TWI464813B - A high-speed to-can optical package module using symmetrical pattern and capacitive compensation technology - Google Patents

Description

Symmetrical Capacitor Compensation High Speed Can Optical Package Module

The present invention relates to a high-speed optical package module, and more particularly to a high-speed TO-can (Transistor Outline Can) optical package module.

The high-speed can-type optical package module is a light-emitting component that converts a signal into an optical signal and attaches the information to be transmitted to a carrier wave and modulates it, for example, Taiwan No. I227078, Taiwan No. I278944, and the United States. Patent No. 7,075,036, B2, and U.S. Patent No. 7,298,937, B2, all of which are related to the technical improvement of such a light-emitting element. However, due to the specifications set by the League of Nations and the development of the 21Gbit/s Fiber Channel (20GFC) and the future 28Gbit/s (32GFC) high transmission speed technology in 2011, the current high-speed can-type optical package module The design must meet at least 25 Gbit/s per second to meet future demand. Therefore, how to increase the transmission frequency of 3 dB bandwidth to meet the requirements of the existing high-speed can-type optical package module The demand for communication is still one of the directions of the academic and industry efforts.

Referring to FIG. 1 , a conventional high-speed can-type optical package module 1 includes a body 11 , two cylindrical electrodes 12 , a substrate 13 , a light emitting element 14 , and a plurality of electrical connecting lines 15 for converting electrical signals into optical signals. And the information to be transmitted is attached to the carrier and modulated and output, and in order to monitor the output optical signal, the high-speed can-type optical package module further includes another cylindrical electrode 16, a light receiving component 17, and a plurality of electric Connection line 18.

The base body 11 has a circular can shape and includes a circular first surface 111, a circular second surface 112 opposite to the first surface 111 and having a larger area than the first surface 111, and two from the first surface. a through hole 113 formed in the second surface 112, and a signal through hole 114 formed on the other side of the second surface 112 from the first surface 111 and located on the other side of the line connecting the two through holes 113, wherein the first surface The center of the 111 and the two perforations 113 and the center of the two-way perforation 114 are two isosceles triangles whose ends are the apex of the first surface 111 and whose apex angle is an obtuse angle.

The two cylindrical electrodes 12 respectively include a dielectric material 121 filled in one of the through holes 113 of the base body 11 , and a dielectric member 121 is coaxially inserted through the dielectric material 121 and protruded at one end. The first surface 111 of the first surface 111 has an electrical pin 122. The other two cylindrical electrodes 16 respectively include a dielectric material 161 filled in one of the signal holes 114 of the base body 11 and a coaxially inserted with the dielectric material 161. An electrical pin 162 is disposed on the first surface 11 at one end of the dielectric member 161.

The substrate 13 is disposed on the first surface 111 in a rectangular shape and symmetric to the two cylindrical electrodes 12 and the other two cylindrical electrodes 16, and includes a mounting surface 131 away from the first surface 111, and is formed on the mounting surface opposite to each other. And a first microstrip line 21 having a predetermined resistance value and a second microstrip line 22 having a first rectangular portion 211 and a line parallel to the center of the two through holes 113 a first scallop 212 extending away from the center of the first surface 111, and a second rectangular portion extending from a center parallel to the same side of the center of the through hole 113 and a center of the signal through hole 114 away from the center of the first surface 111 213. The second microstrip line 22 has a third rectangular portion 221 whose longitudinal direction is substantially parallel to the center of the one of the through holes 113 on the same side and a direction of the center of the signal through hole 114, and a third rectangular portion 221 from the third rectangular portion 221 a short side away from the center of the first surface 111 and forming a long side with a long side of the third rectangular portion 221 away from the center of the first surface 111 and extending further away from the center of the first surface 111 The fourth rectangular portion 222.

The light emitting element 14 is disposed on the mounting surface 131 of the substrate 13 centering on the center of the first surface 11, and the projection toward the first surface 11 covers the first rectangular portion 211 of the first microstrip line 21 and A partial region of the first sector 212 has a predetermined characteristic impedance and generates a monochromatic optical signal of a predetermined frequency domain when the two cylindrical electrodes 12 cooperate to provide an electrical signal. Generally, the light emitting element 14 is a laser diode. LD chip.

A predetermined number of electrical connection lines 15 in the electrical connection lines 15 electrically connect the light emitting element 14 and the first sector portion 212 of the first microstrip line 21 and the third rectangular portion 221 of the second microstrip line 22, respectively. The other electrical connecting lines 15 are electrically connected to the second rectangular portion 213 of the first microstrip line 21 and the electrical pin 122 of one of the cylindrical electrodes 12, respectively, and the fourth rectangle of the second microstrip line 22. The portion 222 and the electrical pin 122 of the other of the cylindrical electrodes 12.

The light receiving component 17 is disposed on the mounting surface 131 of the substrate 13, and the electrical signal is input to the other two cylindrical electrodes 16 to further output a monitoring signal for monitoring the optical signal emitted by the light emitting component 14. The light receiving component 17 is Monitor the photodiode chip (Monitor Photodiode Chip). The electrical connection lines 18 are electrically connected to the light receiving elements 17 and the electrical pins 162 of the two cylindrical electrodes 16, respectively.

When the two cylindrical electrodes 12 are combined to input a signal including a direct current and a high frequency signal to the light emitting element 14, the light emitting element 14 correspondingly converts the electrical signal into an optical signal, and the information to be transmitted is in the optical signal. After the up-modulation is changed, the impedance of the first rectangular portion 211 of the first microstrip line 21 and the first scalloped portion 212, and the third rectangular portion 221 of the second microstrip line 22 are matched to the light-emitting element 14 Actuating the characteristic impedance, and the second rectangular portion 213 of the first microstrip line 21 and the fourth rectangular portion 222 of the second microstrip line 22 generate a coupling capacitance that compensates for the package of the light emitting element 14 and the electrical connection line 15 to maintain The high-speed tank-type optical package module 1 has a frequency response as a whole, and achieves a preset operational characteristic. At the same time, the monitoring signal for the direct current and the high-frequency signal can be output from the other two cylindrical electrodes 16 to the light-receiving element 17. The light receiving component 17 is configured to monitor the optical signal emitted by the light emitting component 14 by correspondingly converting the monitoring optical signal into a monitoring electrical signal.

Although the current high-speed can-type optical package module 1 can convert electrical signals into optical signals, they are respectively connected to the literature shown in Figure 2 [Y. Ou, JS Gustavsson, P. Westbergh, Haglund, A. Larsson, and A. Joel, "Impedance Characteristics and Parasitic Speed Limitations of High-Speed 850-nm VCSELs," IEEE PHOTONICS TECHNOLOGY LETTERS, VOL. 21, NO. 24, DECEMBER 15, 2009] Cavity-faced laser (VCSEL) first equivalent circuit 100, and the literature shown in Figure 3 [Chao-Kun Lin, Ashish Tandon, Kostadin Djordjev, Scott W. Corzine, and Michael RT Tan "High-Speed 985 nm Bottom -Emitting VCSEL Arrays for Chip-to-Chip Parallel Optical Interconnects, "IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 13, NO. 5, SEPTEMBER/OCTOBER 2007] Vertical Resonant Cavity Laser Second Equivalent Circuit When an analog circuit for a transmission amount of 3 dB bandwidth is formed by 200, the transmission efficiency of the 3 dB bandwidth is 14.94 GHz and 14.92 GHz as shown in FIG. 4 and FIG. 5, respectively, and does not satisfy the transmission amount of 25 Gbit/s per second. A requirement of at least greater than 17 GHz is required, presumably that the type design of the first microstrip line 21 and the second microstrip line 22 limits characteristic impedance matching and the resulting coupling capacitance is too small.

Therefore, the design of the existing high-speed can-type optical package module 1, particularly the first and second microstrip lines 21, 22, which affect the characteristic impedance matching and the generated coupling capacitance, needs to be improved to meet the development requirements of optical communication.

Therefore, the object of the present invention is to provide a symmetric capacitor-compensated high-speed tank type having the same overall appearance structure as the existing high-speed tank type optical package module and satisfying the requirement that the transmission amount of 25 Gbit/s per second is at least greater than 17 GHz. Optical package module.

Therefore, the symmetrical capacitor-compensated high-speed can-type optical package module comprises a body, two cylindrical electrodes, a substrate, a light-emitting element, and a plurality of electrical connecting lines.

The base body includes a first surface, a second surface opposite to the first surface, and two perforations formed from the first surface toward the second surface, wherein a center of the first surface and the two perforations The center is an isosceles triangle with the center of the first surface as a vertex.

