TWI464108B - The preparation of porous silicon nanowires and the prepared porous silicon nanowires - Google Patents
The preparation of porous silicon nanowires and the prepared porous silicon nanowires Download PDFInfo
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本發明是有關一種矽奈米線的製法,特別是提供一種多孔矽奈米線的製法及所製得之多孔矽奈米線。The invention relates to a method for preparing a nanowire, in particular to a method for preparing a porous nanowire and a porous nanowire prepared.
矽奈米線為具有極高長寬比的半導體材料。在多種形態的矽奈米線中,多孔矽奈米線由於具有奈米尺度的多孔結構特性,在量子侷限效應及表面積大的影響之下,於光電元件、光觸媒及氣體感測等用途上具備極佳的應用潛力。The nanowire is a semiconductor material with a very high aspect ratio. Among the various types of nanowires, porous nanowires have nanometer-scale porous structure characteristics, and are used in photovoltaic elements, photocatalysts, and gas sensing applications due to quantum confinement effects and large surface area. Excellent application potential.
一般多孔矽奈米線的製法是使用經摻雜的矽基材,並利用金屬離子/氫氟酸/過氧化氫進行一階段蝕刻(如Huihui Chen等人在J. Mater. Chem .,2011,21 ,801-805中所揭示),或利用金屬離子/氫氟酸與氫氟酸/硝酸進行二階段蝕刻(如許文義在其碩士論文「以金屬觸發蝕刻製備單晶矽奈米線及其場發射特性研究」中所揭示)。然而,由於低度摻雜的中電阻率和高電阻率矽基材不易經由蝕刻產生多孔結構,因此上述製法通常需要使用高度摻雜的低電阻率(10 Ω-cm)矽基材,才可製得粗糙程度較大的多孔矽奈米線,不僅價格昂貴且其應用也受到限制,且無法獨立調控所製得之矽奈米線的孔徑大小與長度。Generally, the porous tantalum nanowire is prepared by using a doped germanium substrate and performing one-stage etching using metal ions/hydrofluoric acid/hydrogen peroxide (eg, Huihui Chen et al., J. Mater. Chem ., 2011, 21 , 801-805), or the use of metal ions / hydrofluoric acid and hydrofluoric acid / nitric acid for two-stage etching (such as Xu Wenyi in his master's thesis "metal-triggered etching to prepare single crystal germanium wire and its field Revealed in the Study of Emission Characteristics). However, since the low-doped medium resistivity and high resistivity ruthenium substrate are not easily porous to form a porous structure, the above-described method generally requires the use of a highly doped low resistivity ( 10 Ω-cm) 矽 substrate can be used to make porous nanowires with high roughness, which is not only expensive but also limited in application, and can not independently regulate the pore size of the prepared nanowires. length.
由以上陳述可知,利用現有蝕刻法來製備多孔矽奈米線仍存在諸多問題,如能有效克服低電阻率基材的限制,且可大面積製備多孔矽奈米線,並能輕易控制其孔徑大小,對於產業上製備多孔矽奈米線將有相當大的助益。It can be seen from the above statement that there are still many problems in the preparation of porous tantalum nanowires by using the existing etching method, such as being able to effectively overcome the limitation of the low resistivity substrate, and the porous rice nanowire can be prepared in a large area, and the pore diameter can be easily controlled. Size, for the industrial preparation of porous tannins will be quite helpful.
因此,本發明之目的,即在提供一種多孔矽奈米線的製法,可突破低電阻率的基材的限制,且能輕易控制多孔矽奈米線的孔徑大小。Accordingly, it is an object of the present invention to provide a method for producing a porous tantalum nanowire which can overcome the limitations of a substrate having a low electrical resistivity and can easily control the pore size of the porous tantalum nanowire.
於是,本發明多孔矽奈米線的製法包含:(a)將一矽基材與一蝕刻液反應,蝕刻生成複數矽奈米線,其中,該蝕刻液含有金屬離子;及(b)將該等矽奈米線浸入一電解液並施加電流,藉此,得到複數多孔矽奈米線。Thus, the method for producing a porous tantalum nanowire of the present invention comprises: (a) reacting a tantalum substrate with an etching solution, and etching to form a plurality of tantalum nanowires, wherein the etching solution contains metal ions; and (b) The nanowire is immersed in an electrolyte and an electric current is applied, thereby obtaining a plurality of porous nanowires.
因此,本發明之另一目的,即在提供一種多孔矽奈米線,是藉由如上所述之多孔矽奈米線的製法所製得。Accordingly, another object of the present invention is to provide a porous tantalum nanowire which is produced by a method for producing a porous tannin wire as described above.
本發明之功效在於:本發明多孔矽奈米線的製法藉由金屬誘導蝕刻及電化學處理,可將不同電阻率的矽基材製成多孔矽奈米線。The effect of the invention is that the method for preparing the porous tantalum nanowire of the invention can be made into a porous tantalum nanowire by a metal-induced etching and electrochemical treatment.
本發明多孔矽奈米線的製法包含:(a)將一矽基材與一蝕刻液反應,蝕刻生成複數矽奈米線,其中,該蝕刻液含有金屬離子;及(b)將該等矽奈米線浸入一電解液並施加電流,藉此,得到複數多孔矽奈米線。The method for preparing a porous tantalum nanowire of the present invention comprises: (a) reacting a tantalum substrate with an etching solution, and etching to form a plurality of tantalum nanowires, wherein the etching solution contains metal ions; and (b) the same The nanowire is immersed in an electrolyte and an electric current is applied, thereby obtaining a plurality of porous tantalum wires.
較佳地,該矽基材之電阻率範圍為0.001~1200 Ω-cm。更佳地,該矽基材之電阻率範圍為0.008~770 Ω-cm。最佳地,該矽基材之電阻率範圍為670~770 Ω-cm。Preferably, the tantalum substrate has a resistivity ranging from 0.001 to 1200 Ω-cm. More preferably, the tantalum substrate has a resistivity ranging from 0.008 to 770 Ω-cm. Most preferably, the tantalum substrate has a resistivity ranging from 670 to 770 Ω-cm.
較佳地,該矽基材為一單晶矽基材。Preferably, the ruthenium substrate is a single crystal ruthenium substrate.
該金屬離子可沉積在該矽基材表面並還原成金屬粒子,同時將其周圍的矽基材氧化成二氧化矽。該金屬離子的選擇,是選自於還原電位較高的金屬離子。較佳地,該金屬離子是選自於:銀離子、金離子、鉑離子、銅離子或此等之一組合。在本發明之具體實施例中,該金屬離子是銀離子。該金屬離子的來源可例如各種金屬鹽類,如硝酸銀等。The metal ions may be deposited on the surface of the tantalum substrate and reduced to metal particles while oxidizing the tantalum substrate around it to ruthenium dioxide. The metal ion is selected from metal ions having a high reduction potential. Preferably, the metal ion is selected from the group consisting of silver ions, gold ions, platinum ions, copper ions or a combination thereof. In a particular embodiment of the invention, the metal ion is a silver ion. The source of the metal ion may be, for example, various metal salts such as silver nitrate or the like.
較佳地,該蝕刻液還包括氫氟酸及過氧化氫。氫氟酸可蝕刻二氧化矽;過氧化氫有助於該矽基材氧化成二氧化矽,可加速蝕刻反應的進行。Preferably, the etching solution further comprises hydrofluoric acid and hydrogen peroxide. Hydrofluoric acid can etch cerium oxide; hydrogen peroxide helps the cerium substrate to oxidize to cerium oxide, which accelerates the etching reaction.
較佳地,該電解液包括氫氟酸及過氧化氫。氫氟酸可蝕刻二氧化矽;過氧化氫有助於該矽基材氧化成二氧化矽,可加速蝕刻反應的進行。Preferably, the electrolyte comprises hydrofluoric acid and hydrogen peroxide. Hydrofluoric acid can etch cerium oxide; hydrogen peroxide helps the cerium substrate to oxidize to cerium oxide, which accelerates the etching reaction.
較佳地,該電流施加範圍為0.001~0.008 A。若電流過大,會導致多孔奈米線的孔洞過大,且容易發生斷裂並不易形成整齊排列的陣列。而若電流過小,則無法突破所需能障形成多孔結構。更佳地,該電流施加範圍為0.006~0.008 A。Preferably, the current is applied in the range of 0.001 to 0.008 A. If the current is too large, the pores of the porous nanowire are too large, and it is easy to break and it is difficult to form a neatly arranged array. If the current is too small, it is impossible to break through the required energy barrier to form a porous structure. More preferably, the current is applied in the range of 0.006 to 0.008 A.
較佳地,該電流施加時間範圍為1~5 min。若施加時間過長,會導致多孔奈米線的孔洞過大且容易發生斷裂,並不易形成整齊排列的陣列。而若施加時間過短,則無法順利產生多孔結構。Preferably, the current application time ranges from 1 to 5 min. If the application time is too long, the pores of the porous nanowire are too large and easily broken, and it is difficult to form a neatly arranged array. However, if the application time is too short, the porous structure cannot be smoothly produced.
本發明多孔矽奈米線是藉由如上所述之多孔矽奈米線的製法所製得,其中,該等多孔矽奈米線之電阻率範圍為11~1200 Ω-cm。較佳地,該等多孔矽奈米線之電阻率範圍為100~1200 Ω-cm。更佳地,該等多孔矽奈米線之電阻率範圍為670~770 Ω-cm。The porous tantalum nanowire of the present invention is produced by a method for producing a porous tannin wire as described above, wherein the porous nanowire has a resistivity ranging from 11 to 1200 Ω-cm. Preferably, the porous nanowires have a resistivity ranging from 100 to 1200 Ω-cm. More preferably, the porous nanowires have a resistivity ranging from 670 to 770 Ω-cm.
本發明將就以下實施例作進一步說明,但應瞭解的是,該等實施例僅為例示說明之用,而不應被解釋為本發明實施之限制。The invention is further described in the following examples, but it should be understood that these examples are for illustrative purposes only and are not to be construed as limiting.
實施例1之多孔矽奈米線的製法包含以下步驟:The method for preparing the porous tannin wire of Example 1 comprises the following steps:
(a) 將一晶格面為(100)面且電阻率為0.008~0.02 Ω-cm的單晶矽基材浸泡於一含有5 M氫氟酸、0.02 M硝酸銀水溶液及0.22 M過氧化氫水溶液的蝕刻液中反應1小時,接著取出經處理之矽材,再以20 vol%硝酸去除反應後殘留在矽材上的銀粒子,而獲得反應後的矽材。(a) A single crystal germanium substrate having a (100) plane and a resistivity of 0.008 to 0.02 Ω-cm is immersed in a 5 M hydrofluoric acid, 0.02 M silver nitrate aqueous solution and 0.22 M aqueous hydrogen peroxide solution. The reaction was carried out for 1 hour in the etching solution, and then the treated coffin was taken out, and the silver particles remaining on the coffin after the reaction were removed with 20 vol% nitric acid to obtain a coffin after the reaction.
(b) 提供一電化學裝置,包含一含有4 M氫氟酸及3.25 M過氧化氫水溶液的電解液、間隔設置且與該電解液接觸之工作電極及參考電極、一電源供應器及一連接兩電極與該電源供應器之導線。將反應後的矽材浸入該電解液中,並使該反應後的矽材與該工作電極接觸,對該反應後的矽材施加45 V的電壓及0.007 A的電流1 min,以得到一矽材產物。(b) providing an electrochemical device comprising an electrolyte containing 4 M hydrofluoric acid and 3.25 M aqueous hydrogen peroxide solution, a working electrode and a reference electrode spaced apart from the electrolyte, a power supply and a connection Two electrodes and wires of the power supply. The reacted coffin was immersed in the electrolyte, and the reacted coffin was brought into contact with the working electrode, and a voltage of 45 V and a current of 0.007 A were applied to the coffin after the reaction for 1 min to obtain a crucible. Material product.
除了將該步驟(a)之單晶矽基材的電阻率改變為1~5 Ω-cm外,實施例2的製法與實施例1相同。The production method of Example 2 was the same as that of Example 1 except that the specific resistance of the single crystal germanium substrate of the step (a) was changed to 1 to 5 Ω-cm.
除了將該步驟(b)之通電時間改變為2及3 min外,實施例3~4的製法與實施例2相同。The production methods of Examples 3 to 4 were the same as in Example 2 except that the energization time of the step (b) was changed to 2 and 3 minutes.
除了將該步驟(a)之單晶矽基材的電阻率改變為660~770 Ω-cm外,實施例5的製法與實施例1相同。The production method of Example 5 was the same as that of Example 1 except that the specific resistance of the single crystal germanium substrate of the step (a) was changed to 660 to 770 Ω-cm.
除了將該步驟(b)之通電時間改變為3及5 min外,實施例6~7的製法與實施例5相同。The preparation of Examples 6 to 7 was the same as that of Example 5 except that the energization time of the step (b) was changed to 3 and 5 minutes.
比較例1的製法與實施例2之步驟(a)相同,但不進行該步驟(b)。The preparation method of Comparative Example 1 was the same as that of the step (a) of Example 2, but the step (b) was not carried out.
除了將該步驟(b)之電流施加改變為0.005 A及通電時間改變為20 min外,比較例2的製法與實施例2之步驟(a)相同。The preparation of Comparative Example 2 was the same as that of the step (a) of Example 2, except that the current application in the step (b) was changed to 0.005 A and the energization time was changed to 20 minutes.
分別將上述實施例1~7及比較例1~2製法中的單晶矽基材的電阻率、電流施加及通電時間整理如下表1。The specific resistance, current application, and energization time of the single crystal germanium substrates in the above-described Examples 1 to 7 and Comparative Examples 1 and 2 were respectively summarized in Table 1 below.
以場發射掃描式電子顯微鏡(FE-SEM,購自於Hitachi,型號為S4800)觀察實施例1~7及比較例1~2製得之矽材產物的表面形態,結果分別如圖1~9所示。在圖1~7中,可發現實施例1~7製得之矽材產物皆為複數多孔奈米線。比較圖2~4內嵌的局部放大圖,可發現實施例4製得之矽奈米線具有複數較實施例3更大的孔洞,實施例3製得之矽奈米線具有複數較實施例2更大的孔洞,因此可推知矽材產物之孔徑大小(粗糙程度)隨該步驟(b)之通電時間增加而增加;比較圖5A、6A及7A亦可得到相同的結論。在圖8中,可發現比較例1製得之矽材產物亦為複數矽奈米線的陣列;但在圖8內嵌的局部放大圖中,可發現該等矽奈米線的表面平滑,不具有孔洞。而在圖9A中,可發現比較例2製得之矽材產物並非複數矽奈米線的陣列(即使在圖9B中,可發現比較例2製得之矽材產物具有複數孔洞)。由此可證明本發明的製法確實可製得多孔矽奈米線。The surface morphology of the coffin products obtained in Examples 1 to 7 and Comparative Examples 1 and 2 was observed by a field emission scanning electron microscope (FE-SEM, available from Hitachi, model S4800). The results are shown in Figures 1-9. Shown. In Figures 1-7, it can be seen that the coffin products obtained in Examples 1 to 7 are all plural porous nanowires. Comparing the partial enlarged views embedded in FIG. 2 to FIG. 4, it can be found that the tantalum nanowire prepared in Example 4 has a plurality of holes larger than that of the third embodiment, and the tantalum nanowire prepared in the third embodiment has a plurality of comparative examples. 2 larger pores, so it can be inferred that the pore size (roughness) of the coffin product increases with the increase of the energization time of the step (b); the same conclusion can be obtained by comparing Figs. 5A, 6A and 7A. In FIG. 8, it can be found that the coffin product obtained in Comparative Example 1 is also an array of a plurality of tantalum nanowires; however, in the partially enlarged view embedded in FIG. 8, the surface of the tanned nanowires can be found to be smooth. There are no holes. In Fig. 9A, it was found that the coffin product obtained in Comparative Example 2 was not an array of plural nanowires (even in Fig. 9B, it was found that the coffin product obtained in Comparative Example 2 had a plurality of pores). From this, it can be confirmed that the process of the present invention can indeed produce a porous nanowire.
以螢光光譜儀(購自於HORIBA,型號為Labram HR,光源為He-Cd雷射光源)分別對實施例4及比較例1製得之矽材產物提供325 nm的入射光,測量其在可見光波段的光致發光(photoluminescence)性質,結果如圖10所示。由圖10可以發現,實施例4製得之矽材產物在698 nm有明顯的發光峰,而比較例1製得之矽材產物在可見光波段並無明顯的發光峰,顯示實施例4經電化學處理的矽材產物因奈米尺度的多孔結構所產生的量子侷限效應,使矽材的發光波長由紅外光波段移至可見光波段。Fluorescence spectrometer (purchased from HORIBA, model Labram HR, source of He-Cd laser source) was used to provide 325 nm incident light to the coffin products obtained in Example 4 and Comparative Example 1, respectively, and measured in visible light. The photoluminescence properties of the band are shown in Figure 10. It can be seen from Fig. 10 that the coffin product obtained in Example 4 has a distinct luminescence peak at 698 nm, and the coffin product obtained in Comparative Example 1 has no significant luminescence peak in the visible light band, showing that Example 4 is electrogenerated. The quantum confinement effect of the processed coffin product due to the nanometer-scale porous structure shifts the emission wavelength of the coffin from the infrared band to the visible band.
分別將少量實施例4及比較例1製得之矽材產物置於蓋玻片上,再將蓋玻片放置於平台上並分別在該等矽材產物上滴出水滴,測量該等水滴與蓋玻片的接觸角,結果如圖11所示。在圖11A中,可發現比較例1製得之矽材產物的接觸角為10°,顯示其並不具有疏水性;在圖11B中,可發現實施例4製得之矽材產物的接觸角為164°,顯示其具有明顯的疏水性,具有應用於自潔材料的潛力。A small amount of the coffin products prepared in Example 4 and Comparative Example 1 were placed on a cover glass, and the coverslips were placed on the platform, and water droplets were dropped on the coffin products, respectively, and the water droplets and caps were measured. The contact angle of the slide, the results are shown in Figure 11. In Fig. 11A, it can be found that the contact angle of the coffin product obtained in Comparative Example 1 is 10°, which indicates that it is not hydrophobic; in Fig. 11B, the contact angle of the coffin product obtained in Example 4 can be found. At 164°, it is shown to be significantly hydrophobic and has the potential to be applied to self-cleaning materials.
同樣將實施例2及3製得之矽材產物進行上述接觸角分析,可知實施例2製得之矽材產物的接觸角為26°,及實施例3製得之矽材產物的接觸角為158°。Similarly, the tantalum products obtained in Examples 2 and 3 were subjected to the above contact angle analysis, and it was found that the contact angle of the coffin product obtained in Example 2 was 26°, and the contact angle of the coffin product obtained in Example 3 was 158°.
綜上所述,本發明多孔矽奈米線的製法藉由金屬誘導蝕刻步驟(a)及電化學處理步驟(b),可將不同電阻率的矽基材製成多孔矽奈米線;且可透過改變電流施加時間的長短,輕易控制製得之多孔矽奈米線的孔徑大小及表面疏水性程度。In summary, the method for preparing a porous tantalum nanowire of the present invention can form a porous germanium wire of different resistivity by a metal induced etching step (a) and an electrochemical treatment step (b); The pore size and surface hydrophobicity of the prepared porous nanowire can be easily controlled by changing the length of the current application time.
惟以上所述者,僅為本發明之較佳實施例與具體例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment and the specific examples of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent change according to the scope of the invention and the description of the invention. And modifications are still within the scope of the invention patent.
圖1是一SEM照片,說明運用場發射掃瞄式電子顯微鏡測得實施例1製得之矽材產物的表面形態;Figure 1 is a SEM photograph showing the surface morphology of the coffin product obtained in Example 1 using a field emission scanning electron microscope;
圖2是一SEM照片,說明運用場發射掃瞄式電子顯微鏡測得實施例2製得之矽材產物的表面形態;Figure 2 is a SEM photograph showing the surface morphology of the coffin product obtained in Example 2 using a field emission scanning electron microscope;
圖3是一SEM照片,說明運用場發射掃瞄式電子顯微鏡測得實施例3製得之矽材產物的表面形態;Figure 3 is a SEM photograph showing the surface morphology of the coffin product obtained in Example 3, measured by a field emission scanning electron microscope;
圖4是一SEM照片,說明運用場發射掃瞄式電子顯微鏡測得實施例4製得之矽材產物的表面形態;Figure 4 is a SEM photograph showing the surface morphology of the coffin product obtained in Example 4, measured by a field emission scanning electron microscope;
圖5是一SEM照片,說明運用場發射掃瞄式電子顯微鏡測得實施例5製得之矽材產物的表面形態;Figure 5 is a SEM photograph showing the surface morphology of the coffin product obtained in Example 5 using a field emission scanning electron microscope;
圖6是一SEM照片,說明運用場發射掃瞄式電子顯微鏡測得實施例6製得之矽材產物的表面形態;Figure 6 is a SEM photograph showing the surface morphology of the coffin product obtained in Example 6 measured by a field emission scanning electron microscope;
圖7是一SEM照片,說明運用場發射掃瞄式電子顯微鏡測得實施例7製得之矽材產物的表面形態;Figure 7 is a SEM photograph showing the surface morphology of the coffin product obtained in Example 7 using a field emission scanning electron microscope;
圖8是一SEM照片,說明運用場發射掃瞄式電子顯微鏡測得比較例1製得之矽材產物的表面形態;Figure 8 is a SEM photograph showing the surface morphology of the coffin product obtained in Comparative Example 1 measured by a field emission scanning electron microscope;
圖9是一SEM照片,說明運用場發射掃瞄式電子顯微鏡測得比較例2製得之矽材產物的表面形態;Figure 9 is a SEM photograph showing the surface morphology of the coffin product obtained in Comparative Example 2, measured by a field emission scanning electron microscope;
圖10是一光致發光光譜圖,說明運用螢光光譜儀測得實施例4及比較例1製得之矽材產物在可見光波段的光致發光性質;及Figure 10 is a photoluminescence spectrum showing the photoluminescence properties of the coffin products obtained in Example 4 and Comparative Example 1 in the visible light region by using a fluorescence spectrometer;
圖11是一比較圖,說明比較例1(圖11A)及實施例4(圖11B)製得之矽材產物的接觸角分析結果。Figure 11 is a comparative diagram showing the results of contact angle analysis of the coffin products obtained in Comparative Example 1 (Figure 11A) and Example 4 (Figure 11B).
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