the substrate support The first surface, the elastic contact member is connectable to a first external potential; the second side of the conductive substrate is provided with an insulating material exposing the second side of the conductive substrate, thereby providing at least one contact region; The resilient contact member contacts the exposed second side in at least one of the at least one contact regions.

In another aspect, a substrate support for supporting a conductive substrate during electroplating is provided. The substrate support member includes an attachment member for attaching the conductive substrate to the substrate support such that a first surface of the substrate support member faces the second side of the conductive substrate; and an elastic contact member that is attached To the first surface of the substrate support and connectable to at least one external potential.

Advantageous features of the invention are defined in the scope of the dependent patent application.

In the following, several embodiments of the invention are described with reference to the drawings. These embodiments are described for illustrative purposes to enable those skilled in the art to practice the invention. However, such embodiments are not limiting of the invention, and other combinations of different features may be within the scope of the invention.

Referring to Figure 1, illustrated is a cross-sectional overview of the electroplating apparatus 100. This figure is a simplified diagram of the operational principles of the electroplating process and is intended to illustrate the role of the substrate support 101 in this process.

The conductive substrate 102 is attached to the substrate support 101 during the electroplating process according to an embodiment of the present invention. The conductive substrate 102 can be a wafer of conductive and/or semi-conductive material (eg, a metal material), or a wafer doped with a semiconductor material (such as germanium). The conductive substrate 102 can be attached to the substrate support 101 by an attachment member to seal the back of the substrate in the electroplating process to isolate the electrolyte. This attachment member can be, for example, a clamp ring 104. The clamp ring 104 can be made of a hard, non-conductive material such as Teflon.

In one embodiment, the conductive substrate 102 includes at least a portion of a conductive germanium wafer.

One or several layers or patterns of insulating material may then be disposed on the conductive substrate 102. Alternatively, other conductive materials may be disposed on the conductive substrate 102. Also, one or several layers or patterns of insulating material may be combined with one or several layers or patterns of conductive material to pattern conductive substrate 102.

In an embodiment, the substrate support 101 is made of an insulating material such as polypropylene (PP), Teflon or polydiether ketone (PEEK), and in another embodiment, the substrate support 101 is made of, for example, stainless steel. Made of conductive material. In yet another embodiment, the substrate support 101 is primarily made of an insulating material, but may include one or several conductive features that are different from the contact members described further in the present invention. The conductive substrate 102 is patterned with an electrically insulating layer 103. The insulating layer 103 forms a convex structure, and recessed holes are formed between the convex structures. In the recesses, the conductive surface is exposed to deposit metal on the conductive surfaces during the electroplating process. The bowl 105 is constructed with a reservoir 106. The reservoir 106 is filled with electrolyte during the electroplating process. The electrolyte is drawn from the external reservoir (not shown) via the anode 107 in a gentle flow. The anode 107 can be formed as a grid to prevent the electrolyte from flowing upward toward the conductive substrate 102, which is submerged below the surface of the electrolyte. The electrolyte is caused to flow through the conductive surface in the recess formed by the insulating layer 103. A voltage is applied between the anode 107 (which may be single piece or segmented) and the back of the conductive substrate 102, which in turn forms the cathode in the process. A voltage can be applied between the anode 107 and the back of the conductive substrate 102 via the substrate support 101, as will be discussed further below. Metal ions are released from the anode and carried by the electrolyte and the applied electric field toward the exposed conductive surface, wherein metal ions are deposited on the exposed conductive surface to form a plated metal layer.

In another embodiment, the anode is inert and the ions are only provided by the electrolyte. In this embodiment, the preference is to regularly replenish the fresh ionic electrolyte.

According to another embodiment, a permeable membrane (not shown) may be disposed in the trough between the anode 107 and the substrate support 101 to permit the use of two electrolyte processes to form the substrate support 101 in the trough. Positioning the first compartment in which it is located, and the second compartment in which the anode 107 is positioned. The inorganic substance can penetrate the permeable membrane, such as metal ions (which are produced by dissolution of the metal at the anode 107) and water, but organic substances such as brighteners and inhibitors are impermeable to the permeable mold. The second electrolyte can be injected into the first compartment above the membrane (i.e., on the side of the membrane where the substrate support 101 is positioned) and can contain brighteners and inhibitors. Since the brightener and the inhibitor can degrade at the anode 107, it can be important to separate it from the anode 107 by the membrane. The introduction of a permeable membrane between the substrate support 101 and the anode 107 solves the problems shown above.

After flowing through the substrate, as indicated by arrow 108, the electrolyte overflows the bowl 105 into the outer electrolyte collection tank 109. The electrolyte can be returned from the tank to an external reservoir (not shown) for recycling to the process. When recirculating, the electrolyte is likely to pass through the console and/or filter (not shown) first. The electrolyte can also be collected as a waste liquid, which means that it is no longer returned to the process. The selected process flow is selected based on the needs of the process.

Therefore, during the preparation of the main electrode, according to an embodiment of the present invention, the substrate support immerses the substrate in the electrolyte and the metal is deposited by plating on the recess in the front side of the substrate while keeping the back closed and isolated from the electrolyte. According to an embodiment, the substrate support 101 can be mounted to the piston 110 and an external process control device (not shown). The substrate support 101 can be rotated in either direction around the z-axis during the entire process, as shown in FIG. This rotation ensures uniformity of the plating process in terms of changes in the electric field and changes in the flow of electrolyte across the substrate.

The embodiment depicted in Figure 1 shows a horizontally configured substrate support 101, but it is equally possible to use the substrate support 101 for a plating apparatus such as a tilted electroplater. In the inclined plateau, for example, the substrate support can be tilted in a range of 30 to 60 (e.g., 45) with respect to the z-axis. Another alternative embodiment is to use the substrate support 101 for a plating apparatus such as a tray electroplater. In the tray plater, the substrate support 101 is immersed substantially vertically into the electrolyte. The alternative embodiment described later may also allow a plurality of substrate supports 101 to be used in the same processing device 100 simultaneously in parallel.

The outer conductor and/or the air duct indicated by the broken line 111 respectively supply electric power to the electrical contact member (not shown but included in the substrate support 101) and supply the gas pressure to the substrate support 101 via the piston 110. Due to the rotational movement of the piston, it may be desirable (but not always necessary) to establish electrical contact with at least one external power source by brush contacts, sliding contacts, or similar frictional contact members as deemed suitable by those skilled in the art.

