TWI450369B - Card structure, socket structure, and assembly structure thereof - Google Patents

Description

Card structure, socket structure and combination structure thereof

The invention relates to a card structure, a socket structure and a combination structure thereof, in particular to a thin memory card structure, a socket structure and a combination structure thereof, which are used in the USB 3.0 specification.

Generally, a thin memory card or a plug is used for a USB specification in which a plurality of electronic components (not shown) are provided (for example, U.S. Patent No. 7,440,287), due to a chip-on-chip (Chip On Board) , COB) devices have built a considerable number of electronic components, wafers and solder joints, thus when connecting a chip-connected wafer device to a connector, for the on-board connection of the wafer device and the connector The heat generated during the welding process between the two will cause the re-heating of the electronic components, wafers and solder joints already built in the on-board wafer device, which will result in the electronics in the on-board wafer device. Displacement or damage of parts and wafers.

In addition, there are many card-type memory devices or products (such as microSD, thin USB Storage Card, etc.) that are manufactured on a semiconductor process. These card-type memory devices or products have a flat metal gasket that can be integrated. It is produced by molding, but non-planar metal sheets (for example, three-dimensional springs or shrapnel made by stamping) cannot be produced by integral molding.

The present invention provides a card structure in which the installed electronic components in the card structure are not displaced or damaged by the heat generated by the soldering process, and the yield at the time of manufacture can be significantly increased. In addition, the present invention produces a connector and an electronic circuit in different designs and processes, except that the connector and the electronic circuit are connected by a common (electronic) contact, and the mechanism is adopted. The agreement, the welding or gluing of the agreement to achieve a close combination of the two, in order to achieve the desired application function and significantly reduce the size of the product.

One embodiment of the present invention provides a card structure including a first component and a second component. The first component includes at least one first contact and a first peripheral portion, wherein at least one first contact is present at the first peripheral portion. The second component includes at least one second contact and a second peripheral portion, wherein the at least one second contact is at least one first contact relative to the first component and is present on the second peripheral portion. When the first component and the second component are coupled to each other, the first peripheral portion of the first component and the second peripheral portion of the second component are adjacent to each other such that at least a first contact and a second component of the first component At least one of the second contacts may be juxtaposed to each other.

Moreover, an embodiment of the present invention provides a combined structure including a socket structure and a card structure. The socket structure includes a socket body and a socket contact unit, wherein the socket contact unit is disposed on the socket body. The card structure is detachably disposed on the socket body of the socket structure. The card structure includes a first component, a second component, and a card contact unit. The first component includes at least one first contact and a first peripheral portion, and at least one first contact is present on the first peripheral portion. The second component includes at least one second contact and a second peripheral portion, the at least one second contact being at least one first contact relative to the first component and presenting at the second peripheral portion, when the first component When the second component is coupled to the second component, the first peripheral portion of the first component and the second peripheral portion of the second component are adjacent to each other such that at least a first contact of the first component and at least a second component of the second component The contacts can be juxtaposed to each other. The card contact unit is coupled to at least one second contact of the second component, and the card contact unit is detachably contacted with the socket contact unit of the socket structure. When the card structure is disposed on the socket body of the socket structure, the card contact unit of the card structure contacts the socket contact unit of the socket structure, so that the card structure and the socket structure are coupled.

An embodiment of the present invention provides a card structure suitable for being disposed in a socket structure having a plurality of first elastic pieces and a plurality of second elastic pieces. The card structure includes a body, a plurality of first pad members, and a plurality of second pad members. The body includes an outer surface. The plurality of first pad members and the plurality of second pad members are disposed on the outer surface of the body with respect to the plurality of first elastic pieces and the plurality of second elastic pieces respectively with respect to the socket structure. When the card structure is disposed on the socket structure, the plurality of first pad members and the plurality of second pad members of the card structure respectively contact the plurality of first elastic pieces and the plurality of second elastic pieces of the socket structure.

Further, an embodiment of the present invention provides a socket structure suitable for providing a card structure having a plurality of first pad members and a plurality of second pad members. The socket structure comprises a body, a plurality of first elastic pieces and a plurality of second elastic pieces. The body includes a slot having a wall surface and an opening. The plurality of first elastic pieces and the plurality of second elastic pieces are disposed on the wall surface of the slot of the body with respect to the plurality of first pad members and the plurality of second pad members respectively with respect to the card structure. When the card structure is disposed on the body of the socket structure via the opening of the slot, the plurality of first pad members and the plurality of second pad members of the card structure respectively contact the plurality of first elastic pieces and the plurality of second elastic pieces of the socket structure.

One embodiment of the present invention provides a card structure including a first substrate, a second substrate, and a connector. The first substrate comprises a base surface, at least one electronic component area and a terminal area, and at least one electronic component area and the terminal area are disposed on the base surface. The second substrate is disposed on the base of the first substrate and coupled to the terminal region of the first substrate. The connector is disposed on the base surface of the first substrate in a manner of being juxtaposed on the second substrate. The connector includes a joint surface, a contact unit and a plurality of contact regions, wherein the plurality of contact regions are disposed on the joint surface The contact unit is coupled to the plurality of contact regions. When the connector is connected to the base surface of the first substrate via the bonding surface, the connector covers at least one electronic component area of the first substrate and the plurality of connectors are connected. The dot region is coupled to the terminal region of the first substrate such that the plurality of contact regions of the connector are coupled to the second substrate via the terminal regions of the first substrate.

An embodiment of the present invention provides another card structure including a first substrate, a second substrate, an intermediate unit and a connector. The first substrate includes a base surface. The second substrate is disposed on the base of the first substrate and coupled to the first substrate. The connector is disposed on the base surface of the first substrate via the intermediate unit in a manner of being juxtaposed on the second substrate, and the connector is coupled to the first substrate.

An embodiment of the present invention provides a further combined structure including a housing structure and a card structure. The housing structure includes a housing body having a first access portion and a second access portion, and the first access portion and the second access portion are interconnected. The card structure can be detachably disposed on the casing body of the outer casing structure via the first access portion or the second access portion of the casing body of the outer casing structure. The card structure includes a first component, a second component, and a card contact unit. The first component includes at least one first contact and a first peripheral portion, and at least one first contact is present on the first peripheral portion. The second component includes at least one second contact and a second peripheral portion, the at least one second contact being at least one first contact relative to the first component and presenting at the second peripheral portion, when the first component When the second component is coupled to the second component, the first peripheral portion of the first component and the second peripheral portion of the second component are adjacent to each other such that at least a first contact of the first component and at least a second component of the second component The contacts can be juxtaposed to each other. The card contact unit is disposed on the second component and coupled to the at least one second contact of the second component. When the card structure is disposed on the shell body of the shell structure via the first access portion or the second access portion of the shell body of the outer shell structure, a card chamber and a card structure are formed between the card structure and the shell body of the outer shell structure. The card contact unit is oriented toward the chamber.

An embodiment of the present invention provides a further combined structure including a housing structure and a card structure. The housing structure includes a housing body having a first access portion and a second access portion, and the first access portion and the second access portion are interconnected. The card structure includes a card body, a plurality of first pad members and a plurality of second pad members. The card body includes an outer surface. The plurality of first pad members and the plurality of second pad members are disposed on an outer surface of the card body. When the card structure is disposed on the shell body of the shell structure via the first access portion or the second access portion of the shell body of the outer shell structure, a chamber is formed between the card body of the card structure and the shell body of the outer shell structure and The plurality of first pad members and the plurality of second pad members of the card structure are oriented toward the chamber.

1A and 1B are respectively an exploded view and a combined view of a card structure C1 according to the first embodiment of the present invention. In the present embodiment, the card structure C1 is a thin memory card structure used under the USB 3.0 specification.

As shown in FIG. 1A, the card structure C1 includes a first component 1, a second component 2, a circuit unit D1 and a card contact unit D2. The first element 1 and the second element 2 are both rectangular members. In this embodiment, the first component 1 and the circuit unit D1 together form a Chip On Board (COB) device.

The first component 1 includes a first body 10, a plurality of first contacts 11c, a first bonding portion 101, a first peripheral portion 100s, and a plurality of first wires L1. The first joint portion 101 is a surface of the first body 10, and the first peripheral portion 100s is a peripheral surface of the first body 10 and is located around the outside of the first joint portion 101. The circuit unit D1 is disposed above or inside the first body 10. The plurality of first contacts 11c are present in the first peripheral portion 100s and are coupled (or electrically connected) to the circuit unit D1 via the plurality of first wires L1.

The second component 2 includes a second body 20, a plurality of second contacts 21c, a second bonding portion 201, a second peripheral portion 200s, and a plurality of second wires L21, L22. The second joint portion 201 is a surface of the second body 20 and is coupled to the first joint portion 101 of the first element 1 , and the second peripheral portion 200 s is a peripheral surface of the second body 20 and is located at the second joint Around the part 201. The plurality of second contacts 21c are formed in a plurality of first contacts 11c with respect to the first element 1 and are present in the second peripheral portion 200s. The first body 10 of the first component 1 and the second body 20 of the second component 2 form a card body B1 of the card structure C1.

The card contact unit D2 includes a plurality of first contact members g21 and a plurality of second contact members g22, wherein the plurality of first contact members g21 and the plurality of second contact members g22 are external to the second body 20 and respectively pass through the plurality of second wires L21 and L22 are coupled to the plurality of second contacts 21c of the second component 2. In this embodiment, the plurality of first contact members g21 are electrically conductive plurality of pad members, and the plurality of second contact members g22 are electrically conductive elastic sheets or reeds. For convenience of explanation, in the following description of the present embodiment, the plurality of first wires L1 and the plurality of second wires L21 and L22 are omitted.

As shown in FIG. 1B, when the first bonding portion 101 of the first component 1 is bonded to the second bonding portion 201 of the second component 2, the first peripheral portion 100s of the first component 1 and the second component 2 are second. The peripheral portions 200s are adjacent to each other, and the first peripheral portion 100s of the first element 1 adjacent to each other and the second peripheral portion 200s of the second element 2 together form an interface region J1 and a common peripheral portion S1, which are juxtaposed first. The plurality of first contacts 11c of the component 1 and the plurality of second contacts 21c of the second component 2 are co-located in the boundary region J1 such that the plurality of first contacts 11c and the second component 2 of the first component 1 are plural The two contacts 21c can be juxtaposed to each other to form a plurality of parallel contacts 1121.

Fig. 1C is a view showing the card structure C1 in Fig. 1B after the welding procedure is performed. When the first bonding portion 101 of the first component 1 is bonded to the second bonding portion 201 of the second component 2 and the plurality of first contacts 11c of the first component 1 and the plurality of second contacts 21c of the second component 2 are mutually connected After juxtaposition, the first element 1 and the second element 2 combined with each other are subjected to a welding procedure (for example, a tin furnace), and a plurality of first contacts 11c and second components 2 of the first component 1 juxtaposed with each other The outer surfaces of the two contacts 21c can be respectively covered by the metal soldering portion W, whereby the electrical connection is surely achieved.

It is to be noted that, in the common peripheral portion S1 formed by the first peripheral portion 100s of the first element 1 adjacent to each other and the second peripheral portion 200s of the second member 2, the common peripheral portion S1 includes interconnected a pair of longer sections (long sides) s01 and a pair of shorter sections (short sides) s02, wherein the shorter sections (short sides) s02 are dimensioned according to the plurality of first contacts of the card contact unit D2 The arrangement of the component g21 and the plurality of second contact members g22 is minimized. In the present embodiment, the length of the longer section s01 is twice or more than the length of the shorter section s02. The number of parallel parallel joints 1121 located in a longer section s01 is 5, and the number of parallel parallel joints 1121 located in the other longer section s01 is 4.

In this way, for the first component 1 in which a plurality of electronic components (not shown) are provided, since it is only required to be juxtaposed to each other on the peripheral surface of the first component 1 and the second component 2 Welding between the plurality of first contacts 11c of one component 1 and the plurality of second contacts 21c of the second component 2, the plurality of electronic components inside the first component 1 are not displaced by the heat generated by the soldering process Damage can obviously increase the yield at the time of production.

Fig. 2 is a view showing a modification of a card structure C1 according to the first embodiment of the present invention. The card structure C1' includes a first component 1', a second component 2', and the above-described circuit unit D1 and card contact unit D2. In essence, the first component 1' and the second component 2' of the card structure C1' are identical to the first component 1 and the second component 2 of the card structure C1, and the card structure C1' is mainly different from the card structure C1. It is that the plurality of parallel joints 1121 are located on a single longer section s01 or the same side. In the present embodiment, the number of the plurality of parallel contacts 1121 located in a longer section s01 is 9.

3A and 3B are exploded and combined views showing a combined structure E1 according to a second embodiment of the present invention.

As shown in FIG. 3A, the combined structure E1 includes a socket structure T1 and the above card structure C1. Therefore, the structure of the card structure C1 will not be described in detail below.

The socket structure T1 includes a socket body B31, a positioning component B32 and two socket contact units D31, D32 (for convenience of explanation, the two socket contact units D31, D32 are respectively designated as a first contact unit D31 and a second respectively. Contact unit D32). The first contact unit D31 includes a plurality of first contact members p31a and a plurality of second contact members p32a, and the second contact unit D32 includes a plurality of third contact members p31b and a plurality of fourth contact members p32b. In this embodiment, the plurality of first contact members p31a of the first contact unit D31 and the plurality of third contact members p31b of the second contact unit D32 are electrically conductive elastic pieces or reeds, and the first contact unit D31 is plural. The plurality of fourth contact members p32b of the contact member p32a and the second contact unit D32 are electrically conductive pad members.

The socket body B31 includes a slot R0. The slot R0 has an opening r01 and a wall surface r02. The opening r01 is connected to the wall surface r02. The positioning member B32 extends from the socket body B31 and forms an opening r01 and a wall surface r02 of the slot R0 of the socket body B31. In this embodiment, the positioning member B32 is a cantilever member. The plurality of first contact members p31a and the plurality of second contact members p32a of the first contact unit D31 protrude from the wall surface r02 of the slot R0 of the socket body B31. The plurality of third contact members p31b of the second contact unit D32 protrude from the wall surface r02 of the socket R0 of the socket body B31, and the plurality of third contact members p31b of the second contact unit D32 are plurall than the first contact unit D31. A contact member p31a and a plurality of second contact members p32a are closer to the opening r01 of the slot R0 of the socket body B31. The plurality of fourth contact members p32b of the second contact unit D32 protrude from the wall surface r02 of the socket R0 of the socket body B31, and the plurality of fourth contact members p32b are closer to the socket body B31 than the plurality of third contact members p31b. The opening r01 of the groove R0.

As shown in FIG. 3B, when the card structure C1 is inserted into the slot R0 of the socket structure T1 via the opening r01 of the socket body B31 of the socket structure T1, the plurality of first contact members g21 and the plurality of second contact members of the card structure C1 G22 is in contact with the plurality of first contact members p31a and the plurality of second contact members p32a of the first contact unit D31 of the socket structure T1, respectively. a plurality of first contact members g21 (card structure C1) of the card contact unit D2 in contact with each other, a plurality of first contact members p31a (socket structure T1) of the first contact unit D31, and a plurality of second contact members g22 of the card contact unit D2 Under the action of the plurality of second contact members p32a (socket structure T1) of the first card contact unit D31, the electrical connection between the card structure C1 and the socket structure T1 can be achieved.

The plurality of third and fourth contact members p31b, p32b of the second contact unit D32 described above are provided for use with a conventional plug (not shown) having a USB 2.0 specification. In other words, when the conventional plug is inserted through the opening r01 of the socket body B31 of the socket structure T1, the conventional plug is electrically connected to the plurality of third contact members p31b of the second contact unit D32 and the plurality The fourth contact member p32b can be positioned by the socket body B31 and the positioning member B32.

Fig. 4 is a perspective view showing a card structure C2 according to a third embodiment of the present invention. In this embodiment, the card structure C2 is a thin memory card structure used under the USB 3.0 specification.

The card structure C2 includes a card body B2, a circuit unit D1, a plurality of first pad members p21, a plurality of second pad members p22, and a plurality of wires L21a and L22a. The plurality of second pad members p22 and the plurality of wires L21a and L22a constitute a card contact unit D2a.

The card body B2 includes an outer surface b0. The circuit unit D1 is disposed on the card body B2. The plurality of first pad members p21 are disposed on the outer surface b0 of the card body B2, and the plurality of first pad members p21 are coupled to the circuit unit D1 via the plurality of wires L21a. The plurality of second pad members p22 are adjacent to the plurality of first pad members p21, and the plurality of second pad members p22 are coupled to the circuit unit D1 via the plurality of wires L22a. In this embodiment, the number of the plurality of first pad members p21 is four, the number of the plurality of second pad members p22 is five, and the plurality of first pad members p21 and the plurality of second pad members p22 are made of a conductive material, and The circuit unit D1 is a wafer.

5A and 5B are respectively an exploded view and a combined view of the combined structure E2 according to the fourth embodiment of the present invention.

As shown in FIG. 5A, the combined structure E2 includes a socket structure T2 and the card structure C2 described above. Therefore, the details of the structure of the card structure C2 will not be described below.

The socket structure T2 includes a socket body B31, a positioning component B32 and two socket contact units D31', D32 (for convenience of explanation, two will be hereinafter The socket contact units D31', D32 are designated as a first contact unit D31' and a second contact unit D32, respectively.

The socket body B31 includes a slot R0. The slot R0 has an opening r01 and a wall surface r02. The opening r01 is connected to the wall surface r02. The positioning member B32 extends from the socket body B31 and forms an opening r01 and a wall surface r02 of the slot R0 of the socket body B31. In this embodiment, the positioning member B32 is a cantilever member.

The first contact unit D31' includes a plurality of first contact members p31a and a plurality of second contact members p32a', and the second contact unit D32 includes a plurality of third contact members p31b and a plurality of fourth contact members p32b. The plurality of first contact members p31a and the plurality of second contact members p32a' of the first contact unit D31' protrude from the wall surface r02 of the slot R0 of the socket body B31. The plurality of third contact members p31b of the second contact unit D32 protrude from the wall surface r02 of the socket R0 of the socket body B31, and the plurality of third contact members p31b of the second contact unit D32 are plural than the first contact unit D31' The first contact member p31a and the plurality of second contact members p32a' are closer to the opening r01 of the slot R0 of the socket body B31. The plurality of fourth contact members p32b of the second contact unit D32 protrude from the wall surface r02 of the socket R0 of the socket body B31, and the plurality of fourth contact members p32b are closer to the socket body B31 than the plurality of third contact members p31b. The opening r01 of the groove R0. In this embodiment, the plurality of first contact members p31a and the plurality of second contact members p32a' and the plurality of third contact members p31b of the second contact unit D32 of the first contact unit D31' are electrically conductive elastic pieces or reeds. The plurality of fourth contact members p32b of the second contact unit D32 are electrically conductive pad members. For convenience of explanation, the following is a plurality of first contact members p31a of the first contact unit D31'. The plurality of second contact members p32a' are designated as a plurality of first elastic pieces p31a and a plurality of second elastic pieces p32a', respectively.

As shown in FIG. 5B, when the card structure C2 is inserted into the slot R0 of the socket structure T2 via the opening r01 of the socket body B31 of the socket structure T2, the plurality of first pad members p21 and the plurality of second pad members of the card structure C2 The p22 is respectively in contact with the plurality of first elastic pieces p31a and the plural second elastic pieces p32a' of the first contact unit D31' of the socket structure T2. a plurality of first elastic pieces p31a (socket structure T2), a plurality of second pad members p22 (card structure C2)/first contact unit of the plurality of first pad members p21 (card structure C2)/first contact unit D31' that are in contact with each other Under the action of the plurality of second shrapnel p32a' of D31' (socket structure T2), the electrical connection relationship between the card structure C2 and the socket structure T2 can be achieved.

The plurality of third and fourth contact members p31b, p32b of the second contact unit D32 described above are provided for use with a conventional plug (not shown) having a USB 2.0 specification. In other words, when the conventional plug is inserted through the opening r01 of the socket body B31 of the socket structure T2, the conventional plug is electrically connected to the plurality of third contact members p31b and the plurality of fourth contact members p32b of the second contact unit D32. The positioning can be achieved by the socket body B31 and the positioning component B32.

6A and 6B are respectively an exploded view and a combined view of a card structure C3 according to a fifth embodiment of the present invention. 7A and 7B are respectively a side view and a top view of the card structure C3 according to Fig. 6B. In the present embodiment, the card structure C3 is a thin memory card structure used under the USB 3.0 specification.

As shown in Figures 6A, 6B, 7A, and 7B, the card structure C3 includes a The first substrate 3, a connector 4 and a second substrate 5.

The first substrate 3 includes a base surface 300, an electronic component area 30 (as shown in FIG. 7A) and a terminal area 31 (as shown in FIG. 7A), wherein the part area 30 and the terminal area 31 are disposed on the base. Above the face 300. In this embodiment, the first substrate 3 can be a circuit unit.

The second substrate 5 is disposed on the base surface 300 of the first substrate 3 and coupled to the terminal region 31 of the first substrate 3 . In this embodiment, the second substrate 5 is an on-board connection wafer device.

The connector 4 is disposed on the base surface 300 of the first substrate 3 in such a manner as to be juxtaposed to the second substrate 5. The connector 4 includes a joint surface 400, a contact unit D4, a plurality of contact regions 41c/42c and a receiving portion 400r. The plurality of contact regions 41c and 42c are provided on the joint surface 400. The contact unit D4 includes a plurality of first contact members g41 and a plurality of second contact members g42, wherein the plurality of first contact members g41 and the plurality of second contact members g42 are coupled to the plurality of contact regions 41c, 42c. The accommodating portion 400r is provided on the joint surface 400. The joint surface 400 of the connector 4 is substantially like a U-shaped joint surface of a first segment portion 400a and two second segment portions 400b, wherein the two second segment portions 400b are connected to each other in parallel with each other. a section 400a, and the first section 400a is substantially between the two second section 400b and the second substrate 5 (as shown in FIG. 7B), or can be said to be the first section 400a The U-shaped opening of the U-shaped joint surface formed by the two second-stage portions 400b is opposite to the second base 5, and the plurality of contact portions 41c, 42c are disposed on the first-stage portion 400a of the U-shaped joint surface 400. Above. In this embodiment, the accommodating portion 400r is a recessed portion, and the plurality of first contact members g41 of the contact unit D4 are pad members made of a conductive material, and the plurality of second contact members g42 are It is a conductive shrapnel or reed.

When the connector 4 is connected to the base surface 300 of the first substrate 3 via the joint surface 400, the connector 4 covers the part area 30 of the first substrate 3 and accommodates the part area of the first substrate 3 via the receiving portion 400r thereof. 30, and the plurality of contact regions 41c, 42c of the connector 4 are coupled to the terminal region 31 of the first substrate 3 such that the plurality of contact regions 41c, 42c of the connector 4 can pass through the terminal region 31 of the first substrate 3. The second substrate 5 is coupled to the second substrate 5 .

8A and 8B are respectively an exploded view and a combined view of a card structure C3' according to a sixth embodiment of the present invention, and Figs. 9A and 9B respectively show a side view of the card structure C3' according to Fig. 8B. view. In the present embodiment, the card structure C3' is a thin memory card structure which is used under the USB 3.0 specification.

As shown in FIGS. 8A, 8B, 9A, and 9B, the main difference from the card structure C3 of the fifth embodiment is that the structure of the housing portion 400r' of the connector 4' of the card structure C3' of the sixth embodiment is It is different from the connector 4 of the card structure C3. Since the second substrate 5 proposed in the present embodiment is the same as the fifth embodiment, the structure of the second substrate 5 will not be described in detail hereinafter.

The card structure C3' includes a first substrate 3', a connector 4' and a second substrate 5.

The first substrate 3' includes a base surface 300, an electronic component area 30' (as shown in FIG. 9A) and a terminal area 31' (as shown in FIG. 9A), wherein the part area 30' and the terminal area 31 'The system is placed above the base surface 300.

The connector 4' includes a joint surface 400', a plurality of first contact members g41, a plurality of second contact members g42, a plurality of contact portions 41c/42c and a housing portion. 400r’. The joint surface 400' is substantially like a U-shaped joint surface of one of the first section 400a' and the two second section 400b', and the two second sections 400b' are connected to the first section in parallel with each other. The portion 400a', the two second segments 400b' are substantially located between the first segment 400a' and the second substrate 5 (as shown in FIG. 9B), or can be said to be the first segment 400a The U-shaped opening of the U-shaped joint surface formed by the two second segment portions 400b faces the second substrate 5, and the plurality of contact regions 41c, 42c are disposed on the first segment portion 400a of the U-shaped joint surface 400'. 'On top.

When the connector 4' is connected to the base surface 300 of the first substrate 3' via the joint surface 400', the connector 4' covers the part area 30' of the first substrate 3' and is accommodated via its receiving portion 400r' The part area 30' of the first substrate 3', and the plurality of contact areas 41c, 42c of the connector 4' are coupled to the terminal area 31' of the first substrate 3' such that the plurality of contact areas of the connector 4' 41c, 42c may be coupled to the second substrate 5 via the terminal region 31' of the first substrate 3'.

Fig. 10A is a view showing a card structure C4-1 according to a seventh embodiment of the present invention, and Fig. 10B is a view showing a top view of the card structure C4-1 according to Fig. 10A. In the present embodiment, the card structure C4-1 is a thin memory card structure used under the USB 3.0 specification.

As shown in Figs. 10A and 10B, the card structure C4-1 includes a first substrate 3a, a connector 4a, a second substrate 5, and an intermediate unit 6 having a plurality of connecting portions 61/62.

The first substrate 3a includes a base surface 300f. In the embodiment, the first substrate 3a is a circuit unit.

The second substrate 5 is disposed on the base surface 300f of the first substrate 3a and coupled to the first substrate 3a. In this embodiment, the second substrate 5 is a board. The upper type is connected to the wafer device.

The connector 4a includes a joint surface 400f and a contact unit D4. The contact unit D4 includes a plurality of first contact members g41 and a plurality of second contact members g42. The connector 4a is disposed on the base surface 300f of the first substrate 3a by the support of the plurality of connecting portions 61, 62 of the intermediate unit 6 and is connected to the second substrate 5, and the plurality of contact units D4 of the connector 4a A contact member g41 and a plurality of second contact members g42 are coupled to the first substrate 3a via the plurality of connection portions 61, 62 of the intermediate unit 6, respectively. In this embodiment, the plurality of first contact members g41 of the contact unit D4 are pad members made of a conductive material, and the plurality of second contact members g42 are electrically conductive elastic pieces or reeds, and the plurality of connecting portions of the intermediate unit 6 61, 62 is a conductive columnar structure.

Fig. 11A is a view showing a card structure C4-2 according to an eighth embodiment of the present invention, and Fig. 11B is a view showing the card structure C4-2 according to Fig. 11A. In the present embodiment, the card structure C4-2 is a thin memory card structure used under the USB 3.0 specification.

As shown in FIGS. 11A and 11B, the card structure C4-2 includes a first substrate 3a, a connector 4a, a second substrate 5, and an intermediate unit 7 having a plurality of connecting portions 71, 72. The first substrate 3a, the connector 4a, and the second substrate 5 of the card structure C4-2 of the eighth embodiment are identical to the first substrate 3a of the card structure C4-1 of the seventh embodiment, the connector 4a, and the The second substrate 5 will not be described again for these components and their connection relationship.

The main difference from the card structure C4-1 of the seventh embodiment is that the plurality of connecting portions 71, 72 of the intermediate unit 7 of the card structure C4-2 of the eighth embodiment are only used as the first substrate 3a and the connector. Support between 4a The non-conductive columnar structure, the conductive connection between the first substrate 3a and the connector 4a is the same as the card structure C3 of the fifth embodiment of the seventh embodiment or the card of the sixth embodiment of the ninth embodiment. The coupling method in structure C3' (but not shown).

Fig. 12A is a view showing a card structure C4-3 according to a ninth embodiment of the present invention, and Fig. 12B is a top view showing the card structure C4-3 according to Fig. 12A. In the present embodiment, the card structure C4-3 is a thin memory card structure used under the USB 3.0 specification.

As shown in Figs. 12A and 12B, the card structure C4-3 includes a first substrate 3a', a connector 4a, a second substrate 5, and an intermediate unit 8. The connector 4a and the second substrate 5 of the card structure C4-3 of the ninth embodiment are identical to the connector 4a and the second substrate 5 of the card structure C4-2 of the eighth embodiment, and no longer These components and their connection relationships will be described.

The main difference from the card structure C4-2 of the eighth embodiment is that the intermediate unit 8 of the card structure C4-3 of the ninth embodiment is integrally formed on the first substrate 3a' and protrudes from the first substrate 3a. Above the base surface 300f, the connector 4a is disposed on the second substrate 5 and is disposed above the first substrate 3a' via the direct support of the intermediate unit 8, and the connector 4a is selectable via the intermediate unit 8 is coupled to the first substrate 3a'. In the present embodiment, the intermediate unit 8 is integrally formed in one of the electronic parts of the first substrate 3a'. In other embodiments, based on the intermediate unit 8 of different sizes, the conductive connection between the first substrate 3a' and the connector 4a may be the same as the card structure C3 of the fifth embodiment of the above-mentioned 7A. Or the coupling mode (but not shown) in the card structure C3' of the sixth embodiment of FIG. 9A.

13A and 13B are views showing a first element 1a and a second element 2a, respectively, of a card structure C5a according to a tenth embodiment of the present invention, and FIG. 13C shows the first embodiment according to the tenth embodiment of the present invention. A schematic view of the card structure C5a formed by the combination of the element 1a and the second element 2a, and Fig. 13D shows a cross-sectional view of the card structure C5a cut along a line segment z1-z1 of Fig. 13C. In the present embodiment, the card structure C5a is a 4-pin thin memory card structure used under the USB 2.0 specification.

As shown in FIGS. 13A, 13B, 13C, and 13D, the card structure C5a includes a first component 1a, a second component 2a, a circuit unit D1, and a card contact unit D5a, wherein the first component 1a and the second component 2a are both It is a rectangular shaped member. In the present embodiment, the first component 1a and the circuit unit D1 together form an on-board connection wafer device or an electronic circuit, and the second component 2a and the card contact unit D5a together form a connector.

As shown in FIG. 13A, the first component 1a includes a first body 10a, a plurality of first contacts 11a, a first joint portion 101a and a first peripheral portion 100a. The first joint portion 101a is a surface of the first body 10a, and the first peripheral portion 100a is a peripheral surface of the first body 10a and is located around the outside of the first joint portion 101a. The circuit unit D1 is disposed above or inside the first body 10a of the first component 1a. The plurality of first contacts 11a are disposed on the first bonding portion 101a and coupled to the circuit unit D1 of the first body 10a via a plurality of wires (not shown).

As shown in FIG. 13B, the second component 2a includes a second body 20a, a plurality of second contacts 21a, a second joint portion 201a and a second peripheral portion 200a, wherein the second joint portion 201a is second. a surface of one of the body 20a and for bonding to the first joint portion 101a of the first element 1a, the second peripheral portion 200a is a peripheral surface of the second body 20a and is located outside the second joint portion 201a, and the plurality of second joints 21a are formed by the plurality of first joints 11a with respect to the first element 1a and present on the second joint portion 201a. . The first body 10a of the first component 1a and the second body 20a of the second component 2a form a card body B5a of the card structure C5a.

As shown in FIGS. 13B, 13C, and 13D, the card contact unit D5a includes a plurality of contact members g51a, a plurality of contact members g51a', and a plurality of wires L51a (as shown in FIG. 13D), wherein the plurality of contact members g51a, g51a' are presented The second body 20a of the second component 2a is coupled to the second plurality of contacts 21a of the second component 2a via a plurality of wires L51a. In this embodiment, the number of the plurality of contact members g51a is 2, the number of the plurality of contact members g51a' is 2, and the plurality of contact members g51a/g51a' are all electrically conductive rectangular pad members, and the length of the plurality of contact members g51a is greater than The length of the plurality of contact members g51a'.

As shown in FIGS. 13C and 13D, when the first engaging portion 101a of the first member 1a and the second engaging portion 201a of the second member 2a are coupled to each other, the first peripheral portion 100a and the second member 2a of the first member 1a are coupled to each other. The second peripheral portions 200a are adjacent to each other, and the first peripheral portion 100a of the first element 1a adjacent to each other and the second peripheral portion 200a of the second element 2a together form an interface region J1a and a common peripheral portion S1a, and The plurality of first contacts 11a of an element 1a are respectively coupled to the plurality of second contacts 21a of the second element 2a, so that the card structure C5a can be formed.

It is to be noted that, in the common peripheral portion S1a formed by the first peripheral portion 100a of the first element 1a adjacent to each other and the second peripheral portion 200a of the second member 2a, the common peripheral portion S1a includes interconnected a pair of first segment s01a and a pair of second segment s02a, wherein the size of the second segment s02a is minimized according to the arrangement distance of the plurality of contact members g51a/g51a' of the card contact unit D5a . In this embodiment, the length of the first segment s01a is approximately or slightly smaller than the length of the second segment s02a.

Fig. 13E is a view showing a modification C5a' of a card structure C5a according to the tenth embodiment of the present invention. The card structure C5a' is different from the card structure C5a of the tenth embodiment in that the plurality of first contacts 11a' of the first component 1a' and the plurality of second contacts 21a' of the second component 2a' are mutually Correspondingly, the first peripheral portion 100a of the first element 1a', the second peripheral portion 200a of the second element 2a', and the first joint portion 101a and the second element of the first element 1a' are respectively disposed in an exposed manner. When the second joint portions 201a of 2a' are coupled to each other, the plurality of first joints 11a' of the first element 1a' and the plurality of second joints 21a' of the second element 2a' are juxtaposed with each other and juxtaposed with each other. The plurality of first contacts 11a' of the first component 1a' and the plurality of second contacts 21a' of the second component 2a' are co-located in the boundary region J1a, and the first plurality of first components 1a' juxtaposed with each other The outer surfaces of the plurality of second contacts 21a' of the point 11a' and the second element 2a' may be respectively covered by the metal soldering portion W, whereby the electrical connection is surely achieved.

Figure 14A is a view showing a first element 1b of a card structure C5b according to an eleventh embodiment of the present invention, and Figure 14B is a view showing a second element of a card structure C5b according to the eleventh embodiment of the present invention. 2B is a schematic view showing a card structure C5b formed by combining the first element 1b and the second element 2b according to the eleventh embodiment of the present invention, and FIG. 14D is a line along the line of FIG. 14C. Segment z2-z2 A cross-sectional view of the card structure C5b is cut. In the present embodiment, the card structure C5b is a 5-pin thin memory card structure used under the USB 3.0 specification.

As shown in FIG. 14B, the rectangular second member 2b includes a second body 20b, a plurality of second contacts 21b, a second joint portion 201b and a second peripheral portion 200b, wherein the second joint portion 201b is As a surface of one of the second body 20b and for bonding to the first joint portion 101b of the first element 1b, the second peripheral portion 200b is a peripheral surface of the second body 20b and is located outside the second joint portion 201b, plural The second contact 21b is formed in the second joint portion 201b with respect to the plurality of first joints 11b of the first member 1b. The first body 10b of the first component 1b and the second body 20b of the second component 2b form a card body B5b of the card structure C5b.

As shown in FIGS. 14A, 14B, 14C, and 14D, the card structure C5b includes a first component 1b, a second component 2b, a circuit unit D1, and a card contact unit D5b, wherein the first component 1b and the second component 2b are both It is a rectangular shaped member. In the present embodiment, the first component 1b and the circuit unit D1 together form an on-board connection wafer device or an electronic circuit, and the second component 2b and the card contact unit D5b together form a connector.

As shown in FIG. 14A, the first component 1b includes a first body 10b, a plurality of first contacts 11b, a first bonding portion 101b, and a first peripheral portion 100b. The first joint portion 101b is a surface of the first body 10b, and the first peripheral portion 100b is a peripheral surface of the first body 10b and is located around the outside of the first joint portion 101b. The circuit unit D1 is disposed on or in the first body 10b of the first component 1b. The plurality of first contacts 11b are present on the first bonding portion 101b and are coupled to each other via a plurality of wires (not shown). Circuit unit D1 of the first body 10b.

As shown in FIGS. 14B, 14C, and 14D, the card contact unit D5b includes a plurality of contact members g51b and a plurality of wires L51b (as shown in FIG. 14D), wherein the plurality of contact members g51b are present on the second body of the second member 2b. The outside of 20b is coupled to the plurality of second contacts 21b of the second component 2b via the plurality of wires L51b, respectively. In the present embodiment, the number of the plurality of contact members g51b is five, and the plurality of contact members g51b are electrically conductive like T-shaped pad members.

When the first engaging portion 101b of the first member 1b and the second engaging portion 201b of the second member 2b are coupled to each other, the first peripheral portion 100b of the first member 1b and the second peripheral portion 200b of the second member 2b are adjacent to each other The first peripheral portion 100b of the first element 1b adjacent to each other and the second peripheral portion 200b of the second element 2b together form an interface region J1b and a common peripheral portion S1b, and the plurality of first contacts of the first element 1b 11b is respectively coupled to the plurality of second contacts 21b of the second component 2b, so that the card structure C5b can be formed.

It is to be noted that, in terms of the common peripheral portion S1b formed by the first peripheral portion 100b of the first element 1b adjacent to each other and the second peripheral portion 200b of the second member 2b, the common peripheral portion S1b includes interconnected A pair of first segment s01b and a pair of second segment s02b, wherein the size of the second segment s02b is minimized according to the arrangement distance of the plurality of contact members g51b of the card contact unit D5b. In this embodiment, the length of the first segment s01b is approximately or slightly smaller than the length of the second segment s02b.

Fig. 14E is a view showing a modification C5b' of a card structure C5b according to the eleventh embodiment of the present invention. Card structure C5b' is different from tenth The card structure C5b of an embodiment is that the plurality of first contacts 11b' of the first component 1b' and the plurality of second contacts 21b' of the second component 2b' are respectively exposed in a mutually corresponding manner. Provided in the first peripheral portion 100b of the first element 1b', the second peripheral portion 200b of the second element 2b', and when the first joint portion 101b of the first element 1b' and the second joint portion of the second element 2b' When 201b is combined with each other, the plurality of first contacts 11b' of the first component 1b' and the plurality of second contacts 21b' of the second component 2b' are juxtaposed with each other, and the first component 1b' is juxtaposed with each other. The plurality of first contacts 11b' and the plurality of second contacts 21b' of the second component 2b' are co-located in the interface region J1b, and the plurality of first contacts 11b' and the second component of the first component 1b' juxtaposed to each other The outer surface of the plurality of second contacts 21b' of 2b' can be covered by the metal soldering portion W, respectively, whereby the electrical connection is surely achieved.

Figure 15A is a view showing a first element 1c of a card structure C5c according to a twelfth embodiment of the present invention, and Figure 15B is a view showing a second element of a card structure C5c according to a twelfth embodiment of the present invention. 2C is a schematic view showing a card structure C5c formed by combining the first element 1c and the second element 2c according to the twelfth embodiment of the present invention, and FIG. 15D is a line along the line 15C. Section z3-z3 performs a cross-sectional view of the card structure C5c. In the present embodiment, the card structure C5c is a 7-pin thin memory card structure used under the eSATA specification.

As shown in FIGS. 15A, 15B, 15C, and 15D, the card structure C5c includes a first component 1c, a second component 2c, a circuit unit D1, and a card contact unit D5c, wherein the first component 1c and the second component 2c are both It is a rectangular shaped member. In this embodiment, the first component 1c is shared with the circuit unit D1. The same constitutes an on-board connection wafer device or an electronic circuit, and the second element 2c and the card contact unit D5c together form a connector.

As shown in FIG. 15A, the first component 1c includes a first body 10c, a plurality of first contacts 11c1, a first joint portion 101c and a first peripheral portion 100c. The first joint portion 101c is a surface of the first body 10c, and the first peripheral portion 100c is a peripheral surface of the first body 10c and is located around the outside of the first joint portion 101c. The circuit unit D1 is disposed above or inside the first body 10c of the first component 1c. The plurality of first contacts 11c1 are present on the first bonding portion 101c and coupled to the circuit unit D1 of the first body 10c via a plurality of wires (not shown).

As shown in FIG. 15B, the rectangular second member 2c includes a second body 20c, a plurality of second contacts 21c, a second joint portion 201c and a second peripheral portion 200c, wherein the second joint portion 201c is Is a surface of one of the second body 20c and is coupled to the first joint portion 101c of the first element 1c, the second peripheral portion 200c is a peripheral surface of the second body 20c and is located outside the second joint portion 201c, plural The second contact 21c is formed by the plurality of first contacts 11c with respect to the first element 1c and presented at the second joint portion 201c. The first body 10c of the first component 1c and the second body 20c of the second component 2c form a card body B5c of the card structure C5c.

As shown in FIGS. 15B, 15C, and 15D, the card contact unit D5c includes a plurality of contact members g51c and a plurality of wires L51c (as shown in FIG. 15D), wherein the plurality of contact members g51c are present on the second body of the second member 2c. The plurality of second contacts 21c1 of the second component 2c are coupled to the outside of the second component 2c via the plurality of wires L51c. In this embodiment, the number of the plurality of contact members g51c is 7, and the plurality of contact members g51c are electrically conductive. Shape pad parts.

When the first engaging portion 101c of the first member 1c and the second engaging portion 201c of the second member 2c are coupled to each other, the first peripheral portion 100c of the first member 1c and the second peripheral portion 200c of the second member 2c are adjacent to each other The first peripheral portion 100c of the first element 1c adjacent to each other and the second peripheral portion 200c of the second element 2c together form an interface region J1c and a common peripheral portion S1c, and a plurality of first contacts of the first element 1c The 11c1 is respectively coupled to the plurality of second contacts 21c1 of the second component 2c, so that the card structure C5c can be formed.

It is to be noted that, in terms of the common peripheral portion S1c formed by the first peripheral portion 100c of the first element 1c adjacent to each other and the second peripheral portion 200c of the second member 2c, the common peripheral portion S1c includes interconnected A pair of first segment s01c and a pair of second segment s02c, wherein the size of the second segment s02c is minimized according to the arrangement distance of the plurality of contact members g51c of the card contact unit D5c. In this embodiment, the length of the first segment s01c is approximately or slightly smaller than the length of the second segment s02c.

Fig. 15E is a view showing a modification C5c' of a card structure C5c according to the twelfth embodiment of the present invention. The card structure C5c' is different from the card structure C5c of the twelfth embodiment in that a plurality of first contacts 11c1' of the first component 1c' and a plurality of second contacts 21c1' of the second component 2c' are connected Provided in a mutually corresponding manner to the first peripheral portion 100c of the first element 1c', the second peripheral portion 200c of the second element 2c', and the first joint portion 101c and the second portion of the first element 1c', respectively When the second joint portion 201c of the element 2c' is coupled to each other, the mutual first joint 11c1' of the first element 1c' and the plurality of second joints 21c1' of the second element 2c' are mutually In parallel, the plurality of first contacts 11c1' of the first component 1c' and the plurality of second contacts 21c1' of the second component 2c' are co-located in the boundary region J1c, and the first component 1c' juxtaposed to each other The outer surfaces of the plurality of first contacts 11c1' and the plurality of second contacts 21c1' of the second element 2c' may be respectively covered by the metal soldering portion W, thereby achieving electrical connection.

Figure 16A is a view showing a first element 1d of a card structure C5d according to a thirteenth embodiment of the present invention, and Figure 16B is a view showing a second element of a card structure C5d according to a thirteenth embodiment of the present invention. 2D is a schematic view showing a card structure C5d formed by combining the first element 1d and the second element 2d according to the thirteenth embodiment of the present invention, and FIG. 16D1 is a line along the line of FIG. The segment z41-z41 is a cross-sectional view of the card structure C5d, and the 16D2 is a cross-sectional view of the card structure C5d taken along a line segment z42-z42 of the 16Cth drawing. In this embodiment, the card structure C5d is a multiple interface thin memory card structure under the USB 2.0 and USB 3.0 specifications.

As shown in FIGS. 16A, 16B, 16C, 16D1, and 16D2, the card structure C5d includes a first component 1d, a second component 2d, a circuit unit D1, and a card contact unit D5d, wherein the first component 1d and the second component 2d are rectangular shaped members. In the present embodiment, the first component 1d and the circuit unit D1 together form an on-board connection wafer device or an electronic circuit, and the second component 2d and the card contact unit D5d together form a connector.

As shown in FIG. 16A, the first component 1d includes a first body 10d, a plurality of first contacts 11d1/11d2, a first joint portion 101d, and a first peripheral portion 100d. The first joint portion 101d is a surface of the first body 10d, The first peripheral portion 100d is a peripheral surface of the first body 10d and is located around the outside of the first joint portion 101d. The circuit unit D1 is disposed above or inside the first body 10d of the first component 1d. The plurality of first contacts 11d1/11d2 are formed on the first bonding portion 101d and coupled to the circuit unit D1 of the first body 10d via a plurality of wires (not shown).

As shown in FIG. 16B, the second component 2d includes a second body 20d, a plurality of second contacts 21d1/21d2, a second joint portion 201d and a second peripheral portion 200d, wherein the second joint portion 201d is a surface of one of the second body 20d is coupled to the first joint portion 101d of the first element 1d, and the second peripheral portion 200d is a peripheral surface of the second body 20d and is located outside the second joint portion 201d, plural The two contacts 21d1/21d2 are formed in the second joint portion 201d with respect to the plurality of first contacts 11d1/11d2 of the first element 1d. The first body 10d of the first component 1d and the second body 20d of the second component 2d constitute a card body B5d of the card structure C5d.

As shown in FIGS. 16B, 16C, 16D1, and 16D2, the card contact unit D5d includes a plurality of contact members g51d1/g51d1', a plurality of contact members g51d2, and a plurality of wires L51d1/L51d2 (as shown in FIGS. 16D1 and 16D2), wherein The contact members g51d1/g51d1' and g51d2 are disposed outside the second body 20d of the second component 2d and are coupled to the plurality of second contacts 21d1, 21d2 of the second component 2d via the plurality of wires L51d1, L51d2, respectively. In the present embodiment, the number of the plurality of contact members g51d1 is 2, the number of the plurality of contact members g51d1' is 2, the number of the plurality of contact members g51d2 is 5, and the plurality of contact members g51d1/g51d1' are electrically conductive rectangular pad members. The plurality of contact members g51d2 are all electrically conductive T-shaped pad members, and the length of the plurality of contact members g51d1 is greater than the plurality of contact members g51d1' length.

When the first engaging portion 101d of the first member 1d and the second engaging portion 201d of the second member 2d are coupled to each other, the first peripheral portion 100d of the first member 1d and the second peripheral portion 200d of the second member 2d are adjacent to each other The first peripheral portion 100d of the first element 1d adjacent to each other and the second peripheral portion 200d of the second element 2d together form an interface region J1d and a common peripheral portion S1d, and the plurality of first contacts of the first element 1d The 11d is respectively coupled to the plurality of second contacts 21d1/21d2 of the second component 2d, so that the card structure C5d can be formed.

It is to be noted that, in terms of the common peripheral portion S1d formed by the first peripheral portion 100d of the first element 1d adjacent to each other and the second peripheral portion 200d of the second member 2d, the common peripheral portion S1d includes interconnected A pair of first segment s01d and a pair of second segment s02d, wherein the size of the second segment s02d is minimized according to the arrangement distance of the plurality of contact members g51d1/g51d2 of the card contact unit D5d. In this embodiment, the length of the first segment s01d is approximately or slightly smaller than the length of the second segment s02d.

Fig. 16E is a view showing a modification C5d' of a card structure C5d according to the thirteenth embodiment of the present invention. The card structure C5d' is different from the card structure C5d of the thirteenth embodiment in that a plurality of first contacts 11d1'/11d2' of the first element 1d' and a plurality of second contacts 21d1' of the second element 2d'/ 21d2' is disposed in a mutually corresponding manner in a first peripheral portion 100d of the first contact 11d1'/11d2', a second peripheral portion 200d of the second element 2d', and when the first element 1d is exposed When the first joint portion 101d and the second joint portion 201d of the second element 2d' are combined with each other, The first plurality of contacts 11d1'/11d2' of the first component 1d' and the second plurality of contacts 21d1'/21d2' of the second component 2d' are juxtaposed with each other, and the first component 1d' is juxtaposed with each other. The plurality of first contacts 11d' and the plurality of second contacts 21d1'/21d2' of the second component 2d' are co-located in the boundary region J1d, and the plurality of first contacts 11d1'/ of the first component 1d' juxtaposed to each other The outer surfaces of the plurality of second contacts 21d1'/21d2' of the second element 2d' can be covered by the metal soldering portion W, respectively, whereby the electrical connection is surely achieved.

Figure 17A is a view showing a first element 1e of a card structure C5e according to a fourteenth embodiment of the present invention, and Figure 17B is a view showing a second element of a card structure C5e according to the fourteenth embodiment of the present invention. 2E is a schematic view showing a card structure C5e formed by combining the first element 1e and the second element 2e according to the fourteenth embodiment of the present invention, and FIG. 17D1 is a line along the line 17C. The segment z51-z51 performs a cross-sectional view of the card structure C5e, and the 17D2 shows a cross-sectional view of the card structure C5e along a line segment z52-z52 of the 17Cth drawing. In this embodiment, the card structure C5e is a multi-interface thin memory card structure used under the USB 2.0 and USB 3.0 specifications.

As shown in FIGS. 17A, 17B, 17C, 17D1, and 17D2, the card structure C5e includes a first component 1e, a second component 2e, a circuit unit D1, and a card contact unit D5e, wherein the first component 1e and the second component 2e are both rectangular shaped members. In the present embodiment, the first component 1e and the circuit unit D1 together form an on-board connection wafer device or an electronic circuit, and the second component 2e and the card contact unit D5e together form a connector.

As shown in FIG. 17A, the first component 1e includes a first body 10e, a plurality of first contacts 11e1/11e2, a first bonding portion 101e, and a first periphery. Part 100e. The first joint portion 101e is a surface of the first body 10e, and the first peripheral portion 100e is a peripheral surface of the first body 10e and is located around the outside of the first joint portion 101e. The circuit unit D1 is disposed on or in the first body 10e of the first component 1e. The plurality of first contacts 11e1/11e2 are formed on the first bonding portion 101e and coupled to the circuit unit D1 of the first body 10e via a plurality of wires (not shown).

As shown in FIG. 17B, the second component 2e includes a second body 20e, a plurality of second contacts 21e1/21e2, a second bonding portion 201e and a second peripheral portion 200e1, wherein the second bonding portion 201e is formed. On the second body 20e, a plurality of second contacts 21e1/21e2 are formed on the second bonding portion 201e with respect to the plurality of first contacts 11e1/11e2 of the first element 1e. In this embodiment, the second joint portion 201e is a recess corresponding to the first body 10e of the first component 1e and formed on the second body 20e having a bottom surface 200e2, and the second peripheral portion 200e1 is One of the inner side wall faces of the groove, and a plurality of second contacts 21e1/21e2 are formed on the bottom surface 200e2 of the groove. The first body 10e of the first component 1e and the second body 20e of the second component 2e form a card body B5e of the card structure C5e.

As shown in FIGS. 17B, 17C, 17D1, and 17D2, the card contact unit D5e includes a plurality of contact members g51e1/g51e1', a plurality of contact members g51e2, and a plurality of wires L51e1/L51e2 (as shown in FIGS. 17D1 and 17D2, wherein the plurality of contacts The components g51e1/g51e1' and the plurality of contact members g51e2 are disposed outside the second body 20e of the second component 2e and are coupled to the plurality of second contacts 21e1, 21e2 of the second component 2e via the plurality of wires L51d1, L51d2, respectively. In this embodiment, the number of the plurality of contact members g51e1 is 2, the number of the plurality of contact members g51e1' is 2, and the plurality of contact members g51e2 The number is 5, the plurality of contact members g51e1/g51e1' are electrically conductive rectangular pad members, and the plurality of contact members g51e2 are electrically conductive T-shaped pad members, and the length of the plurality of contact members g51e1 is greater than the plurality of contact members g51e1' length.

As shown in FIGS. 17C, 17D1, and 17D2, when the first element 1e and the second element 2e are combined with each other, the first body 10e of the first element 1e is disposed in a mating manner to the second joint of the second element 2e. 201e, such that the first peripheral portion 100e of the first element 1e and the second peripheral portion 200e1 of the second element 2e are adjacent to each other to form an interface region J1e together, and at the same time, the plurality of first elements 1e can be made A contact 11e1, 11e2 is respectively coupled to the plurality of second contacts 21e1, 21e2 of the second component 2e, so that the card structure C5e can be formed.

Fig. 17E is a view showing a modification C5e' of a card structure C5e according to the fourteenth embodiment of the present invention. The card structure C5e' is different from the card structure C5e of the fourteenth embodiment in that the plurality of first contacts 11e1'/11e2' of the first component 1e' of the card structure C5e' and the second component 2e' are plural The contact points 21e1'/21e2' are disposed in a mutually corresponding manner, and are respectively disposed on the first peripheral portion 100e of the first element 1e' and the second peripheral portion 200e1 of the second element 2e' in an exposed manner to form a boundary region J1e. On both sides of the surface. When the first bonding portion 101e of the first component 1e' and the second bonding portion 201e of the second component 2e are coupled to each other, the plurality of first contacts 11e1'/11e2' and the second component 2e' of the first component 1e' The plurality of second contacts 21e1'/21e2' are juxtaposed with each other, and the plurality of first contacts 11e1'/11e2' of the first element 1e' and the second plurality of contacts 21e1 of the second element 2e' are juxtaposed to each other. The outer surface of '/21e2' can be covered by the metal welded portion W, respectively, thereby achieving Electrical connection.

Figure 18 is a view showing a combined structure E3 according to a fifteenth embodiment of the present invention. The composite structure E3 mainly includes a base structure T3 and a card structure C5x. The base structure T3 includes a body h3 having a first positioning portion h31 and a second positioning portion h32. The card structure C5x is detachably disposed on the base structure T3. The first positioning portion h31 of the body h3 of the base structure T3. In this embodiment, the card structure C5x may be any one of the card structures C5a, C5b, C5c, C5d, and C5e in the above embodiment, and the base structure T3 is a key ring structure, and the first positioning portion h31 is Corresponding to one of the grooves of the card structure C5x, the second positioning portion h32 is a hole for positioning a key or a ring (none of which is shown).

Figure 19 is a view showing a combined structure E4 according to a sixteenth embodiment of the present invention. The composite structure E4 mainly includes a base structure T4 and a card structure C5x. The base structure T4 includes a body h4 having a positioning portion h41 and a wire h42. The card structure C5x is detachably disposed on the body of the base structure T4. Positioning unit h41 of h4. In this embodiment, the card structure C5x may be any one of the card structures C5a, C5b, C5c, C5d, and C5e in the above embodiment, the base structure T4 is a connecting line, and the positioning part h41 is corresponding to the card. One of the grooves of the structure C5x.

Fig. 20A is an exploded view showing a card structure C5f1 according to a seventeenth embodiment of the present invention, and Fig. 20B is a combination view showing a card structure C5f1 according to a seventeenth embodiment of the present invention.

The card structure C5f1 includes a first component 1f, a second component 2f1, a circuit unit D1, and a card contact list having a plurality of contact members g51f. Yuan D5f1. In this embodiment, the first component 1f and the circuit unit D1 together form an on-board connection chip device or an electronic circuit, and the second component 2f1 and the card contact unit D5f1 together form a connector, the card contact unit The plurality of contact members g51f of D5f1 are flat pad members.

As shown in FIG. 20A, the first component 1f includes a first body 10f, a plurality of first contacts 11f and a first bonding portion 101f. The first joint portion 101f is a surface of the first body 10f. The circuit unit D1 is disposed above or inside the first body 10f of the first component 1f. The plurality of first contacts 11f are present on the first bonding portion 101f and coupled to the circuit unit D1 of the first body 10f via a plurality of wires (not shown).

The second component 2f1 includes a second body 20f1, a plurality of second contacts 21f and a second bonding portion 201f. The second bonding portion 201f is a surface of the second body 20f1 and is coupled to the first component 1f. The first joint portion 101f, the plurality of second joints 21f are formed in the second joint portion 201f with respect to the plurality of first joints 11f of the first element 1f. The plurality of contact members g51f of the card contact unit D5f1 are disposed on the second body 20f1 and coupled to the plurality of second contacts 21f of the second body 20f1. The first body 10f of the first element 1f and the second body 20f1 of the second element 2f1 constitute a card body B5f1 of the card structure C5f.

As shown in FIG. 20B, when the first element 1f and the second element 2a are combined, the first joint portion 101f of the first element 1f and the second joint portion 201f of the second element 2a are combined with each other to make The plurality of first contacts 11f of one element 1f and the plurality of second contacts 21f of the second body 20f1 are coupled to each other, so that the card structure C5f1 can be formed.

Figure 21A shows a card knot according to the eighteenth embodiment of the present invention. An exploded view of C5f2, and Fig. 21B shows a combined view of a card structure C5f2 according to an eighteenth embodiment of the present invention.

The card structure C5f2 includes a first component 1f, a second component 2f2, a circuit unit D1, and a card contact unit D5f2 having a plurality of contact members g52f. The card structure C5f2 of the eighteenth embodiment is different from the card structure C5f1 of the seventeenth embodiment in that the card structure C5f2 of the eighteenth embodiment is replaced by a card contact unit D5f2 having a plurality of contact members g52f. The card contact unit D5f1 of the card structure C5f1 of the seventh embodiment having the plurality of contact members g51f. In the embodiment, the plurality of contact members g52f of the card contact unit D5f2 disposed on the second body 20f2 of the card body B5f2 are electrically conductive elastic pieces or reeds. The other structure of the card structure C5f2 of the eighteenth embodiment is identical to the card structure C5f1 of the seventeenth embodiment and the same reference numerals are used, and the description of the same structure and its description will not be repeated here.

Fig. 22A is an exploded view showing a card structure C5f3 according to a nineteenth embodiment of the present invention, and Fig. 22B is a combination view showing a card structure C5f3 according to a nineteenth embodiment of the present invention.

The card structure C5f3 includes a first component 1f, a second component 2f3, a circuit unit D1, and a card contact unit D5f3 having a plurality of contact members g51f/g52f. The card structure C5f3 of the nineteenth embodiment is different from the card structure C5f1 of the seventeenth embodiment and the card structure C5f2 of the eighteenth embodiment in that the card structure C5f3 of the nineteenth embodiment simultaneously adopts the seventeenth The card contact unit D5f1 of the card structure C5f1 of the embodiment having the plurality of contact members g51f and the card contact unit D5f2 having the plurality of contact members g52f of the card structure C5f2 of the eighteenth embodiment. to In the present embodiment, the plurality of contact members g51f of the card contact unit D5f3 disposed in the second body 20f3 of the card body B5f3 are flat pad members, and the plurality of contact members g52f are electrically conductive elastic pieces or reeds. The other structure of the card structure C5f3 of the nineteenth embodiment is identical to the card structure C5f1 of the seventeenth embodiment, and the card structure C5f2 of the eighteenth embodiment, and the same symbols are used, and the same is no longer The structure and its description are described in detail.

Fig. 23A is an exploded view of the combined structure E5 according to the twentieth embodiment of the present invention, and Fig. 23B is a combination view showing the combined structure E5 according to the twentieth embodiment of the present invention.

The combined structure E5 includes a socket structure T5 and the card structure C5f3 of the above-described nineteenth embodiment.

The socket structure T5 includes a socket body B51, a positioning component B52 and a socket contact unit D51. The socket contact unit D51 includes a plurality of first contact members p51a and a plurality of second contact members p52a. In this embodiment, the plurality of first contact members p51a of the socket contact unit D51 are electrically conductive elastic pieces or reeds, and the plurality of second contact members p52a of the socket contact unit D51 are electrically conductive pad members.

The socket body B51 includes a slot R5. The slot R5 has an opening r51 and a wall surface r52. The opening r51 is connected to the wall surface r52. The positioning member B52 extends from the socket body B51 and forms an opening r51 and a wall surface r52 of the slot R5 of the socket body B51. In this embodiment, the positioning member B52 is a cantilever member. The plurality of first contact members p51a and the plurality of second contact members p52a of the socket contact unit D51 protrude from the wall surface r52 of the socket R5 of the socket body B51, and the plurality of second contact members p52a are complex The first contact member p51a is closer to the opening r51 of the slot R5 of the socket body B51.

As shown in FIG. 23B, when the card structure C5f3 is inserted into the slot R5 of the socket structure T5 via the opening r51 of the socket body B51 of the socket structure T5, the plurality of first contact members g51f and the plurality of second contact members of the card structure C5f3 The g52f is in contact with the plurality of first contact members p51a and the plurality of second contact members p52a of the socket contact unit D51 of the socket structure T5, respectively. a plurality of first contact members g51f (card structure C5f3) of the card contact unit D53f3 contacting each other, a plurality of first contact members p51a (socket structure T5) of the socket contact unit D51, and a plurality of second contact members g52f of the card contact unit D53f3 ( Under the action of the card structure C5f3)/the plurality of second contact members p52a (socket structure T5) of the first contact unit D51, the electrical connection relationship between the card structure C5f3 and the socket structure T5 can be achieved.

Fig. 24A is a combination view showing a combination structure E6 according to a twenty-first embodiment of the present invention, and Figs. 24B and 24C are respectively two exploded views showing the combined structure E6 of Fig. 24A in different assembly modes.

As shown in Figures 24A-24C, the combined structure E6 includes a housing structure Ma and a card structure C1.

The outer casing structure Ma includes a casing body m1 and a positioning device (for example, a spring member or a fastener, but not shown), and the positioning device is disposed in the casing body m1. The housing body m1 includes a first component m11 and a second component m12 connected to each other, wherein the first component m11 is hollowed out of one of the first access portion as1 and the second access portion as2. The second member m12 is a U-shaped member having an inner wall surface r100, and the first access portion as1 of the first member m11 is oriented toward the second member m12. The inner side wall surface r100. In the present embodiment, the first access portion as1 and the second access portion as2 are two rectangular openings.

The card structure C1 in this embodiment is identical to the card structure C1 in the first embodiment of the first embodiment A-1C, and will not be described again. The card structure C1 can be detachably disposed in the casing body m1 of the outer casing structure Ma via the first access portion as1 or the second access portion as2 of the casing body m1 of the outer casing structure Ma.

When the card structure C1 is disposed in the casing body m1 of the casing structure Ma via the first access portion as1 or the second access portion as2 of the casing body m1 of the casing structure Ma and is positioned via the positioning device, the card structure C1 The second component 2 forms a cavity between the inner wall surface r100 of the second component m12 of the shell body m1 of the outer casing structure Ma, and the plurality of first contact members g21 and the second of the card contact unit D2 of the card structure C1 The contact member g22 is oriented toward the chamber.

Fig. 25A is a combination view showing a combination structure E7 according to a twenty-second embodiment of the present invention, and Figs. 25B and 25C are respectively two exploded views showing the combined structure E7 in Fig. 25A in different assembly modes.

As shown in Figures 25A-25C, the combined structure E7 includes a housing structure Ma (as shown in Figures 24A-24C) and a card structure C2. The card structure C2 in this embodiment is identical to the card structure C2 in the third embodiment of FIG. 4, and the combination of the outer casing structure Ma and the card structure C2 of the combined structure E7 is identical to that of the 24A-24C. The combination of the outer casing structure Ma of the combined structure E6 and the card structure C1 will not be described herein. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and the skilled artisan without departing from the invention In the spirit and scope of the invention, the scope of protection of the invention is defined by the scope of the appended claims.

1, 1', 1a, 1a', 1b, 1b', 1c, 1c', 1d, 1d', 1e, 1e', 1f, 2f1, 2f2, 2f3‧‧‧ first element

10, 10a, 10b, 10c, 10d, 10e, 10f‧‧‧ first ontology

100a, 100b, 100c, 100d, 100e, 100s‧‧‧ first peripheral

101, 101a, 101b, 101c, 101d, 101e, 101f‧‧‧ first joint

1121‧‧‧ parallel joints

11a, 11a', 11b, 11b', 11c, 11c1, 11c1', 11d1, 11d2, 11d1', 11d2', 11e1, 11e2, 11e1', 11e2', 11f‧ ‧ first joint

2, 2', 2a, 2a', 2b, 2b', 2c, 2c', 2d, 2d', 2e, 2e' ‧ ‧ second component

20, 20a, 20b, 20c, 20d, 20e, 20f1, 20f2, 20f3‧‧‧ second ontology

200a, 200b, 200c, 200d, 200e1, 200s‧‧‧ second peripheral

200e2‧‧‧ bottom surface

201, 201a, 201b, 201c, 201d, 201e, 201f‧‧‧ second joint

21a, 21a', 21a1', 21b, 21b', 21c, 21c1, 21c1', 21d1, 21d2, 21d1', 21d2', 21e1, 21e2, 21e1', 21e2', 21f‧ ‧ second joint

3, 3', 3a, 3a'‧‧‧ first base

30, 30’‧‧‧Electronic parts area

300, 300f‧‧‧ base

31, 31'‧‧‧Terminal area

4, 4'‧‧‧ connectors

400, 400’‧‧‧ joints

400a, 400a’‧‧‧ first section

400b, 400b’‧‧‧The second paragraph

400f‧‧‧ joint surface

400r, 400r’‧‧‧ Housing Department

41c, 42c‧‧‧Contact area

4a‧‧‧Connector

5‧‧‧Second substrate

6‧‧‧Intermediate unit

61, 62‧‧‧ Connections

7‧‧‧Intermediate unit

71, 72‧‧‧ Connections

8‧‧‧Intermediate unit

As1, as2‧‧‧ first and second access

B0‧‧‧ outer surface

B1, B2‧‧‧ card body

B31, B51‧‧‧ socket body

B32, B52‧‧‧ positioning parts

B5a, B5b, B5c, B5d, B5e, B5f1, B5f2, B5f3‧‧‧ card body

C1, C1', C2, C3, C3', C4-1, C4-2, C4-3, C5a, C5a', C5b, C5b', C5c, C5c', C5d, C5d', C5e, C5e', C5f1 , C5f2, C5f3, C5x‧‧‧ card structure

D1‧‧‧ circuit unit

D2, D2a‧‧‧ card contact unit

D31, D31'‧‧‧ socket contact unit (first contact unit)

D32‧‧‧ socket contact unit (second contact unit)

D4‧‧‧Contact unit

D51‧‧‧ socket contact unit

D5a, D5b, D5c, D5d, D5d1, D5d2, D5e1, D5e2, D5f1, D5f2, D5f3‧‧‧ card contact unit

E1, E2, E3, E4, E5, E6, E7‧‧‧ combination structure

G21, g22‧‧‧ first and second contact parts

G41, g42‧‧‧ first and second contact parts

G51a, g51a', g51b, g51c, g51d1, g51d1', g51d2, g51e1, g51e1', g51e2, g51f, g52f‧‧‧ contact parts

H3, h4‧‧‧ ontology

H31, h32‧‧‧ first and second positioning

H41‧‧‧ Positioning Department

H42‧‧‧ wire

J1‧‧‧ junction area

Junction area of J1a, J1b, J1c, J1d, J1e‧‧

L1‧‧‧First wire

L21, L22‧‧‧ second wire

L21a, L21b, L22a‧‧‧ wires

L51a, L51b, L51c, L51d1, L51d2, L51e1, L51e2‧‧‧ wires

Ma‧‧‧Shell structure

M1‧‧‧shell body

M11, m12‧‧‧ first and second parts

P21, p22‧‧‧ first and second pad parts

P31a‧‧‧First contact part

P32a, p32a’‧‧‧second contact parts

P31b, p32b‧‧‧ third and fourth contact parts

P51a, p52a‧‧‧ first and second contact parts

R0, R5‧‧‧ slots

R01, r51‧‧‧ openings

R02, r52‧‧‧ wall

R100‧‧‧ inner wall surface

S01‧‧‧Longer section

S01a, s01b, s01c, s01d, s01e‧‧‧ first section

S02‧‧‧Short section

S02a, s02b, s02c, s02d, s02e‧‧‧ second section

S1, S1a, S1b, S1c, S1d‧‧‧ common peripheral parts

T1‧‧‧ socket structure

T3, T4‧‧‧ base structure

T5‧‧‧ socket structure

W‧‧‧Metal Welding Department

Z1-z1, z2-z2, z3-z3, z41-z41, z42-z42, z51-z51, z52-z52‧‧

1A is an exploded view of a card structure according to a first embodiment of the present invention; FIG. 1B is a combination view of the card structure according to FIG. 1A; and FIG. 1C is a view showing a card structure according to FIG. 1B. 2 is a schematic view showing a variation of a card structure according to a first embodiment of the present invention; FIG. 3A is an exploded view showing a combination structure according to a second embodiment of the present invention; Figure 4 is a perspective view showing a combined structure according to a third embodiment of the present invention; Figure 4 is a perspective view showing a card structure according to a third embodiment of the present invention; and Figure 5A is a view showing a combined structure according to a fourth embodiment of the present invention. Exploded view; Figure 5B shows a combined view of the combined structure according to Fig. 5A; Fig. 6A shows an exploded view of a card structure according to a fifth embodiment of the present invention; and Fig. 6B shows a card according to Fig. 6A Combination view of structure; Fig. 7A shows a side view of the card structure according to Fig. 6B; Fig. 7B shows a top view of the card structure according to Fig. 6B; Fig. 8A shows a sixth embodiment according to the present invention One card An exploded view of the structure; Figure 8B shows a combined view of the card structure according to Figure 8A; Fig. 9A is a side view showing the structure of the card according to Fig. 8B; Fig. 9B is a top view of the card structure according to Fig. 8B; and Fig. 10A is a view showing a card structure according to a seventh embodiment of the present invention; Fig. 10B is a top view of the card structure according to Fig. 10A; Fig. 11A is a view showing a card structure according to an eighth embodiment of the present invention; and Fig. 11B is a view showing the card structure according to Fig. 11A. Figure 12A is a schematic view showing a card structure according to a ninth embodiment of the present invention; Figure 12B is a top view of the card structure according to Figure 12A; and Figure 13A is a view showing a tenth embodiment according to the present invention. A schematic diagram of a first component of a card structure; FIG. 13B is a schematic view showing a second component of a card structure according to a tenth embodiment of the present invention; and FIG. 13C is a first embodiment of the tenth embodiment of the present invention A schematic view of a card structure formed by combining elements and a second element with each other; FIG. 13D is a cross-sectional view of the card structure cut along a line segment (z1-z1) of FIG. 13C; FIG. 13E is a view BRIEF DESCRIPTION OF THE DRAWINGS FIG. 14A is a schematic view showing a first element of a card structure according to an eleventh embodiment of the present invention; and FIG. 14B is a view showing a first embodiment of the card structure according to the eleventh embodiment of the present invention; A schematic diagram of a second component of one of the card structures of the eleventh embodiment; Figure 14C is a view showing a card structure formed by combining a first element and a second element in accordance with an eleventh embodiment of the present invention; and Figure 14D is a view taken along a line segment (z2-z2) of Figure 14C. FIG. 14E is a cross-sectional view showing a variation of a card structure according to an eleventh embodiment of the present invention; and FIG. 15A is a view showing a card structure according to a twelfth embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 15B is a view showing a second element of a card structure according to a twelfth embodiment of the present invention; and FIG. 15C is a view showing a first element according to a twelfth embodiment of the present invention; A schematic view of a card structure formed by combining the second components with each other; a 15D diagram showing a cross-sectional view of the card structure cut along a line segment (z3-z3) of FIG. 15C; and a 15E diagram showing the first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 16A is a schematic view showing a first element of a card structure according to a thirteenth embodiment of the present invention; and FIG. 16B is a thirteenth embodiment of the present invention. FIG. 16C is a schematic view showing a card structure formed by combining a first component and a second component according to a thirteenth embodiment of the present invention; FIG. 16D1 is a view showing a second component of a card structure; A cross-sectional view of the card structure is cut along a line segment (z41-z41) of Fig. 16C; and a 16D2 image is taken along a line segment (z42-z42) of Fig. 16C. FIG. 16E is a schematic view showing a variation of a card structure according to a thirteenth embodiment of the present invention; and FIG. 17A is a view showing a card structure according to a fourteenth embodiment of the present invention. 1A is a schematic view showing a second component of a card structure according to a fourteenth embodiment of the present invention; and FIG. 17C is a view showing a first component according to the fourteenth embodiment of the present invention; A schematic diagram of a card structure formed by combining the second components with each other; a 17D1 diagram showing a cross-sectional view of the card structure cut along a line segment (z51-z51) of FIG. 17C; and a 17D2 diagram showing a 17C A line segment (z52-z52) is a cross-sectional view of the card structure; a 17E is a schematic view showing a variation of the card structure according to the fourteenth embodiment of the present invention; and FIG. 18 is a view showing a modification according to the present invention. 15 is a schematic view showing a combined structure of a sixteenth embodiment of the present invention; and FIG. 20A is a schematic view showing a card structure according to a seventeenth embodiment of the present invention; Exploded view; FIG. 20B indicate that a combination of the structure of FIG card according to a seventeenth embodiment of one embodiment of the present invention; FIG. 21A showing a first exploded view of one embodiment of the card-type structure according to an eighteenth embodiment of the present invention; Figure 21B is a combination view showing a card structure according to an eighteenth embodiment of the present invention; Figure 22A is an exploded view showing a card structure according to a nineteenth embodiment of the present invention; and Figure 22B is a view showing a card structure according to the present invention; A combination view of a card structure of a nineteenth embodiment; an exploded view of a combination structure according to a twentieth embodiment of the present invention; and a second embodiment of a twentieth embodiment of the present invention Combination diagram of structure; Fig. 24A is a combination diagram of a combination structure according to a twenty-first embodiment of the present invention; and Fig. 24B is an exploded view showing a combination structure of a twenty-first embodiment according to the present invention; 24C is another exploded view of a combined structure according to a twenty-first embodiment of the present invention; FIG. 25A is a combination view showing a combined structure according to a twenty-second embodiment of the present invention; and FIG. 25B is a view showing An exploded view of a combined structure of one of the twenty-second embodiments of the present invention; and a twenty-fifth (C) figure showing another exploded view of a combined structure according to a twenty-second embodiment of the present invention.

1‧‧‧ first component

10‧‧‧First Ontology

100s‧‧‧First perimeter

101‧‧‧First joint

11c‧‧‧ first contact

2‧‧‧second component

20‧‧‧Second ontology

200s‧‧‧Second peripheral

201‧‧‧Second joint

21c‧‧‧second junction

B1‧‧‧ card body

C1‧‧‧ card structure

D1‧‧‧ circuit unit

D2‧‧‧ card contact unit

G21‧‧‧First contact parts

G22‧‧‧second contact parts

L1‧‧‧First wire

L21, L22‧‧‧ second wire

Claims (61)

A card structure comprising: a first component comprising at least a first contact and a first peripheral portion, the at least one first contact being present in the first peripheral portion; and a second component comprising at least a second contact and a second peripheral portion, the at least one second contact being associated with the at least one first contact of the first component and presented at the second peripheral portion; when the first component is When the second components are coupled to each other, the first peripheral portion of the first component and the second peripheral portion of the second component are adjacent to each other such that the at least one first contact of the first component and the first component The at least one second contact of the two components may be juxtaposed with each other, wherein the at least one first contact of the first component and the at least one second contact of the second component are mutually connected via a soldering portion And coupled to each other. The card structure of claim 1, wherein the first peripheral portion of the first member and the second peripheral portion of the second member are when the first member and the second member are coupled to each other Adjacent to each other and forming an interface region, the at least one first contact of the first component and the at least one second contact of the second component juxtaposed with each other are co-located in the interface region. The card structure of claim 1, further comprising a circuit unit coupled to the at least one first contact of the first component. a card structure as described in claim 3, wherein the The first component and the circuit unit form an on-board connection wafer device. The card structure of claim 1, further comprising a contact unit coupled to the at least one second contact of the second component. The card structure of claim 5, wherein the second component comprises a plurality of second contacts, the contact unit comprising a plurality of first contact members and a plurality of second contact members, the first of the contact units The contact members and the second contact members are respectively coupled to the second contacts of the second component. The card structure of claim 6, wherein the first contact members of the contact unit comprise a plurality of pad members, and the second contact members of the contact unit comprise a plurality of elastic pieces. A combination structure comprising: a socket structure comprising a socket body and a socket contact unit, the socket contact unit is disposed on the socket body; and a card structure detachably disposed on the socket body of the socket structure The card structure includes: a first component, including at least a first contact and a first peripheral portion, the at least one first contact is present in the first peripheral portion; and a second component, including at least a second contact and a second peripheral portion, the at least one second contact being opposite to the at least one first contact of the first component and presented in the second peripheral portion, when the first component is When the second components are coupled to each other, the first peripheral portion of the first component and the second peripheral portion of the second component are adjacent to each other such that the at least one first contact of the first component and the first component At least one second contact of the two components And a card contact unit coupled to the at least one second contact of the second component, the card contact unit being detachably contacting the socket contact unit of the socket structure; when the card When the structure is disposed on the socket body of the socket structure, the card contact unit of the card structure contacts the socket contact unit of the socket structure, such that the card structure and the socket structure are coupled, wherein the card The at least one first contact of the first component and the at least one second contact of the second component, which are juxtaposed to each other, are coupled to each other via a soldering portion. The combination structure of claim 8, wherein when the first component and the second component of the card structure are coupled to each other, the first peripheral portion of the first component and the second component The second peripheral portions are adjacent to each other and form an interface region, and the at least one first contact of the first component and the at least one second contact of the second component that are juxtaposed to each other are co-located in the interface region. The combination structure of claim 8, wherein the card structure further comprises a circuit unit coupled to the at least one first contact of the first component. The combination structure of claim 10, wherein the first component of the card structure and the circuit unit form an on-board connection wafer device. The combination structure of claim 8, wherein the second component of the card structure comprises a plurality of second contacts, the card contact list The first contact member and the plurality of second contact members are coupled to the second contacts of the second member. The combination structure of claim 12, wherein the first contact members of the card contact unit comprise a plurality of pad members. The combination structure of claim 12, wherein the second contact members of the card contact unit comprise a plurality of elastic pieces. The combination structure of claim 8, wherein the socket contact unit of the socket structure comprises a plurality of first contact members and a plurality of second contact members, the first contact members of the socket contact unit and the same The second contact member is disposed on the socket body; when the card structure is disposed on the socket structure via the socket body of the socket structure, the card contact unit of the card structure contacts the socket of the socket structure The first contact members of the contact unit and the second contact members are such that the card structure and the socket structure are coupled. The combination structure of claim 15, wherein the first contact members of the socket structure comprise a plurality of elastic pieces. The combination structure of claim 15, wherein the second contact members of the socket structure comprise a plurality of pad members. A card structure is applicable to a socket structure having a plurality of first elastic pieces and a plurality of second elastic pieces, the card structure comprising: a body including an outer surface; a plurality of first pad members and a plurality of second pad members respectively The first elastic piece and the second elastic piece are disposed on the body relative to the socket structure Above the outer surface; and a circuit unit including a wafer coupled to the first pad member and the second pad member; when the card structure is disposed on the socket structure, the card structure a pad member and the second pad member are respectively in contact with the first elastic piece and the second elastic piece of the socket structure, wherein the number of the first pad parts is 4, and the second pad parts are The number is 5. The card structure of claim 18, wherein the first pad member and the second pad member are made of a conductive material. A socket structure is provided for providing a card structure having a plurality of first pad members and a plurality of second pad members, the socket structure comprising: a body comprising a slot having a wall surface and an opening; the plurality of first contact members and a plurality of second contact members respectively disposed on the wall surface of the socket of the body with respect to the first pad member and the second pad member of the card structure; a circuit unit including a chip coupling Connecting the first pad member and the second pad member; when the card structure is disposed on the body of the socket structure via the opening of the slot, the first pad member of the card structure and the The second pad component is respectively in contact with the first contact component and the second contact component of the socket structure, wherein the number of the first pad components is 4, and the number of the second pad components is 5 . For example, the socket structure described in claim 20 of the patent scope includes A positioning member extending from the body and forming the opening of the slot of the body and the wall. The socket structure of claim 20, wherein the first contact members and the second contact members are a plurality of elastic pieces. The socket structure of claim 20, further comprising a plurality of third contact members disposed on the wall of the slot of the body, the third contact members being the same The first contact member, the second contact members are closer to the opening of the slot of the body. The socket structure of claim 23, wherein the third contact members are a plurality of elastic pieces. The socket structure of claim 20, further comprising a plurality of fourth contact members disposed on the wall of the slot of the body, the fourth contact members being the same The first contact member, the second contact members are closer to the opening of the slot of the body. The socket structure of claim 25, wherein the fourth contact members comprise a plurality of pad members. A card structure comprising: a first substrate comprising a base surface, at least one part area and a terminal area, the at least one part area and the terminal area being disposed on the base surface; a second substrate, a terminal region disposed on the base surface of the first substrate and coupled to the first substrate; and a connector disposed on the base surface of the first substrate in a manner of being juxtaposed to the second substrate The connector includes a bonding surface, a contact unit and a plurality of contact regions, wherein the contact regions are disposed on the bonding surface, and the contact unit is coupled to the contact regions when the connection Via the connection When the mating surface is connected to the base surface of the first substrate, the connector covers the at least one component area of the first substrate, and the contact regions of the connector are coupled to the first substrate The terminal region is such that the contact regions of the connector are coupled to the second substrate via the terminal region of the first substrate. The card structure of claim 27, wherein the connector further comprises a receiving portion, the receiving portion is disposed on the joint surface, and the connector is connected to the first through the joint surface The receiving portion of the connector receives the at least one electronic component region of the first substrate. The card structure of claim 28, wherein the receiving portion of the connector is a recess. The card structure of claim 27, wherein the joint surface of the connector is substantially a U-shaped joint surface having a first segment and two second segments, the two The two sections are connected to the first section in a mutually parallel manner, the first section is located between the two second sections and the second substrate, and the contact zones are disposed in the U-shaped Above the first section of the joint. The card structure of claim 27, wherein the joint surface of the connector is substantially a U-shaped joint surface having a first segment and two second segments, the two The two sections are connected to the first section in a mutually parallel manner, the two sections are tied between the first section and the second substrate, and the contact zones are disposed in the U-shaped Above the first section of the joint. The card structure as described in claim 27, wherein The contact unit of the connector includes at least one first contact member and at least one second contact member, and the at least one first contact member of the contact unit and the at least one second contact member are coupled to the contact unit The contact areas of the connector. The card structure of claim 32, wherein the at least one first contact member of the contact unit of the connector comprises a plurality of pad members, and the at least one second contact member of the contact unit of the connector Includes multiple shrapnel. The card structure of claim 27, wherein the first substrate comprises a circuit unit. The card structure of claim 27, wherein the second substrate comprises an on-board connection wafer device. A card structure comprising: a first substrate comprising a base surface; a second substrate disposed on the base surface of the first substrate and coupled to the first substrate; an intermediate unit; and a connector Provided on the base surface of the first substrate via the intermediate unit in a manner of being juxtaposed on the second substrate, the connector is coupled to the first substrate, wherein the intermediate unit is integrally formed An electronic component area of the first substrate. The card structure of claim 36, wherein the intermediate unit comprises at least one connecting portion, the connector comprises a contact unit, the contact unit of the connector is via the at least one connecting portion of the intermediate unit And coupled to the first substrate. The card structure of claim 37, wherein the contact unit of the connector comprises at least one first contact member and at least one second contact member, the at least one first of the contact unit of the connector The contact member and the at least one second contact member are coupled to the connection portion of the intermediate unit. The card structure of claim 38, wherein the at least one first contact member of the contact unit of the connector comprises a plurality of pad members, and the at least one second contact member of the contact unit of the connector Includes multiple shrapnel. The card structure of claim 37, wherein the at least one connecting portion of the intermediate unit comprises a conductive columnar structure. The card structure of claim 37, wherein the at least one connecting portion of the intermediate unit is a non-conductive columnar structure. The card structure of claim 36, wherein the first substrate comprises a circuit unit. The card structure of claim 36, wherein the second substrate comprises an on-board connection wafer device. A combined structure includes: a housing structure including a housing body having a first access portion and a second access portion, the first access portion and the second access portion being interconnected; a card structure is detachably disposed on the housing body of the housing structure via the first access portion or the second access portion of the housing body of the housing structure, the card structure comprising: a first component , including at least a first contact and a first perimeter The at least one first contact is present in the first peripheral portion; a second component includes at least one second contact and a second peripheral portion, the at least one second contact being opposite to the The at least one first contact of the first component and the second peripheral portion, when the first component and the second component are coupled to each other, the first peripheral portion of the first component and the second component The second peripheral portions are adjacent to each other such that the at least one first contact of the first component and the at least one second contact of the second component are juxtaposed to each other; and a card contact unit is disposed on The second component is coupled to the at least one second contact of the second component; and the card structure is disposed on the first access portion or the second access portion of the case body of the outer casing structure When the shell body of the outer shell structure is formed, a space is formed between the card structure and the shell body of the outer shell structure, and the card contact unit of the card structure faces the chamber, wherein the card structures are juxtaposed to each other The at least one first contact of the first component The second element of the system via the at least one second contact portion and a solder coupled to each other. The combined structure of claim 44, wherein the shell body of the outer shell structure further comprises a U-shaped member, the chamber being formed in the U-shaped member. The combination structure of claim 44, wherein when the first component and the second component of the card structure are coupled to each other, the first peripheral portion of the first component and the second component The second peripheral portions are adjacent to each other and form an interface region, and the at least one first contact of the first component and the at least one second contact of the second component are juxtaposed with each other Co-located in the junction area. The combined structure of claim 44, wherein the card structure further comprises a circuit unit coupled to the at least one first contact of the first component. The combination structure of claim 47, wherein the first component of the card structure and the circuit unit form an on-board connection wafer device. The combination structure of claim 44, wherein the card structure further comprises a contact unit coupled to the at least one second contact of the second component. The combination structure of claim 49, wherein the second component comprises a plurality of second contacts, the contact unit comprising a plurality of first contact members and a plurality of second contact members, the first of the contact units The contact members and the second contact members are respectively coupled to the second contacts of the second component. The combination structure of claim 50, wherein the first contact members of the contact unit comprise a plurality of pad members, and the second contact members of the contact unit comprise a plurality of elastic pieces. A combined structure includes: a housing structure including a housing body having a first access portion and a second access portion, the first access portion and the second access portion being interconnected; a card structure is detachably disposed on the housing body of the housing structure via the first access portion or the second access portion of the housing body of the housing structure, the card structure comprising: a card body comprising an outer surface; a plurality of first pad members and a plurality of second pad members disposed on the outer surface of the card body; and a circuit unit including a wafer coupled to the first pad member And the second pad member; when the card structure is disposed on the housing body of the housing structure via the first access portion or the second access portion of the housing body of the housing structure, the card structure Forming a chamber between the card body and the housing body of the housing structure, and the first pad member and the second pad member of the card structure are oriented toward the housing, wherein the card structure is The number of first pad members is four, and the number of the second pad members is five. The combination structure of claim 52, wherein the housing body of the outer casing structure further comprises a U-shaped member, the chamber being formed in the U-shaped member. The combination structure of claim 52, wherein the first pad member and the second pad member of the card structure are made of a conductive material. A card structure comprising: a first component comprising at least a first contact and a first peripheral portion, the at least one first contact being present in the first peripheral portion; a second component comprising at least one a second contact and a second peripheral portion, the at least one second contact being disposed at the second peripheral portion with respect to the at least first contact of the first component; and a contact unit, including The first contact of the second component a component, and a plurality of second contact members disposed on the first component; the first peripheral portion of the first component and the second perimeter of the second component when the first component and the second component are coupled to each other The portions are adjacent to each other such that the at least one first contact of the first component and the at least one second contact of the second component are juxtaposed to each other, and the second contact component and the first contact component are also The at least one first contact of the first component and the at least one second contact of the second component that are juxtaposed to each other are coupled to each other via a soldering portion. The card structure of claim 55, wherein the first peripheral portion of the first member and the second peripheral portion of the second member are coupled when the first member and the second member are coupled to each other Adjacent to each other and forming an interface region, the at least one first contact of the first component and the at least one second contact of the second component juxtaposed with each other are co-located in the interface region. The card structure of claim 55, further comprising a circuit unit coupled to the at least one first contact of the first component. The card structure of claim 57, wherein the first component and the circuit unit form an on-board connection wafer device. The card structure of claim 55, wherein the contact unit is coupled to the at least one second contact of the second component. The card structure of claim 59, wherein the second component comprises a plurality of second contacts, and the first contact members and the second contact members of the contact unit are respectively coupled to the first The second component Wait for the second contact. The card structure of claim 60, wherein the first contact members of the contact unit comprise a plurality of pad members, and the second contact members of the contact unit comprise a plurality of elastic pieces.