TWI464633B - Method of manufacturing flexible touch panel - Google Patents

Method of manufacturing flexible touch panel Download PDF

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TWI464633B
TWI464633B TW099104570A TW99104570A TWI464633B TW I464633 B TWI464633 B TW I464633B TW 099104570 A TW099104570 A TW 099104570A TW 99104570 A TW99104570 A TW 99104570A TW I464633 B TWI464633 B TW I464633B
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touch panel
flexible
layer
manufacturing
polymer layer
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TW099104570A
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Chinese (zh)
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TW201128476A (en
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Wen Ju Chuang
Chih Tsung Lee
Wen Chen Lee
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Cando Corp
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可撓式觸控面板的製造方法Flexible touch panel manufacturing method

本發明有關一種可撓式觸控面板的製造方法,尤指一種製造成本較低、製造簡便的可撓式觸控面板的製造方法。The invention relates to a method for manufacturing a flexible touch panel, in particular to a method for manufacturing a flexible touch panel with low manufacturing cost and simple manufacturing.

隨著科技的發展,電子產品的設計逐漸以人機互動緊密與操作介面簡便為趨向,觸控式的操作介面因此廣為主流。觸控面板是一種依附在平面顯示器外側,用以配合平面顯示器呈現畫面作為一種直覺而且操作簡易的使用介面,使用者可藉由手指直接接觸或以觸控筆拖曳點選顯示螢幕上的圖像與文字,來達到輸入資訊與操控產品的目的。With the development of technology, the design of electronic products has gradually become more and more popular with human-computer interaction and easy operation interface. The touch-based operation interface is therefore widely mainstream. The touch panel is attached to the outside of the flat panel display to match the flat display display image as an intuitive and easy to use interface. The user can directly touch the finger or drag the image with the stylus to display the image on the screen. And text to achieve the purpose of inputting information and manipulating the product.

隨著平面顯示器朝大面積發展的同時,具備更輕、更薄甚至可撓、可攜的顯示器成為主要的追求目標。現今,以可撓性基板取代硬質基板製作顯示器已成為顯示器發展的趨勢,觸控面板亦有相同趨勢。With the development of flat-panel displays in a large area, the display of lighter, thinner and even flexible, portable displays has become the main goal. Nowadays, the use of flexible substrates instead of rigid substrates for display has become a trend in display development, and touch panels have the same trend.

為了因應可撓性基板導入製程的需求,可撓性基板通常須以一硬質基板作為支撐而導入現有設備中,之後於可撓性基板上進行各類製程,例如:於可撓式基板上進行成膜製程或製造薄膜電晶體。一般而言,習知可撓式觸控面板的製造通常使用一暫時性的黏著劑,將可撓式基板貼合於硬質基板,再以物理性或化學性的方式將可撓式基板剝離。然而,該暫時性黏著劑的黏性不易控制,且熱穩定性不佳,容易產生貼合不良或難以剝離的問題。再者,如以化學性方式將可撓性基板剝離,基板本身耐蝕性需要加以考慮。In order to meet the requirements of the flexible substrate introduction process, the flexible substrate is usually introduced into a conventional device by using a rigid substrate as a support, and then various processes are performed on the flexible substrate, for example, on a flexible substrate. Film forming process or fabrication of thin film transistors. In general, conventional flexible touch panels are typically fabricated using a temporary adhesive that bonds the flexible substrate to a rigid substrate and physically or chemically strips the flexible substrate. However, the viscosity of the temporary adhesive is not easily controlled, and the thermal stability is not good, and it is easy to cause a problem of poor adhesion or difficulty in peeling off. Furthermore, if the flexible substrate is chemically peeled off, the corrosion resistance of the substrate itself needs to be considered.

另一種方式則是將可撓式基板以一黏著層,整片貼附於硬質基板上,待後續製程施作完畢後,遂再以高溫雷射或照光去鍵結(debonding)的方式,去除黏著層的黏性,而將製作完成的可撓式觸控面板脫離硬質基板。惟,以雷射或照光去鍵結的設備昂貴且耗時長、效果有限,對於增進製程速率有限且成本較高;此外,倘若黏著層的黏性太強,將可撓式基板從硬質基板上取下的過程中,亦可能損害可撓式基板上的精密元件。In another method, the flexible substrate is attached to the hard substrate by an adhesive layer, and after the subsequent process is applied, the germanium is removed by high-temperature laser or light debonding. The adhesive layer is adhered, and the finished flexible touch panel is separated from the rigid substrate. However, equipment that is bonded by laser or illumination is expensive, time consuming, and limited in effect, and has a limited process speed and high cost; and if the adhesive layer is too viscous, the flexible substrate is removed from the rigid substrate. During the removal process, it may also damage the precision components on the flexible substrate.

爰上,本發明之目的在於解決上述問題,進而提出一種易於製造且不留殘膠之可撓式觸控面板的製造方法。In view of the above, an object of the present invention is to solve the above problems, and to provide a method for manufacturing a flexible touch panel which is easy to manufacture and which does not leave a residual glue.

為了達成前述目的,本發明提供之可撓式觸控面板的製造方法,係藉由黏著層將觸控面板之可撓式聚合物層的部分區域黏附於一硬質基板上而固定;該可撓式聚合物層並與該硬質基板形成易脫離介面。In order to achieve the foregoing objective, the present invention provides a method for manufacturing a flexible touch panel by attaching a partial region of a flexible polymer layer of a touch panel to a rigid substrate by an adhesive layer; The polymer layer forms an easy-disengagement interface with the rigid substrate.

本發明之可撓式觸控面板的製造方法步驟包含:備置一硬質基板;形成一不連續的黏著層於該硬質基板上;形成一可撓式聚合物層於該黏著層及該硬質基板上;該可撓式聚合物層接觸該硬質基板的區域定義為一圖案化區域;形成一感測層於該可撓式聚合物層上的圖案化區域;切割該圖案化區域,並將具該感測層的可撓式聚合物層脫離該硬質基板。在上述一實施例中該感測層上可再形成一保護層。The manufacturing method of the flexible touch panel of the present invention comprises: preparing a hard substrate; forming a discontinuous adhesive layer on the hard substrate; forming a flexible polymer layer on the adhesive layer and the hard substrate a region of the flexible polymer layer contacting the rigid substrate is defined as a patterned region; a patterned region of the sensing layer on the flexible polymer layer is formed; the patterned region is cut and The flexible polymer layer of the sensing layer is detached from the rigid substrate. In the above embodiment, a protective layer may be further formed on the sensing layer.

透過本發明,觸控面板脫離該硬質基板時,無須使用昂貴之雷射或照光設備即可輕易地剝離,過程簡單且不留殘膠,可解決習知觸控面板不易自硬質基板取下的問題。有關本發明的詳細技術內容及較佳實施例,配合圖式說明如後。The touch panel can be easily peeled off without using an expensive laser or illumination device, and the process is simple and no residual glue is left, which can solve the problem that the conventional touch panel is not easily removed from the hard substrate. problem. The detailed technical content and preferred embodiments of the present invention are described in conjunction with the drawings.

有關本發明之詳細說明及技術內容,現配合圖式說明如下,惟須說明的是,該些圖式及元件編號僅為示意說明之用,並不代表實際的尺寸與比例;且為求圖面的簡潔及容易瞭解,在不影響本發明的實施與理解下,部分圖式亦省略習知元件的繪製。The detailed description and technical contents of the present invention are described below with reference to the drawings, and the drawings and the component numbers are only for illustrative purposes, and do not represent actual dimensions and proportions; The drawings are also concise and easy to understand, and some of the drawings also omit the drawing of conventional elements without affecting the implementation and understanding of the present invention.

請配合參閱「圖1-1」至「圖1-7」,其顯示本發明一實施例之製造方法流程示意圖,以及對應上述「圖1-1」至「圖1-5」的上視圖「圖2-1」至「圖2-5」。本發明提出一種可撓式觸控面板1的製造方法,其步驟包含:Please refer to "FIG. 1-1" to "FIG. 1-7" for a schematic flow chart of a manufacturing method according to an embodiment of the present invention, and a top view corresponding to the above "FIG. 1-1" to "FIG. 1-5". Figure 2-1" to "Figure 2-5". The invention provides a manufacturing method of the flexible touch panel 1 , and the steps thereof include:

  1. 備置一硬質基板10;Preparing a rigid substrate 10;
  2. 形成一不連續的黏著層11於該硬質基板10上;Forming a discontinuous adhesive layer 11 on the rigid substrate 10;
  3. 形成一可撓式聚合物層12於該黏著層11及該硬質基板10上;該可撓式聚合物層12接觸該硬質基板10的區域定義為一圖案化區域121(標示於「圖2-3」之後的圖式);Forming a flexible polymer layer 12 on the adhesive layer 11 and the hard substrate 10; a region of the flexible polymer layer 12 contacting the hard substrate 10 is defined as a patterned region 121 (labeled in Figure 2 3" after the pattern);
  4. 形成一感測層13於該可撓式聚合物層12上的該圖案化區域121;Forming a sensing layer 13 on the flexible polymer layer 12 of the patterned region 121;
  5. 形成一保護層14於該感測層13上;Forming a protective layer 14 on the sensing layer 13;
  6. 切割該圖案化區域121,並將可撓式聚合物層12脫離該硬質基板10。The patterned region 121 is cut and the flexible polymer layer 12 is detached from the rigid substrate 10.

以下就各步驟做詳細的解說:The following is a detailed explanation of each step:

首先,如「圖1-1」和「圖2-1」所示,備置一硬質基板10,該硬質基板10為一具剛性、耐熱性材質的基板,可於整體製作過程中,承受製程溫度,保持其原有型態而不變形;較佳地,該硬質基板10可具備耐強酸、強鹼的特性,並能避免溶劑侵蝕,例如其為一玻璃基板。First, as shown in FIG. 1-1 and FIG. 2-1, a rigid substrate 10 is provided, which is a rigid, heat-resistant substrate that can withstand process temperatures during the entire manufacturing process. The rigid substrate 10 is preferably resistant to strong acid and alkali, and can be prevented from being attacked by a solvent, for example, a glass substrate.

接著,於該硬質基板10的預設區域形成一不連續黏著層11,再將一可撓式聚合物層12形成於該黏著層11及該硬質基板10上,如「圖1-2」至「圖1-3」及「圖2-2」至「圖2-3」所示。其中,所謂的不連續係指該黏著層11非整面塗佈於該硬質基板10,而僅塗佈於欲黏著的區域。該黏著層11提供一黏附效果,致使該可撓式聚合物層12的部分區域可藉該黏著層11黏接,而緊密地黏附於該硬質基板10上。該可撓式聚合物層12未黏接(或覆蓋)於該黏著層11的區域,意即該可撓式聚合物層12接觸該硬質基板10的範圍定義為一圖案化區域121(請見「圖2-3」),藉此,後續步驟的各功能層,可形成於該可撓式聚合物層12上的圖案化區域121。Then, a discontinuous adhesive layer 11 is formed on the predetermined region of the rigid substrate 10, and a flexible polymer layer 12 is formed on the adhesive layer 11 and the rigid substrate 10, as shown in FIG. 1-2. Figure 1-3 and Figure 2-2 to Figure 2-3 show. Here, the term "discontinuity" means that the adhesive layer 11 is not entirely coated on the hard substrate 10, but is applied only to a region to be adhered. The adhesive layer 11 provides an adhesive effect such that a portion of the flexible polymer layer 12 can be adhered to the rigid substrate 10 by the adhesive layer 11. The flexible polymer layer 12 is not bonded (or covered) to the region of the adhesive layer 11, that is, the range in which the flexible polymer layer 12 contacts the rigid substrate 10 is defined as a patterned region 121 (see "FIG. 2-3"), whereby the functional layers of the subsequent steps can be formed in the patterned region 121 on the flexible polymer layer 12.

在上述一實施例中,該黏著層11可為之材質可為有機物,且可以物理雷射方式將表面改質,或以化學蝕刻方式形成提高基材的粗糙度所形成的特殊表面。In the above embodiment, the adhesive layer 11 may be made of organic materials, and may be modified by physical laser or chemically etched to form a special surface formed by increasing the roughness of the substrate.

在上述一實施例中,該可撓式聚合物層12係作為可撓式觸控面板1的軟性基板,其可利用旋轉塗佈(spin coating)、狹縫塗佈或刮板塗抹(blade coating)的方式,形成於該硬質基板10及該黏著層11上;另一方面,該可撓式聚合物層12的玻璃轉換溫度(glass transition temperature, Tg )可高於150°C,且其材質透明,具低熱膨脹係數(coefficient of thermal expansion, CTE),例如為聚醯亞胺(polyimide, PI),但不以其為限。In the above embodiment, the flexible polymer layer 12 is used as a flexible substrate of the flexible touch panel 1, which can be applied by spin coating, slit coating or blade coating. a method of forming on the hard substrate 10 and the adhesive layer 11; on the other hand, the glass transition temperature ( Tg ) of the flexible polymer layer 12 can be higher than 150 ° C, and The material is transparent and has a low coefficient of thermal expansion (CTE), such as polyimide (PI), but not limited thereto.

接續地,請參閱「圖1-4」至「圖1-5」及「圖2-4」至「圖2-5」所示,分別於該可撓式聚合物層12的圖案化區域121形成一感測層13與一保護層14,以形成一觸控面板的堆疊。其中,該感測層13可為觸控面板的二維感測區域,可為一多層結構,包含複數個感測X方向及Y方向的感測單元(圖中未示),該些感測單元呈陣列方式排列;該保護層14則可保護觸控面板的整體結構,具阻水、阻氣性,能避免其受水氣或有機溶劑的侵入,或避免感測層13因外力刮傷。在一實施例中,該絕緣層係一絕緣透明材質。Continuingly, please refer to "FIG. 1-4" to "FIGS. 1-5" and "FIGS. 2-4" to "FIG. 2-5", respectively, in the patterned region 121 of the flexible polymer layer 12. A sensing layer 13 and a protective layer 14 are formed to form a stack of touch panels. The sensing layer 13 can be a two-dimensional sensing area of the touch panel, and can be a multi-layer structure, and includes a plurality of sensing units (not shown) that sense the X direction and the Y direction. The measuring unit is arranged in an array manner; the protective layer 14 can protect the overall structure of the touch panel, has water blocking and gas barrier properties, can be prevented from being invaded by water vapor or organic solvent, or can prevent the sensing layer 13 from being scraped by external force. hurt. In one embodiment, the insulating layer is an insulating transparent material.

完成該觸控面板的堆疊結構後,接著將包含該可撓式聚合物層12、該感測層13及該保護層14的觸控面板結構自該硬質基板10上取下。請參閱「圖1-6」至「圖1-7」,由於該可撓式聚合物層12係藉由不連續的黏著層11黏貼於該硬質基板10,因此本發明脫離該硬質基板10的方式,係切割該圖案化區域121的可撓式聚合物層12(意即切割未覆蓋或未黏合於黏著層11的區域,切割線如「圖1-6」虛線所顯示),直接將該觸控面板自該硬質基板10脫離。因該圖案化區域121的範圍內並無黏著層11的覆佈,因此該觸控面板極易自該硬質基板10上脫離。After the stacking structure of the touch panel is completed, the touch panel structure including the flexible polymer layer 12, the sensing layer 13 and the protective layer 14 is removed from the rigid substrate 10. Referring to FIGS. 1-6 to FIG. 1-7, since the flexible polymer layer 12 is adhered to the rigid substrate 10 by the discontinuous adhesive layer 11, the present invention is detached from the rigid substrate 10. The method is to cut the flexible polymer layer 12 of the patterned region 121 (that is, to cut the region that is not covered or not bonded to the adhesive layer 11 , and the cutting line is as shown by the dotted line in FIG. 1-6 ), and directly The touch panel is detached from the rigid substrate 10. Since there is no coating of the adhesive layer 11 in the range of the patterned region 121, the touch panel is easily detached from the rigid substrate 10.

須說明的是,該可撓式聚合物層12藉該黏著層11黏附於該硬質基板10並非意指該可撓式聚合物層12與該硬質基板10之間無任何附著力,實際上,該可撓式聚合物層12依然可藉其材料自身之附著力承靠於該硬質基板10上;惟,該可撓式聚合物層12本身所具的附著力相較於黏著層11者小,因此容易脫離該硬質基板10。It should be noted that the adhesion of the flexible polymer layer 12 to the rigid substrate 10 by the adhesive layer 11 does not mean that there is no adhesion between the flexible polymer layer 12 and the rigid substrate 10. The flexible polymer layer 12 can still bear on the rigid substrate 10 by the adhesion of the material itself; however, the flexible polymer layer 12 itself has a lower adhesion than the adhesive layer 11 Therefore, it is easy to separate from the hard substrate 10.

相較於先前技術,本發明藉由黏著層11部分固定可撓式聚合物層12,並利用可撓式聚合物層12易脫離硬質基板10的特性將其取下,因此製造成本低,且製程較為簡便容易;另一方面,透過本發明另可避免習知技術容易形成殘膠,或是因去鍵結過程而破壞材料的問題。Compared with the prior art, the present invention partially fixes the flexible polymer layer 12 by the adhesive layer 11 and removes the flexible polymer layer 12 by the characteristics of the flexible substrate 10, so that the manufacturing cost is low, and The process is relatively simple and easy; on the other hand, through the invention, it is possible to avoid the problem that the prior art is easy to form a residual glue or the material is destroyed by the debonding process.

惟以上所述者,僅為本發明之較佳實施例,非欲侷限本發明專利之專利保護範圍,故舉凡運用本發明說明書及圖式內容所為之等效變化與修飾,均同理包含於本發明之權利保護範圍,合予陳明。The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the patent protection of the present invention. Therefore, the equivalent changes and modifications of the present invention and the contents of the drawings are equally included in The scope of protection of the present invention is combined with Chen Ming.

1‧‧‧可撓式觸控面板
10‧‧‧硬質基板
11‧‧‧黏著層
12‧‧‧可撓式聚合物層
13‧‧‧感測層
14‧‧‧保護層
121‧‧‧圖案化區域
1‧‧‧Flexible touch panel
10‧‧‧hard substrate
11‧‧‧Adhesive layer
12‧‧‧Flexible polymer layer
13‧‧‧Sensor layer
14‧‧‧Protective layer
121‧‧‧ patterned area

本發明的實施方式係結合圖式予以描述:
「圖1-1」至「圖1-7」為本發明可撓式觸控面板的製造流程示意圖;
「圖2-1」至「圖2-5」為對應「圖1-1」至「圖1-5」的上視圖。
Embodiments of the invention are described in conjunction with the drawings:
FIG. 1-1 to FIG. 1-7 are schematic diagrams showing a manufacturing process of the flexible touch panel of the present invention;
Figure 2-1 to Figure 2-5 show the top view corresponding to Figure 1-1 to Figure 1-5.