Each of the cylindrical electrodes includes a dielectric material filled in one of the perforations of the body, and an electrical pin that is coaxially passed through the dielectric material.

The substrate is disposed on the first surface symmetrically to the two cylindrical electrodes, including a mounting surface away from the first surface, and two symmetric microstrip lines formed on the mounting surface opposite each other and having a predetermined impedance value, each The symmetric microstrip line has a first rectangular portion closer to the center of the first surface, and a long side of the first rectangular portion that is away from the center of the first surface forms a long side and is coincident with the first rectangular portion a short side of the second rectangular portion extending away from the center of the first surface, wherein the first rectangular portion of the two symmetric microstrip lines is closer to a longer side than the second side of the first surface than the second rectangular portion The distance between the long sides of the center of the first surface, and the second rectangular portion of the two symmetric microstrip lines form a compensation coupling capacitance.

The light emitting element is disposed on the mounting surface of the substrate centered on the center of the first surface and generates a monochromatic optical signal of a predetermined frequency domain when the electrical signal is supplied, and the characteristic impedance and the second symmetric microstrip line The impedance of a rectangular portion matches.

a predetermined number of electrical connection lines electrically connecting the light emitting element and the first rectangular portion of the two symmetric microstrip lines, respectively, and the other electrical connection lines electrically connecting the second rectangular portion of the two symmetric microstrip lines and the two cylindrical electrodes respectively Electric pin.

The object of the present invention and solving the technical problems thereof can also be further implemented by the following technical measures.

Preferably, the first surface of the seat body is circular.

Preferably, the center of the first surface and the center of the two perforations are isosceles triangles with the center of the first surface as a vertex and the vertex angle as an obtuse angle.

Preferably, the projection of the light-emitting element toward the first surface covers a partial region of the first rectangular portion of the two microstrip lines.

Preferably, the second surface of the seat body is circular rather than the first surface.

Preferably, the base body further includes two signal perforations formed from the first surface toward the second surface and located on the other side of the two perforation lines, wherein the center of the first surface and the two signals are perforated The center is an isosceles triangle having a vertex of the center of the first surface; the symmetric capacitor-compensated high-speed can-type optical package module further includes two cylindrical electrodes respectively disposed in the signal perforations, and a structure disposed on the substrate a light receiving component and a plurality of electrical connecting wires respectively, wherein the two cylindrical electrodes respectively comprise a dielectric material filled in the one of the signal holes, and a dielectric material is coaxially passed through the dielectric material The electrical pins are electrically connected to the light receiving component and the two electrical pins.

The utility model has the advantages that: the design substrate has two symmetrical microstrip lines which are arranged in an L shape and are mirrored at a distance from each other, while maintaining the overall appearance structure and the existing high-speed can-type optical package module. The impedance of the first rectangular portion of the second symmetric microstrip line is matched with the light emitting element, and the second rectangular portion forms a compensation coupling capacitor, so that the transmission efficiency of the 3dB bandwidth of the package module satisfies at least 25 Gbit/s transmission per second. More than 17GHz demand.

The foregoing and other technical aspects, features and advantages of the present invention will be apparent from the following description of the preferred embodiments.

Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 6, a preferred embodiment of the symmetric capacitor-compensated high-speed can-type optical package module 2 includes a body 11, two cylindrical electrodes 12, a substrate 13, a light-emitting element 14, and a plurality of electrical connections. 15. The electrical symbol is converted into an optical signal, and the information to be transmitted is attached to the carrier and modulated, and then outputted. To monitor the output optical signal, the symmetric capacitive compensation high-speed can-type optical package module 2 The preferred embodiment further includes a second cylindrical electrode 16, a light receiving element 17, and a plurality of electrical connections 18.

The base body 11 has a circular can shape and includes a circular first surface 111, a circular second surface 112 opposite to the first surface 111 and having a larger area than the first surface 111, and two from the first surface. a through hole 113 formed in the second surface 112, and a signal through hole 114 formed on the other side of the second surface 112 from the first surface 111 and located on the other side of the line connecting the two through holes 113, wherein the first surface The center of the 111 and the two perforations 113 and the center of the two-way perforation 114 are two isosceles triangles whose ends are the apex of the first surface 111 and whose apex angle is an obtuse angle.

The two cylindrical electrodes 12 respectively include a dielectric material 121 filled in one of the through holes 113 of the base body 11 , and a dielectric member 121 is coaxially inserted through the dielectric material 121 and protruded at one end. The electrical pins 122 of the first surface 111; the other two cylindrical electrodes 16 respectively include a dielectric material 161 filled in one of the signal holes 114 of the base body 11 and coaxially with the dielectric material 161 An electrical pin 162 is formed through the dielectric member 161 and has an end protruding from the first surface 111.

The substrate 13 is disposed on the first surface 111 in a rectangular shape and symmetrically opposite to the two cylindrical electrodes 12 and the other two cylindrical electrodes 16, and includes a mounting surface 131 away from the first surface 111, and two opposite to each other are formed in the structure. The surface 131 has a symmetrical microstrip line 3 having a predetermined impedance value, and the two symmetrical microstrip lines 3 are substantially L-shaped mirror images of each other, respectively having a first rectangular portion 31 closer to the center of the first surface 111, and a A long side of the first rectangular portion 31 away from the center of the first surface 111 forms a long side and a second rectangular portion extending from a short side of the first rectangular portion 31 away from the center of the first surface 111 32, wherein a distance between a first side of the first rectangular portion 31 of the two symmetric microstrip lines 3 and a long side of the center of the first surface 111 is greater than a distance between the long sides of the second rectangular portion 32 that is closer to the center of the first surface 111, At the time of actuation, the second rectangular portion 32 of the two symmetric microstrip lines 3 forms a compensation coupling capacitance.

The light-emitting element 14 is disposed on the mounting surface 131 of the substrate 13 centering on the center of the first surface 111, and the first projection of the first surface 11 covers the first of the two symmetric microstrip lines 3 a portion of the rectangular portion 31, the light-emitting element 14 has a predetermined characteristic impedance and generates a monochromatic optical signal of a predetermined frequency domain when the two cylindrical electrodes 12 cooperate to provide an electrical signal; in this example, the light-emitting element 14 is also Laser diode chip (LD chip).

A predetermined number of electrical connection lines 15 in the electrical connection lines 15 are electrically connected to the light emitting element 14 and the first rectangular portion 31 of the two symmetric microstrip lines 3, respectively, and the other electrical connection lines 15 are electrically connected to the two symmetric lines, respectively. The second rectangular portion 32 of the microstrip line 3 and the electrical pin 122 of the two cylindrical electrodes 12.

The light receiving component 17 is disposed on the mounting surface 131 of the substrate 13, and the electrical signal is input to the cylindrical electrode 16 to further output a monitoring optical signal for monitoring the optical signal emitted by the light emitting component 14. The light receiving component 17 is monitored. The photodiode chips 18 electrically connect the light receiving element 17 and the electrical pins 162 of the two cylindrical electrodes 16, respectively.

When the two cylindrical electrodes 12 are combined to input an electric signal including a direct current and a high frequency signal to the light emitting element 14, the light emitting element 14 correspondingly converts the electrical signal into an optical signal, and the information to be transmitted is in the optical signal. After the up-modulation is changed, the impedance of the first rectangular portion 31 of the two-symmetric microstrip line 3 matches the characteristic impedance of the light-emitting element 14, and the second rectangular portion 32 of the two-symmetric microstrip line 3 generates compensation. The coupling capacitance of the light emitting element 14 and the electrical connection line 15 maintains the high frequency response of the symmetrical capacitive compensation type high speed can type optical package module 2, thereby achieving preset high speed operation characteristics; The two cylindrical electrodes 16 cooperate with the input of the monitoring electric signal including the direct current and the high frequency signal to the light receiving element 17, so that the light receiving element 17 converts the monitoring electrical signal into the monitoring optical signal, thereby monitoring the light emitting element 14 to emit Optical signal.

