TWI452655B - - Google Patents

Info

Publication number
TWI452655B
TWI452655B TW098142243A TW98142243A TWI452655B TW I452655 B TWI452655 B TW I452655B TW 098142243 A TW098142243 A TW 098142243A TW 98142243 A TW98142243 A TW 98142243A TW I452655 B TWI452655 B TW I452655B
Authority
TW
Taiwan
Application number
TW098142243A
Other languages
Chinese (zh)
Other versions
TW201121004A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW098142243A priority Critical patent/TW201121004A/en
Publication of TW201121004A publication Critical patent/TW201121004A/en
Application granted granted Critical
Publication of TWI452655B publication Critical patent/TWI452655B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
TW098142243A 2009-12-10 2009-12-10 Semiconductor chipsets. TW201121004A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW098142243A TW201121004A (en) 2009-12-10 2009-12-10 Semiconductor chipsets.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098142243A TW201121004A (en) 2009-12-10 2009-12-10 Semiconductor chipsets.

Publications (2)

Publication Number Publication Date
TW201121004A TW201121004A (en) 2011-06-16
TWI452655B true TWI452655B (en) 2014-09-11

Family

ID=45045393

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098142243A TW201121004A (en) 2009-12-10 2009-12-10 Semiconductor chipsets.

Country Status (1)

Country Link
TW (1) TW201121004A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070107930A1 (en) * 2005-11-15 2007-05-17 Sharp Kabushiki Kaisha Printed circuit board and method for manufacturing the same
US20080099237A1 (en) * 2006-10-27 2008-05-01 Nitto Denko Corporation Printed circuit board and electronic component device
TWM369636U (en) * 2009-06-11 2009-11-21 Boardtek Electronics Corp Heat-dissipating structure of the circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070107930A1 (en) * 2005-11-15 2007-05-17 Sharp Kabushiki Kaisha Printed circuit board and method for manufacturing the same
US20080099237A1 (en) * 2006-10-27 2008-05-01 Nitto Denko Corporation Printed circuit board and electronic component device
TWM369636U (en) * 2009-06-11 2009-11-21 Boardtek Electronics Corp Heat-dissipating structure of the circuit board

Also Published As

Publication number Publication date
TW201121004A (en) 2011-06-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees