TWI459882B - Electronic device housing - Google Patents

Description

Electronic device housing

The present invention relates to an electronic device, and more particularly to a housing for an electronic device.

When the electronic device accidentally falls, the corner portion of the electronic device housing is a vulnerable area. In order to protect the corners of the electronic device housing, a general electronic device usually uses an impact buffer device to protect the corner portions. The impact buffer device includes a foam material and a connecting member. The foam material is fixed to the corner portion of the electronic device housing by the connecting member. When the electronic device is impacted, the foam material can absorb the impact energy, thereby protecting the corner portions of the electronic device housing. However, the use of an external impact buffer device increases the size of the electronic device and affects the appearance of the electronic device housing.

In view of the above situation, it is necessary to provide an electronic device housing having better drop resistance performance and better appearance.

An electronic device housing includes a bottom case and a protection block fixedly disposed outside the bottom case. The elastic modulus of the protective block material is greater than the elastic modulus of the bottom shell material. The bottom case includes a bottom plate, a plurality of side walls extending from the edge of the bottom plate toward one side thereof, and a fitting portion adapted to the protective block. The bottom case and the protective block are integrally formed by an insert molding method. The mating portion includes a bottom wall connected to the bottom plate, two connecting plates respectively connected to the two adjacent side walls, and a recess portion connecting the two connecting plates, the protective block being fixedly connected to the bottom wall and the connecting plate, and A buffer zone is formed with the recess.

The electronic device casing is disposed on the outer side of the bottom casing by using the protection block, and the elastic modulus of the material of the protection block is large, and a buffer zone is formed between the protection portion and the matching portion of the bottom casing, so that the electronic device casing is impacted and buffered. The part can be elastically deformed in the buffer zone to absorb the impact energy, thereby protecting the electronic device casing and making the anti-drop performance better. The protective block and the bottom case cooperate to form an electronic device housing having a better appearance.

100‧‧‧Electronic device housing

10‧‧‧ bottom case

11,31‧‧‧floor

12‧‧‧First side wall

13‧‧‧Second side wall

14‧‧‧Party Department

141‧‧‧ bottom wall

142‧‧‧First connecting plate

143‧‧‧Second connection plate

144‧‧‧Depression

30‧‧‧protection block

33‧‧‧Extension wall

330‧‧‧buffer

331‧‧‧Connecting Department

332‧‧‧ buffer

1 is an assembled, isometric view of an electronic device housing in accordance with an embodiment of the present invention.

2 is an exploded perspective view of the electronic device housing shown in FIG. 1.

3 is an exploded perspective view of the electronic device housing of FIG. 1 at another angle.

The electronic device housing of the present invention can be a housing of an electronic device such as a touch tablet computer, a mobile phone, an MP3, a digital photo frame, or a liquid crystal display. In the present embodiment, a touch panel housing will be described as an example.

Referring to FIGS. 1 to 3 , the electronic device housing 100 includes a bottom case 10 and a protection block 30 connected to the bottom case 10 . The bottom case 10 includes a bottom plate 11, two opposite first side walls 12, two opposite second side walls 13, and a plurality of mating portions 14. The first side wall 12 and the second side wall 13 are both formed from the edge of the bottom plate 11 toward one side thereof, and the first side wall 12 and the second side wall 13 are sequentially connected. Each of the engaging portions 14 is formed inwardly recessed by the intersection of the first side wall 12, the second side wall 13 and the bottom plate 11. Each of the mating portions 14 includes a bottom wall 141 connected to the bottom plate 11, a first connecting plate 142 connected to the first side wall 12, a second connecting plate 143 connected to the second side wall 13, and a first connecting plate 142 and a connecting portion The recess 144 of the second connecting plate 143. The recess 144 is generally curved. In the present embodiment, the bottom case 10 is made of a metal material.

The protection block 30 is fixedly disposed on the mating portion 14 of the bottom case 10. The protective block 30 has a shape substantially matching the shape of the engaging portion 14, and includes a bottom plate 31 and an extending wall 33 which is bent and extended from one side edge of the bottom plate 31 toward one side thereof. The bottom plate 31 is fixedly coupled to the bottom wall 141 of the mating portion 14 of the bottom case 10. The extension wall 33 includes two connection portions 331 and a buffer portion 332 that connects the two connection portions 331 . The buffer portion 332 and the two connecting portions 331 smoothly transition. The two connecting portions 331 are fixedly connected to the first connecting plate 142 and the second connecting plate 143 of the engaging portion 14, respectively. The buffer portion 332 has an arc shape, and a gap is reserved between the recess portion 144 of the mating portion 14 to form a buffer zone 330 (shown in FIG. 1). In the present embodiment, the protective block 30 is made of plastic.

It can be understood that the material of the bottom case 10 is not limited to the metal material, and the material of the protection block 30 is not limited to plastic, as long as the elastic modulus of the material of the protection block 30 is greater than the elastic modulus of the material of the bottom case 10, for example, the bottom case 10 may also be plastic. However, the elastic modulus of the plastic used in the protective block 30 is greater than the elastic modulus of the plastic used in the bottom casing 10. When both the bottom case 10 and the protection block 30 are plastic, they can be integrally formed by a two-shot molding method.

The electronic device housing 100 of the embodiment of the present invention is disposed at a corner portion of the bottom case 10 by using a protective block 30 having a large material elasticity coefficient, and between the buffer portion 332 of the protection block 30 and the recess portion 144 corresponding to the bottom case 10 The gap is preset to form the buffer zone 330. When the corner portion is impacted, the buffer portion 332 can be elastically deformed in the buffer zone 330 to absorb the impact energy, thereby protecting the electronic device housing 100 from being better in lodging resistance. The protective block 30 and the bottom case 10 cooperate to form an electronic device housing 100 having a complete appearance without affecting its appearance.

In the present embodiment, the material of the bottom case 10 is metal, the material of the protection block 30 is plastic, and the bottom case 10 and the protection block 30 are integrally formed by an insert molding method to enhance the combination between the bottom case 10 and the protection block 30. Force, further improving the electronic device housing 100 Resistance to falling. It can be understood that the bottom case 10 and the protection block 30 can also be fixedly connected by other means, such as adhesive, snapping, and the like.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧Electronic device housing

10‧‧‧ bottom case

30‧‧‧protection block

330‧‧‧buffer

Claims (7)

An electronic device housing includes a bottom case and a protection block fixedly disposed outside the bottom case, wherein a material having a modulus of elasticity greater than a modulus of elasticity of the material of the bottom case is improved in that the bottom case comprises a bottom plate a plurality of side walls extending from one side of the bottom plate to a side thereof and a matching portion adapted to the protective block, the mating portion being formed by recessing the bottom plate and the adjacent two of the side walls toward the inner portion of the bottom case, the fitting portion The bottom wall connected to the bottom plate, the two connecting plates respectively connected to the two adjacent side walls, and the recessed portion connecting the two connecting plates, the protective block is fixedly connected with the bottom wall and the connecting plate, and the recess The department forms a buffer. The electronic device casing according to claim 1, wherein the bottom casing is made of metal, and the protective block is made of plastic. The electronic device housing of claim 2, wherein the bottom case and the protective block are integrally formed by an insert molding method. The electronic device housing of claim 1, wherein the recessed portion has an arc shape. The electronic device housing of claim 1, wherein the protection block comprises a bottom plate fixedly connected to the bottom wall and an extension wall extending from one side edge of the bottom plate to one side thereof, the extension wall The connecting plate is fixedly connected, and the extending wall and the recess form the buffer. The electronic device housing of claim 5, wherein the extension wall comprises two connection portions respectively fixedly connected to the connection plate and a buffer portion connecting the two connection portions, the buffer portion and the recess portion forming the Buffer. The electronic device housing of claim 6, wherein the buffer portion has an arc shape.