TWI452229B - - Google Patents

Info

Publication number
TWI452229B
TWI452229B TW101104003A TW101104003A TWI452229B TW I452229 B TWI452229 B TW I452229B TW 101104003 A TW101104003 A TW 101104003A TW 101104003 A TW101104003 A TW 101104003A TW I452229 B TWI452229 B TW I452229B
Authority
TW
Taiwan
Application number
TW101104003A
Other languages
Chinese (zh)
Other versions
TW201333373A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101104003A priority Critical patent/TW201333373A/zh
Priority to KR1020120052560A priority patent/KR101301893B1/ko
Priority to JP2012114525A priority patent/JP2013162121A/ja
Priority to DE202013100429U priority patent/DE202013100429U1/de
Priority to DE102013100921A priority patent/DE102013100921A1/de
Priority to BRBR102013002902-5A priority patent/BR102013002902A2/pt
Publication of TW201333373A publication Critical patent/TW201333373A/zh
Application granted granted Critical
Publication of TWI452229B publication Critical patent/TWI452229B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
TW101104003A 2012-02-07 2012-02-07 一體化多層式照明裝置 TW201333373A (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW101104003A TW201333373A (zh) 2012-02-07 2012-02-07 一體化多層式照明裝置
KR1020120052560A KR101301893B1 (ko) 2012-02-07 2012-05-17 일체형으로 형성된 복수층 발광 장치
JP2012114525A JP2013162121A (ja) 2012-02-07 2012-05-18 一体化多層式照明装置
DE202013100429U DE202013100429U1 (de) 2012-02-07 2013-01-30 Integral ausgebildete mehrschichtige lichtemittierende Vorrichtung
DE102013100921A DE102013100921A1 (de) 2012-02-07 2013-01-30 Integral ausgebildete mehrschichtige lichtemittierende Vorrichtung
BRBR102013002902-5A BR102013002902A2 (pt) 2012-02-07 2013-02-06 Dispositivo emissor de luz de múltiplas camadas integralmente formado

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101104003A TW201333373A (zh) 2012-02-07 2012-02-07 一體化多層式照明裝置

Publications (2)

Publication Number Publication Date
TW201333373A TW201333373A (zh) 2013-08-16
TWI452229B true TWI452229B (ko) 2014-09-11

Family

ID=48084878

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101104003A TW201333373A (zh) 2012-02-07 2012-02-07 一體化多層式照明裝置

Country Status (5)

Country Link
JP (1) JP2013162121A (ko)
KR (1) KR101301893B1 (ko)
BR (1) BR102013002902A2 (ko)
DE (2) DE102013100921A1 (ko)
TW (1) TW201333373A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103398364B (zh) * 2013-07-23 2016-05-11 宁波市爱使电器有限公司 一种led灯

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1705423A2 (en) * 2005-03-24 2006-09-27 Sony Corporation Lamp cooling device and projection display apparatus
TWM330426U (en) * 2007-11-05 2008-04-11 Unity Opto Technology Co Ltd Heat dissipation structure of lamp
TWM332793U (en) * 2007-11-28 2008-05-21 Cooler Master Co Ltd Heat radiating structure and the lighting apparatus
TWI332067B (ko) * 2007-11-30 2010-10-21 Tysun Inc

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100593919B1 (ko) * 2004-07-01 2006-06-30 삼성전기주식회사 차량 전조등용 발광 다이오드 모듈 및 이를 구비한 차량전조등
KR100637476B1 (ko) 2005-11-09 2006-10-23 알티전자 주식회사 측면발광 다이오드 및 그 제조방법
KR101317429B1 (ko) * 2007-01-31 2013-10-10 잘만테크 주식회사 히트파이프를 이용한 냉각장치를 구비한 ｌｅｄ조명 조립체
KR200437242Y1 (ko) * 2007-03-06 2007-11-16 광성전기산업(주) 교류 전원용 발광 다이오드 램프
TW200847467A (en) * 2007-05-23 2008-12-01 Tysun Inc Light emitting diode lamp
JP5119917B2 (ja) * 2007-12-28 2013-01-16 日亜化学工業株式会社 発光装置
JP5499325B2 (ja) * 2009-06-01 2014-05-21 東芝ライテック株式会社 発光モジュールおよび照明装置
JP2011222544A (ja) * 2010-04-02 2011-11-04 Stanley Electric Co Ltd 半導体発光装置の製造方法および色度が調整された半導体発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1705423A2 (en) * 2005-03-24 2006-09-27 Sony Corporation Lamp cooling device and projection display apparatus
TWM330426U (en) * 2007-11-05 2008-04-11 Unity Opto Technology Co Ltd Heat dissipation structure of lamp
TWM332793U (en) * 2007-11-28 2008-05-21 Cooler Master Co Ltd Heat radiating structure and the lighting apparatus
TWI332067B (ko) * 2007-11-30 2010-10-21 Tysun Inc

Also Published As

Publication number Publication date
BR102013002902A2 (pt) 2015-07-14
JP2013162121A (ja) 2013-08-19
DE102013100921A1 (de) 2013-08-08
KR20130091231A (ko) 2013-08-16
DE202013100429U1 (de) 2013-03-11
KR101301893B1 (ko) 2013-09-04
TW201333373A (zh) 2013-08-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees