TWI458861B - Surface Treatment of Copper in Copper Process Cleaning Solution - Google Patents
Surface Treatment of Copper in Copper Process Cleaning Solution Download PDFInfo
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- TWI458861B TWI458861B TW101120008A TW101120008A TWI458861B TW I458861 B TWI458861 B TW I458861B TW 101120008 A TW101120008 A TW 101120008A TW 101120008 A TW101120008 A TW 101120008A TW I458861 B TWI458861 B TW I458861B
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- copper
- liquid
- cleaning
- cleaning liquid
- storage tank
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- 238000004140 cleaning Methods 0.000 title claims description 75
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 69
- 229910052802 copper Inorganic materials 0.000 title claims description 69
- 239000010949 copper Substances 0.000 title claims description 69
- 238000000034 method Methods 0.000 title claims description 50
- 230000008569 process Effects 0.000 title claims description 29
- 238000004381 surface treatment Methods 0.000 title claims description 21
- 239000007788 liquid Substances 0.000 claims description 87
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 27
- 238000001223 reverse osmosis Methods 0.000 claims description 24
- 239000000126 substance Substances 0.000 claims description 22
- 238000007747 plating Methods 0.000 claims description 18
- 238000004064 recycling Methods 0.000 claims description 17
- 239000012466 permeate Substances 0.000 claims description 15
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 13
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 13
- 239000002738 chelating agent Substances 0.000 claims description 12
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 10
- 239000004917 carbon fiber Substances 0.000 claims description 10
- 239000012141 concentrate Substances 0.000 claims description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 10
- 239000005416 organic matter Substances 0.000 claims description 10
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 9
- 239000000460 chlorine Substances 0.000 claims description 9
- 229910052801 chlorine Inorganic materials 0.000 claims description 9
- 238000001914 filtration Methods 0.000 claims description 8
- 239000010419 fine particle Substances 0.000 claims description 8
- 239000012528 membrane Substances 0.000 claims description 7
- 239000007800 oxidant agent Substances 0.000 claims description 7
- 230000003647 oxidation Effects 0.000 claims description 7
- 238000007254 oxidation reaction Methods 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 7
- 229920002521 macromolecule Polymers 0.000 claims description 6
- 150000004699 copper complex Chemical class 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 claims description 4
- 235000011006 sodium potassium tartrate Nutrition 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 239000010802 sludge Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002351 wastewater Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 238000004065 wastewater treatment Methods 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010812 mixed waste Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009931 pascalization Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Landscapes
- Separation Using Semi-Permeable Membranes (AREA)
- Treatment Of Water By Oxidation Or Reduction (AREA)
Description
本發明係有關於一種表面處理化學銅製程清洗液中銅的循環利用方法，尤其是利用逆滲透模組以形成包含至少高濃度硫酸銅的濃縮液以達到銅的資源回收。The invention relates to a method for recycling copper in a surface treatment chemical copper process cleaning liquid, in particular to use a reverse osmosis module to form a concentrated liquid containing at least a high concentration of copper sulfate to achieve copper resource recovery.
在一般的表面處理製程中，常常需要在目標物件上形成特定鍍層，藉以提供具特殊性能的表面，比如用以增加導電特性以傳導電力或傳送電氣信號，或用以表現出金屬光澤以加強視覺美觀，或用以防蝕、防鏽或防止刮傷的保護作用。In a typical surface treatment process, it is often necessary to form a specific coating on the target object to provide a surface with special properties, such as to increase electrical conductivity to conduct electricity or to transmit electrical signals, or to exhibit metallic luster to enhance vision. Beautiful, or used to protect against corrosion, rust, or scratches.
針對需要增加導電特性或需要形成導電層的應用，常使用通電的電鍍銅製程或不需通電的無電鍍銅製程，可在目標物件上成長出特定厚度的金屬銅層或合金銅層，尤其是印刷電路板(PCB)中的導電層，以供後續蝕刻處理而形成所需的電路圖案。不論是鍍銅製程或無電鍍銅製程，都需要在鍍槽中灌注具有高濃度銅來源的鍍液，藉以利用電力或化學反應將鍍液中的銅離子還原成金屬銅層或合金銅層，並沉積在浸泡於鍍液中的目標物件上。由於鍍液中的銅離子會隨著製程的進行而逐漸消耗掉，因此需要適當的補充銅來源，比如硫酸銅。For applications requiring increased conductive properties or the need to form a conductive layer, an electroplated copper process or an electroless copper-free process is often used to grow a metal copper or alloy copper layer of a specific thickness on the target object, especially A conductive layer in a printed circuit board (PCB) for subsequent etching to form the desired circuit pattern. Whether it is a copper plating process or an electroless copper plating process, it is necessary to inject a plating solution having a high concentration of copper source into the plating tank, thereby reducing the copper ions in the plating solution to a metal copper layer or an alloy copper layer by electric power or chemical reaction. And deposited on the target object immersed in the plating solution. Since the copper ions in the plating solution are gradually consumed as the process progresses, it is necessary to supplement the copper source appropriately, such as copper sulfate.
此外，為了避免對後續製程的干擾，比如目標物件上殘留鍍液的可能污染，因此需要進行清洗處理，以去除殘留的鍍液。通常是使用去離子水(De-ionized Water)當作清洗液，讓目標物件浸泡在清洗液中以實現清洗處理，而清洗後的清洗液中會含有鍍液成分，比如銅離子，而且還可能含有其他有用的或污染性的有機物或化學物質，比如有機酸或螯合劑，所以需要適當處理，而不可 當作廢水直接排放。在習用技術中，常常是將酸洗、蝕刻或其他製程所產生的不同廢水一起混合收集後，再利用複雜且昂貴的廢水處理設備以去除廢水中所有的有害物質或回收有用的物質，以符合環保法規所規範的排放標準，並產生需最終處置的污泥，比如利用掩埋處理。In addition, in order to avoid interference with subsequent processes, such as possible contamination of the residual plating solution on the target object, a cleaning process is required to remove the residual plating solution. De-ionized water is usually used as a cleaning solution, so that the target object is immersed in the cleaning solution for cleaning, and the cleaning solution may contain plating components such as copper ions, and may also Contains other useful or polluting organics or chemicals, such as organic acids or chelating agents, so proper treatment is required. Direct discharge as wastewater. In the conventional technology, it is common to mix and collect different waste water generated by pickling, etching or other processes, and then use complicated and expensive waste water treatment equipment to remove all harmful substances in the waste water or recover useful substances to meet Emission standards stipulated by environmental regulations, and produce sludge that needs final disposal, such as landfill disposal.
然而，習用技術的缺點在於，混合廢水包含太多各種污染物，使得廢水處理設備所需的功能增加，造成整體處理成本居高不下，且實務上操作複雜，需要相當熟練的技術人員。因此，需要一種表面處理化學銅製程清洗液中銅的循環利用方法，利用逆滲透模組以形成包含至少高濃度硫酸銅的濃縮液，對清洗後的含銅清洗液直接進行銅的資源回收處理，以解決上述習用技術的問題。However, the disadvantage of the conventional technology is that the mixed waste water contains too many kinds of various pollutants, so that the functions required for the waste water treatment equipment are increased, the overall treatment cost is high, and the operation is complicated, and a skilled technician is required. Therefore, there is a need for a method for recycling copper in a surface treatment chemical copper process cleaning liquid, which uses a reverse osmosis module to form a concentrated liquid containing at least a high concentration of copper sulfate, and directly recovers copper resources from the cleaned copper-containing cleaning liquid. To solve the above problems of the conventional technology.
本發明之主要目的在提供一種表面處理化學銅製程清洗液中銅的循環利用方法，且該清洗液係在一表面處理製程時浸泡一待清洗物件後所形成，而清洗液包含化學銅的硫酸銅，並包含硫酸銅、微小顆粒，氯、有機物、洛捷爾鹽、螯合劑銅錯合物、螯合劑，該資源回收方法包括：用清洗液儲存槽儲存清洗液，並利用碳纖維過濾器過濾清洗液中的微小顆粒，並吸附該清洗液中的氯，藉以產生過濾處理液；利用臭氧氧化器產生臭氧，用以氧化並去除過濾處理液中的有機物，進而形成臭氧處理液，並回送至清洗液儲存槽；利用高壓幫浦以加壓清洗液儲存槽中的清洗液，形成高壓處理液，並傳送至逆滲透模組；利用逆滲透模組對高壓處理液進行逆滲透處理，進而產生滲透液以及濃縮液，其中濃縮液保留高壓處理液中的大分子物質，以及高濃度的硫酸銅及含銅洛捷爾鹽(Rochelle salt)，而滲透液包含低濃度的硫酸銅及含銅洛捷 爾鹽，且不包含大分子物質；以及將濃縮液輸送至鍍槽，用以當作鍍液的額外銅來源。The main object of the present invention is to provide a method for recycling copper in a surface treatment chemical copper process cleaning liquid, which is formed by immersing a material to be cleaned in a surface treatment process, and the cleaning liquid contains sulfuric acid of chemical copper. Copper, and comprises copper sulfate, fine particles, chlorine, organic matter, Loiter salt, chelating agent copper complex, chelating agent, the resource recovery method comprises: storing the cleaning liquid in a cleaning liquid storage tank, and filtering by using a carbon fiber filter Cleaning the small particles in the liquid, and adsorbing the chlorine in the cleaning liquid, thereby generating a filtering treatment liquid; generating ozone by using an ozone oxidizer to oxidize and remove the organic matter in the filtration treatment liquid, thereby forming an ozone treatment liquid, and returning to the ozone treatment liquid a cleaning liquid storage tank; the high-pressure pump is used to pressurize the cleaning liquid in the cleaning liquid storage tank to form a high-pressure treatment liquid, and is sent to the reverse osmosis module; the reverse osmosis module is used for reverse osmosis treatment of the high-pressure treatment liquid, thereby generating Permeate and concentrate, wherein the concentrate retains macromolecular substances in the high pressure treatment liquid, and high concentration of copper sulfate and copper Ter salts (Rochelle salt), and the permeate contains low concentrations of copper sulfate and copper Luo Jie Salt, and does not contain macromolecular substances; and the concentrate is transported to the plating tank as an additional source of copper for the bath.
因此，本發明的資源回收方法可產生具有高濃渡銅的濃縮液，可實現回收銅的目的，並達到零排放且零污泥的目標。Therefore, the resource recovery method of the present invention can produce a concentrated liquid having a high concentration of copper, which can achieve the purpose of recovering copper and achieve the goal of zero discharge and zero sludge.
以下配合圖式及元件符號對本發明之實施方法式做更詳細的說明，俾使熟習該項技藝者在研讀本說明書後能據以實施。The embodiments of the present invention will be described in more detail below with reference to the drawings and the reference numerals, so that those skilled in the art can implement the present invention after studying the present specification.
參閱第一圖，本發明表面處理化學銅製程清洗液中銅的循環利用方法的處理流程示意圖。如第一圖所示，本發明的表面處理化學銅製程清洗液中銅的循環利用方法係包括依序進行的步驟S10、S20、S30、S40以及S50，用以回收清洗液中的銅，其中清洗液是在表面處理製程時置於清洗槽中以浸泡方式清洗待清洗物件，以除去待清洗物件表面上的殘留化學藥劑或固體微粒，而待清洗物件係經過無電鍍銅處理或電鍍銅處理而在表面形成金屬銅層。因此，清洗液經清洗待清洗物件後會包含化學銅的硫酸銅，並包含微小顆粒，氯、有機物、含銅洛捷爾鹽(Rochelle salt)、螯合劑銅錯合物以及螯合劑的至少其之一。Referring to the first figure, a schematic diagram of the processing flow of the copper recycling method in the surface treatment chemical copper process cleaning liquid of the present invention. As shown in the first figure, the method for recycling copper in the surface treatment chemical copper process cleaning liquid of the present invention comprises the steps S10, S20, S30, S40 and S50 sequentially performed to recover copper in the cleaning liquid, wherein The cleaning liquid is placed in the cleaning tank during the surface treatment process to wash the object to be cleaned by immersion to remove residual chemicals or solid particles on the surface of the object to be cleaned, and the object to be cleaned is subjected to electroless copper treatment or copper plating treatment. A metal copper layer is formed on the surface. Therefore, the cleaning solution contains copper sulfate of chemical copper after cleaning the object to be cleaned, and contains fine particles, at least chlorine, organic matter, copper-containing Rochelle salt, chelating agent copper complex, and chelating agent. one.
同時，為了清楚明本發明的特點，請配合參閱第二圖，本發明循環利用方法資源回收方法的示意圖。In the meantime, in order to clarify the characteristics of the present invention, please refer to the second figure, a schematic diagram of the resource recycling method of the recycling method of the present invention.
首先，本發明的表面處理製程清洗液中銅之資源回收方法由步驟S10開始，主要是由清洗液儲存槽T接收來自清洗槽的清洗槽清洗液L1以形成儲存槽清洗液L2，並利用碳纖維過濾器10過濾儲存槽清洗液L2以產生過濾處理液L3。碳纖維過濾器10包含碳纖維，可過濾儲存槽清洗液L2中的微小顆粒，並吸附氯，藉以同時去除微小顆粒及氯，其中微小顆粒可包括金屬碎屑、固態鹽 粒或其他固態雜質。First, the method for recovering copper resources in the surface treatment process cleaning liquid of the present invention starts from step S10, and mainly receives the cleaning tank cleaning liquid L1 from the cleaning tank by the cleaning liquid storage tank T to form the storage tank cleaning liquid L2, and utilizes carbon fiber. The filter 10 filters the storage tank cleaning liquid L2 to produce a filtration treatment liquid L3. The carbon fiber filter 10 comprises carbon fiber, which can filter fine particles in the storage tank cleaning liquid L2 and adsorb chlorine, thereby simultaneously removing minute particles and chlorine, wherein the fine particles may include metal chips and solid salts. Granules or other solid impurities.
接著在步驟S20中，利用臭氧氧化器20產生臭氧，並利用所產的臭氧對過濾處理液L3中的有機物進行氧化處理，以達到去除有機物的目的，進而形成臭氧處理液L4，且將臭氧處理液L4送回清洗液儲存槽T，其中有機物可包括醇類、醛類、有機酸，而臭氧氧化器20係包含多個串接的臭氧氧化管(圖中未顯示)，每個臭氧氧化管具有用以產生紫外光的紫外燈，用以產生所需的臭氧。Next, in step S20, ozone is generated by the ozone oxidizer 20, and the organic matter in the filtration treatment liquid L3 is oxidized by the generated ozone to achieve the purpose of removing the organic matter, thereby forming the ozone treatment liquid L4, and treating the ozone. The liquid L4 is sent back to the cleaning liquid storage tank T, wherein the organic matter may include alcohols, aldehydes, organic acids, and the ozone oxidizer 20 comprises a plurality of tandem ozone oxidation tubes (not shown), each ozone oxidation tube An ultraviolet lamp is used to generate ultraviolet light to produce the desired ozone.
因此，上述的步驟S10及步驟S20的目的在於預先處理清洗槽清洗液L1，並由臭氧氧化器20及碳纖維過濾器10，配合清洗液儲存槽T而形成封閉循環路徑。Therefore, the above-described steps S10 and S20 aim to pretreat the cleaning tank cleaning liquid L1, and the ozone oxidizer 20 and the carbon fiber filter 10 are combined with the cleaning liquid storage tank T to form a closed circulation path.
在步驟S30中，利用高壓幫浦30抽取清洗液儲存槽T中的儲存槽清洗液L2以形成高壓處理液L5，並傳送至逆滲透模組40。In step S30, the storage tank cleaning liquid L2 in the cleaning liquid storage tank T is taken out by the high pressure pump 30 to form the high pressure processing liquid L5, and is sent to the reverse osmosis module 40.
接著進入步驟S40，利用逆滲透模組40接收高壓處理液L5，且逆滲透模組40包含逆滲透膜(圖中未顯示)，用以對高壓處理液L5進行逆滲透處理，進而產生滲透過逆滲透膜的滲透液L6以及未滲透過逆滲透膜的濃縮液L7。滲透液L6包含低濃度的硫酸銅及含銅洛捷爾鹽，且不包含該大分子物質，比如螯合劑銅錯合物、螯合劑，可當作一般溶劑再利用。相對的，濃縮液L7保留高壓處理液L4中的大分子物質以及高濃度的硫酸銅及含銅洛捷爾鹽，具有再利用的價值。Next, proceeding to step S40, the high-pressure treatment liquid L5 is received by the reverse osmosis module 40, and the reverse osmosis module 40 includes a reverse osmosis membrane (not shown) for performing reverse osmosis treatment on the high-pressure treatment liquid L5, thereby generating permeation. The permeate L6 of the reverse osmosis membrane and the concentrate L7 which did not permeate the reverse osmosis membrane. The permeate L6 contains a low concentration of copper sulfate and a copper-containing Lowell salt, and does not contain the macromolecular substance, such as a chelating agent copper complex, a chelating agent, and can be reused as a general solvent. In contrast, the concentrated liquid L7 retains the macromolecular substance in the high-pressure treatment liquid L4 and the high-concentration copper sulfate and the copper-containing Lowell salt, and has the value of reuse.
此外，可進一步利用液位控制方式，藉動態控制部分的滲透液L6回送到清洗液儲存槽T，以調節排放出去的滲透液L6之流量。具體而言，可在清洗液儲存槽T中安置液位感測器(圖中未顯示)，並配置控制閥V以控制是否回送滲透液L6，且控制閥V係由液位感測器控制是否打開。液位感測器感測清洗液儲存槽T中儲存槽清洗液L2的液位，使得儲存槽清洗液L2低於預設液位時， 打開控制閥V使部分滲透液L6回送到清洗液儲存槽T，以降低排放滲透液L8的流量，並使儲存槽清洗液L2的液位升高。另外，在儲存槽清洗液L2高於預設液位時，可關閉控制閥V，而使所有的滲透液L6排放出去。In addition, the liquid level control method can be further utilized to return the permeate L6 of the dynamic control portion to the cleaning liquid storage tank T to adjust the flow rate of the discharged permeate L6. Specifically, a liquid level sensor (not shown) may be disposed in the cleaning liquid storage tank T, and a control valve V is disposed to control whether the permeate L6 is returned, and the control valve V is controlled by the liquid level sensor. Whether to open. The liquid level sensor senses the liquid level of the storage tank cleaning liquid L2 in the cleaning liquid storage tank T, so that when the storage tank cleaning liquid L2 is lower than the preset liquid level, The control valve V is opened to return a part of the permeate L6 to the cleaning liquid storage tank T to reduce the flow rate of the discharge permeate L8 and raise the liquid level of the storage tank cleaning liquid L2. In addition, when the storage tank cleaning liquid L2 is higher than the preset liquid level, the control valve V can be closed, and all the permeate L6 can be discharged.
最後，在步驟S50中，可藉幫浦、重力或溢流方式，將濃縮液L7輸送至鍍槽50，用以當作無電鍍銅處理或電鍍銅處理中鍍液所需的額外銅來源，或輸送至調配槽(圖中未顯示)，以調配具較佳組成的鍍液，供後續表面處理製程所需，或輸送至儲存槽(圖中未顯示)，用以暫時儲存。由於濃縮液L7包含高濃度的硫酸銅，因此，可達到回收目的，充分利用清洗液中的銅。Finally, in step S50, the concentrate L7 can be transported to the plating tank 50 by means of pumping, gravity or overflow to serve as an additional source of copper required for electroless copper plating or electroplating copper plating. Or transport to the mixing tank (not shown) to prepare a bath with a better composition for subsequent surface treatment processes, or to a storage tank (not shown) for temporary storage. Since the concentrated liquid L7 contains a high concentration of copper sulfate, the purpose of recycling can be achieved, and the copper in the cleaning liquid can be fully utilized.