The length and width of the first rectangular portion 31 of the two-symmetric microstrip line 3 are 0.3647 mm and 0.2937 mm, respectively, and the length and width of the second rectangular portion 32 are 0.7153 mm and 0.4223 mm, respectively. The two symmetric microstrip lines 3 are respectively The pitch of the second rectangular portion 32 closer to the long side of the center of the first surface 111 is 0.02 mm, and the pitch of the first rectangular portion 31 of the second symmetric microstrip line 3 closer to the center of the center of the first surface 111 is 0.2972mm is the experimental sample, respectively connected to the vertical cavity surface laser (VCSEL) first equivalent circuit 100 of the literature shown in Figure 2, and the vertical cavity surface laser of the literature shown in Figure 3 When the equivalent circuit 200 forms an analog circuit for measuring the transmission amount of the 3 dB bandwidth, the transmission efficiency of the 3 dB bandwidth is 21.37 GHz and 17.64 GHz as shown in FIG. 7 and FIG. 8, respectively, and does satisfy 25 Gbit/s/per. The amount of transmission of s needs to be at least greater than the requirement of 17 GHz.

Referring to FIG. 9 , FIG. 10 , FIG. 11 and FIG. 12 , FIG. 9 is an eye diagram of the conventional high-speed can-type optical package module shown in FIG. 1 connected to the second equivalent circuit 200 and carrying 50 Ω and 21 Gb/s. The simulation results (analyzed by ADS (Advanced Design System) with HFSS (High Frequency Structure Simulator)), FIG. 10, FIG. 11, and FIG. 12 are respectively the experimental samples of the present invention described above connected to the second equivalent circuit 200 and loaded at 50 Ω. And the eye diagram simulation results of 21Gbit/s, 25Gbit/s, and 28Gbit/s respectively (also analyzed by ADS with HFSS). It can be seen from the figure that the eye diagram performance at 21 Gbit/s uses the symmetric capacitance compensation method of the present invention. The high-speed can-type optical package module 2 has been improved a lot, and the eye diagram performance at 25 Gbit/s and 28 Gbit/s is as clear as visible.

From the analog circuit measurement results and the eye diagram simulation results of the above experimental samples, it can be confirmed that the symmetric capacitor-compensated high-speed can-type optical package module 2 of the present invention has a uniform appearance and a uniform condition. The design of the mirror-shaped symmetric microstrip line 3 limits the characteristic impedance matching and the coupling capacitance generated, and effectively improves the transmission efficiency of the current high-speed can-type optical package module in 3dB bandwidth, and achieves 25Gbit/s per second. The transmission capacity is greater than the development requirements of light-emitting components of 17 GHz.

In summary, the symmetrical capacitor-compensated high-speed can-type optical package module 2 of the present invention is L-shaped and mirrored by not restricting the appearance of the existing high-speed can-type optical package module. The resistance of the first rectangular portion 31 of the symmetric microstrip line 3 disposed oppositely matches the characteristic impedance of the light-emitting element 14, and the coupling capacitance generated by the second rectangular portion 32 is encapsulated with respect to the light-emitting element 14 and the electrical connection line 15. Component frequency compensation achieves the requirement of satisfying a transmission capacity of 25 Gbit/s per second greater than 17 GHz, while maintaining high frequency response and achieving high speed operation characteristics, the object of the present invention can be achieved.

However, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention, All remain within the scope of the invention patent.

131‧‧‧ Construction surface

2‧‧‧Symmetric type capacitor compensation type high speed tank type optical package module

14‧‧‧Light emitting elements

15‧‧‧Electrical cable

11‧‧‧

16‧‧‧Cylindrical electrode

111‧‧‧ first surface

161‧‧‧ dielectric materials

112‧‧‧ second surface

162‧‧‧Electric pins

113‧‧‧Perforation

17‧‧‧Light receiving components

114‧‧‧ Signal piercing

18‧‧‧Electrical cable

12‧‧‧Cylindrical electrode

3‧‧‧Symmetric microstrip line

121‧‧‧ dielectric materials

31‧‧‧First rectangular part

122‧‧‧Electric pins

32‧‧‧Second rectangular part

13‧‧‧Substrate

1 is a schematic view showing a conventional high speed can type optical package module;

Figure 2 is a circuit diagram showing the existing high-speed can-type optical package module attached to the literature [Y. Ou, JS Gustavsson, P. Westbergh, Haglund, A. Larsson, and A. Joel, "Impedance Characteristics and Parasitic Speed Limitations of High-Speed 850-nm VCSELs," IEEE PHOTONICS TECHNOLOGY LETTERS, VOL. 21, NO. 24, DECEMBER 15, 2009] An equivalent circuit to form an analog circuit for measuring a transmission amount of 3 dB bandwidth;

Figure 3 is a circuit diagram showing the existing high-speed can-type optical package module attached to the literature [Chao-Kun Lin, Ashish Tandon, Kostadin Djordjev, Scott W. Corzine, and Michael RT Tan "High-Speed 985 nm Bottom-Emitting VCSEL Arrays for Chip-to-Chip Parallel Optical Interconnects, "IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 13, NO. 5, SEPTEMBER/OCTOBER 2007] provides a second equivalent circuit for measuring 3dB bandwidth Analog circuit of the amount of transmission;

4 is a relationship between an insertion loss and a frequency, illustrating the performance of the analog circuit shown in FIG. 2 at a bandwidth of 3 dB;

5 is a relationship between insertion loss and frequency, illustrating the performance of the analog circuit shown in FIG. 3 at a bandwidth of 3 dB;

6 is a schematic view showing a preferred embodiment of a symmetric capacitance compensation type high speed can type optical package module of the present invention;

7 is a relationship diagram of insertion loss and frequency, illustrating a preferred embodiment of the symmetrical capacitor-compensated high-speed can-type optical package module of the present invention shown in FIG. 6. [Y. Ou , JS Gustavsson, P. Westbergh, Haglund, A. Larsson, and A. Joel, "Impedance Characteristics and Parasitic Speed Limitations of High-Speed 850-nm VCSELs," IEEE PHOTONICS TECHNOLOGY LETTERS, VOL. 21, NO. 24, DECEMBER 15, 2009] An equivalent circuit forms an analog circuit for measuring a transmission amount of 3 dB bandwidth when expressed in a transmission amount of 3 dB bandwidth;

FIG. 8 is a diagram showing the relationship between the insertion loss and the frequency, and illustrating a preferred embodiment of the symmetrical capacitor-compensated high-speed can-type optical package module of the present invention shown in FIG. 6 [Chao-Kun] Lin, Ashish Tandon, Kostadin Djordjev, Scott W. Corzine, and Michael RT Tan "High-Speed 985 nm Bottom-Emitting VCSEL Arrays for Chip-to-Chip Parallel Optical Interconnects," IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 13, NO. 5, SEPTEMBER / OCTOBER 2007] provides a second equivalent circuit to form an analog circuit for measuring a transmission amount of 3 dB bandwidth when the transmission amount is expressed in 3 dB bandwidth;

Figure 9 is a simulation test result diagram showing the existing high-speed can-type optical package module attached to the literature [Chao-Kun Lin, Ashish Tandon, Kostadin Djordjev, Scott W. Corzine, and Michael RT Tan "High-Speed 985 nm Bottom -Emitting VCSEL Arrays for Chip-to-Chip Parallel Optical Interconnects, "IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 13, NO. 5, SEPTEMBER/OCTOBER 2007] provided a second equivalent circuit for measurement An analog circuit with a transmission bandwidth of 3 dB bandwidth is loaded with an eye diagram signal of 50 Ω and 21 Gbit/s;

Figure 10 is a simulation test result diagram illustrating a preferred embodiment of the symmetric capacitance-compensated high-speed can-type optical package module of the present invention. [Chao-Kun Lin, Ashish Tandon, Kostadin Djordjev, Scott W. Corzine, and Michael RT Tan "High-Speed 985 nm Bottom-Emitting VCSEL Arrays for Chip-to-Chip Parallel Optical Interconnects," IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 13, NO. 5, SEPTEMBER/OCTOBER 2007] The second equivalent circuit forms an eye diagram signal for measuring 50 Ω, 21 Gbit/s of the analog circuit for measuring the transmission amount of the 3 dB bandwidth;

Figure 11 is a simulation test result diagram illustrating a preferred embodiment of the symmetrical capacitor-compensated high-speed can-type optical package module of the present invention. [Chao-Kun Lin, Ashish Tandon, Kostadin Djordjev, Scott W. Corzine, and Michael RT Tan "High-Speed 985 nm Bottom-Emitting VCSEL Arrays for Chip-to-Chip Parallel Optical Interconnects," IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 13, NO. 5, SEPTEMBER/OCTOBER 2007] The second equivalent circuit forms an eye diagram signal for measuring the transmission amount of the 3 dB bandwidth at a load of 50 Ω and 25 Gbit/s;

Figure 12 is a simulation test result diagram illustrating a preferred embodiment of the symmetric capacitance-compensated high-speed can-type optical package module of the present invention. [Chao-Kun Lin, Ashish Tandon, Kostadin Djordjev, Scott W. Corzine, and Michael RT Tan "High-Speed 985 nm Bottom-Emitting VCSEL Arrays for Chip-to-Chip Parallel Optical Interconnects," IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 13, NO. 5, SEPTEMBER/OCTOBER 2007] The second equivalent circuit forms an eye diagram signal for measuring 50 Ω, 28 Gbit/s of the analog circuit for measuring the transmission amount of the 3 dB bandwidth.