The purpose of such conventional air ducts is to supply the substrate support 101 with gas pressure, for example, for applications such as attaching the substrate 102 to the substrate support 101 for loading the substrate 102 into the substrate support 101 or The substrate support 101 is unloaded out of the substrate 102, or used to actuate the movement of the clamp ring 104, and the like.

The conductor and/or air duct 111 can be directed from the piston 110 to the external unit 112, the external unit 112 including a collection of devices, such as at least one selected from the group consisting of a power source, an air pump, a user interface, such as an operator interface A computer that controls different components of the device and/or processes.

Referring to Figures 2A through 2B, illustrated are many exemplary embodiments of a conductive substrate 102 and a patterned insulating layer 103. An insulating material 103 may be provided on the first portion of the side of the conductive substrate 102 facing the substrate support. Accordingly, the back insulating layer 103A can be patterned to divide the back into one or more contact regions 203 at a second portion of the side of the conductive substrate 102. The pattern on the back is usually (but not always) in the shape of a concentric circle or a circular segment. The middle zone (i.e., the center of the back) is typically (but not necessarily always) exposed to form a contact zone. As further described with respect to FIG. 2C, maintaining the entire back exposed to form a single back contact region 203 is also within the scope of this embodiment. The patterned back produces a beneficial technical effect that the ECPR main electrode with pre-deposited material in the recess in the front side can be connected to several voltages from different contact areas formed on the back. This is controlled and ensures the possibility of a uniform distribution of plating efficiency across the main electrode. Therefore, the back patterning is also convenient.

In one embodiment, the back surface of the conductive substrate is provided with an insulating material forming at least one recessed hole on the front side of the exposed conductive substrate, thereby providing at least one contact region in the recessed hole. Accordingly, the first portion and the second portion of the back of the conductive substrate are configured such that the insulating material forms at least one recessed aperture, wherein the at least one contact region 203 is provided in the recessed aperture.

In one embodiment, the at least one contact region 203 covers at least 50% of the diagonal of the back of the conductive substrate 102. In this regard, at least 80% (such as at least 95%) of the diagonal of the back of the conductive substrate 102 can be covered by the contact region 203. In this way, a uniform distribution of voltages can be provided to ensure uniform plating height and plating speed on the front side. Again, this embodiment provides the technical effect that a particular back pattern can interact with different configurations of the contact member 304, according to the following.

It should be understood that the resistivity of the conductive substrate 102 in the lateral direction may be sufficiently large, or the lateral spacing between the contact regions of different potentials or between the recesses on the front side may be sufficiently large to be at least radially on the front side of the conductive substrate 102. Different potentials are generated in the two points.

When the substrate is used as the main electrode in the electrochemical pattern replication (ECPR) process, the front side insulating layer 103B is patterned with the layout to be copied. The recess formed by the front side insulating layer 103B is preconfigured (in an earlier process) to have one or more layers of electrically conductive material 201 that is substantially inert (in this electrolyte), hereinafter referred to as an electrode layer. The electrode layer may have a material selected from the group consisting of Au, Ti, TiW, Cr, Ni, Si, Pd, Pt, Rh, Co, and/or alloys thereof or heterogeneous mixtures. During the electrolysis process indicated by arrow 202, metal is deposited on the pre-configured electrode layer 201.

The conductive substrate allows the use of an edge insulating layer 103C comprising at least one layer having at least one electrically insulating material that covers the edges of the conductive substrate 102. The purpose of the edge insulating layer 103C is to provide electrical insulation between the conductive substrate and the target wafer when the conductive substrate is used as a main electrode in an electrochemical pattern replication (ECPR) process. Another purpose of the edge insulating layer is to provide an air seal along with the substrate support 101 and to provide mechanical operation during the process (such as by clamping the substrate support 101 or by loading or unloading the substrate support 101). The robot arm of the wafer is used to clamp the surface. The edge insulating layer 103C is also used to form a hermetic seal together with the gasket when the substrate 102 is mounted on the substrate support 101 during the process to prevent the electrolyte from coming into contact with the back of the substrate. It is preferred to cover the edge insulating layer 103C from the edge of the substrate by at least 1 to 10 mm.

Another advantage of the edge insulating layer 103C is the period during which the substrate 102 is used as the main electrode in the subsequent ECPR process. When the main electrode is pressed to the substrate being patterned, the edge insulating layer 103C ensures that the substrate being patterned does not short-circuit along the edge.

Referring to Figure 2C, illustrated is another exemplary embodiment of a conductive substrate 102. In this embodiment, the entire back remains exposed to form a single back contact region 203 in the second portion of the side of the conductive substrate facing the substrate support. The front side has been structured and the electrode layer 201 is disposed in the recess. The side walls are covered by an insulating layer 103B.

Referring to Figures 3A and 3B, illustrated is an embodiment of the operation of the substrate support 101 and the physically adjustable contact member 304 in accordance with the present invention. The physically adjustable contact member can be any electrical contact member that is electrically insulated from the substrate support 101, except for any of the interconnections described further configured to provide electrical contact between the electrical contact member 304 and any external power source. Other interconnects may, for example, be leads that pass through the substrate support 101 or around the substrate support 101. The physically adjustable contact member can be adapted to the structured surface in the vertical direction and establish electrical contact with the surface while covering the substantial surface area of the substrate in the lateral direction. Since the subsequent ECPR process requires a certain step height between the surface of the insulating layer (for example, the edge insulating layer 103C) and the bottom of the recessed hole, it is also necessary to make good electrical contact with the back of the substrate 102. . This is ensured by the use of the physically adaptable contact member 304 of the substrate support 101. Contact member 304 can be physically adaptable, for example, due to its elasticity and adhesion to the surface of the substrate support that is intended to face the back of substrate 102. When the contact member 304 is elastic and adheres to the surface of the substrate support 101, the leads passing through the substrate support 101 or surrounding the substrate support 101 ensure electrical contact with an external power source. When the leads through the substrate support 101 ensure electrical contact with an external power source, the leads can be integrated with the substrate support 101 such that the leads are not movable within the substrate support. This ensures a good sealing effect between the interior space 306 and the environment surrounding the substrate support.

Regardless of the layout or thickness of the pattern of insulating layers 103A, 103C on the back of substrate 102, the operator of the present invention can ensure contact with any exposed contact regions 203 using substrate support 101 with physically adjustable contact members 304, such as This is illustrated by the arrows in Figures 3A and 3B. These arrows are intended only to show the principles of vertical adjustment and lateral coverage. The arrows in Figures 3A and 3B do not represent any physical device.

Generally, if the entire back is not to be contacted, the physically adjustable contact member may be connected to the at least two contact regions 203 or two contact points at the back of the conductive substrate 102 at a distance from the center of the conductive substrate to the peripheral edge of the conductive substrate. . The at least two contact regions 203 can be positioned along at least one radius. The current is more evenly distributed by contacting the back of the substrate 102 in at least two contact regions 203 along at least one radius, which allows for a higher plating rate than the only contact region 203 along at least one radius. Therefore, the first portion of the side surface of the conductive substrate facing the substrate support member is provided with the insulating material 103A, 103C, and the second portion facing the side surface of the conductive substrate of the substrate support member forms at least one contact region 203; wherein the elastic contact member 304 and the at least At least one contact point in a contact zone is in contact.

In an embodiment, the configuration of the contact members 304 is patterned to provide a plurality of contact points on the front side of the conductive substrate.

Referring to FIG. 3A, the conductive substrate 102 is normally fastened to the substrate support 101 by the clamp ring 302. The clamp ring may be made of a hard, insulating and inert material such as polypropylene (PP), Teflon, polydiether ketone (PEEK); or a metal or ceramic ring which may be coated with an insulating inert material as mentioned. . In Fig. 3A, the clamp ring 302 is mounted by screwing the clamp ring 302 onto the substrate support 101 by the threaded surface on the vertical interface between the clamp ring 302 and the substrate support 101. The lower portion of the clamp ring 302 can be provided with a sloped low profile structure 305. This design produces the technical effect that the clamp ring 302 will reduce interference or obstruction to the flow of electrolyte near the front side of the substrate 102. The distance d should preferably be in the range of less than 10 mm, such as less than 5 mm, such as less than 2 mm.

As long as the clamp ring 302 is adapted for use with the substrate support 101 and the substrate 102 (which is intended for use with the substrate support and substrate), the clamp ring 302 can have any suitable peripheral or circumferential form. Thus, the perimeter or circumferential form of the clamp ring can be circular, square, rectangular or polygonal.

To ensure that no electrolyte leaks to the back of the substrate, gaskets 303A-C may be provided. Furthermore, as disclosed above, the contact members 304 can be attached to the surface of the substrate support 101 by integrated leads in the substrate support that connect the contact members to an external power source to ensure that no electrolyte leaks to the back of the substrate. The gaskets 303A-C can be lip seals, double lip seals or O-rings. The gasket 303A seals the internal space 306 between the substrate support 101 and the conductive substrate 102. During or before/after operation, the interior space 306 can be evacuated to a pressure of <1 atm via the substrate support 101 and an air conduit (not shown) in the piston 110. A negative pressure is established to fasten the substrate 102 to the substrate support 101.

According to another embodiment of the present invention, the substrate 102 can be fastened to the substrate support 101 by mechanically pressing the clamp ring 302 toward the substrate support 101. This can be accomplished by providing a helical vise between the substrate support 101 and the clamp ring 302 (e.g., by means of a screw/bolt configuration known to those skilled in the art). It is preferred to have the screw/bolt configuration covered by an insulating material after configuration to avoid plating of the configuration when the configuration is a conductive material.

An additional pressure chamber (not shown) may be provided in the body of the substrate support 101. The purpose of the chamber directly connected to the interior space 306 by the conduit is to protect the substrate 102 from attachment due to unintended pressure fluctuations, such as unexpected pressure fluctuations due to leakage of valves of the piping system (not shown). Negative pressure can be supplied to an air conduit from an external source, such as vacuum mercury. A valve can be disposed between the external source and the air ducts. In one embodiment, a negative pressure is continuously provided to the air duct during processing to ensure that a desired negative pressure is achieved even if there is any accidental leakage through the valve or gasket. In another embodiment, the valve is opened to provide a negative pressure when loading or unloading the substrate, but is closed during the plating operation, which can reduce the risk of electrolyte flow into the vacuum system during an accidental leakage event. Negative pressure can also be provided via a detachable connector. In this case, the substrate support may include a check valve for ensuring that the negative pressure is maintained. The outer space 307 is sealed from the external environment by the gaskets 303B and 303C and is sealed from the inner space by the gasket 303A. In an embodiment, the gas overpressure or negative pressure line may be provided with a ball bearing valve whereby the substrate support can be rotated without rotating the pressure supply member. The external space 307 can be increased to a pressure of > 1 atm, for example, by introducing compressed air or by preferring a substantially inert gas such as nitrogen, to allow the external space 307 to act as an additional protection against electrolyte leakage through the gaskets 303B and 303C. A pressure sensor (not shown) may also be configured to monitor the pressure of the interior space 306 and the exterior space 307 to provide measurements to the external unit 112 and alert the operator or automatically in the event of unpredictable pressure fluctuations. Initial preventive measures. Measures can include automatic correction of pressure or suspension or suspension of the process.

As described above, the conductive substrate 102 can also be attached to the substrate support 101 by the clamp ring 302 alone. In this case, the internal space 306 can also have an increased pressure (for example, by using nitrogen gas).

The nozzle 308 of the air duct may be shaped as a groove or hole in the front surface of the substrate support 101. The nozzle 308 can be arranged in a pattern of concentric circles or radial lines, or a combination of the two. Different pressures can be applied to different nozzles 308 or groups of nozzles 308 at different radial positions, i.e., the applied pressure can be equal along the concentric circles of the substrate support 101.

Referring to FIG. 3B, a cross-section of an embodiment of the present invention is illustrated in which the conductive substrate 102 is attached to the substrate support 101 by a negative pressure alone. The gasket 303A seals the interior space 306 to be isolated from the electrolyte.

Referring to Figure 4, illustrated is another embodiment of the present invention in which a negative pressure is established in internal space 306. This pressure is small enough to bend the conductive substrate 102 toward the substrate support 101. Electrical contact may in turn be established by a contact member (not shown), such as a conductive plate that substantially covers the entire front side of the substrate support 101. In this embodiment, the back of the conductive substrate 102 may remain more or less fully exposed. In other embodiments, the negative pressure in the interior space 306 can be used in conjunction with any of the contact members described herein to improve electrical contact between the contact member and the conductive substrate 101.

The fourth figure does not include the clamp ring 302, but it is equally possible to bend the substrate 102 toward the substrate support 101 when the clamp ring 302 is used.

Referring to Figure 5, there is illustrated a cross section of another embodiment of the present invention. Instead of screwing the clamp ring 302 to the substrate support 101, the clamp ring 302 and the substrate support 101 can be connected to each other by a guiding element 501 spaced along the circumference of the ring/support. Thus, the clamp ring 302 can be lowered to an loading/unloading position or raised to a processing position by an actuator such as a linear motor, stepper or rotary motor (not shown) or by a pneumatic actuator. In the loading/unloading position, the substrate 102 can be loaded/unloaded automatically by a robotic arm (not shown) or manually by an operator. The loading operation can be performed by lifting the substrate 102 in contact with the gasket 303A, wherein adhesion is then ensured by the negative pressure established in accordance with the description of Fig. 3A. Dropping the substrate onto the gasket 303B and lifting it to contact the gasket 303A can also be used to load the substrate 102.

The distance between at least two of the guiding elements 501 is greater than the diameter of the substrate 102 to facilitate loading the substrate 102 into the substrate support 101 and unloading the substrate 102 from the substrate support 101.

Another embodiment of the loading/unloading device can be in the form of a pressure actuator 502A and/or 502B connectable to the at least one conduit, the pressure actuator capable of supporting the conductive substrate by a negative pressure The pressure actuators are extendable and contractible to bring the conductive substrate adjacent to or away from the first surface of the substrate support. The pressure actuator 502A can be, for example, a vacuum pin or a vacuum chuck, while the pressure actuator 502B can be, for example, a vacuum chuck. Therefore, the pressure actuators 502A and/or 502B can be mounted in the front side of the substrate support 101. When the substrate 102 is brought into proximity with the substrate support 101 manually or by a robot arm, the actuators 502A and/or 502B are extended to support the back of the substrate 102 by vacuum suction. The actuators 502A and/or 502B are then retracted to bring the substrate 102 into contact with the gasket 303A. Actuator 502A can be arranged in a circle with a maximum internal spacing of 120°, such as when having three actuator vacuum pins 502A. An actuator 502B, such as a vacuum chuck, can be mounted to the center of the substrate support 101. The actuator 502B has a smaller diameter than the conductive substrate 102. The extension and contraction of the actuators 502A and 502B can be performed by pneumatic members, or by a linear motor, or a stepper motor or a rotary motor (not shown).

Instead of a clamp ring 302, an edge holder (not shown) such as a hook or edge clamp ring (unlike the clamp ring) can be used to clamp the edge of the conductive substrate 102 and stretch it against the substrate support 101. And gasket 303A.

Referring to Figure 6, a cross section of another embodiment of the present invention is illustrated. Here, the substrate support 101 and the clamp ring 302 are designed with the inclined guide surfaces 601A and 601B, respectively. Guide surfaces 601A and 601B are used to align substrate 102 laterally and horizontally relative to substrate support 101 during a loading operation. The substrate support 101 and the clamp ring 302 may be provided with gaskets 303A and 303B, respectively. For the sake of clarity, the gasket 303A and the gasket 303B have been omitted in Fig. 6.

As noted above, the clamp ring 302 depicted in FIG. 6 can be attached to the substrate support 101, for example, by screwing. However, as described in connection with Figure 5, it is equally possible to use a design with a guiding element 501.

When the back insulating layer 103A is used, it may be necessary to align the pattern of the back insulating layer 103A with the contact member of the substrate support 101 when the substrate 102 is loaded into the substrate support 101.

Referring to Figure 7, illustrated is an exemplary embodiment of a front side of the substrate support 101 and a physically adjustable contact member 701.

In an embodiment, the physically adaptable contact member 701 means that the device includes the contact element 701A and the interconnect structure 701B.

The physically adaptable contact members 701 are arranged here in a star pattern wherein the individual contact elements 701A are evenly spaced along the interconnect structure 701B. The pattern of interconnect structure 701B can be designed as a concentric circle or a combination of concentric circles and stars. However, any shape capable of covering a substantial portion of the conductive substrate 102 is encompassed within the scope of the present invention. In the embodiment according to Fig. 7, the contact elements 701A are electrically connected in parallel with one another via the interconnect structure 701B. Contact elements 701A are then electrically coupled in parallel to each other to a common potential node 702 via interconnect structure 701B. Node 702 may or may not be located at the center of substrate support 101. As described in connection with FIG. 1, node 702 is in turn coupled via piston 110 to at least one external potential (not shown). It is also possible to contact element 701A individually or with at least two contact elements 701A The groups are connected to different potentials to apply different potentials to different portions of the conductive substrate 102. In this situation, it may be necessary to direct a number of conductors via the piston 110 to at least one external power source to provide different potentials to the different contact elements 701A. Typically, when different potentials are applied to different portions of the conductive substrate 102, it is preferred to maintain the potential of the contact element 701A at a particular radius from the center, at a particular location, for example to apply a voltage in a concentric equipotential circle.

Contact element 701A can be designed in many different ways without departing from the concepts of the present invention. However, a feature that is common and characteristic of all designs is that the contact element 701A should be flexible/elastic in the vertical direction. Therefore, electrical contact with the back of the conductive substrate 102 can be established regardless of the structural configuration of the substrate surface. The different designs of the contact elements 701A will be described more closely below in connection with Figures 9 through 13.

Referring to Fig. 8, illustrated is another exemplary embodiment of the present invention showing the front side of the substrate support member 101 and the physically adjustable contact member 701. The device of Figure 8 differs from the device of Figure 7 only in that there is a large contact element 701C at the center. In all other respects, the devices are identical to Figure 7 and provide the same alternative to the configuration of the electrical connections and the layout of the physically adaptable contact members 701.

In an embodiment, the contact element 701A is made of a conductive material and is designed like a hook that is resiliently flexible in a vertical direction. Contact element 701A is then in electrical contact with the back of conductive substrate 102. For example, as disclosed in Figures 7 and 8, contact element 701A, which is part of a physically adaptable contact member 701, is electrically coupled in parallel to other similar contact elements 701A via interconnect structure 701B. Contact element 701A can then be slightly compressed to make physical contact with back insulating layer 103A of conductive substrate 102.

Referring to Fig. 9, illustrated is another exemplary embodiment of the front side of the substrate support 101 and the physically adjustable contact member 901. The physically adaptable contact members 901 are here arranged in a star pattern, wherein individual contact elements 901A in the form of conductive elastomeric tubes are connected to the interconnect structure 901B. The tube can be made, for example, of a conductive rubber. The pattern of interconnect structure 901B and contact element 901A can also be designed as a concentric circle or a combination of concentric circles and stars. Any shape capable of covering a substantial portion of the conductive substrate 102 is encompassed within the scope of the present invention. In this embodiment, the contact elements 901A are electrically connected in parallel to each other via a interconnect structure 901B to a common potential node 902 located at the center of the substrate support 101. As described in connection with FIG. 1, node 902 is in turn coupled to at least one external power source (not shown) via piston 110 (not shown). It is also possible to divide the contact element 901A along its length into shorter contact sections (not shown) that are electrically insulated from each other. The contact segments can then be connected to different potentials individually or in groups of at least two contact segments to apply different potentials to different portions of the conductive substrate 102. This can improve the voltage distribution in the conductive substrate, thereby causing a more uniform rate of plating material on the conductive substrate. A more uniform plating rate allows more material to be plated in the recesses of the conductive substrate 102 without overfilling specific areas. In the subsequent electrochemical pattern replication (ECPR) process, if a conductive substrate is to be used as the main electrode and brought into contact with the target wafer substrate, it is critical to avoid overfilling because the overfilled material will make the main electrode Short-circuit with the target substrate, and thus the ECPR process cannot be performed. This is especially important when high rates are required. In this situation, it may be necessary to direct a plurality of conductors via the piston 110 to at least one external power source to provide different potentials to different sections. Generally, when different potentials are applied to different portions of the conductive substrate 102, it is preferred to maintain the potential of the contact segments at a particular radius from the center, at a particular location, for example to apply a voltage in a concentric equipotential circle.

FIGS. 10A and 10B illustrate the flexibility of the physically adaptable contact member 901.

Referring to Fig. 10A, illustrated is a detailed view of one of the contact elements 901A in accordance with an embodiment. An exemplary embodiment of the depicted contact element 901A is made of a relatively soft tubular material that can be electrically conductive or whose surface can be coated with a conductive flexible film 1001. The interior 1002 of the contact element 901A can be hollow or filled with another flexible material. FIG. 10A shows how the contact element 901A makes electrical contact with the back of the conductive substrate 102. Contact element 901A, which is part of the physically adaptable contact member 901, is electrically coupled in parallel to other similar contact elements 901A via interconnect structure 701B.

Referring to Fig. 10B, illustrated is a slightly compressed contact element 901A that is in physical contact with the back insulating layer 103A of the conductive substrate 102.

In another embodiment, the contact element 901A can be a spring of electrically conductive material. The spring may be arranged in a star pattern as depicted in Figure 9, but the springs may also be arranged in concentric circles or a combination of the two. Any other feature of the device of Figures 9, 10A and 10B can also be applied to the spring.

Referring to Fig. 11A, illustrated is another view of an exemplary embodiment of a physically adaptable contact member 1101. Contact element 1101A includes micro bellows 1102A that may be inflated or deflated by an actuator such as an external pump unit or other pneumatic actuator (not shown) as desired. The bellows 1102A can be deflated, for example, when loading the substrate into the substrate support 101 and then inflated to establish electrical contact at the contact zone 203. Air conduit 1103 is provided in substrate support 101 and is coupled to an external pneumatic actuator via at least one valve 1104 via an air conduit in piston 110 (not shown).

In another embodiment, an overpressure or vacuum may be provided to the air conduit via the detachable connector. In this case, a check valve can be used to maintain vacuum or pressure.

As shown in the figure, the contact element 1101A is connected in parallel via the interconnect structure 1101B. As previously described, in conjunction with Figures 7 through 10, contact elements 1101A can also be connected individually or in groups to enable different voltages to be applied to different sets of different contact elements 1101A or contact elements 1101A.

Instead of a bellows, it is equally possible to mount the contact element 1101A on a component that is actuated by a linear motor, stepper motor or rotary motor.

Referring to Figure 11B, illustrated is another detailed view of an exemplary embodiment of a physically adaptable contact member 1101. Here, the contact element 1101A is mounted on the elastic spring 1102B. The resilient spring 1102B in a mechanically unstressed state is sufficiently extended to allow the contact element 1101A to reach the contact zone 203 when loading the substrate 102 into the substrate support 101. As shown in the figure, contact elements 1101A are connected in parallel via interconnect structure 1101B. As previously described, in conjunction with Figures 7 through 10, contact elements 1101A can also be connected individually or in groups to enable different voltages to be applied to different sets of different contact elements 1101A or contact elements 1101A.

Referring to Figures 12A and 12B, illustrated is another exemplary embodiment of a physically adaptable contact member 1201. The contact element 1201A is mounted on a relatively flexible flexible elastic layer 1202 attached to a substrate support 101 (not shown). Thus, the elastic layer 1202 is located adjacent the contact element 1201A and the contact element 1201A is located distally of the elastic layer 1202. When the substrate 102 is loaded into the substrate support 101 (not shown), the flexible elastic layer will be adapted according to the pressure from the contact element 1201A. As shown in FIG. 12B, the contact member 1201A that is in contact with the back insulating layer 103A is pushed into the flexible elastic layer 1202. Other contact elements 1201A will enter the recess and make contact with contact area 203.

The contact element 1201A can be connected in parallel to a universal voltage or can be connected via a flexible elastic layer 1202, via an interconnect structure (not shown), or individually or in groups of at least two contact elements 1201A to at least one external voltage source (not shown) Show).

In an embodiment, the flexible conductive film 1203 can be disposed between the contact element 1201A and the conductive substrate 102, that is, on the far side of the contact element 1201A. The flexible conductive film 1203 then acts as an interface between the contact element 1201A and the conductive substrate 102. In the case where different voltages are required at different portions of the conductive substrate 102, it may be necessary to divide the conductive film into concentric circles that are electrically insulated from each other.

Referring to Figures 13A and 13B, illustrated is another exemplary embodiment of a physically adaptable contact member 1301. The hard conductive layer 1302 is applied to the substrate support 101 (not shown) and electrically connected to the substrate support 101. The contact element 1301A is formed as a conductive foil including the protruding structure 1303. Such structures may, for example, be flexible, resilient, point-like protrusions or elongated corrugations. Such flexible protruding structures can be fabricated in the conductive foil, for example, by cutting, pressing corrugations, laser cutting, drilling, water jet cutting, or by milling the desired structure over the foil. The protrusions can be directly produced by a forming process or by deforming/bending the shaped portion to protrude from the flat foil.

When the contact member 1301A is pressed against the substrate 102 loaded into the substrate support 101 (not shown), the protrusion 1303 in physical contact with the back insulating layer 103A can be elastically deformed to allow the other protrusions 1303 to enter the recessed holes. Electrical contact with contact zone 203 is established.

In the case where different voltages are required at different portions of the conductive substrate 102, the hard conductive layer 1302 and the contact member 1301A may be divided into concentric circles electrically insulated from each other. The resulting contact elements 1301A can then be connected in parallel to a common voltage or can be connected via a hard conductive layer 1302, via an interconnect structure (not shown), or individually or in groups of at least two contact elements 1301A to at least one external voltage source (not Graphic).

Referring to Figures 14A and 14B, illustrated is another exemplary embodiment of a physically adaptable contact member 1401. The relatively soft elastic layer 1402 is applied to the substrate support 101 (not shown). Contact element 1401A is formed as a flat, compliant, and conductive foil applied distally of the elastic layer 1402. When the elastic layer 1402 is pressed against the conductive substrate 102 by the substrate support 101, the elastic layer 1402 will be elastically deformed to enter the recess formed by the back insulating layer 103A, thereby also squeezing the compliant contact member 1401A to The conductive substrate 102 is in electrical contact.

An interconnect structure (not shown) may be disposed on the substrate support 101 and connected to the contact element 1401A via the elastic layer 1402.

In the event that different voltages are required at different portions of the conductive substrate 102, the contact elements 1401A can be divided into concentric circles that are electrically insulated from each other. The resulting contact elements 1401A can then be connected in parallel to a common voltage or can be connected via an interconnect structure (not shown) to each of the at least one external voltage source via an interconnect structure (not shown) or a group of at least two contact elements 1401A (not shown) Show).

Referring now to Figures 15A and 15B, illustrated is another exemplary embodiment of a physically adaptable contact member 1501. Contact element 1501A is a thin conductive foil that is secured to substrate support 101 circumferentially by a hermetic seal such as an O-ring, lip seal or glue seal, or by a mechanical clamp such as a clamp ring. An overpressure can be established in the volume enclosed between the contact element 1501A and the substrate support 101 via a nozzle (not shown) in the substrate support 101 (i.e., adjacent the contact element 1501A). When the substrate support 101 is subsequently pressed against the conductive substrate 102 together with the pressurized contact member 1501A, the contact member 1501A is deformed to enter the recess formed by the back insulating layer 103A, thereby establishing electrical contact with the conductive substrate 102. .

Referring now to Figures 15C and 15D, illustrated are alternate embodiments of the devices shown in Figures 15A and 15B. Here, the contact elements have been divided into concentric circles that are electrically insulated from each other. The resulting contact elements 1501A can then be connected in parallel to a common voltage or can be connected via a substrate support 101, via an interconnect structure (not shown), or individually, to a group of at least two contact elements 1501A to at least one external voltage source (not As shown, for example, various voltages or currents are connected to different individuals or groups of contact elements. A groove 1503 can be formed between the arc segments and a valve 1502 can be disposed in the groove to provide a negative pressure outside the volume enclosed between the contact element 1501A and the substrate support 101. This negative pressure can be added to the overpressure described above. The purpose of the negative pressure is to improve the surface suitability of the contact element 1501A. Contact members 701A, 901A, 1001, 1101A, 1201A, 1203, 1301A, 1401A, and 1501A may be made of a durable, relatively flexible material having a high electrical conductivity (ie, resistant to chemicals and corrosion), such as selected from the group consisting of A metal of Cu, Au, Pt, Pd, Ti or steel or a metal alloy thereof. It may also be coated with a metal layer or made of an insulating material coated with a metal layer. The coating may be selected from durable and chemically resistant materials such as Pt, Pd, Ir, Au or mixed conductive oxides.

The interconnect structures 701B, 901B, 1101B and any of the interconnect structures (not shown) of FIGS. 12, 13, 14 and 15 may be provided with resistors (especially variable resistors) and resistors or Any other component that is considered suitable to control different voltages applied to different portions of the conductive substrate 102 when only one external potential is used. The control of the variable resistor and the display of the measured values are associated with the external unit 112 of FIG.

The interconnection structures 701B, 901B, 1101B and any of the interconnection structures (not shown) of FIGS. 12, 13, 14 and 15 may also be provided with switches to allow electrical connection or disconnection of different portions of the contact members open.

The at least one external power source or voltage source can have a plurality of channels for supplying different potentials and/or currents to different individual contact members or groups of contact members and/or controlling different potentials and/or currents.

In any embodiment of the invention, it is also possible to introduce an additional insulating layer or film (which may be patterned) between the substrate support 101 and the conductive substrate 102. The purpose of this insulating layer or film is to cover the particular exposed contact area 203, and the back insulating layer 103A should be modified. For different applications, such as for different conductive substrates having different front or back insulating patterns or conductive materials, the insulating layer can be easily removed or exchanged to easily modify the shape or size of the exposed contact regions 203.

The embodiments disclosed in Figures 7 through 15 may include the air ducts and nozzles 308 disclosed in Figures 1 and 3 to Figure 6, and the descriptions therewith in accordance with the above. If such different layers are permeable to air and/or other gases, such as nitrogen, such air lines and nozzles may be located behind the layers disclosed in Figures 12-15. According to other embodiments described in conjunction with Figures 1 through 6, if the layers disclosed in Figures 12 through 15 are impermeable to air and/or other gases, such as nitrogen, the different layers may be worn. The locally positioned channels of the layers (corresponding to the nozzles 308 in the front surface of the substrate support 101) whereby pressure or underpressure can still be provided in the interior space 306.

