TWI451036B - Light-emitting diode bulb - Google Patents
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Description
本發明係關於一種發光二極體燈泡,特別關於一種具全向性光分佈型態的發光二極體燈泡。The present invention relates to a light-emitting diode bulb, and more particularly to a light-emitting diode bulb having an omnidirectional light distribution pattern.
隨著科技的蓬勃發展與人類環保意識的抬頭,白熾燈泡因發光效率低、耗電量高、壽命短等缺點而面臨被取代的命運。近年來,發光二極體(Light Emitting Diode,LED)因具有壽命長、耗電量少、反應速度快、耐衝撞、耐天候性佳、體積小、發光效率高與輕量化等優點,使得發光二極體成為日常生活應用的主要照明光源之一。With the rapid development of science and technology and the rise of human environmental awareness, incandescent bulbs face the fate of being replaced due to shortcomings such as low luminous efficiency, high power consumption and short life. In recent years, Light Emitting Diode (LED) has advantages such as long life, low power consumption, fast reaction speed, impact resistance, weather resistance, small size, high luminous efficiency and light weight. The diode is one of the main sources of illumination for everyday applications.
請參照「第1圖」,係為習知白熾燈泡於第一平面、第二平面與第三平面的光分佈型態(light distribution pattern)。其中,「第1圖」中圓心位置Q即為習知白熾燈泡所在位置,每個同心圓即表示不同的光強度的等高線,放射狀之線條即表示與鉛垂軸(即0°放射狀之線條)的夾角角度。第一平面係為習知白熾燈泡於0°-180°剖面,且第一平面的光分佈型態係為「第1圖」之實線的光分佈型態。第二平面係為習知白熾燈泡於45°-225°剖面,且第二平面的光分佈型態係為「第1圖」之中心線的光分佈型態。第三平面係為習知白熾燈泡於90°-270°剖面,且第三平面的光分佈型態係為「第1圖」之虛線的光分佈型態。從「第1圖」圖面可知習知白熾燈泡為全向性光源。然而,發光二極體因為封裝等結構上的因素,使得發光二極體所發射的光線通常侷限於一定範圍內(發光二極體的指向性甚高),而無法完整地取代白熾燈泡。Please refer to "Figure 1" for the light distribution pattern of the conventional incandescent bulb on the first plane, the second plane and the third plane. Among them, the center position Q in "1st picture" is the position of the conventional incandescent light bulb, and each concentric circle represents a contour line of different light intensity, and the radial line indicates the vertical axis (ie, 0° radial shape) The angle of the line). The first plane is a 0°-180° section of a conventional incandescent bulb, and the light distribution pattern of the first plane is the light distribution pattern of the solid line of “Fig. 1”. The second plane is a 45°-225° section of a conventional incandescent bulb, and the light distribution pattern of the second plane is the light distribution pattern of the center line of “Fig. 1”. The third plane is a 90°-270° section of a conventional incandescent bulb, and the light distribution pattern of the third plane is a dotted light distribution pattern of “Fig. 1”. It can be seen from the "Fig. 1" drawing that the incandescent bulb is an omnidirectional light source. However, due to structural factors such as packaging, the light-emitting diodes generally limit the light emitted by the light-emitting diodes to a certain range (the directivity of the light-emitting diodes is very high), and cannot completely replace the incandescent light bulbs.
鑒於以上問題,本發明提出一種發光二極體燈泡,藉以解決先前技術所存在發光二極體無法完整地取代白熾燈泡的問題。In view of the above problems, the present invention provides a light-emitting diode bulb, thereby solving the problem that the light-emitting diode of the prior art cannot completely replace the incandescent light bulb.
依據本發明所揭露之發光二極體燈泡的一實施例,發光二極體燈泡包括一電路板組件、一基座、一第一發光二極體光源模組、一第二發光二極體光源模組與一殼體。其中,基座包括一反射面,電路板組件包括彼此相對的一第一表面與一第二表面。第一發光二極體光源模組配置於第一表面上,第二發光二極體光源模組配置於第二表面上。殼體接合基座。第一發光二極體光源模組用以發射一第一光束,第二發光二極體光源模組用以發射一第二光束,第二光束包括一反射光束與一直射光束。第一光束經過殼體後形成一第一光分佈型態(light distribution pattern),反射光束被反射面反射並自殼體出射後形成一第二光分佈型態,直射光束經過殼體後形成一第三光分佈型態。第一光分佈型態、第二光分佈型態與第三光分佈型態相互疊合以構成一全向性光分佈型態。According to an embodiment of the light-emitting diode bulb disclosed in the present invention, the LED bulb includes a circuit board assembly, a base, a first light-emitting diode light source module, and a second light-emitting diode light source. The module is a housing. The base includes a reflective surface, and the circuit board assembly includes a first surface and a second surface opposite to each other. The first light emitting diode light source module is disposed on the first surface, and the second light emitting diode light source module is disposed on the second surface. The housing engages the base. The first light emitting diode light source module is configured to emit a first light beam, the second light emitting diode light source module is configured to emit a second light beam, and the second light beam comprises a reflected light beam and a constant light beam. The first light beam passes through the housing to form a first light distribution pattern. The reflected light beam is reflected by the reflective surface and emerges from the housing to form a second light distribution pattern. The direct light beam passes through the housing to form a light beam. The third light distribution pattern. The first light distribution pattern, the second light distribution pattern, and the third light distribution pattern overlap each other to form an omnidirectional light distribution pattern.
依據本發明所揭露之發光二極體燈泡的一實施例,發光二極體燈泡包括一電路板組件、一基座、一第一發光二極體光源模組、一第二發光二極體光源模組以及一殼體。電路板組件包括彼此相對的一第一表面與一第二表面,殼體包括一反射面。第一發光二極體光源模組係配置於第一表面上,第一發光二極體光源模組用以發射一第一光束。第二發光二極體光源模組係配置於第二表面上,第二發光二極體光源模組用以發射一第二光束,第二光束包括一反射光束與一直射光束。殼體係接合基座。第一光束經過殼體後形成一第一光分佈型態(light distribution pattern),反射光束被反射面反射並自殼體出射後形成一第二光分佈型態,直射光束經過殼體後形成一第三光分佈型態。第一光分佈型態、第二光分佈型態與第三光分佈型態相互疊合以構成一全向性光分佈型態。According to an embodiment of the light-emitting diode bulb disclosed in the present invention, the LED bulb includes a circuit board assembly, a base, a first light-emitting diode light source module, and a second light-emitting diode light source. The module and a housing. The circuit board assembly includes a first surface and a second surface opposite to each other, and the housing includes a reflective surface. The first light emitting diode light source module is disposed on the first surface, and the first light emitting diode light source module is configured to emit a first light beam. The second light emitting diode light source module is disposed on the second surface, the second light emitting diode light source module is configured to emit a second light beam, and the second light beam comprises a reflected light beam and a constant light beam. The housing is coupled to the base. The first light beam passes through the housing to form a first light distribution pattern. The reflected light beam is reflected by the reflective surface and emerges from the housing to form a second light distribution pattern. The direct light beam passes through the housing to form a light beam. The third light distribution pattern. The first light distribution pattern, the second light distribution pattern, and the third light distribution pattern overlap each other to form an omnidirectional light distribution pattern.
依據本發明所揭露之發光二極體燈泡,可藉由反射面與第二發光二極體光源模組的設計,使得第二光束中的直射光束與反射光束可補償第一光分佈型態,進而使本發明所揭露之發光二極體燈泡為全向性光源。其中,反射面可配置於殼體或基座。According to the LED light source disclosed in the present invention, the direct light beam and the reflected light beam in the second light beam can compensate for the first light distribution pattern by the design of the reflective surface and the second light emitting diode light source module. Further, the light-emitting diode bulb disclosed in the present invention is an omnidirectional light source. The reflective surface can be disposed on the housing or the base.
以上關於本發明的內容說明及以下之實施方式的說明係用以示範及解釋本發明的精神及原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the spirit and principles of the invention, and to provide a further explanation of the scope of the invention.
請參照「第2A圖」,係為依據本發明所揭露之發光二極體燈泡的第一實施例立體結構示意圖。發光二極體燈泡100可包括但不限於燈泡接頭22、電路板組件104、基座106與殼體112。在本實施例中,基座106可用以散發發光二極體燈泡100導通時所產生的熱量,燈泡接頭22可外接電源(未繪製)以供電予發光二極體燈泡100。其中,燈泡接頭22可為但不限於螺旋式的燈泡接頭,基座106的材質可為但不限於鋁,殼體112的材質可但不限於透明玻璃。舉例而言,燈泡接頭22亦可為GU10型式的燈泡接頭,基座106的材質亦可為銅,殼體112的材質亦可為透明塑膠。Please refer to FIG. 2A, which is a schematic perspective view of a first embodiment of a light-emitting diode bulb according to the present invention. The light emitting diode bulb 100 can include, but is not limited to, a bulb connector 22, a circuit board assembly 104, a base 106, and a housing 112. In the present embodiment, the susceptor 106 can be used to dissipate the heat generated when the illuminating diode lamp 100 is turned on, and the bulb connector 22 can be externally supplied with a power source (not shown) to supply power to the illuminating diode lamp 100. The bulb connector 22 can be, but is not limited to, a spiral bulb connector. The material of the base 106 can be, but not limited to, aluminum. The material of the housing 112 can be, but is not limited to, transparent glass. For example, the bulb connector 22 can also be a GU10 type bulb connector. The base 106 can also be made of copper. The housing 112 can also be made of transparent plastic.