11. . . Seat body

111. . . First surface

112. . . Second surface

113. . . perforation

114. . . Signal perforation

12. . . Cylindrical electrode

121. . . Dielectric material

122. . . Electric pin

13. . . Substrate

131. . . Construction surface

14. . . Light emitting element

15. . . Electrical cable

16. . . Cylindrical electrode

161. . . Dielectric material

162. . . Electric pin

17. . . Light receiving element

18. . . Electrical cable

2. . . Symmetrical Capacitor Compensation High Speed Can Optical Package Module

3. . . Symmetric microstrip line

31. . . First rectangle

32. . . Second rectangular part

Claims (5)

A symmetrical capacitance-compensated high-speed can-type optical package module comprising: a body comprising a first surface, a second surface opposite to the first surface, and two from the first surface to the second surface a perforation, wherein a center of the first surface and a center of the two perforations are an isosceles triangle having a vertex at a center of the first surface; and two cylindrical electrodes each including a filling body of the seat body a perforated dielectric material, and an electrical pin coaxially penetrating the dielectric material with the dielectric material; a substrate disposed symmetrically to the first cylindrical surface on the first surface, including a distance away from the dielectric a mounting surface of the first surface, and two symmetric microstrip lines formed on the mounting surface opposite to each other and having a predetermined impedance value, each symmetric microstrip line having a first rectangular portion closer to a center of the first surface, and a second rectangular portion extending from a short side of the first rectangular portion and extending from a short side of the first rectangular portion toward a center of the first surface, wherein a long side of the first rectangular portion away from the center of the first surface forms a long side The first of the two symmetric microstrip lines The distance between the long side of the shape closer to the center of the first surface is greater than the distance of the long side of the second rectangular portion closer to the center of the first surface, and the second rectangular portion of the second symmetric microstrip line forms a compensation coupling capacitance; a light emitting element is disposed on a mounting surface of the substrate centered on a center of the first surface and generates a monochromatic optical signal of a predetermined frequency domain when the electrical signal is supplied, and the characteristic impedance and the second symmetric microstrip line The impedance of the first rectangular portion is matched, wherein the projection of the light emitting element toward the first surface covers a partial region of the first rectangular portion of the two symmetric microstrip lines; a plurality of electrical connecting lines, wherein the predetermined number of electrical connecting lines are electrically connected to the first rectangular portion of the light emitting element and the two symmetric microstrip lines, and the other electrical connecting lines are electrically connected to the second rectangular portion of the two symmetric microstrip lines respectively An electrical pin with the two cylindrical electrodes. The symmetrical capacitor-compensated high-speed can-type optical package module according to claim 1, wherein the first surface of the body is circular. The symmetrical capacitor-compensated high-speed can-type optical package module according to claim 2, wherein a center of the first surface and a center of the two perforations are vertices at a center of the first surface and a vertex angle An isosceles triangle with an obtuse angle. The symmetrical capacitor-compensated high-speed can-type optical package module according to claim 3, wherein the second surface of the body is larger than the first surface. The symmetrical capacitor-compensated high-speed can-type optical package module according to the fourth aspect of the invention, wherein the base body further comprises two from the first surface to the second surface and located on the two perforated wires. The other side of the signal is perforated, wherein the center of the first surface and the center of the second signal perforation are an isosceles triangle with a vertex of the center of the first surface; the symmetric capacitance compensation type high speed tank type optical package module The method further includes two cylindrical electrodes respectively disposed in the signal perforations, a light receiving component disposed on the mounting surface of the substrate, and a plurality of electrical connecting wires, wherein the two cylindrical electrodes respectively include a filling of the one of the signal holes a dielectric material, and an electrical pin coaxially passing through the dielectric material, the electrical connection wires electrically connecting the light receiving component and the two electrical pins.