In the same manner, the embodiments disclosed in Figures 7 through 15 may include the pressure actuators 502A and 502B disclosed in Figure 5, and in accordance with the description above. According to other embodiments described in connection with Fig. 5, the pressure actuators 502A and 502B can then operate in passages through the layers disclosed in Figures 12 through 15, whereby the actuator remains tight The substrate 102 is sandwiched.

The substrate support according to an embodiment of the present invention can be used to manufacture and prepare a main electrode, that is, an electrode in the form of a conductive substrate in which an insulating layer forms a pattern of recessed holes in which the conductive surface of the substrate is exposed. During the preparation of the main electrode, the substrate support immerses the substrate in the electrolyte and deposits metal by electroplating in the recess in the front side of the substrate while keeping the back closed and isolated from the electrolyte. The substrate is used as a main electrode in a subsequent electrochemical pattern replication (ECPR) process to fabricate electronic components, waveguides, and the like.

The substrate support in accordance with the present invention greatly improves control of the deposition process by allowing the electrical contact members to be physically adapted to any pattern layout of the substrate and by allowing precise control of the voltage applied to different portions of the substrate.

Although the invention has been described above with reference to specific illustrative embodiments, the invention is not intended to be limited to the specific forms set forth herein. On the contrary, the invention is only limited by the scope of the accompanying claims, and other embodiments that are different from the specifics of the above are also possible within the scope of the appended claims.

The term "comprising" does not exclude the presence of other elements or steps. In addition, although individually listed, a plurality of components, elements or method steps may be implemented by, for example, a single unit or processor. In addition, although individual features may be included in the scope of the different claims, such features may be advantageously combined, and the inclusions in the different claims are not implied and/or advantageous. In addition, the singular reference does not exclude the plural. The terms "a", "first", "second" and the like do not exclude the plural. The component symbols in the scope of the patent application are provided by way of illustration only and should not be construed as limiting the scope of the claims.

d. . . distance

100. . . Plating treatment device

101. . . Substrate support

102. . . Conductive substrate

103. . . Electrical insulation

103A. . . Back insulation

103B. . . Front side insulation

103C. . . Edge insulation

104. . . Clamp ring

105. . . Bowl cavity

106. . . Storage

107. . . anode

108. . . arrow

109. . . External electrolyte collection tank

110. . . piston

111. . . Air duct / dashed line / duct

112. . . External unit

201. . . Electrode layer / conductive material

202. . . arrow

203. . . Contact area

302. . . Clamp ring

303A. . . Seal

303B. . . Seal

303C. . . Seal

304. . . Solid adjustable contact member / contact member

305. . . Low profile structure

306. . . Internal space

307. . . External space

308. . . nozzle

501. . . Guiding element

502A. . . Pressure actuator

502B. . . Pressure actuator

601A. . . Guide surface

601B. . . Guide surface

701. . . Solid adjustable contact member

701A. . . Contact element

701B. . . Interconnect structure

701C. . . Contact element

702. . . Common potential node/node

901. . . Solid adjustable contact member

901A. . . Contact element

901B. . . Interconnect structure

902. . . Common potential node

1001. . . Conductive flexible film

1002. . . internal

1101. . . Solid adjustable contact member

1101A. . . Contact element

1101B. . . Interconnect structure

1102A. . . Micro bellows

1102B. . . Elastic spring

1103. . . Air duct

1104. . . valve

1201. . . Solid adjustable contact member

1201A. . . Contact element

1202. . . Flexible elastic layer

1203. . . Flexible conductive film

1301. . . Solid adjustable contact member

1301A. . . Contact element

1302. . . Hard conductive layer

1303. . . Protruding structure

1401. . . Solid adjustable contact member

1401A. . . Contact element

1402. . . Elastic layer

1501. . . Solid adjustable contact member

1501A. . . Contact element

1502. . . valve

1503. . . Trench

1 is a cross-sectional view of a plating processing chamber; FIGS. 2A to 2C are diagrams showing an exemplary design of a conductive substrate used in conjunction with the present invention; FIGS. 3A, 3B, and 4 are diagrams according to the present invention. Embodiment of the substrate support; FIG. 5 illustrates a loading/unloading embodiment of the substrate support according to the present invention; FIG. 6 illustrates an alignment embodiment of the substrate support according to the present invention; Electrical contact embodiment of a substrate support according to the present invention; FIG. 8 illustrates an electrical contact embodiment of a substrate support according to the present invention; and FIG. 9 illustrates an electrical contact embodiment of a substrate support according to the present invention; 10A and 10B illustrate details of an embodiment of a contact element of a substrate support according to the present invention; FIGS. 11A and 11B illustrate details of an embodiment of a contact element of a substrate support according to the present invention; 12A and 12B illustrate an embodiment of a contact member of a substrate support member according to the present invention; FIGS. 13A and 13B illustrate an embodiment of a contact member of a substrate support member according to the present invention; FIG. 14A and Figure 14B illustrates a substrate support member in accordance with the present invention Embodiments of the contact member; 15A and 15B illustrate another exemplary embodiment of a physically adaptable contact member in accordance with the present invention; and 15C and 15D illustrate a 15A diagram in accordance with the present invention And an alternative embodiment of the device shown in Figure 15B.

d. . . distance

101. . . Substrate support

102. . . Conductive substrate

103A. . . Back insulation

103B. . . Front side insulation

103C. . . Edge insulation

201. . . Electrode layer / conductive material

203. . . Contact area

302. . . Clamp ring

303A. . . Seal

303B. . . Seal

303C. . . Seal

304. . . Solid adjustable contact member / contact member

305. . . Low profile structure

306. . . Internal space

307. . . External space

308. . . nozzle

Claims (32)

