TWI452636B - - Google Patents

Info

Publication number
TWI452636B
TWI452636B TW098136667A TW98136667A TWI452636B TW I452636 B TWI452636 B TW I452636B TW 098136667 A TW098136667 A TW 098136667A TW 98136667 A TW98136667 A TW 98136667A TW I452636 B TWI452636 B TW I452636B
Authority
TW
Taiwan
Application number
TW098136667A
Other languages
Chinese (zh)
Other versions
TW201115653A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW98136667A priority Critical patent/TW201115653A/en
Publication of TW201115653A publication Critical patent/TW201115653A/en
Application granted granted Critical
Publication of TWI452636B publication Critical patent/TWI452636B/zh

Links

TW98136667A 2009-10-29 2009-10-29 Package method and product of hollow-structured surface-mount electronic device TW201115653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98136667A TW201115653A (en) 2009-10-29 2009-10-29 Package method and product of hollow-structured surface-mount electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98136667A TW201115653A (en) 2009-10-29 2009-10-29 Package method and product of hollow-structured surface-mount electronic device

Publications (2)

Publication Number Publication Date
TW201115653A TW201115653A (en) 2011-05-01
TWI452636B true TWI452636B (en) 2014-09-11

Family

ID=44934546

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98136667A TW201115653A (en) 2009-10-29 2009-10-29 Package method and product of hollow-structured surface-mount electronic device

Country Status (1)

Country Link
TW (1) TW201115653A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW577161B (en) * 2003-04-17 2004-02-21 Ftech Corp Package structure having cavity
TWM285801U (en) * 2005-08-03 2006-01-11 Lighthouse Technology Co Ltd Light-emitting diode package structure
TWM306452U (en) * 2006-08-08 2007-02-11 I Chiun Precision Ind Co Ltd SMD LED supporter with metal reflective piece
TW200709364A (en) * 2005-08-16 2007-03-01 Advanced Semiconductor Eng Heat sink and the package structure using the same
TW200717856A (en) * 2005-10-28 2007-05-01 Taiwan Oasis Technology Co Ltd Method of fabricating light emitting diode
TW200908824A (en) * 2007-08-13 2009-02-16 Delta Electronics Inc Surface mount connector and circuit board assembly having same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW577161B (en) * 2003-04-17 2004-02-21 Ftech Corp Package structure having cavity
TWM285801U (en) * 2005-08-03 2006-01-11 Lighthouse Technology Co Ltd Light-emitting diode package structure
TW200709364A (en) * 2005-08-16 2007-03-01 Advanced Semiconductor Eng Heat sink and the package structure using the same
TW200717856A (en) * 2005-10-28 2007-05-01 Taiwan Oasis Technology Co Ltd Method of fabricating light emitting diode
TWM306452U (en) * 2006-08-08 2007-02-11 I Chiun Precision Ind Co Ltd SMD LED supporter with metal reflective piece
TW200908824A (en) * 2007-08-13 2009-02-16 Delta Electronics Inc Surface mount connector and circuit board assembly having same

Also Published As

Publication number Publication date
TW201115653A (en) 2011-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees