TWI452651B - - Google Patents
Info
- Publication number
- TWI452651B TWI452651B TW101107836A TW101107836A TWI452651B TW I452651 B TWI452651 B TW I452651B TW 101107836 A TW101107836 A TW 101107836A TW 101107836 A TW101107836 A TW 101107836A TW I452651 B TWI452651 B TW I452651B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101107836A TW201338092A (zh) | 2012-03-08 | 2012-03-08 | 半導體之氣隙的形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101107836A TW201338092A (zh) | 2012-03-08 | 2012-03-08 | 半導體之氣隙的形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201338092A TW201338092A (zh) | 2013-09-16 |
| TWI452651B true TWI452651B (enExample) | 2014-09-11 |
Family
ID=49628005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101107836A TW201338092A (zh) | 2012-03-08 | 2012-03-08 | 半導體之氣隙的形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201338092A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9653348B1 (en) | 2015-12-30 | 2017-05-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101587857A (zh) * | 2008-05-23 | 2009-11-25 | 中芯国际集成电路制造(北京)有限公司 | 半导体器件互连结构的盖层及其制作方法 |
| TW201002089A (en) * | 2008-05-02 | 2010-01-01 | Canon Kk | Method of manufacturing capacitive electromechanical transducer and capacitive electromechanical transducer |
| TW201027704A (en) * | 2009-01-13 | 2010-07-16 | Taiwan Semiconductor Mfg | Through-silicon via with low-k dielectric liner |
-
2012
- 2012-03-08 TW TW101107836A patent/TW201338092A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201002089A (en) * | 2008-05-02 | 2010-01-01 | Canon Kk | Method of manufacturing capacitive electromechanical transducer and capacitive electromechanical transducer |
| CN101587857A (zh) * | 2008-05-23 | 2009-11-25 | 中芯国际集成电路制造(北京)有限公司 | 半导体器件互连结构的盖层及其制作方法 |
| TW201027704A (en) * | 2009-01-13 | 2010-07-16 | Taiwan Semiconductor Mfg | Through-silicon via with low-k dielectric liner |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201338092A (zh) | 2013-09-16 |