請參照「第2B圖」,係為依據「第2A圖」之發光二極體燈泡的一實施例剖面結構示意圖。發光二極體燈泡100包括電路板組件104、基座106、第一發光二極體光源模組108、第二發光二極體光源模組110與殼體112。其中,電路板組件104包括彼此相對的第一表面52與第二表面54。第一發光二極體光源模組108配置於第一表面52上。第二發光二極體光源模組110配置於第二表面54上,並可環繞基座106與電路板組件104的連接處M。殼體112接合基座106且包括反射面72,反射面72可藉由殼體112上配置反射單元102而形成。Please refer to FIG. 2B, which is a cross-sectional structural view of an embodiment of a light-emitting diode bulb according to FIG. 2A. The LED bulb 100 includes a circuit board assembly 104, a pedestal 106, a first illuminating diode light source module 108, a second illuminating diode light source module 110, and a housing 112. Wherein, the circuit board assembly 104 includes a first surface 52 and a second surface 54 that are opposite each other. The first LED light source module 108 is disposed on the first surface 52. The second LED light source module 110 is disposed on the second surface 54 and surrounds the junction M of the base 106 and the circuit board assembly 104. The housing 112 engages the base 106 and includes a reflective surface 72 that can be formed by disposing the reflective unit 102 on the housing 112.
在本實施例中,殼體112更包括第一殼體112a與第二殼體112b。第一殼體112a係接合基座106與電路板組件104,以形成第一容置空間80a,第二發光二極體光源模組110與反射單元102設置於第一容置空間80a中。第二殼體112b係接合電路板組件104,以形成第二容置空間80b,第一發光二極體光源模組108設置於第二容置空間中80b,但本實施例並非用以限定本發明。舉例而言,發光二極體燈泡100亦可僅包括單一殼體112(請參照「第2C圖」,係為依據本發明所揭露之發光二極體燈泡的第二實施例剖面結構示意圖)。In this embodiment, the housing 112 further includes a first housing 112a and a second housing 112b. The first housing 112a is configured to engage the pedestal 106 and the circuit board assembly 104 to form a first accommodating space 80a. The second illuminating light source module 110 and the reflective unit 102 are disposed in the first accommodating space 80a. The second housing 112b is connected to the circuit board assembly 104 to form a second accommodating space 80b. The first illuminating diode light source module 108 is disposed in the second accommodating space 80b. However, this embodiment is not intended to limit the present. invention. For example, the LED bulb 100 may include only a single housing 112 (refer to FIG. 2C), which is a cross-sectional structural view of a second embodiment of the LED bulb according to the present invention.
第一發光二極體光源模組108用以發射第一光束11,第二發光二極體光源模組110用以發射第二光束12,第二光束12包括反射光束121與直射光束122。第一光束11經過第二殼體112b後形成第一光分佈型態(請參照「第3A圖」,係為依據「第2B圖」之發光二極體燈泡的一實施例第一光分佈型態示意圖),反射光束121被反射面72反射並自殼體112出射後形成第二光分佈型態(請參照「第3B圖」,係為依據「第2B圖」之發光二極體燈泡的一實施例第二光分佈型態示意圖),直射光束122經過殼體112後形成第三光分佈型態(請參照「第3C圖」,係為依據「第2B圖」之發光二極體燈泡的一實施例第三光分佈型態示意圖)。第一光分佈型態、第二光分佈型態與第三光分佈型態相互疊合以構成全向性光分佈型態(請參照「第3D圖」,係為依據「第2B圖」之發光二極體燈泡的一實施例全向性光分佈型態示意圖)。The first light emitting diode light source module 108 is configured to emit a first light beam 11 , and the second light emitting diode light source module 110 is configured to emit a second light beam 12 , and the second light beam 12 includes a reflected light beam 121 and a direct light beam 122 . The first light beam 11 passes through the second casing 112b to form a first light distribution pattern (refer to "3A"), which is a first light distribution type of an embodiment of the light-emitting diode bulb according to "2B". The reflected light beam 121 is reflected by the reflecting surface 72 and emerges from the housing 112 to form a second light distribution pattern (refer to "3B", which is a light-emitting diode bulb according to "2B". In the second light distribution pattern of the embodiment, the direct light beam 122 passes through the housing 112 to form a third light distribution pattern (refer to "3C", which is a light-emitting diode bulb according to "2B". An embodiment of a third light distribution pattern). The first light distribution pattern, the second light distribution pattern, and the third light distribution pattern overlap each other to form an omnidirectional light distribution pattern (refer to "3D map", which is based on "2B map" An embodiment of an omnidirectional light distribution pattern of a light-emitting diode bulb).
在本實施例中,第一發光二極體光源模組108可具有第一光通量L1 ,第二發光二極體光源模組110可具有第二光通量L2 ,發光二極體燈泡100更可包括但不限於控制單元82,控制單元82可用以控制第一光通量L1 與第二光通量L2 。In this embodiment, the first light emitting diode light source module 108 can have a first light flux L 1 , and the second light emitting diode light source module 110 can have a second light flux L 2 , and the light emitting diode bulb 100 can be further including but not limited to a control unit 82, control unit 82 may be used to control the first light flux and second light flux L 1 L 2.
其中,第二發光二極體光源模組110更包括基準軸90,且基準軸90平行第二表面54。在本實施例中,反射光束121與基準軸90之間的第一夾角θ1 可介於但不限於零度至一百二十度之間,使得反射光束121被反射面72反射並自第一殼體112a出射,進而形成第二光分佈型態(如「第3B圖」所示)。直射光束122與基準軸90之間的第二夾角θ2 可介於但不限於一百二十度至一百八十度之間,使得直射光束122直接自第一殼體112a出射,進而形成第三光分佈型態(如「第3C圖」所示)。The second LED light source module 110 further includes a reference axis 90 , and the reference axis 90 is parallel to the second surface 54 . In this embodiment, the first angle θ 1 between the reflected beam 121 and the reference axis 90 may be between, but not limited to, between zero and one hundred and twenty degrees, such that the reflected beam 121 is reflected by the reflective surface 72 and is from the first The housing 112a is emitted to form a second light distribution pattern (as shown in "Fig. 3B"). The second angle θ 2 between the direct beam 122 and the reference axis 90 may be, but is not limited to, between one hundred and twenty degrees to one hundred and eighty degrees, such that the direct beam 122 is directly emitted from the first housing 112a, thereby forming The third light distribution pattern (as shown in Figure 3C).
此外,電路板組件104可包括但不限於第一電路板302、基板304與第二電路板306,第一電路板302與第二電路板306配置於基板304的相對兩側。更詳細地說,第一電路板302包括第一表面52與第三表面56,第二電路板306包括第二表面54與第四表面58,第三表面56與第四表面58分別配置於基板304的相對兩側。基板304有助於第一電路板202與第二電路板204的散熱,基板304的材質可為但不限於鋁或銅。In addition, the circuit board assembly 104 can include, but is not limited to, a first circuit board 302, a substrate 304, and a second circuit board 306. The first circuit board 302 and the second circuit board 306 are disposed on opposite sides of the substrate 304. In more detail, the first circuit board 302 includes a first surface 52 and a third surface 56, and the second circuit board 306 includes a second surface 54 and a fourth surface 58, respectively, and the third surface 56 and the fourth surface 58 are respectively disposed on the substrate The opposite sides of 304. The substrate 304 facilitates heat dissipation of the first circuit board 202 and the second circuit board 204. The material of the substrate 304 may be, but not limited to, aluminum or copper.
請參照「第4A圖」與「第4B圖」,係分別為依據「第2B圖」之第一發光二極體光源模組配置於第一表面與第二發光二極體光源模組配置於第二表面的一實施例結構示意圖。第一發光二極體光源模組108可包括但不限於四個第一發光二極體封裝結構84,每一第一發光二極體封裝結構84配置於第一表面52上。第二發光二極體光源模組110可包括但不限於十二個第二發光二極體封裝結構86,每一第二發光二極體封裝結構86配置於第二表面54上,且每一第二發光二極體封裝結構86可環繞連接處M(請參照「第2B圖」)。其中,第一發光二極體光源模組108所包括第一發光二極體封裝結構84的數量以及第二發光二極體光源模組110所包括第二發光二極體封裝結構86的數量可依據實際需求進行調整。Please refer to "4A" and "4B", respectively. The first light-emitting diode light source module according to "2B" is disposed on the first surface and the second light-emitting diode light source module. A schematic structural view of an embodiment of the second surface. The first LED package 108 can include, but is not limited to, four first LED package structures 84 , and each of the first LED packages 84 is disposed on the first surface 52 . The second LED body module 110 can include, but is not limited to, twelve second LED package structures 86. Each of the second LED packages 86 is disposed on the second surface 54 and each The second LED package structure 86 can surround the junction M (refer to "FIG. 2B"). The number of the first light emitting diode package structure 84 and the number of the second light emitting diode package structures 86 included in the second light emitting diode light source module 110 can be Adjust according to actual needs.
請參照「第5A圖」,係為依據「第2B圖」之第一發光二極體封裝結構的一實施例結構示意圖。第一發光二極體封裝結構84係可為但不限於RGB發光二極體,且可包括第一正極402、404、406、第一負極401、403、405、紅光發光二極體晶片(未繪製)、綠光發光二極體晶片(未繪製)、藍光發光二極體晶片(未繪製)、第一本體407與透鏡408。第一正極402、404、406與第一負極401、403、405電性連接於第一電路板302,第一本體407包覆並保護紅光發光二極體晶片、綠光發光二極體晶片與藍光發光二極體晶片,透鏡408用以控制紅光發光二極體晶片、綠光發光二極體晶片與藍光發光二極體晶片所分別發出紅光、綠光與藍光的行徑方向。第一正極402與第一負極401用以驅動紅光發光二極體晶片發出紅光,第一正極404與第一負極403用以驅動綠光發光二極體晶片發出綠光,第一正極406與第一負極405用以驅動藍光發光二極體晶片發出藍光。需注意的是,第一發光二極體光源模組108係可藉由控制單元82(請參照「第2B圖」)控制每一第一發光二極體封裝結構84所發出第一光束11的顏色,例如但不限於紅光、黃光或白光。Please refer to FIG. 5A, which is a schematic structural view of an embodiment of a first light emitting diode package structure according to FIG. 2B. The first light emitting diode package structure 84 can be, but not limited to, an RGB light emitting diode, and can include a first positive electrode 402, 404, 406, a first negative electrode 401, 403, 405, and a red light emitting diode chip ( Not drawn), green light emitting diode wafer (not drawn), blue light emitting diode wafer (not drawn), first body 407 and lens 408. The first positive electrode 402, 404, 406 and the first negative electrode 401, 403, 405 are electrically connected to the first circuit board 302, and the first body 407 covers and protects the red light emitting diode chip and the green light emitting diode chip. With the blue light emitting diode chip, the lens 408 is used to control the direction of the red, green and blue light respectively emitted by the red light emitting diode chip, the green light emitting diode chip and the blue light emitting diode chip. The first positive electrode 402 and the first negative electrode 401 are used to drive the red light emitting diode chip to emit red light, and the first positive electrode 404 and the first negative electrode 403 are used to drive the green light emitting diode chip to emit green light, and the first positive electrode 406 The first negative electrode 405 is used to drive the blue light emitting diode chip to emit blue light. It should be noted that the first LED light source module 108 can control the first light beam 11 emitted by each of the first LED packages 84 by the control unit 82 (refer to FIG. 2B). Color, such as but not limited to red, yellow or white.
請參照「第5B圖」,係為依據「第2B圖」之第二發光二極體封裝結構的一實施例結構示意圖。第二發光二極體封裝結構86係可為但不限於RGBW發光二極體,且可包括第二正極502、504、506、508、第二負極501、503、505、507、紅光發光二極體晶片(未繪製)、綠光發光二極體晶片(未繪製)、藍光發光二極體晶片(未繪製)、白光發光二極體晶片(未繪製)、第二本體509與透鏡510。第二正極502、504、506、508與第二負極501、503、505、507電性連接於第二電路板306,第二本體509包覆並保護紅光發光二極體晶片、綠光發光二極體晶片、藍光發光二極體晶片與白光發光二極體晶片,透鏡510用以控制紅光發光二極體晶片、綠光發光二極體晶片、藍光發光二極體晶片與白光發光二極體晶片所分別發出紅光、綠光、藍光與白光的行徑方向。第二正極502與第二負極501用以驅動紅光發光二極體晶片發出紅光,第二正極504與第二負極503用以驅動綠光發光二極體晶片發出綠光,第二正極506與第二負極505用以驅動藍光發光二極體晶片發出藍光,第二正極508與第二負極507用以驅動白光發光二極體晶片發出白光。需注意的是,第二發光二極體光源模組110係可藉由控制單元82(請參照「第2B圖」)控制每一第二發光二極體封裝結構86所發出第二光束12的顏色,例如但不限於紅光、黃光或白光。Please refer to FIG. 5B, which is a schematic structural view of an embodiment of a second LED package structure according to FIG. 2B. The second light emitting diode package structure 86 can be, but not limited to, an RGBW light emitting diode, and can include a second positive electrode 502, 504, 506, 508, a second negative electrode 501, 503, 505, 507, a red light emitting diode A polar body wafer (not drawn), a green light emitting diode wafer (not drawn), a blue light emitting diode wafer (not drawn), a white light emitting diode wafer (not drawn), a second body 509 and a lens 510. The second positive electrode 502, 504, 506, 508 and the second negative electrode 501, 503, 505, 507 are electrically connected to the second circuit board 306, and the second body 509 covers and protects the red light emitting diode chip and the green light emitting a diode chip, a blue light emitting diode chip and a white light emitting diode chip, and the lens 510 is used for controlling a red light emitting diode chip, a green light emitting diode chip, a blue light emitting diode chip and a white light emitting diode The polar body wafers emit red, green, blue, and white light, respectively. The second positive electrode 502 and the second negative electrode 501 are used to drive the red light emitting diode chip to emit red light, and the second positive electrode 504 and the second negative electrode 503 are used to drive the green light emitting diode chip to emit green light, and the second positive electrode 506 The second negative electrode 505 is used to drive the blue light emitting diode chip to emit blue light, and the second positive electrode 508 and the second negative electrode 507 are used to drive the white light emitting diode chip to emit white light. It should be noted that the second LED light source module 110 can control the second light beam 12 emitted by each second LED package structure 86 by the control unit 82 (refer to FIG. 2B). Color, such as but not limited to red, yellow or white.
在本實施例中,第一發光二極體封裝結構84與第二發光二極體封裝結構86可分別為RGB發光二極體與RGBW發光二極體,但本實施例並非用以限定本發明。舉例而言,第一發光二極體封裝結構84與第二發光二極體封裝結構86亦可同時為RGB發光二極體或RGBW發光二極體。In this embodiment, the first LED package structure 84 and the second LED package structure 86 can be RGB LEDs and RGBW LEDs, respectively, but this embodiment is not intended to limit the present invention. . For example, the first LED package structure 84 and the second LED package structure 86 can also be RGB LEDs or RGBW LEDs.
依據本實施例進行以下實驗。請參照「第6A圖」至「第6G圖」,係分別為「第2B圖」之發光二極體燈泡的第一光通量與第二光通量的比值為0.1、0.2、0.3、0.5、0.7、1.0與1.5時於第一平面與第三平面的光分布形態。其中,「第6A圖」至「第6G圖」中圓心位置I即為發光二極體燈泡100所在位置,每個同心圓即表示不同的光強度的等高線,放射狀之線條即表示與鉛垂軸(即0°放射狀之線條)的夾角角度。第一平面係為發光二極體燈泡100於0°-180°剖面,且第一平面的光分佈型態係為「第6A圖」至「第6G圖」之實線的光分佈型態。第三平面係為發光二極體燈泡100於90°-270°剖面,且第三平面的光分佈型態係為「第6A圖」至「第6G圖」之虛線的光分佈型態。The following experiment was conducted in accordance with this example. Please refer to "6A" to "6G". The ratio of the first luminous flux to the second luminous flux of the LED bulb of "B2B" is 0.1, 0.2, 0.3, 0.5, 0.7, 1.0. And the light distribution pattern of the first plane and the third plane at 1.5 o'clock. Among them, the center position I in the "6A map" to the "6G map" is the position of the light-emitting diode bulb 100, and each concentric circle represents a contour line of different light intensity, and the radial line indicates the plumb line The angle between the axes (that is, the 0° radial lines). The first plane is a light-emitting diode bulb 100 having a 0°-180° cross-section, and the light distribution pattern of the first plane is a solid light distribution pattern of “6A to 6G”. The third plane is a 90°-270° cross section of the light-emitting diode bulb 100, and the light distribution pattern of the third plane is a dotted light distribution pattern of “6A to 6G”.
從「第6A圖」至「第6G圖」可知,當第一光通量L1 與第二光通量L2 的比值越接近0.1時(即第二發光二極體光源模組110係為發光二極體燈泡100的主要亮度來源),發光二極體燈泡100不管於第一平面或第三平面的光分佈型態中,其-75°經±180°至75°之間的光強度較-75°經0°至75°之間的光強度強。From "Figure 6A" to "of FIG. 6G" shows that when the second light flux ratio of the first light flux L 1 L 2 is closer to 0.1 (i.e., the second light-emitting diode-based light source module 110 is a light emitting diode The main brightness source of the bulb 100), the light-emitting diode bulb 100 has a light intensity of -75° between ±180° and 75° regardless of the light distribution pattern of the first plane or the third plane. The intensity of light between 0° and 75° is strong.
此外,請參照「表一」,係分別為「第2B圖」之第一光通量與第二光通量的比值為0.1、0.2、0.3、0.5、0.7、1.0與1.5的發光二極體燈泡設置於同一高度並照射於同一工作平面之平均照度與均勻度。其中,發光二極體燈泡100設置於與地板相距2.8公尺(meter,m)且配置於工作平面的幾何中心上方的位置,工作平面的面積為5公尺×5公尺且與地板相距85公分,平均照度係為工作平面上各量測點的照度平均值,均勻度係為所有量測點的最小照度與平均照度的比值。In addition, please refer to "Table 1", which is the same as the LED of the "B2B" with the ratio of the first luminous flux to the second luminous flux of 0.1, 0.2, 0.3, 0.5, 0.7, 1.0 and 1.5. The average illumination and uniformity of the height and illumination of the same work plane. Wherein, the light-emitting diode bulb 100 is disposed at a distance of 2.8 meters (meter, m) from the floor and disposed above the geometric center of the working plane, the working plane has an area of 5 meters x 5 meters and is 85 from the floor. The average illuminance is the average value of the illuminance of each measuring point on the working plane, and the uniformity is the ratio of the minimum illuminance to the average illuminance of all the measuring points.
從「表一」可知,當第一光通量L1 與第二光通量L2 的比值越接近0.1時,發光二極體燈泡100的均勻度越高,可應用於室內照明。當第一光通量L1 與第二光通量L2 的比值越接近1.5時,發光二極體燈泡100的平均照度越高,可應用於夜間照明。From the "Table" it shows that, when the second light flux ratio of the first light flux L 1 and L 2 is 0.1, the higher the uniformity of the light emitting diode lamp 100, may be applied to interior lighting closer. When the ratio of the first luminous flux L 1 to the second luminous flux L 2 is closer to 1.5, the higher the average illuminance of the light-emitting diode bulb 100, the night illumination can be applied.
上述第一實施例所揭露之殼體112包括反射面72,但第一實施例並非用以限定本發明。換句話說,反射面72亦可配置於基座106上(請參照「第7圖」,係為依據本發明所揭露之發光二極體燈泡的第三實施例剖面結構示意圖)。The housing 112 disclosed in the above first embodiment includes a reflecting surface 72, but the first embodiment is not intended to limit the present invention. In other words, the reflecting surface 72 can also be disposed on the pedestal 106 (refer to FIG. 7), which is a cross-sectional structural view of a third embodiment of the light-emitting diode bulb according to the present invention.
請參照「第7圖」,發光二極體燈泡100包括電路板組件104、基座106、第一發光二極體光源模組108、第二發光二極體光源模組110與殼體112。其中,基座106包括反射面72,電路板組件104包括彼此相對的第一表面52與第二表面54。第一發光二極體光源模組108配置於第一表面52上。第二發光二極體光源模組110配置於第二表面54上,並可環繞基座106與電路板組件104的連接處M。殼體112接合基座106。在本實施例中,基座106的材質為具有拋光表面的金屬,使得基座106具有反射面72。Referring to FIG. 7 , the LED lamp 100 includes a circuit board assembly 104 , a pedestal 106 , a first illuminating diode light source module 108 , a second illuminating diode light source module 110 , and a housing 112 . Wherein, the pedestal 106 includes a reflective surface 72, and the circuit board assembly 104 includes a first surface 52 and a second surface 54 that are opposite one another. The first LED light source module 108 is disposed on the first surface 52. The second LED light source module 110 is disposed on the second surface 54 and surrounds the junction M of the base 106 and the circuit board assembly 104. The housing 112 engages the base 106. In the present embodiment, the base 106 is made of a metal having a polished surface such that the base 106 has a reflective surface 72.
上述第一實施例、第二實施例與第三實施例所揭露之電路板組件104係可包括但不限於二單面電路板(第一電路板302與第二電路板306)。換句話說,電路板組件104係可為雙面電路板,第一發光二極體光源模組108係可利用晶片直接封裝製程將第一發光二極體晶片32配置於第一封裝體30與第一表面52之間,第二發光二極體光源模組110係可利用晶片直接封裝製程將第二發光二極體晶片42配置於第二封裝體40與第二表面54之間(請參照「第8圖」、「第9A圖」與「第9B圖」,係分別為依據本發明所揭露之發光二極體燈泡的第四實施例剖面結構示意圖以及依據「第8圖」之第一發光二極體光源模組與第二發光二極體光源模組的一實施例結構示意圖)。The circuit board assembly 104 disclosed in the first embodiment, the second embodiment, and the third embodiment may include, but is not limited to, two single-sided circuit boards (the first circuit board 302 and the second circuit board 306). In other words, the circuit board assembly 104 can be a double-sided circuit board, and the first light-emitting diode light source module 108 can configure the first light-emitting diode chip 32 on the first package body 30 by using a wafer direct packaging process. Between the first surfaces 52, the second LED light source module 110 can be disposed between the second package body 40 and the second surface 54 by using a wafer direct packaging process (refer to FIG. 8 is a cross-sectional structural view of a fourth embodiment of a light-emitting diode bulb according to the present invention and the first according to FIG. 8 A schematic diagram of an embodiment of a light emitting diode light source module and a second light emitting diode light source module).
請參照「第8圖」,係為依據本發明所揭露之發光二極體燈泡的第四實施例剖面結構示意圖。發光二極體燈泡100包括電路板組件104、基座106、第一發光二極體光源模組108、第二發光二極體光源模組110與殼體112。其中,基座106包括反射單元102,反射單元102具有反射面72,電路板組件104包括彼此相對的第一表面52與第二表面54。反射單元102配置於基座106,第一發光二極體光源模組108配置於第一表面52上。第二發光二極體光源模組110配置於第二表面54上,並可環繞基座106與電路板組件104的連接處M。殼體112接合基座106。Please refer to FIG. 8 , which is a cross-sectional structural view of a fourth embodiment of a light-emitting diode bulb according to the present invention. The LED bulb 100 includes a circuit board assembly 104, a pedestal 106, a first illuminating diode light source module 108, a second illuminating diode light source module 110, and a housing 112. Wherein, the pedestal 106 includes a reflective unit 102 having a reflective surface 72, and the circuit board assembly 104 includes a first surface 52 and a second surface 54 opposite each other. The reflection unit 102 is disposed on the base 106 , and the first LED light source module 108 is disposed on the first surface 52 . The second LED light source module 110 is disposed on the second surface 54 and surrounds the junction M of the base 106 and the circuit board assembly 104. The housing 112 engages the base 106.
請參照「第9A圖」與「第9B圖」,電路板組件104係可為但不限於雙面圓形電路板。也就是說,電路板組件104亦可為雙面方形電路板。第一發光二極體光源模組108可包括但不限於八個第一發光二極體晶片32與第一封裝體30,但本實施例並非用以限定本發明。也就是說,第一發光二極體光源模組108亦可包括十個第一發光二極體晶片32,第一發光二極體光源模組108所包括第一發光二極體晶片32的數量可依據實際需求進行調整。其中,每一第一發光二極體晶片32可配置於第一封裝體30與第一表面52之間(即利用晶片直接封裝(Chip On Board,COB)製程將第一發光二極體光源模組108配置於電路板組件104的第一表面52上),且第一發光二極體晶片32係可以環形的排列方式配置於第一表面52上,但本實施例並非用以限定本發明。換句話說,第一發光二極體晶片32亦可以陣列的排列方式配置於第一表面52上,第一發光二極體晶片32的排列方式可依據實際需求進行調整。其中,第一發光二極體晶片32可皆為紅光發光二極體晶片,但本實施例並非用以限定本發明。也就是說,第一發光二極體晶片32亦可部分為紅光發光二極體晶片,部分為藍光發光二極體晶片,部分為綠光發光二極體晶片,可依據實際需求進行調整。Referring to "FIG. 9A" and "FIG. 9B", the circuit board assembly 104 can be, but is not limited to, a double-sided circular circuit board. That is, the circuit board assembly 104 can also be a double-sided square circuit board. The first light emitting diode light source module 108 can include, but is not limited to, eight first light emitting diode chips 32 and the first package body 30, but the embodiment is not intended to limit the present invention. In other words, the first LED light source module 108 can also include ten first LED chips 32, and the first LED body 108 includes the number of the first LED chips 32. It can be adjusted according to actual needs. Each of the first LED chips 32 can be disposed between the first package body 30 and the first surface 52 (ie, the first LED light source module is formed by a Chip On Board (COB) process. The group 108 is disposed on the first surface 52 of the circuit board assembly 104, and the first LED array 32 is disposed on the first surface 52 in a ring-like arrangement, but the embodiment is not intended to limit the present invention. In other words, the first LED chips 32 can also be arranged on the first surface 52 in an array arrangement. The arrangement of the first LED chips 32 can be adjusted according to actual needs. The first LED chip 32 can be a red light emitting diode chip, but the embodiment is not intended to limit the present invention. That is to say, the first LED chip 32 can also be partially a red light emitting diode chip, a part of a blue light emitting diode chip, and a part of a green light emitting diode chip, which can be adjusted according to actual needs.
