TWI454793B - Light source device - Google Patents

Light source device Download PDF

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Publication number
TWI454793B
TWI454793B TW100139130A TW100139130A TWI454793B TW I454793 B TWI454793 B TW I454793B TW 100139130 A TW100139130 A TW 100139130A TW 100139130 A TW100139130 A TW 100139130A TW I454793 B TWI454793 B TW I454793B
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Taiwan
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light source
plate
heat dissipating
dissipating component
source device
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TW100139130A
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Chinese (zh)
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TW201317670A (en
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Hung Chun Yang
Chuan Hsiang Wang
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Young Lighting Technology Corp
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Description

光源裝置Light source device

本發明是有關於一種光源裝置,且特別是有關於一種具有散熱元件的光源裝置。The present invention relates to a light source device, and more particularly to a light source device having a heat dissipating component.

目前的電子裝置多利用平面顯示模組進行畫面的顯示,其中又以液晶顯示模組的技術較為純熟且普及化。然而,由於液晶顯示模組的顯示面板本身無法發光,故在顯示面板下方必須具有背光模組以提供顯示畫面所需光線。為了避免背光模組內的光源產生過熱的現象,可在背板內裝設導熱性佳的散熱元件,並將光源配置於散熱元件上,以使光源發光時產生的熱傳導至散熱元件,然而散熱元件在此種配置方式下會被包覆在背板內,而無法有效將熱導至外界。另一種散熱方式為直接將光源配置於背光模組的背板上,且背板選用高導熱的材質以對光源進行散熱,然而高導熱材質的背板(如全鋁背板)會增加產品的製造成本。At present, electronic devices often use a flat display module to display images, and the technology of the liquid crystal display module is more sophisticated and popular. However, since the display panel of the liquid crystal display module cannot emit light by itself, a backlight module must be provided under the display panel to provide light required for displaying the screen. In order to avoid overheating of the light source in the backlight module, a heat dissipating component with good thermal conductivity may be disposed in the back panel, and the light source may be disposed on the heat dissipating component to conduct heat generated when the light source emits light to the heat dissipating component, but dissipate heat. In this configuration, the component is wrapped in the backplane and cannot effectively conduct heat to the outside. Another heat dissipation method is to directly arrange the light source on the back panel of the backlight module, and the back plate is made of a material with high thermal conductivity to dissipate heat from the light source. However, the back plate with high thermal conductivity material (such as the aluminum back plate) increases the product. manufacturing cost.

美國專利編號US20110007236 A1揭露一種背光模組的散熱結構,其散熱片固定於背光模組內以對光源進行散熱。中國專利編號CN201606844U揭露一種背光裝置,散熱擠型板安裝在背光裝置的背板上,且光源透過絕緣導熱薄片貼在散熱擠型板上。US Patent No. US20110007236 A1 discloses a heat dissipation structure of a backlight module, wherein a heat sink is fixed in the backlight module to dissipate heat from the light source. Chinese Patent No. CN201606844U discloses a backlight device in which a heat dissipating extruded plate is mounted on a back plate of a backlight device, and a light source is attached to the heat dissipating plate through an insulating and heat conducting sheet.

本發明提出一種光源裝置,具有較佳的散熱效率且可節省製造成本。The invention provides a light source device which has better heat dissipation efficiency and can save manufacturing costs.

本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。Other objects and advantages of the present invention will become apparent from the technical features disclosed herein.

為達上述之一或部份或全部目的或是其他目的,本發明之一實施例提供一種光源裝置,包括一背板、一散熱元件及一光源。散熱元件固定於背板上。背板與散熱元件形成一容納空間。至少部分散熱元件位於容納空間外。光源配置於散熱元件上且位於容納空間內。In order to achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides a light source device including a back plate, a heat dissipating component, and a light source. The heat dissipating component is fixed to the backboard. The back plate forms a receiving space with the heat dissipating component. At least a portion of the heat dissipating component is located outside of the receiving space. The light source is disposed on the heat dissipating component and located in the accommodating space.

基於上述,在本發明的上述實施例中至少具有以下其中一個優點,背板與散熱元件形成用以容納光源的容納空間,散熱元件並非被包覆於容納空間內,而是至少部分位於容納空間外。藉此,配置於散熱元件上的光源所產生的熱可有效地透過散熱元件被導至外界,以提升光源裝置的散熱效率。Based on the above, at least one of the following advantages is obtained in the above embodiments of the present invention, the back plate and the heat dissipating component form an accommodating space for accommodating the light source, and the heat dissipating component is not covered in the accommodating space, but at least partially located in the accommodating space. outer. Thereby, the heat generated by the light source disposed on the heat dissipating component can be effectively conducted to the outside through the heat dissipating component to improve the heat dissipating efficiency of the light source device.

為讓本發明之上述特徵和優點能更明顯易懂,下文特舉多個實施例,並配合所附圖式,作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之多個實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如「上」、「下」、「前」、「後」、「左」、「右」等,僅是參考附加圖式的方向。因此,使用的方向用語是用來說明,而非用來限制本發明。The foregoing and other objects, features, and advantages of the invention will be apparent from the Detailed Description The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only directions referring to the additional schema. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

圖1為本發明一實施例之光源裝置的立體圖。圖2為圖1之背板及散熱元件的分解圖。請參考圖1及圖2,本實施例的光源裝置100包括一背板110、至少一散熱元件120(繪示為兩個)及至少一光源130。散熱元件120固定於背板110上,背板110與散熱元件120形成一容納空間110a。至少部分散熱元件120位於容納空間110a外,光源130例如為發光二極體燈條且配置於散熱元件120上,並位於容納空間110a內。1 is a perspective view of a light source device according to an embodiment of the present invention. 2 is an exploded view of the backing plate and the heat dissipating component of FIG. 1. Referring to FIG. 1 and FIG. 2 , the light source device 100 of the present embodiment includes a back plate 110 , at least one heat dissipating component 120 (shown as two), and at least one light source 130 . The heat dissipating component 120 is fixed on the backboard 110, and the backplane 110 and the heat dissipating component 120 form a receiving space 110a. At least a portion of the heat dissipating component 120 is located outside the accommodating space 110a. The light source 130 is, for example, a light emitting diode strip and disposed on the heat dissipating component 120 and located in the accommodating space 110a.

在上述配置方式之下,背板110與散熱元件120形成用以容納光源130的容納空間110a,散熱元件120並非被包覆於容納空間110a內,而是至少部分位於容納空間110a外。藉此,配置於散熱元件120上的光源130所產生的熱可有效地透過散熱元件120被導至外界,以提升光源裝置100的散熱效率。此外,由於光源130主要是透過散熱元件120進行散熱而非透過背板110進行散熱,因此背板110不需選用高導熱材質,而可節省製造成本。In the above configuration, the backplane 110 and the heat dissipating component 120 form an accommodating space 110a for accommodating the light source 130. The heat dissipating component 120 is not covered in the accommodating space 110a, but is at least partially located outside the accommodating space 110a. Thereby, the heat generated by the light source 130 disposed on the heat dissipating component 120 can be effectively conducted to the outside through the heat dissipating component 120 to improve the heat dissipating efficiency of the light source device 100. In addition, since the light source 130 mainly dissipates heat through the heat dissipating component 120 instead of dissipating heat through the backplane 110, the backplane 110 does not need to use a high thermal conductive material, thereby saving manufacturing costs.

本實施例的背板110與散熱元件120所形成的容納空間110a可容納導光板、光學膜片及反射片等光學片材,而使光源130與所述光學片材組成背光模組。The accommodating space 110a formed by the back plate 110 and the heat dissipating component 120 of the embodiment can accommodate an optical sheet such as a light guide plate, an optical film, and a reflection sheet, and the light source 130 and the optical sheet form a backlight module.

在本實施例中,散熱元件120的材質例如為導熱效率高的鋁,而背板110的材質例如為導熱效率及成本較低的鍍鋅鋼板(Steel Electrogalvanized ColdRolled Common,SECC)。在其它實施例中,散熱元件120可選用其它導熱效率高的適當材質,且背板110可選用其它導熱效率及成本較低的適當材質,本發明不對此加以限制。In the present embodiment, the material of the heat dissipating component 120 is, for example, aluminum having high heat conductivity, and the material of the backing plate 110 is, for example, a steel electroplated steel plate (SECC) having low heat conduction efficiency and low cost. In other embodiments, the heat dissipating component 120 can be selected from other suitable materials having high heat conduction efficiency, and the backing plate 110 can be selected from other materials having lower heat conduction efficiency and lower cost, which is not limited by the present invention.

本實施例的背板110包括一底板112及兩側牆114。兩側牆114分別垂直地連接於底板112相對的兩側邊,且散熱元件130的兩端分別設置於兩側牆114上。詳細而言,各側牆114的末端具有一折壁114a,散熱元件120的兩端分別藉由鎖附件120a鎖附於兩折壁114a上。在本實施例中,鎖附件120a例如為螺絲,散熱元件120具有鎖孔120b(繪示於圖2),側牆114的折壁114a具有鎖孔114b,鎖附件120a透過鎖孔120b及鎖孔114b將散熱元件120鎖附於背板110上。在其它實施例中,散熱元件120可藉由其它適當方式固定於背板110上,本發明不對此加以限制。The back plate 110 of this embodiment includes a bottom plate 112 and two side walls 114. The two side walls 114 are vertically connected to opposite sides of the bottom plate 112, and two ends of the heat dissipating component 130 are respectively disposed on the two side walls 114. In detail, each end wall 114 has a folded wall 114a at its end, and both ends of the heat dissipating component 120 are respectively locked to the two folded walls 114a by the lock attachment 120a. In this embodiment, the lock attachment 120a is, for example, a screw, the heat dissipation element 120 has a lock hole 120b (shown in FIG. 2), the fold wall 114a of the side wall 114 has a lock hole 114b, and the lock attachment 120a passes through the lock hole 120b and the lock hole 114b. The heat dissipating component 120 is locked to the backboard 110. In other embodiments, the heat dissipating component 120 can be secured to the backplane 110 by other suitable means, which is not limited by the present invention.

圖3為圖1之光源裝置的局部剖視圖。請參考圖1至圖3,本實施例的散熱元件120包括一第一板體122及一第二板體124。第一板體122的兩端分別設置於兩側牆114上,第一板體122垂直於底板112且與底板112之間具有一間隙G。第二板體124垂直地連接於第一板體122且遮蓋間隙G。Figure 3 is a partial cross-sectional view of the light source device of Figure 1. Referring to FIG. 1 to FIG. 3 , the heat dissipating component 120 of the embodiment includes a first plate body 122 and a second plate body 124 . The two ends of the first plate body 122 are respectively disposed on the two side walls 114. The first plate body 122 is perpendicular to the bottom plate 112 and has a gap G between the bottom plate 112 and the bottom plate 112. The second plate body 124 is vertically connected to the first plate body 122 and covers the gap G.

圖4為圖1之光源裝置的局部側視圖。請參考圖1、圖2及圖4,第一板體122具有一折壁122a,各側牆114被限位於折壁122a與第二板體124之間,以阻止背板110與散熱元件120沿垂直底板112的方向D1相對移動。此外,第二板體124具有兩折壁124a,兩折壁124a分別延伸至兩側牆114的外側,以阻止背板110與散熱元件120沿垂直兩側牆114的方向D2相對移動。藉由折壁122a與折壁124a的設計,可限制背板110與散熱元件120的相對移動,使背板110與散熱元件120藉由較少的鎖附件即可完成組裝。Figure 4 is a partial side elevational view of the light source device of Figure 1. Referring to FIG. 1 , FIG. 2 and FIG. 4 , the first board body 122 has a folding wall 122 a , and each side wall 114 is limited between the folding wall 122 a and the second board 124 to prevent the back board 110 from being perpendicular to the heat dissipating component 120 . The direction D1 of the bottom plate 112 relatively moves. In addition, the second plate body 124 has two folded walls 124a extending to the outer sides of the side walls 114 to prevent the back plate 110 from moving relative to the heat dissipating member 120 in the direction D2 of the vertical side walls 114. By the design of the folding wall 122a and the folding wall 124a, the relative movement of the backing plate 110 and the heat dissipating component 120 can be restricted, so that the backing plate 110 and the heat dissipating component 120 can be assembled by using fewer lock attachments.

圖5A及圖5B為圖1之光源裝置的組裝流程圖。當進行背板110與散熱元件120的組裝時,可先如圖5A將散熱元件120對位於背板110。接著,沿方向D3將散熱元件120推向背板110至圖5B所示位置,使背板110的側牆114受到散熱元件120的折壁122a與折壁124a的限位。最後藉由鎖附件120a將散熱元件120鎖附至側牆114的折壁114a上以完成組裝。5A and 5B are assembly flowcharts of the light source device of Fig. 1. When the assembly of the backplane 110 and the heat dissipating component 120 is performed, the heat dissipating component 120 may be first placed on the backplane 110 as shown in FIG. 5A. Next, the heat dissipating component 120 is pushed in the direction D3 to the position of the backing plate 110 to the position shown in FIG. 5B, so that the side wall 114 of the backing plate 110 is restricted by the folding wall 122a and the folding wall 124a of the heat dissipating component 120. Finally, the heat dissipating component 120 is locked to the folded wall 114a of the side wall 114 by the lock attachment 120a to complete the assembly.

圖6為本發明另一實施例之光源裝置的局部側視圖。請參考圖6,在本實施例的光源裝置200中,背板210的底板212與側牆214、側牆214的折壁214a、散熱元件220的第一板體222與第二板體224、第一板體222的折壁222a以及鎖附件220a的配置方式,與圖4所示的配置方式相同,於此不加以贅述。光源裝置200與光源裝置100的不同處在於,散熱元件120的第二板體124具有折壁124a,而散熱元件220的第二板體224不具有折壁,因此光源裝置200可具有較小的整體寬度。可依設計上的需求決定是否於第二板體形成折壁,本發明不對此加以限制。Figure 6 is a partial side elevational view of a light source device in accordance with another embodiment of the present invention. Referring to FIG. 6, in the light source device 200 of the embodiment, the bottom plate 212 and the side wall 214 of the back plate 210, the folding wall 214a of the side wall 214, the first plate body 222 and the second plate body 224 of the heat dissipating component 220, The arrangement of the folded wall 222a of one plate 222 and the lock attachment 220a is the same as that shown in FIG. 4, and details are not described herein. The light source device 200 is different from the light source device 100 in that the second plate body 124 of the heat dissipating component 120 has a folded wall 124a, and the second plate body 224 of the heat dissipating component 220 does not have a folded wall, so the light source device 200 can have a small overall width. . Whether or not the folding wall is formed in the second plate body can be determined according to the design requirements, and the present invention does not limit the same.

圖7為本發明另一實施例之光源裝置的局部剖視圖。請參考圖7,在本實施例的光源裝置300中,背板310的底板312與側牆314、散熱元件320的第一板體322與第二板體324、第一板體322的折壁322a以及鎖附件320a的配置方式,與圖3所示的配置方式相同,於此不加以贅述。光源裝置300與光源裝置100的不同處在於,第二板體324具有一延伸部324a,延伸部324a延伸至底板312的底面且位於容納空間310a外,以增加散熱元件320的散熱面積,提升散熱效率。Figure 7 is a partial cross-sectional view showing a light source device according to another embodiment of the present invention. Referring to FIG. 7, in the light source device 300 of the embodiment, the bottom plate 312 of the back plate 310 and the side wall 314, the first plate 322 and the second plate 324 of the heat dissipating component 320, and the folded wall 322a of the first plate 322 The arrangement of the lock attachment 320a is the same as that of the configuration shown in FIG. 3, and details are not described herein. The difference between the light source device 300 and the light source device 100 is that the second plate 324 has an extending portion 324a extending to the bottom surface of the bottom plate 312 and outside the receiving space 310a to increase the heat dissipation area of the heat dissipating component 320 and improve heat dissipation. effectiveness.

圖8為圖7之光源裝置的立體圖。請參考圖8,第二板體324的延伸部324a可具有多個破孔324b,以進一步增加延伸部324a的散熱面積。在其它實施例中,可在延伸部324a上形成咬花或其它適當結構來取代破孔324b,以增加延伸部324a的散熱面積,本發明不對此加以限制。此外,除了藉由鎖附件320a將散熱元件320的兩端鎖附至背板310上之外,更可藉由鎖附件320c將延伸部324a鎖附於背板310上,以使整體結構更加穩固。Fig. 8 is a perspective view of the light source device of Fig. 7. Referring to FIG. 8, the extension portion 324a of the second plate body 324 may have a plurality of holes 324b to further increase the heat dissipation area of the extension portion 324a. In other embodiments, a bite or other suitable structure may be formed on the extension 324a to replace the aperture 324b to increase the heat dissipation area of the extension 324a, which is not limited in the present invention. In addition, in addition to locking the two ends of the heat dissipating component 320 to the backplane 310 by the lock attachment 320a, the extension 324a can be locked to the backboard 310 by the lock attachment 320c to make the overall structure more stable. .

綜上所述,在本發明的上述實施例中至少具有以下其中一個優點,背板與散熱元件形成用以容納光源的容納空間,散熱元件並非被包覆於容納空間內,而是至少部分位於容納空間外。藉此,配置於散熱元件上的光源所產生的熱可有效地透過散熱元件被導至外界,以提升光源裝置的散熱效率。此外,由於光源是透過散熱元件進行散熱而非透過背板進行散熱,因此背板不需選用高導熱材質,而可節省製造成本。另外,藉由散熱元件上的多個折壁對背板的側牆進行限位,可限制背板與散熱元件的相對移動,使背板與散熱元件藉由較少的鎖附件即可完成組裝,以簡化製程。In summary, in the above embodiments of the present invention, at least one of the following advantages is obtained, the back plate and the heat dissipating component form an accommodating space for accommodating the light source, and the heat dissipating component is not covered in the accommodating space, but at least partially located Space outside the accommodation. Thereby, the heat generated by the light source disposed on the heat dissipating component can be effectively conducted to the outside through the heat dissipating component to improve the heat dissipating efficiency of the light source device. In addition, since the light source dissipates heat through the heat dissipating component rather than through the backplane, the backplane does not need to be made of a high thermal conductivity material, thereby saving manufacturing costs. In addition, by limiting the sidewalls of the backplane by a plurality of folding walls on the heat dissipating component, the relative movement of the backplane and the heat dissipating component can be restricted, so that the backplane and the heat dissipating component can be assembled by using fewer lock accessories. To simplify the process.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。另外,本發明的任一實施例或申請專利範圍不須達成本發明所揭露之全部目的或優點或特點。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本發明之權利範圍。此外,本說明書或申請專利範圍中提及的“第一”、“第二”等用語僅用以命名元件(element)的名稱或區別不同實施例或範圍,而並非用來限制元件數量上的上限或下限。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention. In addition, the terms "first", "second" and the like mentioned in the specification or the scope of the claims are only used to name the elements or distinguish different embodiments or ranges, and are not intended to limit the number of elements. Upper or lower limit.

100、200、300...光源裝置100, 200, 300. . . Light source device

110、210、310...背板110, 210, 310. . . Backplane

110a、310a...容納空間110a, 310a. . . Accommodating space

112、212、312...底板112, 212, 312. . . Bottom plate

114、214、314...側牆114, 214, 314. . . Side wall

114a、122a、124a、214a、222a、314a、322a...折壁114a, 122a, 124a, 214a, 222a, 314a, 322a. . . Folding wall

114b、120b...鎖孔114b, 120b. . . keyhole

120、220、320...散熱元件120, 220, 320. . . Heat sink

120a、220a、320a、320c...鎖附件120a, 220a, 320a, 320c. . . Lock attachment

122、222、322...第一板體122, 222, 322. . . First plate

122a、124a、214a、222a、322a...折壁122a, 124a, 214a, 222a, 322a. . . Folding wall

124、224、324...第二板體124, 224, 324. . . Second plate

130...光源130. . . light source

324a...延伸部324a. . . Extension

324b...破孔324b. . . Broken hole

D1、D2、D3...方向D1, D2, D3. . . direction

G...間隙G. . . gap

圖1為本發明一實施例之光源裝置的立體圖。1 is a perspective view of a light source device according to an embodiment of the present invention.

圖2為圖1之背板及散熱元件的分解圖。2 is an exploded view of the backing plate and the heat dissipating component of FIG. 1.

圖3為圖1之光源裝置的局部剖視圖。Figure 3 is a partial cross-sectional view of the light source device of Figure 1.

圖4為圖1之光源裝置的局部側視圖。Figure 4 is a partial side elevational view of the light source device of Figure 1.

圖5A及圖5B為圖1之光源裝置的組裝流程圖。5A and 5B are assembly flowcharts of the light source device of Fig. 1.

圖6為本發明另一實施例之光源裝置的局部側視圖。Figure 6 is a partial side elevational view of a light source device in accordance with another embodiment of the present invention.

圖7為本發明另一實施例之光源裝置的局部剖視圖。Figure 7 is a partial cross-sectional view showing a light source device according to another embodiment of the present invention.

圖8為圖7之光源裝置的立體圖。Fig. 8 is a perspective view of the light source device of Fig. 7.

100...光源裝置100. . . Light source device

110...背板110. . . Backplane

110a...容納空間110a. . . Accommodating space

112...底板112. . . Bottom plate

114...側牆114. . . Side wall

114a...折壁114a. . . Folding wall

114b...鎖孔114b. . . keyhole

120...散熱元件120. . . Heat sink

120a...鎖附件120a. . . Lock attachment

122...第一板體122. . . First plate

122a、124a...折壁122a, 124a. . . Folding wall

124...第二板體124. . . Second plate

130...光源130. . . light source

D1、D2...方向D1, D2. . . direction

Claims (8)

一種光源裝置,包括:一背板,包括一底板以及兩側牆,其中該兩側牆分別垂直地連接於該底板相對的兩側邊,各該側牆的末端具有一折壁;一散熱元件,固定於該背板上,其中該背板與該散熱元件形成一容納空間,至少部分該散熱元件位於該容納空間外,該散熱元件的兩端分別設置於該兩側牆上,該散熱元件的兩端分別鎖附於該兩折壁上;以及一光源,配置於該散熱元件上且位於該容納空間內。 A light source device comprising: a back plate comprising a bottom plate and two side walls, wherein the two side walls are vertically connected to opposite side edges of the bottom plate, each end wall has a folded wall at the end; a heat dissipating component, Fixed on the backplane, wherein the backplane and the heat dissipating component form a receiving space, at least a portion of the heat dissipating component is located outside the receiving space, and two ends of the heat dissipating component are respectively disposed on the two side walls, the heat dissipating component The two ends are respectively locked on the two folding walls; and a light source is disposed on the heat dissipating component and located in the receiving space. 如申請專利範圍第1項所述之光源裝置,其中該散熱元件的材質包括鋁。 The light source device of claim 1, wherein the heat dissipating component is made of aluminum. 如申請專利範圍第1項所述之光源裝置,其中該背板的材質包括鍍鋅鋼板。 The light source device of claim 1, wherein the material of the back plate comprises a galvanized steel plate. 如申請專利範圍第1項所述之光源裝置,其中該散熱元件包括:一第一板體,該第一板體的兩端分別設置於該兩側牆上,其中該第一板體垂直於該底板且與該底板之間具有一間隙;以及一第二板體,垂直地連接於該第一板體且遮蓋該間隙。 The light source device of claim 1, wherein the heat dissipating component comprises: a first plate body, wherein two ends of the first plate body are respectively disposed on the two side walls, wherein the first plate body is perpendicular to the first plate body The bottom plate has a gap with the bottom plate; and a second plate body is vertically connected to the first plate body and covers the gap. 如申請專利範圍第4項所述之光源裝置,其中該第一板體具有一折壁,各該側牆被限位於該第一板體的該折壁與該第二板體之間,以阻止該背板與該散熱元件沿垂直 該底板的方向相對移動。 The light source device of claim 4, wherein the first plate has a folded wall, and each of the side walls is limited between the folded wall of the first plate and the second plate to block the The back plate is perpendicular to the heat dissipating component The direction of the bottom plate is relatively moved. 如申請專利範圍第4項所述之光源裝置,其中該第二板體具有兩折壁,該第二板體的該兩折壁分別延伸至該兩側牆的外側,以阻止該背板與該散熱元件沿垂直該兩側牆的方向相對移動。 The light source device of claim 4, wherein the second plate has two folded walls, and the two folded walls of the second plate extend to the outer sides of the two side walls respectively to block the back plate and the heat dissipation. The components move relative to each other in the direction perpendicular to the two side walls. 如申請專利範圍第4項所述之光源裝置,其中該第二板體具有一延伸部,該延伸部延伸至該底板的底面且位於該容納空間外。 The light source device of claim 4, wherein the second plate body has an extension portion extending to a bottom surface of the bottom plate and outside the accommodation space. 如申請專利範圍第7項所述之光源裝置,其中該第二板體的該延伸部具有多個破孔。 The light source device of claim 7, wherein the extension of the second plate has a plurality of holes.
TW100139130A 2011-10-27 2011-10-27 Light source device TWI454793B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101251683A (en) * 2008-04-07 2008-08-27 友达光电股份有限公司 Backlight module with integration type base plate
TW200839373A (en) * 2007-03-29 2008-10-01 Coretronic Corp Side-lighting backlight module
JP2010177190A (en) * 2009-01-29 2010-08-12 Samsung Electronics Co Ltd Backlight assembly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200839373A (en) * 2007-03-29 2008-10-01 Coretronic Corp Side-lighting backlight module
CN101251683A (en) * 2008-04-07 2008-08-27 友达光电股份有限公司 Backlight module with integration type base plate
JP2010177190A (en) * 2009-01-29 2010-08-12 Samsung Electronics Co Ltd Backlight assembly

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