TWI456311B - Backlight module and assembling method thereof - Google Patents

Backlight module and assembling method thereof Download PDF

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Publication number
TWI456311B
TWI456311B TW100135776A TW100135776A TWI456311B TW I456311 B TWI456311 B TW I456311B TW 100135776 A TW100135776 A TW 100135776A TW 100135776 A TW100135776 A TW 100135776A TW I456311 B TWI456311 B TW I456311B
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TW
Taiwan
Prior art keywords
light
light emitting
backlight module
emitting diode
opaque layer
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Application number
TW100135776A
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Chinese (zh)
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TW201316092A (en
Inventor
Hunghsun Changchien
Tajen Huang
Chiachen Kung
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Au Optronics Corp
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Publication date
Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW100135776A priority Critical patent/TWI456311B/en
Priority to CN 201110378929 priority patent/CN102401296B/en
Publication of TW201316092A publication Critical patent/TW201316092A/en
Application granted granted Critical
Publication of TWI456311B publication Critical patent/TWI456311B/en

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Claims (13)

一種背光模組,包含:一導光板,包含:一出光面;一反射面,相對該出光面;以及一入光面,同時連接該出光面及該反射面;一光源,包含多個線性排列之發光二極體元件,任二相鄰之該些發光二極體元件間具有一間隔,每一該些發光二極體元件具有面朝該入光面之一發光面,每一該些發光二極體元件之高度大於該導光板之一厚度;以及一不透光層,位於該導光板之該出光面鄰近該些發光二極體元件之一側,包含:一條狀部,包含:一第一面,貼靠該導光板之該出光面;以及至少二第二面,鄰接該第一面,間隔地形成於該第一面之一側,分別面向並貼靠該些發光面其中一者,用以阻擋光線溢露至該導光板之該出光面;以及至少一延伸部,鄰接該第一面,位於該至少二第二面之間,自該條狀部之該側伸入該些間隔其中之一。 A backlight module includes: a light guide plate, comprising: a light emitting surface; a reflecting surface opposite to the light emitting surface; and a light incident surface connecting the light emitting surface and the reflecting surface; a light source comprising a plurality of linear arrays The light-emitting diode element has a space between the two adjacent light-emitting diode elements, and each of the light-emitting diode elements has a light-emitting surface facing the light-incident surface, and each of the light-emitting surfaces The height of the diode element is greater than a thickness of the light guide plate; and an opaque layer is disposed on a side of the light-emitting surface of the light guide plate adjacent to one of the light-emitting diode elements, and includes: a strip portion, comprising: a first surface facing the light-emitting surface of the light guide plate; and at least two second surfaces adjacent to the first surface, spaced apart from one side of the first surface, respectively facing and abutting one of the light-emitting surfaces The light exiting surface for blocking light from being exposed to the light guide plate; and at least one extending portion adjacent to the first surface between the at least two second surfaces, extending from the side of the strip portion Some of these intervals. 如請求項1所述之背光模組更包含:一罩體,其內具有一容置空間,用以容置該導光板、該光源及該不透光層,其中該不透光層藉由一黏膠層結合於該罩體內側;以及 一反光片,貼靠於該導光板之該反射面。 The backlight module of claim 1 further comprising: a cover having an accommodating space for accommodating the light guide plate, the light source and the opaque layer, wherein the opaque layer is An adhesive layer is bonded to the inside of the cover; a reflective sheet that abuts against the reflective surface of the light guide plate. 如請求項1所述之背光模組,其中該不透光層之厚度不大於每一該些發光二極體元件之該高度與該導光板之該厚度之差值。 The backlight module of claim 1, wherein the thickness of the opaque layer is not greater than a difference between the height of each of the light emitting diode elements and the thickness of the light guide plate. 如請求項1所述之背光模組,其中該不透光層包含多個該至少一延伸部,該條狀部之一長軸軸向分別與該些延伸部之一長軸軸向相互垂直,且該些延伸部係分別設置在對應任二相鄰之該些發光二極體元件間之該些間隔。 The backlight module of claim 1, wherein the opaque layer comprises a plurality of the at least one extension portion, and one of the longitudinal axes of the strip portion is perpendicular to the longitudinal axis of one of the extension portions And the extensions are respectively disposed at the intervals between the two adjacent two of the light emitting diode elements. 如請求項1所述之背光模組,其中該不透光層包含多個該至少一延伸部,該條狀部之一長軸軸向分別與該些延伸部之一長軸軸向相互垂直,且該些延伸部係設置在部分任二相鄰之該些發光二極體元件間之該些間隔中。 The backlight module of claim 1, wherein the opaque layer comprises a plurality of the at least one extension portion, and one of the longitudinal axes of the strip portion is perpendicular to the longitudinal axis of one of the extension portions And the extensions are disposed in the intervals between the two adjacent two of the light emitting diode elements. 如請求項1所述之背光模組,其中該不透光層之形狀包含梳狀、”├”字型、””字型、”E”字型或”F”字型。The backlight module of claim 1, wherein the shape of the opaque layer comprises a comb shape, a "├" shape, a "" font, an "E" shape or an "F" shape. 如請求項1所述之背光模組,其中該至少一延伸部之一末端更包含一卡固部,該卡固部之一最大寬度大於該間隔之寬度,被卡固於該些發光二極體元件遠離該條狀部之一側。 The backlight module of claim 1, wherein one end of the at least one extension further comprises a fastening portion, and a maximum width of one of the fastening portions is greater than a width of the interval, and is fixed to the light emitting diodes The body member is located away from one side of the strip. 如請求項1所述之背光模組,其中該至少一延伸部 之截面寬度大於該間隔之寬度,以致該至少一延伸部被卡固於該間隔中。 The backlight module of claim 1, wherein the at least one extension The cross-sectional width is greater than the width of the spacing such that the at least one extension is snapped into the space. 如請求項1所述之背光模組,其中該不透光層包含一光反射片或一遮光片。 The backlight module of claim 1, wherein the opaque layer comprises a light reflecting sheet or a light shielding sheet. 一種背光模組之組裝方法,包含:提供一罩體,該罩體具有朝一長軸軸向配置之容置空間;配置一光源至該容置空間內,其中該光源包含多個朝該長軸軸向配置之發光二極體元件,每一該些發光二極體元件具有一面朝外之發光面,任二相鄰之該些發光二極體元件間具有一間隔;朝該長軸軸向之一正交方向,配置一不透光層至該些發光二極體元件上,其中該不透光層包含一條狀部及至少一延伸部,該至少一延伸部位於該條狀部之一側,且伸入該些間隔其中之一內,使得該條狀部貼靠每一該些發光面;以及朝該長軸軸向之該正交方向,配置一導光板至該容置空間內,其中該導光板包含一出光面、一反射面及一入光面,該出光面相對該反射面,且貼靠該條狀部,該入光面同時連接該出光面及該反射面,且貼靠每一該些發光面,該導光板相對該出光面之一反射面貼附一反光片。 A method for assembling a backlight module, comprising: providing a cover body having an accommodating space disposed axially toward a long axis; and arranging a light source into the accommodating space, wherein the light source comprises a plurality of the long axis toward the long axis An axially disposed light emitting diode element, each of the light emitting diode elements having an outwardly facing light emitting surface, and any two adjacent light emitting diode elements having a space therebetween; toward the long axis Arranging an opaque layer to the light emitting diode elements in an orthogonal direction, wherein the opaque layer comprises a strip portion and at least one extending portion, wherein the at least one extending portion is located in the strip portion One side, and extending into one of the intervals, such that the strip portion abuts each of the light emitting surfaces; and a direction to the orthogonal direction of the long axis, a light guide plate is disposed to the receiving space The light guide plate includes a light emitting surface, a reflecting surface and a light incident surface, wherein the light emitting surface is opposite to the reflecting surface and abuts the strip portion, and the light incident surface simultaneously connects the light emitting surface and the reflecting surface. And abutting each of the light emitting surfaces, the light guide plate is opposite to the light emitting surface Attaching a surface emitting sheeting. 如請求項10所述之背光模組之組裝方法,其中配 置該不透光層至該些發光二極體元件時,更包含:藉由一黏膠層,將該不透光層結合於該罩體內側。 The method for assembling a backlight module according to claim 10, wherein When the opaque layer is disposed on the light emitting diode elements, the opaque layer is bonded to the inner side of the cover body by an adhesive layer. 如請求項10所述之背光模組之組裝方法,其中配置該不透光層至該些發光二極體元件時,更包含:當該至少一延伸部伸入該間隔後,將該至少一延伸部末端之一卡固部卡固於該些發光二極體元件遠離該條狀部之一側。 The method of assembling the backlight module according to claim 10, wherein when the opaque layer is disposed to the light emitting diode elements, the method further comprises: when the at least one extending portion extends into the interval, the at least one One of the ends of the extension portion is fastened to the side of the light-emitting diode element away from the strip portion. 如請求項10所述之背光模組之組裝方法,其中配置該不透光層至該些發光二極體元件時,更包含:當該至少一延伸部伸入該間隔後,由於該至少一延伸部之截面寬度大於該間隔之寬度,以致該至少一延伸部被卡固於該間隔中。 The method of assembling the backlight module of claim 10, wherein when the opaque layer is disposed to the light emitting diode elements, the method further comprises: when the at least one extending portion extends into the interval, due to the at least one The cross-sectional width of the extension is greater than the width of the spacing such that the at least one extension is snapped into the space.
TW100135776A 2011-10-03 2011-10-03 Backlight module and assembling method thereof TWI456311B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI625561B (en) * 2017-04-07 2018-06-01 元太科技工業股份有限公司 Light guide assembly
US10694159B2 (en) 2018-06-06 2020-06-23 Au Optronics Corporation Backlight module and display device using the same
US10823895B2 (en) 2014-01-29 2020-11-03 E Ink Holdings Inc. Light-emitting module

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102889523B (en) * 2012-10-09 2015-03-11 深圳市华星光电技术有限公司 Backlight module
CN104097043B (en) * 2013-04-12 2017-03-01 京东方科技集团股份有限公司 A kind of kludge
CN103728776B (en) * 2013-12-31 2016-02-24 京东方科技集团股份有限公司 A kind of backlight module and display device
CN104175089A (en) * 2014-09-01 2014-12-03 苏州市吴中区胥口广博模具加工厂 Press fit support of LED (light-emitting diode) display screen built-in lamp tube pressing device
CN104235689A (en) * 2014-09-05 2014-12-24 深圳晶华显示器材有限公司 Prepositive surface light source, manufacturing method and display device comprising prepositive surface light source
TWI567341B (en) 2014-11-19 2017-01-21 達方電子股份有限公司 Light emission module and light guide plate and manufacturing method thereof
CN109932839B (en) * 2019-04-24 2022-04-08 京东方科技集团股份有限公司 Display panel and display device
CN113451487B (en) * 2020-08-20 2022-09-23 重庆康佳光电技术研究院有限公司 Display panel and display device with same
WO2022036646A1 (en) * 2020-08-20 2022-02-24 重庆康佳光电技术研究院有限公司 Display panel and display device containing same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080068858A1 (en) * 2006-09-19 2008-03-20 Omron Corporation Surface light source apparatus
TW201007286A (en) * 2008-08-08 2010-02-16 Au Optronics Corp Backlight module and light-mixing structure thereof
CN101929653A (en) * 2009-06-26 2010-12-29 友达光电(厦门)有限公司 Light source reflecting housing and backlight module
CN101936509A (en) * 2010-09-20 2011-01-05 友达光电股份有限公司 Backlight structure and production method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007080520A (en) * 2005-09-09 2007-03-29 Harison Toshiba Lighting Corp Backlight device
JP2010204390A (en) * 2009-03-03 2010-09-16 Hitachi Displays Ltd Liquid crystal display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080068858A1 (en) * 2006-09-19 2008-03-20 Omron Corporation Surface light source apparatus
TW201007286A (en) * 2008-08-08 2010-02-16 Au Optronics Corp Backlight module and light-mixing structure thereof
CN101929653A (en) * 2009-06-26 2010-12-29 友达光电(厦门)有限公司 Light source reflecting housing and backlight module
CN101936509A (en) * 2010-09-20 2011-01-05 友达光电股份有限公司 Backlight structure and production method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10823895B2 (en) 2014-01-29 2020-11-03 E Ink Holdings Inc. Light-emitting module
TWI625561B (en) * 2017-04-07 2018-06-01 元太科技工業股份有限公司 Light guide assembly
US10694159B2 (en) 2018-06-06 2020-06-23 Au Optronics Corporation Backlight module and display device using the same

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CN102401296A (en) 2012-04-04
TW201316092A (en) 2013-04-16
CN102401296B (en) 2013-10-30

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