本發明的特點在於利用碳纖維過濾器、臭氧氧化器以及逆滲透模組，以分別實現過濾、氧化以及濃縮處理，進而將濃縮後具有高濃度銅離子及可再利用物質的濃縮液送回鍍槽，以達到銅的資源回目的，同時，本發明的方法並不產生額外的污泥，進而具有零排放的優點。The invention is characterized in that the carbon fiber filter, the ozone oxidizer and the reverse osmosis module are respectively used for respectively filtering, oxidizing and concentrating, and then the concentrated concentrated liquid having high concentration of copper ions and reusable substances is sent back to the plating tank. In order to achieve the return of copper resources, at the same time, the method of the invention does not generate additional sludge, and thus has the advantage of zero emissions.
以上所述者僅為用以解釋本發明之較佳實施例，並非企圖據以對本發明做任何形式上之限制，是以，凡有在相同之發明精神下所作有關本發明之任何修飾或變更，皆仍應包括在本發明意圖保護之範疇。The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, and any modifications or alterations to the present invention made in the spirit of the same invention. All should still be included in the scope of the intention of the present invention.
10‧‧‧碳纖維過濾器10‧‧‧Carbon fiber filter
20‧‧‧臭氧氧化器20‧‧‧Ozone oxidizer
30‧‧‧高壓幫浦30‧‧‧High pressure pump
40‧‧‧逆滲透模組40‧‧‧ reverse osmosis module
L1‧‧‧清洗槽清洗液L1‧‧‧ Cleaning tank cleaning solution
L2‧‧‧儲存槽清洗液L2‧‧‧ Storage tank cleaning solution
L3‧‧‧過濾處理液L3‧‧‧Filter treatment solution
L4‧‧‧臭氧處理液L4‧‧‧Ozone treatment solution
L5‧‧‧高壓處理液L5‧‧‧High pressure treatment fluid
L6‧‧‧滲透液L6‧‧‧ Permeate
L7‧‧‧濃縮液L7‧‧‧ Concentrate
S10‧‧‧過濾微小顆粒並吸附氯S10‧‧‧Filter fine particles and adsorb chlorine
S20‧‧‧用臭氧氧化去除有機物S20‧‧‧Ulting Ozone Oxidation to Remove Organic Matter
S30‧‧‧加壓傳送S30‧‧‧pressure transfer
S40‧‧‧逆滲透處理S40‧‧‧ reverse osmosis treatment
S50‧‧‧輸送濃縮液S50‧‧‧Transport concentrate
T‧‧‧清洗液儲存槽T‧‧‧ cleaning solution storage tank
V‧‧‧控制閥V‧‧‧ control valve
第一圖顯示本發明表面處理化學銅製程清洗液中銅的循環利用方法的處理流程示意圖。The first figure shows a schematic diagram of the processing flow of the copper recycling method in the surface treatment chemical copper process cleaning liquid of the present invention.
第二圖顯示本發明循環利用方法的示意圖。The second figure shows a schematic diagram of the recycling method of the present invention.
S10‧‧‧過濾微小顆粒並吸附氯S10‧‧‧Filter fine particles and adsorb chlorine
S20‧‧‧用臭氧氧化去除有機物S20‧‧‧Ulting Ozone Oxidation to Remove Organic Matter
S30‧‧‧加壓傳送S30‧‧‧pressure transfer
S40‧‧‧逆滲透處理S40‧‧‧ reverse osmosis treatment
S50‧‧‧輸送濃縮液S50‧‧‧Transport concentrate
Claims (7)
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200500500A (en) * | 2003-05-27 | 2005-01-01 | Ebara Corp | Plating apparatus and plating method |
| TW200838601A (en) * | 2006-09-25 | 2008-10-01 | Toray Industries | Method for operating reverse osmosis membrane filtration plant, and reverse osmosis membrane filtration plant |
| CN201343479Y (en) * | 2009-01-13 | 2009-11-11 | 厦门市威士邦膜科技有限公司 | Electroplating wastewater treatment device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200500500A (en) * | 2003-05-27 | 2005-01-01 | Ebara Corp | Plating apparatus and plating method |
| TW200838601A (en) * | 2006-09-25 | 2008-10-01 | Toray Industries | Method for operating reverse osmosis membrane filtration plant, and reverse osmosis membrane filtration plant |
| CN201343479Y (en) * | 2009-01-13 | 2009-11-11 | 厦门市威士邦膜科技有限公司 | Electroplating wastewater treatment device |
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