TWI453995B - Electrical connector and electrical connecting method of the same - Google Patents
Electrical connector and electrical connecting method of the same Download PDFInfo
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Description
本發明涉及一種電連接器及其電連接方法,尤其是一種可插拔電連接器及令該電連接器與對接電路板對接的電連接方法。 The invention relates to an electrical connector and an electrical connection method thereof, in particular to a pluggable electrical connector and an electrical connection method for docking the electrical connector with a docking circuit board.
與本發明相關之習知技術可參閱於2000年11月7日公告之美國第6142802號發明專利。該專利揭示了電連接器,其具有本體及固持於本體上的複數第一端子及第二端子。與該連接器對接的對接連接器具有子電路板。該子電路板上設有複數第一導電片及複數第二導電片。當該電連接器與對接連接器發生對接時,第一端子與子電路板的第一導電片電性連接以傳輸差分信號、電源信號及接地。第二端子與子電路板的第二導電片電性連接以傳輸電源信號及接地。 The prior art relating to the present invention can be found in U.S. Patent No. 6,142,802, issued on Nov. 7, 2000. The patent discloses an electrical connector having a body and a plurality of first and second terminals retained on the body. The docking connector that interfaces with the connector has a sub-board. The sub-circuit board is provided with a plurality of first conductive sheets and a plurality of second conductive sheets. When the electrical connector is docked with the mating connector, the first terminal is electrically connected to the first conductive strip of the sub-board to transmit the differential signal, the power signal, and the ground. The second terminal is electrically connected to the second conductive strip of the sub-board to transmit the power signal and the ground.
然,如此設置的電連接器中的端子數量較少,如此只能傳輸少量的信號。 However, the number of terminals in the electrical connector thus arranged is small, so that only a small amount of signals can be transmitted.
所以,有必要對習知的電連接器進行改良以克服上述缺陷。 Therefore, it is necessary to modify the conventional electrical connector to overcome the above drawbacks.
鑒於上述內容,本發明之目的在於提供一種可傳輸多個信號的電連接器及電連接方法。 In view of the above, it is an object of the present invention to provide an electrical connector and an electrical connection method that can transmit a plurality of signals.
為達成前述目的,本發明提供一種電連接器,其包括第一組端子及一對第二組端子,所述第一組端子包括其間形成第一插槽的第一上端子及第一下接觸端子,所述第一上端子設有位於第一插槽上方且傳輸接地信號的第一上接觸部,所述第一下接觸端子設有位於第一插槽下方且傳輸接地信號的第一下接觸部,各第二組端子包括其間形成第二插槽的第二上端子及第二下接觸端子,一對第二上端子設有位於第二插槽上方的一對第二上接觸部,所述一對第二下接觸端子設有位於第二插槽下方且傳輸差分信號對的一對第二下接觸部,其中,所述各第二組端子進一步包括第二下導電端子,各第二下導電端子設有位於第二插槽下方並與第二下接觸部沿著對接方向對齊以傳輸低頻信號的第二下導電部。 To achieve the foregoing objective, the present invention provides an electrical connector including a first set of terminals and a pair of second sets of terminals, the first set of terminals including a first upper terminal and a first lower contact therebetween forming a first slot a first upper terminal is provided with a first upper contact portion located above the first slot and transmitting a ground signal, and the first lower contact terminal is provided with a first under the first slot and transmitting a ground signal The contact portion, each of the second group of terminals includes a second upper terminal and a second lower contact terminal formed therebetween, and the pair of second upper terminals are provided with a pair of second upper contact portions located above the second slot. The pair of second lower contact terminals are provided with a pair of second lower contact portions under the second slot and transmitting differential signal pairs, wherein each of the second group of terminals further includes a second lower conductive terminal, each of the second The second lower conductive terminal is provided with a second lower conductive portion located below the second slot and aligned with the second lower contact portion in the mating direction to transmit a low frequency signal.
本發明提供一種電連接器方法,其包括以下步驟:(1)提供一電連接器,所述電連接器包括第一組端子及一對第二組端子,所述第一組端子包括第一上端子及第一下接觸端子,所述各第二組端子包括第二上端子、第二下接觸端子及第二下導電端子;(2)提供具有上、下表面的對接電路板,所述對接電路板的上表面設有第一排導電片,其包括上接地片及一對上差分信號片,所述對接電路板的下表面設有第二排導電片,其包括下接地片及一對差分信號片,對接電路板的下表面進一步設有與一對差分信號片沿著對接方向對齊的兩個下低頻信號片;(3)令對接電路板與所述電連接器對接,使得一對第二下導電端子與兩個下低頻信號片接觸以傳輸低頻信號;(4)使得第一上端子與上接地片接觸以傳輸接地信號,一對第二上端子與一對上差分信號片接觸以傳輸差分信號;(5)使得第一下接觸端子與下接地片接觸以傳輸接地信號,一對第二下接觸端子與一對差分信號片接觸以傳輸差分信號。 The present invention provides an electrical connector method comprising the steps of: (1) providing an electrical connector, the electrical connector comprising a first set of terminals and a pair of second set of terminals, the first set of terminals comprising a first An upper terminal and a first lower contact terminal, the second group of terminals including a second upper terminal, a second lower contact terminal and a second lower conductive terminal; (2) providing a docking circuit board having upper and lower surfaces, The upper surface of the docking circuit board is provided with a first row of conductive sheets, which includes an upper grounding strip and a pair of upper differential signal sheets, and the lower surface of the docking circuit board is provided with a second row of conductive sheets, including a lower grounding strip and a For the differential signal chip, the lower surface of the docking circuit board is further provided with two lower low frequency signal chips aligned with the pair of differential signal chips in the mating direction; (3) the docking circuit board is docked with the electrical connector, such that The second lower conductive terminal is in contact with the two lower low frequency signal sheets to transmit the low frequency signal; (4) the first upper terminal is in contact with the upper ground plane to transmit the ground signal, and the pair of second upper terminals and the pair of upper differential signal sheets Contact to transmit differential signals (5) such that the first contact terminal contacting with the ground plate to transmit a ground signal, the pair of the second contact terminal pair of differential signals with the contact piece to a differential signal transmission.
與習知技術相比,本發明具有如下有益效果:本發明在不增大對接電路板尺寸的情況下可以配置多對差分信號片及控制信號片,且令每對信號片之間設有接地片。如此可以傳輸多對差分信號及控制信號且令每對差分信號之間傳輸接地信號。 Compared with the prior art, the present invention has the following beneficial effects: the present invention can configure multiple pairs of differential signal slices and control signal slices without increasing the size of the docking circuit board, and grounding each pair of signal slices sheet. In this way, multiple pairs of differential signals and control signals can be transmitted and a ground signal can be transmitted between each pair of differential signals.
100‧‧‧電連接器 100‧‧‧Electrical connector
1‧‧‧絕緣本體 1‧‧‧Insulating body
11‧‧‧橫樑 11‧‧‧ beams
12‧‧‧開口 12‧‧‧ openings
2‧‧‧端子模組 2‧‧‧Terminal module
21‧‧‧第一端子模組 21‧‧‧First Terminal Module
210‧‧‧第一絕緣片 210‧‧‧First insulation sheet
211‧‧‧第一上端子 211‧‧‧first upper terminal
2111‧‧‧第一上接觸部 2111‧‧‧First Upper Contact
2112‧‧‧第一上安裝部 2112‧‧‧First installation department
2113‧‧‧第一上連接部 2113‧‧‧First upper connection
212‧‧‧第一下接觸端子 212‧‧‧First contact terminal
2121‧‧‧第一下接觸部 2121‧‧‧First contact
2122‧‧‧第一下安裝部 2122‧‧‧First installation department
2123‧‧‧第一下連接部 2123‧‧‧First lower connection
214‧‧‧第一插槽 214‧‧‧first slot
22‧‧‧第二端子模組 22‧‧‧Second terminal module
220‧‧‧第二絕緣片 220‧‧‧Second insulation sheet
221‧‧‧第二上端子 221‧‧‧Second upper terminal
2211‧‧‧第二上接觸部 2211‧‧‧Second Upper Contact
2212‧‧‧第二上安裝部 2212‧‧‧Second upper installation department
2213‧‧‧第二上連接部 2213‧‧‧Second upper connection
222‧‧‧第二下接觸端子 222‧‧‧Second lower contact terminal
2221‧‧‧第二下接觸部 2221‧‧‧Second lower contact
2222‧‧‧第二下安裝部 2222‧‧‧Second installation department
2223‧‧‧第二下連接部 2223‧‧‧Second lower connection
223‧‧‧第二下導電端子 223‧‧‧Second lower conductive terminal
2231‧‧‧第二下導電部 2231‧‧‧Second lower conductive part
2232‧‧‧第二下安裝腳 2232‧‧‧Second installation foot
2233‧‧‧第二下連接部 2233‧‧‧Second lower connection
224‧‧‧第二插槽 224‧‧‧second slot
3‧‧‧遮蔽蓋體 3‧‧‧shading cover
31‧‧‧對接面 31‧‧‧ docking
32‧‧‧收容腔 32‧‧‧ containment chamber
33‧‧‧插入口 33‧‧‧Inlet
800‧‧‧對接電路板 800‧‧‧ docking board
80‧‧‧對接端 80‧‧‧ docking end
81‧‧‧第一表面 81‧‧‧ first surface
811‧‧‧接地片 811‧‧‧ Grounding piece
812‧‧‧差分信號片 812‧‧‧Differential signal piece
813‧‧‧線纜焊接片 813‧‧‧Cable soldering piece
82‧‧‧第二表面 82‧‧‧ second surface
821‧‧‧接地片 821‧‧‧ Grounding piece
822‧‧‧差分信號片 822‧‧‧Differential signal piece
823‧‧‧控制信號片 823‧‧‧Control signal piece
824‧‧‧線纜焊接片 824‧‧‧Cable soldering piece
21’‧‧‧第一端子模組 21'‧‧‧First Terminal Module
211’‧‧‧第一上端子 211'‧‧‧first upper terminal
2111’‧‧‧第一上接觸部 2111’‧‧‧First Upper Contact
212’‧‧‧第一下接觸端子 212'‧‧‧First contact terminal
2121’‧‧‧第一下接觸部 2121'‧‧‧First contact
213’‧‧‧第一下導電端子 213'‧‧‧First lower conductive terminal
2131’‧‧‧第一下導電部 2131'‧‧‧First lower conductive part
800’‧‧‧對接電路板 800’‧‧‧ docking board
82’‧‧‧第二表面 82’‧‧‧ second surface
821’‧‧‧接地片 821’‧‧‧ Grounding piece
822’‧‧‧差分信號片 822’‧‧‧Differential signal piece
823’‧‧‧控制信號片 823’‧‧‧Control signal
825’‧‧‧電源片 825’‧‧‧Power film
826’‧‧‧接地片 826’‧‧‧ Grounding piece
827’‧‧‧第三排導電片 827’‧‧‧ Third row of conductive sheets
828’‧‧‧第二排導電片 828’‧‧‧Second row of conductive sheets
21’’‧‧‧第一上端子模組 21’’‧‧‧First Upper Terminal Module
211’’‧‧‧第一上端子 211’’‧‧‧First upper terminal
2112’’‧‧‧第一上安裝部 2112’’‧‧‧First Installation Department
212’’‧‧‧第一下接觸端子 212’’‧‧‧First contact terminal
2122’’‧‧‧第一下安裝部 2122’’‧‧‧First installation department
213’’‧‧‧第一下導電端子 213’’‧‧‧First lower conductive terminal
2132’’‧‧‧第一下安裝腳 2132’’‧‧‧First installation foot
第一圖係本發明第一實施方式的電連接器與母電路板的分解圖。 The first figure is an exploded view of the electrical connector and the mother board of the first embodiment of the present invention.
第二圖係第一圖所示之電連接器與母電路板的另一分解圖。 The second figure is another exploded view of the electrical connector and the mother board shown in the first figure.
第三圖係第一圖所示的電連接器的絕緣本體與端子模組的組合圖。 The third figure is a combination diagram of the insulative housing and the terminal module of the electrical connector shown in the first figure.
第四圖係當對接電路板插入絕緣本體時沿第三圖中IV-IV線的剖視圖,其中第一端子模組省略第一絕緣片。 The fourth figure is a cross-sectional view taken along line IV-IV in the third figure when the docking board is inserted into the insulative housing, wherein the first terminal module omits the first insulating sheet.
第五圖係當對接電路板插入絕緣本體時沿第三圖中V-V線的剖視圖,其中第二端子模組省略第二絕緣片。 The fifth figure is a cross-sectional view taken along the line V-V in the third figure when the docking board is inserted into the insulative housing, wherein the second terminal module omits the second insulating sheet.
第六圖係對接電路板的第一表面的視圖。 The sixth figure is a view of the first surface of the docking circuit board.
第七圖係對接電路板的第二表面的視圖。 The seventh figure is a view of the second surface of the docking circuit board.
第八圖係第二實施方式的對接電路板的第二表面的視圖。 The eighth figure is a view of the second surface of the docking circuit board of the second embodiment.
第九圖係第二實施方式的對接電路板插入省略第一絕緣片的第一端子模組內的剖面圖。 The ninth drawing is a cross-sectional view of the mating circuit board of the second embodiment inserted into the first terminal module in which the first insulating sheet is omitted.
第十圖係第三實施方式的第一端子模組的視圖。 The tenth diagram is a view of the first terminal module of the third embodiment.
第十一圖係第三實施方式的對接電路板插入省略第一絕緣片的第一端子模組內的剖面圖。 The eleventh drawing is a cross-sectional view of the mating circuit board of the third embodiment inserted into the first terminal module in which the first insulating sheet is omitted.
如第一圖至第五圖所示,符合本發明的電連接器100安裝於母電路板900上且可與對接連接器(未圖示)對接。對接連接器具有對接電路板800。對接電路板800可於電連接器100內插拔。 As shown in the first to fifth figures, the electrical connector 100 in accordance with the present invention is mounted on the mother board 900 and can interface with a mating connector (not shown). The docking connector has a docking circuit board 800. The docking circuit board 800 can be inserted and removed in the electrical connector 100.
電連接器100包括絕緣本體1、固持於絕緣本體1內的複數端子模組2及覆蓋於絕緣本體1上的遮蔽蓋體3。 The electrical connector 100 includes an insulative housing 1 , a plurality of terminal modules 2 held in the insulative housing 1 , and a shielding cover 3 covering the insulative housing 1 .
參閱第一圖至第三圖,絕緣本體1上設有橫樑11及位於橫樑11之上的開口12。 Referring to the first to third figures, the insulative housing 1 is provided with a beam 11 and an opening 12 above the beam 11.
參閱第一圖,本發明第一實施方式中的複數端子模組2包括複數第一端子模組21與第二端子模組22。結合第四圖,各第一端子模組21包括第一絕緣片210、第一上端子211及第一下接觸端子212。可以通過注塑成型的方式固持第一上端子211及第一下接觸端子212從而令塑膠材料形成第一絕緣片210。亦可以先設置第一絕緣片210,再將第一上端子211及第一下接觸端子212埋設於第一絕緣片210內。 Referring to the first figure, the plurality of terminal modules 2 in the first embodiment of the present invention include a plurality of first terminal modules 21 and second terminal modules 22. In conjunction with the fourth figure, each of the first terminal modules 21 includes a first insulating sheet 210, a first upper terminal 211, and a first lower contact terminal 212. The first upper terminal 211 and the first lower contact terminal 212 may be held by injection molding to form the first insulating sheet 210 of the plastic material. The first insulating sheet 210 may be first disposed, and the first upper terminal 211 and the first lower contact terminal 212 may be buried in the first insulating sheet 210.
第一上端子211包括第一上接觸部2111、第一上安裝部2112及第一上連接部2113。第一上連接部2113位於第一上接觸部2111及第一上安裝部2112之間。第一下接觸端子212包括第一下接觸部2121、第一下安裝部2122及第一下連接部2123。第一下連接部2123位於第一下接觸部2121及第一下安裝部2122之間。第一上接觸部2111與第一下接觸部2121之間形成第一插槽214。第一上接觸部2111大致呈水平狀位於第一插槽214上方。第一下接觸部2121彎折成大致呈水平狀位於第一插槽214下方。 The first upper terminal 211 includes a first upper contact portion 2111, a first upper mounting portion 2112, and a first upper connecting portion 2113. The first upper connecting portion 2113 is located between the first upper contact portion 2111 and the first upper mounting portion 2112. The first lower contact terminal 212 includes a first lower contact portion 2121, a first lower mounting portion 2122, and a first lower connecting portion 2123. The first lower connecting portion 2123 is located between the first lower contact portion 2121 and the first lower mounting portion 2122. A first slot 214 is formed between the first upper contact portion 2111 and the first lower contact portion 2121. The first upper contact portion 2111 is located substantially horizontally above the first slot 214. The first lower contact portion 2121 is bent to be substantially horizontally below the first slot 214.
第一上安裝部2112呈水平延伸,故可通過表面安裝技術焊接於母電路板900上。第一下安裝部2122設置成穿孔狀且向下延伸,故可通過壓接方式與母電路板900電性連接。 The first upper mounting portion 2112 extends horizontally and can be soldered to the mother board 900 by surface mounting techniques. The first lower mounting portion 2122 is provided in a perforated shape and extends downward, so that it can be electrically connected to the mother circuit board 900 by crimping.
各第二端子模組22包括第二絕緣片220、第二上端子221、第二下接觸端子222及第二下導電端子223。可以通過注塑成型的方式固持第二上端子221、第二下接觸端子222及第二下導電端子223從而令塑膠材料形成第二絕緣片220。亦可以先設置第二絕緣片220,再將第二上端子221、第二下接觸端子222及第二下導電端子223埋設於第二絕緣片220內。 Each of the second terminal modules 22 includes a second insulating sheet 220 , a second upper terminal 221 , a second lower contact terminal 222 , and a second lower conductive terminal 223 . The second upper terminal 221, the second lower contact terminal 222, and the second lower conductive terminal 223 may be held by injection molding to form the second insulating sheet 220 of the plastic material. The second insulating sheet 220 may be provided first, and the second upper terminal 221, the second lower contact terminal 222, and the second lower conductive terminal 223 may be embedded in the second insulating sheet 220.
第二上端子221包括第二上接觸部2211、第二上安裝部2212及第二上連接部2213。第二上連接部2213位於第二上接觸部2211及第二上安裝部2212之間。第二下接觸端子222包括第二下接觸部2221、第二下安裝部2222及第二下連接部2223。第二下連接部2223位於第二下接觸部2221及第二下安裝部2222之間。第二下導電端子223包括第二下導電部2231、第二下安裝腳2232及第二下連接部2233。第二下連接部2233位於第二下導電部2231及第二下安裝腳2232之間。第二上接觸部2211與第二下導電部2231之間形成第二插槽224。第二上接觸部2211大致呈水平狀位於第二插槽224上方。第二下接觸部2221及第二下導電部2231彎折成大致呈水平狀位於第二插槽224下方。第二下導電部2231與第二下接觸部2221沿著對接方向對齊。第二下接觸部2221比第二上接觸部2211更靠近所述開口12,第二下導電部2231比第二上接觸部2211更遠離所述開口12。 The second upper terminal 221 includes a second upper contact portion 2211, a second upper mounting portion 2212, and a second upper connecting portion 2213. The second upper connecting portion 2213 is located between the second upper contact portion 2211 and the second upper mounting portion 2212. The second lower contact terminal 222 includes a second lower contact portion 2221, a second lower mounting portion 2222, and a second lower connecting portion 2223. The second lower connecting portion 2223 is located between the second lower contact portion 2221 and the second lower mounting portion 2222. The second lower conductive terminal 223 includes a second lower conductive portion 2231, a second lower mounting leg 2232, and a second lower connecting portion 2233. The second lower connecting portion 2233 is located between the second lower conductive portion 2231 and the second lower mounting leg 2232. A second slot 224 is formed between the second upper contact portion 2211 and the second lower conductive portion 2231. The second upper contact portion 2211 is located substantially horizontally above the second slot 224. The second lower contact portion 2221 and the second lower conductive portion 2231 are bent to be substantially horizontally below the second slot 224. The second lower conductive portion 2231 and the second lower contact portion 2221 are aligned in the mating direction. The second lower contact portion 2221 is closer to the opening 12 than the second upper contact portion 2211, and the second lower conductive portion 2231 is further away from the opening 12 than the second upper contact portion 2211.
第二上安裝部2212呈水平延伸,故可通過表面安裝技術焊接於母 電路板900上。第二下安裝部2222及第二下安裝腳2232設置成穿孔狀且向下延伸,故可通過壓接方式與母電路板900電性連接。 The second upper mounting portion 2212 extends horizontally, so that it can be soldered to the female by surface mounting technology. On the circuit board 900. The second lower mounting portion 2222 and the second lower mounting leg 2232 are disposed in a perforated shape and extend downward, so that the female circuit board 900 can be electrically connected by crimping.
參閱第一圖及第二圖,遮蔽蓋體3設有對接面31、收容腔32及位於遮蔽蓋體3下方的插入口33。 Referring to the first and second figures, the shielding cover 3 is provided with an abutting surface 31, a receiving cavity 32 and an insertion opening 33 located below the shielding cover 3.
參閱第一圖至第五圖,組裝電連接器100時,按照先第一端子模組21、然後是一對第二端子模組22的順序將該等端子模組2固持於絕緣本體1內。令第一插槽214、第二插槽224分別沿著對接方向與絕緣本體1的開口12對齊。將絕緣本體1及端子模組2通過遮蔽蓋體3的插入口33裝入收容腔32內。 Referring to FIG. 1 to FIG. 5 , when the electrical connector 100 is assembled, the terminal modules 2 are held in the insulative housing 1 in the order of the first terminal module 21 and then the pair of second terminal modules 22 . . The first slot 214 and the second slot 224 are respectively aligned with the opening 12 of the insulative housing 1 along the mating direction. The insulative housing 1 and the terminal module 2 are inserted into the receiving cavity 32 through the insertion opening 33 of the shielding cover 3.
如第六圖及第七圖所示,對接電路板800具有對接端80、第一表面81及第二表面82。對接電路板800的第一表面81設有靠近對接端80排列成一排的五個接地片811及四對差分信號片812、及遠離對接端80排列成一排的複數線纜焊接片813。每一對差分信號片812皆位於相鄰兩個接地片811之間。所述複數接地片811及複數對差分信號片812排列成一排。接地片811沿對接方向的長度長於差分信號片812的相應長度。接地片811較之差分信號片812更靠近對接端80。 As shown in the sixth and seventh figures, the docking circuit board 800 has a docking end 80, a first surface 81, and a second surface 82. The first surface 81 of the docking circuit board 800 is provided with five grounding strips 811 and four pairs of differential signal sheets 812 arranged in a row near the mating end 80, and a plurality of cable soldering strips 813 arranged in a row away from the mating end 80. Each pair of differential signal slices 812 is located between two adjacent ground pads 811. The plurality of grounding strips 811 and the plurality of pairs of differential signal strips 812 are arranged in a row. The length of the grounding lug 811 in the mating direction is longer than the corresponding length of the differential signal sheet 812. The grounding strip 811 is closer to the mating end 80 than the differential signal patch 812.
對接電路板800的第二表面82設有靠近對接端80的五個接地片821、四對控制信號片823、四對差分信號片822及遠離對接端80排列成一排的複數線纜焊接片824。一對控制信號片823與一對差分信號片822沿著對接方向對齊且位於相鄰兩個接地片821之間。控制信號片823比差分信號片822更靠近對接端80。接地片821沿對接方向的長度長於控制信號片823或差分信號片822的相應長度。接地片821的前端較之控制信號片823的前端更靠近對接端80。控制 信號片823亦可根據需要設置成其他低頻信號片。 The second surface 82 of the docking circuit board 800 is provided with five grounding strips 821, four pairs of control signal sheets 823, four pairs of differential signal sheets 822, and a plurality of cable soldering strips 824 arranged in a row away from the butting end 80. . A pair of control signal sheets 823 and a pair of differential signal sheets 822 are aligned in the mating direction and are located between adjacent two ground strips 821. The control signal slice 823 is closer to the butt end 80 than the differential signal slice 822. The length of the grounding lug 821 in the mating direction is longer than the corresponding length of the control signal sheet 823 or the differential signal sheet 822. The front end of the grounding lug 821 is closer to the mating end 80 than the front end of the control signal sheet 823. control The signal slice 823 can also be set as other low frequency signal slices as needed.
第一表面81的接地片811與第二表面82的接地片821沿著上下方向部分重疊。第一表面81的差分信號片812與第二表面82的差分信號片822沿著上下方向部分重疊。 The grounding piece 811 of the first surface 81 and the grounding piece 821 of the second surface 82 partially overlap in the up and down direction. The differential signal piece 812 of the first surface 81 and the differential signal piece 822 of the second surface 82 partially overlap in the up and down direction.
當電連接器100與對接連接器(未圖示)對接時,將對接電路板800通過對接面31插入收容腔32內,進而通過絕緣本體1的開口12插入第一、第二插槽214、224中。 When the electrical connector 100 is mated with the mating connector (not shown), the docking circuit board 800 is inserted into the receiving cavity 32 through the mating surface 31, and then inserted into the first and second slots 214 through the opening 12 of the insulative housing 1. 224.
結合第四圖至第七圖,此時,第一端子模組21的第一上端子211的第一上接觸部2111與對接電路板800的第一表面81上的接地片811接觸以傳輸接地信號;第一下接觸端子212的第一下接觸部2121與對接電路板800的第二表面82上的接地片821接觸以傳遞接地信號。同時,相鄰兩個第二端子模組22中的兩個第二上端子221的第二上接觸部2211與對接電路板800的第一表面81上的差分信號片812接觸以傳輸差分信號;兩個第二下接觸端子222的第二下接觸部2221與第二表面82的差分信號片822接觸以傳輸差分信號。兩個第二下導電端子223的第二下導電部2231與兩個控制信號片823接觸以傳輸控制信號。 In conjunction with the fourth to seventh embodiments, the first upper contact portion 2111 of the first upper terminal 211 of the first terminal module 21 is in contact with the grounding strip 811 on the first surface 81 of the docking circuit board 800 to transmit ground. The signal; the first lower contact portion 21121 of the first lower contact terminal 212 contacts the ground strip 821 on the second surface 82 of the docking circuit board 800 to transmit a ground signal. At the same time, the second upper contact portion 2211 of the two second upper terminals 221 of the adjacent two second terminal modules 22 is in contact with the differential signal piece 812 on the first surface 81 of the docking circuit board 800 to transmit a differential signal; The second lower contact portion 2221 of the two second lower contact terminals 222 is in contact with the differential signal sheet 822 of the second surface 82 to transmit a differential signal. The second lower conductive portion 2231 of the two second lower conductive terminals 223 is in contact with the two control signal sheets 823 to transmit a control signal.
第一實施方式的電連接方法包括以下步驟:(1)提供一電連接器100,所述電連接器100包括複數第一端子模組21及複數對第二端子模組22,所述各第一端子模組21包括第一上端子211及第一下接觸端子212,所述各第二端子模組22包括第二上端子221、第二下接觸端子222及第二下導電端子223;(2)提供具有第一表面81、第二表面82的對接電路板800,所述對接電路板800的第一表面81設有第一排導電片,其包括複數接地片811及複數對差分信號 片812,所述對接電路板的第二表面82設有第二排導電片,其包括複數接地片821及複數對差分信號片822,對接電路板800的第二表面82進一步設有複數對控制信號片823;(3)令對接電路板800與所述電連接器100對接,使得第二下導電端子223與控制信號片823接觸以傳輸低頻控制信號;(4)使得第一上端子211與接地片811接觸以傳輸接地信號,第二上端子221與差分信號片812接觸以傳輸差分信號;(5)使得第一下接觸端子212與接地片821接觸以傳輸接地信號,一對第二下接觸端子222與一對差分信號片822接觸以傳輸差分信號。 The electrical connection method of the first embodiment includes the following steps: (1) providing an electrical connector 100, the electrical connector 100 including a plurality of first terminal modules 21 and a plurality of pairs of second terminal modules 22, The first terminal module 211 includes a first upper terminal 211 and a first lower contact terminal 212, and each of the second terminal modules 22 includes a second upper terminal 221, a second lower contact terminal 222, and a second lower conductive terminal 223; 2) providing a docking circuit board 800 having a first surface 81 and a second surface 82. The first surface 81 of the docking circuit board 800 is provided with a first row of conductive strips including a plurality of grounding strips 811 and a plurality of pairs of differential signals The second surface 82 of the docking circuit board is provided with a second row of conductive sheets, which includes a plurality of grounding strips 821 and a plurality of pairs of differential signal sheets 822. The second surface 82 of the docking board 800 is further provided with a plurality of pairs of control The signal sheet 823; (3) mating the docking circuit board 800 with the electrical connector 100 such that the second lower conductive terminal 223 is in contact with the control signal sheet 823 to transmit a low frequency control signal; (4) the first upper terminal 211 is The grounding strip 811 is in contact to transmit a ground signal, the second upper terminal 221 is in contact with the differential signal sheet 812 to transmit a differential signal; (5) the first lower contact terminal 212 is brought into contact with the grounding strip 821 to transmit a ground signal, and a pair of second The contact terminal 222 is in contact with a pair of differential signal sheets 822 to transmit a differential signal.
對接電路板800未增大尺寸便可配置多對差分信號片及控制信號片,且令每對信號片之間設有接地片。如此可以傳輸多對差分信號及控制信號且令每對差分信號之間傳輸接地信號。 The docking board 800 can be configured with a plurality of pairs of differential signal chips and control signal chips without increasing the size, and a grounding strip is disposed between each pair of signal sheets. In this way, multiple pairs of differential signals and control signals can be transmitted and a ground signal can be transmitted between each pair of differential signals.
第二實施方式中的第二端子模組22與第四圖所示的第一實施方式中的第二端子模組22結構相同。參閱第九圖,第二實施方式中的第一端子模組21’包括設有第一上接觸部2111’的第一上端子211’、設有第一下接觸部2121’的第一下接觸端子212’、及設有第一下導電部2131’的第一下導電端子213’。 The second terminal module 22 in the second embodiment has the same structure as the second terminal module 22 in the first embodiment shown in the fourth embodiment. Referring to the ninth diagram, the first terminal module 21' in the second embodiment includes a first upper terminal 211' provided with a first upper contact portion 2111' and a first lower contact provided with a first lower contact portion 2121'. The terminal 212' and the first lower conductive terminal 213' provided with the first lower conductive portion 2131'.
第二實施方式中使用的對接電路板800’的第一表面81與第六圖所示無異,而第二表面82’設置成第八圖所示的結構。如第八圖所示,對接電路板800’的第二表面82’設有第二排導電片828’及第三排導電片827’。第三排導電片827’比第二排導電片828’更靠近對接端80’。第三排導電片827’包括複數控制信號片823’、複數電源片825’及接地片826’。該等控制信號片823’、電源片825’及接地片826’皆為低頻信號片。第二排導電片 828’包括複數接地片821’及複數對差分信號片822’。各對差分信號片822’位於相鄰接地片821’之間。 The first surface 81 of the docking board 800' used in the second embodiment is the same as that shown in the sixth figure, and the second surface 82' is provided in the structure shown in the eighth figure. As shown in the eighth diagram, the second surface 82' of the docking circuit board 800' is provided with a second row of conductive sheets 828' and a third row of conductive sheets 827'. The third row of conductive strips 827' is closer to the butted end 80' than the second row of conductive strips 828'. The third row of conductive sheets 827' includes a plurality of control signal sheets 823', a plurality of power supply sheets 825', and a grounding strip 826'. The control signal piece 823', the power supply piece 825', and the grounding piece 826' are all low frequency signal pieces. Second row of conductive sheets 828' includes a plurality of ground straps 821' and a plurality of pairs of differential signal patches 822'. Each pair of differential signal patches 822' is located between adjacent ground straps 821'.
當對接電路板800’插入時,對接電路板800’的第一表面81上的導電片與第一上端子211’或第二上端子221接觸並導通。對接電路板800’的第二表面82’上的第三排導電片827’與第一下導電端子213’或第二下導電端子223接觸並導通。對接電路板800’的第二表面82’上的第二排導電片828’與第一下接觸端子212’或第二下接觸端子222接觸並導通。 When the docking board 800' is inserted, the conductive sheets on the first surface 81 of the docking board 800' are in contact with and electrically connected to the first upper terminal 211' or the second upper terminal 221. The third row of conductive strips 827' on the second surface 82' of the docking circuit board 800' is in contact with and electrically connected to the first lower conductive terminal 213' or the second lower conductive terminal 223. The second row of conductive strips 828' on the second surface 82' of the docking circuit board 800' is in contact with and electrically connected to the first lower contact terminal 212' or the second lower contact terminal 222.
第二實施方式中對接電路板800’的第二表面82’上的接地片821’設置成比第一實施方式中的接地片821更短,從而於接地片821’前增設控制信號片823’。同時,增設第一下導電端子213’與該控制信號片823’接觸並導通。如此使用同樣尺寸的對接電路板800’可以傳遞更多的控制信號。 In the second embodiment, the grounding piece 821' on the second surface 82' of the docking circuit board 800' is disposed shorter than the grounding plate 821 in the first embodiment, so that the control signal piece 823' is added in front of the grounding plate 821'. . At the same time, the first lower conductive terminal 213' is added in contact with the control signal piece 823' and turned on. Thus using the same size docking board 800' can deliver more control signals.
第二實施方式的電連接方法包括以下步驟:(1)提供一電連接器100’,所述電連接器100’包括複數第一端子模組21’及複數對第二端子模組22,所述第一端子模組21’包括各第一上端子211’、第一下接觸端子212’及第一下導電端子213’,所述各第二端子模組22包括第二上端子221、第二下接觸端子222及第二下導電端子223;(2)提供具有第一表面81、第二表面82’的對接電路板800’,所述對接電路板800’的第一表面81設有第一排導電片,其包括複數接地片811及傳輸差分信號的複數對差分信號片812,所述對接電路板800’的第二表面82’設有第二排導電片828’及第三排導電片827’,第二排導電片828’包括複數接地片821’及設置於相鄰接地片821’之間的複數對差分信號片822’,第 三排導電片827’為低頻信號片;(3)令對接電路板800’與所述電連接器100對接,使得第一下導電端子213’與第二下導電端子223分別與第三排導電片827’接觸以傳輸低頻信號;(4)使得第一上端子211’與接地片811接觸以傳輸接地信號,第二上端子221與差分信號片812接觸以傳輸差分信號;(5)使得第一下接觸端子212’與接地片821’接觸以傳輸接地信號,複數對第二下接觸端子222與複數對差分信號片822’接觸以傳輸差分信號。本實施方式中的第三排導電片827’中的低頻信號片包括控制信號片823’、電源片825’及接地片826’。 The electrical connection method of the second embodiment includes the following steps: (1) providing an electrical connector 100', the electrical connector 100' including a plurality of first terminal modules 21' and a plurality of pairs of second terminal modules 22, The first terminal module 21 ′ includes a first upper terminal 211 ′, a first lower contact terminal 212 ′ and a first lower conductive terminal 213 ′, and each of the second terminal modules 22 includes a second upper terminal 221 , a second contact terminal 222 and a second lower conductive terminal 223; (2) providing a docking circuit board 800' having a first surface 81 and a second surface 82', the first surface 81 of the docking circuit board 800' is provided with A row of conductive sheets, comprising a plurality of grounding strips 811 and a plurality of pairs of differential signal sheets 812 for transmitting differential signals, the second surface 82' of the mating circuit board 800' is provided with a second row of conductive sheets 828' and a third row of conductive The sheet 827', the second row of conductive sheets 828' includes a plurality of grounding strips 821' and a plurality of pairs of differential signal sheets 822' disposed between adjacent grounding strips 821', The three rows of conductive sheets 827' are low frequency signal sheets; (3) the docking circuit board 800' is docked with the electrical connector 100 such that the first lower conductive terminal 213' and the second lower conductive terminal 223 are electrically connected to the third row, respectively. The sheet 827' is in contact to transmit a low frequency signal; (4) the first upper terminal 211' is brought into contact with the grounding strip 811 to transmit a ground signal, and the second upper terminal 221 is in contact with the differential signal sheet 812 to transmit a differential signal; (5) The lower contact terminal 212' is in contact with the grounding strip 821' to transmit a ground signal, and the plurality of second lower contact terminals 222 are in contact with the plurality of pairs of differential signal sheets 822' to transmit a differential signal. The low frequency signal piece in the third row of conductive sheets 827' in the present embodiment includes a control signal piece 823', a power supply piece 825', and a grounding piece 826'.
第十圖及第十一圖揭示第三實施方式中的第一端子模組21’’的結構。第三實施方式中的第一端子模組21’’的第一上端子211’’、第一下接觸端子212’’及第一下導電端子213’’通過注塑成型的方式連接成一體。第三實施方式中的第一端子模組21’’的第一上端子211’’的第一上安裝部2112’’、第一下接觸端子212’’的第一下安裝部2122’’及第一下導電端子213’’的第一下安裝腳2132’’皆設置成水平延伸以通過表面安裝技術與母電路板900焊接。 The tenth and eleventh views disclose the structure of the first terminal module 21'' in the third embodiment. The first upper terminal 211'', the first lower contact terminal 212'', and the first lower conductive terminal 213'' of the first terminal module 21'' in the third embodiment are integrally connected by injection molding. The first upper mounting portion 2112 ′ of the first upper terminal 211 ′′ of the first terminal module 21 ′′ in the third embodiment, the first lower mounting portion 2122 ′′ of the first lower contact terminal 212 ′′ The first lower mounting leg 2132" of the first lower conductive terminal 213" is disposed to extend horizontally to be soldered to the mother circuit board 900 by surface mounting techniques.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟習本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. It should be covered by the following patent application.
221‧‧‧第二上端子 221‧‧‧Second upper terminal
2211‧‧‧第二上接觸部 2211‧‧‧Second Upper Contact
2212‧‧‧第二上安裝部 2212‧‧‧Second upper installation department
2213‧‧‧第二上連接部 2213‧‧‧Second upper connection
222‧‧‧第二下接觸端子 222‧‧‧Second lower contact terminal
2221‧‧‧第二下接觸部 2221‧‧‧Second lower contact
2222‧‧‧第二下安裝部 2222‧‧‧Second installation department
2223‧‧‧第二下連接部 2223‧‧‧Second lower connection
223‧‧‧第二下導電端子 223‧‧‧Second lower conductive terminal
2231‧‧‧第二下導電部 2231‧‧‧Second lower conductive part
2232‧‧‧第二下安裝腳 2232‧‧‧Second installation foot
2233‧‧‧第二下連接部 2233‧‧‧Second lower connection
224‧‧‧第二插槽 224‧‧‧second slot
800‧‧‧對接電路板 800‧‧‧ docking board
Claims (10)
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TW099140746A TWI453995B (en) | 2010-11-25 | 2010-11-25 | Electrical connector and electrical connecting method of the same |
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TW099140746A TWI453995B (en) | 2010-11-25 | 2010-11-25 | Electrical connector and electrical connecting method of the same |
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TW201222982A TW201222982A (en) | 2012-06-01 |
TWI453995B true TWI453995B (en) | 2014-09-21 |
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TW099140746A TWI453995B (en) | 2010-11-25 | 2010-11-25 | Electrical connector and electrical connecting method of the same |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM364991U (en) * | 2009-03-09 | 2009-09-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US7798820B2 (en) * | 2006-04-04 | 2010-09-21 | Finisar Corporation | Communications module edge connector having multiple communication interface pads |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7798820B2 (en) * | 2006-04-04 | 2010-09-21 | Finisar Corporation | Communications module edge connector having multiple communication interface pads |
TWM364991U (en) * | 2009-03-09 | 2009-09-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
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TW201222982A (en) | 2012-06-01 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |