TWI463743B - Elastic sheet structure and electronic device using the same - Google Patents
Elastic sheet structure and electronic device using the same Download PDFInfo
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- TWI463743B TWI463743B TW098126705A TW98126705A TWI463743B TW I463743 B TWI463743 B TW I463743B TW 098126705 A TW098126705 A TW 098126705A TW 98126705 A TW98126705 A TW 98126705A TW I463743 B TWI463743 B TW I463743B
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- contact portion
- electronic device
- latching
- circuit board
- shrapnel
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
本發明涉及一種彈片結構及應用該彈片結構之電子裝置。 The invention relates to a shrapnel structure and an electronic device using the same.
習知之電子產品內部之電子元件與電路板之間常設有一彈片。藉由設置該彈片:一方面可實現電子元件與電路板之間之電連接,另一方面,當電子元件有靜電釋放需求時,電子元件藉由該彈片與電路板上之接地點連接從而實現靜電釋放。 There is a shrapnel between the electronic components inside the electronic product and the circuit board. By providing the shrapnel: on the one hand, the electrical connection between the electronic component and the circuit board can be realized. On the other hand, when the electronic component has the requirement of electrostatic discharge, the electronic component is connected with the grounding point on the circuit board by the elastic piece. Electrostatic discharge.
惟,習知之彈片一般均藉由焊接之方式固接於電路板上,因此,當彈片受損時,難以更換。 However, the conventional shrapnel is generally fixed to the circuit board by soldering, so that it is difficult to replace when the shrapnel is damaged.
鑒於以上所述,有必要提供一種便於更換之彈片結構。 In view of the above, it is necessary to provide a shrapnel structure that is easy to replace.
此外,還有必要提供一種應用上述彈片結構之電子裝置。 In addition, it is also necessary to provide an electronic device to which the above-described shrapnel structure is applied.
一種彈片結構,用以與一電路板連接,該電路板上開設有一通孔,該彈片結構包括一第一接觸部及一由該第一接觸部彎折延伸之卡扣部,該卡扣部穿插且可解除地卡合於前述通孔,以將該彈片結構可解除地卡持於該電路板上。 An elastic structure for connecting to a circuit board, the circuit board having a through hole, the elastic structure comprising a first contact portion and a buckle portion extending from the first contact portion, the buckle portion The through hole is interposed and releasably engaged to releasably hold the elastic structure on the circuit board.
一種電子裝置,包括一電路板,一第一電子元件及一彈片結構,該電路板開設一通孔,該彈片結構包括一第一接觸部、一由該第 一接觸部彎折延伸之卡扣部,該接觸部用以與第一電子元件相接觸,該卡扣部穿插且可解除地卡合於前述通孔,以將該彈片結構可解除地卡持於該電路板上。 An electronic device includes a circuit board, a first electronic component and a resilient structure, the circuit board defines a through hole, the elastic structure includes a first contact portion, and the first a latching portion extending from the contact portion for contacting the first electronic component, the latching portion being inserted and releasably engaged with the through hole to releasably latch the elastic structure On the board.
相較於習知技術,本發明之彈片結構藉由卡扣部可解除地卡合於電路板之通孔內,使彈片結構無需焊接即可固接於電路板上。 Compared with the prior art, the elastic structure of the present invention can be releasably engaged in the through hole of the circuit board by the buckle portion, so that the elastic structure can be fixed to the circuit board without soldering.
10、50‧‧‧彈片結構 10, 50‧‧‧ shrapnel structure
12、52‧‧‧第一接觸部 12, 52‧‧‧ first contact
14、54‧‧‧卡扣部 14, 54, ‧ ‧ buckle
16、56‧‧‧第二接觸部 16, 56‧‧‧Second contact
17、58‧‧‧抵持部 17, 58‧‧ ‧ Responsible Department
18、574‧‧‧防過壓部 18, 574‧‧‧Overvoltage protection
20‧‧‧電路板 20‧‧‧ boards
220‧‧‧通孔 220‧‧‧through hole
222‧‧‧側壁 222‧‧‧ side wall
30‧‧‧第一電子元件 30‧‧‧First electronic components
40‧‧‧第二電子元件 40‧‧‧Second electronic components
50‧‧‧彈片結構 50‧‧‧Shrap structure
542‧‧‧防脫段 542‧‧‧Protection
57‧‧‧第三接觸部 57‧‧‧ Third contact
572‧‧‧連接段 572‧‧‧Connection section
圖1係本發明較佳實施例彈片結構及與其連接之電路板之分解圖;圖2係本發明較佳實施例彈片結構示意圖;圖3係本發明較佳實施例彈片結構固接於電路板上時之示意圖;圖4係圖3所示之彈片結構沿V-V線之剖視圖;圖5係圖4所示之彈片結構抵觸有第一電子元件及第二電子元件之示意圖;圖6係本發明另一較佳實施例彈片結構示意圖。 1 is an exploded view of a shrapnel structure and a circuit board connected thereto according to a preferred embodiment of the present invention; FIG. 2 is a schematic view of a shrapnel structure according to a preferred embodiment of the present invention; and FIG. 3 is a view of a preferred embodiment of the present invention. Figure 4 is a cross-sectional view of the shrapnel structure shown in Figure 3 along the line VV; Figure 5 is a schematic view of the shrapnel structure shown in Figure 4 in contact with the first electronic component and the second electronic component; Figure 6 is a schematic view of the present invention A schematic view of a shrapnel structure of another preferred embodiment.
本發明之彈片結構適用於電子裝置,如手機、個人數位助理(personal digital assistant,PDA)及掌上電腦等。下面以本發明較佳實施例之彈片結構10應用於一手機(圖未標)為例加以說明。 The shrapnel structure of the present invention is suitable for use in electronic devices such as mobile phones, personal digital assistants (PDAs), and palmtop computers. In the following, the shrapnel structure 10 of the preferred embodiment of the present invention is applied to a mobile phone (not shown) as an example.
請參閱圖1及圖5,手機包括一彈片結構10、一電路板20、一第一電子元件30及一第二電子元件40。彈片結構10由導電性能良好之金屬材料製成,如平均含碳量為1%、含鉻量為17%及含鎳量為7% 之不銹鋼(牌號為1Cr17Ni7),且該彈片結構10所需輪廓可由前述金屬材料製成之金屬片經衝壓形成。 Referring to FIGS. 1 and 5 , the mobile phone includes a shrapnel structure 10 , a circuit board 20 , a first electronic component 30 , and a second electronic component 40 . The shrapnel structure 10 is made of a metal material having good electrical conductivity, such as an average carbon content of 1%, a chromium content of 17%, and a nickel content of 7%. Stainless steel (brand number 1Cr17Ni7), and the desired contour of the shrapnel structure 10 can be formed by stamping a metal sheet made of the aforementioned metal material.
請參閱圖2,彈片結構10包括一第一接觸部12、一由第一接觸部12之一側彎折延伸之V形卡扣部14及形成於卡扣部14頂部之第二接觸部16。 Referring to FIG. 2 , the elastic structure 10 includes a first contact portion 12 , a V-shaped buckle portion 14 bent from one side of the first contact portion 12 , and a second contact portion 16 formed on the top of the buckle portion 14 . .
彈片結構10還包括二分別由第一接觸部12之兩端彎折延伸之V形抵持部17及一由第一接觸部12之另一側彎折延伸之防過壓部18。該防過壓部18與卡扣部14相向設置,且防過壓部18之端部大致與第一接觸部12平行。當第一接觸部12受壓過大時,防過壓部18將抵持於電路板20以防止彈片結構10受損。抵持部17對稱設置,當安裝彈片結構10於電路板20上時,抵持部17與電路板20相抵持以便於將彈片結構10固定於電路板20上。此外,抵持部17還可與電路板20上之導電端(圖未示)連接,從而將彈片結構10與電路板20電導通。 The elastic structure 10 further includes two V-shaped abutting portions 17 respectively bent and extended from both ends of the first contact portion 12 and an over-pressure preventing portion 18 bent and extended from the other side of the first contact portion 12. The overpressure prevention portion 18 is disposed opposite to the buckle portion 14, and the end portion of the overpressure prevention portion 18 is substantially parallel to the first contact portion 12. When the first contact portion 12 is overstressed, the overpressure prevention portion 18 will abut against the circuit board 20 to prevent the shrapnel structure 10 from being damaged. The abutting portion 17 is symmetrically disposed. When the elastic structure 10 is mounted on the circuit board 20, the abutting portion 17 abuts against the circuit board 20 to fix the elastic structure 10 to the circuit board 20. In addition, the resisting portion 17 can also be connected to a conductive end (not shown) on the circuit board 20 to electrically connect the shrapnel structure 10 to the circuit board 20.
請參閱圖2及圖4,電路板20上開設一將其貫通之通孔220。該通孔220包括二相對之側壁222,二側壁222之間之距離小於V形卡扣部14開口之間距。因此,當卡扣部14穿過通孔220時,卡扣部14將被壓縮而有擴張之趨勢,從而使卡扣部14卡固於通孔220內。 Referring to FIG. 2 and FIG. 4, a through hole 220 is formed in the circuit board 20 for passing through. The through hole 220 includes two opposite side walls 222, and the distance between the two side walls 222 is smaller than the distance between the openings of the V-shaped snap portions 14. Therefore, when the buckle portion 14 passes through the through hole 220, the buckle portion 14 will be compressed to have a tendency to expand, so that the buckle portion 14 is locked in the through hole 220.
請參閱圖4,安裝前述彈片結構10於電路板20上時,可按照如下步驟進行:將彈片結構10之卡扣部14與電路板20之通孔220對準,以朝向電路板20之方向按壓第一接觸部12,而使卡扣部14進入通孔220內。隨著卡扣部14之進入,卡扣部14兩側與通孔220之側壁222抵持,使得卡扣部14被壓縮而有擴張之趨勢。繼續按壓第一接觸部12,直至抵持部17與電路板20抵持而與電路板上之導電 端連接,如此即將彈片結構10固接於電路板20上。 Referring to FIG. 4, when the foregoing spring structure 10 is mounted on the circuit board 20, the following steps may be performed: aligning the latching portion 14 of the spring structure 10 with the through hole 220 of the circuit board 20 to face the circuit board 20. The first contact portion 12 is pressed to cause the hook portion 14 to enter the through hole 220. As the latching portion 14 enters, the two sides of the latching portion 14 abut against the side wall 222 of the through hole 220, so that the latching portion 14 is compressed and has a tendency to expand. Continue to press the first contact portion 12 until the resisting portion 17 abuts against the circuit board 20 and is electrically conductive on the circuit board The end is connected, so that the shrapnel structure 10 is fixed to the circuit board 20.
請參閱圖3及圖5,將第一電子元件30裝設於彈片結構10之第一接觸部12上及將第二電子元件40裝設於第二接觸部16上,即可實現將第一電子元件30與第二電子元件40與電路板電導通。此時,第一電子元件30壓迫第一接觸部12朝電路板20方向發生微小位移而有反彈之趨勢,使得第一電子元件30與第一接觸部12緊密抵持,從而使第一電子元件30及彈片結構10保持穩定之電性連接。同時,卡扣部14將受壓而發生微小形變,而使得第二電子元件40與前述第二接觸部16緊密抵持,從而使第二電子元件40及彈片結構10亦保持穩定之電性連接。 Referring to FIG. 3 and FIG. 5 , the first electronic component 30 is mounted on the first contact portion 12 of the elastic structure 10 and the second electronic component 40 is mounted on the second contact portion 16 . The electronic component 30 and the second electronic component 40 are electrically connected to the circuit board. At this time, the first electronic component 30 presses the first contact portion 12 to slightly shift toward the circuit board 20 to have a tendency to rebound, so that the first electronic component 30 and the first contact portion 12 closely abut, thereby making the first electronic component 30 and the shrapnel structure 10 maintain a stable electrical connection. At the same time, the latching portion 14 is pressed and slightly deformed, so that the second electronic component 40 and the second contact portion 16 are closely resisted, so that the second electronic component 40 and the elastic structure 10 are also stably connected. .
請參照圖6,本發明另一實施例之彈片結構50包括一第一接觸部52、二分別由第一接觸部52之兩側彎折延伸之卡扣片54、每一卡扣片54之端部形成之一第二接觸部56及由第一接觸部52之一端彎折延伸之與前述卡扣片54相背設置之第三接觸部57。 Referring to FIG. 6 , the elastic structure 50 of the other embodiment of the present invention includes a first contact portion 52 , two fastening pieces 54 respectively bent and extended from two sides of the first contact portion 52 , and each of the fastening pieces 54 . The end portion is formed with a second contact portion 56 and a third contact portion 57 which is bent away from one end of the first contact portion 52 and is disposed opposite to the latching piece 54.
前述卡扣片54間隔設置。前述卡扣片54用以將彈片結構50卡合於電路板20之通孔220內,具體過程為:將前述卡扣片54與通孔220對準,然後按壓前述卡扣片54並使其相向彎曲,再推壓第一接觸部52使得卡扣片54伸入通孔220內,停止按壓卡扣片54,卡扣片54為恢復原來形狀而抵持於通孔220之兩側。如此,將彈片結構50卡合於電路板20上,因此,前述卡扣片54結合為一卡扣部(圖未標)而將彈片結構50卡合於電路板20上。此外,每一卡扣片54之端部先向外再以朝向第一接觸部52之方向卡扣片54彎折形成一防脫段542,當卡扣片54卡入電路板20之通孔220內時,該防脫段542用以防止彈片結構50反方向脫離電路板20。 The aforementioned snap tabs 54 are spaced apart. The locking piece 54 is configured to engage the elastic structure 50 in the through hole 220 of the circuit board 20 by aligning the locking piece 54 with the through hole 220, and then pressing the locking piece 54 and causing the same. When the first contact portion 52 is pressed, the first fastening portion 52 is pushed into the through hole 220, and the locking piece 54 is stopped. The locking piece 54 is restored to the original shape and is abutted on both sides of the through hole 220. In this manner, the elastic structure 50 is engaged with the circuit board 20. Therefore, the locking piece 54 is coupled to a locking portion (not shown) to engage the elastic structure 50 on the circuit board 20. In addition, the end portion of each of the locking pieces 54 is bent outwardly in the direction of the first contact portion 52 to form a retaining portion 542. When the locking piece 54 is inserted into the through hole of the circuit board 20 The inner portion 542 is configured to prevent the shrapnel structure 50 from coming off the circuit board 20 in the opposite direction.
第三接觸部57大致為與第一接觸部52平行之片狀體,其位於第一接觸部52之上方,且藉由一連接段572與第一接觸部52連接。第三接觸部57於垂直於第一接觸部52之方向上與第一接觸部52錯開設置,如此,可將豎直方向上偏移之二電子元件藉由一彈片結構50連接。此外,於第三接觸部57之端部還可向第一接觸部52方向延伸一防過壓部574,該防過壓部574置於該第一接觸部52與該第三接觸部57之間,如此避免第三接觸部57受壓時過度地變形而影響其使用效果。 The third contact portion 57 is substantially a sheet-like body parallel to the first contact portion 52 and located above the first contact portion 52 and connected to the first contact portion 52 by a connecting portion 572. The third contact portion 57 is disposed offset from the first contact portion 52 in a direction perpendicular to the first contact portion 52. Thus, the two electronic components offset in the vertical direction can be connected by a resilient structure 50. In addition, an over-pressure prevention portion 574 extending in the direction of the first contact portion 52 is disposed at an end of the third contact portion 57. The over-pressure prevention portion 574 is disposed between the first contact portion 52 and the third contact portion 57. Therefore, the third contact portion 57 is prevented from being excessively deformed when it is pressed, thereby affecting the use effect.
彈片結構50還包括二分別由第一接觸部52之兩端彎折延伸之V形抵持部58。前述抵持部58與電路板20之導電端接觸而實現彈片結構50與電路板20之電連接。 The elastic structure 50 further includes two V-shaped abutting portions 58 respectively bent and extended by the two ends of the first contact portion 52. The abutting portion 58 is in contact with the conductive end of the circuit board 20 to electrically connect the spring structure 50 to the circuit board 20.
本發明之彈片結構10、50分別藉由卡扣部14、54卡合於電路板20之通孔220內,使彈片結構10、50無需焊接即可固接於電路板20上。此外,藉由彈片結構10之第一接觸部12及彈片結構50之第三接觸部574與第一電子元件30彈性抵觸,以及第二接觸部16、56與第二電子元件40彈性抵觸,使得單一彈片可同時連接兩個不同之電子元件,而可節省彈片之用量。 The elastic structure 10, 50 of the present invention is engaged in the through hole 220 of the circuit board 20 by the fastening portions 14, 54 respectively, so that the elastic structure 10, 50 can be fixed to the circuit board 20 without soldering. In addition, the first contact portion 12 of the elastic structure 10 and the third contact portion 574 of the elastic structure 50 elastically interfere with the first electronic component 30, and the second contact portion 16, 56 elastically interfere with the second electronic component 40, so that A single shrapnel can connect two different electronic components at the same time, saving the amount of shrapnel.
10‧‧‧彈片結構 10‧‧‧Sheet structure
12‧‧‧第一接觸部 12‧‧‧First contact
14‧‧‧卡扣部 14‧‧‧Snap Department
16‧‧‧第二接觸部 16‧‧‧Second contact
17‧‧‧抵持部 17‧‧‧Responsible Department
18‧‧‧防過壓部 18‧‧‧Overvoltage protection
Claims (18)
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TW098126705A TWI463743B (en) | 2009-08-10 | 2009-08-10 | Elastic sheet structure and electronic device using the same |
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TW098126705A TWI463743B (en) | 2009-08-10 | 2009-08-10 | Elastic sheet structure and electronic device using the same |
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TW201106544A TW201106544A (en) | 2011-02-16 |
TWI463743B true TWI463743B (en) | 2014-12-01 |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4003617A (en) * | 1976-03-17 | 1977-01-18 | Essex International, Inc. | Solderless electrical connector for printed circuit |
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2009
- 2009-08-10 TW TW098126705A patent/TWI463743B/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4003617A (en) * | 1976-03-17 | 1977-01-18 | Essex International, Inc. | Solderless electrical connector for printed circuit |
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