TWI452456B - Temperature automatic measuring system and method - Google Patents
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Description
本發明涉及一種溫度自動量測系統及量測方法。The invention relates to a temperature automatic measuring system and a measuring method.
在對電腦所能承受之溫度範圍進行測試時，通常採用手動調變待測電腦周圍環境之溫度，如調變放置待測電腦之燒機室之溫度調變開關，並且需要量測人員進入測試環境對待測電腦之開關機進行手動控制。由於調變待測電腦周圍環境之溫度及進入測試環境對待測電腦進行開關機都是透過手動實現的，從而浪費了時間和人力。When testing the temperature range that the computer can withstand, it is usually used to manually adjust the temperature of the environment around the computer to be tested, such as adjusting the temperature modulation switch of the burning room of the computer to be tested, and the measuring personnel are required to enter the test. The environment is controlled manually by the on/off switch of the computer. Since the temperature of the environment around the computer to be tested is modulated and the computer is turned on and off into the test environment, the switch is manually implemented, which wastes time and labor.
鑒於以上內容，有必要提供一種溫度自動量測系統及量測方法，以自動對電腦所能承受之溫度範圍進行量測。In view of the above, it is necessary to provide an automatic temperature measurement system and measurement method to automatically measure the temperature range that the computer can withstand.
一種溫度自動量測系統，用於量測一待測電腦所能承受之溫度範圍，包括：An automatic temperature measuring system for measuring the temperature range that a computer to be tested can withstand, including:
一溫度調變器，用於調變該待測電腦周圍環境之溫度使其按照遞增或遞減趨勢變化；及a temperature modulator for modulating the temperature of the environment surrounding the computer to be tested to change according to an increasing or decreasing trend; and
一連接該溫度調變器及該待測電腦之主控電腦，該主控電腦包括：A master computer connected to the temperature modulator and the computer to be tested, the master computer includes:
一控制模組，用於在量測該待測電腦所能承受溫度範圍之一極限值過程且在第一次控制該溫度調變器調變溫度時控制調變之溫度為相較於一參考溫度增加了一溫度差之調變溫度，及於第一次以後之每次調變之調變溫度均為上一次調變溫度與該溫度差之和；用於在溫度調變後控制提供一電壓給該待測電腦；在接收到開機成功之偵測結果後控制該待測電腦執行測試軟體；在接收到測試失敗之測試結果後控制該待測電腦關機；及在接收到測試失敗或開機失敗時發送控制訊號；a control module is configured to measure a temperature limit of one of the temperature ranges of the computer to be tested and control the temperature of the modulation when the temperature modulation temperature of the temperature modulator is first controlled is compared with a reference The temperature is increased by a temperature difference of the modulation temperature, and the modulation temperature of each modulation after the first time is the sum of the previous modulation temperature and the temperature difference; for providing control after the temperature modulation The voltage is given to the computer to be tested; after receiving the detection result of successful booting, the computer to be tested is controlled to execute the test software; after receiving the test result of the test failure, the computer to be tested is controlled to be shut down; and when the test fails or is started Send a control signal when it fails;
一偵測模組，用於偵測在調變溫度下該待測電腦是否可開機，並將開機成功或開機失敗之偵測結果傳送至該控制模組；及在該待測電腦成功開機後偵測該待測電腦執行測試軟體測試是否測試成功，並將測試成功或測試失敗之測試結果傳送至該控制模組；及a detecting module, configured to detect whether the computer to be tested is bootable at a modulation temperature, and transmit the detection result of the booting success or the boot failure to the control module; and after the computer to be tested is successfully turned on Detecting whether the test computer performs a test software test, whether the test is successful, and transmitting the test result of the test success or the test failure to the control module; and
一記錄模組，用在於接收到控制訊號後記錄該待測電腦開機失敗或測試失敗時之調變溫度與該溫度差之差，即為該極限值。A recording module is used to receive the control signal and record the difference between the modulation temperature and the temperature difference when the computer to be tested fails to start or fails to test, which is the limit value.