1‧‧‧可撓式觸控面板 1‧‧‧Flexible touch panel

10‧‧‧硬質基板 10‧‧‧hard substrate

11‧‧‧黏著層 11‧‧‧Adhesive layer

12‧‧‧可撓式聚合物層 12‧‧‧Flexible polymer layer

13‧‧‧感測層 13‧‧‧Sensor layer

14‧‧‧保護層 14‧‧‧Protective layer

Claims (10)

一種可撓式觸控面板的製造方法,其步驟包含:
備置一硬質基板;
形成不連續的一黏著層於該硬質基板上;
形成一可撓式聚合物層於該黏著層及該硬質基板上;該可撓式聚合物層接觸該硬質基板的區域定義為一圖案化區域;
形成一感測層於該可撓式聚合物層上的該圖案化區域;
切割該圖案化區域,並將具該感測層的可撓式聚合物層脫離該硬質基板。
A method of manufacturing a flexible touch panel, the steps comprising:
Preparing a rigid substrate;
Forming a discontinuous adhesive layer on the rigid substrate;
Forming a flexible polymer layer on the adhesive layer and the hard substrate; a region of the flexible polymer layer contacting the hard substrate is defined as a patterned region;
Forming a sensing layer on the patterned layer of the flexible polymer layer;
The patterned region is diced and the flexible polymer layer having the sensing layer is detached from the rigid substrate.
如申請專利範圍第1項所述之可撓式觸控面板的製造方法,其中更包含一形成一保護層於該感測層上的步驟。The method for manufacturing a flexible touch panel according to claim 1, further comprising the step of forming a protective layer on the sensing layer. 如申請專利範圍第2項所述之可撓式觸控面板的製造方法,其中該保護層為一透明絕緣材質,且具阻水性和阻氣性。The method for manufacturing a flexible touch panel according to claim 2, wherein the protective layer is a transparent insulating material and has water repellency and gas barrier properties. 如申請專利範圍第1項所述之可撓式觸控面板的製造方法,其中該硬質基板為一玻璃基板。The method of manufacturing a flexible touch panel according to claim 1, wherein the rigid substrate is a glass substrate. 如申請專利範圍第1項所述之可撓式觸控面板的製造方法,其中該可撓式聚合物層係以旋轉塗佈、狹縫塗佈或刮板塗抹的方式,形成於該硬質基板及該黏著層上。The method for manufacturing a flexible touch panel according to claim 1, wherein the flexible polymer layer is formed on the rigid substrate by spin coating, slit coating or blade coating. And the adhesive layer. 如申請專利範圍第1項所述之可撓式觸控面板的製造方法,其中該可撓式聚合物層的玻璃轉換溫度高於150°c。The method of manufacturing a flexible touch panel according to claim 1, wherein the flexible polymer layer has a glass transition temperature higher than 150 ° C. 如申請專利範圍第1項所述之可撓式觸控面板的製造方法,其中該可撓式聚合物層係一具低熱膨脹係數的透明材料所組成。The method of manufacturing a flexible touch panel according to claim 1, wherein the flexible polymer layer is composed of a transparent material having a low coefficient of thermal expansion. 如申請專利範圍第1項所述之可撓式觸控面板的製造方法,其中該可撓式聚合物層為聚醯亞胺。The method for manufacturing a flexible touch panel according to claim 1, wherein the flexible polymer layer is a polyimide. 如申請專利範圍第1項所述之可撓式觸控面板的製造方法,其中該黏著層為有機物。The method of manufacturing a flexible touch panel according to claim 1, wherein the adhesive layer is organic. 如申請專利範圍第1項所述之可撓式觸控面板的製造方法,其中該黏著層以物理方式將表面改質,或以化學方式提高表面粗糙度。The method of manufacturing a flexible touch panel according to claim 1, wherein the adhesive layer physically reforms the surface or chemically increases the surface roughness.
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