A system for electroplating a conductive substrate, the system comprising: (i) a conductive substrate comprising a first conductive side and a second conductive side, wherein the first conductive side of the conductive substrate is to be plated; And (ii) a substrate support member, the substrate support member comprising: at least an attachment member for attaching the conductive substrate to the substrate support member such that a first surface of the substrate support member faces the conductive substrate a second conductive side; and a resilient contact member attached to the first surface of the substrate support, the resilient contact member being connectable to a first external potential, wherein the second conductive side of the conductive substrate The first portion is provided with an insulating material, and a second portion of the second conductive side of the conductive substrate forms at least one contact region; wherein the resilient contact member is in contact with at least one of the at least one contact region, and wherein The first portion and the second portion of the second conductive side of the conductive substrate are configured such that the insulating material forms at least one recessed hole, wherein the at least one contact region provides In the recess. A system according to claim 1, wherein an edge insulating layer (103C) comprising at least one layer of at least one electrically insulating material covers an edge of the electrically conductive substrate (102). The system of claim 1, wherein the at least one contact region covers at least 50% of a diagonal of one of the first conductive sides. The system of claim 1, wherein the elastic contact member is along a distance from a center of the conductive substrate to a peripheral edge of the conductive substrate Contacting at least two contact points with the contact zone. A system according to claim 1 or claim 1, wherein at least one contact area is provided at a center of the conductive substrate. The system of claim 1, wherein the conductive substrate is attached to the substrate support in a sealed manner to prevent the electrolyte solution from contacting the second conductive side of the conductive substrate. The system of claim 1, wherein the insulating material is patterned to provide a plurality of contact regions on the second conductive side. The system of claim 7, wherein the pattern is in the shape of a concentric circle or a circular arc segment. The system of claim 1, wherein the configuration of the contact member is patterned to provide a plurality of contact points on the second conductive side. The system of claim 1, wherein the attachment member comprises: a clamp ring or edge holder along a periphery of the substrate support (101), or a pressure providing member and a hermetic seal, the gas A seal is positioned along the perimeter of the substrate support (101). The system of claim 10, wherein the clamp ring (302) or the edge holder and the substrate support (101) are separated by a guide member (501) spaced along the periphery of the substrate support (101). Connected to each other, the guiding elements (501) are coupled to an actuator that is adapted to be lowered to a loading/unloading position and/or raised to a processing position. The system of claim 1, comprising: at least two contact members, wherein a first resilient contact member is connectable to the first outer a partial potential, and a second resilient contact member is connectable to a second external potential. A substrate support for supporting a conductive substrate during plating, comprising at least: an attaching member for attaching the conductive substrate to the substrate support such that a first surface of the substrate support faces the a second conductive side of the conductive substrate; and an elastic contact member attached to the first surface of the substrate support and connectable to at least one external potential, and wherein the configuration of the contact member is patterned to thereby couple a plurality of contact points Provided on the second conductive side of the conductive substrate. The substrate support of claim 13, wherein the contact member comprises: an interconnect structure (701B) distributed on the first surface of the substrate support, interconnecting the resilient contact members (701A). The substrate support of claim 14, wherein the distribution of the interconnect structure (701B) is in a shape selected from the group consisting of a star shape, a concentric shape, or a concentric circle. The shape is combined with one of the stars. The substrate support of claim 14, wherein the contact elements (701A) are electrically connected in parallel to each other via a interconnect structure (701B) to a common potential node (702). The substrate support of claim 14, wherein the contact elements (701A) have flexibility/elasticity in a direction perpendicular to the first surface. A substrate support according to claim 13 of the patent application, comprising: at least one pipe (111) supplying an overpressure or a negative pressure to the contact member (304) or to the substrate support (101) A space between the conductive substrate or a space supplied between the contact member and the substrate support (101). A substrate support according to claim 18, wherein the contact member (304) is movable in a direction perpendicular to the first surface by means of a gas pressure supplied to a bellows of one of the contact members. A substrate support according to claim 18, comprising: a pressure actuator (502A, 502B) connected to the at least one conduit, the pressure actuator capable of supporting a conductive substrate by a negative pressure, The equal pressure actuator is extendable and retractable to bring the electrically conductive substrate adjacent to or away from the first surface of the substrate support. A substrate support according to claim 18, comprising: an additional pressure chamber provided in the body of the substrate support (101) and connected to the pipe, the additional pressure chamber and the contact member ( 304) or the space between the substrate support (101) and the conductive substrate or the space between the contact member and the substrate support (101). The substrate support of claim 13, wherein the contact member (304) is mounted on a member that is actuated by a linear motor, a stepper motor or a rotary motor such that the contact member (304) is vertical It is movable in the direction of the first surface. According to the substrate support member of claim 13, wherein the connection The contact member (304) includes a hook, loop or tube having flexibility/elasticity in a direction perpendicular to one of the first surfaces. The substrate support of claim 13, wherein the contact member (304) is attachable to the first surface of the substrate support (101) by at least one integrated lead of the substrate support (101), the at least A lead connects the contact member and at least one external potential. The substrate support of claim 13, wherein the contact member (1201) comprises: a contact member (1201A) mounted on a flexible elastic layer (1202) to which the flexible elastic layer (1202) is attached The first surface of the substrate support (101). The substrate support of claim 25, comprising: a flexible conductive film (1203) disposed on a distal side of the contact elements (1201A). A substrate support according to claim 13 of the patent application, comprising: a hard conductive layer (1302) located adjacent to the contact member (1301A), the rigid conductive layer (1302) and the substrate support 101 being electrically Connected, and wherein the contact member (1301A) is a conductive foil comprising a distally protruding conductive contact structure (1303). A substrate support according to claim 13 of the patent application, comprising: an elastic layer (1402) applied to the first surface of the substrate support (101), wherein the contact element (1401A) is located at The compliant and conductive foil on the far side of the conductive elastic layer (1402). The substrate support of claim 18, wherein the contact member (1501A) is a thin conductive foil which is hermetically sealed a piece is fixed to the first surface of the substrate support (101) along a periphery of the substrate support (101), the thin conductive foil establishing a volume between the first surface of the substrate support and the thin conductive foil The volume is connected to at least one first conduit. The substrate support of claim 29, wherein the contact member (1501) is divided into concentric circles that are electrically insulated from each other. According to the substrate support of claim 30, a groove (1503) formed between the circular arc segments includes: a valve (1502) disposed in the groove, the valves being connected to at least one second pipeline. The substrate support of claim 14, wherein the interconnection structure (701B, 901B, 1101B) is provided with at least one resistor.