一種溫度自動量測方法，用於量測一待測電腦所能承受之溫度範圍之一極限值，該溫度自動量測方法包括：An automatic temperature measurement method for measuring a limit value of a temperature range that a computer to be tested can withstand, the automatic temperature measurement method includes:
a:調變該待測電腦周圍環境之溫度為一相較於一參考溫度增加了一溫度差之調變溫度；a: modulating the temperature of the environment surrounding the computer to be tested is a modulation temperature that is increased by one temperature difference from a reference temperature;
b:提供一供電電壓給該待測電腦；b: providing a power supply voltage to the computer to be tested;
c:偵測該待測電腦是否可開機，並輸出偵測到之開機成功或開機失敗之偵測結果；若該偵測結果為開機成功時，執行步驟d；若該偵測結果為開機失敗時，執行步驟g；c: detecting whether the computer to be tested can be turned on, and outputting the detection result of the detected boot success or the boot failure; if the detection result is successful, step d is performed; if the detection result is boot failure When performing step g;
d:控制該待測電腦執行測試軟體，並於測試後偵測該待測電腦測試是否成功，並輸出測試成功或測試失敗之測試結果；若該測試結果為測試失敗時，執行步驟f；若該測試結果為測試成功時，執行步驟e；d: controlling the computer to be tested to execute the test software, and detecting whether the test of the testable computer is successful after the test, and outputting the test result of the test success or the test failure; if the test result is a test failure, performing step f; The test result is that when the test is successful, step e is performed;
e:控制該待測電腦關機並斷電及調變該待測電腦周圍環境之溫度為前一次之調變溫度加上該溫度差之調變溫度，返回步驟b；e: controlling the computer to be tested to shut down and power off and modulating the temperature of the environment surrounding the computer to be tested is the previous modulation temperature plus the temperature difference of the temperature change, return to step b;
f:控制該待測電腦關機並斷電；f: controlling the computer to be tested to be turned off and powered off;
g:對該待測電腦斷電並發送一控制訊號；及g: power off the computer to be tested and send a control signal; and
h:記錄此時該調變溫度與該溫度差之差作為該待測電腦所能承受之溫度範圍之極限值，結束對該待測電腦所能承受之溫度範圍之極限值之量測。h: Record the difference between the modulation temperature and the temperature difference at this time as the limit value of the temperature range that the computer to be tested can withstand, and end the measurement of the limit value of the temperature range that the computer to be tested can withstand.
該溫度自動量測系統及量測方法透過該控制模組控制該溫度調變器調變之溫度為相較於一參考溫度增加了一溫度差，及在第一次以後之每次調變之調變溫度均為上一次調變溫度與該溫度差之和；透過該偵測模組偵測該待測電腦於調變溫度下是否能夠開機，及在開機成功後偵測該待測電腦運行之測試軟體是否測試成功；並透過該控制模組接收到開機失敗或測試失敗之測試結果後發送控制訊號使該記錄模組記錄此時之調變溫度與該溫度差之和來確定該待測電腦所能承受之溫度範圍，從而實現對該待測電腦所能承受之溫度範圍之自動量測。The temperature automatic measuring system and the measuring method control the temperature of the temperature modulator to be adjusted by the control module to increase a temperature difference compared with a reference temperature, and each time after the first time The modulation temperature is the sum of the previous modulation temperature and the temperature difference; the detection module detects whether the computer to be tested can be turned on at the modulation temperature, and detects the running of the computer to be tested after the startup is successful. Whether the test software is successfully tested; and after receiving the test result of the boot failure or the test failure, the control module sends a control signal to cause the recording module to record the sum of the modulation temperature and the temperature difference at this time to determine the test to be tested. The temperature range that the computer can withstand, so as to achieve automatic measurement of the temperature range that the computer to be tested can withstand.
請參考圖1，本發明溫度自動量測系統100用於量測一待測電腦40所能承受之溫度範圍，該溫度自動量測系統100較佳實施方式包括一主控電腦10、一溫度調變器20及一交流電源開關裝置30。該主控電腦10分別與該溫度調變器20、該交流電源開關裝置30及該待測電腦40連接。該待測電腦40包括一與該交流電源開關裝置30相連之電源供應器42。在量測該待測電腦40所能承受之溫度範圍時需將該待測電腦40容置於一燒機室50內，該燒機室50連接該溫度調變器20。該溫度調變器20用於調變該燒機室50內之溫度。該交流電源開關裝置30用於控制提供給該電源供應器42之交流電。該主控電腦10包括一記憶體11及一處理器12。該處理器12用於執行該記憶體11中各模組之指令。Referring to FIG. 1 , the temperature automatic measurement system 100 of the present invention is used to measure a temperature range that can be withstood by a computer 40 to be tested. The preferred embodiment of the automatic temperature measurement system 100 includes a main control computer 10 and a temperature adjustment. The transformer 20 and an AC power switch device 30. The main control computer 10 is connected to the temperature modulator 20, the AC power switch device 30, and the computer 40 to be tested. The computer under test 40 includes a power supply 42 connected to the AC power switch device 30. When measuring the temperature range that the computer 40 to be tested can withstand, the computer 40 to be tested needs to be placed in a burning chamber 50, and the burning chamber 50 is connected to the temperature modulator 20. The temperature modulator 20 is used to modulate the temperature within the firing chamber 50. The AC power switching device 30 is for controlling the AC power supplied to the power supply 42. The main control computer 10 includes a memory 11 and a processor 12. The processor 12 is configured to execute instructions of each module in the memory 11.
請參考圖2，該記憶體11包括一控制模組112、一偵測模組114及一記錄模組116。Referring to FIG. 2 , the memory 11 includes a control module 112 , a detection module 114 , and a recording module 116 .
該控制模組112用於在量測該待測電腦40所能承受溫度範圍之上限過程中，在第一次控制該溫度調變器20調變該燒機室50內之溫度時控制調變之調變溫度為相較於一參考溫度增加了一溫度差之溫度，及在第一次以後之每次調變之調變溫度均為上一次調變溫度與該溫度差之和；及用於在量測該待測電腦40所能承受溫度範圍之下限過程中，在第一次控制該溫度調變器20調變該燒機室50內之溫度時控制調變之調變溫度為相較於該參考溫度減少了該溫度差之溫度，及在第一次以後之每次調變之調變溫度均為上一次調變溫度與該溫度差之差。該參考溫度為正常情況下，該待測電腦40可正常開機之溫度如24度。該溫度差為5度，在其他實施方式中，該參考溫度可為其他溫度，該溫度差可設定為其他溫度值。The control module 112 is configured to control the modulation when the temperature regulator 20 is first controlled to adjust the temperature in the burning chamber 50 during the measurement of the upper limit of the temperature range that the computer 40 can withstand. The modulation temperature is a temperature that is increased by a temperature difference compared to a reference temperature, and the modulation temperature of each modulation after the first time is the sum of the previous modulation temperature and the temperature difference; In the process of measuring the lower limit of the temperature range that the computer 40 to be tested can withstand, the first time the temperature modulator 20 is controlled to modulate the temperature in the firing chamber 50, the modulation temperature of the modulation is controlled to be phase The temperature of the temperature difference is reduced compared to the reference temperature, and the modulation temperature of each modulation after the first time is the difference between the last modulation temperature and the temperature difference. When the reference temperature is normal, the temperature of the computer 40 to be tested can be normally turned on, such as 24 degrees. The temperature difference is 5 degrees. In other embodiments, the reference temperature may be other temperatures, and the temperature difference may be set to other temperature values.
該控制模組112還用於在該溫度調變器20調變溫度後控制該交流電源開關裝置30輸出一交流電壓給該待測電腦40之電源供應器42。The control module 112 is further configured to control the AC power switching device 30 to output an AC voltage to the power supply 42 of the computer 40 to be tested after the temperature modulation device 20 adjusts the temperature.
該電源供應器42用於將該交流電源開關裝置30輸出之交流電壓轉換成直流電壓以供該待測電腦40開機及該待測電腦40之其他元器件工作。The power supply 42 is configured to convert the AC voltage outputted by the AC power switching device 30 into a DC voltage for the PC to be tested 40 to be powered on and other components of the computer 40 to be tested to operate.
該偵測模組114用於偵測在該調變溫度下該待測電腦40是否可開機，並將一開機成功或開機失敗之偵測結果傳送至該控制模組12。The detection module 114 is configured to detect whether the computer 40 to be tested is bootable at the modulation temperature, and transmit a detection result of successful startup or power failure to the control module 12.
該控制模組112還用於在接收到開機成功之偵測結果後控制該待測電腦40執行一測試軟體。The control module 112 is further configured to control the computer under test 40 to execute a test software after receiving the detection result of successful booting.
該偵測模組114還用於在該待測電腦40成功開機後偵測該待測電腦40執行測試軟體測試該待測電腦40內之CPU（Central Processing Unit，中央處理器）、記憶體等元件是否測試成功，並將測試成功或測試失敗之測試結果傳送至該控制模組12。該測試軟體為電腦硬體性能測試軟體，主要用於測試CPU、記憶體、硬碟以及CD-ROM之性能。The detection module 114 is further configured to detect that the computer under test 40 performs a test software test on a CPU (Central Processing Unit), a memory, etc. in the computer 40 to be tested after the computer 40 is successfully powered on. Whether the component is successfully tested and the test result of the test success or the test failure is transmitted to the control module 12. The test software is a computer hardware performance test software, mainly used to test the performance of CPU, memory, hard disk and CD-ROM.
該控制模組112還用於在接收到測試失敗之測試結果後控制該待測電腦40關機，並控制該交流電源開關裝置30斷開，停止給該待測電腦40供電；及還用於在接收到測試失敗或開機失敗時發送控制訊號至該記錄模組116。The control module 112 is further configured to control the computer 40 to be tested to be shut down after receiving the test result of the test failure, and control the AC power switch device 30 to be disconnected, stop supplying power to the computer 40 to be tested; A control signal is sent to the recording module 116 upon receiving a test failure or a power failure.
該記錄模組116用於在量測該待測電腦40所能承受溫度範圍之上限值時，在接收到控制訊號後記錄該待測電腦40開機失敗或測試失敗時之調變溫度與該溫度差之差，即為該待測電腦40所能承受溫度範圍之上限值；及用於在量測該待測電腦40所能承受溫度範圍之下限值時，在接收到控制訊號後記錄該待測電腦40開機失敗或測試失敗時之調變溫度與該溫度差之和，即為該待測電腦40所能承受溫度範圍之下限值。The recording module 116 is configured to record, when the control computer 40 is capable of withstanding the upper limit of the temperature range, the modulation temperature of the computer 40 to be tested after the power failure or the test fails. The difference between the temperature differences is the upper limit of the temperature range that the computer under test 40 can withstand; and is used to measure the lower limit of the temperature range that the computer under test 40 can withstand, after receiving the control signal The sum of the modulation temperature and the temperature difference when the computer 40 to be tested fails or fails to test is recorded, that is, the lower limit of the temperature range that the computer 40 to be tested can withstand.
請繼續參考圖3，本發明溫度自動量測方法用於量測該待測電腦40所能承受之溫度範圍，在進行量測之前為了確保該溫度調變器20調變之溫度是導致該待測電腦40開機失敗或測試失敗之唯一條件需要測試該待測電腦40有無故障，能否正常開機。測試該待測電腦有無故障，能否正常開機包括以下步驟。With reference to FIG. 3, the automatic temperature measurement method of the present invention is used to measure the temperature range that the computer 40 to be tested can withstand, and to ensure the temperature of the temperature modulation device 20 is adjusted before the measurement is performed. The only condition for measuring the failure of the computer 40 to start or fail the test is to test whether the computer 40 to be tested has a fault and can be turned on normally. Test whether the computer to be tested has faults, and whether the normal booting includes the following steps.
K1，該控制模組12控制該交流電源開關裝置30輸出交流電壓給該電源供應器42使其將交流電壓轉換成直流供電電壓後輸出至該待測電腦40之各元器件。K1, the control module 12 controls the AC power switch device 30 to output an AC voltage to the power supply 42 to convert the AC voltage into a DC power supply voltage, and output the components to the components of the computer 40 to be tested.
K2，該偵測模組14偵測該待測電腦40是否可開機，並將偵測到之開機成功或開機失敗之偵測結果傳送至該控制模組12。若該控制模組12接收到之偵測結果為開機成功之訊號時，執行步驟K3；若該控制模組12接收到偵測結果為開機失敗之訊號時，則不能執行溫度自動量測方法來量測該待測電腦40所能承受之溫度範圍。K2, the detecting module 14 detects whether the computer 40 to be tested is bootable, and transmits the detected detection result of the booting success or the booting failure to the control module 12. If the detection result received by the control module 12 is a successful start signal, step K3 is performed; if the control module 12 receives the signal that the detection result is a power failure, the automatic temperature measurement method cannot be performed. The temperature range that the computer 40 to be tested can withstand is measured.
K3，該控制模組12控制該待測電腦40關機並控制該電源開關裝置30斷開，停止給該待測電腦40供電，啟動溫度自動測試系統。K3, the control module 12 controls the computer 40 to be tested to shut down and controls the power switch device 30 to be disconnected, stops supplying power to the computer 40 to be tested, and starts the automatic temperature test system.
若已確保該待測電腦40無故障，可正開機，則可省略以上步驟。If it is ensured that the computer 40 to be tested has no fault and can be turned on, the above steps can be omitted.
本發明溫度自動量測方法較佳實施方式包括以下步驟。The preferred embodiment of the automatic temperature measurement method of the present invention comprises the following steps.
S1，該控制模組12控制該溫度調變器20調變該待測電腦40所處之燒機室50內之溫度為一相較於該參考溫度增加了該溫度差之調變溫度。S1, the control module 12 controls the temperature modulator 20 to modulate the temperature in the burning chamber 50 where the computer 40 to be tested is located to be a modulation temperature that increases the temperature difference compared to the reference temperature.
S2，該控制模組12控制該交流電源開關裝置30輸出交流電壓給該電源供應器42使其將交流電壓轉換成直流供電電壓後輸出至該待測電腦40之各元器件。S2, the control module 12 controls the AC power switch device 30 to output an AC voltage to the power supply 42 to convert the AC voltage into a DC power supply voltage, and output the components to the components of the computer 40 to be tested.
S3，該偵測模組14偵測該待測電腦40是否可開機，並將偵測到之開機成功或開機失敗之偵測結果傳送至該控制模組12。若該偵測結果為開機成功時，執行步驟S4；若該偵測結果為開機失敗時，執行步驟S7。S3, the detecting module 14 detects whether the computer 40 to be tested is bootable, and transmits the detected detection result of the booting success or the booting failure to the control module 12. If the detection result is that the power-on is successful, step S4 is performed; if the detection result is that the power-on fails, step S7 is performed.
S4，該控制模組12控制該待測電腦40執行測試軟體來測試該待測電腦40內之CPU、記憶體等元件。該偵測模組14在該待測電腦40測試完畢後偵測該待測電腦40測試是否成功，並將偵測成功或測試失敗之測試結果傳輸至該控制模組12。若該測試結果為測試失敗時，執行步驟S6。若該測試結果為測試成功時，執行步驟S5。S4, the control module 12 controls the computer 40 to be tested to execute a test software to test components such as a CPU and a memory in the computer 40 to be tested. The detection module 14 detects whether the test of the computer 40 to be tested is successful after the test of the computer 40 to be tested is completed, and transmits the test result of the detection success or the test failure to the control module 12. If the test result is a test failure, step S6 is performed. If the test result is that the test is successful, step S5 is performed.
S5，該控制模組12控制該待測電腦40關機，控制該交流電源開關裝置30斷開，停止給該待測電腦40供電，及控制該溫度調變器20調變該待測電腦40所處該燒機室50內之溫度為前一次之調變溫度加上該溫度差之調變溫度，返回步驟S2。S5, the control module 12 controls the computer 40 to be tested to be shut down, controls the AC power switch device 30 to be disconnected, stops supplying power to the computer 40 to be tested, and controls the temperature modulator 20 to modulate the computer 40 to be tested. The temperature in the burning chamber 50 is the previous modulation temperature plus the temperature change temperature, and the process returns to step S2.
S6，該控制模組12控制該待測電腦40關機。S6, the control module 12 controls the computer 40 to be tested to be shut down.
S7，該控制模組12控制該交流電源開關裝置30斷開，停止給該待測電腦40供電並發送該控制訊號至該記錄模組16。S7, the control module 12 controls the AC power switch device 30 to be disconnected, stops supplying power to the computer 40 to be tested, and sends the control signal to the recording module 16.
S8，該記錄模組12接收到該控制訊號後記錄此時該調變溫度與該溫度差之差作為該待測電腦40所能承受之溫度範圍之上限值。結束對該待測電腦40所能承受之溫度範圍之上限值之量測。S8. After receiving the control signal, the recording module 12 records the difference between the modulation temperature and the temperature difference at this time as the upper limit of the temperature range that the computer under test 40 can withstand. The measurement of the upper limit of the temperature range that the computer 40 to be tested can withstand is ended.
S9，該控制模組12控制該溫度調變器20調變該待測電腦40所處之燒機室50內之溫度為一相較於該參考溫度減去該溫度差之調變溫度。S9, the control module 12 controls the temperature modulator 20 to modulate the temperature in the burning chamber 50 where the computer 40 to be tested is located to be a modulation temperature minus the temperature difference from the reference temperature.
S10，該控制模組12控制該交流電源開關裝置30輸出交流電壓給該電源供應器42使其將交流電壓轉換成直流供電電壓後輸出至該待測電腦40之各元器件。S10, the control module 12 controls the AC power switch device 30 to output an AC voltage to the power supply 42 to convert the AC voltage into a DC power supply voltage, and output the components to the components of the computer 40 to be tested.
S11，該偵測模組14偵測該待測電腦40是否可開機，並將偵測到之開機成功或開機失敗之偵測結果傳送至該控制模組12。若該偵測結果為開機失敗，則執行步驟S15；若該偵測結果為開機成功，則執行步驟S12。S11, the detecting module 14 detects whether the computer 40 to be tested is bootable, and transmits the detected detection result of the booting success or the booting failure to the control module 12. If the detection result is that the power-on fails, step S15 is performed; if the detection result is that the power-on is successful, step S12 is performed.
S12，該控制模組12控制該待測電腦40執行測試軟體來測試該待測電腦40內之CPU、記憶體等元件。該偵測模組14在該待測電腦40測試完畢後偵測該待測電腦40測試是否成功，並將偵測成功或測試失敗之測試結果傳輸給該控制模組12。若該測試結果為測試失敗，則執行步驟S14；若該控制模組12接收到之測試結果為測試成功，執行步驟S13。S12, the control module 12 controls the computer 40 to be tested to execute a test software to test components such as a CPU and a memory in the computer 40 to be tested. The detection module 14 detects whether the test of the computer 40 to be tested is successful after the test of the computer 40 to be tested is completed, and transmits the test result of the detection success or the test failure to the control module 12. If the test result is a test failure, step S14 is performed; if the test result received by the control module 12 is a test success, step S13 is performed.
S13，該控制模組12控制該待測電腦40關機、控制該交流電源開關裝置30斷開，停止給該待測電腦40供電及控制該溫度調變器20調變該待測電腦40所處該燒機室50內周圍環境之溫度為前一次之調變溫度減去該溫度差之調變溫度，返回步驟S10。S13, the control module 12 controls the computer 40 to be tested to be shut down, controls the AC power switch device 30 to be disconnected, stops supplying power to the computer 40 to be tested, and controls the temperature modulator 20 to modulate the computer 40 to be tested. The temperature of the surrounding environment in the burning chamber 50 is the previous modulation temperature minus the temperature difference of the temperature difference, and the process returns to step S10.
S14，該控制模組12控制該待測電腦40關機。S14, the control module 12 controls the computer 40 to be tested to be shut down.
S15，該控制模組12控制該交流電源開關裝置30斷開，停止給該待測電腦40供電並發送該控制訊號至該記錄模組16。S15, the control module 12 controls the AC power switch device 30 to be disconnected, stops supplying power to the computer 40 to be tested, and sends the control signal to the recording module 16.
S16，該記錄模組16於接收到該控制訊號後記錄此時該調變溫度與該溫度差之和作為該待測電腦40所能承受之溫度範圍之下限值。結束對該待測電腦40所能承受之溫度範圍之量測。S16, after receiving the control signal, the recording module 16 records the sum of the modulation temperature and the temperature difference at this time as the lower limit of the temperature range that the computer under test 40 can withstand. The measurement of the temperature range that the computer 40 to be tested can withstand is completed.
在本實施方式中，需要量測得知的為該待測電腦40所能承受之溫度之上限值和下限值。In the present embodiment, it is necessary to measure the upper and lower limit values of the temperature that the computer 40 to be tested can withstand.
在其他實施方式中，可根據需要只需要量測得知的為該待測電腦40所能承受之溫度範圍之上限值或下限值。當只需要量測得知的為待測電腦所能承受之溫度範圍之上限值時，可刪除步驟S9到步驟S16。若只需要測試得知的為待測電腦所能承受之電壓範圍之下限值，可刪除步驟S1到步驟S8。In other embodiments, only the upper or lower limit of the temperature range that the computer under test 40 can withstand can be measured as needed. When it is only necessary to measure the upper limit of the temperature range that can be withstood by the computer to be tested, step S9 to step S16 may be deleted. If it is only necessary to test the lower limit of the voltage range that the computer to be tested can withstand, step S1 to step S8 may be deleted.
下面舉一實例來說明該溫度自動量測系統100及溫度自動量測方法。例如於量測該待測電腦40所能承受之溫度範圍之上限值時，該控制模組12控制該溫度調變器20調變該待測電腦40所處該燒機室50內之溫度為相較於參考溫度24度增加了5度之調變溫度29度，該控制模組12控制該交流電源開關裝置30給該待測電腦40供電。該偵測模組14偵測到該待測電腦40開機成功。該控制模組12控制該待測電腦40執行測試軟體，該偵測模組14偵測到測試成功。該控制模組12控制該交流電源供電裝置30停止給待測電腦40供電。該控制模組12再一次控制該溫度調變器20調變該待測電腦40所處該燒機室50內之調變溫度為34度，以下步驟均與上述步驟相同，於此不再贅述，直到在一調變溫度下該待測電腦40開機失敗或測試失敗，該控制模組12發送控制訊號給該記錄模組16使其記錄該待測電腦40所能承受之溫度範圍之上限值為此時之調變溫度減去該溫度差5度；當量測該待測電腦40所能承受之溫度範圍之下限值時，除了該控制模組12控制該溫度調變器20調變該待測電腦40所處該燒機室50內之溫度為相較於參考溫度24度減少了5度之調變溫度19度，在開機成功及測試成功後控制該溫度調變器20調變該待測電腦40所處該燒機室50內之溫度為相較於前一次之調變溫度減去5度之調變溫度外，其他之步驟與量測該待測電腦40所能承受之上限值時相同，在此不再贅述。An example of the temperature automatic measurement system 100 and the automatic temperature measurement method will be described below. For example, when measuring the upper limit of the temperature range that the computer 40 to be tested can withstand, the control module 12 controls the temperature modulator 20 to modulate the temperature in the burning chamber 50 where the computer 40 to be tested is located. The control module 12 controls the AC power switch device 30 to supply power to the computer 40 to be tested, in order to increase the modulation temperature by 5 degrees by 29 degrees compared to the reference temperature of 24 degrees. The detecting module 14 detects that the computer 40 to be tested is powered on successfully. The control module 12 controls the computer 40 to be tested to execute a test software, and the detection module 14 detects that the test is successful. The control module 12 controls the AC power supply device 30 to stop supplying power to the computer 40 to be tested. The control module 12 once again controls the temperature modulator 20 to modulate the modulation temperature in the burning chamber 50 where the computer 40 to be tested is located to be 34 degrees. The following steps are the same as the above steps, and details are not described herein again. The control module 12 sends a control signal to the recording module 16 to record the upper limit of the temperature range that the computer under test 40 can withstand until the test computer 40 fails to turn on the test or fails the test. The value is the modulation temperature at this time minus the temperature difference of 5 degrees; when the equivalent measurement of the lower limit of the temperature range that the computer 40 can withstand, the control module 12 controls the temperature modulator 20 to adjust The temperature in the burning chamber 50 where the computer 40 to be tested is located is 19 degrees lower than the reference temperature of 24 degrees, and the temperature modulation device 20 is controlled after the startup is successful and the test is successful. The temperature in the burning chamber 50 where the computer 40 to be tested is located is compared with the previous modulation temperature minus the modulation temperature of 5 degrees, and other steps and measurement of the computer 40 to be tested can withstand The upper limit is the same and will not be described here.
該溫度自動量測系統100透過該控制模組12控制該溫度調變器20以該溫度差為間隔遞增或遞減地調變待測電腦40所處該所燒機室50內之溫度，透過該偵測模組14偵測該待測電腦40在調變溫度下是否可開機，及在開機成功後偵測該待測電腦40運行之測試軟體是否測試成功，並透過該控制模組12接收到開機失敗或測試失敗之測試結果後發送控制訊號使該記錄模組16記錄此時之調變溫度與該溫度差之和或差來確定了該待測電腦40所能承受之溫度範圍，方便快捷。The temperature automatic measurement system 100 controls the temperature modulator 20 to increase or decrease the temperature in the burning chamber 50 where the computer 40 to be tested is located at an interval of the temperature difference. The detecting module 14 detects whether the computer 40 to be tested can be turned on at the modulation temperature, and detects whether the test software running on the computer 40 to be tested is successfully tested after being successfully booted, and receives the test software through the control module 12 After the test result of the boot failure or the test failure is sent, the control signal is sent to the recording module 16 to record the sum or difference between the modulation temperature and the temperature difference at this time to determine the temperature range that the computer 40 to be tested can withstand, which is convenient and quick. .
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10‧‧‧主控電腦
11‧‧‧記憶體
112‧‧‧控制模組
114‧‧‧偵測模組
116‧‧‧記錄模組
12‧‧‧處理器
20‧‧‧溫度調變器
30‧‧‧交流電源開關裝置
40‧‧‧待測電腦
42‧‧‧電源供應器
50‧‧‧燒機室
100‧‧‧溫度自動量測系統10‧‧‧Master computer
11‧‧‧ memory
112‧‧‧Control Module
114‧‧‧Detection module
116‧‧‧recording module
12‧‧‧ Processor
20‧‧‧temperature modulator
30‧‧‧AC power switch device
40‧‧‧Computer under test
42‧‧‧Power supply
50‧‧‧burning machine room
100‧‧‧Automatic temperature measurement system
圖1係本發明溫度自動量測系統的較佳實施方式的框圖。1 is a block diagram of a preferred embodiment of the automatic temperature measurement system of the present invention.
圖2係本發明溫度自動量測系統中的記憶體的功能模塊圖。2 is a functional block diagram of a memory in the automatic temperature measuring system of the present invention.
圖3A-圖3C係本發明溫度自動量測方法的較佳實施方式的流程圖。3A-3C are flow charts of a preferred embodiment of the automatic temperature measurement method of the present invention.
10‧‧‧主控電腦 10‧‧‧Master computer
11‧‧‧記憶體 11‧‧‧ memory
12‧‧‧處理器 12‧‧‧ Processor
20‧‧‧溫度調變器 20‧‧‧temperature modulator
30‧‧‧交流電源開關裝置 30‧‧‧AC power switch device
40‧‧‧待測電腦 40‧‧‧Computer under test
42‧‧‧電源供應器 42‧‧‧Power supply
50‧‧‧燒機室 50‧‧‧burning machine room
100‧‧‧溫度自動量測系統 100‧‧‧Automatic temperature measurement system
Claims (8)
一溫度調變器，用於調變該待測電腦周圍環境之溫度使其按照遞增或遞減趨勢變化；及
一連接該溫度調變器及該待測電腦之主控電腦，該主控電腦包括：
一控制模組，用於在量測該待測電腦所能承受溫度範圍之一極限值過程且在第一次控制該溫度調變器調變溫度時控制調變之溫度為相較於一參考溫度增加了一溫度差之調變溫度，及在第一次以後之每次調變之調變溫度均為上一次調變溫度與該溫度差之和；用於在溫度調變後控制提供一電壓給該待測電腦；在接收到開機成功之偵測結果後控制該待測電腦執行測試軟體；在接收到測試失敗之測試結果後控制該待測電腦關機；及在接收到測試失敗或開機失敗時發送控制訊號；
一偵測模組，用於偵測在調變溫度下該待測電腦是否可開機，並將開機成功或開機失敗之偵測結果傳送至該控制模組；及在該待測電腦成功開機後偵測該待測電腦執行測試軟體測試是否測試成功，並將測試成功或測試失敗之測試結果傳送至該控制模組；及
一記錄模組，用於在接收到控制訊號後記錄該待測電腦開機失敗或測試失敗時之調變溫度與該溫度差之差，即為該極限值。An automatic temperature measuring system for measuring the temperature range that a computer to be tested can withstand, including:
a temperature modulator for modulating the temperature of the environment surrounding the computer to be tested to change according to an increasing or decreasing trend; and a master computer connected to the temperature modulator and the computer to be tested, the master computer includes :
a control module is configured to measure a temperature limit of one of the temperature ranges of the computer to be tested and control the temperature of the modulation when the temperature modulation temperature of the temperature modulator is first controlled is compared with a reference The temperature is increased by a temperature difference of the modulation temperature, and the modulation temperature of each modulation after the first time is the sum of the previous modulation temperature and the temperature difference; for providing control after the temperature modulation The voltage is given to the computer to be tested; after receiving the detection result of successful booting, the computer to be tested is controlled to execute the test software; after receiving the test result of the test failure, the computer to be tested is controlled to be shut down; and when the test fails or is started Send a control signal when it fails;
a detecting module, configured to detect whether the computer to be tested is bootable at a modulation temperature, and transmit the detection result of the booting success or the boot failure to the control module; and after the computer to be tested is successfully turned on Detecting whether the test computer performs a test software test, whether the test is successful, and transmitting the test result of the test success or the test failure to the control module; and a recording module for recording the test computer after receiving the control signal The difference between the modulation temperature and the temperature difference when the power fails or the test fails is the limit value.
a:調變該待測電腦周圍環境之溫度為一相較於一參考溫度增加了一溫度差之調變溫度；
b:提供一供電電壓給該待測電腦；
c:偵測該待測電腦是否可開機，並輸出偵測到之開機成功或開機失敗之偵測結果；若該偵測結果為開機成功時，執行步驟d；若該偵測結果為開機失敗時，執行步驟g；
d:控制該待測電腦執行測試軟體，並在測試後偵測該待測電腦測試是否成功，並輸出測試成功或測試失敗之測試結果；若該測試結果為測試失敗時，執行步驟f；若該測試結果為測試成功時，執行步驟e；
e:控制該待測電腦關機並斷電及調變該待測電腦周圍環境之溫度為前一次之調變溫度加上該溫度差之調變溫度，返回步驟b；
f:控制該待測電腦關機並斷電；
g:對該待測電腦斷電並發送一控制訊號；及
h:記錄此時該調變溫度與該溫度差之差作為該待測電腦所能承受之溫度範圍之極限值，結束對該待測電腦所能承受之溫度範圍之極限值之量測。An automatic temperature measurement method for measuring a limit value of a temperature range that a computer to be tested can withstand, the automatic temperature measurement method includes:
a: modulating the temperature of the environment surrounding the computer to be tested is a modulation temperature that is increased by one temperature difference from a reference temperature;
b: providing a power supply voltage to the computer to be tested;
c: detecting whether the computer to be tested can be turned on, and outputting the detection result of the detected boot success or the boot failure; if the detection result is successful, step d is performed; if the detection result is boot failure When performing step g;
d: controlling the computer to be tested to execute the test software, and detecting whether the test of the testable computer is successful after the test, and outputting the test result of the test success or the test failure; if the test result is a test failure, performing step f; The test result is that when the test is successful, step e is performed;
e: controlling the computer to be tested to shut down and power off and modulating the temperature of the environment surrounding the computer to be tested is the previous modulation temperature plus the temperature difference of the temperature change, return to step b;
f: controlling the computer to be tested to be turned off and powered off;
g: power off the computer to be tested and send a control signal; and
h: Record the difference between the modulation temperature and the temperature difference at this time as the limit value of the temperature range that the computer to be tested can withstand, and end the measurement of the limit value of the temperature range that the computer to be tested can withstand.
i:調變該待測電腦周圍環境之溫度為一相較於一參考溫度減少了一溫度差之調變溫度；
j:提供一供電電壓給該待測電腦；
k:偵測該待測電腦是否可開機，並輸出偵測到之開機成功或開機失敗之偵測結果；若該偵測結果為開機成功時，執行步驟l；若該偵測結果為開機失敗時，執行步驟o；
l:控制該待測電腦執行測試軟體，並在測試後偵測該待測電腦測試是否成功，並輸出測試成功或測試失敗之測試結果；若該測試結果為測試失敗時，執行步驟n；若該測試結果為測試成功時，執行步驟m；
m:控制該待測電腦關機並斷電及調變該待測電腦周圍環境之溫度為前一次之調變溫度減去該溫度差之調變溫度，返回步驟j；
n:控制該待測電腦關機；
o:對該待測電腦斷電並發送一控制訊號；及
p:記錄此時該調變溫度與該溫度差之和作為該待測電腦所能承受之溫度範圍之另一極限值，結束對該待測電腦所能承受之溫度範圍之量測。The automatic temperature measurement method according to claim 6, wherein when it is further required to measure the lower limit of the temperature range that the computer to be tested can withstand, the following steps are further included after the step h:
i: modulating the temperature of the environment surrounding the computer to be tested is a modulation temperature whose temperature is reduced by one temperature difference compared with a reference temperature;
j: providing a power supply voltage to the computer to be tested;
k: detecting whether the computer to be tested can be turned on, and outputting the detection result of the detected startup success or the startup failure; if the detection result is successful, the step 1 is performed; if the detection result is a boot failure When performing step o;
l: controlling the test computer to execute the test software, and detecting whether the test of the test computer is successful after the test, and outputting the test result of the test success or the test failure; if the test result is a test failure, executing step n; The test result is that when the test is successful, step m is performed;
m: controlling the computer to be tested to shut down and power off and modulating the temperature of the environment surrounding the computer to be tested is the previous modulation temperature minus the temperature difference of the temperature change, returning to step j;
n: controlling the computer to be tested to be turned off;
o: power off the computer to be tested and send a control signal; and
p: Recording the sum of the modulation temperature and the temperature difference at this time as another limit value of the temperature range that the computer to be tested can withstand, and ending the measurement of the temperature range that the computer to be tested can withstand.
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| TW098128120A TWI452456B (en) | 2009-08-21 | 2009-08-21 | Temperature automatic measuring system and method |
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| US4672226A (en) * | 1985-03-08 | 1987-06-09 | Westinghouse Electric Corp. | Redundant resistance temperature detector power supply system |
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