TWI460198B - - Google Patents

Info

Publication number
TWI460198B
TWI460198B TW100148599A TW100148599A TWI460198B TW I460198 B TWI460198 B TW I460198B TW 100148599 A TW100148599 A TW 100148599A TW 100148599 A TW100148599 A TW 100148599A TW I460198 B TWI460198 B TW I460198B
Authority
TW
Taiwan
Application number
TW100148599A
Other languages
Chinese (zh)
Other versions
TW201326245A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100148599A priority Critical patent/TW201326245A/en
Publication of TW201326245A publication Critical patent/TW201326245A/en
Application granted granted Critical
Publication of TWI460198B publication Critical patent/TWI460198B/zh

Links

TW100148599A 2011-12-26 2011-12-26 Packaged LED with high transmittance TW201326245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100148599A TW201326245A (en) 2011-12-26 2011-12-26 Packaged LED with high transmittance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100148599A TW201326245A (en) 2011-12-26 2011-12-26 Packaged LED with high transmittance

Publications (2)

Publication Number Publication Date
TW201326245A TW201326245A (en) 2013-07-01
TWI460198B true TWI460198B (en) 2014-11-11

Family

ID=49224776

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100148599A TW201326245A (en) 2011-12-26 2011-12-26 Packaged LED with high transmittance

Country Status (1)

Country Link
TW (1) TW201326245A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110054072A1 (en) * 2009-09-01 2011-03-03 Junichi Sawada White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and led device
TW201139490A (en) * 2010-03-02 2011-11-16 Nippon Kayaku Kk Process for production of organopolysiloxane, organopolysiloxane obtained by the process, and composition that contains the organopolysiloxane

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110054072A1 (en) * 2009-09-01 2011-03-03 Junichi Sawada White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and led device
TW201139490A (en) * 2010-03-02 2011-11-16 Nippon Kayaku Kk Process for production of organopolysiloxane, organopolysiloxane obtained by the process, and composition that contains the organopolysiloxane

Also Published As

Publication number Publication date
TW201326245A (en) 2013-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees