TWI463617B - - Google Patents

Info

Publication number
TWI463617B
TWI463617B TW100139317A TW100139317A TWI463617B TW I463617 B TWI463617 B TW I463617B TW 100139317 A TW100139317 A TW 100139317A TW 100139317 A TW100139317 A TW 100139317A TW I463617 B TWI463617 B TW I463617B
Authority
TW
Taiwan
Application number
TW100139317A
Other versions
TW201318120A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100139317A priority Critical patent/TW201318120A/zh
Publication of TW201318120A publication Critical patent/TW201318120A/zh
Application granted granted Critical
Publication of TWI463617B publication Critical patent/TWI463617B/zh

Links

TW100139317A 2011-10-28 2011-10-28 高導熱晶片電路元件及其製作方法 TW201318120A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100139317A TW201318120A (zh) 2011-10-28 2011-10-28 高導熱晶片電路元件及其製作方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100139317A TW201318120A (zh) 2011-10-28 2011-10-28 高導熱晶片電路元件及其製作方法

Publications (2)

Publication Number Publication Date
TW201318120A TW201318120A (zh) 2013-05-01
TWI463617B true TWI463617B (zh) 2014-12-01

Family

ID=48872052

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100139317A TW201318120A (zh) 2011-10-28 2011-10-28 高導熱晶片電路元件及其製作方法

Country Status (1)

Country Link
TW (1) TW201318120A (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI294694B (en) * 2005-06-14 2008-03-11 Ind Tech Res Inst Led wafer-level chip scale packaging
TW200845315A (en) * 2007-01-31 2008-11-16 Yamaha Corp Semiconductor device and packaging structure therefor
CN201412704Y (zh) * 2009-03-10 2010-02-24 广州南科集成电子有限公司 一种集成led芯片的光源

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI294694B (en) * 2005-06-14 2008-03-11 Ind Tech Res Inst Led wafer-level chip scale packaging
TW200845315A (en) * 2007-01-31 2008-11-16 Yamaha Corp Semiconductor device and packaging structure therefor
CN201412704Y (zh) * 2009-03-10 2010-02-24 广州南科集成电子有限公司 一种集成led芯片的光源

Also Published As

Publication number Publication date
TW201318120A (zh) 2013-05-01

Similar Documents

Publication Publication Date Title
BR112013022641A2 (zh)
AP3853A (zh)
BR112013031251A2 (zh)
BR112013027245A2 (zh)
BR112013023185A2 (zh)
BR112013022995A2 (zh)
BR112013027830A2 (zh)
BR112013017670A2 (zh)
BR112013028733A2 (zh)
BR112013027452A2 (zh)
AP2016009466A0 (zh)
BR112013031556A2 (zh)
BR112013032380A2 (zh)
BR112013032377A2 (zh)
BR112013032366A2 (zh)
BR112013018949A2 (zh)
BR112013027836A2 (zh)
BR112013027761A2 (zh)
BR112013021637A2 (zh)
BR112013032392A2 (zh)
BR112013017878A2 (zh)
BR112013027871A2 (zh)
BR112013032394A2 (zh)
BR112013030734A2 (zh)
BR112013027657A2 (zh)