TWI458123B - - Google Patents
Info
- Publication number
- TWI458123B TWI458123B TW101121881A TW101121881A TWI458123B TW I458123 B TWI458123 B TW I458123B TW 101121881 A TW101121881 A TW 101121881A TW 101121881 A TW101121881 A TW 101121881A TW I458123 B TWI458123 B TW I458123B
- Authority
- TW
- Taiwan
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101121881A TW201401552A (en) | 2012-06-19 | 2012-06-19 | Thermal stress release structure for light emitting diodes |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101121881A TW201401552A (en) | 2012-06-19 | 2012-06-19 | Thermal stress release structure for light emitting diodes |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201401552A TW201401552A (en) | 2014-01-01 |
TWI458123B true TWI458123B (en) | 2014-10-21 |
Family
ID=50345173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101121881A TW201401552A (en) | 2012-06-19 | 2012-06-19 | Thermal stress release structure for light emitting diodes |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201401552A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114335274B (en) * | 2022-03-10 | 2022-06-17 | 江西兆驰半导体有限公司 | Epitaxial structure of light emitting diode and preparation method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050145862A1 (en) * | 2003-12-31 | 2005-07-07 | Lg Electronics Inc. | Light emitting device and manufacturing method thereof |
US20100237387A1 (en) * | 2009-03-19 | 2010-09-23 | Sanken Electric Co., Ltd. | Semiconductor wafer, semiconductor element and manufacturing method thereof |
US20110017972A1 (en) * | 2009-07-22 | 2011-01-27 | Rfmd (Uk) Limited | Light emitting structure with integral reverse voltage protection |
US20110104836A1 (en) * | 2008-06-27 | 2011-05-05 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic component and optoelectronic component |
-
2012
- 2012-06-19 TW TW101121881A patent/TW201401552A/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050145862A1 (en) * | 2003-12-31 | 2005-07-07 | Lg Electronics Inc. | Light emitting device and manufacturing method thereof |
US20110104836A1 (en) * | 2008-06-27 | 2011-05-05 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic component and optoelectronic component |
US20100237387A1 (en) * | 2009-03-19 | 2010-09-23 | Sanken Electric Co., Ltd. | Semiconductor wafer, semiconductor element and manufacturing method thereof |
US20110017972A1 (en) * | 2009-07-22 | 2011-01-27 | Rfmd (Uk) Limited | Light emitting structure with integral reverse voltage protection |
Also Published As
Publication number | Publication date |
---|---|
TW201401552A (en) | 2014-01-01 |
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Legal Events
Date | Code | Title | Description |
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GD4A | Issue of patent certificate for granted invention patent |