TWI460021B - Solidification device for solidifying sealant - Google Patents
Solidification device for solidifying sealant Download PDFInfo
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- TWI460021B TWI460021B TW100146156A TW100146156A TWI460021B TW I460021 B TWI460021 B TW I460021B TW 100146156 A TW100146156 A TW 100146156A TW 100146156 A TW100146156 A TW 100146156A TW I460021 B TWI460021 B TW I460021B
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Description
本發明關於一種固化裝置，尤指一種用以固化框膠之固化裝置。The present invention relates to a curing device, and more particularly to a curing device for curing a sealant.
兩片面板之貼合有多種做法，其中一種是在一面板上塗上UV膠，再進行貼合作業。貼合時，膠體可能因面板被擠壓而溢出。因此，一般會在面板之四周塗佈框膠以形成擋牆，來防止膠體溢出。在塗佈框膠的過程中，若無法在出膠時立即進行固化，框膠就會坍塌而無法達到形成擋牆的目的。在塗佈與固化框膠時，最難的是如何讓面板的轉角處的框膠也能即時被UV光照射到而不會有遺漏。先前技術是讓UV光源也跟著供膠裝置旋轉。然而，這在機構的設計上會變得非常複雜，進而增加設備的設置成本。There are many ways to fit the two panels, one of which is to apply UV glue on a panel and then stick it together. When fitted, the gel may overflow as the panel is squeezed. Therefore, the sealant is generally applied around the panel to form a retaining wall to prevent the colloid from overflowing. In the process of coating the sealant, if it cannot be cured immediately after the glue is applied, the sealant will collapse and the retaining wall cannot be formed. When coating and curing the sealant, the most difficult thing is how to make the sealant at the corner of the panel instantly exposed to UV light without any omission. The prior art was to have the UV light source also rotate with the glue supply. However, this can become very complicated in the design of the mechanism, thereby increasing the installation cost of the device.
因此，本發明的目的之一在於提供一種用以固化框膠之固化裝置，以解決上述問題。Accordingly, it is an object of the present invention to provide a curing apparatus for curing a sealant to solve the above problems.
根據一實施例，本發明之用以固化框膠之固化裝置包含一供膠裝置以及四固化光源。供膠裝置沿著一基板之四周移動，以於基板之四周塗佈一框膠。四固化光源分別設置於供膠裝置之前後左右四側，且四固化光源跟隨供膠裝置沿著基板之四周移動。在供膠裝置於基板上塗佈框膠後，四固化光源選擇性地發出固化光線，以固化框膠。According to an embodiment, the curing device for curing the sealant of the present invention comprises a glue supply device and a four-curing light source. The glue supply device moves along a periphery of a substrate to apply a sealant around the substrate. The four curing light sources are respectively disposed on the left and right sides of the glue supply device, and the four curing light sources follow the glue supply device to move along the periphery of the substrate. After the glue applying device applies the sealant on the substrate, the four curing light source selectively emits curing light to cure the sealant.
綜上所述，本發明係於供膠裝置之前後左右四側設置四固化光源，以使供膠裝置位於四固化光源之中心。藉此，即使供膠裝置在基板的轉角處旋轉九十度，供膠裝置還是位於四固化光源之中心。因此，供膠裝置在基板上任意位置塗佈框膠時，都可即時被四固化光源的其中之一所發出之固化光線(例如，UV光)照射到。本發明之用以固化框膠之固化裝置設計簡單，可有效降低設備的設置成本。In summary, the present invention is to provide four curing light sources on the left and right sides of the glue supply device, so that the glue supply device is located at the center of the four curing light sources. Thereby, even if the glue supply device is rotated by ninety degrees at the corner of the substrate, the glue supply device is located at the center of the four solidified light source. Therefore, when the glue applying device applies the sealant at any position on the substrate, it can be immediately irradiated by the curing light (for example, UV light) emitted by one of the four curing light sources. The curing device for curing the sealant of the invention has simple design and can effectively reduce the installation cost of the device.
關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.
請參閱第1圖以及第2圖，第1圖為根據本發明一實施例之用以固化框膠之固化裝置1的示意圖，第2圖為第1圖中的固化裝置1於基板3上塗佈與固化框膠5的俯視圖。本發明之用以固化框膠之固化裝置1包含一供膠裝置10以及四固化光源12a、12b、12c、12d。供膠裝置10可沿著一基板3之四周移動，以於基板3之四周塗佈一框膠5。於實際應用中，基板3可為一用於顯示器之面板。四固化光源12a、12b、12c、12d分別設置於供膠裝置10之前後左右四側。當固化裝置1於基板3上塗佈與固化框膠5時，四固化光源12a、12b、12c、12d係跟隨供膠裝置10沿著基板3之四周移動。在供膠裝置10於基板3上塗佈框膠5後，四固化光源12a、12b、12c、12d選擇性地發出固化光線(例如，UV光)，以固化框膠5。Referring to FIG. 1 and FIG. 2, FIG. 1 is a schematic view of a curing device 1 for curing a sealant according to an embodiment of the present invention, and FIG. 2 is a view showing a curing device 1 of FIG. 1 coated on a substrate 3. Top view of the cloth and the cured frame glue 5. The curing device 1 for curing the sealant of the present invention comprises a glue supply device 10 and four curing light sources 12a, 12b, 12c, 12d. The glue supply device 10 is movable along the periphery of a substrate 3 to apply a sealant 5 around the substrate 3. In practical applications, the substrate 3 can be a panel for a display. The four curing light sources 12a, 12b, 12c, and 12d are respectively disposed on the left and right sides before and after the glue supply device 10. When the curing device 1 coats and cures the sealant 5 on the substrate 3, the four curing light sources 12a, 12b, 12c, and 12d follow the glue supply device 10 to move along the periphery of the substrate 3. After the glue applying device 10 applies the sealant 5 on the substrate 3, the four curing light sources 12a, 12b, 12c, 12d selectively emit curing light (for example, UV light) to cure the sealant 5.
如第1圖與第2圖所示，四固化光源12a、12b、12c、12d所發出之固化光線於基板3上之投影分別以14a、14b、14c、14d標示。當供膠裝置10沿著基板3之側邊10a移動，以於基板3之側邊10a塗佈框膠5時，跟隨供膠裝置10移動之固化光源12a所發出之固化光線即可立即固化框膠5。同理，當供膠裝置10沿著基板3之側邊10b、10c、10d移動，以於基板3之側邊10b、10c、10d塗佈框膠5時，跟隨供膠裝置10移動之固化光源12b、12c、12d所發出之固化光線即可立即固化框膠5。換言之，本發明係於供膠裝置10之前後左右四側設置四固化光源12a、12b、12c、12d，以使供膠裝置10位於四固化光源12a、12b、12c、12d之中心。藉此，即使供膠裝置10在基板3的轉角處旋轉九十度，供膠裝置10還是位於四固化光源12a、12b、12c、12d之中心。因此，供膠裝置10在基板3上任意位置塗佈框膠5時，都可即時被四固化光源12a、12b、12c、12d的其中之一所發出之固化光線照射到。As shown in Figs. 1 and 2, the projections of the curing light emitted by the four curing light sources 12a, 12b, 12c, and 12d on the substrate 3 are indicated by 14a, 14b, 14c, and 14d, respectively. When the glue supply device 10 is moved along the side 10a of the substrate 3 to apply the sealant 5 to the side 10a of the substrate 3, the curing light emitted by the curing light source 12a moving along the glue supply device 10 can be immediately cured. Glue 5. Similarly, when the glue supply device 10 moves along the side edges 10b, 10c, and 10d of the substrate 3 to apply the sealant 5 to the side edges 10b, 10c, and 10d of the substrate 3, the curing light source that follows the movement of the glue supply device 10 is used. The curing light emitted by 12b, 12c, and 12d can immediately cure the sealant 5. In other words, the present invention is to provide four curing light sources 12a, 12b, 12c, 12d on the left and right sides of the glue supply device 10 so that the glue supply device 10 is located at the center of the four curing light sources 12a, 12b, 12c, 12d. Thereby, even if the glue supply device 10 is rotated by ninety degrees at the corner of the substrate 3, the glue supply device 10 is located at the center of the four solidified light sources 12a, 12b, 12c, 12d. Therefore, when the glue applying device 10 applies the sealant 5 at any position on the substrate 3, it can be immediately irradiated by the curing light emitted by one of the four curing light sources 12a, 12b, 12c, and 12d.
固化裝置1運作時，可使四固化光源12a、12b、12c、12d同時發出固化光線，或是根據供膠裝置10目前行進之基板3之側邊控制對應的固化光源發出固化光線。When the curing device 1 is in operation, the four curing light sources 12a, 12b, 12c, and 12d can simultaneously emit curing light, or the curing light can be emitted according to the side of the substrate 3 on which the glue supply device 10 is currently traveling.
於此實施例中，四固化光源12a、12b、12c、12d所發出之固化光線於基板3上之投影14a、14b、14c、14d係呈類橢圓分佈(如第2圖中之虛線類橢圓16所示)。此外，每一個固化光源所發出之固化光線於基板3上之投影的寬度大於或等於與此固化光源相鄰之二固化光源所發出之固化光線於基板3上之投影間的距離。舉例而言，如第2圖所示，固化光源12b所發出之固化光線於基板3上之投影14b的寬度W大於或等於與此固化光源12b相鄰之二固化光源12a、12c所發出之固化光線於基板3上之投影14a、14c間的距離D。藉此，當供膠裝置10在基板3的轉角處(如第2圖中之側邊10a與側邊10b之交角)旋轉九十度時，固化光源12b所發出之固化光線於基板3上之投影14b仍可完全照射到塗佈於此轉角處之框膠5，而不會有遺漏。In this embodiment, the projections 14a, 14b, 14c, and 14d of the curing light emitted by the four curing light sources 12a, 12b, 12c, and 12d on the substrate 3 are elliptical-like (as shown by the dotted line ellipse 16 in FIG. 2). Shown). In addition, the width of the projection of the curing light emitted by each curing light source on the substrate 3 is greater than or equal to the distance between the projection of the curing light emitted by the two curing light sources adjacent to the curing light source on the substrate 3. For example, as shown in FIG. 2, the width W of the projection 14b of the curing light emitted from the curing light source 12b on the substrate 3 is greater than or equal to the curing by the two curing light sources 12a, 12c adjacent to the curing light source 12b. The distance D between the projections 14a, 14c of the light on the substrate 3. Thereby, when the glue supply device 10 rotates ninety degrees at the corner of the substrate 3 (such as the intersection angle of the side edge 10a and the side edge 10b in FIG. 2), the curing light emitted from the curing light source 12b is on the substrate 3. The projection 14b can still completely illuminate the sealant 5 applied to the corners without any omission.
需說明的是，為了讓每一個固化光源12a、12b、12c、12d的照射強度都達到最強，本發明可使每一個固化光源12a、12b、12c、12d都貼近基板3，並且於每一個固化光源12a、12b、12c、12d前端裝設聚光鏡，讓固化光線之強度不致發散。It should be noted that, in order to maximize the illumination intensity of each of the curing light sources 12a, 12b, 12c, and 12d, the present invention can make each of the curing light sources 12a, 12b, 12c, and 12d close to the substrate 3, and cure each of them. The front end of the light sources 12a, 12b, 12c, and 12d is provided with a condensing mirror so that the intensity of the curing light does not diverge.
相較於先前技術，本發明係於供膠裝置之前後左右四側設置四固化光源，以使供膠裝置位於四固化光源之中心。藉此，即使供膠裝置在基板的轉角處旋轉九十度，供膠裝置還是位於四固化光源之中心。因此，供膠裝置在基板上任意位置塗佈框膠時，都可即時被四固化光源的其中之一所發出之固化光線(例如，UV光)照射到。本發明之用以固化框膠之固化裝置設計簡單，可有效降低設備的設置成本。Compared with the prior art, the present invention is to provide four curing light sources on the left and right sides of the glue supply device, so that the glue supply device is located at the center of the four curing light sources. Thereby, even if the glue supply device is rotated by ninety degrees at the corner of the substrate, the glue supply device is located at the center of the four solidified light source. Therefore, when the glue applying device applies the sealant at any position on the substrate, it can be immediately irradiated by the curing light (for example, UV light) emitted by one of the four curing light sources. The curing device for curing the sealant of the invention has simple design and can effectively reduce the installation cost of the device.
以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
1．．．固化裝置1. . . Curing device
3．．．基板3. . . Substrate
5．．．框膠5. . . Frame glue
10．．．供膠裝置10. . . Gluing device
12a、12b、12c、12d．．．固化光源12a, 12b, 12c, 12d. . . Curing light source
14a、14b、14c、14d．．．投影14a, 14b, 14c, 14d. . . projection
16．．．類橢圓16. . . Ellipse
W．．．寬度W. . . width
D．．．距離D. . . distance
第1圖為根據本發明一實施例之用以固化框膠之固化裝置的示意圖。1 is a schematic view of a curing apparatus for curing a sealant in accordance with an embodiment of the present invention.
第2圖為第1圖中的固化裝置於基板上塗佈與固化框膠的俯視圖。Fig. 2 is a plan view showing the curing and sealing of the curing device on the substrate in the first embodiment.
1．．．固化裝置1. . . Curing device
10．．．供膠裝置10. . . Gluing device
12a、12b、12c、12d．．．固化光源12a, 12b, 12c, 12d. . . Curing light source
Claims (4)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100146156A TWI460021B (en) | 2011-12-14 | 2011-12-14 | Solidification device for solidifying sealant |
| CN201210140253XA CN103157588A (en) | 2011-12-14 | 2012-05-08 | Curing device for curing frame glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100146156A TWI460021B (en) | 2011-12-14 | 2011-12-14 | Solidification device for solidifying sealant |
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|---|---|
| TW201323098A TW201323098A (en) | 2013-06-16 |
| TWI460021B true TWI460021B (en) | 2014-11-11 |
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| TW100146156A TWI460021B (en) | 2011-12-14 | 2011-12-14 | Solidification device for solidifying sealant |
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| CN (1) | CN103157588A (en) |
| TW (1) | TWI460021B (en) |
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| CN104668151B (en) * | 2013-11-28 | 2018-06-15 | 东莞新科技术研究开发有限公司 | The processing unit and method of semiconductor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005324440A (en) * | 2004-05-14 | 2005-11-24 | Nok Corp | Device for molding resin by irradiation with wave energy ray or corpuscular ray |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE10020679A1 (en) * | 2000-04-27 | 2001-11-08 | Basf Coatings Ag | Sealing of seams and joints in motor vehicle bodies comprises application of an actinic radiation curable seam sealing material followed by curing of the material by means of actinic radiation. |
| US7470921B2 (en) * | 2005-09-20 | 2008-12-30 | Summit Business Products, Inc. | Light-emitting diode device |
| CN201508663U (en) * | 2009-06-26 | 2010-06-16 | 易发精机股份有限公司 | Display module with enclosure frame and a gumming forming machine for forming display module enclosure frame |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005324440A (en) * | 2004-05-14 | 2005-11-24 | Nok Corp | Device for molding resin by irradiation with wave energy ray or corpuscular ray |
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| CN103157588A (en) | 2013-06-19 |
| TW201323098A (en) | 2013-06-16 |
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