TWI447839B - Substrate processing apparatus and method of manufacturing semiconductor device - Google Patents

Description

Substrate processing apparatus and method of manufacturing semiconductor apparatus

The present invention relates to a substrate processing apparatus and a method of manufacturing the semiconductor apparatus.

A conventional substrate processing apparatus that performs a manufacturing process of a semiconductor device or a manufacturing process of a display device includes a processing tube that processes a substrate, a wafer boat on which the substrate is placed, and a furnace opening that is opened and closed at a lower end of the processing tube Cover, lifting the boat together with the lid to carry the boat into the processing tube, and pushing the lid against the lifting mechanism of the furnace mouth, the motor driving the lifting mechanism, and the seal between the sealing cover and the lower end of the processing tube member.

After the substrate is processed, the lid is lowered to carry the wafer boat out of the processing tube. At this time, in a state where the sealing member is attached to the lower end surface of the processing tube, the cover starts to descend. As a result, the cover is deflected during the process in which the sealing member is gradually peeled off from the contact surface of the lower end of the processing tube, and the cover vibrates when the deflection is to be restored, and the vibration is transmitted to the boat placed on the cover. Therefore, the substrate placed on the wafer boat may be damaged by falling or falling from the boat.

Accordingly, the present invention has an object of providing a substrate processing apparatus and a method of manufacturing a semiconductor device which can suppress vibration of a cover which is generated in an initial stage of carrying out a wafer boat from a processing tube.

According to an aspect of the present invention, a substrate processing apparatus includes: a wafer boat on which a substrate is placed; a processing tube that accommodates the wafer boat; and a cover that mounts the wafer boat and is opened and closed at a lower end of the processing tube a furnace opening; a lifting mechanism for lifting the cover; a motor driving the lifting mechanism; a sealing member sealing the lower end surface of the processing tube and the cover; and a control portion being disposed under the processing tube The recovery period of the deformation of the cover generated when the end surface or the surface of the cover is opened by the sealing member controls the torque of the motor in such a manner that the substrate stays at the mounting position in the boat.

According to another aspect of the present invention, a method of fabricating a semiconductor device is provided, wherein after processing a substrate placed on a wafer boat in a processing tube, a cover that seals the furnace opening of the processing tube through the sealing member is lowered to open The furnace port, and the wafer boat in the processing tube is carried out from the furnace mouth, and the recovery period of the deformation of the cover generated when the sealing member is pulled from the lower end surface of the processing tube or the surface of the cover is The torque of the motor for driving the elevating mechanism that lowers the cover is controlled in such a manner that the substrate stays at the mounting position in the wafer boat.

According to the substrate processing apparatus and the method of manufacturing the semiconductor device of the present invention, it is possible to suppress the vibration of the cover which is generated in the initial stage of carrying out the wafer boat from the processing tube.

[Formation for carrying out the invention]

<First Embodiment of the Present Invention>

Hereinafter, the substrate processing apparatus according to the first embodiment of the present invention will be described with reference to the drawings.

(1) Composition of substrate processing device

First, a configuration example of the substrate processing apparatus 101 which is a substrate processing process which is one of the manufacturing processes of the semiconductor device will be described. 1 is a schematic configuration diagram of a main part of a substrate processing apparatus 101 of the present embodiment, and FIG. 2 is an oblique perspective view of the substrate processing apparatus 101 of the present embodiment. 3 is a longitudinal cross-sectional view showing details of the processing furnace 201 of the substrate processing apparatus 101.

As shown in FIG. 1, the substrate processing apparatus 101 of the present embodiment includes a processing furnace 201 that processes the wafer 10 as a substrate. The wafer 10 is, for example, a germanium substrate, or may be a semiconductor substrate other than germanium, a glass substrate, a ceramic substrate, a plastic substrate, or the like. In the processing furnace 201, a processing tube 203 including a process tube in which a processing chamber 202 is formed later is provided, and a heater as a heating means to be described later is provided so as to surround the processing tube 203. Further, a boat elevator 115 as an elevating mechanism is provided along the side of the processing furnace 201. The arm portion 128 as the support portion of the boat elevator 115 is configured to be movable up and down by the drive mechanism 126. On the arm portion 128, a sealing cover 219 as a cover is supported, and the cover is used to open and close the furnace opening 207 provided at the lower end of the processing tube 203. Further, a seal ring 221 as a sealing member is provided on the seal cap 219 to seal the seal cap 219 from the lower end surface of the process tube 203. The seal ring 221 is formed, for example, by an O-ring. Further, the upper surface of the sealing cover 219 is configured to mount the wafer boat 11, and the wafer boat 11 is placed in a plurality of stages while the wafer 10 as a substrate is horizontally held.

The drive mechanism 126 is configured, for example, as a ball screw structure, and includes a ball screw shaft 127 and a guide post (not shown). The ball screw shaft 127 is meshed with a screw (not shown) provided in the arm portion 128. The cap portion is such that the arm portion 128 is raised and lowered in the vertical direction, and the guiding strut causes the arm portion 128 to slide while being guided in the vertical direction. The drive mechanism 126 of the present embodiment is mainly constituted by a nut portion, a ball, a ball screw shaft 127, and a guide post. Further, a motor 129 that drives the ball screw shaft 127 to rotate is provided at an upper end portion (or a lower end portion) of the ball screw shaft 127. Thereby, the drive motor 129 rotates the ball screw shaft 127, thereby raising and lowering the arm portion 128. Thereby, the sealing cover 219 and the wafer boat 11 placed thereon are raised or lowered to carry in or out of the wafer boat 11 into the processing chamber 202. Further, when the wafer boat 11 is carried into the processing chamber 202, the wafer boat lifter 115 is supported by the sealing cover 219 of the arm portion 128, that is, pressed through the seal ring 221 to the lower end surface of the processing tube 203, so that The inside of the processing chamber 202 is kept airtight.

Further, a torque sensor 271 that measures the torque of the drive shaft is provided on the drive shaft of the motor 129. Further, the motor 129 is provided with a control unit 281 that controls the torque of the motor 129 to a predetermined value. Thereby, the control portion 281 is a recovery period of deformation (for example, deformation due to vibration) generated when the seal ring 221 is pulled away from the lower end surface of the process tube 203 or the surface of the seal cap 219, so that The torque of the motor 129 is controlled in such a manner that the wafer 10 stays at the placement position in the wafer boat 11. For example, it is controlled such that the torque of the motor 129 is within a certain range. A detailed example of the torque control will be described later. In addition, the torque control of the motor 129 of the control unit 281 may be configured such that the control unit 281 is incorporated in a drive control unit, which will be described later, and is driven by the drive control unit.

Next, the overall configuration of the substrate processing apparatus 101 will be specifically described.

As shown in FIG. 2, the substrate processing apparatus 101 of the present embodiment is provided with a housing 111. When the wafer 10 as a substrate is to be transported to the inside and outside of the casing 111, a cassette 110 that accommodates a plurality of wafers 10 as a wafer carrier (substrate storage container) is used. A cassette stage 114 that serves as a receiving station for the cassette 110 is provided in front of the inside of the housing 111. The cassette 110 is placed on the cassette stage 114 by an in-process conveyance device (not shown), and is carried out from the cassette stage 114 to the outside of the housing 111.

The cassette 110 is placed on the cassette stage 114 by the in-process transfer apparatus such that the wafer 10 in the cassette 110 is in a substantially vertical posture and the wafer inlet and outlet of the cassette 110 is directed upward, for example. The cassette stage 114 is configured to rotate the cassette 110 90° in the longitudinal direction toward the rear of the housing 111 so that the wafer 10 in the cassette 110 is horizontally oriented and the wafer inlet and outlet of the cassette 110 are oriented. The rear side of the casing 111.

A cassette holder 105 that serves as a mounting frame for the cassette 110 is provided in a substantially central portion of the housing 111 in the front-rear direction. The cassette truss 105 is configured to store a plurality of cassettes 110 in a plurality of stages and in a plurality of columns. A transfer frame 123 is provided in the cassette cradle 105 to accommodate the cassette 110 to be transported by the wafer transfer mechanism 125. Further, a preliminary cassette truss 107 is provided above the cassette stage 114, and the cassette 110 is preliminarily stored.

A cassette transporting device 118 as a substrate storage container transporting device is disposed between the cassette stage 114 and the cassette holder 105. The cassette conveying device 118 is provided with a cassette elevator 118a as an elevating mechanism that can be raised and lowered under the holding cassette 110, and a cassette conveying mechanism 118b as a conveying mechanism that can move horizontally under the holding cassette 110. By the coordinated operation of the cassette elevator 118a and the cassette transport mechanism 118b, the card is transported between the cassette stage 114, the cassette holder 105, the preparatory cassette holder 107, and the transfer frame 123.匣110.

A wafer transfer mechanism 125 as a substrate transfer mechanism is provided behind the cassette truss 105. The wafer transfer mechanism 125 includes a wafer transfer device 125a as a substrate transfer device that can rotate or directly move the wafer 10 in the horizontal direction, and a substrate transfer device that lifts and lowers the wafer transfer device 125a. A wafer transfer device lift 125b of the lifting mechanism of the device. Further, the wafer transfer device 125a is provided with a tweezer 125c as a substrate transfer jig that holds the wafer 10 in a horizontal posture. By the coordinated operation of the wafer transfer device 125a and the wafer transfer device elevator 125b, the wafer 10 is picked up from the cassette 110 on the transfer frame 123 and is loaded to be held as a substrate to be described later. The wafer boat 11 is loaded or unloaded from the wafer boat 11 to be received in the cassette 110 on the transfer frame 123.

A processing furnace 201 is disposed above the rear portion of the casing 111. At the lower end of the processing furnace 201, an opening (not shown) as a furnace opening is provided. This opening is configured to open and close by a furnace gate (port opening/closing mechanism) 147 that opens and closes the opening. The configuration of the processing furnace 201 will be described in detail later.

Below the processing furnace 201, a boat elevator 115 as a lifting mechanism for moving the boat 11 up and down to be transported to the inside and outside of the processing furnace 201 is provided. In the boat elevator 115, an arm portion 128 that can be raised and lowered is provided. On the arm portion 128, a sealing cover 119 as a cover is provided in a horizontal posture to support the boat 11 in a vertical direction, and the lower end portion of the processing furnace 201 is closed to be airtight.

The wafer boat 11 is configured to include a plurality of holding members, and the wafers 10 of a plurality of sheets (for example, about 50 to 150 sheets) are arranged in a vertical posture and in a state of being aligned in a vertical direction and in a plurality of stages. maintain. The detailed configuration of the boat 11 will be described later.

Above the cassette truss 105, a cleaning unit 134a having a supply fan and a dust filter is provided. The cleaning unit 134a is configured to allow the clean air of the purified atmosphere to flow inside the casing 111.

Further, a clean unit (not shown) including a supply fan and a dust filter is provided on the left end portion of the casing 111 on the side opposite to the side of the wafer transfer device lift 125b and the boat elevator 115 to supply cleanliness. air. The clean air blown out from the cleaning unit (not shown) is configured to be sucked into the exhaust device (not shown) after flowing through the wafer transfer device 125a and the wafer boat 11, and is exhausted to the outside of the casing 111. .

(2) Action of the substrate processing device

Next, the operation of the substrate processing apparatus 101 of the present embodiment will be described.

First, the cassette 110 is placed on the cassette stage 114 by the in-process transfer apparatus (not shown) so that the wafer 10 is in a substantially vertical posture and the wafer inlet and outlet of the cassette 110 are directed upward. Then, the cassette 110 is rotated by 90° in the longitudinal direction toward the rear of the casing 111 by the cassette stage 114. As a result, the wafer 10 in the cassette 110 has a horizontal posture, and the wafer entrance and exit of the cassette 110 faces the rear of the housing 111.

Next, the cassette 110 is automatically transported to the designated rack position of the cassette holder 105 or the preparatory cassette holder 107 by the cassette transport device 118 for receipt, and after being temporarily stored, the cassette holder 105 is temporarily stored. Or the preparatory card truss 107 is transferred to the transfer frame 123 or directly transferred to the transfer frame 123.

Once the cassette 110 is transferred to the transfer frame 123, the wafer 10 is picked up from the cassette 110 through the wafer inlet and outlet by the clamp 125c of the wafer transfer device 125a, and the wafer transfer device 125a and the crystal are transferred. The circular transfer device lift 125b is coordinated and is loaded on the boat 11 located behind the transfer frame 123. The wafer 10 is transferred to the wafer transfer mechanism 125 of the wafer boat 11, returned to the cassette 110, and the next wafer 10 is loaded into the wafer boat 11.

Once the wafer 10 of the predetermined number of wafers is loaded into the wafer boat 11, the opening of the lower end portion of the processing furnace 201 closed by the furnace gate 147 is opened by moving the furnace gate 147. Then, the sealing cover as a cover (not shown) is lifted by the boat elevator 115, whereby the wafer boat 11 holding the wafer 10 to be processed is air-tightly loaded (loaded) into the processing furnace 201. . After the loading, the wafer 10 is subjected to a predetermined process in the processing furnace 201. After the processing, the wafer 10 and the cassette 110 are carried out to the outside of the housing 111 in the reverse order of the above procedure.

(3) Composition of the treatment furnace

Next, the configuration of the processing furnace 201 of the substrate processing apparatus of the present embodiment will be described. Fig. 3 is a longitudinal sectional view showing a processing furnace of a substrate processing apparatus according to an embodiment of the present invention. Further, the processing furnace 201 of the present embodiment is constituted by a CVD apparatus (batch type vertical hot wall type pressure reducing CVD apparatus) as shown in Fig. 3 .

(process tube)

The processing furnace 201 is provided with a vertical process tube that is disposed in a vertical direction so that the center line is vertical and supported by the frame 111. The process pipe system is provided with an inner pipe 204 and an outer pipe 205. The inner tube 204 and the outer tube 205 are integrally formed into a cylindrical shape by a material having high heat resistance such as quartz (SiO ₂ ) or tantalum carbide (SiC).

The inner tube 204 is formed in a cylindrical shape in which the upper end is closed and the lower end is open. In the inner tube 204, a processing chamber 202 is formed to accommodate and process the wafer 10 which is stacked in a plurality of stages in a horizontal posture by the wafer boat 11 as a substrate holder. The lower end opening of the inner tube 204 constitutes a furnace opening 207 for holding and holding the wafer boat 11 holding the wafer 10 group. Therefore, the inner diameter of the inner tube 204 is designed to be larger than the maximum outer diameter of the wafer boat 11 in which the wafer 10 group is held. The outer tube 205 is formed in a cylindrical shape in which the upper end is closed and the lower end is open, and the side wall portion is formed in a large, for example, similar shape with respect to the inner tube 204. That is, the outer tube 205 is covered in a concentric circle so as to surround the outer side of the inner tube 204 as viewed from above. The lower end portion of the inner tube 204 and the lower end portion of the outer tube 205 are sealed to be airtight by a manifold 209 formed in a ring shape. Further, the lower end portion of the outer tube 205 and the outer peripheral end portion of the manifold 209 are sealed to be airtight by the seal ring 222. The manifold 209 is detachably attached to the inner tube 204 and the outer tube 205 so that the maintenance inspection work or the cleaning operation for the inner tube 204 and the outer tube 205 can be easily performed. By supporting the manifold 209 to the casing 111 (refer to the second drawing described above), the process pipe is mounted in a vertical state. Therefore, the processing tube 203 is constituted by the process tube composed of the inner tube 204 and the outer tube 205 and the manifold 209.

(exhaust unit)

An exhaust system 230 that exhausts gas within the processing chamber 202 is coupled to a portion of the sidewall of the manifold 209. The exhaust system 230 is disposed at a lower end portion of the exhaust path 250, and the exhaust path 250 is constituted by a cylindrical space formed by a gap between the inner tube 204 and the outer tube 205. The exhaust pipe 231 constituting the exhaust system 230 is communicated into the exhaust path 250. In the order from the upstream, the exhaust pipe 231 is provided with a pressure sensor 245, an APC (Auto Pressure Controller) valve 242 as a pressure regulating valve, and a vacuum pump 246 as a vacuum exhausting device. The vacuum pump 246 is configured to evacuate the pressure in the processing chamber 202 to a predetermined pressure (degree of vacuum). A pressure control unit 236 is electrically connected to the APC valve 242 and the pressure sensor 245. The pressure control unit 236 is configured to control the opening degree of the APC valve 242 based on the pressure detected by the pressure sensor 245 so that the pressure in the processing chamber 202 becomes a desired pressure at a desired timing. The exhaust unit of the present embodiment is mainly constituted by the exhaust pipe 231, the exhaust path 250, the pressure sensor 245, the APC valve 242, and the vacuum pump 246. Further, on the upstream side of the APC valve 242 of the exhaust system 230, an over-pressure prevention line 233 subjected to an overpressure prevention process is connected. When the overpressure prevention line 233 is connected, the overpressure prevention valve 234 is connected. The pressure in the processing chamber 202 becomes over pressurized, and when the overpressure is detected by the pressure sensor 245, the pressure control portion 236 opens the overpressure preventing valve 234 to release the excess in the processing chamber 202. Pressure state.

(substrate holder)

Below the manifold 209, a sealing cover 219 as a cover that opens at the lower end of the opening and closing manifold 209 is provided. The seal cap 219 is formed in a disk shape equal to or larger than the outer diameter of the lower end opening of the manifold 209, and a seal ring 221 as a sealing member that can be in close contact with the lower end surface of the manifold 209 is provided on the outer periphery thereof. In the seal ring 221, for example, an O-ring is used. Further, the seal cover 219 is configured to be lifted in the vertical direction by the boat lifter 115 as the elevating mechanism vertically disposed outside the process pipe 203 in a state where the mounting surface of the boat 11 is horizontal. Therefore, the sealing cover 219 which is raised by the boat elevator 115 is pressed against the lower end surface of the manifold 209 through the seal ring 221, and the lower end of the sealing manifold 209 is opened, so that the processing chamber 202 becomes airtight. .

(Crystal lift)

The above-described boat elevator 115 includes, as an example, an arm portion 128 that supports the seal cover 219 from the lower surface thereof, a guide post (not shown) that guides the elevation of the arm portion 128 in the vertical direction, and the arm portion 128. The drive mechanism 126 is raised and lowered in the vertical direction along the guide post. The drive mechanism 126 is configured by, for example, a ball screw structure, and is configured, for example, by a nut portion (not shown) provided in the arm portion 128 and a ball screw shaft 127 that is meshed with the nut portion through a ball (not shown). Further, a motor 129 (see the first drawing) that can drive the ball screw shaft 127 to rotate is provided at an upper end portion (or a lower end portion) of the ball screw shaft 127. Thereby, the drive motor 129 is configured to rotate the ball screw shaft 127 in a predetermined direction, thereby raising and lowering the arm portion 128.

On the sealing cover 219, the wafer boat 11 as the substrate holder for holding the wafer 10 is vertically supported. The wafer boat 11 is made of, for example, a heat-resistant material such as quartz (SiO ₂ ) or tantalum carbide (SiC), and is configured such that the plurality of wafers 10 are aligned in a horizontal posture and at the center of each other, and are held in a plurality of stages. Further, in the lower portion of the wafer boat 11, a plurality of heat insulating plates 216 which are formed of a heat-resistant material such as quartz or tantalum carbide in a horizontal posture as a heat insulating member are arranged in a plurality of stages in a plurality of stages. The heat shield 216 is configured such that heat from the heater 206 is hard to be conducted to the side of the manifold 209.

On the opposite side of the sealing cover 219 from the processing chamber 202, a rotating mechanism 254 for rotating the boat 11 is provided. The rotating shaft 255 of the rotating mechanism 254 supports the boat 11 from below through the sealing cover 219. The wafer 10 can be rotated in the processing chamber 202 by rotating the rotating shaft 255. The sealing cover 219 is configured to be lifted and lowered in the vertical direction by the above-described boat elevator 115, whereby the boat 11 can be transported to the inside and outside of the processing chamber 202.

A drive control unit 237 is electrically connected to the rotation mechanism 254 and the boat elevator 115. The drive control unit 237 is configured to control the rotation mechanism 254 and the motor 129 of the boat elevator 115 so as to perform a desired operation at a desired timing.

(heater unit)

Outside the outer tube 205, a heater 206 as a heating means is provided to surround the outer tube 205, and the heater 206 covers heating the entire process tube 203 to a uniform or predetermined temperature distribution. The heater 206 is mounted in a vertical state by being supported by a heater base 251 provided in the casing 111 (see FIG. 2) of the substrate processing apparatus 101, for example, a carbon heater. Such as a resistance heater.

In the process tube 203, a temperature sensor 263 as a temperature detector is provided. A temperature control unit 238 is electrically connected to the heater 206 and the temperature sensor 263. The temperature control unit 238 is configured to control the energization state of the heater 206 based on the temperature information detected by the temperature sensor 263 so that the temperature in the processing chamber 202 becomes a desired temperature at a desired timing. distributed.

The heater unit is mainly constituted by a heater 206 and a temperature sensor 263.

(Processing gas supply unit)

A gas supply nozzle 230 is provided that is held in the manifold 209 and vertically erected in the processing chamber 202 to supply a processing gas to the processing chamber 202. The gas supply nozzle 230 has an erect type (not shown) or the like, in addition to the L-shaped type in which the downstream end portion is vertically erected. The gas supply nozzle 230 is made of a non-metallic material having heat resistance such as quartz. Further, the upstream end portion of the gas supply nozzle 230 protrudes outside the processing furnace 201, and is connected to the gas supply nozzle 230 to supply the processing gas to the gas supply pipe 232 in the processing chamber 202. Further, on the upstream side of the gas supply pipe 232, a mass flow controller (MFC) 241 as a gas flow controller is connected to a processing gas supply source or an inert gas supply source (not shown). A gas flow rate control unit 235 is electrically connected to the mass flow controller 241. The mass flow controller 241 is configured to control the flow rate of the gas supplied to the processing chamber 202 at a desired timing so as to be a desired amount. The processing gas is supplied to the processing gas supply unit in the processing chamber 202 by the mass flow controller 241, the gas supply tube 232, and the gas supply nozzle 230, and a plurality of systems may be provided. For example, there are a system for supplying a material gas, a system for supplying a gas containing an additive, a system for supplying a diluent gas, and the like.

(controller)

The gas flow rate control unit 235, the pressure control unit 236, the drive control unit 237, and the temperature control unit 238 also constitute an operation unit including an input unit and an input/output unit, and are electrically connected to the main control unit 239 of the entire control substrate processing apparatus. . The gas flow rate control unit 235, the pressure control unit 236, the drive control unit 237, the temperature control unit 238, and the main control unit 239 are configured as the controller 240.

(4) Substrate processing process

Next, a process of manufacturing a semiconductor device implemented by the substrate processing apparatus 101 will be described with reference to a flowchart of FIG.

First, the plurality of wafers 10 are loaded onto the wafer boat 11 that is carried out from the process tube 203. Thereby, a plurality of sheets of the film to be formed, for example, 100 wafers having a diameter of 300 mm, are accommodated in the wafer boat 11. After the filling of the wafer 10 is completed, the wafer boat 11 holding the plurality of wafers 10 is lifted by the boat elevator 115, and loaded (boat loading) into the processing chamber 202 (the boat is moved into the processing) Indoor: S1). In this state, the lower end surface of the manifold 209 is in a state of being sealed through the seal ring 221 through the seal ring 219, and the inside of the process tube 203 is airtight (the inside of the process tube is airtight: S2).

When the process of loading the wafer 10 into the processing chamber 202 is completed, vacuum evacuation is performed by the vacuum pump 246 to make the inside of the processing chamber 202 a desired pressure (vacuum degree), thereby discharging the gas in the processing chamber 202. surroundings. At this time, the pressure in the process chamber 202 is measured by the pressure sensor 245. Based on the measured pressure, the feedback controls the opening of the APC valve 242. Further, the inside of the processing chamber 202 is heated by the heater 206 to bring the inside of the processing chamber 202 to a desired temperature. Next, the energization status of the heater 206 is feedback controlled based on the temperature information detected by the temperature sensor 263 to make the inside of the processing chamber 202 a desired temperature distribution. Next, the wafer boat 11 is rotated by the rotating mechanism 254, thereby rotating the wafer 10.

Next, the processing gas is supplied into the processing chamber 202 to perform a film forming process on the wafer 10. In other words, the processing gas supplied from a processing gas supply source (not shown) and controlled to a desired flow rate by the MFC 241 is supplied from the gas supply pipe 232, and introduced into the processing chamber 202 through the gas supply nozzle 230. The introduced process gas rises in the processing chamber 202, flows out from the upper end opening of the inner tube 204 into the exhaust path 250, and is exhausted from the exhaust system 230. When the processing gas passes through the processing chamber 202, it is in contact with the surface of the wafer 10, and at this time, a film is deposited on the surface of the wafer 10 by, for example, a thermal CVD reaction (substrate processing: S3).

Upon completion of the film forming process, an after purge process is performed. That is, the gas supply nozzle 232 is passed through the gas supply nozzle 230 to supply the inert gas into the processing chamber 202. Further, at this time, the vacuum exhaust treatment is performed by the vacuum exhaust unit 246. As a result, the gaseous environment within the processing chamber 202 is purified by an inert gas.

At the end of the post-flushing process, the atmospheric return process is performed. That is, the vacuum evacuation process is stopped, and only the supply process of the inert gas is performed. As a result, the pressure in the processing chamber 202 is restored to normal pressure.

When the atmospheric return processing is completed, the wafer boat is carried out. That is, the sealing cover 219 is lowered by the boat elevator 115 to open the furnace opening 207 at the lower end of the manifold 209, and the wafer 10 which has completed the film forming process is placed in the state of the wafer boat 11 from the manifold 209. The lower end of the furnace port 207 is unloaded (boat unloading) to the outside of the process pipe 203 (the boat is carried out: S4). Then, the wafer 10 subjected to the film formation process is recovered by the wafer boat 11 (wafer discharge), and the processing of the first batch is completed. In the same manner, the above-described processing is also performed on the wafer 10 to be processed in the second batch.

Here, the details of the carry-out process S4 of the wafer boat 11 will be described below.

(Step S4-1)

After the substrate processing (S3) is completed, immediately after returning to the atmospheric gas atmosphere in the processing chamber 202, the sealing cover 219 is passed through the sealing ring 221 by the boat elevator 115, and is pressed against the processing tube 203 (substantially the manifold 209). Lower end face. At this time, the motor 129 is driven to move the arm portion 128 upward to output a torque that can press the seal ring 221 (the seal ring is in close contact with the lower end surface of the processing tube: S4-1). The torque at this time is, for example, -37% of the rated torque of the motor 129. Hereinafter, when the torque of the motor 129 is negative (-), it is shown that the motor 129 is driven to the transmission seal 221 by the drive motor 129 to press the seal cap 219 against the lower end surface of the process tube 203 ( The state of the up direction).

On the other hand, when the torque of the motor 129 is positive (+), it means that the motor 129 is driven to separate the sealing cover 219 which is in close contact with the lower end surface of the processing tube 203 through the sealing ring 221 by the driving motor 129. The direction of the direction (downward direction).

The state in which the seal ring 221 is in close contact with the lower end surface of the process tube 203 reverses the direction of rotation of the motor 129, and drives the motor 129 to a direction in which the seal cap 219 is lowered. At this time, by the control unit 281, the recovery period (for example, vibration) of the sealing cover 219 generated when the seal ring 221 is pulled from the lower end surface of the processing tube 203 or the surface of the sealing cover 219 is restored, so that the wafer 10 is caused. The torque of the motor 129 is controlled in such a manner as to stay at the placement position in the wafer boat 11. Further, the torque of the motor 129 is set to a torque value at which the seal ring 221 can be pulled away from the lower end surface of the process tube 203. In the following description, the case where the seal ring 221 is fixed to the seal cover 219 side and is in close contact with the lower end surface of the process tube 203 will be described. On the other hand, in the case where the seal ring 221 is fixed to the lower end surface side of the process tube 203 and is in contact with the seal cover 219 side, the torque control of the motor 129 can be similarly performed.

Immediately after the motor 129 is driven to the direction in which the seal cap 219 is lowered, the seal ring 221 is continuously attached to the lower end surface of the process tube 203. At the same time, the seal ring 221 is pulled vertically downward due to the pulling force generated by the action of lowering the seal cap 219 by the boat elevator 115. In this state, the torque of the motor 129 gradually rises. Next, since the torque of the motor 129 is limited by the upper limit value, the torque of the motor 129 rises to the upper limit value. The upper limit value is determined as a recovery value of a deformation period (e.g., vibration) of the seal cap 219 generated when the seal ring 221 is pulled away from the lower end surface of the process tube 203 (or the surface of the seal cap 219). When viewed from the wafer mounting position of the wafer boat 11, the wafer 10 does not float and the wafer 10 stays in the loading position in the wafer boat 11.

Alternatively, the upper limit value of the torque of the motor 129 is set to, for example, a recovery period in which the deformation (vibration) of the seal cap 219 is returned to the original state, and the acceleration generated in the wafer boat 11 is equal to or less than the gravitational acceleration. That is, in order to separate the wafer 10 placed on the wafer boat 11 so as to float from its mounting position, the wafer boat 11 must be lowered more rapidly than the wafer 10. Therefore, when the acceleration (downward acceleration) of the wafer boat 11 becomes larger than the gravitational acceleration, the wafer 10 floats as viewed from the wafer boat 11. Therefore, by causing the acceleration generated in the wafer boat 11 to be below the gravitational acceleration, the floating of the wafer 10 can be prevented from being viewed from the wafer mounting position of the wafer boat 11.

(Step S4-2)

Then, until the upper limit of the set torque is reached, the boat lifter 115 continues to pull the seal cap 219 in the downward direction, and at the same time, the seal ring 221 is continuously pulled downward. Then, even before the upper limit value of the set torque is reached, when the force of pulling the seal ring 221 downward is better than the adhesion force of the seal ring 221 to the lower end surface of the process tube 203, the process tube 203 can be The lower end faces open the seal ring 221 (the seal ring is peeled off from the lower end surface of the treatment tube: S4-2).

(Another example of step S4-2)

Further, even if the torque of the motor 129 has reached the upper limit value but cannot be separated while the seal 219 is being lowered by the boat elevator 115, the upper limit value is also turned. The moment drive motor 129 continues to pull the seal cap 219 in the descending direction by the boat elevator 115. At this time, the sealing cover 219 is also continuously pulled in the descending direction together with the sealing cover 219. Then, when the sealing cover 219 is continuously pulled, the sealing ring 221 which is closely adhered to the lower end surface of the processing tube 203 is gradually peeled off. After a certain period of time, the force of pulling the sealing ring 221 outweighs the sealing ring 221 With the attaching force, the sealing ring 221 can be pulled from the lower end surface of the processing tube 203 (the sealing ring is peeled off from the lower end surface of the processing tube: S4-2).

At this time, since the motor 129 is driven by the torque value limited to the set upper limit, the torque exceeding the set upper limit is not generated at the moment when the seal ring 221 is pulled from the lower end surface of the processing tube 203. The torque of the value. Therefore, even if the sealing cover 219 is deformed to generate vibration, the deformation is in a range in which the wafer 10 is placed at the mounting position in the wafer boat 11.

(Step S4-3)

Next, after the seal ring 221 is pulled apart, the motor 129 is driven by the set upper limit or lower, and the seal cover 219 is lowered by the boat elevator 115 (the seal cover and the boat are lowered (seal ring) After separation from the lower end of the treatment tube): S4-3). Therefore, when the seal ring 221 is pulled away from the lower end surface of the process tube 203 or the surface of the seal cap 219, the wafer 10 stays at the placement position in the wafer boat 11.

Further, the control unit 281 may be controlled such that the torque of the motor 129 that presses the seal ring 221 just before the operation of pulling the seal ring 221 from the lower end surface of the processing tube 203 or the surface of the seal cap 219 becomes a ratio The torque of the motor 129 when the seal ring 221 is pushed to the lower end surface of the process tube 203 and the surface of the seal cap 219 is still small.

Further, the control unit 281 may be configured to recover the deformation (for example, vibration) of the arm portion 128 generated when the seal ring 221 is pulled from the lower end surface of the processing tube 203 or the surface of the sealing cover 219 to make the crystal The torque of the motor 129 is controlled in such a manner that the circle 10 stays at the placement position in the boat 11.

Further, the control unit 281 may be controlled to change the torque of the motor 129 in accordance with the timing when the seal ring 221 is pulled away from the lower end surface of the processing tube 203 or the surface of the sealing cover 219.

(5) Effect of this embodiment

According to this embodiment, the effects of one or more of the following items can be exhibited.

(a) The control unit 281 of the present embodiment is configured to pull the wafer placed in the wafer boat 11 when the sealing ring 221 is attached to the lower end surface of the processing tube 203 or the surface of the sealing cover 219. The torque of the motor 129 is controlled by the manner in which it stays at the placement position. Therefore, in a state where the seal ring 221 is attached to the lower end surface of the process tube 203 or the surface of the seal cap 219, the lowering of the seal cap 219 is started, and the cross section of the seal cap 219 is deformed to stretch, and the seal ring 221 is pulled away from the lower end surface. At this time, even if the vibration (attenuation vibration) of the sealing cover 219 due to the deformation of the sealing cover 219 is transmitted to the wafer boat 11, the floating of the wafer 10 viewed from the wafer mounting position (substrate mounting position) can be prevented. The wafer boat 11 can be carried out from the processing tube 203 in a state in which the wafer 10 is stably placed.

(b) Further, since the floating of the wafer 10 viewed from the wafer placement position (substrate placement position) may occur at the initial stage of the recovery period of the deformation of the sealing cover 219, in order to prevent this, only the sealing cover 219 is provided. The torque control of the motor 129 may be performed during the initial period of the recovery period of the deformation. Then, after the seal ring 221 is pulled out from the lower end surface of the processing tube 203 (manifold 209) in other periods, the motor 129 is not torque-controlled, and for example, the torque of the motor 129 can be reduced to increase the moving speed. Thereby, the throughput of carrying out the wafer boat 11 from the processing tube 203 can be increased.

(c) The control unit 281 controls the torque of the motor 129 that presses the seal ring 221 just before the operation of pulling the seal ring 221 from the lower end surface of the processing tube 203 or the surface of the seal cap 219. The torque of the motor 129 is smaller than when the seal ring 221 is pushed to the lower end surface of the process tube 203 and the surface of the seal cap 219. Thereby, since the sealing force of the seal ring 221 immediately before the action of lowering the seal cap 219 to the lower end surface of the process tube 203 or the surface of the seal cap 219 is weakened, it becomes easy to be sealed from the lower end surface of the process tube 203 or sealed. The surface of the cover 219 separates the seal ring 221. Therefore, the seal ring 221 can be pulled away from the lower end surface of the processing tube 203 or the surface of the sealing cover 219 in a state where the torque of the motor 129 is small.

(d) The control unit 281 controls the torque of the motor 129 in such a manner that the wafer 10 stays at the placement position in the wafer boat 11 during the recovery period of the deformation (for example, vibration) of the arm portion 281. When the sealing ring 221 is attached to the lower end surface of the processing tube 203 or the surface of the sealing cover 219, the lowering of the boat 11 and the sealing cover 219 is started, and the arm portion 128 supporting the sealing cover 219 is deformed, and the processing tube 203 is deformed. When the lower end surface or the surface of the sealing cover 219 is pulled apart from the seal ring 221, the deformation of the arm portion 128 may be restored. The vibration (attenuation vibration) of the arm portion 128 generated when the deformation of the arm portion 128 is to be restored is transmitted to the boat 11 through the sealing cover 219. At this time, since the control unit 281 controls the torque of the motor 129 so that the wafer 10 placed in the wafer boat 11 stays at the placement position, it is possible to prevent the wafer 10 from being placed at the mounting position. The wafer 10 is floated, and the wafer boat 11 can be carried out from the processing chamber 202 of the processing tube 203 in a state where the wafer 10 is stably placed.

(e) The sealing ring 221 can be pulled apart by controlling the torque of the motor 129 to vary in time series, for example, by increasing the timing, thereby gradually weakening the adhesion of the seal ring 221 to the lower end surface of the processing tube 203. Thereby, the wafer 10 does not vibrate from the wafer mounting position of the wafer boat 11 placed on the sealing cover 219, and the sealing ring 221 can be pulled away from the lower end surface of the processing tube 203. However, it is necessary that the period in which the torque of the motor 129 is changed in accordance with the time series is not excessively long. For example, by performing time monitoring, the period during which the torque of the motor 129 is increased in time is suppressed to, for example, about 20 seconds or less. A large reduction in the amount of processing is suppressed. In particular, in the case of, for example, heat during wafer processing, by-products generated during wafer processing, or the like, the adhesion force of the seal ring 221 to the lower end surface of the process tube 203 is increased, or is set. When the upper limit of the output torque of the motor 129 is present, it is effective when the seal ring 221 is difficult to be pulled by the torque of the upper limit value.

(Example 1)

In the substrate processing apparatus 101 of the present embodiment, the torque output from the motor 129 is controlled by the control unit 281 to be equal to or lower than a predetermined upper limit value. Thereby, when the seal ring 221 is pulled from the lower end surface of the process tube 203, the torque output from the motor 129 is controlled to be predetermined so that the wafer 10 stays at the placement position in the wafer boat 11. Below the limit. The relationship between the position of the seal cap 219 and the elapsed time in this case, the relationship between the moving speed of the seal cap 219 and the elapsed time, and the relationship between the torque ratio of the motor 129 and the elapsed time are shown in Fig. 5.

In the graph, the vertical axis of the upper graph indicates the amount of movement of the seal cap 219 from the position of the seal cap 219 in a state in which the process tube 203 is hermetically sealed. The vertical axis of the middle section chart indicates the descending speed of the sealing cover 219. The vertical axis of the lower graph shows the ratio of the torque output to the rated torque of the motor 129 (torque ratio) as a percentage. In the vertical axis indicating the torque, the torque ratio of the motor 129 when the motor 129 is driven to the direction in which the cover 219 is lowered is positive (+) to drive the motor 129 to the direction in which the cover 219 is raised. The torque ratio of the motor 129 is represented by a negative (-). Moreover, the horizontal axis of each graph indicates the elapsed time. Further, the relationship between the position of the seal cap 219 and the elapsed time, the relationship between the moving speed of the seal cap 219 and the elapsed time, and the relationship between the torque ratio of the motor 129 and the elapsed time are shown in the vertical axis and the cross direction. The axis is also the same as above.

As shown in Fig. 5, the upper limit value of the output torque of the motor 129 is limited by the control unit 281 to 8% by the torque ratio. The upper limit is set such that the wafer boat 11 placed on the upper surface of the sealing cover 219 or the wafer 10 placed on the wafer boat 11 is placed at the moment when the sealing ring 221 is pulled from the lower end surface of the processing tube 203. The surface of the sealing cover 219 is viewed from a reference position and does not float. Further, the torque ratio upper limit value can be determined depending on the rated output of the motor 129, the weight of the boat 11, the seal ring 221, the arm portion 128, and the like. To open the seal ring 221 which is closely connected to the lower end surface of the processing tube 203, when the torque is output from the motor 129, the output is continuously outputted at a torque ratio of about 2 seconds, and then the lower end of the processing tube 203 can be pulled. The seal ring 221 is opened. At the moment of the pulling, even if the acceleration in the descending direction is applied to the seal cap 219, the wafer ratio 11 placed on the upper surface of the seal cap 219 or placed on the wafer boat 11 is set to a torque ratio of the upper limit value. The wafer 10 is viewed from a position based on the surface of the sealing cover 219 and does not become in a floating state. Then, after the seal ring 221 which is in close contact with the lower end surface of the processing tube 203 is pulled open, the torque of the motor 129 is outputted with a torque ratio of 8% or less, and is placed thereon with the seal cap 219. The boat 11 is lowered and carried out from the processing chamber 202 of the processing tube 203. As shown in the relationship between the torque ratio and the elapsed time, it is understood that the sealing cover 219 is lowered at a torque ratio of about 6% to 7%. At this time, as shown in the graph of the relationship between the position and the elapsed time and the relationship between the moving speed and the elapsed time, it can be seen that the speed decreases at a substantially constant speed. In this way, if the output torque from the motor 129 is a torque ratio of 6% to 7%, the seal cap 219 on which the wafer boat 11 storing the wafer 10 is placed can be lowered at a high speed. Therefore, by setting the torque ratio of the output torque of the motor 129 to 8% or less, it is possible to suppress the vibration when the seal ring 221 is pulled apart, and to perform the high-speed operation of the wafer boat 11 to be carried out.

(Example 2)

Next, a case where the upper limit of the torque value of the motor 129 is limited to 5% will be described with reference to FIG. As shown in Fig. 6, when the upper limit value of the output torque of the motor 129 is set to be low, for example, the torque ratio is set to 5%, the sealing ring 221 is pulled away from the lower end surface of the processing tube 203, not only It takes 2 seconds to 3 seconds and also takes the action time after the sealing ring 221 is opened. In this case, it took 298 seconds until the wafer boat 11 was carried out from the processing chamber 202 of the processing tube 203. Further, when the output torque of the motor 129 is about 5%, if the seal ring 221 is pulled from the lower end surface of the processing tube 203, the moving speed when the boat 11 is lowered together with the sealing cover 219 is not Certainly, it is possible to observe a phenomenon in which a slight change is repeated with a slight change. As described above, if there is fluctuation in the speed fluctuation during the lowering of the wafer boat 11, there is a problem in that the wafer 10 accommodated in the wafer boat 11 is displaced from the placement position. Further, in the worst case, it is also considered that the force of pulling the seal ring 221 may be weak, and the seal ring 221 may not be pulled from the lower end surface of the process tube 203. Therefore, the torque ratio of the motor 129 is excessively reduced. For example, the torque ratio must be greater than 5%. However, if the upper limit of the torque value is reduced, the deformation of the seal cap at the time of pulling can be further reduced, so that it is easy to imagine that the vibration suppressing effect is high.

(Example 3)

Next, a case where the seal ring 221 which is substantially unattached is pulled out will be described with reference to Fig. 7. In this case, the upper limit value of the torque ratio of the motor 129 is limited to 7% to control the moving position of the seal cap 219, and the seal ring 221 is pulled apart. As shown in Fig. 7, even if the sealing ring 221 is substantially unattached to the lower end surface of the processing tube 203, the change in the speed variation and the torque ratio is detected at the moment when the sealing ring 221 is pulled apart. Accordingly, even if it is said to be substantially unattached, it can be seen that it is also attached. Further, although it was an instant, it was found that the motor 129 was torque-limited with a torque ratio of 7%. Further, when the seal ring 221 is opened, the torque ratio is 2% to 3%, and the command speed of the operating torque after the pull-open is low. In this way, even if it is considered that the seal ring 221 is not attached, the attachment may be somewhat attached. Therefore, by setting the upper limit of the output torque of the motor 129 to be limited in advance, the excess torque is outputted from the output. When the lower end surface of the processing tube 203 is peeled off from the seal ring 221, deformation (for example, vibration) of the seal cap 219 which adversely affects the accommodated wafer 10 by applying vibration to the wafer boat 11 can be suppressed. Therefore, even if the seal ring 221 is not attached to the lower end surface of the processing tube 203 or the like, it is necessary to set the upper limit value of the output torque of the motor 129 in advance.

(Comparative example)

Here, the carry-out process for the conventional wafer boat will be described with reference to FIG.

With the boat elevator 115, the sealing cap 219 is transmitted through the seal ring 221, as shown in Fig. 8, and is pressed against the lower end surface of the process tube 203 (substantially the manifold 209) with a torque ratio of, for example, -37%. At this time, there is no torque limit of the motor 129, and the torque can be output to the rated torque of the motor 129. Therefore, in order to pull the seal ring 221 which is in close contact with the lower end surface of the process tube 203, the torque output from the motor 129 is gradually increased until the seal ring 221 is pulled apart. Next, at the moment when the seal ring 221 is opened, the seal ring 221 is pulled away from the lower end surface of the process tube 203. At this time, the torque of the motor 129 is outputted at a torque ratio of 17%. Further, at the moment when the seal ring 221 is pulled out from the lower end surface of the processing tube 203, a rapid acceleration in the descending direction is applied to the seal cap 219, and the wafer boat 11 placed thereon or the wafer placed on the wafer boat 11 is applied. 10, when viewed from the position on the surface of the sealing cover 219, it becomes a state of floating, and as a result, problems such as breakage of the wafer 10, drop of particles, and positional displacement occur. Then, from the relationship between the position and the moving speed, it is understood that the boat 11 is lowered together with the sealing cover 219 at a constant moving speed. Further, from the relationship between the position and the elapsed time, it is understood that the sealing cover 219 is moved downward in the descending direction. At this time, the torque output from the motor 129 is slightly changed, but the torque ratio is approximately 5%.

Further, as a reference example, as shown in Fig. 9, when the seal ring 221 is pulled away from the lower end surface of the process tube 203 or the surface of the seal cap 219, the seal ring is completely pulled from the initial stage of the movement of the seal cap 219. At 221, the sealing cover 219 is slightly moved at a time to weaken the adhesion of the seal ring 221 a little at a time. In Fig. 9, from about 40 seconds to about 60 seconds, about 60 seconds, although the sealing cover 219 is slightly lowered. By this, the vibration of the sealing cover 219 which is generated when the sealing cover 219 is opened is suppressed, and the wafer 10 placed on the wafer boat 11 is prevented from vibrating, and generation of particles can be suppressed (refer to Japanese Laid-Open Patent Publication No. 2005-56905 ). At this time, as shown in the figure, the output torque of the motor 129 is stepwise increased. Next, when a certain torque is output from the motor 129, the seal ring 221 is pulled apart. However, it takes a long time from the start of the lowering operation of the sealing cover 219 to the pulling of the sealing ring 221 from the lower end surface of the processing tube 203. Therefore, in the case shown in Fig. 9, it takes about 254 seconds to carry out the loading of the boat 11. On the other hand, in the case shown in the fifth drawing described above, the carry-out of the wafer boat 11 was completed in 159 seconds. When the wafer boat 11 is unloaded and the situation shown in Fig. 9 is compared with the case shown in Fig. 5, the situation shown in Fig. 9 is more than 95 seconds. This is because the operation time during the period in which the seal ring 221 that does not require a small movement is not attached, and the cases shown in Figs. 5 and 9 are substantially the same, but in the case shown in Fig. 9, The process of moving the sealing cover 219 minutely is time consuming. As a result, the time taken out of the wafer 10 from the processing chamber 202 is greatly lengthened, and the entire wafer 10 is transported for a long period of time, which causes a problem of deterioration in the amount of processing. Further, it is also conceivable that the sealing cover 219 is moved at a low speed only during the attachment of the seal ring 221, but since it is difficult to see the attachment period of the seal ring 221, it is necessary to take a longer period of time in which the seal ring 221 is attached. . Hereinafter, means for accelerating the amount of processing in order to solve such a problem will be described.

In the substrate processing apparatus according to the embodiment of the present invention, the substrate processing apparatus 101 described in the first to third figures has the control unit 281 sealed from the lower end surface of the processing tube 203 or as a cover. While the surface of the 219 is pulled apart as the seal ring 221 of the sealing member, the motor 129 is controlled in such a manner that the moving speed of the seal cap 219 after the seal ring 221 is opened is further accelerated.

<Second embodiment of the present invention>

The substrate processing apparatus according to the second embodiment of the present invention has the following configuration as an example of the substrate processing apparatus 101 described above with reference to FIGS. 1 to 3 .

In the substrate processing apparatus 101, a motor driven by a pulse is used for the motor 129. For example, use a servo motor. In the case of using a servo motor, as shown in FIG. 1 above, the seal ring 221 is attached to the lower end surface of the process tube 203 for some reason (for example, heat during processing, adhesion of by-products, etc.) or When the surface of the cover 219 is sealed, even if the pulse of the drive motor 129 is continuously input to the motor 129, the seal cover 219 stays in a certain position without being lowered. At this time, the torque of the motor 129 is the upper limit of the settable torque (torque ratio). Next, the pulse back of the motor 129 is driven. Next, before the sealing ring 221 is just pulled from the lower end surface of the processing tube 203, the sealing ring 221 is attached with a slight attachment state with respect to the lower end surface of the processing tube 203 or the surface of the sealing cover 219, and the motor 129 The drive system drives the motor 129 in a rapid high-speed rotation to recover (digest) the accumulated pressure, and lowers the seal cover 219 through the arm portion 128. At this time, since the sealing cover 219 is applied with a rapid downward acceleration, the wafer 10 placed on the wafer boat 11 as a substrate may jump or fall from the substrate mounting position.

Therefore, the control unit 281 of the substrate processing apparatus 101 of this embodiment is configured to drive the motor 129 from the state of the pulse input to the motor 129 by the back pressure, and to seal the lower end surface of the processing tube 203 or the seal. The recovery period of the pulse generated when the surface of the cover 219 is opened by the seal ring 221 is controlled so that the wafer 10 stays at the placement position in the boat 11 to control the torque of the motor 129. Specifically, the upper limit value of the output torque of the motor 129 is limited to, for example, a torque ratio of 7% or less. The upper limit value is a period in which the pulse is recovered, so that the wafer 10 stays at the mounting position in the wafer boat 11, and the rated torque value of the motor 129 is appropriately determined.

As shown in Fig. 10, the upper limit of the output torque of the motor 129 is limited to 7%. In this state, the motor 129 is driven to operate the boat elevator 115, and the arm portion 128 is lowered in the direction in which the seal cap 219 is pulled and attached to the seal ring 221 of the lower end surface of the process tube 203. At this time, for some of the above reasons, the seal ring 221 is attached to the lower end surface of the treatment tube 203 or the surface of the seal cap 219. When the motor 129 is driven down in this state, the output torque (torque ratio) of the motor 129 does not exceed the torque ratio upper limit value, and the above torque is not applied. Next, the state in which the seal ring 221 is attached to the lower end surface of the process tube 203 is continued. In this state, even if the pulse of the drive motor 129 is continuously input to the motor 129, the seal cap 219 does not fall. That is, the motor 129 cannot be driven, and the pulse of the drive motor 129 is accumulated.

Soon, just before the sealing ring 221 is pulled from the lower end surface of the processing tube 203, the surface of the lower surface of the processing tube 203 or the surface of the sealing cover 219 is driven by the motor 129 when the sealing ring 221 becomes slightly attached. The resulting force that causes the seal cap 219 to descend is superior to the force at which the seal ring 221 is attached to the lower end face. At this time, the sealing cover 219 can be pulled away from the lower end surface. Next, the motor 129 is suddenly driven at a high speed by a pulse for recovering (digesting) the back pressure, and therefore, the sealing cover 219 through the boat elevator 115 seems to be rapidly lowered. However, in the present embodiment, since the upper limit value of the torque ratio of the motor 129 is set to, for example, 7% or less at the moment of opening the seal ring 221, the motor 129 does not output the torque ratio exceeding the torque ratio. Moment. Therefore, the wafer 10 accommodated in the wafer boat 11 placed on the surface of the sealing cover does not cause vibration such as jumping or damage, or vibration such as particles. Therefore, the wafer boat 11 in which the wafer 10 is accommodated can be stably carried out from the processing chamber 202 of the processing tube 203.

Further, when the torque control as described above is not applied to the motor 129, when the motor 129 starts to rapidly rotate at a high speed, even if the sealing cover 219 is to be positionally controlled, it cannot be controlled. In this case, due to the rapid driving speed of the motor 129, a downward acceleration is generated to the seal cap 219, and the wafer 10 stored in the wafer boat 11 placed on the surface of the seal cover floats.

Therefore, since the torque of the motor 129 can be controlled by setting the upper limit value of the torque ratio of the motor 129, the sealing ring 221 is in contact with the lower end surface of the processing tube 203 but is not attached (essentially Before the sealing ring 221 is just opened, the motor 129 is driven at a command speed within the limit of the torque ratio, and the motor is driven at a high speed by the command speed within the torque ratio immediately after the sealing ring 221 is pulled open. 129. Therefore, the command can be commanded to lower the speed immediately before the seal ring 221 is pulled, and the acceleration can be expected to be lowered. Thereby, the vibration caused by the deformation of the sealing cover 219 when the seal ring 221 is opened can be suppressed.

Further, when the sealing cover 219 is lowered to open the mouth 207 of the processing tube 203, the torque of the motor 129 is controlled, and then the driving speed of the motor 129 is increased, thereby speeding up the falling speed (moving speed) of the sealing cover 219. To move out of the boat 11. Thereby, the carry-out time of the wafer boat 11 can be further shortened. That is, the throughput of the wafer 10 can be increased.

<Third embodiment of the present invention>

Next, a substrate processing apparatus according to a third embodiment of the present invention will be described. In the description, the same components as those of the substrate processing apparatus 101 described above with reference to FIGS. 1 to 3 are denoted by the same reference numerals.

In the second embodiment described above, as a method of preventing the motor 129 (servo motor) from being driven to rotate at a high speed by a rapid pulse to recover (digest) the accumulated pressure, a method of controlling the speed by which the pulse is not accumulated is used. Specifically, it is assumed that the period during which the seal ring 221 is attached is set as the speed control, and after the furnace opening 207 of the process tube 203 is opened, the position control is switched to lower the seal cap 219. Switching from the speed control to the position control is performed at a position where the seal ring 221 is attached (for example, a position that is lowered by 10 mm from the position of the sealed state). The identification of the position is performed by an encoder (not shown) that monitors the motor 129 by the control unit 281. Next, when it is recognized that the predetermined position is attached to the seal ring 221, the speed control is switched to the position control.

The speed control is performed by a high-order control device not shown. The high-order control device is configured to indicate the rotation speed (or rotation angle) of the motor 129 belonging to the servo motor, and to determine the code value obtained by an encoder (not shown) provided in the motor 129, and to operate as a servo motor control device. The control unit 281 issues a command to drive or stop the motor 129. Therefore, it takes a communication time to obtain an instruction from the high-order control device after obtaining the code value, and the sealing cover 219 cannot be stopped at the required position. However, in the speed control, since the motor 129 is controlled by instructing the rotation speed (rotation angle) of the motor 129, it is not necessary to use a pulse in the command. Therefore, even in the upper limit value of the torque ratio specified by the control unit 281, the seal cover 219 stays at a certain position without being lowered, and the pulse is not accumulated. Therefore, after the seal ring 221 is pulled away from the lower end surface of the processing tube 203, the motor 129 does not jerk rapidly rotate at a high speed, but operates at the indicated speed.

Therefore, the speed control having the characteristic that the pulse train does not accumulate is performed only during the period in which it is assumed that the seal ring 221 is attached. During this period, the high-order control device monitors the encoded value at any time. Next, after confirming that the coded value has been moved to the position where the seal ring 221 is supposed to be attached, the command to stop the driving of the motor 129 is once issued to the control unit 281. Then, switch the speed control to position control for correct positioning.

In the position control, the high-order control device issues a command indicating the final target position of the seal cover 219 to the control unit 281 using the pulse train. Next, the position after the seal cover 219 is pulled out is read from the code value, the difference between the read code value and the final target position is calculated, and the control unit 281 is instructed by the difference as the position command value. This indication is continued until the gap becomes zero. In the control unit 281, the motor 129 is operated to move the seal cover 219 to the position indicated by the position command value. In this way, by performing position control, the sealing cover 219 can be stopped at the correct position.

By switching the above-described speed control to the position control and switching the upper limit value of the set torque ratio of the motor 129, the driving speed of the motor 129 can be increased as in the second embodiment described above, and the sealing cover can be accelerated. The speed of 219 is lowered to move out of the boat 11. Further, instead of the above-described speed suppression, the torque control in which the pulse is not used for the command can be similarly used. Since the torque value of the drive is directly indicated in the case of torque control, the indicated torque value is used when pulled apart.

<Fourth embodiment of the present invention>

Next, a substrate processing apparatus according to a fourth embodiment of the present invention will be described with reference to FIG. In the eleventh embodiment, the same components as those of the substrate processing apparatus 101 described above with reference to Figs. 1 to 3 are denoted by the same reference numerals.

As shown in Fig. 11, for example, the control unit 281 has an alarm 284 for measuring the operation time of pulling the seal ring 221 from the lower end surface of the processing tube 203 or the surface of the sealing cover 219, which is not predetermined. When the pull-out operation is completed within the operation time, the message M is transmitted to the display unit 283 connected to the control unit 281. The alarm 284 may also be provided outside the control unit 281. In short, the alarm 284 is configured to measure the driving time of the motor 129 when the torque of the motor 129 is controlled by the control unit 281, and based on the measurement result, when the driving limit time of the preset motor 129 is exceeded, The alarm 284 transmits a message M indicating that the pulling operation has not ended within the predetermined operation time to the display unit 283. The means for notifying the operator M of the message M of the alarm 284 is not limited to the display of the display unit 283, and may be a sound such as a warning sound. Further, in a case where the alarm device 284 issues the message M that the pulling operation is not completed within the predetermined operation time, the control unit 281 can issue an instruction to the motor 129 to automatically stop the motor 129. Drive.

When the alarm 284 is provided, even if the drive motor 129 cannot pull the seal ring 221 from the lower end surface of the process tube 203 or the surface of the seal cap 219 within a predetermined time, it is effective for the following cases. For example, due to the deterioration of the seal ring 221, the adhesion force to the lower end surface of the process tube 203 or the surface of the seal cap 219 becomes strong and it is difficult to pull open. When the motor 129 is continuously driven in this state, the motor 129 sometimes burns. Waiting for a fault. The occurrence of such a malfunction of the motor 129 can be prevented in advance.

<Fifth Embodiment of the Present Invention>

In the substrate processing apparatus 101 of the fifth embodiment of the present invention, as shown in FIG. 12, the substrate processing apparatus 101 described in the first to third embodiments is configured such that the sealing cover 219 and the arm portion 128 are formed. There is a spring 311 as an elastic body. Hereinafter, the details will be described with reference to Fig. 12 for details.

As shown in Fig. 12, the substrate processing apparatus 101 of the present embodiment includes a processing furnace 201 similar to the substrate processing apparatus 101 described with reference to Fig. 1 described above. In the processing furnace 201, a processing tube 203 that forms a processing tube 202, which will be described later, is formed, and a heater as a heating means is provided so as to surround the processing tube 203. Further, a boat elevator 115 as an elevating mechanism is provided along the side of the processing furnace 201. The boat elevator 115 is configured such that the arm portion 128 as a support portion can be raised and lowered by the drive mechanism 126. On the arm portion 128, a spring 311 as an elastic body that has been attenuated is supported, and a sealing cover 219 as a cover is supported to open and close the furnace opening 207 provided at the lower end of the processing tube 203. Further, a seal ring 221 as a sealing member is provided on the seal cap 219 to seal the seal cap 219 from the lower end surface of the process tube 203. The seal ring 221 is formed, for example, by an O-ring. Further, the upper surface of the sealing cover 219 is configured to mount the wafer boat 11, and the wafer boat 11 is placed in a plurality of stages while the wafer 10 as a substrate is horizontally held.

As the spring 311, for example, an air spring, a liquid spring, a leaf spring, and a coil spring such as a coil spring can be used. An air damper can be cited as the air spring, and a hydraulic damper can be cited as the liquid spring.

The drive mechanism 126 is configured as a ball screw structure in the same manner as the above. Further, a motor 129 that can drive the ball screw shaft 127 to rotate is provided at an upper end portion (or a lower end portion) of the ball screw shaft 127. Thereby, the drive motor 129 rotates the ball screw shaft 127, thereby raising and lowering the arm portion 128. By this, the sealing cover 219 and the wafer boat 11 placed thereon are raised or lowered to carry in or out of the wafer boat 11 into the processing chamber 202. Further, when the boat 11 is carried into the processing chamber 202, the sealing cover 219 supported by the boat lifter 115 via the boat elevator 115 passes through the seal ring 221 and is pressed against the lower end surface of the processing tube 203. The inside of the processing chamber 202 is kept airtight.

Further, a torque sensor 271 that measures the torque of the drive shaft (not shown) is provided on the drive shaft of the motor 129. Further, the motor 129 is provided with a control unit 281 that controls the torque of the motor 129 to a predetermined value. The control unit 281 is a deformation of the sealing cover 219 (for example, deformation due to vibration) generated when the seal ring 221 is pulled from the lower end surface of the processing tube 203 or the surface of the sealing cover 219 by the torque sensor 271. The recovery period is such that the torque of the motor 129 is controlled in such a manner that the wafer 10 stays at the placement position in the wafer boat 11. For example, it is controlled such that the torque of the motor 129 is within a certain range. The detailed example of the torque control is as described above.

Further, since the overall configuration of the substrate processing apparatus 101 and the details of the processing furnace are the same as those described above, please refer to the above.

In the substrate processing apparatus 101 provided with the spring 311, by providing a spring 311 having a spring characteristic which is excessively attenuated between the sealing cover 219 and the arm portion 128, it is possible to suppress the impatient of the boat 11 and the sealing cover 219 together. decline.

For example, when the mass of the wafer boat 11 and the seal ring 221 including the wafer 10 placed on the surface of the sealing cover 219 is M, the force F applied to the spring 311 can be expressed by F=Mg. Here, g is the gravitational acceleration. Further, when the displacement generated by the spring 311 is x and the spring constant of the spring 311 is K, the force Fs generated by the spring 311 can be expressed by Fs = Kx. Here, when a certain vibration is applied to the seal cap 219, it is necessary to make Kx <Mg without causing the attenuation vibration to be excessively attenuated by M. In this way, the movement of the spring 311 is over-attenuated, so that even if the load is applied to the spring 311, it does not vibrate. Therefore, since the spring 311 is attenuated, when the seal ring 221 is pulled away from the lower end surface of the process tube 203, the seal cap 219 does not vibrate and quietly faces the surface of the arm portion 128.

Here, a description will be given of a case where the driving motor 129 gradually lowers the arm portion 128 by the boat elevator 115. When the seal ring 221 is in close contact with the lower end surface of the process tube 203 and the arm portion 128 is gradually lowered in the attached state, the spring 311 is stretched. At this time, the amount of elongation of the spring 311 is x, and the seal ring 221 is pulled away from the lower end surface of the processing tube 203 at the elongation x. As a result, the force Fs generated by the spring 311 becomes Kx at this time, and the wafer boat 11 and the seal ring 221 including the wafer 10 placed on the surface thereof are counted together with the sealing cover 219, and the force applied to the spring 311 is applied. F becomes F=Mg. Here, since Kx<Mg is set so that the movement of the spring 311 becomes excessively attenuated, the vibration of the wafer boat 11 and the seal ring 221 including the wafer 10 placed on the surface of the sealing cover 219 is calculated. Over-attenuation, the surface of the arm portion 128 is quietly in a stationary state.

Further, when the torque of the motor 129 when Fs is generated is T and the lead of the ball screw is I, when viewed from the motor 129, the force Fs becomes Fs = 2πT/I. Here, since Fs=Kx, 2πT/I=Kx, and since Kx<Mg, it becomes 2πT/I<Mg. If it is further deformed, it becomes T<MgI/2π. Here, if the torque of the motor 129 required to lower the arm portion 128 is the torque T', the total torque Tall of the motor 129 required to pull the seal ring 221 from the lower end surface of the process tube 203 Become Tall=T+T'. Therefore, the motor 129 is preferably used with a torque of Tall = T + T' or less.

<Embodiment 6 of the present invention>

In the substrate processing apparatus according to the sixth embodiment of the present invention, the wafer boat 11 is transported, and the drive control of the motor 129 changes depending on the height position of the seal cap 219. Hereinafter, the details will be described with reference to Fig. 13. Fig. 13(a) is a schematic view showing a transport operation performed by the substrate processing apparatus of the embodiment, and Fig. 13(b) is a flow chart showing the transport control by the control unit.

At the beginning of the carry-out process (S4) of the present embodiment, the control unit 281 first measures the current height position of the seal cover 219 (S4a). The measurement of the height position of the seal cap 219 is performed using, for example, an optical sensor (not shown) provided on the ball screw shaft 127 or the arm portion 128, or an encoder provided in the motor 129. Next, the measured height position of the seal cap 219 and the predetermined "action switching position" are compared (S4b). The "operation switching position" refers to a height position at which switching of a conveying operation to be described later is to be performed. Immediately after the start of the unloading process (S4), since the height position of the seal cap 219 is "seal position" and is higher than the "action switching position", the control unit 281 is in the "Yes" of Fig. 13 (a). The motor 129 transmits the predetermined setting information (action instruction information) to start the lowering of the sealing cover 219 (S4c). At this time, the maximum torque of the motor 129 defined by the predetermined setting information is set to the same torque as that of the above-described embodiment. That is, the recovery period of the deformation (e.g., vibration) of the sealing cover 219 generated when the sealing ring 221 is pulled away from the lower end surface of the processing tube 203 or the surface of the sealing cover 219, so that the wafer 10 stays in the wafer boat 11. The torque at the placement position is, for example, 10% or less of the rated torque, preferably about 1%. Thereby, when the lowering of the sealing cover 219 is started, the floating of the wafer 10 viewed from the wafer mounting position (substrate mounting position) can be prevented, and the wafer 10 can be stably placed, and the processing tube can be stably placed. The boat 11 is carried out in 203. Hereinafter, the operation of moving out the related setting information is also referred to as "initial transfer operation".

Next, the control unit 281 transmits the setting information to the motor 129, and readablely stores the setting information transmitted to the motor 129 in, for example, a non-volatile memory included in the control unit 281 (S4d). By this means, even if the control unit 281 is restarted in the event that the power supplied to the substrate processing apparatus is accidentally blocked or the like, the control unit 281 can quickly read the setting information just before the restart, and then The transmission to the motor 129 can quickly resume the "initial transfer operation" described above.

When the operation of the motor 129 is started, the control unit 281 repeatedly measures the height position of the seal cap 219 at predetermined time intervals (for example, at intervals of 200 msec). Next, when the seal cap 219 is present above the "operation switching position", the setting of the maximum torque of the motor 129 is not changed (the value is always limited to the above value), and the motor 129 continues the "initial transfer operation" described above. "."

After the motor 129 is driven in the direction in which the sealing cover 219 is lowered, as described above, the seal ring 221 is continuously attached to the lower end surface of the processing tube 203 or the like. Then, until the upper limit of the set torque is reached, the boat lifter 115 continues to pull the seal cap 219 in the downward direction, and at the same time, the seal ring 221 is continuously pulled in the descending direction. Next, when the force of pulling the seal ring 221 downward is better than the adhesion of the seal ring 221 to the lower end surface of the process tube 203, the seal ring 221 is pulled away from the lower end surface of the process tube 203. Then, the sealing cover 219 is actually caused to start to descend.

Then, the sealing cover 219 is lowered to the above-mentioned "action switching position", that is, to "No" of Fig. 13 (b), and the control portion 281 transmits new setting information to the motor 129 to lower the sealing cover 219. The speed is increased (or maintained) to a predetermined speed (a speed greater than the rate of decline in the initial transport operation) (S4e). Further, the maximum torque of the motor 129 at this time may be larger than the maximum torque at the time of the initial conveyance operation, and may be, for example, about 20% of the rated torque. In this manner, the sealing cover 219 is lowered to the "action switching position", and by controlling the operation of the motor 129 to increase (or maintain) the lowering speed of the sealing cover 219, the time required for the carry-out process (S4) can be reduced. To improve the productivity of substrate processing. Hereinafter, the carry-out operation according to the relevant setting is also referred to as "post-transfer operation". Further, when switching from the "initial transfer operation" to the "post transfer operation", the falling speed of the sealing cover 219 can be gradually changed to reduce the impact on the wafer 10 caused by these speed differences.

Next, the control unit 281 transmits new setting information to the motor 129, and readablely stores the setting information transmitted to the motor 129 in, for example, a non-volatile memory included in the control unit 281 (S4f). By this means, even if the control unit 281 is restarted in the event that the power supplied to the substrate processing apparatus is accidentally blocked or the like, the control unit 281 can quickly read the setting information just before the restart, and then The transmission to the motor 129 can quickly resume the above-mentioned "post-transfer operation".

Then, the control unit 281 operates the motor 129 at the maximum speed within the re-set torque allowable range, and quickly lowers the seal cover 219 to the "lifting end position" shown in Fig. 13(a), and completes the carry-out. Process (S4). Further, the control unit 281 may change the setting information to the motor 129 as soon as the sealing cover 219 approaches the "loading end position", so that the lowering speed of the sealing cover 219 is decelerated to a predetermined speed. Thereby, it is possible to reduce the impact applied to the wafer 10 when the sealing cover 219 reaches the "loading end position" (when the falling of the sealing cover 219 is stopped).

Further, in the above-described embodiment, the switching between the "initial transfer operation" and the "late transfer operation" is continuously performed without stopping the lowering of the seal cover 219, that is, the motor 129 is not stopped. However, the present invention is not limited to this embodiment. That is, the motor 129 can be temporarily stopped, and the above switching can be performed. In this case, the lowering speed of the seal cap 219 around the "action switching position" can be reduced to a predetermined speed. Thereby, it is possible to reduce the application of the crystal to the crystal when the sealing cover 219 reaches the "operation switching position" (when the sealing cover 219 is lowered) or when the sealing cover 219 leaves the "operation switching position" (when the sealing cover 219 is lowered again). The impact of the round 10.

Further, in the above-described embodiment, the case where the "initial transfer operation" and the "late transfer operation" are switched at the time of carrying out the wafer boat 11 will be described. However, the present invention is not limited to this embodiment, and may be in the form of crystal. When the boat 11 is moved in. In this case, the loading operation from the "removal end position" to the "action switching position" and the loading operation from the "operation switching position" to the "sealing position" may be set to the "post-transfer operation" described above. It is the same as the "initial transfer operation" (although the transfer direction is set to the rising direction). In addition, the maximum torque of the motor 129 in the "post-transport operation" may be, for example, about 60% of the rated torque.

Further, in the above-described embodiment, the case of performing the two-stage switching between the "initial transfer operation" and the "late transfer operation" has been described. However, the present invention is not limited to the related art, and may be performed in three stages or more. Switching of actions.

<Preferred form of the present invention>

Hereinafter, a preferred embodiment of the present invention will be attached.

According to a first aspect of the invention, a substrate processing apparatus includes: a wafer boat on which a substrate is placed; a processing tube that accommodates the wafer boat; and a lid that mounts the wafer boat and is opened and closed at a lower end of the processing tube. a furnace opening; a lifting mechanism for lifting the cover; a motor driving the lifting mechanism; a sealing member sealing the lower end surface of the processing tube and the cover; and a control portion being disposed from the lower end surface of the processing tube Or the recovery period of the deformation of the cover generated when the surface of the cover is pulled apart to control the torque of the motor in such a manner that the substrate stays at the mounting position in the boat.

According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, the control unit opens the sealing member more quickly than when the sealing member is pulled from a lower end surface of the processing tube or a surface of the cover. The motor is controlled in such a manner that the speed of the cover moves.

A third aspect of the invention is the substrate processing apparatus according to the first or second aspect, wherein the control unit controls the rotation of the motor only when the sealing member is pulled from a lower end surface of the processing tube or a surface of the cover. Moment; the driving speed of the motor is controlled during the driving period of the motor other than the period during which the torque of the motor is controlled.

The substrate processing apparatus according to any one of the first aspect to the third aspect, wherein the control unit is controlled such that the control unit is just started to be opened from the lower end surface of the processing tube or the surface of the cover. The torque of the motor that presses the sealing member before the operation of the sealing member is less than the torque of the motor when the sealing member is pressed against the lower end surface of the processing tube and the surface of the cover.

The substrate processing apparatus according to any one of the first aspect to the fourth aspect, wherein the control unit is configured to pull the sealing member from a lower end surface of the processing tube or a surface of the cover The torque of the motor varies according to the timing.

A substrate processing apparatus according to any one of the first to fifth aspects of the present invention, comprising an alarm device for measuring an action of pulling the sealing member from a lower end surface of the processing tube or a surface of the cover The time, and the message that the pull-opening operation has not been completed within the predetermined operating time is transmitted to the display unit connected to the control unit.

A substrate processing apparatus according to any one of the first aspect to the sixth aspect, wherein the motor is a pulse-driven motor; and the control unit is in a state of being back-charged from the pulse input to the motor. The backlog pulse drives the motor to recover the deformation of the cover when the sealing member is pulled from the lower end surface of the processing tube or the surface of the cover, so that the substrate stays in the boat The way the position is placed controls the torque of the motor.

The substrate processing apparatus according to any one of the first aspect to the seventh aspect, wherein the cover and the support portion that supports the cover and the elevating mechanism is movable up and down Attenuated elastomer.

The substrate processing apparatus according to any one of the first aspect to the eighth aspect, wherein the control unit is produced when the sealing member is pulled from a lower end surface of the processing tube or a surface of the cover The recovery period of the deformation of the cover is controlled such that the acceleration of the boat is equal to or less than the acceleration of gravity.

A substrate processing apparatus according to any one of the first to ninth aspects, wherein the elevating mechanism has a support, and a support that supports the cover and drives the motor to move up and down along the support The control portion is a recovery period of the deformation of the support portion generated when the sealing member is pulled from the lower end surface of the processing tube or the surface of the cover, so that the substrate stays in the wafer boat The way of position controls the torque of the motor.

According to an eleventh aspect of the present invention, in a method of manufacturing a semiconductor device, after a substrate placed on a wafer boat is processed in a processing tube, a cover that seals a nozzle of the processing tube through a sealing member is lowered to open the furnace. And recovering from the mouth of the wafer in the processing tube from the furnace mouth, a recovery period of deformation of the cover generated when the sealing member is pulled from the lower end surface of the processing tube or the surface of the cover, so that The manner in which the substrate stays at the mounting position in the wafer boat controls the torque of the motor for driving the lifting mechanism that lowers the cover.

10. . . Wafer (substrate)

11. . . Crystal boat

101. . . Substrate processing device

115. . . Crystal boat lift (lifting mechanism)

201. . . Treatment furnace

202. . . Processing room

203. . . Processing tube

219. . . Sealing cover (cover)

221. . . Sealing ring (sealing member)

281. . . Control department

Fig. 1 is a schematic block diagram showing a main part of a substrate processing apparatus according to a first embodiment of the present invention.

Fig. 2 is a perspective perspective view showing the outline of a substrate processing apparatus according to a first embodiment of the present invention.

Fig. 3 is a vertical cross-sectional view showing an example of a processing furnace of the substrate processing apparatus according to the first embodiment of the present invention.

Fig. 4 is a flow chart showing a process of a method of manufacturing a semiconductor device according to the first embodiment of the present invention.

Fig. 5 is a graph showing the relationship between the position of the seal cap and the elapsed time when the upper limit of the torque ratio of the motor is limited, the relationship between the moving speed of the seal cap and the elapsed time, and the relationship between the torque ratio of the motor and the elapsed time. .

Fig. 6 is a graph showing the relationship between the position of the seal cap and the elapsed time when the upper limit of the torque ratio of the motor is limited, the relationship between the moving speed of the seal cap and the elapsed time, and the relationship between the torque ratio of the motor and the elapsed time. .

Figure 7 is a graph showing the relationship between the position of the seal cap and the elapsed time when the upper limit of the torque ratio of the motor is limited, the relationship between the moving speed of the seal cap and the elapsed time, and the relationship between the torque ratio of the motor and the elapsed time. .

Figure 8 is a graph showing the relationship between the position of the sealing cap and the elapsed time when the upper limit of the torque ratio of the motor is not limited, the relationship between the moving speed of the sealing cap and the elapsed time, and the relationship between the torque ratio of the motor and the elapsed time. Figure.

Fig. 9 is a graph showing the relationship between the position of the sealing cover and the elapsed time when the sealing cover is slightly moved, the relationship between the moving speed of the sealing cover and the elapsed time, and the relationship between the torque ratio of the motor and the elapsed time.

Figure 10 is a graph showing the relationship between the position of the seal cap and the elapsed time when the upper limit of the torque ratio of the motor is limited, the relationship between the moving speed of the seal cap and the elapsed time, and the relationship between the torque ratio of the motor and the elapsed time. .

Fig. 11 is a schematic block diagram showing a main part of a substrate processing apparatus according to a third embodiment of the present invention.

Fig. 12 is a schematic block diagram showing a main part of a substrate processing apparatus according to a fifth embodiment of the present invention.

Fig. 13 (a) is a schematic view showing a transport operation performed by the substrate processing apparatus according to the sixth embodiment of the present invention, and (b) is a flow chart of the transport control by the control unit.

10. . . Wafer (substrate)

11. . . Crystal boat

101. . . Substrate processing device

115. . . Crystal boat lift (lifting mechanism)

126. . . Drive mechanism

127. . . Ball screw shaft

128. . . Arm

129. . . motor

201. . . Treatment furnace

202. . . Processing room

203. . . Processing tube

207. . . Mouth

219. . . Sealing cover (cover)

221. . . Sealing ring (sealing member)

271. . . Torque sensor

281. . . Control department

Claims (4)

A substrate processing apparatus comprising: a wafer boat for mounting a substrate; a processing tube for accommodating the wafer boat; and a lid for mounting the wafer boat to open and close a furnace mouth provided at a lower end of the processing tube; Lifting the cover; driving the lifting mechanism; sealing member sealing between the lower end surface of the processing tube and the cover; and the control portion being pulled away from the lower end surface of the processing tube or the surface of the cover The recovery period of the deformation of the cover generated by the sealing member controls the motor so that the substrate stays at the mounting position in the wafer boat, and the control portion moves from the furnace opening to the predetermined position During the period from the position, the speed control of the motor is performed while limiting the torque of the motor. The substrate processing apparatus according to claim 1, wherein the control unit switches the control of the motor from the speed control to the torque of the motor after the cover is moved from the furnace mouth to the predetermined position. Position control. A manufacturing method of a semiconductor device, which has a process of processing a substrate placed on a wafer boat in a processing tube, and sealing the processing tube through a sealing member after processing the substrate The lid of the furnace mouth is lowered to open the furnace mouth; and the process of moving the wafer boat in the processing tube is carried out from the furnace mouth while the lid is opened, from the furnace mouth while the lid is opened a recovery period of the deformation of the cover generated when the sealing member is pulled from the lower end surface of the processing tube or the surface of the cover in the process of moving out the wafer boat in the processing tube, so that the substrate stays in the The speed of the motor is controlled while controlling the torque of the motor for driving the lifting mechanism for lowering the cover while the cover is moved from the furnace mouth to the predetermined position in the manner in which the position is placed in the wafer boat. The substrate processing apparatus according to claim 1, wherein the control unit switches the limit value of the torque of the motor when the control of the motor is switched from the speed control to the position control.