第二發光二極體光源模組110可包括但不限於八個第二發光二極體晶片42與第二封裝體40,但本實施例並非用以限定本發明。也就是說,第二發光二極體光源模組110亦可包括十個第一發光二極體晶片42,第二發光二極體光源模組110所包括第二發光二極體晶片42的數量可依據實際需求進行調整。其中,每一第二發光二極體晶片42可配置於第二封裝體40與第二表面54之間(即利用晶片直接封裝(Chip On Board,COB)製程將第二發光二極體光源模組110配置於電路板組件104的第二表面54上),且第二發光二極體晶片42係以環形的排列方式環繞連接處M,但本實施例並非用以限定本發明。換句話說,第二發光二極體晶片42亦可以方形的排列方式環繞連接處M,第二發光二極體晶片42的排列方式可依據實際需求進行調整。其中,第二發光二極體晶片42可皆為紅光發光二極體晶片,但本實施例並非用以限定本發明。也就是說,第二發光二極體晶片42亦可部分為紅光發光二極體晶片,部分為藍光發光二極體晶片,部分為綠光發光二極體晶片,可依據實際需求進行調整。The second LED light source module 110 can include, but is not limited to, the eight second LED chips 42 and the second package 40, but the embodiment is not intended to limit the present invention. In other words, the second LED light source module 110 can also include ten first LED chips 42 , and the second LED light source module 110 includes the second LED chips 42 . It can be adjusted according to actual needs. Each of the second LED chips 42 can be disposed between the second package 40 and the second surface 54 (ie, the second LED light source module is processed by a Chip On Board (COB) process. The set 110 is disposed on the second surface 54 of the circuit board assembly 104, and the second LED array 42 surrounds the joint M in an annular arrangement, but this embodiment is not intended to limit the invention. In other words, the second LED chip 42 can also surround the connection M in a square arrangement, and the arrangement of the second LED chips 42 can be adjusted according to actual needs. The second LED chips 42 may all be red light emitting diode chips, but the embodiment is not intended to limit the present invention. That is to say, the second LED chip 42 can also be partially a red light emitting diode chip, a part of a blue light emitting diode chip, and a part of a green light emitting diode chip, which can be adjusted according to actual needs.
請參照「第8圖」,第二發光二極體光源模組110更包括基準軸90,且基準軸90平行第二表面54。在本實施例中,反射光束121與基準軸90之間的第一夾角θ1 可介於但不限於零度至一百二十度之間,使得反射光束121被反射面72反射並自殼體112出射。直射光束122與基準軸90之間的第二夾角θ2 可介於但不限於一百二十度至一百八十度之間,使得直射光束122直接自殼體112出射。Referring to FIG. 8 , the second LED light source module 110 further includes a reference axis 90 , and the reference axis 90 is parallel to the second surface 54 . In the present embodiment, the first angle θ 1 between the reflected beam 121 and the reference axis 90 may be between, but not limited to, between zero and one hundred and twenty degrees, such that the reflected beam 121 is reflected by the reflective surface 72 and is self-contained. 112 out. The second angle θ 2 between the direct beam 122 and the reference axis 90 may be, but is not limited to, between one hundred and twenty degrees to one hundred and eighty degrees such that the direct beam 122 exits directly from the housing 112.
在本實施例中,第一發光二極體光源模組108可具有第一光通量L1 ,第二發光二極體光源模組110可具有第二光通量L2 ,發光二極體燈泡100更可包括但不限於控制單元82,控制單元82可用以控制第一光通量L1 與第二光通量L2 。此外,第一發光二極體光源模組108亦可藉由控制單元82控制每一第一發光二極體晶片32所發出第一光束11的顏色,例如但不限於紅光、綠光或藍光。第二發光二極體光源模組110亦可藉由控制單元82控制每一第二發光二極體晶片42所發出第二光束12的顏色,例如但不限於紅光、綠光或藍光。當發光二極體燈泡100用以輸出白光時,控制單元82可控制每一第一發光二極體晶片32與每一第二發光二極體晶片42所分別發出第一光束11與第二光束12的顏色,使第一光束11與第二光束12為白色光束,但本實施例並非用以限定本發明。舉例而言,第一封裝體30與第二封裝體40另可包括螢光粉(未繪製)或者殼體112另可包括螢光粉(未繪製)或螢光膜(未繪製),使得控制單元82控制每一第一發光二極體晶片32與每一第二發光二極體晶片42所分別發出第一光束11與第二光束12的顏色為特定色光,而螢光粉被第一光束11與第二光束12激發後輸出與特定色光為互補色的光束,進而使得光二極體燈泡100輸出白光。In this embodiment, the first light emitting diode light source module 108 can have a first light flux L 1 , and the second light emitting diode light source module 110 can have a second light flux L 2 , and the light emitting diode bulb 100 can be further including but not limited to a control unit 82, control unit 82 may be used to control the first light flux and second light flux L 1 L 2. In addition, the first LED light source module 108 can also control the color of the first light beam 11 emitted by each of the first LED chips 32 by the control unit 82, such as but not limited to red light, green light or blue light. . The second LED light source module 110 can also control the color of the second light beam 12 emitted by each of the second LED chips 42 by the control unit 82, such as, but not limited to, red light, green light or blue light. When the LED lamp 100 is used to output white light, the control unit 82 can control each of the first LED chip 32 and each of the second LED chips 42 to emit a first beam 11 and a second beam, respectively. The color of 12 is such that the first beam 11 and the second beam 12 are white beams, but this embodiment is not intended to limit the invention. For example, the first package body 30 and the second package body 40 may further include phosphor powder (not drawn) or the housing 112 may further include phosphor powder (not drawn) or a fluorescent film (not drawn), so that the control The unit 82 controls the color of the first light beam 11 and the second light beam 12 of each of the first light emitting diode chips 32 and each of the second light emitting diode chips 42 to be a specific color light, and the phosphor powder is the first light beam. 11 and the second light beam 12 is excited to output a light beam that is complementary to a specific color light, thereby causing the light diode bulb 100 to output white light.
上述第四實施例所揭露之電路板組件104係可為雙面電路板,第一發光二極體光源模組108係可利用晶片直接封裝製程將第一發光二極體晶片32配置於第一封裝體30與第一表面52之間,第二發光二極體光源模組110係可利用晶片直接封裝製程將第二發光二極體晶片42配置於第二封裝體40與第二表面54之間,但第四實施例並非用以限定本發明。換句話說,電路板組件104係可包括第一電路板202與第二電路板204,第一電路板包括第一表面52與第三表面92,第二電路板204包括第二表面54與第四表面94,第三表面92與第四表面94面對面(請參照「第10圖」、「第11A圖」與「第11B圖」,係分別為依據本發明所揭露之發光二極體燈泡的第五實施例剖面結構示意圖以及依據「第10圖」之第一發光二極體光源模組與第二發光二極體光源模組的一實施例結構示意圖)。The circuit board assembly 104 disclosed in the fourth embodiment may be a double-sided circuit board, and the first light-emitting diode light source module 108 may be configured to first configure the first light-emitting diode chip 32 by using a wafer direct packaging process. Between the package body 30 and the first surface 52, the second LED light source module 110 can dispose the second LED body 42 on the second package body 40 and the second surface 54 by using a wafer direct packaging process. The fourth embodiment is not intended to limit the invention. In other words, the circuit board assembly 104 can include a first circuit board 202 and a second circuit board 204, the first circuit board including the first surface 52 and the third surface 92, and the second circuit board 204 including the second surface 54 and the The four surfaces 94, the third surface 92 and the fourth surface 94 face each other (refer to "10th drawing", "11A" and "11B", respectively, which are the light-emitting diode bulbs according to the present invention. A cross-sectional structural view of a fifth embodiment and a schematic structural view of an embodiment of a first light-emitting diode light source module and a second light-emitting diode light source module according to FIG.
請參照「第10圖」,第一電路板202與第二電路板204可分別為但不限於單面電路板。需注意的是,第一電路板202的第三表面92與第二電路板204的第四表面94可互相疊合。Referring to FIG. 10, the first circuit board 202 and the second circuit board 204 can be, but are not limited to, a single-sided circuit board. It should be noted that the third surface 92 of the first circuit board 202 and the fourth surface 94 of the second circuit board 204 may overlap each other.
請參照「第11A圖」與「第11B圖」。第一發光二極體光源模組108可包括但不限於八個第一發光二極體晶片32與第一封裝體30,但本實施例並非用以限定本發明。也就是說,第一發光二極體光源模組108亦可包括十個第一發光二極體晶片32,第一發光二極體光源模組108所包括第一發光二極體晶片32的數量可依據實際需求進行調整。其中,每一第一發光二極體晶片32可配置於第一封裝體30與第一表面52之間(即利用晶片直接封裝(Chip On Board,COB)製程將第一發光二極體光源模組108配置於電路板組件104的第一表面52上),且第一發光二極體晶片32係可以環形的排列方式配置於第一表面52上,但本實施例並非用以限定本發明。換句話說,第一發光二極體晶片32亦可以陣列的排列方式配置於第一表面52上,第一發光二極體晶片32的排列方式可依據實際需求進行調整。其中,第一發光二極體晶片32可皆為紅光發光二極體晶片,但本實施例並非用以限定本發明。也就是說,第一發光二極體晶片32亦可部分為紅光發光二極體晶片,部分為藍光發光二極體晶片,部分為綠光發光二極體晶片,可依據實際需求進行調整。Please refer to "11A" and "11B". The first light emitting diode light source module 108 can include, but is not limited to, eight first light emitting diode chips 32 and the first package body 30, but the embodiment is not intended to limit the present invention. In other words, the first LED light source module 108 can also include ten first LED chips 32, and the first LED body 108 includes the number of the first LED chips 32. It can be adjusted according to actual needs. Each of the first LED chips 32 can be disposed between the first package body 30 and the first surface 52 (ie, the first LED light source module is formed by a Chip On Board (COB) process. The group 108 is disposed on the first surface 52 of the circuit board assembly 104, and the first LED array 32 is disposed on the first surface 52 in a ring-like arrangement, but the embodiment is not intended to limit the present invention. In other words, the first LED chips 32 can also be arranged on the first surface 52 in an array arrangement. The arrangement of the first LED chips 32 can be adjusted according to actual needs. The first LED chip 32 can be a red light emitting diode chip, but the embodiment is not intended to limit the present invention. That is to say, the first LED chip 32 can also be partially a red light emitting diode chip, a part of a blue light emitting diode chip, and a part of a green light emitting diode chip, which can be adjusted according to actual needs.
第二發光二極體光源模組110可包括但不限於八個第二發光二極體晶片42與第二封裝體40,但本實施例並非用以限定本發明。也就是說,第二發光二極體光源模組110亦可包括十個第一發光二極體晶片42,第二發光二極體光源模組110所包括第二發光二極體晶片42的數量可依據實際需求進行調整。其中,每一第二發光二極體晶片42可配置於第二封裝體40與第二表面54之間(即利用晶片直接封裝(Chip On Board,COB)製程將第二發光二極體光源模組110配置於電路板組件104的第二表面54上),且第二發光二極體晶片42係以環形的排列方式環繞連接處M,但本實施例並非用以限定本發明。換句話說,第二發光二極體晶片42亦可以方形的排列方式環繞連接處M,第二發光二極體晶片42的排列方式可依據實際需求進行調整。其中,第二發光二極體晶片42可皆為紅光發光二極體晶片,但本實施例並非用以限定本發明。也就是說,第二發光二極體晶片42亦可部分為紅光發光二極體晶片,部分為藍光發光二極體晶片,部分為綠光發光二極體晶片,可依據實際需求進行調整。The second LED light source module 110 can include, but is not limited to, the eight second LED chips 42 and the second package 40, but the embodiment is not intended to limit the present invention. In other words, the second LED light source module 110 can also include ten first LED chips 42 , and the second LED light source module 110 includes the second LED chips 42 . It can be adjusted according to actual needs. Each of the second LED chips 42 can be disposed between the second package 40 and the second surface 54 (ie, the second LED light source module is processed by a Chip On Board (COB) process. The set 110 is disposed on the second surface 54 of the circuit board assembly 104, and the second LED array 42 surrounds the joint M in an annular arrangement, but this embodiment is not intended to limit the invention. In other words, the second LED chip 42 can also surround the connection M in a square arrangement, and the arrangement of the second LED chips 42 can be adjusted according to actual needs. The second LED chips 42 may all be red light emitting diode chips, but the embodiment is not intended to limit the present invention. That is to say, the second LED chip 42 can also be partially a red light emitting diode chip, a part of a blue light emitting diode chip, and a part of a green light emitting diode chip, which can be adjusted according to actual needs.
此外,請參照「第12圖」,係為依據本發明所揭露之發光二極體燈泡的第六實施例剖面結構示意圖。在本實施例中,發光二極體燈泡100包括電路板組件104、基座106、第一發光二極體光源模組108、第二發光二極體光源模組110與殼體112。其中,基座106包括反射單元102,反射單元102具有反射面72,電路板組件104可包括第一電路板302、第二電路板306與基板410,第一電路板302可包括第一表面52與第三表面96,第二電路板306可包括第二表面54與第四表面98,第三表面96與第四表面98可配置於基板410的相對二側面,反射單元102配置於基座106。第一發光二極體光源模組108配置於第一表面52上。第二發光二極體光源模組110配置於第二表面54上,並可環繞基座106與電路板組件104的連接處M。殼體112接合基座106。In addition, please refer to FIG. 12, which is a cross-sectional structural view of a sixth embodiment of a light-emitting diode bulb according to the present invention. In this embodiment, the LED bulb 100 includes a circuit board assembly 104, a pedestal 106, a first illuminating diode light source module 108, a second illuminating diode light source module 110, and a housing 112. The pedestal 106 includes a reflective unit 102 having a reflective surface 72. The circuit board assembly 104 can include a first circuit board 302, a second circuit board 306, and a substrate 410. The first circuit board 302 can include a first surface 52. The third circuit board 306 can include a second surface 54 and a fourth surface 98. The third surface 96 and the fourth surface 98 can be disposed on opposite sides of the substrate 410. The reflective unit 102 is disposed on the base 106. . The first LED light source module 108 is disposed on the first surface 52. The second LED light source module 110 is disposed on the second surface 54 and surrounds the junction M of the base 106 and the circuit board assembly 104. The housing 112 engages the base 106.
第一發光二極體光源模組108用以發射第一光束11,第二發光二極體光源模組110用以發射第二光束12,第二光束12包括反射光束121與直射光束122。第一光束11直接自殼體112出射,反射光束121被反射面72反射並自殼體112出射,直射光束122直接自殼體112出射。The first light emitting diode light source module 108 is configured to emit a first light beam 11 , and the second light emitting diode light source module 110 is configured to emit a second light beam 12 , and the second light beam 12 includes a reflected light beam 121 and a direct light beam 122 . The first beam 11 exits directly from the housing 112, the reflected beam 121 is reflected by the reflecting surface 72 and exits from the housing 112, and the direct beam 122 exits directly from the housing 112.
其中,第二發光二極體光源模組110更包括基準軸90,且基準軸90平行第二表面54。在本實施例中,反射光束121與基準軸90之間的第一夾角θ1 可介於但不限於零度至一百二十度之間,使得反射光束121被反射面72反射並自殼體112出射。直射光束122與基準軸90之間的第二夾角θ2 可介於但不限於一百二十度至一百八十度之間,使得直射光束122直接自殼體112出射。The second LED light source module 110 further includes a reference axis 90 , and the reference axis 90 is parallel to the second surface 54 . In the present embodiment, the first angle θ 1 between the reflected beam 121 and the reference axis 90 may be between, but not limited to, between zero and one hundred and twenty degrees, such that the reflected beam 121 is reflected by the reflective surface 72 and is self-contained. 112 out. The second angle θ 2 between the direct beam 122 and the reference axis 90 may be, but is not limited to, between one hundred and twenty degrees to one hundred and eighty degrees such that the direct beam 122 exits directly from the housing 112.
此外,在本實施例中,第一發光二極體光源模組108與第二發光二極體光源模組110的實施方式可與第一實施例(如「第4A圖」與「第4B圖」所示)相同,於此不再贅述。In addition, in this embodiment, the first light emitting diode light source module 108 and the second light emitting diode light source module 110 can be implemented in the same manner as the first embodiment (for example, "4A" and "4B". The same is shown here, and will not be repeated here.
上述控制單元82除了可用以控制第一光通量L1 、第二光通量L2 、每一第一發光二極體封裝結構84所發出第一光束11的顏色、 每一第二發光二極體封裝結構86所發出第二光束12的顏色、每一第一發光二極體晶片32所發出第一光束11的顏色與每一第二發光二極體晶片42所發出第一光束11的顏色外,更可選擇性地致動第一發光二極體光源模組108或第二發光二極體光源模組110。當控制單元82僅致動第一發光二極體光源模組108時(即第一發光二極體光源模組108發出第一光束11),可用以取代習知發光二極體燈泡。當控制單元82僅致動第二發光二極體光源模組110時(即第二發光二極體光源模組110發出第二光束12),可使用於間接照明。當控制單元82同時致動第一發光二極體光源模組108與第二發光二極體光源模組110時(即第一發光二極體光源模組108發出第一光束11且第二發光二極體光源模組110發出第二光束12),可用以取代習知白熾燈泡。The control unit 82 can be used to control the first luminous flux L 1 , the second luminous flux L 2 , the color of the first light beam 11 emitted by each first LED package structure 84, and each second LED package structure. 86, the color of the second light beam 12, the color of the first light beam 11 emitted by each of the first light emitting diode chips 32, and the color of the first light beam 11 emitted by each of the second light emitting diode chips 42 The first light emitting diode light source module 108 or the second light emitting diode light source module 110 can be selectively activated. When the control unit 82 only activates the first LED light source module 108 (ie, the first LED light source module 108 emits the first light beam 11), it can be used to replace the conventional LED bulb. When the control unit 82 only activates the second light emitting diode light source module 110 (ie, the second light emitting diode light source module 110 emits the second light beam 12), it can be used for indirect illumination. When the control unit 82 simultaneously activates the first LED light source module 108 and the second LED light source module 110 (ie, the first LED light source module 108 emits the first light beam 11 and the second illumination The diode light source module 110 emits a second light beam 12) that can be used in place of a conventional incandescent light bulb.
依據本發明所揭露之發光二極體燈泡,可藉由調整反射面與第二發光二極體光源模組的設計,使得第二光束中的直射光束與反射光束可補償第一光分佈型態,進而使本發明所揭露之發光二極體燈泡為全向性光源。可藉由控制單元控制第一發光二極體光源模組與第二發光二極體光源模組所輸出的第一光束與第二光束的顏色、第一光通量與第二光通量的比值以及選擇性地致動第一發光二極體光源模組或第二發光二極體光源模組。可藉由基板與基座將發光二極體燈泡導通時所產生的熱能散發至外在環境中。其中,反射面可配置於基座或殼體,第一發光二極體光源模組可利用晶片直接封裝製程將多個第一發光二極體晶片配置於第一表面上或利用多個第一發光二極體封裝結構配置於第一表面上;第二發光二極體光源模組可利用晶片直接封裝製程將多個第二發光二極體晶片配置於第二表面上或利用多個第二發光二極體封裝結構配置於第二表面上。According to the light-emitting diode bulb disclosed in the present invention, the direct light beam and the reflected light beam in the second light beam can compensate the first light distribution pattern by adjusting the design of the reflective surface and the second light-emitting diode light source module. Further, the light-emitting diode bulb disclosed in the present invention is an omnidirectional light source. The color, the ratio of the first light flux and the second light flux, and the selectivity of the first light beam and the second light beam output by the first light emitting diode light source module and the second light emitting diode light source module may be controlled by the control unit The first light emitting diode light source module or the second light emitting diode light source module is actuated. The heat energy generated when the light-emitting diode bulb is turned on by the substrate and the pedestal can be radiated to the external environment. The reflective surface can be disposed on the pedestal or the housing, and the first illuminating diode light source module can be configured on the first surface by using a wafer direct packaging process or by using a plurality of first The light emitting diode package structure is disposed on the first surface; the second light emitting diode light source module can use the wafer direct packaging process to configure the plurality of second light emitting diode chips on the second surface or utilize the plurality of second The light emitting diode package structure is disposed on the second surface.
雖然本發明以前述的較佳實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,因此本發明的專利保護範圍須視本說明書所附的申請專利範圍所界定者為準。While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of patent protection of the invention is subject to the definition of the scope of the patent application attached to this specification.
11...第一光束11. . . First beam
12...第二光束12. . . Second beam
22...燈泡接頭twenty two. . . Light bulb connector
30...第一封裝體30. . . First package
32...第一發光二極體晶片32. . . First light emitting diode chip
40...第二封裝體40. . . Second package
42...第二發光二極體晶片42. . . Second light emitting diode chip
52...第一表面52. . . First surface
54...第二表面54. . . Second surface
56、92、96...第三表面56, 92, 96. . . Third surface
58、94、98...第四表面58, 94, 98. . . Fourth surface
72...反射面72. . . Reflective surface
80a...第一容置空間80a. . . First accommodation space
80b...第二容置空間80b. . . Second accommodation space
82...控制單元82. . . control unit
84...第一發光二極體封裝結構84. . . First light emitting diode package structure
86...第二發光二極體封裝結構86. . . Second light emitting diode package structure
90...基準軸90. . . Reference axis
100...發光二極體燈泡100. . . Light-emitting diode bulb
102...反射單元102. . . Reflection unit
104...電路板組件104. . . Board assembly
106...基座106. . . Pedestal
108...第一發光二極體光源模組108. . . First light emitting diode light source module
110...第二發光二極體光源模組110. . . Second light emitting diode light source module
112‧‧‧殼體112‧‧‧Shell
112a‧‧‧第一殼體112a‧‧‧First housing
112b‧‧‧第二殼體112b‧‧‧second housing
121‧‧‧反射光束121‧‧‧Reflected beam
122‧‧‧直射光束122‧‧‧Direct beam
202、302‧‧‧第一電路板202, 302‧‧‧ first board
204、306‧‧‧第二電路板204, 306‧‧‧ second circuit board
304、410‧‧‧基板304, 410‧‧‧ substrate
401、403、405‧‧‧第一負極401, 403, 405‧‧‧ first negative
402、404、406‧‧‧第一正極402, 404, 406‧‧‧ first positive
407‧‧‧第一本體407‧‧‧First Ontology
408、510‧‧‧透鏡408, 510‧ ‧ lens
501、503、505、507‧‧‧第二負極501, 503, 505, 507‧‧‧ second negative
502、504、506、508‧‧‧第二正極502, 504, 506, 508‧‧‧ second positive
509‧‧‧第二本體509‧‧‧Second ontology
θ1 ‧‧‧第一夾角θ 1 ‧‧‧first angle
θ2 ‧‧‧第二夾角θ 2 ‧‧‧second angle
第1圖係為習知白熾燈泡於第一平面、第二平面與第三平面的光分佈型態。Figure 1 is a light distribution pattern of a conventional incandescent bulb in a first plane, a second plane, and a third plane.
第2A圖係為依據本發明所揭露之發光二極體燈泡的第一實施例立體結構示意圖。2A is a schematic perspective view showing a first embodiment of a light-emitting diode bulb according to the present invention.
第2B圖係為依據第2A圖之發光二極體燈泡的一實施例剖面結構示意圖。Fig. 2B is a schematic cross-sectional view showing an embodiment of the light-emitting diode bulb according to Fig. 2A.
第2C圖係為依據本發明所揭露之發光二極體燈泡的第二實施例剖面結構示意圖。2C is a cross-sectional structural view showing a second embodiment of the light-emitting diode bulb according to the present invention.
第3A圖係為依據第2B圖之發光二極體燈泡的一實施例第一光分佈型態示意圖。Fig. 3A is a schematic view showing the first light distribution pattern of an embodiment of the light-emitting diode bulb according to Fig. 2B.
第3B圖係為依據第2B圖之發光二極體燈泡的一實施例第二光分佈型態示意圖。Fig. 3B is a schematic view showing a second light distribution pattern of an embodiment of the light-emitting diode bulb according to Fig. 2B.
第3C圖係為依據第2B圖之發光二極體燈泡的一實施例第三光分佈型態示意圖。Fig. 3C is a schematic view showing a third light distribution pattern of an embodiment of the light-emitting diode bulb according to Fig. 2B.
第3D圖係為依據第2B圖之發光二極體燈泡的一實施例全向性光分佈型態示意圖。The 3D figure is a schematic diagram of an omnidirectional light distribution pattern of an embodiment of the light-emitting diode bulb according to FIG. 2B.
第4A圖係為依據第2B圖之第一發光二極體光源模組配置於第一表面的一實施例結構示意圖。FIG. 4A is a schematic structural view of an embodiment of the first light emitting diode light source module disposed on the first surface according to FIG. 2B.
第4B圖係為依據第2B圖之第二發光二極體光源模組配置於第二表面的一實施例結構示意圖。FIG. 4B is a schematic structural view of an embodiment of the second light emitting diode light source module disposed on the second surface according to FIG. 2B.
第5A圖係為依據第2B圖之第一發光二極體封裝結構的一實施例結構示意圖。FIG. 5A is a schematic structural view of an embodiment of a first light emitting diode package structure according to FIG. 2B.
第5B圖係為依據第2B圖之第二發光二極體封裝結構的一實施例結構示意圖。FIG. 5B is a schematic structural view of an embodiment of a second light emitting diode package structure according to FIG. 2B.
第6A圖係為第2B圖之發光二極體燈泡的第一光通量與第二光通量的比值為0.1時於第一平面與第三平面的光分布形態。Fig. 6A is a view showing the light distribution pattern on the first plane and the third plane when the ratio of the first luminous flux to the second luminous flux of the light-emitting diode bulb of Fig. 2B is 0.1.
第6B圖係為第2B圖之發光二極體燈泡的第一光通量與第二光通量的比值為0.2時於第一平面與第三平面的光分布形態。Fig. 6B is a view showing the light distribution pattern on the first plane and the third plane when the ratio of the first luminous flux to the second luminous flux of the light-emitting diode bulb of Fig. 2B is 0.2.
第6C圖係為第2B圖之發光二極體燈泡的第一光通量與第二光通量的比值為0.3時於第一平面與第三平面的光分布形態。Fig. 6C is a view showing the light distribution pattern on the first plane and the third plane when the ratio of the first luminous flux to the second luminous flux of the light-emitting diode bulb of Fig. 2B is 0.3.
第6D圖係為第2B圖之發光二極體燈泡的第一光通量與第二光通量的比值為0.5時於第一平面與第三平面的光分布形態。Fig. 6D is a light distribution pattern of the first plane and the third plane when the ratio of the first luminous flux to the second luminous flux of the light-emitting diode bulb of Fig. 2B is 0.5.
第6E圖係為第2B圖之發光二極體燈泡的第一光通量與第二光通量的比值為0.7時於第一平面與第三平面的光分布形態。Fig. 6E is a view showing the light distribution pattern on the first plane and the third plane when the ratio of the first luminous flux to the second luminous flux of the light-emitting diode bulb of Fig. 2B is 0.7.
第6F圖係為第2B圖之發光二極體燈泡的第一光通量與第二光通量的比值為1.0時於第一平面與第三平面的光分布形態。Fig. 6F is a view showing a light distribution pattern on the first plane and the third plane when the ratio of the first luminous flux to the second luminous flux of the light-emitting diode bulb of Fig. 2B is 1.0.
第6G圖係為第2B圖之發光二極體燈泡的第一光通量與第二光通量的比值為1.5時於第一平面與第三平面的光分布形態。Fig. 6G is a view showing the light distribution pattern on the first plane and the third plane when the ratio of the first luminous flux to the second luminous flux of the light-emitting diode bulb of Fig. 2B is 1.5.
第7圖係為依據本發明所揭露之發光二極體燈泡的第三實施例剖面結構示意圖。Figure 7 is a schematic cross-sectional view showing a third embodiment of a light-emitting diode bulb according to the present invention.
第8圖係為依據本發明所揭露之發光二極體燈泡的第四實施例剖面結構示意圖。Figure 8 is a cross-sectional structural view showing a fourth embodiment of a light-emitting diode bulb according to the present invention.
第9A圖係為依據第8圖之第一發光二極體光源模組的一實施例結構示意圖。FIG. 9A is a schematic structural view of an embodiment of the first light emitting diode light source module according to FIG. 8 .
第9B圖係為依據第8圖之第二發光二極體光源模組的一實施例結構示意圖。FIG. 9B is a schematic structural view of an embodiment of the second light emitting diode light source module according to FIG. 8 .
第10圖係為依據本發明所揭露之發光二極體燈泡的第五實施例剖面結構示意圖。Figure 10 is a cross-sectional structural view showing a fifth embodiment of a light-emitting diode bulb according to the present invention.
第11A圖係為依據第10圖之第一發光二極體光源模組配置於第一表面的一實施例結構示意圖。FIG. 11A is a schematic structural view of an embodiment of the first light emitting diode light source module disposed on the first surface according to FIG. 10 .
第11B圖係為依據第10圖之第二發光二極體光源模組配置於第二表面的一實施例結構示意圖。11B is a schematic structural view of an embodiment in which the second light emitting diode light source module according to FIG. 10 is disposed on the second surface.
第12圖係為依據本發明所揭露之發光二極體燈泡的第六實施例剖面結構示意圖。Figure 12 is a cross-sectional structural view showing a sixth embodiment of a light-emitting diode bulb according to the present invention.
11‧‧‧第一光束11‧‧‧First beam
12‧‧‧第二光束12‧‧‧second beam
52‧‧‧第一表面52‧‧‧ first surface
54‧‧‧第二表面54‧‧‧second surface
56‧‧‧第三表面56‧‧‧ third surface
58‧‧‧第四表面58‧‧‧ fourth surface
72‧‧‧反射面72‧‧‧reflecting surface
80a‧‧‧第一容置空間80a‧‧‧First accommodation space
80b‧‧‧第二容置空間80b‧‧‧Second space
82‧‧‧控制單元82‧‧‧Control unit
84‧‧‧第一發光二極體封裝結構84‧‧‧First LED package structure
86‧‧‧第二發光二極體封裝結構86‧‧‧Second light-emitting diode package structure
90‧‧‧基準軸90‧‧‧reference axis
100‧‧‧發光二極體燈泡100‧‧‧Lighting diode bulb
102‧‧‧反射單元102‧‧‧Reflective unit
104‧‧‧電路板組件104‧‧‧Circuit board assembly
106‧‧‧基座106‧‧‧Base
108‧‧‧第一發光二極體光源模組108‧‧‧First light-emitting diode light source module
110‧‧‧第二發光二極體光源模組110‧‧‧Second light-emitting diode light source module
112‧‧‧殼體112‧‧‧Shell
112a‧‧‧第一殼體112a‧‧‧First housing
112b‧‧‧第二殼體112b‧‧‧second housing
121‧‧‧反射光束121‧‧‧Reflected beam
122‧‧‧直射光束122‧‧‧Direct beam
302‧‧‧第一電路板302‧‧‧First board
304‧‧‧基板304‧‧‧Substrate
306‧‧‧第二電路板306‧‧‧Second circuit board
θ1 ‧‧‧第一夾角θ 1 ‧‧‧first angle
θ2 ‧‧‧第二夾角θ 2 ‧‧‧second angle
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW100131775A TWI451036B (en) | 2011-09-02 | 2011-09-02 | Light-emitting diode bulb |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100131775A TWI451036B (en) | 2011-09-02 | 2011-09-02 | Light-emitting diode bulb |
Publications (2)
Publication Number | Publication Date |
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TW201312039A TW201312039A (en) | 2013-03-16 |
TWI451036B true TWI451036B (en) | 2014-09-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW100131775A TWI451036B (en) | 2011-09-02 | 2011-09-02 | Light-emitting diode bulb |
Country Status (1)
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TW (1) | TWI451036B (en) |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5929788A (en) * | 1997-12-30 | 1999-07-27 | Star Headlight & Lantern Co. | Warning beacon |
US20030227774A1 (en) * | 2002-06-10 | 2003-12-11 | Martin Paul S. | Axial LED source |
TWM247762U (en) * | 2003-12-24 | 2004-10-21 | Chia-Yi Chen | Light emitting diode of caution light |
TWM259122U (en) * | 2004-06-30 | 2005-03-11 | Haozhen Entpr Co Ltd | LED lamp |
CN1610137A (en) * | 2003-10-17 | 2005-04-27 | 西铁城电子股份有限公司 | White light emitting diode |
TWM264656U (en) * | 2004-07-08 | 2005-05-11 | Kai-Bo Chen | LED illumination apparatus |
TW200720587A (en) * | 2005-11-24 | 2007-06-01 | Ind Tech Res Inst | Illumination module |
JP2007200877A (en) * | 2005-12-27 | 2007-08-09 | Showa Denko Kk | Light guide member, surface light source device, and display device |
TW200842456A (en) * | 2007-04-19 | 2008-11-01 | Chi Mei Optoelectronics Corp | Liquid crystal display and side-type backlight module thereof |
TW200909722A (en) * | 2007-08-21 | 2009-03-01 | Next Generation Lighting Source Co Ltd | Hybrid lighting source |
TW200923272A (en) * | 2007-11-20 | 2009-06-01 | Lustrous Technology Ltd | LED lamp with adjustable chromaticity |
TWM371846U (en) * | 2009-08-27 | 2010-01-01 | Trend Lighting Corp | Light source device |
TW201120345A (en) * | 2009-12-10 | 2011-06-16 | Hon Hai Prec Ind Co Ltd | LED illuminating device |
-
2011
- 2011-09-02 TW TW100131775A patent/TWI451036B/en not_active IP Right Cessation
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5929788A (en) * | 1997-12-30 | 1999-07-27 | Star Headlight & Lantern Co. | Warning beacon |
US20030227774A1 (en) * | 2002-06-10 | 2003-12-11 | Martin Paul S. | Axial LED source |
CN1610137A (en) * | 2003-10-17 | 2005-04-27 | 西铁城电子股份有限公司 | White light emitting diode |
TWM247762U (en) * | 2003-12-24 | 2004-10-21 | Chia-Yi Chen | Light emitting diode of caution light |
TWM259122U (en) * | 2004-06-30 | 2005-03-11 | Haozhen Entpr Co Ltd | LED lamp |
TWM264656U (en) * | 2004-07-08 | 2005-05-11 | Kai-Bo Chen | LED illumination apparatus |
TW200720587A (en) * | 2005-11-24 | 2007-06-01 | Ind Tech Res Inst | Illumination module |
JP2007200877A (en) * | 2005-12-27 | 2007-08-09 | Showa Denko Kk | Light guide member, surface light source device, and display device |
TW200842456A (en) * | 2007-04-19 | 2008-11-01 | Chi Mei Optoelectronics Corp | Liquid crystal display and side-type backlight module thereof |
TW200909722A (en) * | 2007-08-21 | 2009-03-01 | Next Generation Lighting Source Co Ltd | Hybrid lighting source |
TW200923272A (en) * | 2007-11-20 | 2009-06-01 | Lustrous Technology Ltd | LED lamp with adjustable chromaticity |
TWM371846U (en) * | 2009-08-27 | 2010-01-01 | Trend Lighting Corp | Light source device |
TW201120345A (en) * | 2009-12-10 | 2011-06-16 | Hon Hai Prec Ind Co Ltd | LED illuminating device |
Also Published As
Publication number | Publication date |
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TW201312039A (en) | 2013-03-16 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |